JP2007221002A - Manufacturing device of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively manufacture an electronic component having a structure wherein an electronic component body and a bonding member are bonded by enabling an adhesive to be applied uniformly to a plurality of electronic component bodies. <P>SOLUTION: A plurality of electronic component bodies 4 are held by a plurality of through-holes 5 provided to a holding plate 6; and an adhesive is uniformly applied to the electronic component body by bringing the electronic component body to an application table 1, wherein an adhesive 2 is expanded with almost uniform pressing force by pressing the electronic component body 4 from a rear by an independently suspended pressing pin 8. The electronic component body and the bonding member are bonded by bringing the electronic component body whereto the adhesive is attached into contact with the bonding member 10. A pressing jig 9 is used having a structure wherein a pressing pin 8 is raised in a base body 13 formed by using a rubber-like elastic body. A pressing pin is used as the pressing pin 8 constituting the pressing jig having a spring disposed so that its restoring force works to return to its original length when a stress is applied in a direction wherein a length contracts. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to an electronic component manufacturing apparatus, and more specifically, for example, an electronic component main body such as a wound coil component in which a wire is wound around a winding core and a ferrite plate is bonded to both ends of the winding core. The present invention relates to an electronic component manufacturing apparatus for manufacturing an electronic component having a structure in which a bonded member and a member to be bonded are bonded via an adhesive.

  For example, as shown in FIG. 8, a winding core 51 made of ferrite having flange portions 53a and 53b on both ends, and wound around the winding core 51, as shown in FIG. The wire 54 connected to the electrode 55 provided at the lower part of 53a, 53b and the pair of flange parts 53a, 53b are connected so as to extend from the flange part 53a on one side to the flange part 53b on the other side. There is a wire-wound coil component having a structure including a ferrite plate 56.

  And in manufacturing the winding type coil component which has such a structure, after winding the wire 54 around the winding core 51, on the joining surfaces 63a and 63b of the flange portions 53a and 53b on both ends of the winding core. The ferrite plate 56 is manufactured by bonding through an adhesive 57 (see, for example, Patent Document 1).

  In the case of this manufacturing method, the bonding surfaces 63a and 63b of the winding core 51, which is the electronic component main body, with the ferrite plate 56 are brought into contact with the adhesive 57, and the adhesive 57 is applied to the bonding surfaces 63a and 63b. The ferrite plate 56 is bonded to the winding core 51 by pressing the ferrite plate 56 against the bonding surfaces 63a and 63b to which the adhesive 57 of the winding core 51 is applied to cure the adhesive 57. Yes.

And in this manufacturing method, when apply | coating the adhesive agent 57 to the joint surfaces 63a and 63b of the winding core 51, as shown in FIG. 9, the winding core which arranges and arranges the several winding core 51 in a line. A chuck mechanism 70 having a bottomed groove 71 shallower than the height 51 and configured to hold the winding core 51 in the groove 71 by vacuum suction is used to form the winding core 51 in the groove 71. The chuck mechanism 70 is moved up and down with the opening of the groove 71 facing down and the winding core 51 protruding downward, so that the joint surfaces 63a and 63b of the winding core 51 are applied to the coating table. The adhesive 57 is applied to the joining surfaces 63 a and 63 b of the winding core 51 by contacting the adhesive 57 developed on the 61 with a constant thickness.
Therefore, the winding core 51 is brought into contact with the adhesive 57 on the application table 61 in a state in which the winding core 51 is positioned in the height direction by the bottom of the groove 71 of the chuck mechanism 70.

Therefore, in addition to the dimensional error of the winding core 51 itself, the height of the joining surfaces 63a and 63b of the winding core 51 varies due to the error in processing accuracy of the chuck mechanism 70. When the variation in the height direction of the joint surfaces 63a and 63b is within the allowable range, the adhesive 57 is applied satisfactorily, but the joint surfaces 63a and 63b of the winding core 51 exceed the allowable range. If it protrudes or the amount of protrusion is insufficient, it causes a variation in the application state of the adhesive 57 and causes a problem in assembly.
JP 2003-86442 A

  The present invention solves the above-described problem, and can apply an adhesive to a predetermined position of a plurality of electronic component main bodies simultaneously and uniformly, and the electronic component main body and the member to be joined via the adhesive. It is an object of the present invention to provide an electronic component manufacturing apparatus capable of efficiently manufacturing an electronic component having a structure in which and are joined.

In order to solve the above-described problem, an electronic component manufacturing apparatus according to claim 1 comprises:
The electronic component main body and the member to be bonded are bonded by applying an adhesive to the joint portion of the electronic component main body held on the holding plate and bonding the electronic component main body and the member to be bonded through the adhesive. An electronic component manufacturing apparatus for manufacturing an electronic component having a structure joined via an agent,
An application table;
An adhesive spreading means for spreading the adhesive on the coating table at a constant thickness;
An inner peripheral surface made of an elastic material, and a holding plate provided with a plurality of through holes for elastically holding the electronic component main body by the inner peripheral surface;
The electronic component main body, which is arranged in a state of being suspended independently from each other in a position corresponding to each through hole of the holding plate and is elastically held in the through hole by being driven by a driving means, is fixed with an adhesive. A pressing jig provided with a pressing pin for pressing toward the coating table developed in thickness;
The joining part of the electronic component main body elastically held in the through hole of the holding plate is attached to a member to be joined disposed at a position corresponding to the through hole of the holding plate. And a joining mechanism portion that joins the electronic component body and the member to be joined.

  According to a second aspect of the present invention, in the electronic component manufacturing apparatus according to the first aspect of the present invention, the pressing jig has a structure in which a pressing pin is erected on a base formed using a rubber-like elastic body. It is characterized by being.

  Further, in the electronic component manufacturing apparatus according to claim 3, in the configuration of the invention according to claim 1 or 2, when stress is applied in a direction in which the length contracts as the pressing pin constituting the pressing jig, A pressing pin having a spring arranged so as to exert a restoring force to return to the original length is used, and the electronic component body is directed to the application table in which an adhesive is spread at a constant thickness. When pressing, the electronic component main body is configured to be applied with a predetermined pressing force by the urging force of the spring.

  According to a fourth aspect of the present invention, there is provided the electronic component manufacturing apparatus according to any one of the first to third aspects, wherein the joining mechanism is elastically held in the through hole from above the holding plate. It is characterized by having an extrusion pin that pushes the component body downward.

  According to a fifth aspect of the present invention, in the electronic component manufacturing apparatus according to the fourth aspect of the present invention, when the electronic component main body and the member to be bonded are bonded, the push-out pin is an upper end surface of the electronic component main body. The electronic component main body is configured to abut against the member to be joined with a predetermined pressing force.

  According to a sixth aspect of the present invention, there is provided the electronic component manufacturing apparatus according to any one of the first to fifth aspects, wherein the joining member is located at a position substantially opposite to the through hole of the holding plate. Each of the electronic component main bodies elastically held in the through-holes of the holding plate is connected to the bonded member storage jig. It is characterized by being configured to be joined to each of the members to be joined housed and held in the bottomed hole via the adhesive.

  According to a seventh aspect of the present invention, there is provided the electronic component manufacturing apparatus according to any one of the first to sixth aspects, wherein the electronic component is joined to a predetermined position of the winding core around which the wire is wound. It is a wire-wound coil component having the above-described structure.

  According to another aspect of the invention, there is provided an electronic component manufacturing apparatus comprising: an application table; an adhesive developing means for developing an adhesive on the application table with a constant thickness; and an inner peripheral surface made of an elastic material. A holding plate provided with a plurality of through-holes for elastically holding the component body, and arranged in a state of being suspended independently at positions corresponding to the through-holes of the holding plate, driven by driving means, and passed through. A pressing jig provided with a pressing pin that presses the electronic component main body elastically held in the hole toward the coating table in which the adhesive is spread at a constant thickness, and the electronic component elastically held in the through hole of the holding plate A joining mechanism portion for joining the electronic component body and the joined member by bringing the joined portion of the main body into contact with the joined member arranged at a position corresponding to the through hole of the holding plate. It has a configuration with Therefore, by holding multiple electronic component bodies in the through holes of the holding plate and pressing them from the back with the pressing pins, each electronic component body is brought into contact with the coating table on which the adhesive is spread with a substantially uniform pressing force. The electronic component main body can be applied uniformly to the electronic component main body, and the electronic component main body with the adhesive uniformly adhered to the joining surface is brought into contact with the member to be joined. And the member to be joined can be reliably joined, and an electronic component having a structure in which the electronic component main body and the member to be joined are joined via an adhesive can be efficiently manufactured.

  That is, in the present invention, when applying the adhesive to the joint portion of the electronic component main body, the plurality of electronic component main bodies are elastically held by the inner peripheral surfaces of the plurality of through holes provided in the holding plate, and are independently suspended. Since it is pressed from behind with a pressing pin, when there is a slight misalignment between the electronic component bodies when they are held in the through holes, or when there are dimensional variations in the holding plate and each electronic component body In addition, the pressing pin makes it possible to bring the joint portion of each electronic component body into contact with the application table on which the adhesive layer is spread with a substantially uniform pressing force, and uniformly adheres to all the electronic component bodies. Can be applied.

  As a result, for example, a wound-type coil component having a structure in which a ferrite member (member to be bonded) is bonded to a predetermined position of a winding core (electronic component main body) wound with a wire via an adhesive When manufacturing an electronic component, it is possible to manufacture the electronic component configured as described above reliably and efficiently.

In the present invention, regarding the pressing pin, `` arranged in an independently suspended state '' means that each of the pressing pins corresponding to each through hole is an electronic component body elastically held in the corresponding through hole, It is a concept that means that it is arranged so that it can be pressed independently from each other on the application table where the adhesive is developed with a predetermined pressing force, as described below,
(a) having a structure in which a single or a plurality of pressing pins are erected on a base formed using a rubber-like elastic body;
(b) When the stress is applied in the direction in which the length of the pressing pin contracts, the one having a structure provided with a spring arranged so that a restoring force to return to the original length is applied. In the invention, an example of a configuration in which the pressing pins are arranged in an independently suspended state is given.

  Further, as in the electronic component manufacturing apparatus according to claim 2, in the configuration of the invention according to claim 1, as a pressing jig for pressing the electronic component main body, a pressing pin is attached to a base formed using a rubber-like elastic body. When using a structure having a standing structure, it is possible to suppress variations in the pressing force to each electronic component body when pressing each electronic component body, and to bond the joints of each electronic component body. It is possible to contact the coating table with a constant thickness with a uniform pressing force, and more reliably apply the adhesive to each of the multiple electronic component bodies held on the holding plate. Will be able to.

  Further, as in the electronic component manufacturing apparatus according to claim 3, in the configuration of the invention according to claim 1 or 2, when a stress is applied in a direction in which the length contracts as a pressing pin constituting the pressing jig, When using a pressing pin with a spring arranged so that a restoring force to return to the original length is used, the electronic component body is directed toward the coating table in which the adhesive is spread at a constant thickness. When pressing, it becomes possible to press the electronic component main body with a predetermined pressing force by the urging force of the spring, and the bonding portion of each electronic component main body is uniformly pressed against the coating table on which the adhesive layer is spread. The adhesive can be applied more reliably and uniformly to each of the plurality of electronic component main bodies held on the holding plate by the contact with each other, and the present invention can be more effectively realized. .

  According to a fourth aspect of the present invention, there is provided the electronic component manufacturing apparatus according to any one of the first to third aspects of the present invention, wherein the joining mechanism portion lowers the electronic component main body elastically held in the through hole from above the holding plate. For example, when the electronic component main body and the member to be bonded are bonded, the electronic component main body is pressed against the bonded portion to bond the electronic component main body and the bonded member more. After the electronic component main body and the member to be joined are bonded, the electronic component main body is pushed downward to release the engagement between the electronic component main body and the through hole of the holding plate. It becomes possible to send it to a process, and the present invention can be further effectively presented.

  When the electronic component main body elastically held in the through hole of the holding plate is pushed downward by the push pin, the push pin may be pushed down without moving the hold plate, or the push pin is moved. Alternatively, the holding plate may be raised. It is also possible to configure so that both the holding plate and the push pin are moved in the vertical direction.

  Further, as in the electronic component manufacturing apparatus according to the fifth aspect, in the configuration of the invention according to the fourth aspect, when the electronic component main body and the member to be bonded are bonded, the push pin contacts the upper end surface of the electronic component main body. If the electronic component main body is configured to contact the member to be bonded with a predetermined pressing force, the electronic component main body and the member to be bonded can be more reliably bonded, and a highly reliable electronic component can be obtained. It becomes possible to manufacture more reliably.

  Further, as in the electronic component manufacturing apparatus according to the sixth aspect, in the configuration of any one of the first to fifth aspects, the joining member is disposed at a position substantially opposite to the through hole of the holding plate. Each of the electronic component main bodies elastically held in the through holes of the holding plate is provided in the bottomed hole of the bonded member storage jig. When configured to be joined to each member to be joined that is stored and held via an adhesive, each of the plurality of electronic component bodies is efficiently and reliably attached to the member to be joined held at the corresponding position. It becomes possible to make it join, and this invention can be made more effective.

  Further, according to the present invention, when manufacturing a wound type coil component having a structure in which a ferrite member is bonded to a predetermined position of a winding core around which a wire is wound, It is particularly significant that the ferrite member is securely joined to the position of the wire-type coil component, and the wire-wound coil component having the above-described configuration can be manufactured efficiently and reliably.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

  FIG. 1 is a diagram schematically showing the configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing the configuration of an electronic component (winding coil component) manufactured using the electronic component manufacturing apparatus according to one embodiment of the present invention.

  As shown in FIG. 2, the electronic component (winding coil component) includes a winding core (electronic component body) 4 made of ferrite, and flange portions 23 a and 23 b disposed on both ends of the winding core 4. The wire 24 is wound around the winding core 4 and the terminal is connected to the electrode 25 disposed at the lower part of the flange portions 23a and 23b, and extends from the flange portion 23a on one side to the flange portion 23b on the other side. A ferrite plate (member to be joined) 10 is provided that connects and couples the pair of flange portions 23a and 23b.

In this winding type coil component, the ferrite plate 10 and the flange portions 23a and 23b are bonded by the adhesive 2, and the winding portion 30 obtained by winding the wire 24 around the winding core 4 is substantially free of adhesive. 2 has an uncoated structure.
The electronic component manufacturing apparatus A of this embodiment is used for manufacturing the above-described coiled coil component, and is provided at a predetermined position of a winding core (electronic component main body) 4 around which a wire 24 is wound. The ferrite member (member to be joined) 10 is used in the step of joining.
That is, the electronic component manufacturing apparatus A of this embodiment, as shown in FIG. 1, has a coating table 1 and a squeegee 3 that is an adhesive developing means for spreading the adhesive 2 on the coating table 1 with a constant thickness. And a holding plate 6 provided with a plurality of through holes 5 for elastically holding the winding core 4, and arranged in a state of being independently suspended at positions corresponding to the through holes 5 of the holding plate 6, and driving means 7, a pressing jig 9 having a pressing pin 8 that presses the winding core 4 elastically held in the through-hole 5 toward the coating table 1, and an adhesive 2 for the winding core 4. The adhered joint (joint surface) 4a is brought into contact with a ferrite member (ferrite plate) 10 which is a member to be joined disposed at a position corresponding to the through hole 5 of the holding plate 6, and the winding core 4 and ferrite Joiner for joining the plate 10 And a part 11.

  The holding plate 6 is configured such that the inner peripheral surface 12 of the through-hole 5 is made of an elastic material, and the winding core 4 that is the electronic component main body is elastically held by the inner peripheral surface 12.

  Further, as shown in FIGS. 1 and 3, the pressing jig 9 is configured by erecting a pressing pin 8 via a base portion 18 on a base 13 formed using a rubber-like elastic body. .

  As shown in FIGS. 4 (a) and 4 (b), as the pressing pin 8, when a stress is applied in a direction in which the length shrinks (see FIG. 4 (a)), A pressing pin provided with a spring 8b that works to restore the original length (see FIG. 4B) is used, and the winding core 4 is unfolded with a certain thickness. When pressing toward the coating table 1, a predetermined pressing force is applied to the winding core 4 by the urging force of the spring 8b.

Further, as shown in FIG. 1, the joining mechanism portion 11 holds an extruding pin 14 for extruding the winding core 4 elastically held in the through hole 5 downward from above the holding plate 6, and the extruding pin 14. An extrusion pin base 15 is provided.
In this embodiment, the extruding pin 14 is moved upward by moving the holding plate 6 upward in a state where the pushing pin 14 is in contact with the upper surface of the winding core 4 elastically held in the through hole 5 of the holding plate 6. The winding core 4 elastically held in the hole 5 is pushed out of the through hole 5 and the holding of the winding core 4 by the holding plate 6 is released.

  In addition, in the electronic component manufacturing apparatus A of this embodiment, when the winding core 4 and the ferrite plate 10 are joined, the push pin 14 comes into contact with the upper end surface of the winding core 4, and the winding core 4 is configured to contact the ferrite plate 10 with a predetermined pressing force.

Furthermore, in the electronic device manufacturing apparatus A of this embodiment, the bonding mechanism portion 11 has a plurality of existences in which the ferrite 10 that is a member to be bonded is housed and held at a position substantially opposite to the through hole 5 of the holding plate 6. A plate-like member-to-be-joined storage jig 17 having a bottom hole 16 is provided, and either one of the holding plate 6 and the member-to-be-joined member storage jig 17 or both are moved toward the other side, Each of the winding cores 4 elastically held in the plurality of through holes 5 of the holding plate 6 is stored in and held in the plurality of bottomed holes 16 of the bonded member storage jig 17, and the adhesive 2. It is comprised so that it may join via.
Although not particularly illustrated, an insertion hole for inserting a take-out pin for taking out the winding core 4 after the ferrite plate 10 has been joined to the bottom of the bottomed hole 16 of the member-receiving jig 17 to be joined. Is arranged.

  Next, as shown in FIG. 2, the electronic component manufacturing apparatus A configured as described above is used to place ferrite at a predetermined position of the winding core (electronic component main body) 4 around which the wire 24 is wound. A method for manufacturing a wound coil component having a structure in which the plate (member to be joined) 10 is joined will be described.

  (1) First, the holding plate 6 transported from a predetermined process and having the winding core 4 held in the through hole 5 is received, and the bonding surface 4a of the winding core 4 with the ferrite plate 10 is the holding plate 6. It presses with the pressing pin 8 of the pressing jig 9 so that it may protrude slightly below from the lower surface side.

(2) Then, as shown in FIG. 1, the position for applying the adhesive 2 to the bonding surface 4 a of the winding core 4 by the transport mechanism (not shown), that is, the application table 1. To the position above.
Before the holding plate 6 is conveyed, the adhesive 2 is spread on the application table 1 so as to have a constant thickness by the squeegee 3 and preparations for applying the adhesive are made.

  (3) Then, as shown in FIG. 5, the holding plate 6 is positioned slightly above the coating table 1, and the pressing pin 8 is inserted into the through-hole 5 from the upper surface (back surface) of the holding plate 6. The winding core 4 is pressed individually, and the joining surface 4a of the winding core 4 is pressed against the surface of the coating table 1 on which the adhesive 2 is spread with a constant thickness.

(4) Then, the winding core 4 coated with the adhesive 2 is conveyed to a region where the winding core 4 and the ferrite plate 10 are to be joined while being held in the through hole 5 of the holding plate 6 (FIG. 1). .
At this time, the winding cores 4 elastically held in the through holes 5 of the ferrite plates 10 housed and held in the plurality of bottomed holes 16 of the joined member housing jig 17 constituting the joining mechanism portion 11. Position it above.

  (5) Then, as shown in FIG. 6, in a state where the through hole 5 of the holding plate 6 and the bottomed hole 16 of the member-to-be-joined member storage jig 17 are positioned so as to face each other, The push pin 14 is inserted from the upper surface side, and the winding core 4 in the through hole 5 is pressed against the ferrite plate 10.

  (6) Thereafter, as shown in FIG. 7, only the holding plate 6 is raised in a state where the winding core 4 is pressed against the ferrite plate 10 with a predetermined pressing force by the push pin 14, and the member to be joined is stored. It is assumed that the winding core 4 having the ferrite plate 10 bonded thereto is placed in the 17 bottomed holes 16.

  (7) Next, the winding core 4 to which the ferrite plate 10 is bonded is transported to the region for curing the adhesive 2 together with the bonded member storage jig 17 (for example, a heat treatment apparatus equipped with heating means). The adhesive 2 is cured.

  (8) Then, the part 2 is discharged while the adhesive core 2 is cured and the winding core 4 to which the ferrite plate 10 is fixed (that is, the wound type coil part as a product) is held on the member-to-be-joined member storage jig 17. Then, a take-out pin (not shown) is inserted from an insertion hole (not shown) formed in the bottom of the bottomed hole 16 of the member-to-be-joined member storage jig 17, and a wound coil component as a product is inserted. Take out.

  In the above embodiment, when the adhesive 2 is applied to the joint surface 4 a of the winding core (electronic component body) 4, the plurality of winding cores (electronic component body) 4 are provided with a plurality of through holes provided in the holding plate 6. 5 is elastically held on the inner peripheral surface and is pressed from behind by an independent suspension pressing pin 8, so that it is somewhat between the winding cores (electronic component main bodies) 4 when elastically held in the through hole 5. In the case where there is a displacement of the position, or in the case where the holding plate 6 or each winding core (electronic component main body) 4 has dimensional variations, the pressing pins 8 are used to join each winding core (electronic component main body) 4. The surface 4a can be brought into contact with the application table 1 on which the adhesive 2 is spread with a substantially uniform pressing force, and the adhesive 2 is uniformly applied to a plurality of winding cores (electronic component main bodies) 4. It becomes possible.

  Specifically, in the method of Patent Document 1 described above, the application failure rate of the adhesive 2 was 0.1 to 0.2%, but in the method of the above example, the application failure rate was substantially reduced. Has been confirmed to be 0%.

  Therefore, according to the manufacturing method of the above embodiment, the ferrite member (member to be joined) 10 is joined via the adhesive 2 to the joining surface 4a of the winding core (electronic component body) 4 around which the wire 24 is wound. The wire-wound coil component (electronic component) having the above structure can be manufactured reliably and efficiently.

  In the above embodiment, the case of manufacturing a wound coil component has been described as an example. However, by applying the present invention, not only the wound coil component but also the electronic component main body and the member to be joined have an adhesive. Thus, it is possible to efficiently manufacture an electronic component (for example, an electronic component with a protective case (that adheres the case and the electronic component main body)) having a structure joined through the two.

  Moreover, in the said Example, when the stress is applied to the base | substrate 13 formed using the rubber-like elastic body as the press jig | tool 9, the length shrink | contracts, the restoring force which tries to return to the original length A pressing jig formed by erecting a pressing pin 8 provided with a spring 8b that works is used, but when a base 13 made of a rubber-like elastic body is used as in this embodiment, It is also possible to use a pressing pin made of a rigid material that does not include a spring as described above, and when the pressing pin 8 that includes a spring as described above is used, It is also possible to use a base made of a rigid body such as metal.

  The invention of the present application is not limited to the above embodiment in other points as well. The specific structure of the holding plate, the number and positions of the through holes provided in the holding plate, and the specifics of the through holes. Shape, the type of material constituting the inner peripheral surface of the through-hole, the specific shape of the push pin constituting the joining mechanism, the member to be joined storage jig provided in the joining mechanism, and the With respect to the specific structure of the bottom hole, various applications and modifications can be made within the scope of the invention.

As described above, according to the present invention, the electronic component main body is elastically held by the inner peripheral surfaces of the plurality of through holes provided in the holding plate, and is pressed from behind by the independent suspension pressing pins. Even when there is a slight misalignment between the electronic component bodies when they are elastically held in the through holes, or when there is a dimensional variation in the holding plate or electronic component body, The surface can be brought into contact with the adhesive with a substantially uniform pressing force, and an electronic component having a structure in which a member to be bonded is bonded to the electronic component main body via the adhesive can be efficiently manufactured.
Therefore, the present invention manufactures an electronic component such as a wound coil component having a structure in which a bonded member such as a ferrite member is bonded to the bonding surface of an electronic component main body such as a winding core via an adhesive. It is possible to apply widely when doing.

It is a figure which shows typically the structure of the manufacturing apparatus of the electronic component concerning one Example of this invention. It is a figure which shows the structure of the electronic component (winding-type coil component) manufactured using the manufacturing apparatus of the electronic component concerning one Example of this invention. It is a figure which shows the structure of the press jig | tool used in the manufacturing apparatus of the electronic component concerning one Example of this invention. (a), (b) is a figure which shows the structure of the press pin used in the manufacturing apparatus of the electronic component concerning one Example of this invention, (a) is a figure which shows the state shrunk in the longitudinal direction, (b) is a figure which shows the state which the length of the longitudinal direction restored. In the process of manufacturing a wound type coil component using the electronic component manufacturing apparatus according to one embodiment of the present invention, the winding core is pressed, and the bonding surface of the winding core is spread with a constant thickness. It is a figure which shows the state pressed against the surface of an application | coating table. In the process which manufactures a winding type coil component using the electronic component manufacturing apparatus concerning one Example of this invention, it is a figure which shows the state which is going to press the winding core in a through-hole against a ferrite plate with an extrusion pin. is there. In the process of manufacturing the coiled coil component using the electronic component manufacturing apparatus according to one embodiment of the present invention, the holding plate is pressed in a state where the winding core is pressed against the ferrite plate with a predetermined pressing force by the push pin. It is a figure which shows the state raised. It is a figure which shows the example of the electronic component which has a structure where the electronic component main body and the to-be-joined member were joined via the adhesive agent. It is a figure which shows the method of apply | coating an adhesive agent to the bonding surface of the winding core which is an electronic component main body in the manufacturing method of the conventional electronic component.

Explanation of symbols

A Electronic device manufacturing equipment 1 Application table 2 Adhesive 3 Squeegee 4 Winding core (electronic component body)
4a Joint (joint surface)
DESCRIPTION OF SYMBOLS 5 Through-hole 6 Holding plate 7 Drive means 8 Pressing pin 8a Cylindrical main body 8b Spring 9 Pressing jig 10 Ferrite plate (ferrite member, to-be-joined member)
DESCRIPTION OF SYMBOLS 11 Joining mechanism part 12 Inner peripheral surface of through-hole 13 Base body 14 Extrusion pin 15 Extrusion pin base body 16 Bottomed hole 17 Joined member storage jig 18 Base 23a, 23b Flange part 24 Wire 25 Electrode 30 Winding part

Claims (7)

The electronic component main body and the member to be bonded are bonded by applying an adhesive to the joint portion of the electronic component main body held on the holding plate and bonding the electronic component main body and the member to be bonded through the adhesive. An electronic component manufacturing apparatus for manufacturing an electronic component having a structure joined via an agent,
An application table;
An adhesive spreading means for spreading the adhesive on the coating table at a constant thickness;
An inner peripheral surface made of an elastic material, and a holding plate provided with a plurality of through holes for elastically holding the electronic component main body by the inner peripheral surface;
The electronic component main body, which is arranged in a state of being suspended independently from each other in a position corresponding to each through hole of the holding plate and is elastically held in the through hole by being driven by a driving means, is fixed with an adhesive. A pressing jig provided with a pressing pin for pressing toward the coating table developed in thickness;
The joining part of the electronic component main body elastically held in the through hole of the holding plate is attached to a member to be joined disposed at a position corresponding to the through hole of the holding plate. An electronic component manufacturing apparatus comprising: a joining mechanism unit that joins the electronic component body and the member to be joined.   2. The electronic component manufacturing apparatus according to claim 1, wherein the pressing jig has a structure in which a pressing pin is erected on a base formed using a rubber-like elastic body.   As the pressing pin constituting the pressing jig, when a stress is applied in a direction in which the length contracts, a pressing pin provided with a spring arranged so that a restoring force to return to the original length works. When the electronic component body is pressed toward the application table in which the adhesive is spread with a constant thickness, a predetermined pressing force is applied to the electronic component body by the biasing force of the spring. 3. The electronic component manufacturing apparatus according to claim 1, wherein the electronic component manufacturing apparatus is configured as described above.   The said joining mechanism part is provided with the extrusion pin which extrudes below the said electronic component main body elastically hold | maintained by the said through-hole from the upper direction of the said holding plate. Electronic component manufacturing equipment.   When the electronic component body and the member to be joined are joined, the push pin abuts on an upper end surface of the electronic component body, and the electronic component body abuts on the member to be joined with a predetermined pressing force. 5. The electronic component manufacturing apparatus according to claim 4, wherein the electronic component manufacturing apparatus is configured as follows.   The joining mechanism portion includes a joined member storage jig having a plurality of bottomed holes in which the joined members are accommodated and held at positions substantially opposite to the through holes of the holding plate, Each of the electronic component main bodies elastically held in the through hole is joined to each of the members to be joined housed and held in the bottomed hole of the member to be joined storage jig through the adhesive. The electronic component manufacturing apparatus according to claim 1, wherein the electronic component manufacturing apparatus is configured as described above.   The said electronic component is a winding type coil component which has the structure where the ferrite member was joined to the predetermined position of the winding core in which the wire was wound, The one in any one of Claims 1-6 characterized by the above-mentioned. Electronic component manufacturing equipment.

Images