JP2007210641A - Packing case and packing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packing case which can suppress damage to semiconductor devices during packing and transport, and a packing method. <P>SOLUTION: The packing case 10 has, in an outer box 5, holding members 1 for holding a plurality of semiconductor devices 8 in piles, each semiconductor device 8 is provided with a layer forming recesses and projections on the substrate. The holding members 1 are disposed opposite to each other in the outer box 5 and have grooves 4 for sandwiching the sides of the semiconductors 8 in a state of being piled up. The holding members 1 are formed from flexible urethane foam. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a packing case for packing a semiconductor device such as a solar cell and a packing method using the packing case.

  With the recent increase in production volume of semiconductor devices, it is required to transport a large amount of semiconductor devices. In order to transport a large amount of semiconductor devices, it is necessary that packing and unpacking can be performed with good workability without reducing the productivity of the semiconductor devices, and that the semiconductor devices are not cracked during transportation.

  Conventionally, as a packaging method of the semiconductor device, (1) a method of protecting and fixing a plurality of stacked semiconductor devices by covering them with an organic material or the like formed in a thin film (shrink method) (for example, Patent Document 1) (2) A method of storing semiconductor devices one by one in a molded hard plastic tray (single wafer tray method), (3) Covering a plurality of stacked semiconductor devices with cushioning material, Storage method (individual case storage method) (see, for example, Patent Document 2), (4) A plurality of stacked semiconductor devices are stored in a tray made of molded hard plastic or the like (mainly stacked semiconductor devices are The semiconductor device may be stored so that the bottom surface of the semiconductor device is perpendicular to the bottom surface of the tray, or covered with a buffer material, etc.) (stacked tray method), a method combining these methods, etc. .

  Among these, the shrink packing method will be described below with reference to FIG.

  FIG. 12 is a cross-sectional view showing a schematic configuration of a packing case, showing a shrinking packing method.

As shown in FIG. 12, in the shrink-type packaging, an air mat 502 is accommodated in an exterior box 504, and a plurality of stacked semiconductor devices 501 are stored in the recesses of the air mat 502. On the plurality of semiconductor devices 501, a second air mat 505 that protects a portion that is not in contact with the air mat 502 is installed. As described above, the semiconductor device 501 is protected from an external impact or the like by surrounding the plurality of stacked semiconductor devices 501 with an air mat.
JP 2004-269026 A (published September 30, 2004) JP 2003-34363 A (published February 4, 2003)

  However, the conventional configuration causes a problem that the semiconductor device 501 is damaged during packaging or transportation.

  Specifically, since the thickness of the substrate of the semiconductor device 501 has become thinner due to the recent reduction in the thickness of the semiconductor device 501, the substrate of the semiconductor device 501 is likely to be warped, and the semiconductor device 501 is resistant to stress. Are becoming more vulnerable. For this reason, the semiconductor device 501 is more likely to be cracked due to external forces such as vibration and impact.

  In particular, in the case of a semiconductor device 501 having a configuration in which a member such as an electrode is provided on the surface of a flat semiconductor plate, such as a solar battery cell, since the surface has an uneven structure, a plurality of the semiconductor devices 501 are stacked. When packaged, the semiconductor device 501 is easily cracked due to external vibration and impact. In addition, even if the thickness of the semiconductor device 501 is slight, a large difference occurs in the thickness when the semiconductor devices 501 are stacked. Therefore, a load is applied to the semiconductor device 501 due to a mismatch in size between the stacked product and the packaging case. Cracks are likely to occur.

  The present invention has been made in view of the above-described problems, and its purpose is to protect a semiconductor device provided with a layer for forming irregularities on a substrate from external forces such as vibration and impact. Another object of the present invention is to realize a packing case and a packing method capable of suppressing damage to a semiconductor device during packing work and transportation.

  In order to solve the above problems, a packaging case according to the present invention is a packaging case in which a holding member for holding a plurality of stacked semiconductor devices in which a layer for forming irregularities is provided on a substrate is provided in an exterior box. In the outer box, a pair of holding members provided with grooves for sandwiching the side surfaces of the semiconductor device in a state where a plurality of the semiconductor devices are stacked are opposed to each other, and the holding member is It is characterized by being made of flexible urethane foam.

  According to the above configuration, since the holding member formed of the flexible urethane foam is provided, a plurality of stacked semiconductor devices are stably held by the holding member, and the semiconductor device is prevented from being damaged during packing work and transportation. be able to. Specifically, the flexible urethane foam has a high buffering property and has an appropriate stress for holding the semiconductor device, so that the semiconductor device can be protected from external vibration and impact. In addition, since flexible polyurethane foam is excellent in flexibility, even if the thickness of the stacked semiconductor devices varies, the mismatch in size between the stacked semiconductor devices and the groove of the holding member The load on the semiconductor device due to is small. Further, since the side surface of the semiconductor device is sandwiched, it is difficult for a load to be applied to the uneven portion on the substrate of the semiconductor device. Thereby, since it is difficult to apply a non-uniform load to the semiconductor device, the semiconductor device can be stably held. Therefore, according to the above configuration, by protecting the semiconductor device from external forces such as vibration and shock, it is possible to provide a packaging case that can suppress damage to the semiconductor device during packaging work and transportation. Play.

  In addition, since the flexible urethane foam has high buffering properties, it is not necessary to separately use a buffer material or a thin film when packing the semiconductor device. Furthermore, since the flexible urethane foam is a foam and has a low density, the weight of the packaging case can be reduced as compared with a normal plastic molded product. Therefore, it is possible to provide a packing case that can be packed and transported with less labor.

  Furthermore, since the flexible urethane foam is excellent in processability, it is not necessary to process it using an expensive jig such as a metal mold unlike plastics such as polypropylene and PET resin. Therefore, the packaging case can be manufactured at a lower cost.

  In the packaging case according to the present invention, it is preferable that the pair of holding members hold the semiconductor device in an upright state.

  According to the above configuration, since the semiconductor device is not positioned so as to lean on another semiconductor device, the load on the semiconductor device is reduced. Furthermore, since the vibration applied during transportation is mainly vertical vibration, the load during vibration applied to the layer forming the unevenness in the semiconductor device is reduced. As a result, the semiconductor device can be further prevented from being damaged during packing and transportation.

  Further, in the packaging case according to the present invention, the pair of holding members are respectively provided upright in the exterior box, and the grooves are provided along vertical lines, respectively, It is preferable that a second holding member made of a flexible urethane foam, in which a groove for holding the lower surface of the standing semiconductor device is provided, is further provided inside.

  According to the above configuration, since the second holding member provided with the groove for holding the lower surface of the standing semiconductor device is further provided, the semiconductor device can be further held from below. Therefore, since the semiconductor device is held more stably with respect to the vibration in the vertical direction, it is possible to further suppress the damage of the semiconductor device during packing work and transportation.

  In the packing case according to the present invention, the flexible urethane foam is preferably a polyether-based flexible urethane foam.

  According to the above configuration, since the polyether-based flexible urethane foam can be manufactured by blending various types of raw materials, performance such as elastic modulus and cushioning can be widely adjusted according to the application. There is a further effect of being able to.

Moreover, in the packaging case which concerns on this invention, it is preferable that the said flexible urethane foam is a urethane foam which has the hardness of 10-30 (kg / 314cm < ² >).

  According to the above configuration, since the holding member has an appropriate hardness, it is possible to hold the semiconductor device more stably and to further suppress the damage of the semiconductor device during packing work and transportation. Play.

  Moreover, in the packaging case which concerns on this invention, while providing the reinforcement member which reinforces the said exterior box inside the said exterior box, it is preferable that the said holding member is being fixed to the said reinforcement member.

  According to the above configuration, since the deformation of the outer box and the holding member can be suppressed against vibration and impact, the further effect that the semiconductor device can be further prevented from being damaged during the packing operation and transportation. Play.

  Further, in the packaging case according to the present invention, the reinforcing member is a box-shaped reinforcing member having an opening surface, and a plurality of the box-shaped reinforcing members are accommodated inside the exterior box. It is preferable to be provided on the inner wall of the box-shaped reinforcing member.

  According to the said structure, since the reinforcement member is a box-shaped shape with which the upper surface opened, the deformation | transformation of an exterior box and a holding member can be suppressed more. Further, since a plurality of reinforcing members are accommodated in one outer box, there is a further effect that more semiconductor devices can be stably accommodated in one outer box.

  In the packing case according to the present invention, it is preferable that solar cells are packed as the semiconductor device.

  According to the said structure, since a photovoltaic cell can be packed, damage can be suppressed and the packing operation and transportation of a photovoltaic cell can be performed stably.

  In order to solve the above problems, a packaging method according to the present invention is a packaging method for a semiconductor device using the packaging case according to the present invention, wherein a semiconductor device provided with a layer for forming irregularities on a substrate is provided. The semiconductor device is packed in the packing case by storing a plurality of the same in a groove provided in the packing case.

  According to the above method, since the packaging case according to the present invention is used, damage to the semiconductor device during packaging work and transportation can be suppressed by protecting the semiconductor device from external forces such as vibration and impact. There is an effect.

  In addition, since the flexible urethane foam has high buffering properties, it is not necessary to separately use a buffer material or a thin film when packing the semiconductor device. Furthermore, since the flexible urethane foam is a foam and has a low density, the weight of the packaging case can be reduced as compared with a normal plastic molded product. Accordingly, the packaging work and transportation can be performed with less labor.

  The packaging case according to the present invention, as described above, is a packaging case in which a holding member that holds a plurality of stacked semiconductor devices provided with a layer for forming irregularities on a substrate is provided in an exterior box. A pair of holding members provided with grooves for sandwiching the side surfaces of the semiconductor device in a state where a plurality of the semiconductor devices are stacked in the outer packaging box are opposed to each other, and the holding member is made of a flexible urethane foam. It is characterized by being formed by.

  Thereby, there is an effect that it is possible to provide a packing case that can prevent damage to the semiconductor device during packing work and transportation by protecting the semiconductor device from external forces such as vibration and impact.

  Further, as described above, the packaging method according to the present invention is a packaging method for a semiconductor device using the packaging case according to the present invention, wherein a semiconductor device provided with a layer for forming irregularities on a substrate is provided. The semiconductor device is packed in the packing case by storing a plurality of the same in a groove provided in the packing case. Thus, by protecting the semiconductor device from external forces such as vibration and impact, the semiconductor device can be prevented from being damaged during packing work and transportation.

[Embodiment 1]
An embodiment of the present invention will be described below with reference to FIGS.

  FIG. 1 is a cross-sectional view of the packaging case according to the present embodiment cut perpendicularly to the standing direction of the accommodated semiconductor device. FIG. 2 is a cross-sectional view of the packaging case according to the present embodiment cut in parallel to the standing direction of the accommodated semiconductor device. FIG. 3 is a cross-sectional view showing an example of the holding member in the packaging case according to the present embodiment. FIG. 4 is a cross-sectional view showing another example of the holding member in the packaging case according to the present embodiment.

  As shown in FIG. 1, a packaging case 10 according to the present embodiment is provided with a holding member 1 that holds a plurality of semiconductor devices 8 in an outer box 5. The holding member 1 is provided with a groove 4 for sandwiching a side surface of the semiconductor device 8 in a state where a plurality of the semiconductor devices 8 are stacked, and the holding member 1 is opposed to the outer box 5 as a pair. Is arranged. Each of the pair of holding members 1 is erected inside the outer box 5, and each of the grooves 4 is provided along a vertical line.

  The packaging case 10 further includes a holding member (second holding member) 7 provided with a groove 4 for holding the lower surface of the standing semiconductor device 8 inside the outer box. Thereby, as shown in FIG. 2, the semiconductor device 8 is held from the three directions of the lower surface and the two side surfaces.

  The semiconductor device 8 is provided with a layer for forming irregularities on the substrate. In other words, unlike a glass substrate or the like that is easily cracked but has a uniform thickness and a smooth surface, and does not break when only a load is applied evenly, the thickness of the semiconductor device 8 according to the present embodiment is not high. Uniform and uneven surface. For this reason, in the case of accommodating a plurality of stacked substrates, the semiconductor device 8 is more easily damaged by an external force such as vibration or impact compared to a glass substrate or the like.

  As the layer for forming the unevenness on the substrate in the semiconductor device 8, a metal electrode made of solder, aluminum, silver or the like, a wired electrode made of copper, silver, solder or the like, or a transparent conductive material such as tin oxide or zinc oxide. A metal oxide etc. are mentioned.

  In the case where the thickness of the layer forming the irregularities in the semiconductor device 8 is thicker than the thickness of the substrate in the semiconductor device 8, the semiconductor device 8 is more damaged by external force because the difference in thickness due to unevenness in the semiconductor device 8 is large. Is likely to occur. Furthermore, when the layer forming the unevenness in the semiconductor device 8 is harder than the substrate in the semiconductor device 8, the hardness of the semiconductor device 8 becomes non-uniform, so that the semiconductor device 8 is more damaged by an external force. It is likely to occur. In such a case, a buffer material or a film has been conventionally used separately. However, in the packaging case 10 according to the present embodiment, the holding members 1 and 7 have high buffering properties as will be described later, and the semiconductor device 8 Therefore, the semiconductor device 8 can be protected from external vibrations and shocks without using a buffer material or a film.

  The shape of the bottom surface of the substrate in the semiconductor device 8 is not particularly limited, and examples thereof include a square, a rectangle, a circle, and an ellipse. Specific examples of the semiconductor device 8 include an IC (integrated circuit), an optical pickup, an electronic component such as a laser, a solar battery cell, and the like. In particular, in the solar cell, a metal electrode that is thicker (0.1 to 1 mm) and harder than the substrate is formed on the surface of an extremely thin substrate (thickness 50 to 300 μm) that is very easy to break, and the surface is uneven. Therefore, it can pack suitably by the packing case 10 which concerns on this Embodiment.

  The shape of the holding members 1 and 7 is not particularly limited. From the viewpoint of stably holding the semiconductor device 8, the width of the holding members 1 and 7 in the direction of the groove 4 is set so that the semiconductor device 8 is installed in the groove 4. The width of the semiconductor device 8 parallel to the direction of the groove 4 at this time (hereinafter referred to as the width of the semiconductor device 8 corresponding to the groove 4) is preferably ½ or more. That is, it is preferable that the holding members 1 and 7 are configured to hold the semiconductor device 8 in contact with 1/2 or more of the side surface of the semiconductor device 8.

  The number of grooves 4 provided in the holding members 1 and 7 is not particularly limited, but a plurality of grooves 4 are preferably provided.

  The width W of the groove 4 (the width in the direction parallel to the side surface of the semiconductor device 8 when the semiconductor device 8 is sandwiched) is not particularly limited, but the balance between the accommodation efficiency of the semiconductor device 8 and the load applied to the semiconductor device 8 is not limited. From the viewpoint of taking the above, it is preferable that it is 1.5 times or less the thickness (width in the stacking direction on the side surface) of a plurality of stacked semiconductor devices 8 inserted into the groove 4. From the viewpoint of improving workability, the width W of the groove 4 is preferably slightly larger than the thickness of a plurality of stacked semiconductor devices 8 to be inserted into the groove 4.

  The width d between adjacent grooves 4 is preferably substantially equal to the width W at the bottom surface of the groove 4. When the width d between the adjacent grooves 4 is larger than the width W at the bottom surface of the grooves 4, the number of semiconductor devices 8 that can be accommodated decreases. Further, if the width d between adjacent grooves 4 is smaller than the width W at the bottom surface of the grooves 4, the strength of the grooves 4 decreases, and the semiconductor device 8 can easily move due to external impact or the like. Furthermore, if the width d between the adjacent grooves 4 is smaller than the width W at the bottom surface of the groove 4, the gap between the adjacent stacked semiconductor devices 8 is reduced when the semiconductor device 8 is accommodated. Workability deteriorates.

  As shown in FIGS. 3 and 4, the width W of the groove 4 is preferably such that the opening width (opening width) W2 is wider than the bottom width (bottom width) W1, and the bottom width W1. It is more preferable that the opening width W2 is 10% to 20% wider than that. By making the opening width W2 wider than the bottom surface width W1, the semiconductor device 8 can be easily inserted into the groove 4 when the semiconductor device 8 is accommodated in the packing case 10. The shape of the groove 4 in this case may be a configuration in which the width only in the vicinity of the opening is wide as shown in FIG. 3, or the width is gradually widened from the bottom surface to the opening as shown in FIG. It may be a configuration.

  The depth b of the groove 4 is not particularly limited, but in order to avoid applying a load to the layer forming the unevenness when the layer forming the unevenness in the semiconductor device 8 is not formed at the edge of the substrate. In addition, it is preferable that the depth is to hold only the substrate in the semiconductor device 8. That is, the depth b of the groove 4 is preferably shorter than the distance from the end of the semiconductor device 8 to the region where the layer for forming irregularities is provided.

  The length of the groove 4 (the length in the direction orthogonal to the width W of the groove 4) is the width of the semiconductor device 8 parallel to the length direction of the groove 4 when the length of the groove 4 is held by the groove 4. When it is shorter than (the width of the semiconductor device 8 corresponding to the groove 4), the length of the groove 4 is preferably the same as the length of the holding members 1 and 7 parallel to the length direction of the groove 4. That is, it is preferable that the groove 4 penetrates in the length direction of the groove 4.

  Further, when the length of the holding members 1 and 7 (the length parallel to the length direction of the groove 4) is longer than the width of the semiconductor device 8 corresponding to the groove 4, the length of the groove 4 is the groove Preferably, the width of the semiconductor device 8 corresponding to 4 is substantially equal to the width.

  The distance f between the bottom surfaces of the pair of grooves 4 facing the holding member 1 is 0.5 than the length of the semiconductor device 8 (the distance between the left and right side surfaces of the semiconductor device 8 sandwiched between the grooves 4). It is preferable that the length is ˜1.0 cm. If the distance f is within the above range, the semiconductor device 8 can be appropriately fixed, and the semiconductor device 8 is not easily caught by the holding member 1 when the semiconductor device 8 is inserted. can do.

  Further, for example, as described later, in a configuration in which a holding member is provided at a position facing the holding member 7 as in a configuration including a lid having a holding member at a position facing the holding member 7, The distance between the bottom surfaces of the opposing grooves 4 in the holding member may be 0.2 to 0.5 cm shorter than the length of the semiconductor device 8 (the distance between the upper and lower side surfaces of the semiconductor device 8 sandwiched between the grooves 4). preferable. If the distance is within the above range, the semiconductor device 8 can be appropriately fixed, damage is hardly transmitted to the semiconductor device 8, and the occurrence of cracks in the semiconductor device 8 can be suppressed.

  The holding members 1 and 7 are made of flexible urethane foam. The flexible urethane foam is not particularly limited as long as it has an appropriate stress for stably holding the semiconductor device 8 and a high buffering force for reducing external vibration or impact. Examples include urethane foam and polyester-based flexible urethane foam. Since various types of raw materials can be blended and manufactured, performances such as elastic modulus and cushioning properties can be widely adjusted depending on the application, and therefore, a polyether-based flexible urethane foam is more preferable.

The “soft urethane foam” in the present embodiment is a urethane foam having an expansion ratio of about 10 to 60 times and an apparent density of about 16 to 100 kg / m ³ .

  The polyether-based flexible urethane foam can be produced by combining various polyols, polyisocyanates, foaming agents, foam stabilizers and the like, and can be produced using conventionally known materials.

The flexible urethane foam preferably has a hardness in the range of 10 to 30 (kg / 314 cm ² ), and more preferably in the range of 12 to 15 (kg / 314 cm ² ). When the hardness is less than 10 (kg / 314 cm ² ), the holding force of the holding members 1 and 7 is weakened, so that the semiconductor device 8 is easy to move, and the semiconductor device 8 is easily damaged during packing work and transportation. . When the hardness exceeds 30 (kg / 314 cm ² ), the buffering force of the holding members 1 and 7 becomes weak, so that the impact received by the semiconductor device 8 increases, and the semiconductor device 8 is easily damaged during packaging and transportation. Become.

  Values of various physical properties of the flexible urethane foam other than hardness such as tensile strength, elongation, and compressive residual strain are not particularly limited, and may be within a range of conventionally known flexible urethane foam.

  In addition to the above configuration, the packaging case 10 according to the present embodiment further includes a reinforcing member 2 that reinforces the exterior box 5 as shown in FIG. The reinforcing member 2 is provided inside the outer box 5 and includes holding members 1 and 7 on the back surface of the surface in contact with the outer box 5. Examples of the material of the reinforcing member 2 include cardboard and hard plastic.

  The shape of the reinforcing member 2 is not particularly limited as long as the outer box 5 and the holding members 1 and 7 can be reinforced. From the viewpoint of reinforcing the outer box 5 uniformly, the reinforcing member 2 is attached to the outer member. It is preferable that it is flat form which has a bottom face substantially the same shape as the inner surface in the box 5. When a plurality of flat plate-like reinforcing members 2 are provided on the inner surface of the outer box 5, the reinforcing members 2 corresponding to the respective surfaces may be connected to each other to form one member, or separate members. It may be. In this embodiment, in order to hold the back surfaces of the holding members 1 and 7, the three flat reinforcing members 2 corresponding to the holding members 1 and 7 are connected to form one member. A reinforcing member 2 having a letter shape is used.

  The exterior box 5 is a box having an accommodating portion that is approximately the same size as the packaging tray 20 including the reinforcing member 2 and the holding members 1 and 7. The shape of the packaging tray 20 is maintained by the exterior box 5, and the packaging tray 20 can be transported. Examples of the material of the outer box 5 include cardboard, hard plastic, light metal, and the like.

  Below, an example of the production method of the said packaging case 10 is demonstrated using FIG. 5 and FIG.

  FIG. 5 is a perspective view for explaining a method for producing the packaging tray 20 in the packaging case 10. FIG. 6 is a perspective view for explaining a manufacturing method of the packaging case 10.

  As shown in FIG. 5, the holding members 1 and 7 have a suitable thickness and size, and a flat flexible urethane foam material 3 having a rectangular bottom surface (for example, a width of 10 cm, a length of 50 cm, and a thickness of 4 cm). It is produced using a flexible urethane foam material). The flexible urethane foam material 3 is compressed from a side surface (hereinafter referred to as a side surface on the long side) on the bottom surface of the flexible urethane foam material 3 toward a side surface on the opposite long side. And in order to form a groove | channel in the bottom face of the compressed flexible urethane foam material 3, the recessed part penetrated to a compression direction from the side surface of a long side is cut out by a fixed space | interval. Here, the cutting operation can be performed efficiently by performing with a U-shaped blade or the like. Thereby, the groove | channel 4 penetrated in the compression direction is provided on the bottom face of the compressed flexible urethane foam material 3. The groove 4 is set, for example, to a depth of about 2 cm, which is about a half of the thickness of the flexible urethane foam material 3, and a width of about 1 cm.

  After the above cutting operation, the flexible urethane foam material 3 is released from compression and expanded to return to its original size. And the back surface of the surface in which the groove 4 of the holding members 1 and 7 is formed and the rectangular reinforcing member 2 are fixed with a double-sided tape or the like. At this time, the holding members 1 and 7 are arranged so that the direction of the groove 4 is parallel to the direction of the long side of the reinforcing member 2. Then, the reinforcing member 2 between the adjacent holding members 1 and 7 is folded at two locations in total so that the direction of the short side of the reinforcing member 2 and the fold line are parallel to each other. The packaging tray 20 is produced. And the packaging case 10 can be produced by accommodating the packaging tray 20 in the exterior box 5, as shown in FIG.

  The packaging case 10 may be configured to include a lid 6 as shown in FIG. That is, after the semiconductor device 8 that is an object to be packed is accommodated in the packing case 10, the lid 6 may be disposed on the exposed semiconductor device 8 and the packing case 10 may be packed.

  The lid 6 is for protecting the exposed upper surface of the semiconductor device 8 accommodated in the packaging case 10 described above. The lid 6 may be anything as long as it protects the semiconductor device 8, but it is preferable that the holding member 1 is provided on the reinforcing member 2 in the same manner as the packing case 10. In this case, the lid 6 is arranged so that the holding member 1 faces the accommodated semiconductor device 8 side. In the present embodiment, the lid 6 is one in which the holding member 1 is provided on the reinforcing member 2. Further, the holding member 1 in the lid 6 may be provided with a groove 4. Thereby, the semiconductor device 8 can be held more stably.

  Next, a method for packing the semiconductor device 8 using the packing case 10 will be described below.

  First, the semiconductor device 8 is accommodated in the grooves 4 of the holding members 1 and 7 in the packaging case 10 so that the semiconductor device 8 is in an upright state. At this time, the semiconductor devices 8 may be accommodated one by one, or a plurality of stacked semiconductor devices 8 may be accommodated at a time. Next, in the case of the configuration having the lid 6, the lid 6 is disposed on the surface of the packing case 10 where the semiconductor device 8 is exposed so that the holding member 1 of the lid 6 faces the semiconductor device 8 side. As a result, the holding members 1 and 7 hold the semiconductor device 8 from four directions, and the semiconductor device 8 can be stably protected from external forces such as vibration and shock during transportation. Finally, the packaging of the semiconductor device 8 is completed by closing the lid of the outer box 5.

  As described above, the packaging case 10 according to the present embodiment has a pair of holdings provided with the grooves 4 that sandwich the side surfaces of the semiconductor device 8 in a state where a plurality of semiconductor devices 8 are stacked in the outer box 5. While the member 1 is disposed to face the holding member 1, the holding member 1 is formed of a flexible urethane foam. For this reason, a plurality of stacked semiconductor devices 8 are stably held by the holding member 1, and damage to the semiconductor device 8 during transportation can be suppressed. Specifically, the flexible urethane foam has a high buffering property and has an appropriate stress for holding the semiconductor device 8, so that the semiconductor device 8 can be protected from external vibration and impact. In addition, since the flexible urethane foam is excellent in flexibility, even if the thickness of the stacked semiconductor devices 8 varies, the plurality of stacked semiconductor devices 8 and the grooves 4 of the holding member 1 The load on the semiconductor device 8 due to the size mismatch is small. Further, since the side surface of the semiconductor device 8 is sandwiched, it is difficult for a load to be applied to the uneven portions on the substrate of the semiconductor device 8. Thereby, since it is difficult to apply a non-uniform load to the semiconductor device 8, the semiconductor device 8 can be stably held. Therefore, according to the above configuration, it is possible to provide the packaging case 10 that can prevent damage to the semiconductor device 8 during packaging work and transportation by protecting the semiconductor device 8 from external forces such as vibration and impact. .

  Further, since the flexible urethane foam has a high buffering property, it is not necessary to separately use a buffer material or a thin film when packing the semiconductor device 8. Furthermore, since the flexible urethane foam is a foam and has a low density, the weight of the packaging case 10 can be reduced as compared with a normal plastic molded product. Therefore, it is possible to provide the packing case 10 that can be packed and transported with less labor.

  Furthermore, since the flexible urethane foam is excellent in processability, it is not necessary to process it using an expensive jig such as a metal mold unlike plastics such as polypropylene and PET resin. Therefore, the packaging case 10 can be manufactured at a lower cost.

  Further, in the packaging method according to the present embodiment, the semiconductor device 8 provided with a layer for forming irregularities on the substrate is placed in the groove 4 provided in the packaging case 10 using the packaging case 10. In this method, the semiconductor device 8 is packed in the packing case 10 by storing a plurality of the stacked devices. Since the packaging method according to the present embodiment uses the packaging case 10, it is possible to suppress damage to the semiconductor device 8 during packaging work and transportation.

  In the above description, the case where the holding members 1 and 7 are provided is described. However, the present invention is not limited to this. A configuration in which the side surfaces of the semiconductor device are sandwiched between the two holding members 1 in a state where a plurality of semiconductor devices 8 are stacked may be employed. However, when the configuration is such that the two side surfaces and the bottom surface of the semiconductor device 8 are held as in this embodiment, the semiconductor device 8 is also held from the lower side, and is more stable against vertical vibration. It is more preferable because the semiconductor device 8 can be held.

  In the above description, the case where the pair of holding members 1 that sandwich the side surfaces of the semiconductor device 8 in a state where a plurality of semiconductor devices 8 are stacked is erected inside the outer box 5 has been described. This is not a limitation. The pair of holding members 1 may be configured so as to be laterally provided inside the outer box 5. However, in this case, the opening surface of the outer box 5 needs to be a side surface, not an upper surface.

  Moreover, although the case where the thing consisting of one box was used as the exterior box 5 was demonstrated in the above-mentioned description, it is not restricted to this. For the purpose of increasing the strength of the outer box 5, it may be a multi-structure box in which one or more other boxes smaller than the outer box 5 are provided in the outer box 5.

  Further, the exterior box 5 may be configured to be partitioned by a partition plate or the like. In this case, the holding members 1 and 7 may be provided on the partition plate.

  In the above description, the case where the semiconductor device 8 is configured to be held in the standing state has been described. However, the present invention is not limited to this. The semiconductor device 8 may be configured to be held horizontally. However, when the semiconductor device 8 is configured to be held in an upright state as in the present embodiment, the semiconductor device 8 is difficult to be positioned so as to lean on the other semiconductor device 8, and a load is applied to the semiconductor device 8. Is more preferable because it is difficult to apply. Furthermore, since the vibration applied during transportation is mainly vertical vibration, the load applied to the layer forming the unevenness in the semiconductor device 8 is reduced. Further, when the semiconductor device 8 is configured to be held horizontally, the side surface of the outer box 5 must be opened to accommodate the semiconductor device 8 from the side.

  Moreover, although the case where the reinforcement member 2 was provided was demonstrated in the above-mentioned description, it is not restricted to this. A configuration in which the holding members 1 and 7 are directly attached to the exterior box 5 without providing the reinforcing member 2 may be adopted. However, in the case where the reinforcing member 2 is provided, the deformation of the outer box 5 and the holding members 1 and 7 can be further suppressed against vibration and impact, and the semiconductor device 8 at the time of packing work and transportation can be suppressed. Since damage can be suppressed more, it is more preferable.

[Embodiment 2]
A second embodiment of the present invention will be described in detail below with reference to FIGS. However, the same members as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted. The packaging case according to the present embodiment is the same as that of the first embodiment except that the shape of the reinforcing member 2 is different and that three packaging trays are arranged in one outer box 5. It has the same configuration as the case 10.

  FIG. 7 is a cross-sectional view of the packaging case according to the present embodiment cut perpendicularly to the standing direction of the accommodated semiconductor device. FIG. 8 is a perspective view showing a schematic configuration of the packaging tray in the packaging case according to the present embodiment. FIG. 9 is a perspective view showing a schematic configuration of the packaging case according to the present embodiment.

  As shown in FIG. 7, the packing case 50 has three packing trays 20 arranged in one outer box 5. Further, as shown in FIG. 8, the reinforcing member 2 has a configuration in which the surfaces constituting the reinforcing member 2 are further connected to the reinforcing member 2 in the first embodiment by a pair of parallel surfaces. Yes. That is, the reinforcing member 2 has a box shape having one opening surface. Thereby, the shape of the holding members 1 and 7 can be maintained more firmly.

  As shown in FIG. 9, the packaging case 50 is configured to include the packaging tray 20, the outer box 5, and the lid 6, similarly to the packaging case 10 of the first embodiment.

  Since the manufacturing method of the packing case 50 is the same as that of the packing case 10 in Embodiment 1, description is abbreviate | omitted here. Further, the packing method using the packing case 50 is the same as the packing method using the packing case 10 in the first embodiment, and thus the description thereof is omitted here.

  Below, the result of having conducted the packing test and the actual transport test by the packing case 50 which concerns on this Embodiment using a crystalline silicon photovoltaic cell as the semiconductor device 8 is demonstrated. First, the manufacturing method of a crystalline silicon solar cell is demonstrated using FIG. 10 and FIG.

  FIG. 10 is a cross-sectional view for explaining the manufacturing process of the solar battery cell. Moreover, FIG. 11 is a figure which shows schematic structure of a photovoltaic cell, (a) is sectional drawing, (b) is a top view, (c) is a bottom view. In addition, the arrow described in FIG.11 (b) represents that the surface shown in FIG.11 (b) is a light-receiving surface.

  As shown in FIG. 10, a solution containing impurities is applied to the upper surface (light-receiving surface) 101a of a semiconductor substrate 101 (for example, a P-type silicon substrate, thickness 200 μm), or heat is applied at about 800 to 900 ° C. from the gas phase. By diffusing, an N-type impurity diffusion layer 102 is formed, and a PN junction layer 102a is formed.

  Next, impurities are thermally diffused at about 900 to 1100 ° C. on the bottom surface (back surface) 101b to form a P-type high-concentration impurity diffusion layer 103 to form a BSF (Back Surface Field). If aluminum is used as the back contact electrode, the BSF can be locally formed by firing at about 700 to 900 ° C.

  Next, a surface antireflection film 104 made of a metal oxide or the like is formed on the upper surface 101a, and an antireflection film 105 made of a metal oxide or the like is formed on the bottom surface 101b side. Then, a grid-shaped light receiving surface electrode 106 is formed on the upper surface 101 a side of the semiconductor substrate 101. Then, a back contact electrode 107 is partially formed from the top of the antireflection film 105 on the bottom surface 101b side. At this time, since the light-receiving surface electrode 106 and the back contact electrode 107 are in ohmic contact with the semiconductor layer, it is desirable to fire the manufactured solar battery cell at 400 to 800 ° C. The back contact electrode 107 may be formed on the entire bottom surface 101b.

  The light receiving surface electrode 106 and the back contact electrode 107 can be formed by vacuum deposition, screen printing, sputtering, or the like. Further, the surfaces of the light receiving surface electrode 106 and the back contact electrode 107 may be coated with solder (not shown) as required.

  As shown in FIG. 11, the solar battery manufactured in this way has a light receiving surface electrode 106 protruding on the upper surface 101a and a back contact electrode 107 protruding on the bottom surface 101b. Is not smooth but uneven. The unevenness of the surface of the solar battery cell is caused not only by the electrode forming process in the manufacturing process, but also by projections due to abnormal growth of the electrode in the firing process, grains or pools generated on the electrode during solder coating, etc. Also forms.

  Next, the results obtained by actually packing the solar battery cell with the packing case 50 of the present embodiment and conducting a packing test and an actual transportation test will be described below.

  In the packing test and the actual transportation test, a polycrystalline silicon solar battery cell having a 156 mm square and a thickness of 200 μm was used. In the packaging case 50 of the present embodiment, 20 grooves 4 having the same shape are provided in the holding members 1 and 7 of the respective packaging trays 20, and each of the grooves 4 accommodates 15 solar cells. be able to. Therefore, a total of 900 solar cells can be accommodated in the packing case 50. In addition, this test was performed by accommodating 900 solar cells in the packing case 50.

  The width of the groove 4 is 10 mm, and the width between the grooves 4 is set to 10 mm, which is the same as the width of the groove 4. The length of the groove 4 is 160 mm, and the depth of the groove 4 is set to 15 mm. The packing tray 20 has a size of width 196 mm × length 506 × height 186 mm. The outer box 5 accommodated a box (inner box) 635 mm wide x 560 mm long x 210 mm high in a box (outer box) having a size of width 715 mm × length 745 × height 275 mm. A double structure was used. Between the inner box and the outer box in the outer box 5, corner pads made of earth republic material are respectively inserted into the four corners on the bottom surface inside the outer box for the purpose of absorbing external force such as impact. Yes.

  Evaluation in each test was performed by visually observing the solar battery cell after each test and calculating how many cracks occurred. In the packing test, a vibration test (JIS Z 0232 packaging cargo-vibration test method, IMV vibration tester (VS-150-1, SC-1000)) is performed on the packaging case 50 containing the solar battery cells. Use, vibration frequency: 5-50Hz, period: 3 minutes, acceleration 1G (constant), total amplitude 20-0.2mm) for 60 minutes vertically, 15 minutes vertically, 15 minutes horizontally, 90 minutes in total After the test, a drop test was performed.

  The drop test was carried out by performing three times from a height of 15 cm. The first time, one of the long sides on the bottom surface of the packaging case 50 was directed to the falling surface, and the normal of the dropping surface passing through the center of gravity of the packaging case 50 and the long side were dropped. In the second time, the long side opposite to the first time on the bottom surface of the packing case 50 is directed to the drop surface, and the normal of the drop surface passing through the center of gravity of the packing case 50 and the long side are dropped in a state orthogonal to each other. It was. The third time, the packing case 50 was dropped with the bottom surface facing the drop surface and the bottom surface and the drop surface being parallel.

  The actual transportation test was conducted by air freight (with truck transportation on the way) from Kansai International Airport (Japan) to Heathrow Airport (London) by passenger cargo.

  For comparison in the packing test, a stacked tray type packing case (width 720 mm × length 635 mm × height 310 mm, 12 sheets / groove, 720 sheets in total) for storing an object to be packed in a molded foamed polypropylene tray, and A plurality of stacked solar cells using a stacked tray type packing case (width 720 mm × length 635 mm × height 310 mm, 12 sheets / groove, total 720 sheets) that accommodates an object to be packed in a molded polypropylene tray The same test was conducted for each of the cells packed. Further, for comparison in the actual transportation test, the same test was performed using the above-mentioned packing case of the laminated tray system in which the packaged items are stored in the molded foamed polypropylene tray. The results are shown in Table 1.

  As shown in Table 1, in the packing test, the cracking rate of the solar battery cell was 3.4% for packing by the laminated tray method (polypropylene tray), and 1.4% for packing by the laminated tray method (foamed polypropylene tray). On the other hand, in the packaging by the packaging case 50 of this embodiment, it is 0.44%, and the cracking rate is suppressed to 1/3 or less as compared with the packaging by the conventional laminated tray system.

  Also, in the actual air transportation test, the cracking rate of the solar battery cell was 3.4% in the packing by the laminated tray method (foamed polypropylene tray), whereas it was 1.0% in the packing by the packing case 50. Yes, the cracking rate is suppressed to 1/3 or less as compared with the packaging by the conventional laminated tray system.

  As described above, the packaging case 50 according to the present embodiment protects the semiconductor device 8 from external forces such as vibrations and shocks, thereby suppressing damage to the semiconductor device 8 during packaging work and transportation.

  In addition, the packaging case according to the present invention is a packaging case for packaging a plurality of plate-like semiconductor devices, and urethane is fixed to a reinforcing material that reinforces the plate-like semiconductor device, and a groove is formed in the urethane. It does not matter even if it is configured. In this case, the reinforcing material is preferably contained in a container. Moreover, it is preferable that a plurality of reinforcing materials are contained in the container. Furthermore, it is preferable that the reinforcing material has a rectangular shape and grooves are formed on at least three surfaces of urethane fixed to the reinforcing material. The urethane is preferably a polyether-based flexible urethane foam.

  Further, the packing method according to the present invention may be a method of packing a plate-like semiconductor device with the packing case. In this case, it is preferable that the said plate-shaped semiconductor device is a photovoltaic cell.

  In addition, each specific numerical value in the packaging cases 10 and 50 shown by each above-mentioned embodiment is an example, and this invention is not limited to the value.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  Since the packaging case according to the present invention includes a holding member made of a flexible urethane foam, the semiconductor device can be prevented from being damaged during packaging and transportation. Therefore, it can apply suitably as packing cases, such as a photovoltaic cell.

It is sectional drawing of the packaging case which concerns on this Embodiment cut | disconnected perpendicularly | vertically with respect to the standing direction of the accommodated semiconductor device. It is sectional drawing of the said packaging case cut | disconnected in parallel with respect to the standing direction of the accommodated semiconductor device. It is sectional drawing which shows an example of the holding member in the said packaging case. It is sectional drawing which shows another example of the holding member in the said packaging case. It is a perspective view for demonstrating the preparation methods of the packaging tray in the said packaging case. It is a perspective view for demonstrating the preparation methods of the said packaging case. It is sectional drawing of the packaging case which concerns on the other form of this Embodiment cut | disconnected perpendicularly | vertically with respect to the standing direction of the accommodated semiconductor device. It is a perspective view which shows schematic structure of the packaging tray in the packaging case which concerns on the other form of this embodiment. It is a perspective view which shows schematic structure of the packaging case which concerns on the other form of this Embodiment. It is sectional drawing for demonstrating the manufacturing process of a photovoltaic cell. It is a figure which shows schematic structure of a photovoltaic cell, (a) is sectional drawing, (b) is a top view, (c) is a bottom view. It is sectional drawing which shows a prior art and shows schematic structure of a packaging case.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Holding member 2 Reinforcing member 4 Groove 5 Exterior box 7 Holding member (2nd holding member)
8 Semiconductor Device 10 Packing Case 20 Packing Tray 50 Packing Case

Claims (9)

A packaging case provided with a holding member for holding a plurality of stacked semiconductor devices provided with a layer for forming irregularities on a substrate in an outer box,
In the outer box, a pair of holding members provided with grooves for sandwiching the side surfaces of the semiconductor device in a state where a plurality of the semiconductor devices are stacked are disposed opposite to each other.
The holding case is formed of a flexible urethane foam.   The packing case according to claim 1, wherein the pair of holding members hold the semiconductor devices in an upright state. Each of the pair of holding members is erected inside the outer box, and each of the grooves is provided along a vertical line, and
3. The second holding member made of flexible urethane foam, further provided with a groove for holding the lower surface of the standing semiconductor device, is provided inside the outer box. 4. Packing case.   The packaging case according to claim 1, wherein the flexible urethane foam is a polyether-based flexible urethane foam. The packaging case according to claim 1, wherein the flexible urethane foam is a urethane foam having a hardness of 10 to 30 (kg / 314 cm ² ). While equipped with a reinforcing member for reinforcing the outer box inside the outer box,
The packaging case according to claim 1, wherein the holding member is fixed to the reinforcing member. The reinforcing member is a box-shaped reinforcing member having an opening surface,
The packaging case according to claim 6, wherein a plurality of the box-shaped reinforcing members are accommodated in the exterior box, and the holding member is provided on an inner wall of the box-shaped reinforcing member.   The packing case according to claim 1, wherein solar cells are packed as the semiconductor device. A method for packing a semiconductor device using the packing case according to claim 1,
A plurality of semiconductor devices provided with a layer for forming irregularities on a substrate are accommodated in a groove provided in the packing case, and the semiconductor device is packed in the packing case. A method for packing a semiconductor device.

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