JP2007201273A - Manufacturing method of electronic component and conductor paste for ceramic green sheet with conductor layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic component capable of forming a high dimensional accuracy and highly precise conductor without delamination, and to provide conductor paste for ceramic green sheet with conductor layer. <P>SOLUTION: The manufacturing method of electronic component comprises a process of forming a conductor layer 2 by applying conductor paste 2a on a substrate 1 and drying the same; a process of forming the ceramic green sheet 3 with conductor layer by applying ceramic slurry 3a on the substrate 1 on which the conductor layer 2 is formed, and drying the same by heat treatment; a process of forming a ceramic green sheet laminate 4 by laminating a plurality of the ceramic green sheets 3 with conductor layer; and a process of calcining the ceramic green sheet laminate 4. The conductor paste 2a contains molten components becoming a molten state by heat treatment when drying the ceramic slurry 3a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a conductor paste for a ceramic green sheet with a conductor layer used for manufacturing an electronic component such as a multilayer ceramic wiring board, and a method for manufacturing the electronic component.

  In recent years, with the miniaturization of electronic devices, miniaturization and high performance are also desired in electronic components such as multilayer capacitors and multilayer ceramic wiring boards used in the electronic devices. For example, multilayer capacitors are required to have multilayered thinner dielectric layers and conductor layers for miniaturization and higher capacity. In addition, in order to reduce the size and increase the density of wiring conductors in multilayer ceramic wiring boards, thinner insulating layers and wiring conductor layers are formed in multiple layers, and the width and spacing of wiring conductor layers are required to be finer. ing.

  Such electronic parts are made by adding an organic binder, a plasticizer, a solvent, etc. to ceramic powder to form a slurry, forming a ceramic green sheet (hereinafter also referred to as a green sheet) with a doctor blade, etc., and then a conductor containing a metal powder. A conductive layer is formed on the green sheet by printing a paste, etc., and then a green sheet on which a plurality of conductive layers are formed is laminated and pressed to obtain a laminated body. Can be obtained by firing.

  However, if a large number of green sheets on which conductor layers are formed are stacked in response to the above-described requirements for electronic components, the difference in thickness between the area where the conductor layers are formed overlaps with other areas. For this reason, when the laminated green sheets are pressed in the thickness direction, the pressure is sufficiently applied in the portion where the regions where the conductor layers are formed overlap, but the pressure is not sufficiently applied in the other portions, It tends to result in insufficient crimping. As a result, when such a laminate is fired, there is a problem in that delamination (delamination) occurs at a portion where the pressure bonding is insufficient.

On the other hand, a ceramic green sheet with a flat conductor layer is formed by applying a ceramic slurry onto a support having a conductor layer formed on the surface, as described in Patent Document 1, and then drying and peeling. A manufacturing method has been proposed.
Japanese Patent Laid-Open No. 50-64768

  However, in the production method as described in Patent Document 1, when the ceramic green sheet with a conductor layer is peeled from the support, the ceramic green sheet and the conductor layer are compared with each other in terms of the adhesive strength between the support and the conductor layer. Since the adhesive strength is weak, there is a possibility that a problem occurs in the bonding state between the conductor layer and the ceramic green sheet.

  If an electronic component is manufactured by laminating and firing a ceramic green sheet with a conductor layer (hereinafter also referred to as a sheet) having a defect in the bonding state of such a conductor layer, it is electrically connected. Is difficult and may cause problems in electrical characteristics.

  The present invention has been completed in order to solve the above-mentioned problems, and a ceramic slurry with a flat conductor layer is obtained by applying a ceramic slurry on a support having a conductor layer formed on the surface, and then drying and peeling. In the manufacturing method of electronic parts formed with green sheets, when applying ceramic slurry or peeling ceramic green sheets with conductor layers, the possibility of failure in the bonding state of the conductor layers is reduced, and connection reliability is reduced. An object of the present invention is to provide a method for manufacturing an electronic component having a high value.

  The method for producing an electronic component of the present invention includes a step of forming a conductor layer by applying a conductor paste on a support and drying, and applying a ceramic slurry on the support on which the conductor layer is formed, and performing a heat treatment A step of forming a ceramic green sheet with a conductor layer, a step of forming a ceramic green sheet laminate by laminating a plurality of ceramic green sheets with a conductor layer, and a step of forming the ceramic green sheet laminate. A step of firing, wherein the conductor paste contains a molten component that is brought into a molten state by a heat treatment when the ceramic slurry is dried.

  In the electronic component manufacturing method according to the present invention, the melting component has a melting point of 40 to 100 ° C.

  The conductor paste for a ceramic green sheet with a conductor layer of the present invention is characterized by containing a molten component that becomes a molten state in the heat treatment in the drying process of the ceramic slurry.

  The conductor paste for a ceramic green sheet with a conductor layer of the present invention is characterized in that the melting point of the molten component is 40 to 100 ° C.

  In the method for producing an electronic component of the present invention, since the conductor paste contains a molten component that becomes a molten state by heat treatment when the ceramic slurry is dried, the ceramic paste with the conductor layer is peeled off from the support. The conductor layer can be made difficult to peel off from the green sheet. That is, due to the heat treatment when the ceramic slurry is applied to the support and dried, the molten component contained in the conductor layer becomes a molten state and diffuses into the ceramic slurry, and the organic binder contained in the conductor layer contains the conductor layer and the ceramic slurry. Therefore, the organic binder contained in the conductor layer and the organic binder contained in the ceramic slurry are firmly bonded at the interface between the conductor layer and the ceramic green sheet. Therefore, a ceramic green sheet with a conductor layer having a sufficient adhesive strength between the conductor layer and the ceramic green sheet can be obtained. By using such a ceramic green sheet with a conductor layer, it is possible to manufacture an electronic component having high connection reliability and excellent electrical characteristics.

  Further, it is preferable that the melting point of the molten component contained in the conductor paste is 40 to 100 ° C. This is because when a conductor having a melting point in this range is used, the conductor layer is formed by changing the state of the molten component according to a slight change in temperature during operation, and the viscosity of the conductor paste is changed accordingly. The conductive layer is free from the occurrence of layer blurring and thickness variation, and when the ceramic slurry is applied and dried, organic components such as the organic binder and plasticizer contained in the ceramic slurry are decomposed to generate organic gas. There is no appearance defect such as bubbles or bumps due to organic gas in the attached ceramic green sheet.

  In addition, the conductor paste for a ceramic green sheet with a conductor layer of the present invention contains a melting component that becomes a molten state by heat treatment when the ceramic slurry is applied and dried, so that the conductor paste is applied and dried. When the ceramic slurry is applied to the support on which the conductor layer is formed and dried by applying a heat treatment, the molten component contained in the conductor layer becomes a molten state and diffuses into the ceramic slurry. Since the organic binder contained can move to the interface between the conductor layer and the ceramic slurry and bond with the organic binder contained in the ceramic slurry, it will have sufficient adhesive strength at the interface between the conductor layer and the ceramic green sheet, A conductor layer produced when the ceramic green sheet with a conductor layer is peeled off from the support; It is possible to reduce the possibility that a problem may appear in the bonding state of the La Mick green sheet.

  The method for manufacturing an electronic component of the present invention will be described in detail below.

  FIG. 1 is a cross-sectional view for each process showing an example of an embodiment of a method of manufacturing an electronic component according to the present invention. 1 is a support, 2 is a conductor layer, 2a is a conductor paste, and 3 is a ceramic green sheet with a conductor layer. 3a is a ceramic slurry, and 4 is a ceramic green sheet laminate.

  First, as shown in FIG. 1A, a conductor layer 2 is formed by applying a conductor paste 2a on a support 1 and drying it. Next, as shown in FIG. 1B, the ceramic green sheet 3 with a conductor layer is formed by applying a ceramic slurry 3a on the support 1 on which the conductor layer 2 is formed and drying it.

  Here, it is important that the conductor paste 2a of the present invention contains a molten component that becomes a molten state by heat treatment when the ceramic slurry 3a is applied and dried.

  When the conductive paste 2a contains a molten component, in the heat treatment when the ceramic slurry 3a is applied to the support 1 and dried, the molten component contained in the conductor layer 2 becomes a molten state and diffuses into the ceramic slurry 3a. Since the organic binder contained in the conductor layer 2 moves to the interface between the conductor layer 2 and the ceramic slurry 3a, the organic binder and ceramic slurry 3a contained in the conductor layer 2 at the interface between the conductor layer 2 and the ceramic green sheet 3 are used. Is firmly bonded to the organic binder contained in the. The molten component contained in the conductor paste 2a moves to the interface between the conductor layer 2 and the support 1 at the time of melting, and the organic binder of the conductor layer 2 moves accordingly, but the organic binder in the conductor paste 2a is In the ceramic slurry 3a containing a liquid such as a solvent, it is easy to move, but it is difficult to move into the solid support 1 formed only by the resin. Since it diffuses only on the surface and does not diffuse as much as the interface between the conductor layer 2 and the ceramic green sheet, the adhesive strength between the conductor layer 2 and the support 1 does not increase as much as the adhesive strength between the conductor layer 2 and the ceramic green sheet. In addition, when a surface treatment layer such as a release layer is formed on the surface of the support 1, the surface treatment layer may be more easily diffused than the support 1 depending on the type of the surface treatment layer, but the surface treatment layer is solid. And since the thickness is thin, the diffusion amount into the surface treatment layer is small compared with the diffusion amount into the ceramic slurry 3a as described above. It does not increase as much as the adhesive strength.

  Thereby, the adhesive strength between the conductor layer 2 and the ceramic green sheet can be sufficiently maintained, and the problem of the joining state of the conductor layer 2 that occurs when the ceramic green sheet 3 with the conductor layer is peeled from the support 1 can be reduced. Therefore, by using the ceramic green sheet 3 with a conductor layer, it is possible to manufacture an electronic component with high conductor connection reliability in which the conductor layer 2 does not peel off.

  Here, the conductor paste 2a is obtained by uniformly dispersing a conductor powder obtained by adding an organic binder, a solvent, a molten component, and, if necessary, a dispersing agent, using a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. After that, the viscosity is adjusted by adding a necessary amount of a solvent.

  The molten component added to the conductor paste 2a is a molten state by heat treatment when the ceramic slurry 3a is dried, and examples thereof include hydrocarbons, fatty acids, esters, fatty alcohols, polyhydric alcohols, and the like. Considering the solubility in a solvent when preparing the slurry, hydrocarbons, esters, fatty alcohols and polyhydric alcohols having a small molecular weight and polarity are preferred. Further, in view of compatibility with the above-described acrylic binder, esters, fatty alcohols, and polyhydric alcohols are more preferable.

  Among the above-mentioned melting components, those having a melting point of 40 to 100 ° C. are preferable. If the melting point of the molten component is lower than 40 ° C., when the conductor layer 2 is formed at room temperature, the state of the molten component changes due to a minute change in temperature at the time of operation, and the viscosity of the conductor paste 2a greatly varies accordingly. As a result, blurring of the conductor layer 2 and variations in thickness occur. If the melting point of the molten component is higher than 100 ° C., the organic component such as the organic binder and plasticizer in the ceramic slurry 3a is decomposed by the heat treatment when the ceramic slurry 3a is applied and dried, and the ceramic green sheet with a conductor layer The appearance defects such as bubbles and bumps due to the organic gas are generated in 3. Here, specific examples of the melting component having a melting point of 40 to 100 ° C. include hexadecanol, polyethylene glycol, polyglycerol, stearylamide, oleylamide, ethylene glycol monostearate, paraffin, stearic acid, and silicone. Can be mentioned.

  The amount of the molten component added is preferably 5 to 10% by mass with respect to the conductor layer 2. By setting it as such a range, while being able to adhere | attach the conductor layer 2 and a ceramic green sheet firmly, the organic binder contained in the conductor layer 2 spread | diffuses, and a conductor layer flows and a blurring generate | occur | produces. Can be reduced.

  The support 1 is a film made of an organic resin such as polyolefin, polyester, polyamide, polyimide, or vinyl chloride. The surface of the support 1 is the surface of the surface treatment layer when a surface treatment layer such as a release agent or an antistatic agent is formed on the surface of the support 1 in consideration of the peelability of the ceramic green sheet. is there. In order to prevent the ceramic green sheet from being deformed due to elongation or the like at the time of peeling from the support 1, it is preferable that a surface treatment layer of a release agent is formed. When the peel strength between the ceramic green sheet and the support 1 and the peel strength between the conductor layer 2 and the support 1 are compared, the organic binder of the conductor paste 2a diffuses to the extreme surface of the support 1, but the organic binder of the ceramic slurry Since the molecular weight is large and does not diffuse to the support 1, the peel strength between the ceramic green sheet and the support 1 is lower.

  As a kind of mold release agent formed in the support body 1, a silicone type, a fluorine type, a long-chain alkyl group containing type, an alkyd resin type, a polyolefin resin type, etc. can be roughly classified. From the viewpoint of heat resistance, releasability and cost, a silicone system is desirable. Moreover, according to the product form, any of a solventless type, an emulsion type, and a solvent type can be used.

  Examples of the conductor material of the conductor powder include one or more of W, Mo, Mn, Au, Ag, Cu, Pd (palladium), Pt (platinum), etc. It is manufactured by a method or the like, and may be subjected to treatments such as oxidation prevention and aggregation prevention if necessary. When two or more kinds of conductor materials are used, two or more kinds of powders may be mixed, or may be a powder in which two or more kinds of materials are integrated by an alloy, coating, or the like. Moreover, fine powder or coarse powder may be removed by classification or the like to adjust the particle size distribution.

  As the organic binder, those conventionally used for the conductor paste 2a can be used. For example, acrylic (acrylic acid, methacrylic acid or a homopolymer or copolymer thereof, specifically acrylic acid Ester copolymers, methacrylate copolymers, acrylic ester-methacrylic ester copolymers, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, etc. A polymer or a copolymer is mentioned. In selecting an organic binder, acrylic and alkyd organic binders are more preferable in consideration of solubility parameters, decomposition in the firing step, and volatility. The amount of the organic binder added varies depending on the conductor powder, but may be any amount that can be easily decomposed and removed during firing and can disperse the conductor particles. Is desirable. Further, the molecular weight Mw of the organic binder may be such that the adhesive strength when diffused to the extreme surface of the support 1 when the conductor paste 2a is applied is such that it does not peel off due to the stress generated when the ceramic slurry 3a is applied. Usually, it may be about 20,000 to 100,000.

  The solvent used for the conductor paste 2a may be any solvent as long as the conductor powder and the organic binder can be well dispersed and mixed, and terpineol, butyl carbitol acetate, or the like can be used. When the solvent is added in an amount of 4 to 15% by mass with respect to the conductor powder, the conductor paste 2a can form the conductor layer 2 by printing, and the viscosity is such that no bleeding of the conductor paste 2a occurs after the conductor layer 2 is formed. It is desirable to be about 40000 cps.

  The solvent added to the conductor paste 2a is preferably a low-boiling solvent in consideration of the formability and drying properties after application of the conductor paste 2a, and considering the workability of application, the boiling point of the solvent is the temperature during operation. Higher than (room temperature) is preferable. Furthermore, in order to suppress the dimensional variation of the support 1 due to the temperature at the time of drying, it is preferably lower than the glass transition point of the support 1 or the melting point of the molten component. Here, the glass transition point of the support 1 is a temperature at which the properties of the resin forming the support 1 change. The glass transition point is glassy below the glass transition point and viscoelastic properties above the glass transition point. When the glass transition point is exceeded, the resin is easily deformed. If the melting point of the molten component is higher than the melting point, the conductive component 2 melts before the solvent volatilizes and the organic binder contained in the conductive paste 2a moves when the conductive paste 2a is applied and dried. This is because of the above. Considering these, the boiling point of the solvent used for the conductive paste 2a is more preferably in the range from 40 ° C. to the glass transition point of the support 1 or the lower melting point of the molten component. For example, when PET (polyethylene terephthalate) having a glass transition point of 70 ° C. is used as the support 1 and hexadecanol having a melting point of 60 ° C. is used as the melting component, the melting point of the melting component is from 35 ° C. Examples thereof include a solvent such as methyl acetate having a boiling point in the range of 60 ° C. and a boiling point of 57 ° C.

  As a method of applying and drying the conductive paste 2a on the support 1, it is applied by a conventionally used printing method such as screen printing or gravure printing, and then hot air dryer, vacuum dryer, or far infrared ray. A dryer such as a dryer can be used.

  The ceramic slurry 3a is prepared by adding an organic binder and a solvent to the ceramic powder and mixing the ceramic powder while crushing it using a mixing device such as a ball mill or a bead mill. In order to adjust the dispersibility of the ceramic powder and the hardness and strength of the ceramic green sheet 3, a dispersant or a plasticizer may be added.

Examples of the ceramic powder used for the ceramic slurry 3a include Al ₂ O ₃ , AlN, glass ceramic powder (a mixture of glass powder and filler powder) and the like for a ceramic wiring board, and BaTiO for a multilayer capacitor. Composite perovskite ceramic powders such as ₃ series and PbTiO ₃ series are listed, and they are appropriately selected according to the characteristics required for electronic parts.

Examples of the glass component of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different and Ca, Sr, Mg , Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ —B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (where M ³ is the same as above) Pb glass, Bi glass and the like.

Further, as the filler powder of the glass ceramic powder, for example, a composite oxide of Al ₂ O ₃ , SiO ₂ , ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, A ceramic powder such as a composite oxide (for example, spinel, mullite, cordierite) containing at least one selected from Al ₂ O ₃ and SiO ₂ can be used.

  As the organic binder to be added to the ceramic slurry 3a, those conventionally used for green sheets can be used. For example, acrylic (acrylic acid, methacrylic acid or ester homopolymer or copolymer, Specifically, acrylic acid ester copolymer, methacrylic acid ester copolymer, acrylic acid ester-methacrylic acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate , Cellulosic homopolymers or copolymers. In selecting the organic binder, an acrylic binder is more preferable in consideration of decomposition and volatility in the firing step in addition to the solubility parameter. The amount of the organic binder added varies depending on the ceramic powder, but it may be an amount that is easy to be decomposed and removed during firing, and the ceramic powder is dispersed, and the green sheet is easy to handle and process. About 10 to 20% by mass is desirable. Further, the molecular weight Mw of the organic binder may be such that no elongation or the like occurs in the ceramic green sheet when the ceramic green sheet is peeled off from the support 1, and may usually be about 300000 to 1000000.

  The solvent contained in the ceramic slurry 3a is added in an amount of 30 to 100% by mass with respect to the ceramic powder so that the viscosity of the ceramic slurry 3a can be satisfactorily applied on the support 1 and about 3 to 100 cps. It is desirable to make it. The kind of the solvent is such that the above ceramic powder and the organic binder can be well dispersed and mixed, and specific examples include organic solvents such as toluene, ketones, alcohols, and water. Among these, solvents having a high evaporation coefficient such as toluene, methyl ethyl ketone, and isopropyl alcohol are preferable because the drying step after slurry application can be performed in a short time.

  Examples of the method for applying the ceramic slurry 3a include a doctor blade method, a lip coater method, and a die coater method. In particular, when using extrusion methods such as the die coater method, slot coater method, curtain coater method, etc., these are non-contact coating methods, so the conductor layer 2 is provided with a conductor layer without being mixed by physical force. This is because the ceramic green sheet 3 can be formed. Further, the thickness of the ceramic green sheet 3 with the conductor layer is formed to be thicker than the thickness of the conductor layer 2.

  The heat treatment for drying the ceramic slurry 3a coated on the support 1 is performed in the same manner as the method for drying the conductor paste 2a, such as radiant heat and heat transfer such as conventionally used hot air dryers and far-infrared dryers. A drier such as a vacuum drier may be used, which is performed using a dryer utilizing heat and is reduced in pressure in addition to heat treatment to lower the vapor pressure of the solvent to increase the evaporation rate. Further, the temperature of the heat treatment for drying is desirably below the glass transition point of the support 1 as described above, as the molten component contained in the conductor paste 2a is melted. For example, when PET (polyethylene terephthalate) having a glass transition point of 70 ° C. is used as the support 1 and hexadecanol having a melting point of 45 ° C. is used as the melting component, the temperature at which the ceramic slurry 3 a is dried is 45 to 70 ° C. It is done.

  Note that through conductors such as via-hole conductors and through-hole conductors for connecting the conductor layers 2 between the upper and lower layers may be formed as necessary. These through conductors are formed by embedding means such as printing or press filling with a conductive paste for a through conductor in a through hole formed in the ceramic green sheet 3 with a conductor layer by punching using a mold or laser processing. When the ceramic green sheet 3 with a conductor layer is thick, there is no difference in the diameter of the through holes on the front and back of the ceramic green sheet 3 with a conductor layer, and a large number of gang molds can be formed at once. It is preferable. Further, when processing the through hole, the ceramic green sheet 3 with the conductor layer may be peeled off from the support 1, but if it is held on the support 1, the deformation of the ceramic green sheet 3 with the conductor layer is prevented. It is more preferable because it is possible. The conductor paste for through conductors is produced in the same manner as the conductor paste 2a, and is adjusted to about 15000 cps to 40000 cps depending on the amount of the solvent and the organic binder.

  Next, as shown in FIG.1 (c), the ceramic green sheet laminated body 4 is produced by aligning and stacking | stacking the ceramic green sheets 3 with a conductor layer, and heating and pressurizing and crimping | bonding them. The conditions of heat and pressure at the time of pressure bonding are generally 30 to 100 ° C. and 2 to 20 MPa, although they vary depending on the type and amount of the organic binder used. At this time, in order to improve the adhesiveness between the ceramic green sheets 3 with conductor layers, it is also possible to use an adhesive mixed with a solvent and an organic binder, a plasticizer, or the like. Moreover, when peeling the ceramic green sheet 3 with a conductor layer from the support body 1, it may be before or after pressure bonding. If the ceramic green sheet with a conductor layer is thin, particularly if it is after crimping, it is restrained by the support 1, so that the dimensional variation of the ceramic green sheet with conductor layer 3 due to temperature and pressure during crimping can be suppressed, and is more preferable. . Moreover, when peeling off, it is also possible to perform a treatment such as heating to such an extent that the size of the ceramic green sheet 3 with a conductor layer does not fluctuate as required.

  Prior to pressure bonding, when the ceramic green sheets 3 with conductor layers are aligned and stacked, pressurization is performed so that the ceramic green sheets 3 with conductor layers do not deform so that the ceramic green sheets 3 with conductor layers do not shift. When (0.1 to 1 MPa) is performed, the ceramic green sheets 3 with a conductor layer are in close contact with each other without generation of delamination, and the electronic component obtained by firing the ceramic green sheet laminate 4 is in an insulating substrate. No voids are generated. In addition, if vacuum suction is performed when the ceramic green sheets 3 with conductor layers are aligned and stacked, air taken in between the stacked ceramic green sheets 3 with conductor layers is removed, resulting in delamination. This is more preferable, and since it is more closely contacted by the suction force, it is more preferable that the positional deviation between the ceramic green sheets 3 with a conductor layer hardly occurs.

  In the case of an electronic component in which the conductor layer 2 is not exposed on the surface, such as a multilayer capacitor, the conductor layer 2 is formed on the ceramic green sheet 3 with the conductor layer located at the top as shown in FIG. A ceramic green sheet 3b that is not used may be used.

  Finally, the ceramic green sheet laminate 4 is fired to produce the electronic component of the present invention. The step of firing consists of removing organic components and sintering the ceramic powder. Removal of the organic component is performed by heating the ceramic green sheet laminate 4 in a temperature range of 100 to 800 ° C. to decompose and volatilize the organic component. The sintering temperature varies depending on the ceramic composition, and is performed within a range of about 800 to 1600 ° C. The firing atmosphere varies depending on the ceramic powder and the conductor material, and is performed in the air, in a reducing atmosphere, in a non-oxidizing atmosphere or the like, and may contain water vapor or the like in order to effectively remove organic components.

When a low-temperature sintered material such as glass ceramics is used as the ceramic material, if the constrained green sheet is further laminated on the upper and lower surfaces of the green sheet laminate 4 and fired, and the restraint sheet is removed after firing, the higher It becomes possible to obtain a ceramic substrate with dimensional accuracy. The constrained green sheet is a green sheet mainly composed of a hardly sinterable inorganic material such as Al ₂ O ₃ and does not shrink during firing. In the laminate in which the constrained green sheets are laminated, shrinkage in the laminating plane direction (xy plane direction) is suppressed by the constraining green sheet that does not shrink, and shrinks only in the laminating direction (z direction). Is suppressed.

  In addition to the hardly sinterable inorganic component, the constrained green sheet may contain a glass component having a softening point not higher than the firing temperature, for example, the same glass as the glass in the ceramic green sheet 3. When the glass is softened and bonded to the ceramic green sheet 3 during firing, the bonding between the ceramic green sheet 3 and the constraining green sheet becomes strong, and a more reliable restraining force can be obtained. The amount of the glass at this time may be 0.5 to 15% by mass by external addition to the inorganic component that is a combination of the hardly sinterable inorganic component and the glass component. Firing shrinkage is suppressed to 0.5% or less.

  Examples of the method for removing the constrained green sheet after firing include polishing, water jet, chemical blasting, sand blasting, wet blasting (a method of spraying abrasive grains and water by air pressure) and the like.

  After firing, the electronic component is exposed to the surface of the conductor layer 2 exposed on the surface of the conductor layer 2 in order to prevent corrosion of the conductor layer 2 or to provide a good connection means for connecting to an external substrate or electronic component such as solder or metal wire. Therefore, Ni or Au plating may be applied.

  The electronic component manufactured by the above method has a high dimensional accuracy and a high precision conductor without delamination inside, and has excellent electrical characteristics and airtightness required as an electronic component. It becomes a high quality thing.

(A)-(d) is sectional drawing for every process which shows an example of embodiment of the manufacturing method of the electronic component of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... Conductor layer 2a ... Conductor paste 3 ... Ceramic green sheet 3a with a conductor layer ... Ceramic slurry 4 ... Ceramic green sheet laminated body

Claims (4)

Forming a conductor layer by applying and drying a conductor paste on a support; and
Applying a ceramic slurry on the support on which the conductor layer is formed, drying by applying a heat treatment, and forming a ceramic green sheet with a conductor layer;
A step of laminating a plurality of ceramic green sheets with a conductor layer to form a ceramic green sheet laminate;
And firing the ceramic green sheet laminate.
The method of manufacturing an electronic component, wherein the conductor paste contains a molten component that becomes a molten state by a heat treatment when the ceramic slurry is dried. 2. The method of manufacturing an electronic component according to claim 1, wherein the melting component has a melting point of 40 to 100.degree. A conductor paste for a ceramic green sheet with a conductor layer, which contains a molten component that becomes a molten state by a heat treatment in a drying process of the ceramic slurry. The conductor paste for a ceramic green sheet with a conductor layer according to claim 3, wherein the melting component has a melting point of 40 to 100 ° C.

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