JP2007207544A - Method and apparatus for manufacturing organic electroluminescence device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic electroluminescence device which can achieve a long service life of the organic electroluminescence device. <P>SOLUTION: The method for manufacturing the organic electroluminescence device comprises: a first step for forming an organic layer on a substrate, a second step for heating the organic layer formed on the substrate in an inert gas atmosphere, and a third step for irradiating the organic layer formed on the substrate 1 with a predetermined light in a predetermined atmosphere. The third step is performed at least before or after the second step. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a method and apparatus for manufacturing an organic electroluminescence (EL) device.

The organic EL device has a light emitting element (organic EL element) having a structure in which an organic layer including a light emitting layer capable of emitting light is sandwiched between an anode and a cathode, and holes injected from the anode side and injected from the cathode side. The emitted electrons are recombined in the light emitting layer, and desired light is emitted by utilizing the phenomenon of light emission when the electrons are lost from the excited state. The organic EL device is required to have various performances such as high brightness and long life, and various methods for manufacturing the organic EL device are required to realize the performance. Are devised. Patent Documents 1 and 2 below disclose an example of a technique in which an organic layer is formed on a substrate and then a predetermined treatment is performed on the organic layer after the film formation.
JP 2002-31567 A JP 2005-005159 A

In the technique of Patent Document 1, irregularities are formed at the interface with the adjacent layer of the organic layer by adjusting the firing conditions when firing the organic layer after film formation on the substrate. At the same time, there is concern about the formation of pinholes. When a large number of pinholes are formed, a decrease in luminous efficiency and a decrease in lifetime are expected. In addition, since the organic layer is deteriorated by moisture, it is effective to remove the moisture by baking the organic layer after film formation on the substrate at a temperature equal to or higher than the evaporation temperature of water as in the technique of Patent Document 2. However, the present situation is that a sufficient light emission lifetime is not yet obtained. Therefore, it is desired to devise a manufacturing method and a manufacturing apparatus that can realize a long lifetime of the organic EL element.

This invention is made | formed in view of the said situation, and it aims at providing the manufacturing method and manufacturing apparatus of an organic electroluminescent apparatus which can implement | achieve lifetime improvement.

In order to solve the above-described problems, the present invention provides a method for manufacturing an organic electroluminescence device having an organic layer capable of emitting light, a first step of forming the organic layer on a substrate, and a film formed on the substrate. A second step of heating the organic layer in an inert gas atmosphere, and a third step of irradiating the organic layer formed on the substrate with a predetermined light in a predetermined gas atmosphere, Provided is a method for manufacturing an organic electroluminescence device, wherein the third step is performed at least one of before and after the second step.

The present inventor has obtained a predetermined light in a predetermined gas atmosphere before and / or after heating the organic layer formed on the substrate in an inert gas atmosphere. It has been found that the emission life of the organic EL device is extended by irradiation. So, according to the present invention,
By irradiating a predetermined light in a predetermined gas atmosphere to the organic layer formed on the substrate at least one of before and after heating the organic layer formed on the substrate in an inert gas atmosphere, The lifetime of the organic EL device can be increased.

In the first step, the organic layer is formed on the first electrode formed on the substrate, and the second step is performed.
After the step and the third step are completed, a configuration in which the second electrode is formed on the organic layer can be adopted.

That is, the inventor forms an organic layer on the first electrode formed on the substrate, and then performs the second step and the second step on the organic layer formed on the first electrode on the substrate. After performing any one of the three steps, the other is performed, and after the second step and the third step are completed, the second layer is formed on the organic layer.
It has been found that the lifetime of the organic EL device can be increased by forming the electrode.

The third step may employ a configuration in which the organic layer is irradiated with white light in an air atmosphere.

That is, the present inventor has found that the organic EL device can have a long lifetime by irradiating the organic layer with white light in an air atmosphere.

The third step may employ a configuration in which the organic layer is irradiated with ultraviolet light in an air atmosphere.

That is, the present inventor has found that the organic EL device can have a long lifetime by irradiating the organic layer with ultraviolet light in an air atmosphere.

The third step may employ a configuration in which the organic layer is irradiated with ultraviolet light in an inert gas atmosphere.

That is, the present inventor has found that the organic EL device can have a long lifetime by irradiating the organic layer with ultraviolet light in an inert gas atmosphere.

The inert gas may employ a configuration including at least one of helium, argon, nitrogen, neon, xenon, and krypton.

  Thereby, deterioration of the organic layer during the second step can be prevented.

The first step may employ a configuration including discharging a liquid material including a material for forming the organic layer onto the substrate based on a droplet discharge method.

  Thereby, an organic layer can be formed efficiently.

According to another aspect of the present invention, there is provided a manufacturing apparatus for an organic electroluminescence device having an organic layer capable of emitting light, a first processing apparatus capable of heating the organic layer formed on the substrate in an inert gas atmosphere; The second organic layer can be irradiated with predetermined light in a predetermined gas atmosphere.
A processing apparatus; and a control apparatus for processing the organic layer with the second processing apparatus at least before and after the organic layer formed on the substrate is processed with the first processing apparatus. An apparatus for manufacturing an organic electroluminescence device is provided.

According to the present invention, the organic layer formed on the substrate is heated in the inert gas atmosphere before and after the organic layer formed on the substrate is subjected to the predetermined light in the predetermined gas atmosphere. The life of the organic EL device can be extended.

A first storage device that forms a first space in which the substrate on which the organic layer is formed can be stored; and an adjustment device that can adjust the first space to one of an inert gas atmosphere and an air atmosphere. The first processing apparatus includes a heating apparatus that heats and bakes the organic layer formed on the substrate housed in the first space in the inert gas atmosphere, and the second processing apparatus includes: The processing apparatus applies either one of white light and ultraviolet light to the organic layer formed on the substrate accommodated in the first space in the inert gas atmosphere or the air atmosphere. A configuration including an irradiation device for irradiation can be employed.

Thereby, in the first space, the organic layer can be heated in an inert gas atmosphere, and the organic layer can be irradiated with white light or ultraviolet light in an air atmosphere or an inert gas atmosphere. Processing efficiency can be improved.

In order to form the organic layer on the substrate, a configuration including a droplet discharge device that discharges a liquid material including a material for forming the organic layer onto the substrate can be employed.

  Thereby, an organic layer can be formed efficiently.

The droplet discharge device forms the organic layer on the first electrode formed on the substrate, and after the processing of the first processing device and the second processing device is completed, on the organic layer The structure provided with the electrode formation apparatus which forms a 2nd electrode is employable.

Thereby, an organic layer can be formed on the first electrode formed on the substrate. Then, the organic layer formed on the first electrode on the substrate is processed using one of the second processing apparatus and the third processing apparatus, and then processed using the other. After these processes are completed, the lifetime of the organic EL device can be extended by forming the second electrode on the organic layer.

The electrode forming apparatus has a second space, and can adopt a configuration in which the second electrode is formed by vapor deposition by accommodating the substrate on which the organic layer is formed in the second space.

Accordingly, the second electrode can be smoothly formed by vapor deposition on the organic layer processed in the first space in the second space different from the first space in which the organic layer is processed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is the X-axis direction, and a direction orthogonal to the X-axis direction in the horizontal plane is a direction orthogonal to the Y-axis direction, the X-axis direction, and the Y-axis direction (
That is, the vertical direction) is taken as the Z-axis direction. Furthermore, the rotation directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a side sectional view showing an organic EL device according to the first embodiment. In FIG. 1, the organic EL device S includes a substrate 1, a light emitting element (organic EL element) 2 provided on the substrate 1, and a sealing member 20 connected to the substrate 1 and covering the light emitting element 2. Yes. The light emitting element 2 is provided on the surface (active surface) 1A of the substrate 1. Organic EL device S
Includes a driving element (chip) (not shown) for driving the light emitting element 2. The drive element is provided outside the sealing space 10 formed by the sealing member 20, for example. A connecting member (wiring) for electrically connecting the light emitting element 2 and the driving element is provided on the surface 1A of the substrate 1. The sealing member 20 has a sealing space 1 for disposing the light emitting element 2 between the sealing member 20 and the substrate 1.
0 is formed and connected to the substrate 1 via an adhesive 8.

The sealing member 20 is formed in a U shape that is downwardly viewed in cross section, and forms a sealing space 10 with the substrate 1. The sealing member 20 has a second region 42 that is bonded to the first region 41 of the substrate 1. The first region 41 is set outside the portion of the surface 1A of the substrate 1 where the light emitting element 2 is provided. The second region 42 is set on the lower end surface of the sealing member 20 and faces the first region 41. A sealing space for sealing the light emitting element 2 between the flat substrate 1 and the sealing member 20 by bonding the first region 41 and the second region 42 via the adhesive 8. 10 is formed.

The light emitting element 2 includes an anode 3 formed on the surface 1A of the substrate 1, an organic layer 11 capable of emitting light, and a cathode 7. The anode 3 and the cathode 7 are provided so as to sandwich the organic layer 11. The organic layer 11 includes a hole injection layer 4, a hole transporting intermediate layer 5, and a light emitting layer 6. Hole injection layer 4
The hole transporting intermediate layer 5 is a layer provided between the light emitting layer 6 and the anode 3.

The anode 3 of the light emitting element 2 provided in the sealed space 10 is electrically connected to the driving element via a connection member (wiring). Although not shown, the cathode 7 of the light emitting element 2 is also electrically connected to the driving element. Power (current) including a drive signal is supplied from the drive element to the anode 3 and the cathode 7 of the light emitting element 2. Further, a desiccant 9 called a getter agent is provided in the sealed space 10. The desiccant 9 is provided on the ceiling surface 20 </ b> B of the sealing member 20 facing the surface 1 </ b> A of the substrate 1. The desiccant 9 suppresses deterioration of the light emitting element 2 due to moisture, etc.
Good sealing performance can be maintained for a long time.

The sealing member 20 blocks the intrusion of air including moisture and oxygen from the external space into the sealing space 10. The forming material for forming the sealing member 20 is not particularly limited as long as it has a desired sealing performance. For example, a material having a low moisture permeability such as glass, quartz, synthetic resin, or metal is used. Can do. As the glass, for example, soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, silica glass and the like can be used. As the synthetic resin, a transparent synthetic resin such as polyolefin, polyester, polyacrylate, polycarbonate, polyether ketone, or the like can be used. As the metal, aluminum, stainless steel, or the like can be used.

The desiccant 9 is not particularly limited as long as it has a desired drying function (moisture absorption function) in the sealed space 10. For example, silica gel, zeolite, activated carbon, calcium oxide, germanium oxide, barium oxide, magnesium oxide, Phosphorus pentoxide, calcium chloride, or the like can be used.

The adhesive 8 is provided over the entire first region 41 (or the second region 42). The adhesive 8 is not particularly limited as long as it can maintain a stable adhesive strength and has good airtightness. For the adhesive 8 of this embodiment, a photocurable epoxy resin that is cured by irradiation with ultraviolet light (UV) is used. Note that the adhesive 8 is not limited to a photocurable material, and may be a thermosetting material, or may be cured by mixing two or more different materials.

The organic EL device S of the present embodiment is a so-called bottom emission mode in which light emitted from the light emitting element 2 is extracted from the substrate 1 side to the outside of the device. The substrate 1 is formed of a transparent or translucent material that can transmit light, for example, transparent glass, quartz, sapphire, or a transparent synthetic resin such as polyester, polyacrylate, polycarbonate, or polyetherketone.

The anode 3 injects holes into the hole injection layer 4 by an applied voltage, and is formed of a transparent conductive film such as ITO (Indium Tin Oxide).

The hole injection layer 4 is for transporting and injecting holes of the anode 3 to the light emitting layer 6.
It is provided above. As the hole injection layer 4, a known material can be used, for example,
Polythiophene, polyaniline, polypyrrole, etc. can be used. More specifically, 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT /
PSS) or the like can be used.

The hole transporting intermediate layer 5 is provided between the hole injection layer 4 and the light emitting layer 6 and is provided to improve the hole transportability (injection property) from the anode 3 to the light emitting layer 6. ing. The hole transporting intermediate layer 5 may have a function of retaining electrons in the light emitting layer by blocking electrons. The hole transporting intermediate layer 5 includes, for example, a triphenylamine-based polymer having a good hole transporting property.

The light emitting layer 6 has a function of generating fluorescence by combining holes injected from the anode 3 through the hole injection layer 4 and electrons injected from the cathode 7. As a material for forming the light emitting layer 6, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. For example,
Such as polyfluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinylcarbazole (PVK), polythiophene derivative, polymethylphenylsilane (PMPS), etc. Polysilane or the like can be used.

Further, an electron transport layer may be provided between the light emitting layer 6 and the cathode 7. The electron transport layer is the light emitting layer 6
It plays the role of injecting electrons. Materials for forming the electron transport layer include oxadiazole derivatives, anthraquinodimethane and its derivatives, benzoquinone and its derivatives, naphthoquinone and its derivatives, anthraquinone and its derivatives, tetracyanoanthraquinodimethane and its derivatives, fluorenone derivatives , Diphenyldicyanoethylene and derivatives thereof, diphenoquinone derivatives, metal complexes of 8-hydroxyquinoline and derivatives thereof, and the like can be used.

The cathode 7 is a metal having a low work function that can efficiently inject electrons into the light emitting layer 6, such as aluminum (Al), magnesium (Mg), gold (Au), silver (Ag), calcium (Ca), and the like. It is made of a metal material.

When a driving signal is supplied from the driving element to the light emitting element 2, a current flows between the anode 3 and the cathode 7, the light emitting element 2 emits light, and light is emitted to the outer surface side of the transparent substrate 1. .

Next, a method for manufacturing the organic EL device S having the above-described configuration will be described with reference to the flowchart shown in FIG. The organic EL device S is a droplet discharge device IJ as described later.
And a manufacturing apparatus including the processing apparatus T.

As shown in FIG. 2, the manufacturing method of the organic EL device S according to the present embodiment includes a first step SP <b> 1 for forming the organic layer 11 including the light emitting layer 6 on the substrate 1, and a film formation on the substrate 1. A second step SP2 for irradiating the organic layer 11 with white light in an air atmosphere; and a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The hole injection layer 4,
Before the organic layer 11 including the hole transporting intermediate layer 5 and the light emitting layer 6 is formed, a step of forming the anode 3 on the substrate 1 is performed. In the first step SP1, on the substrate 1 An organic layer 11 is formed on the anode 3 formed in the above.

As shown in FIG. 3, on the surface (active surface) 1A of the substrate 1, an anode 3, a hole injection layer 4, and a hole transporting intermediate layer 5 are provided in this order. When these layers are provided, a known predetermined method such as a photolithography method or a droplet discharge method can be used. Although not shown in FIG. 3, wiring (connection member) and the like are already formed on the surface 1 </ b> A of the substrate 1.

In FIG. 3, a liquid material containing a material for forming the light emitting layer 6 is discharged onto a hole transporting intermediate layer 5 provided on the substrate 1 based on a droplet discharge method (inkjet method). In the droplet discharge method, a forming material for forming a material layer to be formed is a liquid material, and the liquid material is quantitatively discharged using a droplet discharge device such as a dispenser or an inkjet device. In this method, the forming material is applied to a desired region. That is, the amount of liquid per droplet from the nozzle 325 is controlled while the nozzle 325 and the substrate 1 are relatively moved while the nozzle 325 provided in the droplet discharge head (inkjet head) 301 is opposed to the substrate 1. On the substrate 1 (on the hole transporting intermediate layer 5) by discharging a droplet of the liquid material formed
A film pattern having a desired shape is formed on the liquid material. Thus, the light emitting layer 6 is formed on the substrate 1 (on the hole transporting intermediate layer 5).

FIG. 4 is a perspective view showing a schematic configuration of a droplet discharge device (inkjet device) IJ used in a droplet discharge method (inkjet method). In this droplet discharge device IJ, in order to form the organic layer 11 including the light emitting layer 6 on the substrate 1, a liquid material including a material for forming the organic layer 11 is applied to the droplet discharge head on the substrate 1. (Inkjet head) The ink is discharged from the nozzle 325 of the 301. The droplet discharge device IJ is provided on a base 309, a base 309, a stage 307 that supports the substrate 1, and a Y that drives the stage 307 in the Y-axis direction on the base 309.
An axial drive motor 303, a Y-axis guide shaft 305 that guides the movement of the stage 307 in the Y-axis direction, and a droplet discharge head 301 that discharges a liquid material onto the substrate 1 supported by the stage 307 X-axis direction drive motor 3 for driving the droplet discharge head 301 in the X-axis direction
02 and an X-axis direction guide shaft 304 that guides the movement of the droplet discharge head 301 in the X-axis direction.
And a cleaning mechanism 308 and a control device C1 for controlling the operation of the droplet discharge device IJ.

The stage 307 supports the substrate 1 and includes a fixing mechanism (not shown) that fixes the substrate 1 at a reference position. The Y-axis direction guide shaft 305 is fixed so as not to move with respect to the base 309. The stage 307 includes a Y-axis direction drive motor 303. The Y-axis direction drive motor 303 is a stepping motor or the like, and moves the stage 307 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device C1.

The droplet discharge head 301 is a multi-nozzle type droplet discharge head provided with a plurality of nozzles 325, and the longitudinal direction thereof coincides with the X-axis direction. The plurality of nozzles 325 are provided on the lower surface of the droplet discharge head 301 along the X-axis direction at regular intervals. A liquid material droplet is discharged from the nozzle 325 of the droplet discharge head 301 to the substrate 1 supported by the stage 307. An X-axis direction drive motor 302 is connected to the X-axis direction guide shaft 304. The X-axis direction drive motor 302 is a stepping motor or the like, and rotates the X-axis direction guide shaft 304 when a drive signal in the X-axis direction is supplied from the control device C1. When the X-axis direction guide shaft 304 rotates, the droplet discharge head 301 moves in the X-axis direction.

The control device C1 supplies a droplet discharge control voltage to the droplet discharge head 301. Also,
A drive pulse signal for controlling movement of the droplet discharge head 301 in the X-axis direction is supplied to the X-axis direction drive motor 302, and a drive pulse signal for controlling movement of the stage 307 in the Y-axis direction is supplied to the Y-axis direction drive motor 303. .

The cleaning mechanism 308 is for cleaning the droplet discharge head 301. The cleaning mechanism 308 includes a Y-axis direction drive motor (not shown). This Y
The cleaning mechanism 308 moves the Y-axis direction guide shaft 305 by driving the axial drive motor.
Move along. The movement of the cleaning mechanism 308 is also controlled by the control device C1.

FIG. 5 is a schematic configuration diagram of a droplet discharge head for explaining the principle of discharging a liquid material by a piezo method. In FIG. 5, the piezo element 3 is adjacent to the liquid chamber 321 for containing the liquid material.
22 is installed. A liquid material is supplied to the liquid chamber 321 through a supply system 323. The piezo element 322 is connected to a drive circuit 324, and a voltage is applied to the piezo element 322 via the drive circuit 324 to deform the piezo element 322 and elastically deform the liquid chamber 321. Then, a droplet of the liquid material is ejected from the nozzle 325 by the change in the internal volume during the elastic deformation. In this case, the amount of distortion of the piezo element 322 can be controlled by changing the value of the applied voltage. In addition, the strain rate of the piezo element 322 can be controlled by changing the frequency of the applied voltage. Since the droplet discharge by the piezo method does not apply heat to the material, it has an advantage of hardly affecting the composition of the material.

Manufacturing cost can be reduced by forming the light emitting layer 6 using the droplet discharge method. In other words, since the material can be disposed in a desired local region on the substrate 1 in the droplet discharge method, the film formation process is simple and the use material is less wasteful than the photolithography method or the like. .

In addition, although demonstrated here that the light emitting layer 6 was formed into a film using the droplet discharge method, of course,
The hole injection layer 4 and the hole transporting intermediate layer 5 may be formed using the droplet discharge device IJ.

In the present embodiment, the first step SP1 for forming the organic layer 11 including the hole injection layer 4, the hole transporting intermediate layer 5, and the light emitting layer 6 is performed in an air atmosphere. In the present embodiment, the atmospheric atmosphere (air condition) includes, for example, an atmosphere (state) in which the temperature is 15 ° C. or higher, the humidity is 20% or higher, and the oxygen concentration is 18% or higher.

Note that the first step SP1 for forming the organic layer 11 may be performed in an inert gas atmosphere.
As the inert gas, at least one of helium, argon, nitrogen, neon, xenon, and krypton can be used. In the present embodiment, the inert gas atmosphere (inert gas state) includes an atmosphere (state) in which each of the oxygen concentration and the water concentration is 1 ppm or less.

After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on the droplet discharge method, the atmosphere is applied to the light emitting layer 6 (organic layer 11) formed on the substrate 1. A process of irradiating white light in an atmosphere is performed. FIG. 6 is a schematic diagram showing a processing apparatus T that processes the organic layer 11 formed on the substrate 1.

In FIG. 6, the processing apparatus T includes a first space 5 that can accommodate the substrate 1 on which the organic layer 11 is formed.
A second storage device 60 that forms a second space 66 that is provided separately from the first space 56 and that can accommodate the substrate 1 on which the organic layer 11 is formed, An inert gas supply device 51 for making the first space 56 an inert gas atmosphere, an air supply device 52 for making the first space 56 an air atmosphere, and heating the organic layer 11 formed on the substrate 1 Possible heating device 5
3, an irradiation device 68 capable of irradiating the organic layer 11 formed on the substrate 1 with predetermined light, and a substrate on which the organic layer 11 is formed in the second space 66. 1 and an electrode forming device 63 capable of forming a cathode 7 on the organic layer 11 (light emitting layer 6) by vapor deposition, and a first space 5
6 and a second space 66, a transfer device 57 capable of transferring the substrate 1 and a control device C2 for controlling the operation of the processing device T are provided.

The first space 56 and the second space 66 are connected via a passage 59, and the transfer device 57 can move in the passage 59. A door 58 </ b> A is provided between the first space 56 and the passage 59, and a door 58 </ b> B is provided between the second space 66 and the passage 59. Control device C2 is door 5
8A and 58B are used to close the passage 59, thereby preventing gas from entering and leaving between the first space 56 and the second space 66.

One end of a flow path 51A is connected to the inert gas supply device 51, and one end of a flow path 52A is connected to the atmospheric supply device 52. A flow path switching mechanism 54 including a valve is connected to each of the other end of the flow path 51A and the other end of the flow path 52A. Further, the flow path switching mechanism 54 and the first space 5
6 is connected via a flow path 55. The control device C2 can connect the inert gas supply device 51 and the first space 56 via the flow channel 51A and the flow channel 55 by controlling the flow channel switching mechanism 54. When the inert gas supply device 51 and the first space 56 are connected via the flow channel 51A and the flow channel 55, the air supply device 5 is operated by the flow channel switching mechanism 54.
The middle of the flow path 52 </ b> A and the flow path 55 that connect 2 and the first space 56 is blocked. Similarly, the control device C2 controls the flow path switching mechanism 54, so that the air supply device 52 and the first space 5 are controlled.
6 can be connected via the flow path 52A and the flow path 55. When the air supply device 52 and the first space 56 are connected via the flow channel 52A and the flow channel 55, the inert gas supply device 51 and the first space 56 are connected by the flow channel switching mechanism 54. The middle of the flow path 51A and the flow path 55 is blocked. In other words, the control device C2 can supply the inert gas from the inert gas supply device 51 to the first space 56 via the flow channel 51A and the flow channel 55, and then the flow channel 52A and the flow from the atmospheric supply device 52. Air cannot be supplied to the first space 56 via the path 55. Further, the control device C2 can supply the active gas to the first space 56 from the air supply device 52 via the flow channel 52A and the flow channel 55, and then the flow channel 51A and the flow channel from the inert gas supply device 51. The inert gas cannot be supplied to the first space 56 via 55.

The inert gas supply device 51 supplies an inert gas to the first space 56,
The first space 56 is set to an inert gas atmosphere. As described above, as the inert gas, at least one of helium, argon, nitrogen, neon, xenon, and krypton can be used. In the present embodiment, the inert gas supply device 51 supplies nitrogen to the first space 56. The control device C2 uses the inert gas supply device 51, so that the first space 56 is obtained.
The inert gas concentration (the ratio of the inert gas to the atmosphere (active gas)) can be adjusted.
In the present embodiment, the control device C2 fills the first space 56 with nitrogen so that the oxygen concentration in the first space 56 is 1 ppm or less. Further, the control device C2 uses the inert gas supply device 51 to fill the first space 56 with nitrogen so that the moisture concentration in the first space 56 is 1 ppm or less.

The air supply device 52 supplies the air to the first space 56 to make the first space 56 an air atmosphere (an atmosphere having an oxygen concentration of about 20% and a nitrogen concentration of about 80%).

Thus, in the present embodiment, the control device C2 uses the inert gas supply device 51, the air supply device 52, the flow path switching mechanism 54, and the like to divide the first space 56 into the inert gas atmosphere and the atmosphere. It can be adjusted to either one of the atmospheres.

The heating device 53 includes, for example, a hot plate or an oven. In the present embodiment, the heating device 53 includes a hot plate and has a holding surface for holding the substrate 1. The heating device 53 can heat the organic layer 11 including the substrate 1 and the light emitting layer 6 formed on the substrate 1 in a state where the substrate 1 is held by the holding surface. In addition, the heating device 53 can fire the organic layer 11 by heating the organic layer 11 formed on the substrate 1 at a predetermined temperature.

The irradiation device 68 is provided in the first housing device 50 and irradiates the organic layer 11 (light emitting layer 6) formed on the substrate 1 disposed in the first space 56 with predetermined light. In the present embodiment, the irradiation device 68 irradiates the organic layer 11 with white light. As the irradiation device 68, for example, a fluorescent lamp capable of emitting white light is used.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the atmospheric supply device 52 to change the first space 56 in which the substrate 1 is accommodated. The organic layer 11 including the light emitting layer 6 formed on the substrate 1 by using the irradiation device 68 while making the atmosphere.
Is irradiated with white light for a predetermined time. As described above, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with white light in the air atmosphere for a predetermined time.

In the present embodiment, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with white light at normal temperature (for example, 25 ° C.) for about 60 minutes in the air atmosphere. Thus, the processing device T
Irradiates the organic layer 11 formed on the substrate 1 accommodated in the first space 56 in an air atmosphere with white light for a predetermined time.

Note that while the processing is being performed on the organic layer 11 in the first space 56, the door 58A,
While 58 </ b> B is closed, the transfer device 57 is disposed in the passage 59.

Next, the control device C <b> 2 drives the flow path switching mechanism 54 and supplies the inert gas from the inert gas supply device 51 to the first space 56. The inert gas supply device 51 makes the first space 56 an inert gas atmosphere (nitrogen gas atmosphere) by supplying an inert gas to the first space 56.

The control device C2 uses the inert gas supply device 51, and the first space 56 in which the substrate 1 is accommodated.
The organic layer 11 including the light emitting layer 6 formed on the substrate 1 is heated and baked using the heating device 53. As described above, the control device C2 heats the organic layer 11 formed on the substrate 1 in an inert gas atmosphere.

When heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere, the control device C2 heats the organic layer 11 at 100 ° C. or higher for a predetermined time. In the present embodiment, the control device C2 heats and bakes the organic layer 11 formed on the substrate 1 in an inert gas at about 130 ° C. for about 60 minutes. As described above, the processing apparatus T heats and bakes the organic layer 11 formed on the substrate 1 accommodated in the first space 56 in an inert gas atmosphere.

Note that while the processing is being performed on the organic layer 11 in the first space 56, the door 58A,
While 58 </ b> B is closed, the transfer device 57 is disposed in the passage 59.

After the completion of the second step SP2 and the third step SP3, the control device C2 uses the electrode forming device 63.
Is used to form the cathode 7 on the organic layer 11 (light emitting layer 6). After the processing for the organic layer 11 in the first space 56 is completed, the control device C2 opens the door 58A to enter the transport device 57 into the first space 56, and uses the transport device 57 to move the substrate 1 from the first space 56. Unload. After unloading the substrate 1 from the first space 56 using the transfer device 57, the control device C2 closes the door 58A. After the control device C2 closes the door 58A, the control device C2 opens the door 58B and holds the substrate 1.
7 enters the second space 66. Then, after placing the substrate 1 on a holding member (not shown) provided in the second space 66, the control device C2 moves the transfer device 57 to the passage 59 and closes the door 58B. As a result, the substrate 1 on which the organic layer 11 is formed is accommodated in the second space 66.

The electrode forming device 63 provided in the second space 66 of the second storage device 60 includes a vapor deposition device, and the control device C2 completes the processing in the first space 56 and is stored in the second space 66. A cathode 7 is formed on the organic layer 11 (light emitting layer 6) formed on 1 by vapor deposition. In the present embodiment, the electrode forming device 63 deposits aluminum on the organic layer 11. Moreover, when vapor-depositing aluminum on the organic layer 11, the control device C2 makes the second space 66 a vacuum and vapor-deposits it. Thereby, the cathode 7 made of aluminum is formed on the organic layer 11. Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

When the substrate 1 is transferred from the first space 56 to the second space 66, the first space 56, the passage 5
9 and the atmosphere (including oxygen and moisture) in the second space 66 are sufficiently reduced, and the control device C
2, after completion of the third step SP3 which is a baking step, the organic layer 11 can be accommodated in the second space 66 without being exposed to the atmosphere and vacuum-deposited.

Further, while the processing is being performed on the organic layer 11 in the second space 66, the door 58A,
While 58 </ b> B is closed, the transfer device 57 is disposed in the passage 59.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1. When the adhesive 8 is applied on the substrate 1, a droplet discharge method can be used. After the adhesive 8 is applied to the first region 41 of the substrate 1, the first region 41 of the substrate 1 and the second region 42 of the sealing member 20 including the desiccant 9 are bonded together via the adhesive 8. It is done. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). In this case, a mask that blocks light can be disposed at a predetermined position so that the light emitting element 2 is not irradiated with light for curing the adhesive 8. Thus, by connecting the sealing member 20 to the substrate 1, a sealing space 10 for arranging the light emitting element 2 is formed between the substrate 1 and the sealing member 20. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the organic layer 11 formed on the substrate 1 is inactivated. The light emission lifetime of the light emitting element 2 (organic EL device S) could be extended by irradiating white light in the air atmosphere before heating and baking in the gas atmosphere.

This is because when the organic layer 11 including the light-emitting layer 6 is irradiated with white light in an air atmosphere, the oxygen component remaining in the organic layer 11 reacts with the organic substance, and the organic EL device S after manufacture is driven. (
It is considered that one reason is that the oxidation-reduction reaction during the application of power to the organic layer 11 is suppressed. That is, there is a possibility that oxygen is present in the organic layer 11 formed in the first step SP1 due to oxygen or the like dissolved in the solvent of the liquid material including the material for forming the organic layer 11. There is. If the oxygen is allowed to stand, an oxidation-reduction reaction occurs when the organic EL device S after manufacture is driven (when power is applied to the organic layer 11), and the organic layer 11 deteriorates due to the oxidation-reduction reaction. , There is a possibility that the light emission life is reduced. In this embodiment,
Even if oxygen is present in the organic layer 11 formed in the first step SP1, the first step SP1
After that, until the cathode 7 is formed, the organic layer 11 is irradiated with white light in the air atmosphere, and oxygen present in the organic layer 11 is reacted with an organic substance, whereby the organic EL device S after manufacture is manufactured. There is a possibility that the oxidation-reduction reaction during driving (when power is applied to the organic layer 11) can be suppressed.

As described above, the organic layer 11 formed on the substrate 1 is irradiated with white light in an air atmosphere, and then heated and fired in an inert gas atmosphere, whereby the light-emitting element 2 (organic EL device). The light emission life of S) can be extended.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is simplified or omitted.

FIG. 7 is a flowchart for explaining a method of manufacturing the organic EL device S according to the second embodiment. As shown in FIG. 7, the manufacturing method of the organic EL device S in the present embodiment includes a substrate 1
A first step SP1 for forming the organic layer 11 including the above-described light emitting layer 6 thereon, a second step SP2 for irradiating the organic layer 11 formed on the substrate 1 with white light in an air atmosphere, and a substrate And a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The third step SP3 is performed after the first step SP1 and before the second step SP2. Is provided. That is,
In the manufacturing method of the second embodiment, the order of the second step SP2 and the third step SP3 is switched compared to the manufacturing method of the first embodiment described above.

Similar to the first embodiment described above, an anode 3 and a hole injection layer 4 are formed on the surface (active surface) 1A of the substrate 1.
The hole transporting intermediate layer 5 and the light emitting layer 6 are provided in this order. After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on a droplet discharge method or the like, the light emitting layer 6 (organic layer 11) formed on the substrate 1 is formed. Heat treatment is performed in an inert gas atmosphere.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the inert gas supply device 51 and the first space in which the substrate 1 is accommodated. The organic layer 11 including the light emitting layer 6 formed on the substrate 1 is heated and baked by using the heating device 53 while making 56 an inert gas atmosphere. As described above, the control device C2 heats the organic layer 11 formed on the substrate 1 in an inert gas atmosphere.

As in the first embodiment, the control device C2 heats and burns the organic layer 11 formed on the substrate 1 at about 130 ° C. for about 60 minutes in an inert gas atmosphere.

Next, the control device C <b> 2 drives the flow path switching mechanism 54 to supply air from the air supply device 52 to the first space 56. The air supply device 52 makes the first space 56 an air atmosphere by supplying air to the first space 56.

The control device C2 uses the air supply device 52 to make the first space 56 in which the substrate 1 is accommodated an air atmosphere, and includes the light emitting layer 6 formed on the substrate 1 using the irradiation device 68. The organic layer 11 is irradiated with white light.

As in the first embodiment described above, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with white light for about 60 minutes in an air atmosphere.

After the third step SP3 and the second step SP2 are completed, the control device C2 uses the transfer device 57 to transfer the substrate 1 from the first space 56 to the second space 66, and uses the electrode forming device 63 to perform organic processing. A cathode 7 is formed on the layer 11 (light emitting layer 6). Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1,
The first region 41 of the substrate 1 and the second region 42 of the sealing member 20 provided with the desiccant 9 are bonded together with the adhesive 8. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). Thus, by connecting the sealing member 20 to the substrate 1, the light emitting element 2 is interposed between the substrate 1 and the sealing member 20.
A sealing space 10 is formed for placing the. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the organic layer 11 formed on the substrate 1 is inactivated. After heating and baking in a gas atmosphere, the light emission lifetime of the light-emitting element 2 (organic EL device S) could be extended by irradiating with white light in the air atmosphere.

As described above, the organic layer 11 formed on the substrate 1 is heated in an inert gas atmosphere, and then irradiated with white light in the air atmosphere, so that the light emitting element 2 (organic EL device S)
The light emission life can be extended.

<Third Embodiment>
Next, a third embodiment will be described. FIG. 8 is a flowchart for explaining a method of manufacturing the organic EL device S according to the third embodiment. As shown in FIG. 8, the manufacturing method of the organic EL device S according to the present embodiment includes a first step SP <b> 1 for forming the organic layer 11 including the light emitting layer 6 on the substrate 1, and a film formation on the substrate 1. A second step SP2a for irradiating the formed organic layer 11 with ultraviolet light in an air atmosphere, and a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The second step SP2a is performed after the first step SP1 and before the third step SP3. In the present embodiment, a UV irradiation device capable of emitting ultraviolet light is used as the irradiation device 68. In the present embodiment, the irradiation device 68 is, for example, 50 m.
Irradiate with ultraviolet light having a peak at a wavelength of 365 nm or 254 nm at W / cm ² or less.

Similar to the above-described embodiment, on the surface (active surface) 1A of the substrate 1, the anode 3, the hole injection layer 4, the hole transporting intermediate layer 5, and the light emitting layer 6 are provided in this order. After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on a droplet discharge method or the like, the light emitting layer 6 formed on the substrate 1 is formed.
The (organic layer 11) is subjected to a process of irradiating with ultraviolet light in an air atmosphere.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the atmospheric supply device 52 to change the first space 56 in which the substrate 1 is accommodated. The organic layer 11 including the light emitting layer 6 formed on the substrate 1 by using the irradiation device 68 while making the atmosphere.
Is irradiated with ultraviolet light. As described above, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light in the air atmosphere.

In the present embodiment, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light for about 1 minute in an air atmosphere.

Next, the control device C <b> 2 drives the flow path switching mechanism 54 and supplies the inert gas from the inert gas supply device 51 to the first space 56. The inert gas supply device 51 makes the first space 56 an inert gas atmosphere by supplying an inert gas to the first space 56.

The control device C2 uses the inert gas supply device 51, and the first space 56 in which the substrate 1 is accommodated.
The organic layer 11 including the light emitting layer 6 formed on the substrate 1 is heated and baked using the heating device 53.

As in the first embodiment, the control device C2 heats and burns the organic layer 11 formed on the substrate 1 at about 130 ° C. for about 60 minutes in an inert gas atmosphere.

After the second step SP2a and the third step SP3 are completed, the control device C2 uses the transfer device 57 to transfer the substrate 1 from the first space 56 to the second space 66, and uses the electrode forming device 63 to perform organic processing. A cathode 7 is formed on the layer 11 (light emitting layer 6). Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1,
The first region 41 of the substrate 1 and the second region 42 of the sealing member 20 provided with the desiccant 9 are bonded together with the adhesive 8. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). Thus, by connecting the sealing member 20 to the substrate 1, the light emitting element 2 is interposed between the substrate 1 and the sealing member 20.
A sealing space 10 is formed for placing the. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the atmosphere is applied to the organic layer 11 formed on the substrate 1. After irradiating with ultraviolet light, heating and baking in an inert gas atmosphere enabled the light emission lifetime of the light-emitting element 2 (organic EL device S) to be extended.

As described above, the organic layer 11 formed on the substrate 1 is irradiated with ultraviolet light in the air atmosphere, and then heated in an inert gas atmosphere, so that the light-emitting element 2 (organic EL device S)
The light emission life can be extended.

<Fourth embodiment>
Next, a fourth embodiment will be described. FIG. 9 is a flowchart for explaining a method of manufacturing the organic EL device S according to the fourth embodiment. As shown in FIG. 9, the manufacturing method of the organic EL device S according to the present embodiment includes a first step SP <b> 1 for forming the organic layer 11 including the light emitting layer 6 on the substrate 1, and a film formation on the substrate 1. A second step SP2a for irradiating the formed organic layer 11 with ultraviolet light in an air atmosphere, and a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The third step SP3 is performed after the first step SP1 and before the second step SP2a. That is, in the manufacturing method of the fourth embodiment, the order of the second step SP2a and the third step SP3 is switched compared to the manufacturing method of the third embodiment described above.

Similar to the above-described embodiment, on the surface (active surface) 1A of the substrate 1, the anode 3, the hole injection layer 4, the hole transporting intermediate layer 5, and the light emitting layer 6 are provided in this order. After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on a droplet discharge method or the like, the light emitting layer 6 formed on the substrate 1 is formed.
(Organic layer 11) is subjected to heat treatment in an inert gas atmosphere.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the inert gas supply device 51 and the first space in which the substrate 1 is accommodated. The organic layer 11 including the light emitting layer 6 formed on the substrate 1 is heated and baked by using the heating device 53 while making 56 an inert gas atmosphere. As described above, the control device C2 heats the organic layer 11 formed on the substrate 1 in an inert gas atmosphere.

As in the above-described embodiment, the control device C2 heats and bakes the organic layer 11 formed on the substrate 1 in an inert gas atmosphere at about 130 ° C. for about 60 minutes.

Next, the control device C <b> 2 drives the flow path switching mechanism 54 to supply air from the air supply device 52 to the first space 56. The air supply device 52 makes the first space 56 an air atmosphere by supplying air to the first space 56.

The control device C2 uses the air supply device 52 to make the first space 56 in which the substrate 1 is accommodated an air atmosphere, and includes the light emitting layer 6 formed on the substrate 1 using the irradiation device 68. The organic layer 11 is irradiated with ultraviolet light.

Similar to the above-described embodiment, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light for about 1 minute in an air atmosphere.

After the third step SP3 and the second step SP2a are completed, the control device C2 uses the transfer device 57 to transfer the substrate 1 from the first space 56 to the second space 66, and uses the electrode forming device 63 to perform organic processing. A cathode 7 is formed on the layer 11 (light emitting layer 6). Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1,
The first region 41 of the substrate 1 and the second region 42 of the sealing member 20 provided with the desiccant 9 are bonded together with the adhesive 8. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). Thus, by connecting the sealing member 20 to the substrate 1, the light emitting element 2 is interposed between the substrate 1 and the sealing member 20.
A sealing space 10 is formed for placing the. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the organic layer 11 formed on the substrate 1 is inactivated. After heating and baking in a gas atmosphere, the emission life of the light-emitting element 2 (organic EL device S) could be extended by irradiating with ultraviolet light in the air atmosphere.

As described above, the organic layer 11 formed on the substrate 1 is heated in an inert gas atmosphere, and then irradiated with ultraviolet light in the air atmosphere, whereby the light emitting element 2 (organic EL device S).
The light emission life can be extended.

<Fifth Embodiment>
Next, a fifth embodiment will be described. FIG. 10 is a flowchart for explaining a method of manufacturing the organic EL device S according to the fifth embodiment. As shown in FIG. 10, the manufacturing method of the organic EL device S in the present embodiment includes a first step SP <b> 1 for forming the organic layer 11 including the light emitting layer 6 on the substrate 1, and a film formation on the substrate 1. A second step SP2b for irradiating the formed organic layer 11 with ultraviolet light in an inert gas atmosphere, and a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The second step SP2b is performed after the first step SP1,
And it is performed before the third step SP3.

Similar to the above-described embodiment, on the surface (active surface) 1A of the substrate 1, the anode 3, the hole injection layer 4, the hole transporting intermediate layer 5, and the light emitting layer 6 are provided in this order. After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on a droplet discharge method or the like, the light emitting layer 6 formed on the substrate 1 is formed.
(Organic layer 11) is irradiated with ultraviolet light in an inert gas atmosphere.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the inert gas supply device 51 and the first space in which the substrate 1 is accommodated. While making 56 an inert gas atmosphere, the irradiation device 68 is used to irradiate the organic layer 11 including the light emitting layer 6 formed on the substrate 1 with ultraviolet light. As described above, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light in an inert gas atmosphere.

In the present embodiment, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light in an inert gas atmosphere for about 3 minutes.

Next, the controller C2 uses the inert gas supply device 51 to maintain the inert gas atmosphere in the first space 56 in which the substrate 1 is accommodated, and uses the heating device 53 to form the substrate 1 on the substrate 1. The organic layer 11 including the formed light emitting layer 6 is heated and baked.

As in the above-described embodiment, the control device C2 heats and bakes the organic layer 11 formed on the substrate 1 in an inert gas atmosphere at about 130 ° C. for about 60 minutes.

After the completion of the second step SP2b and the third step SP3, the control device C2 uses the transfer device 57 to transfer the substrate 1 from the first space 56 to the second space 66, and uses the electrode forming device 63 to perform organic processing. A cathode 7 is formed on the layer 11 (light emitting layer 6). Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1,
The first region 41 of the substrate 1 and the second region 42 of the sealing member 20 provided with the desiccant 9 are bonded together with the adhesive 8. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). Thus, by connecting the sealing member 20 to the substrate 1, the light emitting element 2 is interposed between the substrate 1 and the sealing member 20.
A sealing space 10 is formed for placing the. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the organic layer 11 formed on the substrate 1 is inactive. After irradiation with ultraviolet light in a gas atmosphere, the light-emitting element 2 is heated and fired in an inert gas atmosphere.
The light emission life of (organic EL device S) could be extended.

As described above, the organic layer 11 formed on the substrate 1 is irradiated with ultraviolet light in an inert gas atmosphere and then heated in the inert gas atmosphere, whereby the light emitting element 2 (organic EL device) The light emission life of S) can be extended.

<Sixth Embodiment>
Next, a sixth embodiment will be described. FIG. 11 is a flowchart for explaining a method of manufacturing the organic EL device S according to the sixth embodiment. As shown in FIG. 11, in the method for manufacturing the organic EL device S in the present embodiment, the first step SP <b> 1 for forming the organic layer 11 including the light emitting layer 6 on the substrate 1 and the film formation on the substrate 1 are performed. A second step SP2b for irradiating the formed organic layer 11 with ultraviolet light in an inert gas atmosphere, and a third step SP3 for heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere. The third step SP3 is performed after the first step SP1 and before the second step SP2b. That is, the manufacturing method according to the sixth embodiment is the same as the fifth method described above.
Compared with the manufacturing method of the embodiment, the order of the second step SP2b and the third step SP3 is switched.

Similar to the above-described embodiment, on the surface (active surface) 1A of the substrate 1, the anode 3, the hole injection layer 4, the hole transporting intermediate layer 5, and the light emitting layer 6 are provided in this order. After forming the light emitting layer 6 on the substrate 1 (on the hole transporting intermediate layer 5) based on a droplet discharge method or the like, the light emitting layer 6 formed on the substrate 1 is formed.
(Organic layer 11) is subjected to heat treatment in an inert gas atmosphere.

After the substrate 1 on which the organic layer 11 including the light emitting layer 6 is formed is accommodated in the first space 56, the control device C <b> 2 uses the inert gas supply device 51 and the first space in which the substrate 1 is accommodated. The organic layer 11 including the light emitting layer 6 formed on the substrate 1 is heated and baked by using the heating device 53 while making 56 an inert gas atmosphere. As described above, the control device C2 heats the organic layer 11 formed on the substrate 1 in an inert gas atmosphere.

As in the above-described embodiment, the control device C2 heats and bakes the organic layer 11 formed on the substrate 1 in an inert gas atmosphere at about 130 ° C. for about 60 minutes.

Next, the control device C2 uses the inert gas supply device 51 to maintain the inert gas atmosphere in the first space 56 in which the substrate 1 is accommodated, and uses the irradiation device 68 to form the substrate 1 on the substrate 1. The organic layer 11 including the formed light emitting layer 6 is irradiated with ultraviolet light.

Similar to the above-described embodiment, the control device C2 irradiates the organic layer 11 formed on the substrate 1 with ultraviolet light for about 3 minutes in an inert gas atmosphere.

After the third step SP3 and the second step SP2b are completed, the control device C2 uses the transfer device 57 to transfer the substrate 1 from the first space 56 to the second space 66, and uses the electrode forming device 63 to perform organic processing. A cathode 7 is formed on the layer 11 (light emitting layer 6). Thus, the light emitting element 2 having the anode 3, the organic layer 11, and the cathode 7 is formed on the substrate 1.

After the light emitting element 2 is formed on the substrate 1, the adhesive 8 is applied to the first region 41 of the substrate 1,
The first region 41 of the substrate 1 and the second region 42 of the sealing member 20 provided with the desiccant 9 are bonded together with the adhesive 8. Next, when a photocurable adhesive is used as the adhesive 8, the adhesive 8 is irradiated with light having a predetermined wavelength (ultraviolet light). Thus, by connecting the sealing member 20 to the substrate 1, the light emitting element 2 is interposed between the substrate 1 and the sealing member 20.
A sealing space 10 is formed for placing the. Thus, the organic EL device S is manufactured.

In the present embodiment, the anode 3 is formed on the substrate 1, the organic layer 11 including the light emitting layer 6 is formed on the anode 3, and then the organic layer 11 formed on the substrate 1 is inactivated. After heating and baking in a gas atmosphere, the light emitting element 2 is irradiated with ultraviolet light in an inert gas atmosphere.
The light emission life of (organic EL device S) could be extended.

As described above, the organic layer 11 formed on the substrate 1 is heated in an inert gas atmosphere and then irradiated with ultraviolet light in the inert gas atmosphere, so that the light emitting element 2 (organic EL device) The light emission life of S) can be extended.

In the first to sixth embodiments described above, a step of heating the organic layer 11 formed on the substrate 1 in an inert gas atmosphere and a predetermined amount of the organic layer 11 formed on the substrate 1 are predetermined. Each of the process of irradiating predetermined light (white light or ultraviolet light) in a gas atmosphere (in an inert gas atmosphere or in an air atmosphere) is performed in the same first space 56, but in different spaces. You may go.

In each of the above-described embodiments, the control device C2 includes the organic layer 1 formed on the substrate 1.
1, it is explained that predetermined light (white light or ultraviolet light) is irradiated at room temperature (for example, 25 ° C.), but predetermined light is irradiated for a predetermined time at a temperature higher than normal temperature (for example, 50 ° C.). May be.

In each of the above-described embodiments, an irradiation device having a function capable of irradiating white light and ultraviolet light is used as the irradiation device 68, and the white light and the ultraviolet light are appropriately switched and irradiated. Good.

In each of the above-described embodiments, the organic layer 11 may be irradiated with white light in an inert gas atmosphere.

In each of the above-described embodiments, either one of the air atmosphere and the inert gas atmosphere is irradiated with either white light or ultraviolet light, as long as the light emission life can be extended. The light having a predetermined wavelength can be irradiated in an arbitrary atmosphere.

<Optical writing head>
FIG. 12 is a diagram showing an example in which the above-described organic EL device S is applied to an optical writing head (printer head) of an electrophotographic printer. In FIG. 12, an optical system 70 is provided above the substrate 1 of the organic EL device S, and a photosensitive drum (photosensitive member) 71 is provided above the optical system 70. The organic EL device S irradiates the photosensitive drum 71 with light via the optical system 70. Light emitted from the substrate 1 of the organic EL device S is condensed on the photosensitive drum 71 through the optical system 70. Since the organic EL device S has a long life, the photosensitive drum 71 can be satisfactorily exposed and an image can be formed satisfactorily using the photosensitive drum 71.

<Electronic equipment>
Next, an example of an electronic apparatus provided with the organic EL device S of the above embodiment will be described.
FIG. 13A is a perspective view illustrating an example of a mobile phone. In FIG. 13A, reference numeral 1000 denotes a mobile phone body, and reference numeral 1001 denotes a full-color display unit using the organic EL device S described above.

FIG. 13B is a perspective view illustrating an example of a wristwatch-type electronic device. In FIG. 13B, reference numeral 1100 denotes a watch body, and reference numeral 1101 denotes a full-color display unit using the organic EL device S described above.

FIG. 13C is a perspective view illustrating an example of a portable information processing device such as a word processor or a personal computer. In FIG. 13C, reference numeral 1200 denotes an information processing apparatus, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus body, and reference numeral 1206 denotes a full-color display unit using the organic EL device S described above. Yes.

Since the electronic device shown in FIGS. 13A to 13C includes the organic EL device S of the above embodiment, it is possible to provide a compact electronic device having desired performance.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, the above-described organic EL device S can be used as an illumination light source capable of surface emission, and can be used as a backlight constituting a display unit of a liquid crystal display device, for example. Moreover, the organic EL device S of each of the above-described embodiments can be applied to, for example, a monochrome display.

For example, in the above-described embodiment, the light emission of the light-emitting element 2 is described using a form in which the light emission of the light-emitting element 2 is emitted to the outer surface side through the substrate 1, that is, so-called bottom emission. It is also possible to use a so-called top emission type that is emitted from the cathode 7 side through the sealing member 20. In this case, as the sealing member 20 and the cathode 7, a transparent or translucent material capable of extracting light is used.

In the above embodiment, the droplet discharge method (inkjet method) is used when forming the light emitting layer 6 and the adhesive 8 described above, but other predetermined methods can be used as a matter of course. .
For example, in order to form the light emitting layer 6, a spin coating method, a dip method, or the like can be used.

It is principal part sectional drawing which shows the organic electroluminescent apparatus which concerns on 1st Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 1st Embodiment. It is a schematic diagram for demonstrating a mode that the light emitting layer is formed into a film. It is a figure for demonstrating a droplet discharge apparatus. It is a figure for demonstrating a droplet discharge head. It is a figure for demonstrating the manufacturing apparatus of the organic EL apparatus which concerns on 1st Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 2nd Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 3rd Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 4th Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 5th Embodiment. It is a flowchart figure for demonstrating the manufacturing method of the organic electroluminescent apparatus concerning 6th Embodiment. It is a figure for demonstrating the example which applied the organic EL apparatus to the optical writing head. It is a figure which shows an example of the electronic device provided with the organic EL apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Light emitting element, 3 ... Anode, 4 ... Hole injection layer, 5 ... Hole transportable intermediate layer, 6 ... Light emitting layer, 7 ... Cathode, 11 ... Cathode, 50 ... 1st accommodating apparatus, 51 ... Inert gas supply device, 52 ...
Atmospheric supply device, 53 ... heating device, 56 ... first space, 60 ... second storage device, 63 ... electrode forming device, 66 ... second space, 68 ... irradiation device, C1, C2 ... control device, IJ ... droplet Discharge device,
S ... Organic EL device, T ... Processing device

Claims (12)

In a method for producing an organic electroluminescence device having an organic layer capable of emitting light,
A first step of forming the organic layer on a substrate;
A second step of heating the organic layer formed on the substrate in an inert gas atmosphere;
A third step of irradiating the organic layer formed on the substrate with predetermined light in a predetermined gas atmosphere,
The method of manufacturing an organic electroluminescence device, wherein the third step is performed at least one of before and after the second step. In the first step, the organic layer is formed on a first electrode formed on the substrate,
The manufacturing method according to claim 1, wherein a second electrode is formed on the organic layer after the second step and the third step are completed. The manufacturing method according to claim 1, wherein in the third step, the organic layer is irradiated with white light in an air atmosphere. The manufacturing method according to claim 1, wherein in the third step, the organic layer is irradiated with ultraviolet light in an air atmosphere. The method according to claim 1 or 2, wherein the third step irradiates the organic layer with ultraviolet light in an inert gas atmosphere. The manufacturing method according to claim 1, wherein the inert gas includes at least one of helium, argon, nitrogen, neon, xenon, and krypton. The said 1st process discharges the liquid material containing the material for forming the said organic layer on the said board | substrate based on the droplet discharge method, The Claim 1 characterized by the above-mentioned. Production method. In an apparatus for manufacturing an organic electroluminescence device having an organic layer capable of emitting light,
A first processing apparatus capable of heating the organic layer formed on the substrate in an inert gas atmosphere;
A second processing apparatus capable of irradiating the organic layer formed on the substrate with a predetermined light in a predetermined gas atmosphere;
And a control device for processing the organic layer with the second processing device at least before and after processing the organic layer formed on the substrate with the first processing device. An apparatus for manufacturing an organic electroluminescence device. A first accommodating device that forms a first space capable of accommodating the substrate on which the organic layer is formed;
An adjustment device capable of adjusting the first space to one of an inert gas atmosphere and an air atmosphere;
The first processing apparatus includes a heating apparatus for heating and baking the organic layer formed on the substrate housed in the first space in the inert gas atmosphere,
The second processing apparatus may be configured to emit white light or ultraviolet light on the organic layer formed on the substrate housed in the first space in either the inert gas atmosphere or the air atmosphere. The manufacturing apparatus according to claim 8, further comprising an irradiation apparatus that irradiates one of them. 9. A droplet discharge device for discharging a liquid material containing a material for forming the organic layer onto the substrate in order to form the organic layer on the substrate. 9. The manufacturing apparatus according to 9. The droplet discharge device forms the organic layer on a first electrode formed on the substrate,
The electrode forming apparatus for forming a second electrode on the organic layer after the processing of the first processing apparatus and the second processing apparatus is completed. The manufacturing apparatus as described. 12. The electrode forming apparatus according to claim 11, wherein the electrode forming apparatus includes a second space, and the second electrode is formed by vapor deposition by accommodating the substrate on which the organic layer is formed in the second space. Manufacturing equipment.

Images