JP2007201133A - Electromagnetic wave shielding material and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding material that is superior in electromagnetic wave shielding performance, having high transparency and is superior in productivity, and to provide its manufacturing method. <P>SOLUTION: In the manufacturing method of the electromagnetic wave shielding material includes a step of developing a photosensitive material, having a layer made of at least silver halide and a binder on a supporting medium after exposure, the photosensitive material contains at least two kinds of silver halide emulsions having different sensitivities. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding material that blocks electromagnetic waves generated from electronic devices such as mobile phones, microwave ovens, CRTs, and flat panel displays, and a method for manufacturing the same.

  In recent years, the use of electronic devices such as display devices used in mobile phones, personal computers, TVs and the like has increased, but electromagnetic waves are generally emitted from these electronic devices, It is known that so-called electromagnetic interference (EMI) occurs, such as malfunction of electronic and electrical equipment, failure, or the possibility of harming the human body. Accordingly, there is an increasing need to reduce such EMI, and standards or regulations regarding the intensity of electromagnetic wave emission are established mainly in Europe and the United States, and recent electronic devices are required to satisfy these standards. ing.

  As a method for blocking electromagnetic waves, for example, a method using a so-called electromagnetic wave absorbing material exhibiting high dielectric loss, conductive loss, and magnetic loss is known. However, since these materials are generally opaque, they cannot be used for equipment such as a CRT, flat panel display, or window glass that requires visibility, and their applications have been limited.

  As a means for achieving both electromagnetic wave shielding performance and transparency, a method of forming a thin film of a conductive material such as silver on a transparent substrate by sputtering or the like is known (see, for example, Patent Document 1). However, in the case of these metal thin films, it is necessary to increase the thickness of the metal thin film layer in order to provide high electromagnetic wave shielding performance. It was difficult to balance the rates. Moreover, since the sputtering method generally requires a vacuum environment, problems from the viewpoint of productivity have been raised.

  As a method that can achieve both high electromagnetic shielding performance and transmittance, there is a method using a conductive mesh, and various methods have been proposed as means for realizing the method (for example, see Patent Documents 2 to 4). Among them, the method for producing a conductive mesh by using developed silver obtained through exposure to silver halide and development process is easy to form a mesh pattern, and can produce a large amount of transparent electromagnetic wave shielding material at a low cost. It is useful as a method (see, for example, Patent Documents 5 and 6).

However, in the above-described method for producing a conductive mesh using developed silver, in order to obtain high conductivity, it was necessary to form as many contacts as possible between metallic silver formed by development processing. For this purpose, it is preferable to increase the silver halide density in the layer as much as possible. However, in order to apply the silver halide and carry it on the support, a necessary amount of binder must be used, thereby developing silver In some cases, the number of contact points may decrease, and an improvement thereof has been desired. In addition, in a sample in which silver halide grains having a small particle size are densely coated, silver halide in the vicinity of the surface (the farther from the support) is rapidly developed when the development process is performed, whereas the lower layer Development of the silver halide on the part (side closer to the support) is suppressed, and as a result, the conductivity tends to decrease, and an improvement thereof has been desired.
JP 2004-179405 A JP-A-5-327274 JP-A-11-170421 Japanese Patent Laid-Open No. 2003-23290 JP 2004-221564 A JP 2004-221565 A

  The present invention has been made in view of the above problems, and an object thereof is to provide an electromagnetic wave shielding material excellent in electromagnetic wave shielding performance, having high transparency, and having excellent productivity, and a method for producing the same. .

  The above object of the present invention is achieved by the following configurations.

  1. In a method for producing an electromagnetic wave shielding material in which a photosensitive material having a layer comprising at least silver halide and a binder on a support is subjected to development processing after exposure, at least two types of silver halides having different sensitivities in the photosensitive material A method for producing an electromagnetic wave shielding material comprising an emulsion.

  2. 2. The method for producing an electromagnetic wave shielding material according to 1, wherein the difference ΔS between the sensitivity S of at least two kinds of silver halide emulsions having different sensitivities is 0.4 or more.

  However, the sensitivity S represents a common logarithmic value of the reciprocal of the exposure amount (E) that gives an intermediate density ((Dmax + Dmin) / 2) between the maximum density (Dmax) and the minimum density (Dmin).

  3. The at least two types of silver halide emulsions having different sensitivities are present in the same layer, and the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) (CH / CL ) Is 1.85-19, The manufacturing method of the electromagnetic wave shielding material of 2 characterized by the above-mentioned.

  4). The at least two types of silver halide emulsions having different sensitivities are present in different layers adjacent to each other, and the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) ( 2. The method for producing an electromagnetic wave shielding material according to 2, wherein CH / CL is from 0.8 to 19.

  5. 5. The method for producing an electromagnetic wave shielding material according to any one of 1 to 4, wherein the electromagnetic wave shielding material has an average transmittance in a visible light region of 85% or more.

  6). 6. The method for producing an electromagnetic wave shielding material according to any one of 1 to 5, wherein the development treatment includes physical development before fixing.

  7). The method for producing an electromagnetic wave shielding material according to any one of 1 to 6, wherein an intensifying treatment is performed after the developing treatment.

  An electromagnetic wave shielding material obtained by the production method according to 8.1 to 7.

  According to the present invention, it is possible to provide an electromagnetic wave shielding material having excellent electromagnetic wave shielding performance, high transparency, and excellent productivity, and a method for producing the same.

  As a result of studying a method for producing a conductive mesh using developed silver, focusing on a silver halide emulsion used as a light-sensitive material, the present inventors have found at least two types of silver halide emulsions having different sensitivities. It has been found that, when used in combination, high conductivity can be obtained at the same transmittance as compared with the case of using a single silver halide emulsion.

  The method for producing an electromagnetic wave shielding material of the present invention is characterized in that a photosensitive material having a layer comprising at least a silver halide and a binder on a support is subjected to development after exposure, and the photosensitive material is different. It contains at least two types of silver halide emulsions having sensitivity.

  Techniques using a combination of silver halide emulsions with different sensitivities are known in the field of silver halide photographic light-sensitive materials, but in the case of photographic light-sensitive materials for the purpose of image formation, the gradation adjustment is generally performed. It was intended (see, for example, Japanese Patent Laid-Open Nos. 2001-209152, 2004-37549, 2005-195850, 2000-10226, etc.). In order to increase the conductivity of the developed silver, at least two types of silver halide emulsions having different sensitivities have not been known.

  The reason why the conductivity after development is improved by using silver halide emulsions with different sensitivities is not clear, but low-sensitivity silver halide grains are a source of silver ions in solution physical development that occurs simultaneously with chemical development. Therefore, it is necessary to increase the development silver growth efficiency of high-sensitivity silver halide grains, or to have a space where development silver does not exist. It is estimated that the liquid component can be efficiently supplied into the coating film.

  Hereinafter, the present invention will be described in detail.

  The light-sensitive material used in the present invention is characterized by containing at least two types of halogenated emulsions having different sensitivities.

In the present invention, the sensitivity S of the silver halide emulsion can be determined by a method usually used in the photographic industry, and can be determined, for example, in accordance with the following method.
(Exposure): An optical step wedge whose transmittance of each step is known in advance is brought into close contact with the emulsion surface side of the photosensitive material, and then exposed from above the optical step wedge using an ultraviolet lamp.
(Development): A developer (type 681 (manufactured by Konica Minolta Co., Ltd.)) was used for development at 35 ° C. for 180 seconds, followed by a fixer (type 871 (manufactured by Konica Minolta Co., Ltd.). )), The fixing solution prepared according to the manual is used, and a fixing process is performed at 35 ° C. for 180 seconds, and finally, a sufficient water washing process is performed and dried.
(Measurement): Using X-rite 310TR (manufactured by X-rite), measure the transmission density of each step wedge recorded on the film, plot the transmission density against the exposure amount, draw a so-called characteristic curve, This is expressed by using a common logarithmic value of the reciprocal of the exposure amount (E) giving an intermediate density ((Dmax + Dmin) / 2) between the density (Dmax) and the minimum density (Dmin).

  The difference ΔS in sensitivity is the difference in sensitivity S between the two silver halide emulsions.

  In the present invention, the sensitivity difference ΔS is preferably 0.4 or more. If the difference in sensitivity ΔS is less than 0.4, low-sensitivity silver halide grains tend to form weak photosensitive nuclei upon exposure, and low-sensitivity halogenation occurs when development conditions are activated to promote development silver growth. Silver particles are also easily developed, but when the sensitivity difference ΔS is 0.4 or more, the low-sensitivity silver halide grains are hardly developed, and by making a space where no developed silver exists appropriately, plating, etc. It is presumed that the effect of supplying the intensifying liquid component necessary for the intensifying treatment to the inside of the coating film is enhanced, and this is preferable because the effect of the present invention is further enhanced. The upper limit of the sensitivity difference is not particularly specified. For example, when chemical sensitization is performed strongly in a high-sensitivity silver halide emulsion, fog is likely to occur, and as a result, the transparency of the film tends to decrease, and high-sensitivity halogen When the grain size of the silver halide emulsion is increased, the distance between the low-sensitivity silver halide grains forming the developed silver increases, rather the conductivity decreases, and as a result, the electromagnetic wave shielding performance also decreases. ΔS is preferably 1.5 or less, and more preferably 1.0 or less.

  In the present invention, at least two types of silver halide emulsions having different sensitivities are preferably present in the same layer or in layers adjacent to each other.

When at least two types of silver halide emulsions having different sensitivities are present in the same layer, the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) (CH / CL) of 1.85 to 19 is particularly preferable because the effect of the present invention is high. The content of the silver halide emulsion here can be expressed by the coating amount of silver halide in each layer, and the silver halide is expressed in terms of mass per unit area (g / m ² ) in terms of equimolar silver. Can be represented. The reason why the effect of the present invention is particularly high within this range is not clear, but since there are relatively high-sensitivity silver halide grains as compared with the case where CH / CL is less than 1.85, a developed silver network is formed. Compared to the case where CH / CL is larger than 19, there is relatively more space where there is no developed silver, and the intensifying liquid component necessary for intensifying processing such as plating is applied to the inside of the coating film. It is presumed that the effect of supplying is increased and efficient supplementing is performed.

  When at least two types of silver halide emulsions having different sensitivities are present in adjacent layers, the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) ( (CH / CL) is preferably 0.8 to 19 because the effect of the present invention is particularly high. The reason why the effect of the present invention is particularly high within this range is not clear, but since there are relatively high sensitivity silver halide grains as compared with the case where CH / CL is less than 0.8, a developed silver network is formed. The effect of supplying the intensifying liquid component necessary for intensifying treatment such as plating to the inside of the coating film is increased because the layer containing the low-sensitivity silver halide grains is relatively thin. The amount of low-sensitivity silver halide grains relative to the high-sensitivity silver halide grains is relatively larger than that in the case where intensification is performed and CH / CL is greater than 19, and high-sensitivity halogen having a latent image during development. It is presumed that the silver ion concentration around the silver halide grains is increased and efficient development silver formation is performed.

  When at least two types of silver halide emulsions having different sensitivities are present in adjacent layers, a layer far from the support is formed from the viewpoint of facilitating supply of the developer component and the plating solution component to the inside of the coating film. An embodiment that is a low-sensitivity silver halide emulsion layer is preferred. When one or both of the two adjacent silver halide emulsion layers contain two types of silver halide emulsions having different sensitivities, the CH / CL of the layer far from the support is used for the same reason. However, an aspect smaller than CH / CL of the layer close to the support is preferable.

[Silver halide grains]
The composition of the silver halide grains used in the present invention has an arbitrary halogen composition such as silver chloride, silver bromide, silver chlorobromide, silver iodobromide, silver chloroiodobromide and silver chloroiodide. However, in order to obtain metallic silver having good conductivity, fine particles having high sensitivity are preferable, and silver iodobromide particles are preferably used. When a large amount of iodine is contained, the sensitivity is high and the particles can be made fine.

  In order to reduce the surface specific resistance after silver halide grains are developed to become metallic silver grains and effectively block electromagnetic waves, the contact area between developed silver grains needs to be as large as possible. For this purpose, a smaller silver halide grain size is better to increase the surface area ratio, but too small grains tend to agglomerate into large agglomerates, in which case the contact area will be reduced, so there is an optimum grain size. To do. In the present invention, the average grain size of the high-sensitivity silver halide grains is preferably 0.01 to 0.3 [mu] m, more preferably 0.03 to 0.1 [mu] m in terms of equivalent sphere diameter. In addition, the sphere equivalent diameter of silver halide grains represents the diameter of grains having the same volume and having a spherical shape. The average grain size of silver halide grains is the temperature at the time of preparation of silver halide grains, pAg, pH, addition rate of silver ion solution and halogen solution, grain size control agent (for example, 1-phenyl-5 mercaptotetrazole, 2 -Mercaptobenzimidazole, benztriazole, tetrazaindene compounds, nucleic acid derivatives, thioether compounds, etc.) can be appropriately combined and controlled.

  In the present invention, from the viewpoint of keeping the distance between high-sensitivity silver halide grains moderate and maintaining the contact efficiency of developed silver appropriately, the average grain size (RH) of high-sensitivity silver halide grains and low sensitivity The ratio (RH / RL) of the average grain size (RL) of silver halide grains is preferably 2.0 or less, more preferably 1.5 or less.

  The average grain size of the high-sensitivity silver halide grains is preferably 0.01 to 0.3 μm.

  In the present invention, the shape of the silver halide grains is not particularly limited, and for example, spherical, cubic, flat plate (hexagonal flat plate, triangular flat plate, tetragonal flat plate, etc.), octahedron, tetrahedron It can be in various shapes such as shapes. In order to increase the sensitivity, tabular grains having an aspect ratio of 2 or more, 4 or more, and further 8 to 16 can be preferably used. The particle size distribution is not particularly limited, but a narrow distribution is preferable from the viewpoint of enhancing the transparency while sharply reproducing the outline of the pattern and maintaining high conductivity during pattern formation by exposure. The particle size distribution of the silver halide grains used in the light-sensitive material according to the present invention is preferably monodispersed silver halide grains having a coefficient of variation of 0.22 or less, more preferably 0.15 or less. Here, the variation coefficient is a coefficient representing the breadth of the particle size distribution, and is defined by the following equation.

Coefficient of variation = S / R
(In the formula, S represents the standard deviation of the particle size distribution, and R represents the average particle size.)
The silver halide grains used in the present invention may further contain other elements. For example, in a photographic emulsion, it is also useful to dope metal ions used to obtain a high-contrast emulsion. In particular, Group 8-10 metal ions such as iron ion, rhodium ion, ruthenium ion and iridium ion are preferably used because the difference between the exposed portion and the unexposed portion tends to be clearly generated when the metal silver image is generated.

  These metal ions can be added to the silver halide emulsion in the form of a salt or a complex salt. Transition metal ions represented by rhodium ions and iridium ions can also be compounds having various ligands. Examples of such a ligand include cyanide ions, halogen ions, thiocyanate ions, nitrosyl ions, water, hydroxide ions, and the like. Specific examples of the compound include potassium bromide rhodate and potassium iridate.

In the present invention, the content of the metal ion compound contained in the silver halide is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, and is preferably 10 ⁻⁹ to 10 ^−. More preferably, it is ³ mol / mol Ag.

  The amount of these metal ions is preferably higher in the low-sensitivity silver halide grains than in the high-sensitivity silver halide grains.

  In order for silver halide grains to contain the above-described metal ions, the metal compound is subjected to physical ripening before formation of silver halide grains, during formation of silver halide grains, after formation of silver halide grains, etc. What is necessary is just to add in the arbitrary places in a process. Moreover, in addition, the solution of a heavy metal compound can be continuously performed over the whole or a part of particle formation process.

  In the present invention, in order to further improve the sensitivity, chemical sensitization performed in a photographic emulsion can be performed. As chemical sensitization, for example, noble metal sensitization such as gold, palladium and platinum sensitization, chalcogen sensitization such as sulfur sensitization with inorganic sulfur or organic sulfur compounds, reduction sensitization such as tin chloride and hydrazine, etc. are used. be able to.

  The silver halide grains can be spectrally sensitized. Preferably, at least one of the at least two types of silver halide emulsions having different sensitivities is spectrally sensitized.

  Preferred spectral sensitizing dyes include cyanine, carbocyanine, dicarbocyanine, complex cyanine, hemicyanine, styryl dye, merocyanine, complex merocyanine, holopolar dye, and the like. Can be used alone or in combination.

  Particularly useful dyes are cyanine dyes, merocyanine dyes, and complex merocyanine dyes. For these dyes, any of the nuclei commonly used for cyanine dyes can be used as the basic heterocyclic ring nucleus. That is, a pyrroline nucleus, an oxazoline nucleus, a thiazoline nucleus, a pyrrole nucleus, an oxazole nucleus, a thiazole nucleus, a selenazole nucleus, an imidazole nucleus, a tetrazole nucleus, a pyridine nucleus, and a nucleus in which an alicyclic hydrocarbon ring is fused to these nuclei, and these A nucleus in which an aromatic hydrocarbon ring is fused to the nucleus, that is, an indolenine nucleus, a benzindolenin nucleus, an indole nucleus, a benzoxazole nucleus, a naphthoxazole nucleus, a benzothiazole nucleus, a naphthothiazole nucleus, a benzoselenazole nucleus, a benzimidazole nucleus Quinoline nuclei and the like. These nuclei may be substituted on carbon atoms.

  The merocyanine dye or the complex merocyanine dye includes a pyrazoline-5-one nucleus, a thiohydantoin nucleus, a 2-thiooxazolidine-2,4-dione nucleus, a thiazolidine-2,4-dione nucleus, and a rhodanine nucleus as a nucleus having a ketomethylene structure. A 5- to 6-membered heterocyclic nucleus such as a thiobarbituric acid nucleus can be applied.

  These sensitizing dyes may be used alone or in combination. A combination of sensitizing dyes is often used for the purpose of supersensitization.

  In order to incorporate these sensitizing dyes in a silver halide emulsion, they may be dispersed directly in the emulsion, or water, methanol, propanol, methyl cellosolve, 2,2,3,3-tetrafluoro A solvent such as propanol may be added alone or in a mixed solvent and added to the emulsion. Further, as described in JP-B-44-23389, 44-27555, 57-22089, etc., an acid or a base is allowed to coexist to form an aqueous solution, US Pat. No. 3,822,135, As described in US Pat. No. 4,006,025, an aqueous solution or colloidal dispersion prepared by coexisting a surfactant such as sodium dodecylbenzenesulfonate may be added to the emulsion. Further, after dissolving in a substantially immiscible solvent such as phenoxyethanol, water or a hydrophilic colloid dispersion may be added to the emulsion. As described in JP-A Nos. 53-102733 and 58-105141, it may be dispersed directly in a hydrophilic colloid and the dispersion may be added to the emulsion.

[High contrast agent]
There is a method of increasing the silver chloride content and narrowing the particle size distribution as a method of increasing the contrast of the photosensitive material, but for plate-making, a hydrazine compound or a tetrazolium compound is used as a contrast enhancer to further increase the contrast. It is known to use. The hydrazine compound is a compound having a —NHNH— group, and a typical one is represented by the following general formula (1).

General formula (1) T-NHNHCO-V, T-NHNHCOCO-V
In the formula, each T represents an optionally substituted aryl group or heterocyclic group. The aryl group represented by T includes a benzene ring or a naphthalene ring, and this ring may have a substituent, and as a preferable substituent, a linear or branched alkyl group (preferably having 1 to 20 carbon atoms). Methyl group, ethyl group, isopropyl group, n-dodecyl group, etc.), alkoxy group (preferably C2-C21 methoxy group, ethoxy group, etc.), aliphatic acylamino group (preferably C2-C21 alkyl group) An acetylamino group, a heptylamino group, etc.), an aromatic acylamino group, and the like. In addition to these, for example, a substituted or unsubstituted aromatic ring as described above is -CONH-, -O-,- Those bonded with a linking group such as SO ₂ NH—, —NHCONH—, —CH ₂ CHN— and the like are also included. V represents a hydrogen atom, an optionally substituted alkyl group (methyl group, ethyl group, butyl, trifluoromethyl group, etc.), aryl group (phenyl group, naphthyl group), heterocyclic group (pyridyl group, piperidyl group, pyrrolidyl group) , Furanyl group, thiophene group, pyrrole group and the like).

  The above-mentioned hydrazine compound can be synthesized with reference to the description in US Pat. No. 4,269,929. The hydrazine compound can be contained in the silver halide grain-containing layer, in the hydrophilic colloid layer adjacent to the silver halide grain-containing layer, or in another hydrophilic colloid layer.

Particularly preferred hydrazine compounds are listed below.
(H-1): 1-trifluoromethylcarbonyl-2-{[4- (3-n-butylureido) phenyl]} hydrazine (H-2): 1-trifluoromethylcarbonyl-2- {4- [ 2- (2,4-di-tert-pentylphenoxy) butyramide] phenyl} hydrazine (H-3): 1- (2,2,6,6-tetramethylpiperidyl-4-amino-oxalyl) -2- { 4- [2- (2,4-di-tert-pentylphenoxy) butyramide] phenyl} hydrazine (H-4): 1- (2,2,6,6-tetramethylpiperidyl-4-amino-oxalyl)- 2- {4- [2- (2,4-di-tert-pentylphenoxy) butyramide] phenylsulfonamidophenyl} hydrazine (H-5): 1- (2,2,6,6-tetramethyl Peridyl-4-amino-oxalyl) -2- (4- (3- (4-chlorophenyl-4-phenyl-3-thia-butanamide) benzenesulfonamido) phenyl) hydrazine (H-6): 1- (2, 2,6,6-tetramethylpiperidyl-4-amino-oxalyl) -2- (4- (3-thia-6,9,12,15-tetraoxatricosanamide) benzenesulfonamido) phenylhydrazine (H- 7): 1- (1-Methylenecarbonylpyridinium) -2- (4- (3-thia-6,9,12,15-tetraoxatricosanamide) benzenesulfonamido) phenylhydrazine chloride.

  When hydrazine is used as the thickening agent, an amine compound or a pyridine compound can be preferably used in order to enhance the reducing action of hydrazine. As the amine compound that promotes the reducing action of the hydrazine compound, it is particularly preferable that the molecule has at least one piperidine ring or pyrrolidine ring, at least one thioether bond, and at least two ether bonds.

  In addition to the above-described amine compounds, pyridinium compounds and phosphonium compounds can also be preferably used as compounds that promote the reduction action of hydrazine. Since onium compounds are positively charged, they are adsorbed on silver halide grains that are negatively charged and promote electron injection from the developing agent at the time of development, thereby promoting high contrast. It has been. As preferred pyridinium compounds, reference can be made to bispyridinium compounds disclosed in JP-A-5-53231 and 6-242534. Particularly preferred pyridinium compounds are those in which a bispyridinium body is formed by linking at the 1-position or 4-position of pyridinium. In the salt, as the halogen anion, chlorine ion, bromine ion and the like are preferable, and other examples include boron tetrafluoride ion and perchlorate ion, and chlorine ion or boron tetrafluoride ion is preferable.

The hydrazine compound, amine compound, pyridinium compound, and tetrazolium compound are preferably contained in an amount of 1 × 10 ^{−6 to} 5 × 10 ⁻² mol per mol of silver halide, particularly 1 × 10 ⁻⁴ to 2 × 10 ⁻² mol. Is preferred. It is easy to adjust the addition amount of these compounds to increase the degree of contrast γ to 6 or more. γ can be further adjusted by monodispersity of the emulsion, the amount of rhodium used, chemical sensitization, and the like. Here, γ is a density difference with respect to a difference between exposure amounts giving density of 0.1 and 3.0.

  These compounds are used by being added to a layer containing halogenated particles or another hydrophilic colloid layer. If it is water-soluble, add it to an aqueous solution. Good. Moreover, when it does not melt | dissolve in these organic solvents, it can add to 0.01-10 micrometers microparticles | fine-particles with a ball mill, a sand mill, a jet mill etc., and can be added. As the fine particle dispersion method, a technique of solid dispersion of a dye as a photographic additive can be preferably applied. For example, a desired particle size can be obtained using a dispersing machine such as a ball mill, a planetary rotating ball mill, a vibrating ball mill, or a jet mill. When a surfactant is used at the time of dispersion, stability after dispersion can be improved.

[Silver halide emulsion-containing layer]
In the present invention, a silver halide emulsion-containing layer (silver halide grain-containing layer) is provided on the support, but the silver halide emulsion-containing layer contains a binder, an activator, etc. in addition to silver halide grains. can do.

(binder)
In the silver halide emulsion-containing layer according to the present invention, the silver halide grains are uniformly dispersed and the silver halide grains are supported on the support to ensure the adhesion between the silver halide emulsion-containing layer and the support. A binder can be used for the purpose. The binder that can be used in the present invention is not particularly limited, and any of a water-insoluble polymer and a water-soluble polymer can be used. From the viewpoint of improving developability, it is preferable to use a water-soluble polymer.

  In the light-sensitive material according to the present invention, it is advantageous to use gelatin as a binder, but if necessary, gelatin derivatives, graft polymers of gelatin and other polymers, proteins other than gelatin, sugar derivatives, cellulose derivatives, simple substances. Hydrophilic colloids such as synthetic hydrophilic polymer materials such as mono- or copolymers can also be used. There is no restriction | limiting in particular in the amount of binders, An optimal value can be used from a coating property, a film physical property, electromagnetic wave shielding performance, etc.

  From the viewpoint of forming a developed silver network and increasing the conductivity of the film after development, in the present invention, it is preferable to set the Ag / binder volume ratio higher than that of a normal photographic silver halide photographic material, The content of the binder in the particle-containing layer is preferably 0.3 to 100 in terms of Ag / binder volume ratio, more preferably 0.5 to 30, and further preferably 1 to 15.

[Support]
In the present invention, as a support, for example, a cellulose ester film, a polyester film, a polycarbonate film, a polyarylate film, a polysulfone (including polyether sulfone) film, a polyester film such as polyethylene terephthalate, polyethylene naphthalate, Polyethylene film, polypropylene film, cellophane, cellulose diacetate film, cellulose acetate butyrate film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene vinyl alcohol film, syndiotactic polystyrene film, polycarbonate film, norbornene resin film, polymethyl Pentene film, polyetherketone film, polyether Ton imide film, a polyamide film, a fluororesin film, a nylon film, a polymethyl methacrylate film or an acrylic film or the like. In addition to these plastic films, quartz glass, soda glass, and the like can be used. Of these, cellulose triacetate film, polycarbonate film, polysulfone (including polyethersulfone) and polyethylene terephthalate film are preferably used.

  In the present invention, it is particularly preferable to use a cellulose ester film as the support from the viewpoints of transparency, isotropy, adhesion and the like.

  When the electromagnetic wave shielding material of the present invention is used for a display screen of a display, high transparency is required. Therefore, it is desirable that the support itself has high transparency. In this case, the average transmittance of the entire visible light region of the plastic film or glass plate is preferably 85 to 100%, more preferably 90 to 100%. Moreover, in this invention, what colored the said plastic film or glass plate to the extent which does not interfere with the objective of this invention can also be used for color tone adjustment.

  In the present invention, the average transmittance in the visible light region is the average value obtained by integrating the transmittances in the visible light region obtained by measuring the transmittance in the visible light region from 400 to 700 nm at least every 5 nm. Defined as

  In measurement, the measurement aperture needs to be sufficiently larger than the mesh pattern described above, and is obtained by measuring at least 100 times larger than the mesh area of the mesh.

  In the present invention, the average transmittance in the visible light region is preferably 85% or more, more preferably 88% or more, and further preferably 90% or more.

  Although there is no restriction | limiting in particular in the thickness of the support body used for this invention, It is preferable that it is 5-200 micrometers from a viewpoint of the maintenance of a transmittance | permeability, and a handleability, and it is further more preferable that it is 30-150 micrometers.

〔exposure〕
In the present invention, the photosensitive material is exposed in order to form a conductive pattern by development / compensation processing described later. Examples of the light source used for exposure include light such as visible light and ultraviolet light, radiation such as electron beam and X-ray, and ultraviolet light or near infrared light is preferably used. Further, a light source having a wavelength distribution may be used for exposure, and a light source having a narrow wavelength distribution may be used.

  Various light emitters that emit light in the spectral region are used as necessary for visible light. For example, one or more of a red light emitter, a green light emitter, and a blue light emitter are mixed and used. The spectral region is not limited to the above red, green, and blue, and phosphors that emit light in the yellow, orange, purple, or infrared region are also used. An ultraviolet lamp is also preferable, and g-line of a mercury lamp, i-line of a mercury lamp, etc. are also used.

In the present invention, exposure can be performed using various laser beams. For example, a monochromatic high-density light such as a gas laser, a light emitting diode, a semiconductor laser, a semiconductor laser, or a second harmonic light source (SHG) that combines a nonlinear laser and a solid state laser using a semiconductor laser as an excitation light source was used. A scanning exposure method can be preferably used, and a KrF excimer laser, an ArF excimer laser, an F ₂ laser, or the like can also be used. In order to make the system compact and quick, exposure is preferably performed using a semiconductor laser, a semiconductor laser, or a second harmonic generation light source (SHG) that combines a solid-state laser and a nonlinear optical crystal. In order to design an apparatus that is particularly compact, quick, long-life, and highly stable, exposure is preferably performed using a semiconductor laser.

  Specifically, as the laser light source, an ultraviolet semiconductor, a blue semiconductor laser, a green semiconductor laser, a red semiconductor laser, a near infrared laser, or the like is preferably used.

  The method for exposing the silver halide emulsion-containing layer in the form of an image may be performed by surface exposure using a photomask or by scanning exposure using a laser beam. At this time, condensing exposure using a lens or reflection exposure using a reflecting mirror may be used, and exposure methods such as surface contact exposure, near field exposure, reduced projection exposure, and reflection projection exposure can be used. The laser output may be about several tens of μW to 5 W, as long as it is an amount suitable for exposing the silver halide.

[Development processing]
In the present invention, after the photosensitive material is exposed, development processing is performed. The development process is preferably a so-called black-and-white development process that does not contain a color developing agent.

  As the developing solution, in addition to hydroquinones such as hydroquinone, sodium hydroquinonesulfonate, chlorohydroquinone and the like as developing agents, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1- Use in combination with pyrazolidones such as phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone, 1-phenyl-4-methyl-3-pyrazolidone and superadditive developing agents such as N-methylparaaminophenol sulfate. Can do. Further, it is preferable to use a reductone compound such as ascorbic acid or isoascorbic acid in combination with the superadditive developing agent without using hydroquinone.

  In addition, sodium sulfite or potassium sulfite as a preservative, sodium carbonate or potassium carbonate as a buffer, diethanolamine, triethanolamine, diethylaminopropanediol or the like as a development accelerator can be appropriately used in the developing solution.

  The development processing solution used in the development processing can contain an image quality improver for the purpose of improving the image quality. Examples of the image quality improver include nitrogen-containing heterocyclic compounds such as 1-phenyl-5-mercaptotetrazole and 5-methylbenzotriazole.

  In the present invention, it is preferable that the development processing performed after exposure includes physical development before fixing. The term “physical development before fixing” as used herein refers to a process in which silver ions are supplied from outside the silver halide grains having a latent image by exposure to reinforce developed silver before performing a fixing process described later. As a specific method for supplying silver ions from the developing solution, for example, a method of dissolving silver nitrate or the like in advance in a developing solution and dissolving silver ions, or sodium thiosulfate in the developing solution, Examples include a method in which a silver halide solvent such as ammonium thiocyanate is dissolved, unexposed silver halide is dissolved during development, and development of silver halide grains having a latent image is supplemented.

  In the present invention, it is preferable to use a formulation in which a silver halide solvent is preliminarily dissolved in a developer because a reduction in the transmittance of the film due to fogging in unexposed areas can be suppressed.

  In the development processing in the present invention, after the development of the exposed silver halide grains, fixing processing is performed for the purpose of removing and stabilizing the unexposed silver halide grains. For the fixing treatment in the present invention, a fixer formulation used for photographic films, photographic papers and the like using silver halide grains can be used. The fixing solution used in the fixing process may use sodium thiosulfate, potassium thiosulfate, ammonium thiosulfate, or the like as a fixing agent. Aluminum sulfate, chromium sulfate, or the like can be used as a hardener for fixing. As the fixing agent preservative, sodium sulfite, potassium sulfite, ascorbic acid, erythorbic acid and the like described in the developing solution can be used, and citric acid, oxalic acid, and the like can be used.

  The washing water used in the present invention includes N-methyl-isothiazol-3-one, N-methyl-isothiazol-5-chloro-3-one, and N-methyl-isothiazole-4,5 as antifungal agents. -Dichloro-3-one, 2-nitro-2-bromo-3-hydroxypropanol, 2-methyl-4-chlorophenol, hydrogen peroxide and the like can be used.

[Reinforcement processing]
In the present invention, in order to assist the contact between the developed silvers formed by the above-described development process, and to increase the conductivity, it is preferable to perform a reinforcement process. In the present invention, the intensifying process refers to a process in which a conductive substance source not previously contained in the photosensitive material is supplied from the outside during or after the development process to increase the conductivity. Examples thereof include physical development or plating treatment. Physical development can be performed by immersing a photosensitive material containing a silver halide emulsion having a latent image in a processing solution containing silver ions or silver complex ions and a reducing agent. In the present invention, physical development is defined not only when the development start point of physical development is the latent image nucleus but also when developed silver is the physical development start point, and this can be preferably used.

  In the present invention, various conventionally known plating methods can be used for the plating treatment used as the intensifying treatment. For example, electrolytic plating and electroless plating can be carried out alone or in combination. Among these, electroless plating that does not cause uneven plating due to uneven current distribution can be preferably used. As metals that can be used for electroless plating, for example, copper, nickel, cobalt, tin, silver, gold, platinum, and other various alloys can be used, but the plating process is relatively easy and has high conductivity. It is particularly preferable to use copper electroless plating from the viewpoint that it is easy to obtain.

  The intensifying process can be performed at any timing during development, after development, before fixing, and after fixing process, but it is preferably performed after the fixing process from the viewpoint of maintaining high transparency of the film.

[Oxidation treatment]
In the present invention, it is preferable to perform an oxidation treatment after the development treatment or the intensification treatment. By the oxidation treatment, unnecessary metal components can be ionized and dissolved and removed, and the transmittance of the film can be further increased.

[Configuration of electromagnetic wave shielding layer]
In the present invention, in order to provide high translucency and high electromagnetic wave shielding performance, it is possible to form a conductive mesh pattern by drawing a lattice-like fine line pattern by exposure and then performing development processing or the like. preferable. The conductive metal part preferably has a line width of 20 μm or less and a line interval of 50 μm or more. The conductive metal portion may have a portion whose line width is wider than 20 μm for the purpose of ground connection or the like. Further, from the viewpoint of making the image inconspicuous, the line width of the conductive metal portion is preferably less than 18 μm, more preferably less than 15 μm, further preferably less than 14 μm, still more preferably less than 10 μm, and most preferably less than 7 μm.

  The conductive metal portion in the present invention has an aperture ratio of preferably 85% or more, more preferably 90% or more, and most preferably 90% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the portion without fine lines forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh having a line width of 10 μm and a pitch of 200 μm is 90%.

[Functional layers other than electromagnetic wave shielding layers]
When the electromagnetic wave shielding material of the present invention is used in combination with, for example, an optical filter for a plasma display panel (PDP), a near-infrared absorbing layer which is a layer containing a near-infrared absorbing dye under the silver halide grain layer It is also preferable to provide In some cases, the near-infrared absorbing layer may be provided on the opposite side of the support to the silver halide grain layer side, or may be provided on both the silver halide grain layer side and the opposite side. A near-infrared absorbing layer can be provided between the silver halide grain layer containing silver halide and the support, or a near-infrared absorbing layer can be provided on the opposite side of the support as viewed from the silver halide grain layer. The former is preferred because it can be applied simultaneously with one side of the support.

  Specific examples of near-infrared absorbing dyes include polymethine, phthalocyanine, naphthalocyanine, metal complex, aminium, imonium, diimonium, anthraquinone, dithiol metal complex, naphthoquinone, indolephenol, azo And triallylmethane-based compounds. The PDP optical filter is required to have near-infrared absorptivity mainly for heat ray absorption and noise prevention of electronic devices. For this purpose, a dye having a near-infrared absorbing ability having a maximum absorption wavelength of 750 to 1100 nm is preferable, and a metal complex, aminium, phthalocyanine, naphthalocyanine, diimonium, and squalium compound are particularly preferable.

  As a near-infrared absorbing dye, diimonium compounds are IRG-022, IRG-040 (above, trade names manufactured by Nippon Kayaku Co., Ltd.), nickel dithiol complex compounds are SIR-128, SIR-130, SIR-132, SIR. -159, SIR-152, SIR-162 (above, trade names manufactured by Mitsui Chemicals, Inc.), and phthalocyanine compounds use commercially available products such as IR-10, IR-12 (above, trade names of Nippon Shokubai Co., Ltd.). can do.

  The near-infrared absorbing dye may be used after being dissolved in an organic solvent such as alcohol solvents such as methanol, ethanol and isopropanol, ketone solvents such as acetone, methyl ethyl ketone and methyl butyl ketone, dimethylsulfoxide, dimethylformamide, dimethyl ether and toluene. It is preferable to apply fine particles having an average particle diameter of 0.01 to 10 μm using a fine particle machine, and the addition amount is preferably such that the optical density is in the range of 0.05 to 3.0 at the maximum wavelength.

  In addition, when making the color tone correction | amendment layer contain the pigment | dye which has a near-infrared absorptivity, you may contain any 1 type among said pigment | dye, and may contain 2 or more types. In order to avoid deterioration of the near-infrared absorbing dye due to ultraviolet rays, it is preferable to use an ultraviolet absorber.

  As the ultraviolet absorber, known ultraviolet absorbers such as salicylic acid compounds, benzophenone compounds, benzotriazole compounds, S-triazine compounds, cyclic imino ester compounds and the like can be preferably used. Of these, benzophenone compounds, benzotriazole compounds, and cyclic imino ester compounds are preferred. As what is blended with the polyester, a cyclic imino ester compound is particularly preferable.

  When the electromagnetic wave shielding material of the present invention is used in combination with, for example, an optical filter for a plasma display panel (PDP), as a countermeasure against this, it is possible to prevent a decrease in color reproducibility due to emission of neon gas used in PDP. An embodiment containing a dye that absorbs light is preferred. Specific examples of the dye that absorbs such a specific wavelength include, for example, azo, condensed azo, cyanine, phthalocyanine, anthraquinone, indigo, perinone, perylene, dioxazine, quinacridone, Well-known organic pigments such as methine-based, isoindolinone-based, quinophthalone-based, pyrrole-based, thioindigo-based, metal complex-based, organic dyes, and inorganic pigments may be mentioned. Among these, phthalocyanine-based and anthraquinone-based dyes are particularly preferably used because of good weather resistance.

  When the electromagnetic wave shielding material of the present invention is used for the purpose of protecting a display screen or the like, it is preferable to provide an antireflection layer. As the antireflection layer, inorganic materials such as metal oxides, fluorides, silicides, borides, carbides, nitrides, sulfides, etc., can be used by vacuum deposition, sputtering, ion plating, ion beam assist, etc. A method of laminating a thin film in a layer or a multilayer, a method of laminating a resin having a different refractive index such as an acrylic resin or a fluororesin into a single layer or a multilayer can be used.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated concretely, this invention is not limited to these. In addition, although the display of "part" or "%" is used in an Example, unless otherwise indicated, "part by mass" or "mass%" is represented.

(Preparation of EMP-1)
The following (A1 solution) and (B1 solution) were simultaneously added to 1 liter of a 0.5% gelatin aqueous solution kept at 35 ° C. while controlling the silver potential (EAg) = 85 mV and pH = 5.8, and the following ( C1 solution) and (D1 solution) were simultaneously added while controlling EAg = 85 mV and pH = 5.8. At this time, the silver potential was controlled using a 10% potassium bromide aqueous solution, and the pH was controlled using acetic acid or a sodium hydroxide aqueous solution.

(A1 solution)
Potassium bromide 104g
Potassium iodide 3.0g
1300ml with water
(B1 solution)
150 g silver nitrate
1360ml with water
(C1 liquid)
310g of potassium bromide
Potassium hexachloroiridium (IV) 4 × 10 ⁻⁸ mol Potassium hexacyanoferrate (II) 2 × 10 ⁻⁵ mol Potassium iodide 10 g
4000ml with water
(D1 solution)
480 g of silver nitrate
4200ml with water
After the addition, desalting was performed using a 5% aqueous solution of Demol N manufactured by Kao Atlas and a 20% aqueous solution of magnesium sulfate, and then mixed with an aqueous gelatin solution to obtain an average particle size of 0.04 μm and a coefficient of variation in particle size distribution. A 0.13 silver halide emulsion EMP-1 was obtained.

(Preparation of EMP-2 to EMP-5)
In the preparation of EMP-1, the average particle size was 0.03 μm and the particle size distribution was the same except that the addition time of (A1 solution) and (B1 solution) and the addition rate of (C1 solution) and (D1 solution) were increased. A silver halide emulsion EMP-2 having a coefficient of variation of 0.12 and a silver halide emulsion having an average grain size of 0.018 μm and a coefficient of variation of grain size distribution of 0.13 in the same manner except that the addition rate was further increased. EMP-3 was obtained. Further, in the preparation of EMP-2 and EMP-3, silver halide emulsions EMP-4 and EMP- were similarly prepared except that the amount of potassium hexachloroiridium (IV) in (C1 solution) was changed to 3 times. 5 was prepared.

(Preparation of EM-1)
The EMP-1 was chemically sensitized at 40 ° C. using 2.0 mg of sodium thiosulfate per mole of silver halide, and 4-hydroxy-6-methyl-1,3,3a, 500 mg of 7-tetrazaindene (TAI) was added per mole of silver halide to obtain a silver halide emulsion EM-1.

(Preparation of EM-2 to EM-11)
In the preparation of EM-1, the silver halide emulsions EM-2 and EM-3 were obtained by shortening the chemical sensitization time by 10% and 20%, respectively. Further, silver halide emulsions EM-4 to EM-4 to EM-1 to EM-3 were prepared in the same manner except that the emulsion subjected to chemical sensitization was changed from EMP-1 to EMP-2 and EMP-4. EM-6 and EM-8 to EM-10 were prepared. In addition, silver halide emulsions EM-7 and EM-11 were prepared in the same manner as in the preparation of EM-1, except that the emulsion to be chemically sensitized was changed from EMP-1 to EMP-3 and EMP-5. .

(Evaluation of EM-1 to EM-11)
The silver halide emulsions EM-1 to EM-11 thus prepared were measured for the average grain size and sensitivity (relative values based on EM-1) of the silver halide grains by the following method.

<Average particle size>
In the present invention, the grain size of the silver halide grains refers to the diameter when the projected image of the silver halide grains when converted from a direction perpendicular to the main surface of the silver halide grains is converted into a circular image of the same area. A sample in which silver halide grains are coated on a support together with latex balls having a known particle size as an internal standard so that the main plane is oriented parallel to the substrate, and is magnified 10,000 to 70,000 times with an electron microscope. It can be obtained by enlarging and measuring the area of the projected image of silver halide grains on the print. The number of measured grains is indiscriminately 5,000 or more, and the average grain size is an arithmetic average of grain sizes of individual silver halide grains.

<sensitivity>
Silver halide emulsions EM-1 to EM-11 were applied onto a triacetyl cellulose film support having a thickness of 120 μm and provided with an undercoat layer, and dried to produce a photosensitive material. In the production of the light-sensitive material, a hardening agent (H-1: tetrakis (vinylsulfonylmethyl) methane) was added so as to be 30 mg per 1 g of gelatin. Further, as a coating aid, a surfactant (SU-2: di (2-ethylhexyl) sulfosuccinate / sodium) was added to adjust the surface tension.

  As described above, an optical step wedge whose transmittance of each step is known in advance is brought into close contact with the manufactured photosensitive material on the emulsion surface side of the photosensitive material. The exposure was performed. Next, using a developer (type 681 (manufactured by Konica Minolta Co., Ltd.)), developing was performed at 35 ° C. for 180 seconds using a developer prepared according to the manual, and then a fixer (type 871 (manufactured by Konica Minolta Co., Ltd.)). ) Was used for fixing at 35 ° C. for 180 seconds using a fixing solution prepared according to the manual, and finally, sufficient washing with water was performed and dried. Using X-rite 310TR (manufactured by X-rite), the transmission density of each step wedge stage recorded on the film was measured, the transmission density against the exposure amount was plotted, and the maximum density (Dmax) and minimum density (Dmin) Sensitivity was determined using the common logarithm of the reciprocal of the exposure dose (E) giving an intermediate density ((Dmax + Dmin) / 2). Sensitivity is expressed as a relative value based on the sensitivity of EM-1.

  The results are shown in Table 1 together with the characteristics of the silver halide emulsions EM-1 to EM-11.

(Manufacture of photosensitive materials 101-117)
With silver halide emulsions EM-1 to EM-11 prepared as described above on a triacetyl cellulose film support having a thickness of 120 μm to which an undercoat layer has been applied, as shown in Table 2. After coating to an amount, the photosensitive material 101 to 117 was produced by drying. In the production of the light-sensitive material, the coating solution was adjusted so that the volume ratio of silver halide grains to gelatin was 0.6, and a hardener (H-1: tetrakis (vinylsulfonylmethyl) methane) was added to 1 g of gelatin. It added so that it might become a ratio of 30 mg per. Further, as a coating aid, a surfactant (SU-2: di (2-ethylhexyl) sulfosuccinate / sodium) was added to adjust the surface tension. In Table 2, the amount of silver halide emulsion (CH, CL) is shown as a value converted to equimolar silver.

(Evaluation of photosensitive materials 101 to 117)
The photosensitive materials 101 to 117 manufactured as described above are exposed using an ultraviolet lamp through a lattice-shaped photomask having a line width of 6 μm and a distance between lines of 194 μm, and then developed as follows. After developing for 60 seconds at 25 ° C. using the solution (DEV-1), fixing processing was performed for 120 seconds at 25 ° C. using the following fixing solution (FIX-1), followed by washing with water. Furthermore, electroless copper plating treatment was performed at 45 ° C. using the following plating solution (PL-1).

(DEV-1)
500 ml of pure water
Metol 2g
80 g of anhydrous sodium sulfite
Hydroquinone 4g
4g borax
Sodium thiosulfate 10g
Potassium bromide 0.5g
Add water to bring the total volume to 1 liter (FIX-1)
750 ml of pure water
Sodium thiosulfate 250g
Anhydrous sodium sulfite 15g
Glacial acetic acid 15ml
Potash alum 15g
Add water to bring the total volume to 1 liter (PL-1)
Copper sulfate 0.04 mol Formaldehyde (37%) 0.08 mol Sodium hydroxide 0.10 mol Triethanolamine 0.05 mol Polyethylene glycol 100 ppm
Add water to bring the total volume to 1 liter.

  With respect to each of the samples having the conductive metal mesh portion thus obtained, the surface specific resistance value and the transmittance were respectively measured by a resistivity meter (Loresta GP (MCP-T610 type): Diamond Co., Ltd.) Instruments) and a spectrophotometer (Hitachi spectrophotometer U-3210: manufactured by Hitachi, Ltd.). The results are shown in Table 2.

  From Table 2, the electromagnetic wave shielding material of the present invention prepared by exposing and developing a photosensitive material containing two types of silver halide emulsions having different sensitivities in the same layer has excellent electromagnetic wave shielding performance and high transparency. It can be seen that

Example 2
(Manufacture of photosensitive materials 201-217)
Using the EM-1 to EM-11 prepared in Example 1 on a 120 μm thick triacetyl cellulose film support with an undercoat layer, the amount of silver halide is as shown in Table 3 below. As described above, the photosensitive material 201 to 216 was manufactured by applying a two-layer structure having a first layer and a second layer from the support side. In the production of the light-sensitive material, the volume ratio of silver halide grains to gelatin in each layer is adjusted to 0.6, and the hardener (H-1) is adjusted to a ratio of 30 mg / g gelatin. Added. Further, as a coating aid, a surfactant (SU-2) was added to adjust the surface tension. In Table 3, the amount of silver halide emulsion (CH, CL) is shown as a value converted to equimolar silver.

(Evaluation of photosensitive materials 201-217)
Evaluation similar to Example 1 was performed with respect to the photosensitive materials 201-217 manufactured as mentioned above.

  The results are shown in Table 3.

  From Table 3, the electromagnetic wave shielding material of the present invention prepared by exposing and developing a photosensitive material containing two types of silver halide emulsions having different sensitivities in different layers adjacent to each other has excellent electromagnetic wave shielding performance, and It turns out that it has high transparency.

Claims (8)

In a method for producing an electromagnetic wave shielding material in which a photosensitive material having a layer comprising at least silver halide and a binder on a support is subjected to development processing after exposure, at least two types of silver halides having different sensitivities in the photosensitive material A method for producing an electromagnetic wave shielding material comprising an emulsion. 2. The method for producing an electromagnetic wave shielding material according to claim 1, wherein the difference ΔS of the sensitivity S of at least two types of silver halide emulsions having different sensitivities is 0.4 or more.
However, the sensitivity S represents a common logarithmic value of the reciprocal of the exposure amount (E) that gives an intermediate density ((Dmax + Dmin) / 2) between the maximum density (Dmax) and the minimum density (Dmin). The at least two types of silver halide emulsions having different sensitivities are present in the same layer, and the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) (CH / CL ) Is 1.85 to 19, the method for producing an electromagnetic wave shielding material according to claim 2. The at least two types of silver halide emulsions having different sensitivities are present in different layers adjacent to each other, and the ratio of the high-sensitivity silver halide emulsion content (CH) to the low-sensitivity silver halide emulsion content (CL) ( CH / CL) is 0.8-19, The manufacturing method of the electromagnetic wave shielding material of Claim 2 characterized by the above-mentioned. 5. The method for producing an electromagnetic wave shielding material according to claim 1, wherein an average transmittance of the electromagnetic wave shielding material in a visible light region is 85% or more. The method for producing an electromagnetic wave shielding material according to claim 1, wherein the development treatment includes physical development before fixing. The method for producing an electromagnetic wave shielding material according to claim 1, wherein an intensifying process is performed after the development process. An electromagnetic wave shielding material obtained by the production method according to claim 1.