JP2007266042A - Method of manufacturing laminated structural body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated structural body wherein a convex can be precisely formed in the cavity of the laminated structural body. <P>SOLUTION: The method includes a first step to prepare a first lamination sheet 5, a supporting body 1 provided with a top-viewed frame-like convex 2, a second lamination sheet 4b which is mounted outside the convex 2 on the supporting body 1 and forms a top-viewed frame, and a third lamination sheet 4a which is mounted inside the convex 2 on the supporting body 1, and a second step to laminate the second and third lamination sheets 4 in a manner that they are pinched with the first lamination sheet 5 and the supporting body 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a laminated structure such as a multilayer circuit board used for semiconductor devices, composite electronic components, and the like.

  Conventionally, a manufacturing method of a laminated structure having a cavity for storing an electronic component such as a ceramic multilayer circuit board has been as follows.

  First, after forming a ceramic green sheet with a doctor blade or the like, a conductor layer containing a metal powder is printed on the ceramic green sheet to form a conductor layer on the ceramic green sheet.

  Next, a laminated green sheet on which a plurality of conductor layers are formed is laminated and pressed to form a laminated body, and a frame-shaped ceramic green formed separately by punching with a mold or the like A ceramic green sheet laminate was obtained by further laminating one or more sheets on the laminate.

  Electronic components such as IC chips, transistors, chip resistors, and chip capacitors are mounted on the ceramic multilayer circuit board formed by firing this ceramic green sheet laminate. For the purpose of realizing the above, in Patent Document 1, a relatively thick electronic component (for example, a chip capacitor) is disposed in the cavity, and a relatively thin electronic component (for example, an IC chip) is disposed so as to cover the cavity. The structure to be considered is considered.

  In the multilayer circuit board having such a structure, the contacts for electrical connection between the electronic components arranged so as to cover the cavity and the multilayer circuit board are concentrated in the peripheral region in plan view of the cavity. Therefore, when this electronic component requires a large amount of current and generates a large amount of heat, heat is accumulated in the cavity, and the electronic component in the cavity and the electronic component arranged to cover the cavity Further, it is considered that the characteristics of the multilayer circuit board are affected.

Accordingly, the present inventors physically connect the electronic component disposed so as to cover the cavity and the upper portion of the protruding portion if the protruding portion is formed in the cavity, and the electronic component and the multilayer circuit board As a result, the heat of the electronic components is dissipated from the multilayer circuit board, and new knowledge is obtained that the heat dissipation of the cavity and the periphery of the cavity can be improved. It came to.
JP 7-42165 A

  However, even if the present inventors tried to form a protrusion in the cavity using the conventional method for manufacturing a multilayer circuit board, it was impossible for the following reason.

  That is, a second ceramic green sheet for a frame-like portion formed on a first ceramic green sheet to be a substrate and having a frame shape in plan view, and a protrusion for being surrounded by the second ceramic green sheet In order to simultaneously form the third ceramic green sheet, each slurry is applied on a support made of polyethylene terephthalate (hereinafter referred to as PET). However, since this slurry has fluidity, both of the slurries are mixed on the support, and the second ceramic green sheet serving as the frame portion and the third ceramic green sheet serving as the projection portion are formed. A ceramic green sheet laminate that is reliably separated cannot be formed.

  Therefore, instead of the method of simultaneously creating the frame-shaped portion and the protrusion, a laminate for the protrusion made of a ceramic green sheet similar to the ceramic green sheet laminate is separately prepared and placed in the cavity. It was decided.

  However, since the strength of the laminate for the projecting portion made of a ceramic green sheet prepared separately is low, the pressing force applied when holding it with a jig etc. when placing it in the cavity or when crimping in the cavity It is difficult to form a protrusion having a desired shape because it is easily deformed by the pressure of the material.

  Furthermore, as the size of the multilayer circuit board is reduced, the dimensions of the cavities have also become smaller, and if the laminate for the protrusions formed in the cavities is required to be very small, such deformation is required. However, it tends to be more difficult to accurately form a laminate for a fine protrusion.

  The present invention has been devised in order to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing a laminated structure capable of accurately forming protrusions in the cavity of the laminated structure. It is to provide.

  The method for producing a laminated structure of the present invention is mounted on the first lamination sheet, a support having a frame-like convex part in plan view, and on the support and outside the frame-like convex part. And preparing a second laminating sheet having a frame shape in plan view and a third laminating sheet mounted on the support and inside the frame-shaped convex portion. And a second step in which the second and third laminating sheets are bonded together so as to be sandwiched between the first laminating sheet and the support.

  Furthermore, the upper surfaces of the second and third lamination sheets are lower than the tops of the convex portions of the support.

  Furthermore, the thickness of the second laminating sheet is different from the thickness of the third laminating sheet.

  Furthermore, the second laminating sheet and the third laminating sheet are made of different materials.

  According to the method for manufacturing a laminated structure of the present invention, according to the above manufacturing method, the second and third lamination sheets are held on the support while being separated from each other after being placed on the support. The second and third lamination sheets are pressure-bonded to the first lamination sheet so that the second and third lamination sheets are sandwiched between the first lamination sheet and the support, and then By peeling off the support, the frame portion of the support becomes a concave portion, and the third lamination sheet can be formed as a convex portion in the cavity.

  Further, in the present manufacturing method, the third lamination sheet is pressure-bonded in a state surrounded by the support and the first lamination sheet, so that the protruding portion in the cavity is formed with almost no deformation. Can do.

  Furthermore, in this manufacturing method, the third lamination sheet is pressure-bonded to the first lamination sheet in a state of being held on the support together with the second lamination sheet. Is easy, and the protrusion can be formed in the cavity with high accuracy.

  In addition, in the present manufacturing method, when the frame-like convex portion formed on the support is viewed in plan, the upper surface of the support that is inside the convex portion is lower than the upper surface of the support that is outside the convex portion. By positioning, the thickness of the 3rd lamination sheet formed inside the convex part can be made thicker than the 2nd lamination sheet formed outside the convex part.

  Conversely, the thickness of the third lamination sheet formed on the inner side of the frame-like convex portion by positioning the upper surface of the support inside the convex portion in plan view higher than the upper surface of the support outside the convex portion is frame-shaped. It can also be made thinner than the second laminating sheet formed on the outside of the convex portion.

  Since the height of the cavity outer peripheral portion made of the second laminating sheet and the height of the protrusion inside the cavity made of the third laminating sheet can be freely changed in this way, for example, Even when the piezoelectric vibrator is mounted on the protrusion, the range of selection with respect to the thickness is widened, and the degree of freedom in design is greatly increased.

  Furthermore, since the periphery of the protrusions of the completed laminate is separated from the frame-like part, another member, for example, an IC or the like can be mounted in the separation region between the frame-like part and the protrusion. It becomes possible, and the degree of freedom of design is also greatly increased.

  Moreover, in this manufacturing method, it is also possible to arbitrarily change the materials of the second and third laminating sheets formed on the inside and outside of the frame-like convex portions formed on the support, thereby In addition, it is possible to freely design characteristics such as the thermal conductivity of the protrusion inside the cavity.

  Moreover, in this manufacturing method, when forming the said 2nd and 3rd sheet | seat for lamination | stacking by slurry coating by making the upper surface of the said 2nd sheet | seat for lamination | stacking lower than the convex part of the said support body. The second laminating sheet and the third laminating sheet can be reliably separated.

  The method for manufacturing an electronic component of the present invention will be described in detail below.

  FIG. 1 is a cross-sectional view for each process showing an example of an embodiment of an electronic component manufacturing method of the present invention. 1 is a support, 2 is a frame-like convex part on the support, 3 is a conductor layer, 4 Is a ceramic green sheet with a conductor layer, 5 is a green sheet laminate, and 6 is a laminate structure including cavities and protrusions in the cavities.

  As the support 1, a film-like material made of an organic resin such as polyolefin, polyester, polyamide, polyimide, or vinyl chloride can be used. The surface of the support 1 is the surface of the surface treatment layer when a surface treatment layer such as a release agent or an antistatic agent is formed on the surface of the support 1 in consideration of the peelability of the ceramic green sheet. is there. In order to prevent the ceramic green sheet from being deformed due to elongation or the like at the time of peeling from the support 1, it is preferable that a surface treatment layer of a release agent is formed.

  As a kind of mold release agent formed in the support body 1, a silicone type, a fluorine type, a long-chain alkyl group containing type, an alkyd resin type, a polyolefin resin type, etc. can be roughly classified. From the viewpoint of heat resistance, releasability and cost, a silicone system is desirable. Moreover, according to the product form, any of a solventless type, an emulsion type, and a solvent type can be used.

  The thickness of the support 1 is suitably 10 to 100 μm, preferably 20 to 50 μm. This is because if the thickness of the support 1 is less than 10 μm, the ceramic green sheet 2 formed by deformation or bending tends to be deformed or peeled off or torn, and if the thickness is more than 100 μm, it is difficult to perform hole processing by laser processing or the like. It is to become.

  With respect to the support 1, in the present manufacturing method, it is important to prepare a support 1 having a convex portion 2 having a frame shape in plan view, as shown in FIGS. 1 (a) and 2.

  By applying a ceramic slurry to be described later on the support 1 on which such a frame-like convex portion 2 is formed, the ceramic slurry on the support 1 becomes green sheets 4a on the inside and outside of the frame-like convex portion 2. (It is an example of the 3rd lamination sheet.) And 4b (It is an example of the 2nd lamination sheet.) Can be divided | segmented and formed. The green sheets 4 a and 4 b are sandwiched between the laminated body 5 (an example of a first laminating sheet) and the support body 1 after being crimped while being held by the support body 1. Then, the support 1 is peeled off from the green sheets 4a and 4b, whereby the green sheet 4a is formed as a protrusion 7 in the cavity, and the green sheet 4b is formed as an outer periphery of the cavity. A laminated structure in which 7 is arranged can be obtained. In order to separate the support 1 and the green sheets 4a and 4b, it is possible to remove the support 1 as described above, or to remove it by a removing means such as burning.

  The frame-like convex part 2 on the support 1 is formed by attaching the convex part to the planar support 1 by a technique such as adhesion, but only the convex part may be formed of a different material. Or you may form the support body 1 by the method of scraping off parts other than the convex part which makes a frame shape in a flat support body by methods, such as a laser processing.

  Next, as shown in FIG. 1B, a conductor layer 3 is formed on the support 1 using a conductor paste.

  Here, the conductor paste is homogeneously mixed with a conductor powder obtained by adding an organic binder, a solvent, a molten component, and, if necessary, a dispersant to a kneading means such as a ball mill, a three-roll mill, a planetary mixer, or a trimix. After the dispersion, the viscosity is adjusted by adding a necessary amount of a solvent.

  Examples of the conductor material of the conductor powder include one or more of W, Mo, Mn, Au, Ag, Cu, Pd (palladium), Pt (platinum), etc. It is manufactured by a method or the like, and may be subjected to treatments such as oxidation prevention and aggregation prevention if necessary. When two or more kinds of conductor materials are used, two or more kinds of powders may be mixed, or may be a powder in which two or more kinds of materials are integrated by an alloy, coating, or the like. Moreover, fine powder or coarse powder may be removed by classification or the like to adjust the particle size distribution.

  As the organic binder, those conventionally used for conductor pastes can be used. For example, acrylic (a homopolymer or copolymer of acrylic acid, methacrylic acid or their esters, specifically acrylic ester) Copolymer, methacrylic acid ester copolymer, acrylic acid ester-methacrylic acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, etc. Examples thereof include a polymer or a copolymer.

  In selecting an organic binder, acrylic and alkyd organic binders are more preferable in consideration of solubility parameters, decomposition in the firing step, and volatility. The amount of the organic binder added varies depending on the conductor powder, but may be any amount that can be easily decomposed and removed during firing and can disperse the conductor particles. Is desirable. The molecular weight Mw of the organic binder may be such that the adhesive strength when diffused to the extreme surface of the support 1 when the conductor paste is applied is such that it does not peel off due to the stress generated when the ceramic slurry is applied. It may be about 20,000 to 100,000.

  The solvent used for the conductor paste is not particularly limited as long as the conductor powder and the organic binder can be well dispersed and mixed, and terpineol, butyl carbitol acetate, or the like can be used. When the solvent is added in an amount of 4 to 15% by mass with respect to the conductor powder, the conductor paste can form the conductor layer 3 by printing, and the viscosity is such that no bleeding of the conductor paste occurs after the conductor layer 3 is formed, 3000 to 40000 cps. It is desirable that the degree.

  The solvent added to the conductor paste is preferably a low-boiling solvent in consideration of the formability after coating of the conductor paste and the drying property. In consideration of the workability of the application, the boiling point of the solvent is the temperature at the time of operation (room temperature). Higher) is preferred. Furthermore, in order to suppress the dimensional variation of the support 1 due to the temperature at the time of drying, it is preferably lower than the glass transition point of the support 1 or the melting point of the molten component.

  Here, the glass transition point of the support 1 is a temperature at which the properties of the resin forming the support 1 change. The glass transition point is glassy below the glass transition point and viscoelastic properties above the glass transition point. When the glass transition point is exceeded, the resin is easily deformed. If the melting point of the molten component is higher than the melting point of the molten component, when the conductive paste is applied and dried, the molten component melts and the organic binder contained in the conductive paste moves before the solvent volatilizes. This is because it occurs. Considering these, the boiling point of the solvent used for the conductive paste is more preferably in the range from 40 ° C. to the glass transition point of the support 1 or the lower melting point of the molten component. For example, when PET (polyethylene terephthalate) having a glass transition point of 70 ° C. is used as the support 1 and hexadecanol having a melting point of 60 ° C. is used as the melting component, the melting point of the melting component is from 35 ° C. Examples thereof include a solvent such as methyl acetate having a boiling point in the range of 60 ° C. and a boiling point of 57 ° C.

  As a method of applying and drying a conductive paste on the support 1, it is applied by a conventionally used printing method such as screen printing or gravure printing, and then hot air dryer, vacuum dryer, or far infrared drying. A dryer such as a dryer can be used.

  Next, as shown in FIG. 1C, the green sheet 4 is formed by applying ceramic slurry to the upper surface of the support 1 including the convex portions 2 on which the conductor layer 3 is formed at the same height as the convex portions 2. Form. As a result, the green sheet 4 is divided into green sheets 4 a and 4 b on the inner side and the outer side of the support protrusion 2, respectively.

The ceramic powder used for the ceramic slurry is appropriately selected according to the characteristics required for the multilayer wiring board. For example, if it is a ceramic wiring board, Al ₂ O ₃ , AlN, glass ceramic powder (glass powder and filler powder) In the case of a multilayer capacitor, composite perovskite ceramic powders such as BaTiO ₃ and PbTiO ₃ are used.

Examples of the glass component of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different and Ca, Sr, Mg , Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ —B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (where M ³ is the same as above) Pb glass, Bi glass and the like.

Examples of the filler powder of the glass ceramic powder include Al ₂ O ₃ , SiO ₂ , a composite oxide of ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, and Al _2. Examples thereof include ceramic powders such as composite oxides (eg, spinel, mullite, cordierite) containing at least one selected from O ₃ and SiO ₂ .

  Examples of the organic binder include acrylics (acrylic acid, methacrylic acid or homopolymers or copolymers thereof, specifically acrylic ester copolymers, methacrylic ester copolymers, acrylic ester-methacrylic esters. Acid ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, and other homopolymers or copolymers. In view of decomposition and volatility in the firing step, an acrylic binder is more preferable.

  The solvent is not particularly limited as long as the above ceramic powder and the organic binder can be well dispersed and mixed, and examples thereof include toluene, ketones, organic solvents such as alcohols, and water. Among these, solvents having a high evaporation coefficient such as toluene, methyl ethyl ketone, and isopropyl alcohol are preferable because the drying process after slurry application can be performed in a short time.

  Examples of the method for forming the green sheets 4a and 4b by applying the ceramic slurry include a doctor blade method, a lip coater method, and a die coater method. In particular, when extrusion methods such as the die coater method, slot coater method, and curtain coater method are used, these are non-contact coating methods, so the green sheet can be formed without mixing the conductor layers with physical force. I can do it. The green sheets 4a and 4b are formed to have a thickness greater than that of the conductor layer 3.

  The heat treatment for drying the ceramic slurry coated on the support 1 is performed using radiant heat or heat transfer such as a hot air dryer or a far-infrared dryer conventionally used in the same manner as the method for drying the conductor paste. A drier such as a vacuum drier may be used, which is carried out using the drier utilized, and lowers the vapor pressure of the solvent to increase the evaporation rate by reducing the pressure in addition to the heat treatment. The temperature of the heat treatment for drying is desirably below the glass transition point of the support 1 as described above, as the molten component contained in the conductor paste melts. For example, when PET (polyethylene terephthalate) having a glass transition point of 70 ° C. is used as the support 1 and hexadecanol having a melting point of 45 ° C. is used as the melting component, the temperature at which the ceramic slurry is dried is 45 to 70 ° C. .

  In addition, as shown in FIG.1 (d), you may form through conductors, such as a via-hole conductor and a through-hole conductor, for connecting the conductor layers 3 of the upper and lower layers as needed. These through conductors are formed by a means such as embedding a conductor paste obtained by pasting a conductor material powder into a through hole formed in the ceramic green sheet 4 by punching, laser processing, or the like by printing or press filling. When the ceramic green sheet 4 is thick, the through hole processing is preferable because punching processing has no difference in the through hole diameters on the front and back sides of the ceramic green sheet 4. The through-hole is filled with a conductor paste, which is a precursor of the via conductor, using a screen printing method or a press filling method.

  Next, as shown in FIG. 1 (e), the upper surface of the green sheet 4 and the green sheet (another example of the first laminated sheet) or the laminated body 5 formed by an arbitrary manufacturing method are aligned and stacked. The ceramic green sheet laminate is produced by pressurizing and heating and pressure bonding. The conditions of heat and pressure at the time of pressure bonding are generally 30 to 100 ° C. and 2 to 20 MPa, although they vary depending on the type and amount of the organic binder used. At this time, in order to improve the adhesiveness between the ceramic green sheets with the conductor layer, it is also possible to use an adhesive in which a solvent is mixed with an organic binder, a plasticizer, or the like.

  After the pressure bonding, the support 1 is peeled off from the green sheet 4 to form a laminated structure 6 including a cavity and a protrusion in the cavity as shown in FIG. In the pressure-bonding step, the green sheet 4 is pressure-bonded in a state surrounded by the laminate 5 and the support 1, so that the green sheet 4 can be pressure-bonded without being deformed or displaced by pressurization. Further, since the inner green sheet 4a and the outer green sheet 4b are handled in a state where they are formed and then held on the support until they are pressed, the inner green sheet 4a and the outer green sheet 4b are subjected to external force. It is possible to perform pressure bonding with high positional accuracy without causing deformation or displacement.

  Before the pressure bonding, when the ceramic green sheets 4 with conductor layers are aligned and stacked, pressurization is performed so that the ceramic green sheets 4 with conductor layers do not deform so that the ceramic green sheets 4 with conductor layers do not shift. When (0.1 to 1 MPa) is performed, the ceramic green sheets with the conductor layer adhere to each other without generation of delamination, and the electronic component obtained by firing the ceramic green sheet laminated structure 6 is in an insulating substrate. No voids are generated. In addition, if vacuum suction is performed when the ceramic green sheets with conductor layers are aligned and stacked, air taken in between the stacked ceramic green sheets with conductor layers is removed, resulting in more delamination. It is more preferable because it can be suppressed and is more closely adhered by the suction force, so that the positional deviation between the ceramic green sheets with conductor layers is less likely to occur.

  Finally, the ceramic green sheet laminated structure 6 is fired to produce the electronic component of the present invention. The step of firing consists of removing organic components and sintering the ceramic powder. The removal of the organic component is performed by heating the ceramic green sheet laminated structure 6 in a temperature range of 100 to 800 ° C. to decompose and volatilize the organic component. The sintering temperature varies depending on the ceramic composition, and is performed within a range of about 800 to 1600 ° C. The firing atmosphere varies depending on the ceramic powder and the conductor material, and is performed in the air, in a reducing atmosphere, in a non-oxidizing atmosphere or the like, and may contain water vapor or the like in order to effectively remove organic components.

  After firing, the electronic component is exposed to the surface of the conductor layer 2 exposed on the surface of the conductor layer 2 in order to prevent corrosion of the conductor layer 2 or to provide a good connection means for connecting to an external substrate or electronic component such as solder or metal wire. Therefore, Ni or Au plating may be applied.

  In the above embodiment, the green sheet is formed by applying the ceramic slurry to the same height as the frame-like convex portion 2 of the support 1 in the step of forming the green sheet 4. By forming the green sheet 4 with a thickness lower than that of the portion 2, it is possible to prevent the slurry on the inside of the convex portion and the slurry on the outside from being mixed.

  Moreover, in said embodiment, in the process of forming the green sheet 4, the support body upper surface inside the frame-shaped convex part 2 of the support body 1 is located lower than the support body upper surface used as the outer side of the convex part 2. FIG. Thus, when the green sheet 4 is formed by coating the slurry on the sheet 1, the sheet 4a on the inner side of the frame-like convex portion can be formed thicker than the outer sheet 4b. When the green sheet 4 thus formed is pressure-bonded to the laminate 5, the inner sheet 4 a, that is, the protrusion 7 in the cavity can be formed higher than the height of the cavity outer peripheral part. Conversely, the inner sheet 4a may be formed thinner than the outer sheet 4b by positioning the upper surface of the support body on the inner side of the frame-shaped convex portion 2 of the sheet 1 higher than the upper surface of the support body on the outer side of the convex portion. it can. When the green sheet 4 formed in this manner is pressure-bonded to the laminated body 5, the inner sheet 4a, that is, the protrusion 7 in the cavity can be formed lower than the height of the outer periphery of the cavity. At this time, by forming the inner sheet 4a and the outer sheet 4b so that the heights on the opposite sides of the sheet are the same, pressure is applied to the same plane at the time of crimping, and the crimping can be performed with a smaller deformation.

  Thus, since the height of the cavity outer peripheral portion and the height of the protrusion 7 in the cavity can be freely varied, the degree of freedom in designing the characteristics of the multilayer substrate can be greatly increased. For example, when the piezoelectric vibrator is formed on the protrusion 7, the range of selection can be increased.

  Further, by forming the ceramic green sheets 4a and 4b with different materials, the protrusion 7 in the cavity and the outer periphery of the cavity can be formed with different materials. For example, only the protrusion 7 has a material having excellent thermal conductivity. It is possible to improve the heat dissipation from the protrusions 7 by using and further increase the degree of freedom in designing the characteristics of the multilayer substrate.

  Moreover, it is also possible to form a cavity with a plurality of sheets as shown in FIG.

  Embodiments of the present invention will be described in detail below.

  First, a frame-like convex part having a width of 3 mm, an inner dimension of 4 mm × 4 mm, and a thickness of 50 μm was formed on a 50 μm-thick PET film. The surface of the PET film was subjected to surface treatment to improve the peelability. Next, a conductor layer having a conductor thickness of 15 μm was formed on the PET film by screen printing. After the conductor layer is formed, a PET film on which a conductor layer is formed by mixing ceramic slurry obtained by adding 12% by weight of an acrylic resin and adding 40% by weight of a solvent shown in Table 1 as a solvent to 100% by weight of glass powder. It was coated on top and dried to obtain a ceramic green sheet with a conductor layer of 65 μm. A ceramic green sheet with a conductor was thermocompression bonded and the PET film was peeled off to obtain a multilayer circuit board having protrusions inside the cavity.

  Next, the utilization example of the laminated structure produced by the manufacturing method of the present invention is shown below.

  As a first example, as shown in FIG. 3, a protrusion 7 having the same height as the outer periphery is formed in the cavity, and the lower side of the electronic component 8 disposed on the protrusion 7 so as to straddle the cavity. There is a structure to connect with. In this structure, by forming a thermal via having excellent thermal conductivity in the protrusion 7, heat generated from the electronic component can be radiated to the multilayer circuit board, and the characteristics of the electronic component can be stabilized. Further, in the present structure, the electrical contact between the electronic component 8 and the multilayer substrate can be formed at an arbitrary location by electrically connecting the protruding portion 7 and the electronic component 8. Further, in this structure, when a mechanical load is applied to the upper part of the electronic component 8, the protrusion 7 prevents the deformation of the electronic component, thereby suppressing cracks and breakage of the electronic component and improving the reliability. In this structure, the shape, the arrangement location, and the number of the projections 7 are not limited, and the plurality of projections are arranged in any shape and in any location.

  As a second example, as shown in FIG. 4, there is a structure in which a protrusion 7 having a lower height than the outer periphery is formed in the cavity, and the electronic component 8 is disposed on the protrusion 7 so as to straddle the cavity. . For example, in this structure, an electric capacity can be formed between the lower part of the electronic component 8 and the protruding part 7 by forming electrodes on the lower part of the electronic part 8 and the upper part of the protruding part 7. Since the electric capacity fluctuates when the distance between the lower part of the electronic component 8 and the upper part of the protruding portion fluctuates, the deformation of the electronic component or the multilayer circuit board can be easily detected by detecting the capacitance value.

  As a third example, as shown in FIG. 5, a structure in which a protrusion 7 having a height higher than the outer periphery is formed in the cavity and the electronic component 8 is disposed on the protrusion 7 is also possible.

  As a fourth example, a case where, for example, a tuning fork type crystal resonator is mounted on the protrusion 7 will be described. As shown in FIG. 6, a crystal piece composed of a base and two vibrating parts is usually used as a tuning fork type crystal resonator. What is necessary is just to connect the positive / negative electrode provided in the lower surface of the base part of this crystal piece to the projection part for positive electrodes provided in the cavity, and the projection part for negative electrodes, respectively. Even if a conductive resin or solder paste is used to connect the projection electrode and the crystal piece electrode by separating the projection for the positive electrode and the projection for the negative electrode, the positive and negative It can suppress that the electrode of this is short-circuited. This is because even if the amount of the conductive resin or solder paste is larger than expected, the positive and negative electrode projections are island-like projections that are independent from each other. This is because, even if the solder paste overflows from one of the protrusions, it only flows out and does not reach the other protrusion.

  As a fifth example, for example, when a fluid is allowed to flow into a cavity of a laminated body, a flow path may be formed by a protrusion. By variously changing the shape of the protrusions, the fluid can be separated or assembled. Further, a protrusion may be used to stir and mix the two kinds of fluids. For example, as shown in FIG. 7, in order to agitate and mix the fluid A and the fluid B entering from different approach paths in the cavity, a large number of protrusions are provided, and the fluids A and B are placed between the protrusions. By flowing, the mixed fluid can be taken out.

1 is a cross-sectional structure diagram of a multilayer substrate according to an embodiment of the present invention. It is a perspective view of the support body which formed the frame-shaped convex part. It is an Example of this invention. It is an Example of this invention. It is an Example of this invention. It is an Example of this invention. It is an Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support body 2 Frame-shaped convex part 3 on a support body Conductor layer 4 Ceramic green sheet 4a with a conductor Ceramic green sheet inside convex part 2 (an example of the sheet | seat for 3rd lamination | stacking)
4b Ceramic green sheet outside convex part 2 (an example of a second lamination sheet)
5 Laminate (an example of a first lamination sheet)
6 Laminated structure including cavities and protrusions in the cavity 7 Protrusions formed in the cavities 8 Electronic components placed on the protrusions in the cavities 9 Side walls constituting the cavities

Claims (4)

A first lamination sheet;
A support having a frame-like convex portion in plan view;
A second laminating sheet mounted on the support and outside the frame-shaped convex portion, and having a frame shape in plan view;
A first step of preparing a third lamination sheet mounted on the support and inside the frame-shaped convex portion;
A laminated structure characterized in that the second and third laminating sheets are subjected to a second step of bonding so that the second laminating sheet and the third laminating sheet are sandwiched between the first laminating sheet and the support. Production method.   At least one of the second and third laminated sheets is in a slurry state when placed on the support, and the laminated sheet is in the slurry form among the second and third lamination sheets. The manufacturing method of the laminated structure according to claim 1, wherein an upper surface of the substrate is lower than a top of the convex portion of the support.   The thickness of the said 2nd sheet | seat for lamination | stacking differs from the thickness of the sheet | seat for said 3rd lamination | stacking, The manufacturing method of the laminated structure in any one of Claim 1 or Claim 2 characterized by the above-mentioned.   The method for producing a laminated structure according to any one of claims 1 to 3, wherein the second lamination sheet and the third lamination sheet are made of different materials.

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