JP2007217499A - Oh modified polyimide resin and method for preparation of the same - Google Patents
Oh modified polyimide resin and method for preparation of the same Download PDFInfo
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- JP2007217499A JP2007217499A JP2006037968A JP2006037968A JP2007217499A JP 2007217499 A JP2007217499 A JP 2007217499A JP 2006037968 A JP2006037968 A JP 2006037968A JP 2006037968 A JP2006037968 A JP 2006037968A JP 2007217499 A JP2007217499 A JP 2007217499A
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 176
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 165
- 238000000034 method Methods 0.000 title description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 53
- 125000003118 aryl group Chemical group 0.000 claims abstract description 27
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 125000000623 heterocyclic group Chemical group 0.000 claims abstract description 10
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 6
- 239000003607 modifier Substances 0.000 claims description 33
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 30
- 239000011342 resin composition Substances 0.000 claims description 27
- 150000002367 halogens Chemical class 0.000 claims description 21
- 239000005056 polyisocyanate Substances 0.000 claims description 13
- 229920001228 polyisocyanate Polymers 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- 150000003138 primary alcohols Chemical class 0.000 claims description 9
- 230000001476 alcoholic effect Effects 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000007142 ring opening reaction Methods 0.000 claims description 6
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 230000004048 modification Effects 0.000 abstract description 11
- 238000012986 modification Methods 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 abstract description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000001879 gelation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 5
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920000298 Cellophane Polymers 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000005462 imide group Chemical group 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- CDZXJJOGDCLNKX-UHFFFAOYSA-N 2,2,3,3-tetrafluorobutane-1,4-diol Chemical compound OCC(F)(F)C(F)(F)CO CDZXJJOGDCLNKX-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000006798 ring closing metathesis reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- GBXRUYNQDDTQQS-UHFFFAOYSA-N 1-O-dodecylglycerol Chemical compound CCCCCCCCCCCCOCC(O)CO GBXRUYNQDDTQQS-UHFFFAOYSA-N 0.000 description 1
- FQYIBTYPDCFSRE-UHFFFAOYSA-N 1-ethoxy-4-methylhexane-1,2-diol Chemical compound CC(CC)CC(C(O)OCC)O FQYIBTYPDCFSRE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- AVSUMWIDHQEMPD-UHFFFAOYSA-N 2-(oxiran-2-yl)ethanol Chemical compound OCCC1CO1 AVSUMWIDHQEMPD-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 1
- NULJIGCWBBPPOA-UHFFFAOYSA-N 3-(3,3-dimethoxybutoxy)propane-1,2-diol Chemical compound COC(CCOCC(CO)O)(C)OC NULJIGCWBBPPOA-UHFFFAOYSA-N 0.000 description 1
- SOGGLVJYVOCYTB-UHFFFAOYSA-N 3-(oxiran-2-yl)propan-1-ol Chemical compound OCCCC1CO1 SOGGLVJYVOCYTB-UHFFFAOYSA-N 0.000 description 1
- LOSWWGJGSSQDKH-UHFFFAOYSA-N 3-ethoxypropane-1,2-diol Chemical compound CCOCC(O)CO LOSWWGJGSSQDKH-UHFFFAOYSA-N 0.000 description 1
- GUPXYSSGJWIURR-UHFFFAOYSA-N 3-octoxypropane-1,2-diol Chemical compound CCCCCCCCOCC(O)CO GUPXYSSGJWIURR-UHFFFAOYSA-N 0.000 description 1
- ZTKZJXGLCCVMLJ-UHFFFAOYSA-N 3-propoxypropane-1,2-diol Chemical compound CCCOCC(O)CO ZTKZJXGLCCVMLJ-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IHWUGQBRUYYZNM-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-3,4-dicarboxylic acid Chemical compound C1CC2(C(O)=O)C(C(=O)O)=CC1C2 IHWUGQBRUYYZNM-UHFFFAOYSA-N 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- -1 carboxylic acid compound Chemical class 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- DBZUBBBSXPLXBA-UHFFFAOYSA-N decane-2,3,8,9-tetrol Chemical compound OC(C(C)O)CCCCC(C(C)O)O DBZUBBBSXPLXBA-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- GCXZDAKFJKCPGK-UHFFFAOYSA-N heptane-1,2-diol Chemical compound CCCCCC(O)CO GCXZDAKFJKCPGK-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- LJZULWUXNKDPCG-UHFFFAOYSA-N nonane-1,2-diol Chemical compound CCCCCCCC(O)CO LJZULWUXNKDPCG-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
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- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
本発明は、ポリイミド樹脂の優れた耐熱性、機械的強度、耐薬品性を損なわずに各種基材への密着性を向上させたＯＨ変性ポリイミド樹脂、及び、その製造方法に関するものである。 The present invention relates to an OH-modified polyimide resin having improved adhesion to various substrates without impairing the excellent heat resistance, mechanical strength, and chemical resistance of the polyimide resin, and a method for producing the same.
ポリイミド樹脂は、優れた耐熱性、機械的強度を有する樹脂であり、電子部品や各種基材、例えば電線等のコーティング剤または耐熱塗料などとして広く用いられている。しかしながら、特に耐熱性や強度に優れる芳香族環含有ポリイミド樹脂は剛性が高いため、加工性や基材との密着性が十分ではなく、そのため、基材からのハガレが起こるなどの問題があった。 Polyimide resin is a resin having excellent heat resistance and mechanical strength, and is widely used as a coating agent or heat resistant paint for electronic parts and various base materials, for example, electric wires. However, the aromatic ring-containing polyimide resin, which is particularly excellent in heat resistance and strength, has high rigidity, so that the workability and the adhesion to the base material are not sufficient, and there has been a problem that peeling from the base material occurs. .
従来、金属層とポリイミド樹脂との密着性を向上させるために、ポリイミドフィルム表層部にイミド環が開環して生成したカルボキシル基と、イミド環の窒素および／またはイミド環が開環して生成した第２アミドの窒素と結合したベンゼン環に少なくとも１つの水酸基が付加された分子構造を有する変質ポリイミド層を形成した金属被覆ポリイミドが提案されている（特許文献１）。しかしながら、樹脂層形成後の表面改質では十分な密着性は得られないおそれがあり、また、前記［特許文献１］には表面改質方法として、具体的には酸素プラズマ放電しか開示されておらず、このような物理的改質では所望の密着性を得ることは困難であった。 Conventionally, in order to improve the adhesion between the metal layer and the polyimide resin, the polyimide film surface layer is formed by opening the imide ring and the imide ring nitrogen and / or imide ring. A metal-coated polyimide having a modified polyimide layer having a molecular structure in which at least one hydroxyl group is added to a benzene ring bonded to nitrogen of the second amide has been proposed (Patent Document 1). However, there is a possibility that sufficient adhesion cannot be obtained by surface modification after the resin layer is formed, and the above [Patent Document 1] specifically discloses only oxygen plasma discharge as a surface modification method. In addition, it was difficult to obtain desired adhesion by such physical modification.
また、［特許文献２］には、水酸基またはカルボキシル基を有するジアミンを原料として得られるＡＣＦ密着性および吸湿処理後の半田耐熱性に優れる熱可塑性ポリイミド樹脂が開示されている。しかしながら、このような官能基含有成分の反応により得られる、該官能基含有ポリイミド樹脂は、合成時にゲル化を起こすおそれがあり、貯蔵安定性も十分ではなく、貯蔵時にゲル化を起こしやすいという問題があった。また、特に耐熱性高い構造のポリイミド樹脂を合成することは困難であり、官能基含有成分の反応性等によりポリイミドの構造が限定されてしまうといった問題があった。
また、［特許文献３］にもポリイミドと基材との密着性を改良するために、ポリイミド合成時にフェノール性水酸基を有する化合物を反応し形成させた、フェノール性水酸基含有ポリイミドが提案されている。しかしながら、上記同様、性能、作業性等の面で十分なものではなかった。
[Patent Document 3] also proposes a phenolic hydroxyl group-containing polyimide obtained by reacting and forming a compound having a phenolic hydroxyl group during polyimide synthesis in order to improve the adhesion between the polyimide and the substrate. However, like the above, it was not sufficient in terms of performance and workability.
本発明の目的は、ポリイミド樹脂の耐熱性、機械強度、耐薬品性等の諸物性を損なうことなく、さらに、基材への密着性をさらに向上させたＯＨ変性ポリイミド樹脂、及び、その製造方法を提供することである。
本発明のその他の目的は、上記のＯＨ変性ポリイミド樹脂を含有する樹脂組成物を提供することである。
An object of the present invention is to provide an OH-modified polyimide resin that further improves the adhesion to a substrate without impairing various physical properties such as heat resistance, mechanical strength, and chemical resistance of the polyimide resin, and a method for producing the same. Is to provide.
Another object of the present invention is to provide a resin composition containing the OH-modified polyimide resin.
本発明によれば、下記式（１）
本発明のＯＨ変性ポリイミド樹脂においては、前記水酸基含有変性基は、前記ポリイミド樹脂の繰り返し構造中に存在するヘテロ環開環部位の窒素原子にアミド結合を介して導入された、カルボキシル基含有基のカルボキシル基にエステル結合を介して水酸基含有基が結合したものであることが好ましい。
According to the present invention, the following formula (1)
In the OH-modified polyimide resin of the present invention, the hydroxyl group-containing modifying group is a carboxyl group-containing group introduced through an amide bond to a nitrogen atom of a heterocyclic ring opening site present in the repeating structure of the polyimide resin. It is preferable that a hydroxyl group-containing group is bonded to a carboxyl group via an ester bond.
また、本発明によれば下記式（１）
次いで、１級アルコール由来のＯＨ基を少なくとも２個有する非ハロゲン系多価アルコール化合物及び／又は１級アルコール由来のＯＨ基と末端エポキシ基とを有する非ハロゲン系アルコール性エポキシ化合物を変性剤として使用し、該変性剤を前記ＣＯＯＨ変性ポリイミド樹脂と混合して加熱することにより、該変性剤を該ＣＯＯＨ変性ポリイミド樹脂に導入されている変性基中のカルボキシル基と反応させて、前記多価アルコールまたはアルコール性エポキシ化合物に由来するＯＨ含有基を前記変性基に導入することを特徴とするＯＨ変性ポリイミド樹脂の製造方法が提供される。
Further, according to the present invention, the following formula (1)
Next, a non-halogen polyhydric alcohol compound having at least two primary alcohol-derived OH groups and / or a non-halogen alcohol-based epoxy compound having a primary alcohol-derived OH group and a terminal epoxy group are used as a modifier. Then, the modifier is mixed with the COOH-modified polyimide resin and heated to cause the modifier to react with the carboxyl group in the modified group introduced into the COOH-modified polyimide resin. There is provided a method for producing an OH-modified polyimide resin, wherein an OH-containing group derived from an alcoholic epoxy compound is introduced into the modifying group.
本発明において、前記ＣＯＯＨ変性ポリイミド樹脂は１ｍｇＫＯＨ／ｇ以上の酸価を有していることが好ましい。
本発明によれば、さらに、前記ＯＨ変性ポリイミド樹脂と前記式（１）で表されるポリイミド樹脂の繰り返し構造中に存在するヘテロ環の開環部位の窒素原子にアミド結合を介してカルボキシル基含有基が導入されたＣＯＯＨ変性ポリイミド樹脂と、ポリイソシアネート化合物とを含有する樹脂組成物が提供される。この樹脂組成物においては、前記ＯＨ変性ポリイミド樹脂１００重量部当たり、前記ＣＯＯＨ変性ポリイミド樹脂を１０乃至１０００重量部の量で含有するしていることが好ましい。
In the present invention, the COOH-modified polyimide resin preferably has an acid value of 1 mgKOH / g or more.
According to the present invention, the OH-modified polyimide resin and the polyimide resin represented by the formula (1) further contain a carboxyl group via an amide bond in the nitrogen atom of the heterocyclic ring-opening site. A resin composition containing a COOH-modified polyimide resin having a group introduced therein and a polyisocyanate compound is provided. In this resin composition, the COOH-modified polyimide resin is preferably contained in an amount of 10 to 1000 parts by weight per 100 parts by weight of the OH-modified polyimide resin.
本発明のＯＨ変性ポリイミド樹脂は、芳香族環を含有する繰り返し構造を有するポリイミド樹脂の少なくとも一部に、アミド結合を介して非ハロゲン系の水酸基含有変性基が導入されていることが顕著な特徴である。すなわち、このような水酸基含有変性基が導入されているため、優れた耐熱性、機械特性を損なうことなく、各種基材や金属に対する密着性が顕著に向上するのである。 The OH-modified polyimide resin of the present invention is characterized in that a non-halogen-based hydroxyl group-containing modifying group is introduced into at least a part of a polyimide resin having a repeating structure containing an aromatic ring via an amide bond. It is. That is, since such a hydroxyl group-containing modifying group is introduced, adhesion to various base materials and metals is remarkably improved without impairing excellent heat resistance and mechanical properties.
＜ＯＨ変性ポリイミド樹脂＞
本発明のＯＨ変性ポリイミド樹脂は、下記式（１）
The OH-modified polyimide resin of the present invention has the following formula (1)
上記式で表される芳香族含有繰り返し単位を有するポリイミド樹脂は、それ自体公知であり、本発明ではＧＰＣによる数平均分子量が１０００〜１００００００、特に、１００００〜５０００００、特に好ましくは５００００〜１５００００程度の範囲のポリイミド樹脂を使用することが好ましい。 The polyimide resin having an aromatic-containing repeating unit represented by the above formula is known per se, and in the present invention, the number average molecular weight by GPC is 1,000 to 1,000,000, particularly 10,000 to 500,000, particularly preferably about 50,000 to 150,000. It is preferred to use a range of polyimide resins.
また、上記式中Ａ、Ｂはそれぞれ任意の４価のアリール基、２価のアリール基を示しているが、下記群よりそれぞれ選ばれる構造であることが好ましく、式中Ａの４価のアリール基としては下記より選ばれる構造が好ましく、
さらに、耐熱性、耐摩耗性などの特性を十分に発揮するためには、特に、下記群よりそれぞれ選ばれる構造であることが特に好ましい。
式中Ａの４価のアリール基
A tetravalent aryl group of A in the formula
また、上記式（１）中の繰り返し数ｎは、３０以上であることが好ましく、５０以上であることがさらに好ましい。このような繰り返し数を有することで本発明のＯＨ変性密度を最適に制御することができる。 The number of repetitions n in the above formula (1) is preferably 30 or more, and more preferably 50 or more. By having such a repeating number, the OH modification density of the present invention can be optimally controlled.
このような式（１）で表されるポリイミド樹脂はそれ自体公知の方法で製造され、例えば、前記４価のアリール基に対応するテトラカルボン酸［Ａ（ＣＯＯＨ）４］又はその無水物と、前記２価のアリール基に対応するジアミン［Ｂ（ＮＨ２）２］とを反応することによって得られる。 Such a polyimide resin represented by the formula (1) is produced by a method known per se, for example, tetracarboxylic acid [A (COOH) 4] corresponding to the tetravalent aryl group or an anhydride thereof, It can be obtained by reacting diamine [B (NH2) 2] corresponding to the divalent aryl group.
また、本発明のＯＨ変性ポリイミド樹脂においては、水酸基含有変性基がアミド結合を介してポリイミド樹脂に結合している。
本発明に使用される上述した未変性ポリイミド樹脂は窒素含有ヘテロ環を有しており、変性基導入の際、前記ヘテロ環の一部が開環するため、ポリイミド樹脂の主鎖に−ＮＨ−基が存在することになる。さらには、ポリイミド樹脂合成時の前駆体であるポリアミック酸の閉環が１００％で行われず、一部のヘテロ環部分が開環状態で残存する場合があり、これによっても、ポリイミド樹脂の主鎖に−ＮＨ−基が生じる。本発明における、アミド結合による水酸基含有変性基のポリイミド樹脂への結合は未変性ポリイミド樹脂の繰り返し構造中に存在する前記−ＮＨ−基にカルボキシル基含有基がアミド結合を介して導入され、さらに、導入されたカルボキシル基に水酸基含有基が結合している。ここで、カルボキシル基と水酸基含有基との結合はエステル結合であることが好ましい。
In the OH-modified polyimide resin of the present invention, the hydroxyl group-containing modifying group is bonded to the polyimide resin via an amide bond.
The above-mentioned unmodified polyimide resin used in the present invention has a nitrogen-containing heterocycle, and when the modifying group is introduced, a part of the heterocycle is opened, so that —NH— is added to the main chain of the polyimide resin. The group will be present. Furthermore, ring closure of polyamic acid, which is a precursor at the time of polyimide resin synthesis, is not performed at 100%, and some heterocyclic parts may remain in a ring-opened state. A —NH— group is formed. In the present invention, the hydroxyl group-containing modified group is bonded to the polyimide resin by an amide bond, a carboxyl group-containing group is introduced through the amide bond to the -NH- group present in the repeating structure of the unmodified polyimide resin, A hydroxyl group-containing group is bonded to the introduced carboxyl group. Here, the bond between the carboxyl group and the hydroxyl group-containing group is preferably an ester bond.
上記、カルボキシル基含有基を導入する化合物（ＣＯＯＨ変性剤）としては、マレイン酸、フマル酸、コハク酸、アジピン酸、フタル酸、イソフタル酸、ヘキサヒドロフタル酸、テトラヒドロフタル酸、ダイマー酸、セバシン酸、アゼライン酸、５−Ｎａスルホイソフタル酸、イタコン酸、シトラコン酸、ノルボルネンジカルボン酸、ビシクロ［２，２，１］ヘプト−２−エン−５，６−ジカルボン酸、及びこれらの酸無水物などの多価カルボン酸化合物を例示することが出来、特にマレイン酸あるいは無水マレイン酸が反応性等の点で特に好適である。 As the compound (COOH modifier) for introducing a carboxyl group-containing group, maleic acid, fumaric acid, succinic acid, adipic acid, phthalic acid, isophthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, dimer acid, sebacic acid , Azelaic acid, 5-Na sulfoisophthalic acid, itaconic acid, citraconic acid, norbornene dicarboxylic acid, bicyclo [2,2,1] hept-2-ene-5,6-dicarboxylic acid, and acid anhydrides thereof A polyvalent carboxylic acid compound can be exemplified, and maleic acid or maleic anhydride is particularly preferred in terms of reactivity.
また、水酸基含有基を導入する化合物（ＯＨ変性剤）としては、非ハロゲン系の化合物が用いられる。ハロゲンを含有するＯＨ変性剤を用いると、ポリイミド樹脂にハロゲンが導入されてしまい、密着性が損なわれてしまうおそれがある。本発明で用いられるＯＨ変性剤としては、１級アルコール由来のＯＨ基を少なくとも２個有する非ハロゲン系多価アルコール、又は１級アルコール由来のＯＨ基と末端エポキシ基とを有する非ハロゲン系アルコール性エポキシ化合物が好ましく用いられる。 In addition, as the compound for introducing a hydroxyl group-containing group (OH modifier), a non-halogen compound is used. If an OH modifier containing halogen is used, halogen is introduced into the polyimide resin, which may impair adhesion. The OH modifier used in the present invention is a non-halogen polyhydric alcohol having at least two OH groups derived from primary alcohol, or a non-halogen alcohol having an OH group derived from primary alcohol and a terminal epoxy group. Epoxy compounds are preferably used.
なかでも、ＯＨ変性剤導入時にゲル化を起こしにくく、反応性が高く、反応速度が早い点で非ハロゲン系アルコール性エポキシ化合物がより好適に用いられる。なお、非ハロゲン系アルコール性エポキシ化合物において、１級アルコール由来のＯＨ基と末端エポキシ基とでは、末端エポキシ基の方がポリイミド樹脂との反応性が高く、末端エポキシ基部位でポリイミド樹脂と結合するため、ポリイミド樹脂にはフリーのＯＨ基が導入されることとなる。 Among these, non-halogen alcoholic epoxy compounds are more preferably used in that gelation is unlikely to occur when an OH modifier is introduced, reactivity is high, and reaction rate is high. In the non-halogen alcoholic epoxy compound, the primary epoxy-derived OH group and the terminal epoxy group are more reactive with the polyimide resin, and bind to the polyimide resin at the terminal epoxy group site. For this reason, free OH groups are introduced into the polyimide resin.
上記非ハロゲン系多価アルコール化合物の例としては、これに限定されるものではないが、エチレングリコール、プロピレングリコール、１，４−ブタンジオール、１，５−ペンタンジオール、１，６−ヘキサンジオール、１，８−オクタンジオール、３−エトキシ−１，２−ジヒドロキシプロパン、３−ｎ−オクトキシ−１，２−ジヒドロキシプロパン、３−ラウロキシ−１，２−ジヒドロキシプロパン、３−プロポキシ−１，２−ジヒドロキシプロパン、３−（２−ｎ−ブチル）エトキシ−１，２−ジヒドロキシプロパン、３−（３，３−ジメトキシブチル）オキシ−１，２−ジヒドロキシプロパン、３−（ｎ−ブチル）−１，２−ジヒドロキシプロパン、３−（ｎ−ヘキシル）−１，２−ジヒドロキシプロパン、１，４−ビス（１，２−ジヒドロキシプロピル）−ｎ−ブタンなどを例示することが出来る。 Examples of the non-halogen polyhydric alcohol compound include, but are not limited to, ethylene glycol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 3-ethoxy-1,2-dihydroxypropane, 3-n-octoxy-1,2-dihydroxypropane, 3-lauroxy-1,2-dihydroxypropane, 3-propoxy-1,2- Dihydroxypropane, 3- (2-n-butyl) ethoxy-1,2-dihydroxypropane, 3- (3,3-dimethoxybutyl) oxy-1,2-dihydroxypropane, 3- (n-butyl) -1, 2-dihydroxypropane, 3- (n-hexyl) -1,2-dihydroxypropane, 1,4-bis (1,2 Dihydroxypropyl)-n-butane or the like can be exemplified.
また、上記非ハロゲン系アルコール性エポキシ化合物としては、２，３−エポキシ−１−プロパノール、３，４−エポキシ−１−ブタノール、４，５−エポキシ−１−ペンタノール、５，６−エポキシ−１−ヘキサノールなどを例示することが出来る。 Examples of the non-halogen alcoholic epoxy compound include 2,3-epoxy-1-propanol, 3,4-epoxy-1-butanol, 4,5-epoxy-1-pentanol, and 5,6-epoxy- Examples thereof include 1-hexanol.
本発明のＯＨ変性ポリイミド樹脂は、水酸基価が１ｍｇＫＯＨ／ｇ以上であり、好ましくは１０〜１００ｍｇＫＯＨ／ｇの範囲にあり、特に密着性を要する場合には２０〜９０ｍｇＫＯＨ／ｇの範囲である。このような量で水酸基が導入されることにより、ポリイミド樹脂の超耐熱性を損なうことなく、金属や、各種基材に対する高い密着性を確保することが出来る。すなわち、水酸基価が上記範囲よりも少ないと密着性が損なわれ、また、水酸基価が上記範囲を超えて過度に高いと、ＯＨ変性の際にゲル化を伴うため、安定的に製造することが困難となり、塗膜形成時の作業性も悪くなる。 The hydroxyl group value of the OH-modified polyimide resin of the present invention is 1 mg KOH / g or more, preferably 10 to 100 mg KOH / g, and particularly 20 to 90 mg KOH / g when adhesion is required. By introducing hydroxyl groups in such an amount, high adhesion to metals and various substrates can be secured without impairing the super heat resistance of the polyimide resin. That is, if the hydroxyl value is less than the above range, the adhesiveness is impaired, and if the hydroxyl value is excessively high beyond the above range, gelation is accompanied during OH modification, so that it can be stably produced. It becomes difficult and workability at the time of forming a coating film also deteriorates.
＜ＯＨ変性ポリイミド樹脂の製造＞
本発明のＯＨ変性ポリイミド樹脂は、未変性のポリイミド樹脂をＣＯＯＨ変性及びＯＨ変性の２段で変性することにより得られる。
本発明で使用される未変性のポリイミド樹脂としては、上述したポリイミド樹脂が用いられる。
<Manufacture of OH-modified polyimide resin>
The OH-modified polyimide resin of the present invention can be obtained by modifying an unmodified polyimide resin in two stages of COOH modification and OH modification.
As the unmodified polyimide resin used in the present invention, the polyimide resin described above is used.
本発明においては、先ず、上述の未変性ポリイミド樹脂をＣＯＯＨ変性剤を用いてＣＯＯＨ変性させる。
このＣＯＯＨ変性は、未変性ポリイミド樹脂を溶媒に溶解させ、ポリイミド樹脂溶液を調製し、これにＣＯＯＨ変性剤を混合して反応させることにより行われる。この際の溶媒としては、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ，Ｎ−ジメチルホルムアミド、ジメチルスルホキシド、Ｎ−メチル−２−ピロリドンなどが使用できるが、特にＮ，Ｎ−ジメチルアセトアミドが好適である。
尚、ポリイミド樹脂は、上記のような溶媒に溶解させた溶液状の形態で市販されている。
In the present invention, first, the above-mentioned unmodified polyimide resin is COOH-modified using a COOH modifier.
This COOH modification is performed by dissolving an unmodified polyimide resin in a solvent to prepare a polyimide resin solution, and mixing and reacting with a COOH modifier. As the solvent in this case, N, N-dimethylacetamide, N, N-dimethylformamide, dimethylsulfoxide, N-methyl-2-pyrrolidone and the like can be used, and N, N-dimethylacetamide is particularly preferable.
The polyimide resin is commercially available in a solution form dissolved in the above solvent.
ＣＯＯＨ変性剤としては、上述したものを使用することが出来る。このようなＣＯＯＨ変性剤は、通常、原料ポリイミド樹脂１００重量部当たり０．５重量部以上、好ましくは３乃至１５重量部の量で使用し、得られるＣＯＯＨ変性ポリイミド樹脂の酸価が１ｍｇＫＯＨ／ｇ以上、特に１０乃至１００ｍｇＫＯＨ／ｇとなるようにするのがよい。すなわち、ＣＯＯＨ変性剤の使用量が少ないと得られるＣＯＯＨ変性ポリイミド樹脂の酸価が小さく、このため、所定のＯＨ基を導入することが困難になってしまう。また、必要以上に多量のＣＯＯＨ変性剤を使用し、得られるＣＯＯＨ変性ポリイミド樹脂の酸価が必要以上に大きくなってしまうと、後述するＯＨ変性工程で未反応物等の生成量が多くなり、密着性の低下やポリイミド樹脂が本来有している耐熱性、耐摩耗性などの特性を損なうおそれがある。
また、ＣＯＯＨ変性剤による反応は、通常、副反応等を抑制するため、窒素雰囲気等の不活性ガス雰囲気中で行うことが好ましく、また、５０乃至１５０℃程度の温度で、加熱還流下に行うことが好適である。
As the COOH modifier, those described above can be used. Such a COOH modifier is usually used in an amount of 0.5 parts by weight or more, preferably 3 to 15 parts by weight per 100 parts by weight of the raw material polyimide resin, and the resulting COOH-modified polyimide resin has an acid value of 1 mgKOH / g. As described above, it is particularly preferable to set the amount to 10 to 100 mgKOH / g. That is, when the amount of the COOH modifier used is small, the acid value of the obtained COOH-modified polyimide resin is small, which makes it difficult to introduce a predetermined OH group. In addition, when an unnecessarily large amount of COOH modifier is used, and the acid value of the resulting COOH-modified polyimide resin becomes unnecessarily large, the amount of unreacted substances generated in the OH modification step described later increases. There is a possibility that characteristics such as a decrease in adhesion and heat resistance and wear resistance inherent in the polyimide resin may be impaired.
In addition, the reaction with the COOH modifier is usually preferably performed in an inert gas atmosphere such as a nitrogen atmosphere in order to suppress side reactions and the like, and is performed at a temperature of about 50 to 150 ° C. under heating and reflux. Is preferred.
上記のようにして、適度な酸価を有するＣＯＯＨ変性ポリイミド樹脂が得られる。かかるＣＯＯＨ変性ポリイミド樹脂においては、反応中に未変性ポリイミド中のヘテロ環が開環することにより生じる−ＮＨ−基、及び／又は、未変性ポリイミド樹脂中に含まれるポリイミド前駆体であるポリアミック酸由来の−ＮＨ−基の窒素にＣＯＯＨ変性剤の少なくとも１つのカルボキシル基がアミド結合し、結合に関与しなかったＣＯＯＨ変性基がポリイミド樹脂に導入されている。 As described above, a COOH-modified polyimide resin having an appropriate acid value can be obtained. In such a COOH-modified polyimide resin, a —NH— group generated by the opening of a heterocycle in the unmodified polyimide during the reaction, and / or a polyamic acid that is a polyimide precursor contained in the unmodified polyimide resin. At least one carboxyl group of the COOH modifier is amide-bonded to the nitrogen of the —NH— group, and a COOH-modified group that has not participated in the bond is introduced into the polyimide resin.
本発明において、ＯＨ変性に用いる変性剤としては、１級アルコール由来のＯＨ基を少なくとも２個有する非ハロゲン系多価アルコール及び／又は１級アルコール由来のＯＨ基と末端エポキシ基とを有する非ハロゲン系アルコール性エポキシ化合物が使用される。
上記非ハロゲン系ＯＨ変性剤としては、上述したものを用いることが出来る。また、ＯＨ変性剤導入時にゲル化を起こしにくく、さらに反応性が高く、反応速度が速い点で非ハロゲン系アルコール性エポキシ化合物がより好適に用いられる。なお、非ハロゲン系アルコール性エポキシ化合物においては末端エポキシ基の方がポリイミド樹脂との反応に関与するため、ポリイミド樹脂にはフリーのＯＨ基が導入されることとなる。
In the present invention, the modifier used for OH modification is a non-halogen polyhydric alcohol having at least two primary alcohol-derived OH groups and / or a non-halogen having a primary alcohol-derived OH group and a terminal epoxy group. Alcoholic epoxy compounds are used.
As the non-halogen OH modifier, those described above can be used. In addition, non-halogen alcoholic epoxy compounds are more preferably used in that gelation is difficult to occur at the time of introduction of the OH modifier, the reactivity is high, and the reaction rate is high. In the non-halogen alcoholic epoxy compound, since the terminal epoxy group is involved in the reaction with the polyimide resin, a free OH group is introduced into the polyimide resin.
このようなＯＨ変性剤は、ＣＯＯＨ変性ポリイミド樹脂のＣＯＯＨ基に対して、０．１乃至１０当量、好ましくは０．５乃至５当量の範囲で好適に用いられる。得られるＯＨ変性ポリイミド樹脂の水酸基価が１ｍｇＫＯＨ／ｇ以上、好適には１０乃至１００ｍｇＫＯＨ／ｇ、さらに好適には２０乃至９０ｍｇＫＯＨ／ｇとなるようにするのがよい。このような量で水酸基が導入されることにより、ポリイミド樹脂本来の耐熱性、耐摩耗性などの特性を損なうことなく、金属や各種樹脂に対する高い密着性を確保することが出来る。
かかるＯＨ変性剤を用いての反応は、前述したＣＯＯＨ変性と同様、不活性雰囲気中５０乃至１５０℃の温度で加熱還流下に行うことが好ましい。
上記のような反応により、前述したＣＯＯＨ変性基中のカルボキシル基に１級アルコール由来のＯＨ基及び／又はエポキシ基が反応してエステル結合を形成することで、所定量の水酸基が導入され目的とするＯＨ変性ポリイミド樹脂が得られる。
Such an OH modifier is suitably used in the range of 0.1 to 10 equivalents, preferably 0.5 to 5 equivalents, relative to the COOH group of the COOH-modified polyimide resin. The resulting OH-modified polyimide resin should have a hydroxyl value of 1 mgKOH / g or more, preferably 10 to 100 mgKOH / g, more preferably 20 to 90 mgKOH / g. By introducing the hydroxyl group in such an amount, high adhesion to metals and various resins can be ensured without impairing the properties such as heat resistance and wear resistance inherent to the polyimide resin.
The reaction using such an OH modifier is preferably performed under heating and refluxing at a temperature of 50 to 150 ° C. in an inert atmosphere as in the case of the COOH modification described above.
By the reaction as described above, the OH group and / or epoxy group derived from the primary alcohol reacts with the carboxyl group in the COOH-modified group described above to form an ester bond, whereby a predetermined amount of hydroxyl group is introduced. OH-modified polyimide resin is obtained.
上述した本発明のＯＨ変性ポリイミド樹脂は、溶液状態で得られるため、通常、そのままの形態で使用され、例えば金属や各種樹脂からなる成形品の表面にコーティングし、加熱乾燥して硬化皮膜を形成することにより、超耐熱性保護皮膜として、例えば電線被覆など、各種の用途に適用される。 Since the above-described OH-modified polyimide resin of the present invention is obtained in a solution state, it is usually used as it is. For example, it is coated on the surface of a molded product made of metal or various resins, and dried by heating to form a cured film. By doing so, the super heat resistant protective film is applied to various uses such as a wire coating.
＜樹脂組成物＞
また、本発明のＯＨ変性ポリイミド樹脂は、ＣＯＯＨ変性ポリイミド樹脂及びポリイソシアネート化合物とを混合した樹脂組成物として、保護皮膜の形成等の用途に供することも出来る。すなわち、このＯＨ変性ポリイミド樹脂は、ＣＯＯＨ変性ポリイミド樹脂と相溶性が高く、ＣＯＯＨ変性ポリイミド樹脂のＣＯＯＨ基とＯＨ変性ポリイミド樹脂のＯＨ基とが塗膜形成中に反応して硬化するため、３次元的な架橋構造が導入され、耐熱性、機械的強度等がさらに向上する。また、ポリイソシアネート化合物はＯＨ変性ポリイミド樹脂とウレタン結合し、ポリイミド樹脂中にウレタン結合による架橋構造を導入し、部分ウレタン化ポリイミド樹脂を形成する。これによって、ポリイミド樹脂の耐熱性、機械的強度がさらに向上した、緻密で高硬度の皮膜を形成することができる。
<Resin composition>
The OH-modified polyimide resin of the present invention can also be used for applications such as the formation of a protective film as a resin composition obtained by mixing a COOH-modified polyimide resin and a polyisocyanate compound. That is, since this OH-modified polyimide resin is highly compatible with the COOH-modified polyimide resin, the COOH group of the COOH-modified polyimide resin and the OH group of the OH-modified polyimide resin react and cure during the formation of the coating film. Thus, a cross-linked structure is introduced to further improve heat resistance, mechanical strength, and the like. In addition, the polyisocyanate compound is urethane-bonded to the OH-modified polyimide resin, and a crosslinked structure by urethane bond is introduced into the polyimide resin to form a partially urethanized polyimide resin. This makes it possible to form a dense and high hardness film in which the heat resistance and mechanical strength of the polyimide resin are further improved.
かかる樹脂組成物において、用いるＣＯＯＨ変性ポリイミド樹脂としては、前述した範囲の酸価を有するものが、ＯＨ変性ポリイミド樹脂との相溶性の観点から特に好適であり、通常、ＯＨ変性ポリイミド樹脂１００重量部当たり、１０乃至１０００重量部、特に３０乃至３００重量部の量で使用するのがよい。すなわち、必要以上に多量のＣＯＯＨ変性ポリイミド樹脂を用いるとＯＨ変性ポリイミド樹脂による密着性が損なわれるおそれがあり、またＣＯＯＨ変性ポリイミド樹脂の使用量があまり少ないと架橋構造の形成による耐熱性、機械的強度の向上などのメリットが希薄なものとなるからである。 In such a resin composition, as the COOH-modified polyimide resin to be used, one having an acid value in the above-mentioned range is particularly suitable from the viewpoint of compatibility with the OH-modified polyimide resin, and usually 100 parts by weight of the OH-modified polyimide resin. It may be used in an amount of 10 to 1000 parts by weight, particularly 30 to 300 parts by weight. That is, if a larger amount of COOH-modified polyimide resin is used than necessary, the adhesion by the OH-modified polyimide resin may be impaired, and if the amount of COOH-modified polyimide resin used is too small, the heat resistance and mechanical properties due to the formation of a crosslinked structure This is because merits such as improvement in strength are diminished.
また、ポリイソシアネート化合物としては、これに限定されるものではないが、トリレンジイソシアネート、キシリレンジイソシアネート、４，４‘−ジフェニルメタンジイソシアネート、１，５−ナフタレンジイソシアネート、３，３’−ジメチル−４，４‘−ジフェニルメタンジイソシアネート等の芳香族系ジイソシアネートや、１，６−ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、４，４’−ジシクロヘキシルメタンジイソシアネート、１，３−ビス（イソシアネートメチル）シクロヘキサン、トリメチルヘキサメチレンジイソシアネート等の脂肪族系ジイソシアネート、及びそれらのトリメチロールプロパン等のアルコール付加体を例示することができる。特にＯＨ変性ポリイミド樹脂との相溶性や耐熱性の観点からは、芳香族系ジイソシアネートが好適である。 Moreover, as a polyisocyanate compound, although not limited to this, tolylene diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, 3,3'-dimethyl-4, Aromatic diisocyanates such as 4′-diphenylmethane diisocyanate, 1,6-hexamethylene diisocyanate, isophorone diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, 1,3-bis (isocyanatemethyl) cyclohexane, trimethylhexamethylene diisocyanate, etc. Examples thereof include aliphatic diisocyanates and alcohol adducts thereof such as trimethylolpropane. In particular, aromatic diisocyanates are suitable from the viewpoint of compatibility with OH-modified polyimide resins and heat resistance.
このようなポリイソシアネート化合物は、通常、ＯＨ変性ポリイミド樹脂１００重量部当たり０．１乃至２０重量部、特に１乃至１０重量部の量で使用するのがよい。即ち、必要以上に多量のポリイソシアネート化合物を用いても技術的メリットはなく、むしろ経済的に不利となり、また、あまり少量の場合には硬化が不十分で架橋による塗膜性能の向上が見込めないおそれがある。上記のＣＯＯＨ変性ポリイミド樹脂及びポリイソシアネート化合物をＯＨ変性ポリイミド樹脂とを混合するには、前述したポリイミド樹脂用の溶媒を用いて行うのがよい。 Such a polyisocyanate compound is usually used in an amount of 0.1 to 20 parts by weight, particularly 1 to 10 parts by weight, per 100 parts by weight of the OH-modified polyimide resin. In other words, using a polyisocyanate compound in an amount larger than necessary has no technical merit, but rather disadvantageous economically, and if it is too small, curing is insufficient and improvement in coating film performance due to crosslinking cannot be expected. There is a fear. In order to mix the COOH-modified polyimide resin and the polyisocyanate compound with the OH-modified polyimide resin, the above-described solvent for the polyimide resin is preferably used.
また、かかる樹脂組成物にはＯＨ変性ポリイミド樹脂の特性を損なわない範囲の量で、それ自体公知の各種添加剤、例えば染料、顔料等の着色剤、帯電防止剤、充填材、可塑剤、分散剤などを適宜配合することができる。 In addition, the resin composition has an amount within a range that does not impair the properties of the OH-modified polyimide resin. An agent or the like can be appropriately blended.
以下の実施例及び比較例において用いた原料ポリイミド樹脂、ＯＨ変性剤の種類及び資料の評価は、以下の通りである。
原料ポリイミド：３，５−ジアミノ安息香酸を溶解したＮ−メチル−２−ピロリドン溶液に、１：１当量となるようにビシクロ(２，２，２)オクト−７−エンー２，３，５，６−テトラカルボン酸二無水物を添加、反応させポリアミック酸を生成し、生成したポリアミック酸を分離、精製した後、Ｎ−メチル−２−ピロリドンに溶解させ、γ−カプロラクトン、ピリジンを加えて加熱して脱水閉環することで得られる数平均分子量１０万のポリイミド樹脂溶液（１０％Ｎ−メチル−２−ピロリドン溶液）
The raw material polyimide resin used in the following Examples and Comparative Examples, types of OH modifiers, and evaluation of materials are as follows.
Raw material polyimide: Bicyclo (2,2,2) oct-7-ene-2,3,5 in an N-methyl-2-pyrrolidone solution in which 3,5-diaminobenzoic acid is dissolved so as to have 1: 1 equivalent. 6-tetracarboxylic dianhydride is added and reacted to produce a polyamic acid. The produced polyamic acid is separated and purified, then dissolved in N-methyl-2-pyrrolidone, heated with γ-caprolactone and pyridine. Polyimide resin solution (10% N-methyl-2-pyrrolidone solution) having a number average molecular weight of 100,000 obtained by dehydration and ring closure
ＯＨ変性剤：
（ａ）１，４−ブタンジオール
（ｂ）エチレングリコール
（ｃ）２，３−エポキシ−１−プロパノール
（ｄ）２，２，３，３−テトラフルオロ−１，４−ブタンジオール
OH modifier:
(A) 1,4-butanediol (b) ethylene glycol (c) 2,3-epoxy-1-propanol (d) 2,2,3,3-tetrafluoro-1,4-butanediol
密着性：
碁盤目試験法（ＪＩＳ Ｋ５４００）により評価した。
即ち、アルミニウム板上に乾燥後の塗膜の厚さが１０μｍとなるように試料を塗布し、１５０℃１０分の乾燥を行った後、２００℃１時間の熱処理を行って塗膜を形成した。塗膜に幅１ｍｍの傷を碁盤目状（１００マス）に作り、次いで、この塗膜にセロハンテープを貼着し、密着させたのちセロハンテープを剥がし、剥がれなかった碁盤目の個数により、次の基準で密着性を評価した。
◎：１００／１００
○：９０〜９９／１００
△：８０〜８９／１００
×：０〜７９／１００
Adhesion:
It was evaluated by a cross cut test method (JIS K5400).
That is, a sample was applied on an aluminum plate so that the thickness of the coating film after drying was 10 μm, dried at 150 ° C. for 10 minutes, and then heat-treated at 200 ° C. for 1 hour to form a coating film. . Make a scratch with a width of 1 mm on the coating film in a grid pattern (100 squares), and then apply cellophane tape to this coating film. After attaching it, peel off the cellophane tape, and then remove the cellophane tape. Adhesion was evaluated according to the criteria.
A: 100/100
○: 90 to 99/100
Δ: 80-89 / 100
X: 0 to 79/100
耐熱性：
アルミニウム板上に乾燥後の塗膜の厚さが１０μｍとなるように試料を塗布し、１５０℃１０分の乾燥を行った後、２００℃１時間の熱処理を行って塗膜を形成した。形成した塗膜を５００℃で１時間加熱し、加熱前後の塗膜の重量変化により、耐熱性を評価した。
○：重量変化が１０％以内
×：重量変化が１０％より大
Heat-resistant:
A sample was applied on an aluminum plate so that the thickness of the coating film after drying was 10 μm, dried at 150 ° C. for 10 minutes, and then heat-treated at 200 ° C. for 1 hour to form a coating film. The formed coating film was heated at 500 ° C. for 1 hour, and the heat resistance was evaluated by the weight change of the coating film before and after heating.
○: Change in weight is within 10% ×: Change in weight is greater than 10%
（製造例１）ＣＯＯＨ変性ポリイミド樹脂
撹拌装置、窒素ガス道入管、温度計および環流冷却管を備えたフラスコに、前記ポリイミド樹脂溶液１０００重量部（ポリイミド樹脂１００重量部）、無水マレイン酸（ＣＯＯＨ変性剤）５重量部を仕込み、撹拌しながらフラスコ内の内容物を９５℃まで昇温し、そのまま９５℃に維持しながら反応させた。反応後、室温まで冷却し、ＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）を得た。
得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）は、数平均分子量１０万で、酸価が５８ｍｇＫＯＨ／ｇであった。
(Production Example 1) In a flask equipped with a COOH-modified polyimide resin stirring device, a nitrogen gas inlet pipe, a thermometer, and a reflux condenser, 1000 parts by weight of the polyimide resin solution (100 parts by weight of polyimide resin), maleic anhydride (COOH-modified) Agent) 5 parts by weight were charged, and the contents in the flask were heated to 95 ° C. while stirring and reacted while maintaining the temperature at 95 ° C. as it was. After the reaction, it was cooled to room temperature to obtain a COOH-modified polyimide resin (P-1).
The obtained COOH-modified polyimide resin (P-1) had a number average molecular weight of 100,000 and an acid value of 58 mgKOH / g.
（製造例２）ＣＯＯＨ変性ポリイミド樹脂
無水マレイン酸の量を０．１重量部に代えた以外は製造例１と同様にしてＣＯＯＨ変性ポリイミド樹脂（Ｐ−２）を得た。
得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−２）は数平均分子量が１０万で酸価が３ｍｇＫＯＨ／ｇであった。
(Production Example 2) COOH-modified polyimide resin A COOH-modified polyimide resin (P-2) was obtained in the same manner as in Production Example 1 except that the amount of maleic anhydride was changed to 0.1 parts by weight.
The obtained COOH-modified polyimide resin (P-2) had a number average molecular weight of 100,000 and an acid value of 3 mgKOH / g.
（実施例１）
上記製造例１で得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）が入れられたフラスコに、
ＯＨ変性剤（ａ）［１，４−ブタンジオール］ ５重量部
を入れ、フラスコ内に窒素ガスを導入しながら３０分撹拌して窒素置換を行った。
次いで、フラスコ内の内容物を９５℃まで昇温し、そのまま９５℃に維持しながら３時間反応させた。反応後、室温まで冷却し、ＯＨ変性ポリイミド樹脂（Ｑ−１）の溶液を得た。
得られたＯＨ変性ポリイミド樹脂の水酸基価は５０ｍｇＫＯＨ／ｇであった。
また、このＯＨ変性ポリイミド樹脂（Ｑ−１）の溶液を用いて、前述した方法にしたがって密着性及び耐熱性の評価を行い、その結果を表１に示した。
Example 1
In a flask containing the COOH-modified polyimide resin (P-1) obtained in Production Example 1,
5 parts by weight of OH modifier (a) [1,4-butanediol] was added, and nitrogen substitution was performed by stirring for 30 minutes while introducing nitrogen gas into the flask.
Next, the contents in the flask were heated to 95 ° C. and reacted for 3 hours while maintaining the temperature at 95 ° C. as it was. After the reaction, it was cooled to room temperature to obtain a solution of OH-modified polyimide resin (Q-1).
The obtained OH-modified polyimide resin had a hydroxyl value of 50 mgKOH / g.
Further, using this OH-modified polyimide resin (Q-1) solution, the adhesion and heat resistance were evaluated according to the methods described above, and the results are shown in Table 1.
（実施例２）
ＯＨ変性剤（ａ）の代わりにＯＨ変性剤（ｂ）［エチレングリコール］を用いた以外は、実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−２）の溶液を得た。
得られたＯＨ変性ポリイミド樹脂（Ｑ−２）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Example 2)
A solution of the OH-modified polyimide resin (Q-2) was obtained in the same manner as in Example 1 except that the OH modifier (b) [ethylene glycol] was used instead of the OH modifier (a).
For the obtained OH-modified polyimide resin (Q-2), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（実施例３）
ＯＨ変性剤（ａ）の代わりにＯＨ変性剤（ｃ）［２，３−エポキシ−１−プロパノール］を用いた以外は、実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−３）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−３）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Example 3)
A solution of the OH-modified polyimide resin (Q-3) in the same manner as in Example 1 except that the OH modifier (c) [2,3-epoxy-1-propanol] was used instead of the OH modifier (a). Got.
For the obtained OH-modified resin (Q-3), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例１）
ＯＨ変性剤（ａ）の使用量を０．１重量部に代えた以外は実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−４）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−４）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Comparative Example 1)
A solution of OH-modified polyimide resin (Q-4) was obtained in the same manner as in Example 1 except that the amount of OH-modifying agent (a) used was changed to 0.1 parts by weight.
For the obtained OH-modified resin (Q-4), the hydroxyl value, adhesion and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例２）
ＯＨ変性剤（ｃ）の使用量を０．１重量部に変更した以外は実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−５）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−５）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Comparative Example 2)
An OH-modified polyimide resin (Q-5) solution was obtained in the same manner as in Example 1 except that the amount of the OH-modifying agent (c) was changed to 0.1 parts by weight.
For the obtained OH-modified resin (Q-5), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例３）
製造例１で得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）の代わりに製造例２で得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−２）を用いた以外は、実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−６）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−６）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Comparative Example 3)
OH-modified in the same manner as in Example 1 except that the COOH-modified polyimide resin (P-2) obtained in Production Example 2 was used instead of the COOH-modified polyimide resin (P-1) obtained in Production Example 1. A solution of polyimide resin (Q-6) was obtained.
For the obtained OH-modified resin (Q-6), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例４）
製造例１で得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）の代わりに製造例２で得られたＣＯＯＨ変性ポリイミド樹脂（Ｐ−２）を用いた以外は実施例３と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−７）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−７）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Comparative Example 4)
OH-modified polyimide in the same manner as in Example 3 except that the COOH-modified polyimide resin (P-2) obtained in Production Example 2 was used instead of the COOH-modified polyimide resin (P-1) obtained in Production Example 1. A solution of Resin (Q-7) was obtained.
For the obtained OH-modified resin (Q-7), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例５）
ＯＨ変性剤（ａ）の代わりにＯＨ変性剤（ｄ）［２，２，３，３−テトラフルオロ−１，４−ブタンジオール］を用いた以外は、実施例１と同様にしてＯＨ変性ポリイミド樹脂（Ｑ−８）の溶液を得た。
得られたＯＨ変性樹脂（Ｑ−８）について、実施例１と同様にして水酸基価、密着性及び耐熱性を測定し、その結果を表１に示した。
(Comparative Example 5)
OH-modified polyimide in the same manner as in Example 1 except that the OH modifier (d) [2,2,3,3-tetrafluoro-1,4-butanediol] was used instead of the OH modifier (a). A solution of Resin (Q-8) was obtained.
For the obtained OH-modified resin (Q-8), the hydroxyl value, adhesion, and heat resistance were measured in the same manner as in Example 1, and the results are shown in Table 1.
（比較例６）
原料として用いた未変性のポリイミド樹脂の溶液を用いて実施例１と同様に密着性及び耐熱性を評価し、その結果を表１に示した。
(Comparative Example 6)
The adhesion and heat resistance were evaluated in the same manner as in Example 1 using the unmodified polyimide resin solution used as a raw material, and the results are shown in Table 1.
（応用例１）
実施例１で得られたＯＨ変性ポリイミド樹脂（Ｑ−１）の溶液に、ＯＨ変性ポリイミド樹脂１００重量部当たり、５重量部の量でポリイソシアネート化合物（トリレンジイソシアネート）を混合して樹脂組成物を調製した。この樹脂組成物について、実施例１と同様に密着性及び耐熱性を評価し、その結果を表２に示した。
(Application 1)
Polyisocyanate compound (tolylene diisocyanate) is mixed with the solution of OH-modified polyimide resin (Q-1) obtained in Example 1 in an amount of 5 parts by weight per 100 parts by weight of OH-modified polyimide resin. Was prepared. About this resin composition, adhesiveness and heat resistance were evaluated similarly to Example 1, and the result was shown in Table 2.
（応用例２）
実施例３で得られたＯＨ変性ポリイミド樹脂（Ｑ−３）の溶液を用いた以外は、応用例１と同様にして樹脂組成物を調製し、その評価を行った。結果を表２に示す。
(Application example 2)
A resin composition was prepared and evaluated in the same manner as in Application Example 1 except that the OH-modified polyimide resin (Q-3) solution obtained in Example 3 was used. The results are shown in Table 2.
（応用例３）
実施例１で得られたＯＨ変性ポリイミド樹脂（Ｑ−１）の溶液に、ＯＨ変性ポリイミド樹脂１００重量部当たり、１００重量部の量で製造例１で調製されたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）を混合して樹脂組成物を調製した。この樹脂組成物について応用例１と同様に密着性及び耐熱性を評価し、その結果を表２に示した。
(Application 3)
The COOH-modified polyimide resin (P-1) prepared in Production Example 1 was added to the solution of the OH-modified polyimide resin (Q-1) obtained in Example 1 in an amount of 100 parts by weight per 100 parts by weight of the OH-modified polyimide resin. ) Were mixed to prepare a resin composition. The adhesiveness and heat resistance of this resin composition were evaluated in the same manner as in Application Example 1, and the results are shown in Table 2.
（応用例４）
実施例３で得られたＯＨ変性ポリイミド樹脂（Ｑ−３）の溶液を用いた以外は、応用例３と同様にして樹脂組成物を調製し、その評価を行った。結果を表２に示す。
(Application 4)
A resin composition was prepared and evaluated in the same manner as in Application Example 3 except that the OH-modified polyimide resin (Q-3) solution obtained in Example 3 was used. The results are shown in Table 2.
（応用例５）
応用例３で調製された樹脂組成物に、さらに、ＯＨ変性ポリイミド樹脂（Ｑ−１）１００重量部当たり、５重量部の量でポリイソシアネート化合物（トリレンジイソシアネート）を混合して樹脂組成物を調製した。この樹脂組成物について密着性及び耐熱性を評価し、その結果を表２に示した。
(Application example 5)
The resin composition prepared in Application Example 3 is further mixed with a polyisocyanate compound (tolylene diisocyanate) in an amount of 5 parts by weight per 100 parts by weight of the OH-modified polyimide resin (Q-1). Prepared. The resin composition was evaluated for adhesion and heat resistance, and the results are shown in Table 2.
（応用例６）
応用例４で調製された樹脂組成物に、さらに、ＯＨ変性ポリイミド樹脂（Ｑ−３）１００重量部当たり、５重量部の量でポリイソシアネート化合物（トリレンジイソシアネート）を混合して樹脂組成物を調製した。この樹脂組成物について密着性及び耐熱性を評価し、その結果を表２に示した。
(Application example 6)
The resin composition prepared in Application Example 4 is further mixed with a polyisocyanate compound (tolylene diisocyanate) in an amount of 5 parts by weight per 100 parts by weight of the OH-modified polyimide resin (Q-3) to obtain a resin composition. Prepared. The resin composition was evaluated for adhesion and heat resistance, and the results are shown in Table 2.
（応用例７）
比較例１で調製されたＯＨ変性ポリイミド樹脂（Ｑ−４）の溶液を用いた以外は、応用例１と同様にして樹脂組成物を調製し、密着性及び耐熱性の評価を行った。結果を表２に示す。
(Application example 7)
Except having used the solution of OH modified polyimide resin (Q-4) prepared by the comparative example 1, the resin composition was prepared like the application example 1, and adhesiveness and heat resistance were evaluated. The results are shown in Table 2.
（応用例８）
比較例１で調製されたＯＨ変性ポリイミド樹脂（Ｑ−４）の溶液を用いた以外は、応用例３と同様にして樹脂組成物を調製し、密着性及び耐熱性の評価を行った。その結果を表２に示す。
(Application 8)
A resin composition was prepared in the same manner as in Application Example 3 except that the OH-modified polyimide resin (Q-4) solution prepared in Comparative Example 1 was used, and the adhesion and heat resistance were evaluated. The results are shown in Table 2.
（応用例９）
比較例１で調製されたＯＨ変性ポリイミド樹脂（Ｑ−４）の溶液を用いた以外は、応用例５と同様にして樹脂組成物を調製し、密着性及び耐熱性の評価を行った。その結果を表２に示す。
(Application example 9)
A resin composition was prepared in the same manner as in Application Example 5 except that the solution of the OH-modified polyimide resin (Q-4) prepared in Comparative Example 1 was used, and the adhesion and heat resistance were evaluated. The results are shown in Table 2.
（応用例１０）
ＯＨ変性ポリイミド樹脂を全く使用せず、製造例１で調製されたＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）の溶液と、該ＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）１００重量部当たり５重量部のポリイソシアネート化合物（トリレンジイソシアネート）を混合して樹脂組成物を調製した。この樹脂組成物について密着性及び耐熱性を評価した。その結果を表２に示す。
(Application example 10)
Without using any OH-modified polyimide resin, 5 parts by weight of polyisocyanate per 100 parts by weight of the COOH-modified polyimide resin (P-1) prepared in Production Example 1 and the COOH-modified polyimide resin (P-1) A compound (tolylene diisocyanate) was mixed to prepare a resin composition. The resin composition was evaluated for adhesion and heat resistance. The results are shown in Table 2.
（応用例１１）
ＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）の量を２５００重量部とした以外は、応用例３と同様にして樹脂組成物を調製し、密着性及び耐熱性を評価し、その結果を表２に示す。
(Application Example 11)
A resin composition was prepared in the same manner as in Application Example 3 except that the amount of the COOH-modified polyimide resin (P-1) was 2500 parts by weight, the adhesion and heat resistance were evaluated, and the results are shown in Table 2. .
（応用例１２）
ＣＯＯＨ変性ポリイミド樹脂（Ｐ−１）の量を５０００重量部とした以外は、応用例３と同様にして樹脂組成物を調製し、密着性及び耐熱性を評価した。その結果を表２に示す。
(Application 12)
A resin composition was prepared in the same manner as in Application Example 3 except that the amount of the COOH-modified polyimide resin (P-1) was 5000 parts by weight, and adhesion and heat resistance were evaluated. The results are shown in Table 2.
Claims (7)
次いで、１級アルコール由来のＯＨ基を少なくとも２個有する非ハロゲン系多価アルコール化合物又は１級アルコール由来のＯＨ基と末端エポキシ基とを有する非ハロゲン系アルコール性エポキシ化合物を変性剤として使用し、該変性剤を前記ＣＯＯＨ変性ポリイミド樹脂と混合して加熱することにより、該変性剤を該ＣＯＯＨ変性ポリイミド樹脂に導入されている変性基中のカルボキシル基と反応させて、前記多価アルコールまたはアルコール性エポキシ化合物に由来するＯＨ含有基を前記変性基に導入することを特徴とするＯＨ変性ポリイミド樹脂の製造方法。
Next, a non-halogen polyhydric alcohol compound having at least two OH groups derived from a primary alcohol or a non-halogen alcohol-based epoxy compound having an OH group and a terminal epoxy group derived from a primary alcohol is used as a modifier. By mixing and heating the modifier with the COOH-modified polyimide resin, the modifier is reacted with a carboxyl group in the modified group introduced into the COOH-modified polyimide resin, and the polyhydric alcohol or alcoholic A method for producing an OH-modified polyimide resin, wherein an OH-containing group derived from an epoxy compound is introduced into the modifying group.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014500412A (en) * | 2010-12-09 | 2014-01-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Polyimide nanoweb with amidated surface and method for making |
| WO2019102994A1 (en) * | 2017-11-21 | 2019-05-31 | 三菱マテリアル株式会社 | Resin for forming insulating coating film, varnish, electrodeposition liquid, and method for producing insulated conductor |
| TWI833720B (en) | 2017-11-21 | 2024-03-01 | 日商三菱綜合材料股份有限公司 | Resin for forming insulating film, varnish, electrodeposition dispersion, and method for producing insulated conductor |
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|---|---|---|---|---|
| JPH03167225A (en) * | 1989-11-28 | 1991-07-19 | Tomoegawa Paper Co Ltd | Polyamideimide block copolymer |
| JP2002088154A (en) * | 2000-09-14 | 2002-03-27 | Toyobo Co Ltd | Alkaline-soluble polyamideimide copolymer |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167225A (en) * | 1989-11-28 | 1991-07-19 | Tomoegawa Paper Co Ltd | Polyamideimide block copolymer |
| JP2002088154A (en) * | 2000-09-14 | 2002-03-27 | Toyobo Co Ltd | Alkaline-soluble polyamideimide copolymer |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014500412A (en) * | 2010-12-09 | 2014-01-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Polyimide nanoweb with amidated surface and method for making |
| WO2019102994A1 (en) * | 2017-11-21 | 2019-05-31 | 三菱マテリアル株式会社 | Resin for forming insulating coating film, varnish, electrodeposition liquid, and method for producing insulated conductor |
| CN111247219A (en) * | 2017-11-21 | 2020-06-05 | 三菱综合材料株式会社 | Resin for forming insulating coating, varnish, electrodeposition liquid, and method for producing insulated conductor |
| KR20200080249A (en) * | 2017-11-21 | 2020-07-06 | 미쓰비시 마테리알 가부시키가이샤 | Method for producing resin for coating, varnish, electrodeposition solution, and insulating conductor |
| CN113372810A (en) * | 2017-11-21 | 2021-09-10 | 三菱综合材料株式会社 | Resin for forming insulating coating film, varnish, electrodeposition liquid, and method for producing insulated conductor |
| KR102619226B1 (en) * | 2017-11-21 | 2023-12-28 | 미쓰비시 마테리알 가부시키가이샤 | Manufacturing method of resin for forming insulating film, varnish, electrodeposition solution, and insulating conductor |
| TWI833720B (en) | 2017-11-21 | 2024-03-01 | 日商三菱綜合材料股份有限公司 | Resin for forming insulating film, varnish, electrodeposition dispersion, and method for producing insulated conductor |
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