JP2007221486A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thinned and miniaturized imaging apparatus. <P>SOLUTION: The imaging apparatus 1 is provided with a main substrate 50 to mount a system IC 40 and an optical unit 10 to lead a light to an imaging element 30 on the same plane, and a sub substrate 70 to be connected to the main substrate 50 through a FPC 55 and to mount a sub part 60. The sub substrate 70 is oppositely arranged to the system IC 40 having a clearance within a width of a lengthwise direction of the main substrate 50 in a manner that the FPC 55 is bent. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an imaging apparatus, and more particularly to an imaging apparatus suitable for mounting on a small device such as a mobile phone.

An imaging device mounted on an electronic device (external device) such as a mobile phone or a mobile computer has an optical unit that supports a lens and an electronic component for driving an imaging device mounted on a substrate. (See Patent Document 1).
Some of such imaging devices have an optical unit and a plurality of electronic components mounted on the same surface.
In addition, such an imaging apparatus is required to be downsized and space-saving with the downsizing of an electronic device to be mounted.

JP 2004-309623 A

Here, since the optical unit is required to have a height corresponding to the entire length of the lens or a moving distance of the lens in the optical axis direction, there is a certain limit to reducing the height of the optical unit in the optical axis direction. It was. Therefore, when the optical unit and the electronic component are mounted on the same surface of the substrate, the difference in height between the optical unit and the electronic component in the optical axis direction is large. This height difference creates a dead space in the vicinity of the upper part of the electronic component when the imaging device is mounted on the electronic device (external device).
In addition, since the size of the imaging device depends on the size of the area of the substrate, it is difficult to reduce the size of the imaging device if the area of the substrate is large. In particular, depending on the length of the substrate in the longitudinal direction, the degree of freedom of the mounting position on the electronic device may be limited.

  Therefore, the present invention provides an imaging device that can be miniaturized.

  The image pickup apparatus according to the present invention is connected to the main substrate through a flexible substrate, a main substrate on which an image pickup device, a main component, and an optical unit for guiding light to the image pickup device are mounted. A sub-board on which the sub-component is mounted, and in a state where the flexible substrate is bent, the sub-board is separated from the main component within the longitudinal width of the main board in the optical axis direction. It is characterized by being opposed to each other.

With such a configuration, by connecting the main board and the sub board via the flexible board, the sub board can be arranged to face the main component within the longitudinal width of the main board. The main board is provided with only a large occupied area member (image pickup device, signal processing device and optical unit) on the same surface, and other sub parts are provided on the sub board. It becomes possible. Further, by arranging the sub-board in this way, the vicinity of the upper part of the main part (subject side in the optical axis direction) caused by the height difference in the optical axis direction between the optical unit and the main part mounted on the main board is provided. Dead space can be eliminated.
Further, since the sub-board is disposed within the longitudinal width of the main board, the length of the imaging device in the longitudinal direction can be suppressed, and the imaging device can be downsized.
In addition, by mounting sub-components that are conventionally mounted on the main substrate other than the image sensor, the signal processing device, and the optical unit, the area of the main substrate can be reduced. Thereby, an imaging device can be reduced in size. Moreover, the freedom degree of the mounting position to an electronic device improves by reducing in size.
In addition, since the sub board is disposed apart from the main part, the influence of heat radiation from the main part can be suppressed.

The said structure can employ | adopt the structure arrange | positioned so that the said sub board | substrate may be hold | maintained in the position lower than the height of the optical axis direction of the said optical unit.
With such a configuration, the height of the imaging device in the optical axis direction can be suppressed to the height of the optical unit, so that the imaging device can be reduced in thickness and size.

In the above configuration, the sub-board may be provided with a terminal portion for electrical connection with an external device.
With such a configuration, an increase in the size of the main substrate can be avoided, and the image pickup apparatus can be reduced in size. This is because a main part having a large occupied area is provided on a main board on which an optical unit (including an image pickup device) is provided, and a terminal part having a large occupied area is provided separately on the sub board after the optical unit and the main part.
The main board and the sub board are rigid wiring boards made of a hard base material, and the main board, the sub board, and the flexible board are made of the main board and the sub board. It is possible to adopt a configuration that is a rigid-flex wiring board that is integrated and electrically connected by a conductive substrate. Since the main board, the sub board, and the flexible board are integrated, it is not necessary to provide a space for a connecting portion or a connector on each board, and the imaging measures can be reduced in size.

The said structure WHEREIN: The structure provided with the positioning control part which positions the said sub board | substrate by regulating the separation distance of the said sub board | substrate and the said main component is employable.
With such a configuration, the separation distance between the sub-board and the main component is regulated, so that it is possible to suppress the influence of heat radiation from the main component due to the separation distance being too small, and imaging due to the separation distance being too large. The height of the device in the optical axis direction can be suppressed.

The said structure WHEREIN: The said positioning control part can employ | adopt the structure integrally shape | molded by the said optical unit.
With such a configuration, the positioning restricting portion is formed integrally with the optical unit, so that it is not necessary to separately attach the positioning restricting portion, and the manufacturing cost can be reduced.

The said structure WHEREIN: The said positioning control part can employ | adopt the structure provided with the 2nd terminal part which electrically connects a to-be-connected apparatus and the said sub board | substrate.
With such a configuration, it is possible to position the sub-board and to electrically connect the sub-board and the connected device.

  In the above configuration, a positioning unit that positions the imaging device is formed in the external device on which the imaging device is mounted, and a positioning engagement unit that engages with the positioning unit is formed in the imaging device, and the positioning The engaging portion may employ a configuration that positions the main substrate and the sub substrate and engages the positioning portion that regulates a separation distance between the sub substrate and the main component.

With such a configuration, since the positioning engagement portion that engages with the positioning portion formed in the external device is provided, the imaging device can be easily mounted on the external device.
In addition, since the main board and the sub board are positioned with a single member and the distance between the sub board and the main component is regulated, the number of parts of the imaging device can be reduced, and the manufacturing process of the imaging device is simplified. can do. Thereby, an imaging device can be manufactured at low cost.
In addition, since the main board and the sub board are positioned by one member and the separation distance between the sub board and the main component is regulated, the positional accuracy is reduced due to the dimensional tolerance compared to the case of positioning by a plurality of members. Can be minimized.

  According to the present invention, a downsized imaging apparatus can be provided.

  Hereinafter, a plurality of embodiments according to the present invention will be described with reference to the drawings.

  The configuration of the image pickup apparatus of the present embodiment will be described with reference to FIG. FIG. 1 is a diagram illustrating the configuration of the imaging apparatus 1 according to the first embodiment. FIG. 1A is a front view of the imaging apparatus 1, and FIG. 1B is a side view of the imaging apparatus 1.

The imaging apparatus 1 includes an optical unit 10, a voice coil motor 20, an imaging element 30, a system IC (main component) 40, a main substrate 50, an electronic component (sub component) 60, a sub substrate 70, an FPC (Flexible Printed Circuit) (possible Flexible substrate) 55, spacer 80, connector 90, and the like. In this embodiment, the main board 50 and the sub board 70 are multilayer rigid wiring boards made of a hard base material. The main board 50 and the sub board 70 have inner layers, and a part of the inner layer is an FPC 55. Thus, the main board 50 and the sub board 70 are electrically connected by the FPC 55. As a result, a rigid flexible substrate in which the main substrate 50, the sub substrate 70, and the FPC 55 are integrated.
Although omitted in FIG. 1, a lens barrel holding a lens is disposed in the lens barrel opening 21 formed in the voice coil motor 20.

The optical unit 10 includes a voice coil motor 20, an image sensor 30, a lens barrel, and the like.
The voice coil motor 20 gives a driving force for moving the lens held in the lens barrel in the optical axis direction. The lens guides light to the image sensor 30.
The image pickup device 30 includes a CCD (Charge Coupled Devices) type image sensor or a COMS (Complementary Metal-Oxide Semiconductor) type image sensor. The image sensor 30 is attached to the main board 50 and receives light through a lens.

The main board 50 is a board such as paper phenol or glass epoxy, and is formed in a rectangular shape. Further, the voice coil motor 20 and the system IC 40 are adjacently mounted on the same surface on the main board 50.
The system IC 40 includes at least a DSP (Digital Signal Processor) having an image processing circuit, and includes a control circuit for controlling the imaging device 30, an image signal processing circuit for performing image processing on an image signal obtained by the optical unit 10, and the like. It constitutes. The system IC 40 is a component that occupies a large area after the optical unit 10.
The image pickup device 30 is mounted on the main board 50, and is provided so that the center of the lens barrel opening 21 formed in the voice coil motor 20 and the center of the image pickup region of the image pickup device 30 overlap. ing. The main board 50 has such a size that only the optical unit 10 (including the image sensor 30) having a large occupied area and the system IC 40 having a large occupied area are provided, and the other electronic components 60 are mounted on the sub board 70. Is provided. With this configuration, the imaging device 1 is thin and small.

The FPC 55 is made of a film material such as polyimide and has flexibility. The FPC 55 electrically connects the main board 50 and the sub board 70.
The electronic component 60 is mounted on the sub board 70. Details are described below.

  As shown in FIG. 1B, the sub board 70 is formed to have a smaller area than the main board 50. Since the optical unit 10 (including the imaging device 30) and the system IC 40 having a large occupied area are provided on the main board 50, the sub board 70 can be formed smaller than the main board 50. The sub board 70 is connected to the main board 50 through the FPC 55. The spacer 80 (positioning restricting portion) is formed in a columnar shape extending in the optical axis direction, and the lower end surface (end surface on the main substrate 50 side) of the spacer 80 and the four corners of the upper surface of the system IC 40 are fixed. The upper end surface (surface on the subject side) of the spacer 80 and the sub board 70 are fixed. Thereby, the sub board | substrate 70 is spaced apart and arrange | positioned facing the system IC40. The sub board 70 is arranged in parallel with the main board 50. Further, the FPC 55 is held in a bent state.

  A plurality of electronic components 60 are mounted on the surface of the sub-board 70 facing the system IC 40. The spacer 80 is formed to have a longer length in the optical axis direction than the electronic component 60, and the sub substrate 70 is disposed at a position where the electronic component 60 does not contact the system IC 40. Accordingly, the sub-board 70 is disposed so as to face the system IC 40 at a position where the electronic component 60 does not contact the system IC 40.

  Further, the sub board 70 is disposed within the width of the main board 50 in the longitudinal direction and the width direction. The sub board | substrate 70 should just be arrange | positioned so that it may be settled in the width | variety of the longitudinal direction of the main board | substrate 50 at least.

As described above, in a state where the FPC 55 is bent, the sub board 70 is disposed to be opposed to the system IC 40 within the width in the longitudinal direction of the main board 50.
With such a configuration, by connecting the main board 50 and the sub board 70 via the FPC 55, the sub board 70 can be disposed to face the system IC 40 within the width in the longitudinal direction.
By arranging the sub-board 70 as described above, the dead space near the top of the system IC 40 (the subject side in the optical axis direction) caused by the height difference between the optical unit 10 and the system IC 40 in the optical axis direction is eliminated. be able to.

Further, by mounting the electronic component 60 that has been conventionally mounted on the main board 50 on the sub board 70, the area of the main board 50 can be reduced. Thereby, the imaging device 1 can be reduced in size. In addition, the downsizing improves the degree of freedom of the mounting position on an external device such as a mobile phone.
Moreover, since the sub board | substrate 70 is spaced apart and arrange | positioned from system IC40, the influence of the thermal radiation from system IC40 can be suppressed.

Further, as shown in FIG. 1B, the sub board 70 holds the sub board 70 and the electronic component 60 at a position lower than the height in the optical axis direction of the optical unit 10 (or the voice coil motor 20). Placed in. In other words, the sub board 70 holds the sub board 70 and the electronic component 60 at a position closer to the main board 50 side than the upper end surface of the voice coil motor 20 (the surface on the subject side in the optical axis direction). Be placed.
With such a configuration, the height of the imaging device 1 in the optical axis direction can be suppressed within the height of the optical unit 10, so that the imaging device 1 can be downsized.

  In the sub-board 70, the electronic component 60 is mounted on the surface facing the system IC 40. A connector (terminal portion) 90 for electrically connecting the sub substrate 70 and an external device is provided on the back surface of the surface on which the electronic components of the sub substrate 70 are mounted. An FPC 100 that electrically connects the sub board 70 and an external device is attached to the connector 90. Thereby, the board | substrate of external apparatuses, such as a mobile telephone with which the imaging device 1 is mounted, and the sub board | substrate 70 can be electrically connected.

The connector 90 is a component that occupies a large area after the optical unit 10 (including the imaging device 30) and the system IC 40. Since the connector 90 and the electronic component 60 smaller than the system IC 40 are provided on the sub board 70, the imaging device 1 is thin and small. This is because the components are mounted on one side of the main board 50 in order to reduce the thickness, so that if the electronic board is provided with more electronic components than the main board 50, the main board 50 becomes larger by the space, and the overall size of the imaging device 1 is reduced. It will not be Further, when the system IC 40 is provided on the sub board 70 in order to further reduce the main board 50, the sub board 70 is arranged from the longitudinal width of the main board 50 when the sub board 70 is disposed within the height of the optical unit 10. Will not occur, and the imaging apparatus 1 will not be downsized. Further, if the system IC 40 and the sub board 70 are provided at a position overlapping the main board 50 in the optical axis direction, the size is further reduced in plan view, but the thickness is not reduced. For this reason, in order to reduce the thickness and size, it is preferable to provide only a component (system IC 40 in this embodiment) having a large occupation area on the main substrate 50 on which the optical unit 10 is provided.
Further, since the connector 90 electrically connects the sub board 70 and the external device, the imaging device 1 can be easily mounted on the external device.
That is, when the imaging device 1 is manufactured and mounted on an external device such as a mobile phone, the FPC 100 attached to the substrate of the external device is connected to the connector 90, so that the imaging device 1 and the substrate of the external device can be easily connected. Can be electrically connected.

  The spacer 80 positions the sub board 70 by regulating the distance between the sub board 70 and the system IC 40. With such a configuration, the separation distance between the sub-board 70 and the system IC 40 is regulated, so that the influence of heat radiation from the system IC 40 due to the separation distance being too small can be suppressed, and the separation distance is too large. The height of the imaging device 1 in the optical axis direction can be suppressed.

Next, a method for attaching the spacer 80 will be described.
Using a rigid flexible substrate in which non-flexible (hard) substrates are connected to each other via a flexible substrate in advance, the image sensor 30, the voice coil motor 20, and the system IC 40 are mounted on the main substrate 50, and then the spacer 80 is mounted. Is mounted on the sub-board 70 together with the electronic component 60. Specifically, the electronic component 60 is mounted on the sub-board 70 and connected to the wiring pattern on the sub-board 70. At the same time, the spacer 80 is mounted on the sub-board 70. The spacer 80 is mounted by the same method as the electronic component 60 mounted on the sub-board 70. For example, a conductive adhesive used when mounting the electronic component 60 on the sub board 70 is used.

FIG. 2 is a side view of the imaging apparatus 1 before positioning the sub board 70. As shown in FIG. 2, the spacer 80 is mounted on the same surface as the surface on which the electronic component 60 of the sub-board 70 is mounted.
Next, in order to position the sub board 70, an adhesive is applied to the other end face of the spacer 80, the FPC 55 is bent, and the other end face of the spacer 80 is placed on the upper surface of the system IC 40 mounted on the main board 50. To fix. In this way, the spacer 80 is mounted on the sub board 70 together with the electronic component 60. Thereby, the manufacturing process of the imaging device 1 can be simplified.

  Next, an imaging apparatus 1a according to the second embodiment will be described with reference to FIG. FIG. 3 is a diagram illustrating the configuration of the imaging apparatus 1a according to the second embodiment. FIG. 3A is a front view of the imaging apparatus 1a, and FIG. 3B is a side view of the imaging apparatus 1a. Since the basic configuration of the image pickup apparatus 1a is the same as that of the image pickup apparatus 1, description thereof is omitted by assigning the same reference numerals to the same portions.

As shown in FIG. 3, projecting pieces (positioning restricting portions) 22 a to 22 c are formed on a part of the side surface 20 a of the voice coil motor 20. The projecting pieces 22 a to 22 c are formed on the side surface 20 a of the voice coil motor 20 adjacent to the system IC 40. The projecting pieces 22 a to 22 c extend in the direction perpendicular to the optical axis direction, and are formed in a plate shape parallel to the main substrate 50. Further, the projecting pieces 22a to 22c are formed at positions closer to the subject than the upper surface of the system IC 40.
Further, the projecting piece 22a is formed closer to the subject than the projecting pieces 22b and 22c.
The protrusions 22b and 22c are formed at the same height in the optical axis direction. The sub board 70 is sandwiched between the projecting piece 22a and the projecting pieces 22b and 22c, and the sub board 70 is positioned by regulating the separation distance between the sub board 70 and the system IC 40.

The projecting pieces 22 a to 22 c are formed integrally with the voice coil motor 20. There is no need to attach a separate positioning restriction portion, and the manufacturing cost can be reduced.
Further, the sub-board 70 is positioned in contact with the side surface 20a of the voice coil motor 20. Therefore, the sub board 70 is positioned in the vertical direction of the side face 20a by the side face 20a. As a result, similarly to the first embodiment, the sub-board 70 can be easily arranged so as to be at least within the width of the main board 50 in the longitudinal direction.

  Next, an imaging device 1b according to the third embodiment will be described with reference to FIG. FIG. 4 is a diagram illustrating the configuration of the imaging apparatus 1b according to the third embodiment. 4A is a front view of the imaging apparatus 1b, and FIG. 4B is a side view of the imaging apparatus 1b. Since the basic configuration of the image pickup apparatus 1b is the same as that of the image pickup apparatus 1, description thereof is omitted by assigning the same reference numerals to the same portions.

  As shown in FIG. 4, protrusions 22 b and 22 c that are positioning regulating portions and a second terminal portion 23 that transmits driving power to the voice coil motor 20 are formed on a part of the side surface 20 a of the voice coil motor 20. Yes. The second terminal portion 23 is formed in parallel with the projecting pieces 22b and 22c. The second terminal portion 23 is formed closer to the subject than the protrusions 22b and 22c. The sub board 70 is sandwiched between the second terminal portion 23 and the projecting pieces 22b and 22c, and the sub board 70 is positioned by restricting the distance between the sub board 70 and the system IC 40.

Further, the second terminal portion 23 and the sub board 70 are electrically connected by the solder 24. Thereby, the sub board | substrate 70 can be positioned reliably between the 2nd terminal part 23 and the protrusions 22b and 22c.
The second terminal portion 23 is electrically connected to the voice coil motor 20 and the sub board 70. Thus, the 2nd terminal part 23 electrically connects the voice coil motor 20 and the sub board | substrate 70 as a non-connecting apparatus. The sub-board 70 can be positioned, and the sub-board 70 and the voice coil motor 20 can be electrically connected.

  Next, an imaging device 1c according to the fourth embodiment will be described with reference to FIG. FIG. 5 is a diagram illustrating the configuration of the image pickup apparatus 1c according to the fourth embodiment. FIG. 5A is a front view of the imaging apparatus 1c, and FIG. 5B is a side view of the imaging apparatus 1c. Since the basic configuration of the image pickup apparatus 1c is the same as that of the image pickup apparatus 1, description thereof is omitted by assigning the same reference numerals to the same portions.

As shown in FIG. 5, the imaging device 1c is mounted on a housing 101 of an external device such as a mobile phone. Positioning pins (positioning portions) 102 a to 102 c are formed on the inner wall surface of the casing 101 so as to extend toward the subject side in the optical axis direction.
Cutout recesses (positioning engagement portions) 72a to 72c that engage with the end portions of the positioning pins 102a to 102c are formed on the side surface of the sub-board 70a. The notch recesses 72a to 72c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
Accordingly, the positioning pins 102a to 102c position the sub board 70a. Further, the positioning pins 102a to 102c are positioned so that the electronic component 60 does not contact the system IC 40.

FIG. 6 is an enlarged view showing the configuration around the positioning pin 102a. FIG. 6A is a diagram showing the engagement between the positioning pin 102a and the notch recess 72a.
An engaging pin 1021a is formed at the tip of the positioning pin 102a so as to protrude toward the subject side in the optical axis direction. Further, the engagement pin 1021a is formed thinner than the body portion of the positioning pin 102a. This engagement pin 1021a engages with the notch recess 72a. The notches 72b and 72c and the positioning pins 102b and 102c have the same configuration as described above.

Although not shown in FIG. 5, notch recesses 52a to 52c that engage with the side surfaces of the positioning pins 102a to 102c are formed on the side surface of the main board 50a. The notch recesses 52a to 52c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
Thus, the positioning pins 102a to 102c position the main board 50a.

FIG. 6B is a diagram showing the engagement between the positioning pin 102a and the notch recess 52a. The side surface of the body portion of the positioning pin 102a engages with the notch recess 52a. The notches 52b and 52c and the positioning pins 102b and 102c have the same configuration as described above.
Thereby, the main board | substrate 50a is positioned with respect to the orthogonal direction of an optical axis.

  Thus, since it has the notch recessed parts 52a-52c and 72a-72c engaged with the positioning pins 102a-102c formed in the external apparatus, the imaging device 1c can be easily mounted in an external apparatus. .

  Further, the positioning pins 102a to 102c regulate the separation distance between the sub board 70a and the system IC 40 according to the length in the optical axis direction.

  Thus, since the main board 50a and the sub board 70a are positioned with one member and the distance between the sub board 70a and the system IC 40 is regulated, the number of parts of the imaging apparatus can be reduced, and the imaging apparatus 1c. The manufacturing process can be simplified. Thereby, the imaging device 1c can be manufactured at low cost.

  Further, since the main board 50a and the sub board 70a are positioned by one member and the separation distance between the sub board 70a and the system IC 40 is regulated, the positional accuracy due to the dimensional tolerance is compared with the case of positioning by a plurality of members. Can be minimized.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and modifications and changes can be made within the scope of the gist of the present invention described in the claims. Is possible.
For example, in the above embodiment, the optical unit 10 has a configuration in which the voice coil motor 20 is disposed around the lens barrel. However, the optical unit 10 is not limited to such a configuration. An actuator for moving in the axial direction may be provided. In this case, a positioning restricting portion is formed on the outer peripheral portion of the lens barrel.
In the present embodiment, the system IC 40 is provided on the main board 50. However, the system IC 40 is not limited to the system IC 40, and the main board 50 has a larger occupation area than the electronic component 60 provided on the sub board 70. Good. Further, a DSP or an ISP (Image Signal Processor) having an image processing circuit may be provided instead of the system IC 40. Further, the lens may be driven not only by the voice coil motor 20 but also by using another motor. Further, it may be a single focus type imaging device without a lens driving device. Moreover, the terminal part soldered may be sufficient instead of the connector 90 in which FPC100 is inserted.
In the above embodiment, the electronic component 60 is mounted on the surface of the sub-board 70 that faces the system IC 40. However, the electronic component 60 is not limited to such a configuration. An electronic component may be mounted on the surface that is not provided.
In the first embodiment, the spacer 60 is fixed to the system IC 40 and the sub board 70. However, the spacer 60 is not limited to such a configuration, and the spacer 60 is fixed to the main board 50 and the sub board 70. You may comprise. In this case, the spacer 60 may be mounted on the main board 50 together with the system IC 40.

1 is a diagram illustrating a configuration of an imaging apparatus according to a first embodiment. It is a side view of an imaging device before positioning a sub board. 6 is a diagram illustrating a configuration of an imaging apparatus according to Embodiment 2. FIG. FIG. 6 is a diagram illustrating a configuration of an imaging apparatus according to a third embodiment. FIG. 6 is a diagram illustrating a configuration of an imaging apparatus according to a fourth embodiment. It is the enlarged view which showed the structure of the positioning pin periphery.

Explanation of symbols

1, 1a, 1b, 1c
Imaging device 10
Optical unit 20
Voice coil motor 22a, 22b, 22c
Projection piece (positioning restriction part)
23
Second terminal portion 24
Solder 30
Image sensor 40
System IC (main parts)
50, 50a
Main board 52a, 52b, 52c, 72a, 72b, 72c
Notch recess (positioning engagement part)
55
FPC (flexible substrate)
60
Electronic parts (sub parts)
70, 70a
Sub-board 80
Spacer (Positioning restriction)
90
Connector (terminal part)
100
FPC
101
External device casings 102a, 102b, 102c
Positioning pin (positioning part)
1021a
Engagement pin

Claims (8)

A main board on which an image pickup device, a main component, and an optical unit for guiding light to the image pickup device are mounted on the same surface;
A sub-board connected to the main board via a flexible board and mounted with sub-components,
The imaging apparatus, wherein the flexible substrate is bent, and the sub-substrate is disposed opposite to the main component within the width in the longitudinal direction of the main substrate and facing the optical axis direction. The imaging apparatus according to claim 1, wherein the sub-board is disposed so as to be held at a position lower than a height of the optical unit in an optical axis direction. The imaging device according to claim 1, wherein the sub-board is provided with a terminal portion for electrically connecting an external device. The main board and the sub board are rigid wiring boards made of a hard base material, and the main board, the sub board, and the flexible board include the main board and the sub board as the flexible board. The imaging apparatus according to claim 1, wherein the imaging apparatus is a rigid-flex wiring board integrated and electrically connected. 5. The image pickup apparatus according to claim 1, further comprising a positioning restriction portion that positions the sub board by regulating a separation distance between the sub board and the main component. The imaging apparatus according to claim 5, wherein the positioning restriction part is formed integrally with the optical unit. The imaging apparatus according to claim 5, wherein the positioning restriction portion includes a second terminal portion that electrically connects the connected device and the sub-board. A positioning unit that positions the imaging device is formed in the external device on which the imaging device is mounted, and a positioning engagement unit that engages with the positioning unit is formed in the imaging device,
The imaging apparatus according to claim 1, wherein the positioning unit positions the main board and the sub board and regulates a separation distance between the sub board and the main component.

Images