JP2007186725A5 - - Google Patents

Description

In the sputtering method, ions in the plasma atmosphere, treatment in accordance with the composition of Utosu Ru film to film formation on the substrate surface is accelerated toward the target made into a predetermined shape by an impact, to scatter the target atom, A thin film is formed on the surface of the processing substrate. In this case, a plasma atmosphere is formed by applying a voltage to the target, which is a cathode electrode, via a DC power supply or an AC power supply, thereby generating a glow discharge between the cathode electrode and the anode electrode or the earth electrode. .

In this case, the targets 41a and 41b are juxtaposed so that the sputtering surfaces 411 when not in use are positioned on the same plane parallel to the processing substrate S, and between the side surfaces 412 facing each target 41a and 41b. Does not have any components such as an anode or a shield. The external dimensions of the targets 41a and 41b are set to be larger than the external dimensions of the processing substrate S when the targets 41a and 41b are arranged side by side.

Then, the second driver circuit 73a and the second PMW control circuit 73b, for example, the first and fourth switching transistors 72a, 72 d, the second and third on the switching transistor 72 b, 72 c, When the operation of each switching transistor 72a, 72b, 72c, 72d is controlled so that the OFF timing is reversed, sinusoidal AC power can be output via the AC power lines 74a, 74b from the oscillation switch circuit 72. In this case, a detection circuit 75a and an AD conversion circuit 75b that detect an oscillation voltage and an oscillation current are provided, and are input to the second CPU circuit 71 via the detection circuit 75a and the AD conversion circuit 75b.

In the present embodiment, the oscillating unit 7 is provided with arc detecting means 8 for detecting a voltage drop in which the voltage drop time of the output voltage waveform to the pair of targets 41a and 41b is shorter than that during normal glow discharge. It was. When the arc detection means 8 detects the occurrence of arc discharge, the voltage drop arc output signal is output to the second CPU circuit 71 connected to be communicable, and the first CPU communicable with the second CPU circuit 71 is provided. The operation of the switching transistor 65 is controlled by the first driver circuit 66a by the control signal from the circuit 61 , and the output to the pair of targets 41a and 41b is immediately cut off.

If it demonstrates with reference to Fig.6 (a) and FIG.6 (b), 90 is the arc detection means which concerns on other embodiment. The arc detection means 90 detects the occurrence of arc discharge from the difference waveform between the output voltage waveform and the output current waveform, and a current sensor amplifier 910 and current transformer amplifier that amplify the output voltage and output current from the detection circuit 77a. 920, known noise filters 930a and 930b that can remove noise in the output voltage waveform and output current waveform, and adjustment so that the amplitudes of the output voltage waveform and output current waveform that have passed through the noise filters 930a and 930b substantially match First and second gain adjustment circuits 940a and 940b.

Further, the arc detection means 90 receives the output voltage waveform and the output current waveform that have passed through the first and second gain adjustment circuits 940a and 940b, respectively, and the difference between the known structures that performs differential operation according to the difference between them. Differential waveform detection provided with a dynamic amplifier 950, an absolute value detection circuit 960 that detects the absolute value of the differential waveform from the differential amplifier 950, and a comparator 970a to which the absolute value and the differential waveform detection level are input. Circuit 970.