JP2007214044A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket allowing to test a large number of IC devices at a time and having a ZIF mechanism to correspond to automatization easily. <P>SOLUTION: A cover member 4 is moved to a second position by pushing it downward against biasing force of a coil spring 6. An abut part 43 abuts against a projection part 52 of a contact 5, and the projection 52 rotates counterclockwise around a press fit part 53 as a fulcrum. Rotating the projection part 52 makes a contact part 51 having the projection part 52 on its end rotate counterclockwise. A receiving opening 42 of the cover member 4 is made so that at least a terminal 711 of each IC device 71 can be inserted into it without substantial resistance. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a socket for electrical connection of a semiconductor integrated circuit (hereinafter abbreviated as IC) device, and more particularly to an IC socket used for testing an IC device.

  When performing a so-called burn-in test for evaluating the electrical characteristics, durability, heat resistance, and the like of an IC device, for example, an IC socket 100 as shown in FIG. 9 is used. The IC socket 100 includes a receiving hole 102 through which the terminal 202 of the IC device 200 can be inserted, an internal contact 104 (see FIG. 10) that is somewhat elastically deformable and configured to be in sliding contact with each of the terminals 202, and an inspection. And a sleeve 106 that can be connected to a substrate (not shown) of the apparatus and the like, and the IC device 200 can be repeatedly inserted and removed.

  Patent Document 1 discloses a terminal-implanted socket mainly intended to eliminate contact failure with a sleeve-shaped terminal.

JP 58-26477 A

  In the conventional IC socket shown in FIG. 9 and FIG. 10, the pins of the IC device and the internal contacts of the IC socket are in sliding contact with each other. Further, such an IC socket does not have a mechanism (so-called ZIF (Zero Insertion Force) mechanism) that makes the insertion resistance (operation force) substantially zero when the IC device is inserted, and therefore has a large number of terminals of the IC device. In this case, the operation force is increased and the operability is lowered. Further, with the IC socket as shown in FIGS. 9 and 10, only one IC device can be inspected, which is an obstacle to improving the mass productivity.

  Further, in the structure described in Patent Document 1, the four elastic contact pieces of the sleeve terminal are in contact with the four corners of the lead having a rectangular cross section of the implantation socket so that the elastic contact pieces of the sleeve terminal gradually increase. However, it will wear out and is not suitable as a socket for inspection.

  Accordingly, an object of the present invention is to provide an IC socket that can inspect a large number of IC devices at a time and can easily cope with the automation of the inspection itself by including a ZIF mechanism.

  In order to achieve the above object, an invention according to claim 1 is an IC socket which can be electrically connected to a plurality of IC devices, and is electrically connected to each of terminals of the plurality of IC devices. A contact member having an elastically displaceable contact portion, a base member to which the contact member is fixed, and a plurality of receiving holes capable of receiving terminals of the plurality of IC devices. A cover member engageable with an upper portion of the base member, and the cover member is configured to be movable in a substantially vertical direction between a first position and a second position with respect to the base member. And a contact portion that abuts against the contact and elastically displaces the contact when in the second position, whereby the contact portion of the contact is When in the first position, the cover member is received. Hole was closed, when the cover member is in the second position to open the receiving hole, to provide an IC socket.

  According to a second aspect of the present invention, in the IC socket according to the first aspect, each of the plurality of contacts is connected to the contact portion and the contact of the cover member in the second position. Provided is an IC socket that integrally has a protrusion abutting on a contact part, and the displacement of the contact part is caused by the displacement of the protrusion abutted on the contact part of the cover member.

  According to a third aspect of the present invention, in the IC socket according to the second aspect, each of the plurality of contacts has a press-fit portion that can be press-fitted into a through hole provided in the cover member, and the contact portion Provides an IC socket that is displaced by a pivoting operation with the press-fit portion as a fulcrum.

  The invention according to claim 4 is the IC socket according to any one of claims 1 to 3, further comprising a biasing member that biases the cover member toward the first position. I will provide a.

  The invention described in claim 5 provides the IC socket according to claim 4, wherein the biasing member is a coil spring disposed between the base member and the cover member.

  According to a sixth aspect of the present invention, in the IC socket according to any one of the first to fifth aspects, the plurality of IC devices are multiple IC devices connected to a carrier, and the reception of the cover member The hole provides an IC socket provided corresponding to the position of each terminal of the IC device connected to the carrier.

  According to the IC socket of the present invention, a large number of IC devices can be inspected at a time, and the operation force when inserting the IC device can be extremely reduced by providing the ZIF mechanism. In addition, the ZIF mechanism of the present invention comprises an abutting portion provided integrally with the cover member and a protrusion provided integrally with the contact member, and does not require any other special device or means. This structure is simple and advantageous in terms of manufacturing cost.

Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram showing a preferred embodiment of an IC socket according to the present invention. The IC socket 1 includes a base member 3 disposed on the inspection device 2 schematically illustrated, and a cover member 4 that engages with an upper portion of the base member 3. Each of the base member 3 and the cover member 4 is preferably an integrally molded resin molded product. The cover member 4 has a notch 41 that engages with the engagement groove 31 of the base member 3, and is thereby movable in a vertical direction with respect to the base member 3 over a predetermined length. Further, the cover member 4 has a receiving hole 42 that can receive a contact 5 that is electrically connected to a terminal of an IC device (described later), and the contact 5 passes through an insertion hole 32 formed in the base member 3. Then, it protrudes from below the base member 3 and is electrically connected to the inspection device 2. Further, a coil spring 6 that urges the cover member 4 upward is disposed between the base member 3 and the cover member 4, but other urging means such as a leaf spring may of course be used. Thereby, when the force is not applied from the outside, the cover member 4 is located in the 1st position (after-mentioned). The cover member 4 may have an integrally formed block or reinforcing member 43 for securing its own rigidity in place.

  FIG. 2 is a diagram showing details of the contact 5. The contact 5 is preferably an integral part made of a thin plate made of a conductive metal such as a copper alloy, which is a spring material. The contact 5 has one end in contact with the terminal of the IC device during use, and the contact 51 A protrusion 52 formed by bending or the like in the vicinity of the other end, a press-fit portion 53 that can be press-fitted into the insertion hole 32 of the base member 3, and a tail portion 54 that protrudes from below the base member 3 and is electrically connected to the inspection device. And have. The contact 5 is fixed to the base member 3 by the press-fit portion 53, and in this state, the portion above the press-fit portion 53 (that is, the portion including the contact portion 51 and the protrusion 52) serves as the fulcrum of the press-fit portion 53. Can be elastically rotated in the direction indicated by the arrow.

  Next, with reference to FIGS. 3 to 8, mounting of the IC device to the IC socket according to the present invention will be described. First, FIG. 3 shows the IC socket 1 before the IC device is mounted. Each IC device may be inserted into the receiving hole 42 of the cover member 4 one by one. However, as shown in FIG. 3, at least one terminal 711 of each IC device 71 is connected to a conductive carrier 72. It is advantageous that the IC socket 1 is mounted as the continuous IC device 7. According to such a configuration, a large number of IC devices can be inspected by a single mounting operation.

  In the state shown in FIG. 3, the cover member 4 of the IC socket 1 is positioned upward, that is, in the first position by the biasing force of the coil spring 6 (see FIG. 1). As shown in the cross-sectional view 4, the cover member 4 has a protruding contact portion 44 that is integrally formed, and the contact portion 44 is separated from the protrusion 52 of the contact 5 at the first position. Or contact the protrusion 52 to such an extent that the contact 5 is not elastically deformed. In this state, the contact portion 51 of the contact 5 is positioned so as to close the receiving hole 42 of the cover member 4.

  Next, as shown in FIG. 5, the cover member 4 is pushed downward against the urging force of the coil spring 6 and moved to the second position manually or preferably using an automation device (not shown). At this time, as shown in the sectional view 6, the contact portion 44 of the cover member contacts the protrusion 52 of the contact 5 and elastically displaces the protrusion 52. More specifically, since the contact portion 44 has a wedge shape as shown in the drawing, the protrusion 52 of the contact 5 can be rotated counterclockwise in FIG. 6 with the press-fit portion 53 as a fulcrum. As the projection 52 rotates, the contact portion 51 having the projection 52 at the end also rotates counterclockwise, so that at least the terminal 711 of each IC device 71 can be inserted without substantial resistance. The receiving hole 42 is opened. Accordingly, when the cover member 4 is in the second position, the resistance applied when each IC device is inserted is substantially zero, and the IC device has a large number of terminals or a multiple IC device as illustrated. However, the operation force is not increased and the operability is not impaired, which is extremely advantageous in automation.

  When the multiple IC device 7 is inserted (i.e., mounted) into the IC socket 1 from the state shown in FIGS. 5 and 6, the cover member 4 is returned to the first position as shown in FIG. 7. Since the IC socket 1 according to the present embodiment has the coil spring 6 as shown in FIG. 1, it is only necessary to release the manual or automatic force to push down the cover member 4 here. As the cover member 4 moves upward, as shown in the sectional view 8, the protrusion 52 and the contact portion 51 of the cover member 4 rotate or restore clockwise with the press-fit portion 53 as a fulcrum, and the contact portion 51 becomes the IC device 71. The terminal 711 is contacted to establish an electrical connection. As a result, each IC device 71 is conductively connected to the inspection apparatus on which the base member 3 is mounted via the contact 5, so that various inspections can be performed.

  Conventionally, as the number of IC devices or the number of terminals of each IC device increases, the operating force also increases proportionally. Therefore, it is possible to perform inspection one by one using a single IC socket as shown in FIG. It was general. However, according to the present invention, the operating force applied when each terminal is inserted can be made substantially zero, so that the receiving hole of the cover member is connected to the carrier as shown in FIGS. By providing corresponding to the position of each terminal of the IC device, a large number of IC devices can be mounted on the IC socket at a very low operating force at a time. Accordingly, the insertion operation is stabilized and the inspection process can be easily automated. As a result, it contributes to the mass productivity improvement of IC devices.

It is a disassembled perspective view of IC socket concerning the present invention. It is a perspective view which shows the detail of the contact of the IC socket of FIG. It is a perspective view which shows an IC socket when an IC device is not yet mounted and a cover member is in a first position. It is a figure which shows the AA cross section of FIG. It is a perspective view which shows an IC socket when an IC device is not yet mounted and a cover member is in a second position. It is a figure which shows the BB cross section of FIG. It is a perspective view which shows an IC socket when an IC device is mounted and a cover member returns to a first position. It is a figure which shows CC cross section of FIG. It is a schematic perspective view of the conventional IC socket. FIG. 10 is a side view of the IC socket of FIG. 9, showing a part in cross section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC socket 2 Inspection apparatus 3 Base member 32 Insertion hole 4 Cover member 42 Receiving hole 44 Contact part 5 Contact 51 Contact part 52 Projection part 53 Press-fit part 54 Tail part 6 Coil spring 7 Multiple IC device 71 IC device 72 Carrier 711 terminal

Claims (6)

An IC socket that can be electrically connected to a plurality of IC devices,
A contact having an elastically displaceable contact for electrically connecting to each of the terminals of the plurality of IC devices;
A base member to which the contact is fixed;
A plurality of receiving holes capable of receiving terminals of the plurality of IC devices, and a cover member engageable with an upper portion of the base member;
The cover member is configured to be movable in a substantially vertical direction between a first position and a second position with respect to the base member, and contacts the contact when in the second position. Integrally having a contact portion that contacts and elastically displaces the contact portion;
Thereby, the contact portion of the contactor closes the receiving hole of the cover member when the cover member is in the first position, and the receiving hole when the cover member is in the second position. To open the
IC socket.   Each of the plurality of contacts integrally includes a protrusion that is connected to the contact portion and contacts the contact portion of the cover member at the second position, and the displacement of the contact portion is The IC socket according to claim 1, wherein the IC socket is generated along with a displacement of the protrusion that is in contact with the contact portion of the cover member.   Each of the plurality of contacts has a press-fit portion that can be press-fitted into a through-hole provided in the cover member, and the contact portion is displaced by a rotation operation with the press-fit portion as a fulcrum. The IC socket as described.   The IC socket according to claim 1, further comprising a biasing member that biases the cover member toward the first position.   The IC socket according to claim 4, wherein the urging member is a coil spring disposed between the base member and the cover member.   The plurality of IC devices are multiple IC devices connected to a carrier, and the receiving hole of the cover member is provided corresponding to the position of each terminal of the IC device connected to the carrier. Item 6. The IC socket according to any one of Items 1 to 5.

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