JP2007189207A5 - - Google Patents

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JP2007189207A5
JP2007189207A5 JP2006329465A JP2006329465A JP2007189207A5 JP 2007189207 A5 JP2007189207 A5 JP 2007189207A5 JP 2006329465 A JP2006329465 A JP 2006329465A JP 2006329465 A JP2006329465 A JP 2006329465A JP 2007189207 A5 JP2007189207 A5 JP 2007189207A5
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light emitting
film
nitride semiconductor
semiconductor light
emitting device
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JP2006329465A
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JP4776514B2 (en
JP2007189207A (en
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光出射部にコート膜が形成されている窒化物半導体発光素子であって、前記光出射部は窒化物半導体からなり、前記光出射部に接するコート膜が前記光出射部側の酸窒化物膜と前記酸窒化物膜上の酸化物膜とからなることを特徴とする、窒化物半導体発光素子。   A nitride semiconductor light emitting device in which a coating film is formed on a light emitting portion, wherein the light emitting portion is made of a nitride semiconductor, and the coating film in contact with the light emitting portion is an oxynitride film on the light emitting portion side And an oxide film on the oxynitride film. 前記窒化物半導体発光素子は窒化物半導体レーザ素子であって、前記光出射部は共振器端面であることを特徴とする、請求項1に記載の窒化物半導体発光素子。   2. The nitride semiconductor light emitting device according to claim 1, wherein the nitride semiconductor light emitting device is a nitride semiconductor laser device, and the light emitting portion is a resonator end face. 前記酸窒化物膜は、アルミニウムの酸窒化物膜またはシリコンの酸窒化物膜であることを特徴とする、請求項1または2に記載の窒化物半導体発光素子。   The nitride semiconductor light emitting device according to claim 1, wherein the oxynitride film is an aluminum oxynitride film or a silicon oxynitride film. 前記酸化物膜は、酸化アルミニウム膜、酸化シリコン膜、酸化チタン膜、酸化ハフニウム膜、酸化ジルコニウム膜、酸化ニオブ膜、酸化タンタル膜または酸化イットリウム膜であることを特徴とする、請求項1から3のいずれかに記載の窒化物半導体発光素子。   The oxide film is an aluminum oxide film, a silicon oxide film, a titanium oxide film, a hafnium oxide film, a zirconium oxide film, a niobium oxide film, a tantalum oxide film, or an yttrium oxide film. The nitride semiconductor light-emitting device according to any one of the above. 前記酸窒化物膜中の酸素の含有量が1原子%以上50原子%以下であることを特徴とする、請求項1から4のいずれかに記載の窒化物半導体発光素子。5. The nitride semiconductor light emitting device according to claim 1, wherein the oxygen content in the oxynitride film is 1 atomic% or more and 50 atomic% or less. 前記酸窒化物膜中の酸素の含有量が2原子%以上35原子%以下であることを特徴とする、請求項1から5のいずれかに記載の窒化物半導体発光素子。6. The nitride semiconductor light emitting device according to claim 1, wherein the oxygen content in the oxynitride film is 2 atomic% or more and 35 atomic% or less. 前記酸窒化物膜中の酸素の含有量が2原子%以上15原子%以下であることを特徴とする、請求項1から6のいずれかに記載の窒化物半導体発光素子。7. The nitride semiconductor light emitting device according to claim 1, wherein a content of oxygen in the oxynitride film is 2 atom% or more and 15 atom% or less. 前記酸窒化物膜中の酸素の含有量が3原子%以上11原子%以下であることを特徴とする、請求項1から7のいずれかに記載の窒化物半導体発光素子。8. The nitride semiconductor light emitting device according to claim 1, wherein a content of oxygen in the oxynitride film is 3 atomic% or more and 11 atomic% or less. 9. 光出射部にコート膜が形成されている窒化物半導体発光素子を製造する方法であって、前記光出射部に前記光出射部側の酸窒化物膜と前記酸窒化物膜上の酸化物膜とからなるコート膜を形成する工程を含む、窒化物半導体発光素子の製造方法。A method of manufacturing a nitride semiconductor light emitting device in which a coat film is formed on a light emitting portion, wherein the light emitting portion includes an oxynitride film on the light emitting portion side and an oxide film on the oxynitride film The manufacturing method of the nitride semiconductor light-emitting device including the process of forming the coating film which consists of these. 前記光出射部が共振器端面であって、前記窒化物半導体発光素子が窒化物半導体レーザ素子であることを特徴とする請求項9に記載の窒化物半導体発光素子の製造方法。The method for manufacturing a nitride semiconductor light emitting device according to claim 9, wherein the light emitting portion is a resonator end face, and the nitride semiconductor light emitting device is a nitride semiconductor laser device. 前記酸窒化物膜は、ターゲットに酸化アルミニウムを用いて作製されたことを特徴とする請求項9または10に記載の窒化物半導体発光素子の製造方法。 11. The method for manufacturing a nitride semiconductor light emitting element according to claim 9 , wherein the oxynitride film is manufactured using aluminum oxide as a target. 前記コート膜は、成膜炉内の少なくとも一部が酸化された状態で形成されることを特徴とする請求項9または10に記載の窒化物半導体発光素子の製造方法。 11. The method for manufacturing a nitride semiconductor light emitting element according to claim 9 , wherein the coat film is formed in a state in which at least a part in a film forming furnace is oxidized. 前記酸窒化物膜は、ターゲットにアルミニウムを用い、成膜炉内に少なくとも窒素ガスと酸素ガスとを導入することによって形成されることを特徴とする請求項9または10に記載の窒化物半導体発光素子の製造方法。The nitride semiconductor light emitting device according to claim 9 or 10, wherein the oxynitride film is formed by using aluminum as a target and introducing at least nitrogen gas and oxygen gas into a film forming furnace. Device manufacturing method. 前記酸窒化物膜は、ターゲットに酸窒化アルミニウムおよび酸化アルミニウムの少なくとも一方を用い、成膜炉内に酸素ガスを導入せずに形成されることを特徴とする請求項9または10に記載の窒化物半導体発光素子の製造方法。The oxynitride film according to claim 9 or 10, wherein the oxynitride film is formed using at least one of aluminum oxynitride and aluminum oxide as a target without introducing oxygen gas into a film forming furnace. For manufacturing a semiconductor light emitting device. 前記酸窒化物膜は、成膜炉内の少なくとも一部を酸化させて前記成膜炉内に酸素ガスを導入せずに形成されることを特徴とする請求項9または10に記載の窒化物半導体発光素子の製造方法。The nitride according to claim 9 or 10, wherein the oxynitride film is formed without oxidizing oxygen gas into the film forming furnace by oxidizing at least a part of the film forming furnace. A method for manufacturing a semiconductor light emitting device.
JP2006329465A 2005-12-16 2006-12-06 Nitride semiconductor laser device Active JP4776514B2 (en)

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JP2006329465A JP4776514B2 (en) 2005-12-16 2006-12-06 Nitride semiconductor laser device

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JP2005363589 2005-12-16
JP2005363589 2005-12-16
JP2006329465A JP4776514B2 (en) 2005-12-16 2006-12-06 Nitride semiconductor laser device

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JP2007189207A JP2007189207A (en) 2007-07-26
JP2007189207A5 true JP2007189207A5 (en) 2008-04-03
JP4776514B2 JP4776514B2 (en) 2011-09-21

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JP5004597B2 (en) 2006-03-06 2012-08-22 シャープ株式会社 Nitride semiconductor light emitting device and method for manufacturing nitride semiconductor light emitting device
JP5430826B2 (en) 2006-03-08 2014-03-05 シャープ株式会社 Nitride semiconductor laser device
JP5127644B2 (en) * 2007-09-28 2013-01-23 三洋電機株式会社 Nitride semiconductor laser device
JP5127642B2 (en) * 2007-09-28 2013-01-23 三洋電機株式会社 Nitride semiconductor laser device
JP4621791B2 (en) 2009-06-11 2011-01-26 シャープ株式会社 Nitride semiconductor laser device

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JP2000021860A (en) * 1998-07-03 2000-01-21 Hitachi Ltd Semiconductor device and its manufacture
JP4977931B2 (en) * 2001-03-06 2012-07-18 ソニー株式会社 GaN semiconductor laser manufacturing method
JP2005340625A (en) * 2004-05-28 2005-12-08 Nichia Chem Ind Ltd Nitride semiconductor laser device

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