JP2007191726A - Electroplating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroplating apparatus in which even a small object can be efficiently plated so as not to cause the variation of a plated film. <P>SOLUTION: The electroplating apparatus 1 has a pump 14 for supplying a plating solution 90 to a plating tank 10a. The plating tank 10a has: a spouting portion 20a arranged therein which spouts the plating solution 90; a portion 80 for moving the object to be plated upward by the jet of the spouting portion 20a; and a portion 81 for moving the object 91 downward, which is partitioned from the portion 80 for moving the object upward. Thus, the object 91 can circulate in between the portion 80 for moving the object upward and the portion 81 for moving the object downward. The portion 81 for moving the object downward has a spiral plate 41 therein which is a cathode. The object 91 contacts the upper side of the spiral plate 41 and is plated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electroplating apparatus for plating parts and the like, and more particularly, to an electroplating apparatus suitable for plating small parts such as precision parts.

Conventionally, there are various methods for plating parts and the like. One of the methods is electroplating.
In the case of performing electroplating, a barrel having a space in which the plating solution can pass and having a space inside is usually used, and an object to be plated is put in this barrel, and an electrode (cathode) is inserted into the barrel. Then, when electricity is passed while rotating the barrel, the plating is performed with the metal ions of the plating solution becoming metal on the surface of the object to be plated. In addition, even when a large number of objects to be plated are plated, electricity can be supplied uniformly by rotating the barrel, so that plating can be performed uniformly throughout.

In addition to the method using a rotatable barrel, for example, plating can be performed using a plating apparatus disclosed in Patent Document 1.
Japanese Utility Model Publication No. 5-56961

  The barrel needs to allow the plating solution to pass therethrough and prevent the plating object from passing therethrough. Therefore, the smaller the plating target, the smaller the holes for allowing the plating solution to pass therethrough, so that the circulation of the plating solution becomes worse, and there is a possibility that it cannot be supplied for the consumption of metal ions in the plating solution in the barrel. is there.

Moreover, in order to flow electricity to the plating target, it is necessary to contact the electrode (cathode) directly or indirectly through a conductive material. However, since the surface area is reduced when the plating object is small, the contact with the electrode or the like is likely to be uneven among the individual plating objects, and the degree of plating tends to be different.
A method of stirring the plating solution so that the contact of the electrode is not biased is conceivable, such as the method described in Patent Document 1, but the time for the plating object to float by stirring of the plating solution is considered. As a result, the contact time with the electrode is shortened, and efficient plating cannot be performed.

  Therefore, an object of the present invention is to provide an electroplating apparatus capable of performing plating with little variation even when a plating object is small.

  The invention described in claim 1 for achieving the above-described object is provided with a jetting part from which a plating solution is jetted, and a plating target rising part in which a plating target is raised by a jet of the jetting part, and a plating target rising part And a plating object descending part where the plating object descends, and the plating object can circulate between the plating object ascending part and the plating object descending part. The electroplating apparatus is characterized in that a cathode is disposed in a descending portion, and a plating object is brought into contact with an upper side of the cathode to perform plating.

  According to the first aspect of the present invention, the plating target ascending portion where the plating object ascends due to the jet flow of the jetting part and the plating object ascending portion are partitioned, and the plating object descending portion where the plating object descends. The plating object circulates between the plating object rising part and the plating object falling part, and the plating object is brought into contact with the upper side of the cathode arranged in the plating object falling part to perform plating. Therefore, the plating object can be brought into contact with the cathode without variation, and efficient plating can be performed.

  The invention according to claim 2 is provided with a cylindrical portion, and the cylindrical portion separates the plating target rising portion and the plating target falling portion, and the plating target falling portion is arranged around the plating target rising portion. The electroplating apparatus according to claim 1, wherein

  According to the invention of claim 2, the cylindrical target part partitions the plating target rising part and the plating target falling part, and the plating target falling part is arranged around the plating target rising part. The plating target rising portion and the plating target falling portion can be partitioned without complicating the structure.

  The invention according to claim 3 is characterized in that the jetting part jets the plating solution toward the inside of the cylindrical part, and the vicinity of the lower end of the cylindrical part spreads downward. Item 3. The electroplating apparatus according to Item 2.

  According to the invention described in claim 3, since the ejection part ejects the plating solution toward the inside of the cylindrical part, and the vicinity of the lower end of the cylindrical part is expanded downward, the ejection part Since the plating solution is entrained when the plating solution is ejected from, the object to be plated can be circulated more reliably.

  The invention according to claim 4 is the electroplating apparatus according to claim 2 or 3, wherein the cathode has a spiral plate shape and can be rotated.

  According to the fourth aspect of the present invention, since the cathode has a spiral plate shape and can be rotated, the time during which the plating object contacts the cathode can be made longer.

  The invention according to claim 5 is characterized in that the rotation speed of the cathode can be changed in at least two stages and is controlled to change periodically. This is an electroplating apparatus.

  According to the invention described in claim 5, since the rotation speed of the cathode can be changed in at least two stages and is controlled to change periodically, the object to be plated is placed on the cathode. It is possible to perform plating while moving the plate to reduce plating variation.

  The invention according to claim 6 is the electroplating apparatus according to claim 4 or 5, wherein the cylindrical portion and the cathode are integrated, and the cylindrical portion and the cathode rotate. is there.

  According to the invention described in claim 6, since the cylindrical portion and the cathode are integrated, and the cylindrical portion and the cathode rotate, the cathode can be easily rotated.

  The invention according to claim 7 is the electroplating apparatus according to claim 6, wherein the cylindrical portion is formed of a member capable of conducting electricity.

  According to the seventh aspect of the present invention, since the cylindrical portion is formed by a member capable of conducting electricity, electricity is easily supplied to the cathode by conducting the cathode and the cylindrical portion. can do.

  According to the electroplating apparatus of the present invention, even when the plating object is small, there is little variation and efficient plating can be performed.

Hereinafter, specific examples of the present invention will be described.
FIG. 1 is a perspective view showing an electroplating apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic diagram of the electroplating apparatus shown in FIG. 3 is a cross-sectional view showing the inside of the plating tank of the electroplating apparatus shown in FIG. FIG. 4 is a perspective view showing a rotating body.

As shown in FIG. 1, the electroplating apparatus 1 according to the first embodiment of the present invention includes a main body 10 having a plating tank 10a, a control unit 13 for controlling plating, a pump 14, and a main body. 10 and a tank 15 arranged on the lower side. In addition, the plating tank 10a of this embodiment is formed with the transparent resin board, and the cylindrical body 30 and the perforated plate 31 arrange | positioned in the plating tank 10a are visible as FIG. 1 shows.
Then, the plating object 91 can be plated by the electroplating apparatus 1. In the electroplating apparatus 1 of this embodiment, the plating object 91 is suitable for plating of small parts, but the size and shape of the plating object 91 are not limited.

  Then, as shown in FIG. 2, the plating solution 90 is supplied from the tank 15 to the plating tank 10 a by the supply pipe 20 connected to the pump 14, and flows from the plating tank 10 a to the tank 15 by the discharge pipe 21 and the overflow pipe 22. The plating solution 90 is circulated.

  The outlet portion of the supply pipe 20 on the side of the plating tank 10a, that is, the inlet portion of the plating bath 90a of the plating solution 90 is provided with an ejection portion 20a from which the plating solution 90 is ejected, and the jet of the plating solution 90 in the ejection direction. Is formed. The ejection part 20a is arrange | positioned at the bottom of the plating tank 10a, and a direction is upward.

Further, an outlet portion of the discharge pipe 21 on the plating tank 10a side, that is, an outlet portion of the plating solution 90 of the plating tank 10a is provided with a discharge portion 21a, and the discharge portion 21a is disposed near the bottom of the plating tank 10a. Yes.
An overflow portion 22a is provided at the inlet portion of the overflow pipe 22 on the plating tank 10a side, and the overflow portion 22a is disposed above the plating tank 10a. When the plating solution 90 is supplied by the overflow pipe 22 as the water level rises from the overflow portion 22a, the plating solution 90 flows from the overflow portion 22a to prevent the water level from rising.

  The pump 14 of this embodiment can be adjusted with an inverter, and can change the supply amount of the plating solution 90 to the plating tank 10a.

  As shown in FIG. 3, a cylindrical body 30, a perforated plate 31, a rotating body 32, and an anode hanging part 36 are disposed inside the plating tank 10 a of the main body 10. In addition, a motor 33 and a cathode-side power supply connecting portion 35 are disposed outside the plating tank 10 a and above the rotating body 32.

As shown in FIG. 1, the cylindrical body 30 is a cylindrical member having an opening 30a, and is made of resin. And the deformation | transformation of the perforated plate 31 arrange | positioned inside the cylinder 30 is prevented by a water flow etc.
The perforated plate 31 is used to prevent the plating object 91 such as a component from jumping to the outside while allowing the plating solution 90 to pass through. As a specific material, the same barrel as that used for barrel plating can be employed.

  A mortar-shaped tapered portion 38 is formed on the lower side of the perforated plate 31, and, as will be described later, when the plating object 91 falls, the ejection portion 20 a side disposed below the tapered portion 38. To guide.

  The rotating body 32 is disposed inside the cylindrical body 30 or the perforated plate 31 as shown in FIGS. 2 and 3, and as shown in FIG. 4, the cylindrical portion 40, the spiral plate 41, and And a connecting member 44.

  The cylindrical part 40 is cylindrical and partitions the inner side and the outer side. The inner side becomes the plating target rising portion 80 where the plating target 91 rises when performing plating, and the outer side becomes the plating target lowering portion 81 where the plating target 91 descends when performing plating.

  The tubular portion 40 includes a cylindrical member 42 and an ejector member 43, and the ejector member 43 is disposed below the cylindrical member 42. The cylindrical member 42 is a metal pipe, and an opening 42a is formed on the upper side. Four openings 42a are formed in four directions. Further, the positions of the four openings 42 a in the vertical direction are the same, and are disposed further above the upper side of the spiral plate 41. As shown in FIG. 2, the opening 42 a is near the position of the overflow portion 22 a of the overflow pipe 22, and when the electroplating apparatus 1 is used, the water level is above the lower end of the opening 42 a.

  Further, as shown in FIG. 3, the ejector member 43 has a lower side portion 43a that protrudes from the cylindrical member 42, an upper side portion 43b that is disposed inside the cylindrical member 42, and inserts the upper side portion 43b. Thus, the cylindrical member 42 is fixed.

  The shape of the inner side of the ejector member 43 is such that the upper end and the lower end side are wide and the vicinity of the center is narrow, and a constricted portion 45 is formed. And it is gradually expanded so that it leaves | separates from the constriction part 45, and the shape of the lower side vicinity of the cylindrical part 40 is a shape which expands below. Further, the cross-sectional area of the lower portion 43 a is wider than the cross-sectional area of the cylindrical member 42.

Moreover, the ejection part 20a is arrange | positioned under the cylindrical part 40, and the direction of the ejection part 20a is facing the inside of the cylindrical part 40. FIG. Therefore, the plating solution 90 ejected from the ejection part 20 a rises inside the cylindrical part 40.
When the plating solution 90 rises, the ejector member 43 raises the surrounding plating solution 90 while entraining it. That is, since the plating solution 90 near the lower side of the tubular portion 40 is also raised by the jet flow from the ejection portion 20a, the plating solution 90 outside the tubular portion 40 is also raised.

  As shown in FIG. 4, the spiral plate 41 is a continuous spiral plate, and is disposed around the outside of the tubular portion 40, and is disposed in the plating target descending portion 81. The spiral plate 41 is made of metal and is a material through which electricity can be conducted. As will be described later, the spiral plate 41 is configured such that the cathode-side power supply connecting portion 35 is electrically connected to become a cathode. In the electroplating apparatus 1, the cathode is arranged in the plating target descending portion 81.

  Moreover, the shape seen from the up-down direction of the spiral plate 41 is circular both inside and outside. The inner size of the spiral plate 41 is substantially equal to the outer diameter of the cylindrical portion 40, and the inner side of the spiral plate 41 is fixed to the cylindrical portion 40. Further, the outer size of the spiral plate 41 is smaller than the inner diameter of the perforated plate 31, and between the outer edge 41a of the spiral plate 41 and the perforated plate 31, as shown in FIG. A gap 46 is formed.

  The connecting member 44 is made of metal and is located above the cylindrical member 42. The cylindrical member 42 and the connecting member 44, and the cylindrical member 42 and the spiral plate 41 are fixed by welding, and electricity can be passed between the connecting member 44 and the spiral plate 41. .

As shown in FIG. 3, the connecting member 44 of the rotator 32 is fixed to the motor 33 disposed on the rotator 32, and the rotator 32 is rotatable. The rotation speed of the rotating body 32 can be changed, and the speed can be changed in at least two stages by the control unit 13.
Further, the connecting member 44 is electrically connected to the cathode side power supply connecting portion 35, and electricity can be conducted between the spiral plate 41 and the cathode side power supply connecting portion 35. Moreover, even if the rotary body 32 rotates, it connects via the rotary connector 47 so that the cathode side power supply connection part 35 may not rotate.

The anode hanging portion 36 is a portion for hanging the anode rod 92. As shown in FIG. 1, the anode suspension 36 is disposed inside the plating tank 10a, but a part of the anode suspension 36 is exposed to the outside to form the anode-side power connection 36a.
The anode suspension part 36 is formed of a copper plate, and is disposed on the upper side of the plating tank 10 a so as to surround the cylindrical body 30.

As shown in FIG. 2, the vertical position of the anode hanging portion 36 is above the position of the overflow portion 22 a of the overflow pipe 22, and the plating solution 90 is not in contact when the electroplating apparatus 1 is used. The anode rod 92 suspended from the anode suspension part 36 comes into contact with the plating solution 90.
The anode rod 92 used for the plating can be the same as that generally used, and a soluble one that can replenish metal ions by plating may be used, or an insoluble one. May be used.

Next, a method for plating the plating object 91 using the electroplating apparatus 1 will be described with reference to FIG.
First, the plating object 91 is placed inside the perforated plate 31. When putting the plating object 91, it can be easily performed by removing the rotating body 32 and the motor 33. In a state where the plating solution 90 is not supplied, the plating object 91 does not rise, and the plating object 91 is gathered in the vicinity of the ejection part 20a. In addition, since the filter 20b is provided in the ejection part 20a, the plating target 91 does not fall.

And the pump 14 is operated and the plating solution 90 is supplied from the ejection part 20a. A part of the supplied plating solution 90 exits from the perforated plate 31 and is discharged from the discharge pipe 21, but since the amount supplied is larger than the amount discharged, the plating solution in the plating tank 10a. The 90 water level gradually rises.
When the water level rises and reaches the overflow part 22a of the overflow pipe 22, the plating solution 90 is also discharged from the overflow part 22a, so that the water level is maintained at the height of the overflow part 22a.

  Further, the jet of the plating solution 90 from the ejection portion 20 a flows into the cylindrical portion 40, and a flow in which the plating solution 90 rises is generated in the cylindrical portion 40. Then, the plating object 91 rises on the rising flow of the plating solution 90, and the inside of the cylindrical part 40 becomes the plating object raising part 80.

Then, the plating solution 90 and the plating object 91 that have moved up the plating target rising portion 80 in the cylindrical portion 40 are discharged from the opening 42 a formed in the upper portion of the cylindrical portion 40. The plating object 91 discharged from the opening 42a is placed on the spiral plate 41 which is a cathode, and contacts the upper side of the spiral plate 41.
When a voltage is applied between the cathode-side power supply connecting portion 35 and the anode-side power supply connecting portion 36a while the pump 14 is operated, the plating solution 90 is placed on the surface of the plating object 91 placed on the spiral plate 41. The metal ion becomes a metal, and the plating object 91 is plated.

  Moreover, when performing plating, the rotating body 32 is rotated by the motor 33. Then, since the plating object 91 moves on the spiral plate 41, plating with less variation can be performed. In particular, in the electroplating apparatus 1 of this embodiment, since the rotational speed of the rotary body 32 can be changed, variation can be further reduced.

  In the electroplating apparatus 1 of this embodiment, the rotational speed of the rotating body 32 includes a low-speed rotation state and a high-speed rotation state, and the low-speed rotation state is a slower rotation than the high-speed rotation state. The rotation speed in these states and the operation time in each state are not particularly limited and can be changed depending on the shape and size of the plating object 91 and other conditions. For example, in the low-speed rotation state The rotation speed can be 5 to 10 rpm, and the rotation speed in a high-speed rotation state can be 15 to 30 rpm.

  Then, the pump 14 is operated, and the low-speed rotation state and the high-speed rotation state are alternately repeated at a predetermined cycle while applying a voltage between the cathode-side power connection portion 35 and the anode-side power connection portion 36a. In the low-speed rotation state, the plating target 91 moves little on the spiral plate 41, and the plating target 91 is mainly plated. Further, in the high-speed rotation state, there is a difference in the relative speed between the plating solution 90 and the spiral plate 41, and the plating object 91 moves on the spiral plate 41, thereby preventing the portion to be plated from being biased. it can.

  The rotation direction of the rotating body 32 is not particularly limited, but the plating object 91 stays in the vicinity of the opening 42a of the cylindrical member 42 so that the plating object 91 moves on the spiral plate 41 by rotation. In order not to go down, the spiral plate 41 can be rotated in the direction of the arrow shown in FIG.

  While the plating object 91 is plated, the plating object 91 gradually moves down the spiral plate 41 disposed in the plating object descending portion 81 and moves to the lower side of the tubular portion 40. The plating object 91 that has moved to the lower side of the tubular part 40 again circulates up the plating object ascending part 80 due to the flow involved by the jet or the guidance to the center side by the tapered part 38.

  As described above, the plating object 91 is repeatedly circulated between the plating object rising part 80 and the plating object lowering part 81, and plating is performed when the plating object lowering part 81 descends. And since the raising of the plating object 91 at the plating object raising part 80 is performed by a jet, the time is short, and the lowering of the plating object 91 at the plating object lowering part 81 gradually moves on the spiral plate 41. It takes a long time to go down. Therefore, the time for plating with the spiral plate (cathode) 41 of the plating object 91 can be made longer, and efficient plating can be performed.

  Then, after operating for a predetermined time, the power supply is stopped to finish the plating. If the supply of the plating solution 90 is stopped, the plating solution 90 is discharged from the discharge pipe 21, so that the plating object 91 is taken out. At this time, since a part of the plating object 91 is placed on the spiral plate 41, it is difficult to collect the plating object 91. Then, the collection | recovery operation | work of the plating target object 91 can be made easy by performing the plating target collection | recovery process shown below.

  In the plating object recovery step, the supply of the plating solution 90 from the ejection part 20a is reduced to such an extent that the water level of the plating solution 90 can be maintained, and the rotating body 32 is continuously rotated in a high-speed rotation state. In this state, the jet flow from the ejection part 20a becomes small, and the plating object 91 does not rise. In addition, since the rotating body 32 is in a high-speed rotation state, the plating object 91 moves on the spiral plate 41 and is further plated from the gap 46 between the spiral plate 41 and the perforated plate 31 by centrifugal force. 91 falls.

By the plating object recovery step, the plating object 91 on the spiral plate 41 moves to the vicinity of the ejection part 20a, and finally all the plating objects 91 move to the vicinity of the ejection part 20a. Then, the plating object 91 can be easily recovered by removing the rotating body 32.
In addition, the rotational speed in the high-speed rotation state of the plating target recovery process may be the same as or different from the rotational speed at the time of plating.

  In the above-described embodiment, the spiral plate 41 which is a continuous spiral plate is used as the cathode disposed in the plating target lowering portion 81. However, the plating target 91 can contact the upper side, and the plating target 91 is lowered. If possible, other shapes can be used. For example, a partly discontinuous spiral plate or a plate that is not a spiral and does not tilt in the circumferential direction and that is partly missing and arranged in layers can be used.

  Furthermore, in order to ensure the movement of the plating object 91 on the spiral plate 41, a vibration generator (vibrator) can be provided. And by this vibration generator, the rotary body 32 can be vibrated up and down (axial direction), and the plating object 91 on the spiral plate 41 can be easily moved.

It is the perspective view which showed the electroplating apparatus in the 1st Embodiment of this invention. It is a schematic diagram of the electroplating apparatus shown by FIG. It is sectional drawing which shows the inside of the plating tank of the electroplating apparatus shown by FIG. It is the perspective view which showed the rotary body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electroplating apparatus 10 Main-body part 10a Plating tank 20a Ejection part 32 Rotating body 40 Cylindrical part 41 Spiral plate (cathode)
42 Cylindrical member 43 Ejector member 80 Plating target rising portion 81 Plating target falling portion 90 Plating solution 91 Plating target

Claims (7)

  A plating target is provided, and a plating target ascending portion where the plating target is raised by the jet flow of the jetting portion is separated from the plating target rising portion, and the plating target is lowered where the plating target is lowered. The plating object can circulate between the plating object ascending part and the plating object descending part, and the cathode is disposed at the plating object descending part, and the plating object is in contact with the upper side of the cathode An electroplating apparatus characterized in that plating is performed.   A cylindrical part is provided, and the plating target rising part and the plating target falling part are partitioned by the cylindrical part, and the plating target falling part is arranged around the plating target rising part. The electroplating apparatus according to claim 1.   The electroplating apparatus according to claim 2, wherein the jetting part jets a plating solution toward the inside of the cylindrical part, and the vicinity of the lower end of the cylindrical part spreads downward.   The electroplating apparatus according to claim 2 or 3, wherein the cathode has a spiral plate shape and can be rotated.   5. The electroplating apparatus according to claim 4, wherein the rotation speed of the cathode can be changed in at least two stages and is controlled so as to change periodically.   The electroplating apparatus according to claim 4 or 5, wherein the cylindrical portion and the cathode are integrated, and the cylindrical portion and the cathode rotate.   The electroplating apparatus according to claim 6, wherein the cylindrical portion is formed of a member capable of conducting electricity.

Images