JP2007220862A - Metallized film capacitor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a characteristic reduction in a metallized film capacitor due to a leakage failure and a surface leakage occurring between metallikon metal electrodes at the end faces of its capacitor element, and to realize a loss reduction in a manufacturing process. <P>SOLUTION: The metallized film capacitor is equipped with a capacitor element 9 which is configured in such a manner that a metallized film composed of a dielectric film 1 and a pair of metal evaporation electrodes formed thereon is rolled up, so as to enable the metal evaporation electrodes to confront each other through the intermediary of the dielectric film 1; and extraction electrodes 8 which are formed of metallikon and provided on the end faces of the capacitor element 9, respectively. In this case, the outer peripheral surface of the capacitor element 9 excluding the extraction electrodes 8 is coated with a cellophane masking tape 3 while a clearance of 3.0 mm or above is provided apart from each of the extraction electrodes 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is used in various electronic equipment, electrical equipment, industrial equipment, automobiles, and the like, and more particularly, relates to a metallized film capacitor that is optimal for smoothing, filtering, and snubbing of an inverter circuit for driving a motor of a hybrid car, and a manufacturing method thereof. Is.

  A conventional metallized film capacitor forms a substantially oval shaped capacitor element by winding a metallized film deposited on a dielectric polymer film into a substantially cylindrical shape and pressing it from the side direction.

  Metallicon metal is applied to both ends of the substantially oval metallized film capacitor for leading out the external electrode. In order to increase manufacturing efficiency in this metallicon metal spraying step, metal plates are continuously sprayed by incorporating substantially oval metallized film capacitors into one or more rows of frames in a state where they are arranged and pressed in the minor axis direction. The film capacitor element framed with the metallicon metal is subjected to vacuum heat treatment in a pressed state and removed from the frame.

  At this time, a large amount of metallicon metal is adhered to the side surface exterior portion. This is because the metallicon metal is sprayed directly on the side surface exterior portion because the entire frame is sprayed in the metallicon metal spraying process.

  Since the adhered metallicon metal impairs the insulating properties at both ends of the substantially oval metallized film capacitor, it was necessary to remove the sprayed metal in the next step. As a method of removing the metallicon metal, for example, a method of scraping off the adhered metallicon metal by spraying glass beads or the like with compressed air, a method of turning off the number of exterior films of the metallized film capacitor and removing the metallicon metal together with the metallicon metal, etc. was there.

  Thus, in the conventional manufacturing method and metallized film capacitor, it was necessary to remove the metallicon metal. All of these generated significant manufacturing losses such as man-hours and indirect material costs.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-1-220816

  However, in the metallized film capacitor according to the above-described conventional manufacturing method, the metal sprayed as the metallized metal of the extraction electrode adheres to the side surface exterior part, and the characteristics are deteriorated due to a short circuit or a surface leak due to a leak failure between the metallized metal electrodes. A process for removing this was necessary.

  In addition, in the known art, an operation step of wiping off the element side exterior part is necessary for the purpose of confirming that no extra sprayed metal debris is attached.

  These have caused a loss in the manufacturing process such as an adverse effect on the characteristics of the metallized film capacitor, man-hours, and indirect material costs. The present invention solves such a conventional problem, by winding a film or tape on which the metallicon metal is difficult to adhere to the side exterior portion of the metallized film capacitor and performing a masking treatment, thereby causing a leakage failure between the metallicon metal electrodes, the surface It is an object of the present invention to enable characteristic reduction due to leakage and loss reduction in the manufacturing process.

  In order to solve the above-mentioned problems, a metallized film deposited on a dielectric film is wound, and then a masked cellophane film or an adhesive cellophane adhesive tape is attached to the side exterior of the metallized film capacitor. Process.

  The cellophane for masking and the cellophane tape have a thickness of 30 μm or more and a width of 3.0 mm or more, and are wound around a metallicon metal part at a distance of 3.0 mm or more.

  The metallized film capacitor of the present invention is a metallized film capacitor that can reduce loss in the manufacturing process because the metallized metal is difficult to adhere to the side surface of the capacitor element when the metallized electrode is formed.

  A metallized film is wound, and a cellophane adhesive tape and a cellophane film are coated on the side exterior portion. By applying an alkyl pendant or silicon compound to the surface of the cellophane adhesive tape or cellophane film, it is possible to further prevent the metallicon metal from adhering. In addition to the alkyl pendant type and silicon type compounds considered to be applied to the surface of the cellophane film, fluorine type compounds have been considered, but the capacitor characteristics are adversely affected for reasons such as promoting oxidation of the metallized film. Cellophane is made of pulp and is the same material as paper, so that it is charged during drying. However, the application of the above compound also prevents drying and prevents charging. As a result, the metallicon metal can be further prevented from sticking by utilizing the fact that the cellophane has no heat softening property and is not easily charged.

  Further, the cellophane adhesive tape and the cellophane film are coated at a position of 3.0 mm or more from the metallicon metal electrode. Those cellophane adhesive tapes and cellophane films have a width of 3.0 mm or more. By covering the inner side of the metallicon metal by 3.0 mm or more, the extra metallicon metal does not adhere to the side surface exterior portion, and the wiping work of the metallicon metal can be omitted.

  In addition, by separating the metallicon metal electrodes by 3.0 mm or more from each other, the metallicon metal adhered to the portion and the metallicon electrode are more closely adhered to each other, thereby increasing the adhesive strength between the metallicon electrode and the film.

(Embodiment 1)
Hereinafter, the present invention will be described using the first embodiment.

  FIG. 1 is a diagram showing a configuration of a wound metallized film capacitor according to Embodiment 1 of the present invention.

  In FIG. 1, 1 is a dielectric polymer film made of polypropylene, and 2 is a vapor deposition metal made of aluminum or zinc.

  Reference numeral 3 denotes a masking tape, reference numeral 4 denotes a masking tape application position A dimension that defines the position where the masking tape 3 is applied, and reference numeral 5 denotes a masking tape width B dimension that defines the width of the masking tape 3.

  A vapor-deposited metal 2 is provided on one surface of the dielectric polymer film 1, and the strip-shaped non-metal vapor-deposited portions 1 a having no vapor-deposited metal 2 are opposed to each other through the dielectric polymer film 2 at different positions in the width direction of the dielectric polymer film 1. Thus, a pair of metallized vapor-deposited films is formed and wound into a cylindrical shape to constitute a metallized film capacitor element 9.

  Then, as shown in FIG. 1, an adhesive cellophane is coated as a masking tape 3 on the outermost portion of the metallized film capacitor element 9 wound.

  At this time, the covering position of the masking tape 3 is set so that the masking tape attaching position A dimension 4 is 3.0 mm or more inward from the end face of the metallized film capacitor element 9.

  The masking tape width B dimension 5 is 3.0 mm or more.

  Cellophane film or cellophane adhesive tape surface coated with an alkyl pendant compound is used.

  FIG. 2 is a view showing a method of frameworking and press-working the metallized film capacitor element 9 wound into a substantially cylindrical shape.

  In FIG. 2, 6 is an alignment press frame for allowing a plurality of metallized film capacitor elements 9 to be handled at the same time, and 7 is a partition plate for securing a space between adjacent metallized film capacitor elements 9. And 8 is a metallicon electrode which is a sprayed metal metallicon formed by thermally spraying zinc or tin to draw out the electrode of the metallized film capacitor element 9.

  Metallicon electrodes 8 are provided at both ends of the substantially cylindrical metallized film capacitor element 9 having the above-described metallized film wound thereon and covered with the masking tape 3 on the side surfaces for leading out external electrodes.

  In order to increase manufacturing efficiency in the metallized metal spraying process for forming the metallized electrode 8, approximately oval metallized film capacitors are arranged in the minor axis direction, and a partition plate 7 is installed between each metallized film capacitor element 9, and press In this state, it is incorporated into one or a plurality of rows of aligned press frames 6 to continuously perform metallized metal spraying.

  This metallized film capacitor element 9 forms a metallicon electrode 8, is framed by an alignment press frame 6, and is vacuum-heated while being pressed into a substantially oval shape.

  The masking tape 3 may be a cellophane adhesive tape or a cellophane film. Since these are easily available, the material cost can be further reduced.

  The metallized film capacitor element 9, which is removed from the alignment press frame 6 after the vacuum heat treatment and becomes a substantially oval type, is coated with the masking tape 3 so that the masking tape attachment position A dimension 4 is 3.0 mm or more on the side exterior part. Since the excess metallicon metal by the electrode 8 does not adhere, it is possible to reduce the process of scraping off and wiping off the metallicon metal.

  In addition, it is possible to prevent deterioration in characteristics that may occur during the operation of scraping off the excess metallicon metal adhering to the side surface portion of the metallized film capacitor element 9.

  As described above, according to the embodiment of the present invention, in the step of forming the metallicon electrode 8 for leading out the external electrode on both side ends of the metallized film capacitor element 9, the extra metallicon due to the metallicon electrode 8 attached to the side surface portion. Capacitor characteristics are stabilized by eliminating the metal removal process, preventing side surface leakage, and eliminating adverse effects on the characteristics due to the removal operation.

  Further, the omission of the side surface wiping work as in the prior art can further reduce the number of work steps.

  A silicon compound may be applied to the cellophane film surface.

  Since the metallized film capacitor according to the present invention becomes a metallized film capacitor that can reduce loss in the manufacturing process, it is useful as a passive component for all electronic devices.

The block diagram of the element which wound the metallized film by Embodiment 1 of this invention Schematic showing an element framework press according to Embodiment 1 of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dielectric film 1a Band-shaped nonmetallic vapor deposition part 2 Deposition metal 3 Masking tape 4 Masking tape sticking position A dimension 5 Masking tape width B dimension 6 Alignment press frame 7 Partition plate 8 Metallicon electrode 9 Metallized film capacitor element

Claims (6)

A capacitor element formed by winding a metallized film in which a metal vapor deposition electrode is formed on a dielectric film so that the pair of metal vapor deposition electrodes are opposed to each other through the dielectric film, and both end faces of the capacitor element In a metallized film capacitor having an extraction electrode made of a metallicon formed respectively, a masking tape made of cellophane is provided on the outermost peripheral surface excluding the extraction electrode of the capacitor element with a gap of at least 3.0 mm from each extraction electrode. Or a metallized film capacitor coated with a film. The metallized film capacitor according to claim 1, wherein the cellophane masking tape has a film width of at least 3.0 mm. The metallized film capacitor according to claim 1, wherein a cellophane masking tape or an alkyl pendant or silicon compound is applied on the film. 2. The metallized film capacitor according to claim 1, wherein the capacitor element has a substantially oval cross section. The metallized film capacitor according to claim 1, wherein the capacitor element has a substantially cylindrical cross section. A metallized film in which a metal vapor-deposited electrode is formed on a dielectric film is wound so that a pair of metal vapor-deposited electrodes are opposed to each other through the dielectric film, and then a capacitor element is produced. Subsequently, from each end face of the capacitor element A method of manufacturing a metallized film capacitor in which a predetermined gap is provided and a masking tape made of a cellophane tape is coated on an outer peripheral portion, and then an extraction electrode made of metallicon is formed on each end face of the capacitor element by metal spraying.

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