JP2007179829A - Mask cleaning device for organic el element, and manufacturing method of organic el display using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask cleaning device for an organic EL element capable of suppressing temperature irregularity and etching irregularity of a mask, and of improving etching efficiency while suppressing temperature rise of the mask; and to provide a manufacturing method of an organic EL display using it. <P>SOLUTION: In this mask cleaning device 1, two dispersion plates 21 and 22 are arranged stepwise in a gas discharge part 14 in a chamber 11. The dispersion plate 21 is arranged to close a discharge opening 23a of a tube body 23 constituting the gas discharge part 14, and the dispersion plate 22 is arranged, oppositely to the dispersion plate 21, on the upstream side of a gas flow of the dispersion plate 21 in the tube body 23. The dispersion plates 21 and 22 are provided with a plurality of holes 21a and 22a dispersedly arranged for passing gas therethrough, respectively. The holes 21a and 22a are formed by shifting the positions thereof from each other so as not to face the holes 21a of the dispersion plate 21 and the holes 22a of the dispersion plate 22 to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL element mask cleaning apparatus and an organic EL display manufacturing method using the same.

As a conventional cleaning device, there is one described in Patent Document 1. In this mask cleaning apparatus, the O ₂ gas is turned into plasma immediately before being introduced into the chamber and applied to the mask from above.

JP-A-5-175112

  However, as in the above-mentioned Patent Document 1, when a plasma gas converted into plasma is immediately introduced into the chamber and the mask is cleaned, the overall temperature of the mask is increased, temperature unevenness, the etching efficiency is reduced overall, It was found that etching unevenness might be caused. The principle explanation and the like regarding this point will be described in the best mode for carrying out the invention later.

  Further, when the organic layer of the organic EL device is formed, since the gaseous organic material is applied to the substrate surface from below through the mask, the organic material adheres mainly to the lower surface side of the mask. For this reason, the method of applying the cleaning gas to the mask from above as in Patent Document 1 cannot efficiently clean the mask for forming the organic layer of the organic EL device.

  Accordingly, a first problem to be solved by the present invention is to provide a mask cleaning device for an organic EL element that can suppress mask temperature unevenness and etching unevenness, and can improve etching efficiency while suppressing temperature rise of the mask. That is.

  The second problem to be solved by the present invention is to provide a mask cleaning apparatus for an organic EL element that can efficiently clean the mask for forming an organic layer of the organic EL element.

  A third problem to be solved by the present invention is to provide a method for producing an organic EL display with high productivity by efficiently cleaning a mask.

  In order to solve the above-mentioned problem, the invention of claim 1 is a mask cleaning apparatus for an organic EL element for cleaning a mask used for forming an organic layer of an organic EL element, and comprises a plasma gas generating unit for generating a plasma gas A chamber for accommodating the mask, a transport pipe for transporting the plasma gas from the plasma gas generator into the chamber, and a gas flow provided in the chamber and introduced by the transport pipe is dispersed or A plurality of gas flow converting means for changing the direction.

  According to a second aspect of the present invention, there is provided a mask cleaning apparatus for an organic EL element for cleaning a mask used for forming an organic layer of an organic EL element, the plasma gas generating part for generating a plasma gas, and the mask being accommodated A chamber for transporting the plasma gas from the plasma gas generation unit into the chamber, and a gas discharge provided in the chamber for discharging the gas sent by the transport tube toward the mask The gas discharge means is provided in a gas flow path of the gas discharge means and includes a plurality of gas flow conversion means for dispersing or redirecting the gas flow.

  According to a third aspect of the present invention, in the organic EL element mask cleaning device according to the first or second aspect of the present invention, the plurality of gas flow conversion means are at least one provided with a plurality of holes through which gas passes. With two dispersion plates.

  According to a fourth aspect of the present invention, in the organic EL element mask cleaning apparatus according to the first or second aspect of the present invention, the plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other. Each of the dispersion plates has a plurality of holes through which gas passes, and the holes of the dispersion plates are provided so as not to face each other between the adjacent dispersion plates.

  According to a fifth aspect of the present invention, in the organic EL element mask cleaning apparatus according to the first or second aspect of the present invention, the plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other. Each of the dispersion plates has a plurality of holes through which gas passes, and the holes provided in the dispersion plate on the most upstream side of the gas flow among the plurality of dispersion plates have the gas that has passed through the holes. It is provided to be inclined obliquely outward with respect to the dispersion plate so as to blow out obliquely outward.

  Further, according to a sixth aspect of the present invention, in the organic EL element mask cleaning apparatus according to the first or second aspect of the present invention, the plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other. Each of the dispersion plates has a plurality of holes through which gas passes, and the plurality of dispersion plates include at least one dispersion plate in which the diameter of the hole in the central part is smaller than the diameter of the hole in the peripheral part. Prepare.

  According to a seventh aspect of the present invention, in the organic EL element mask cleaning apparatus according to the second aspect of the present invention, the gas discharge section includes a receiving port for receiving the gas sent from the transport pipe, and a receiving port for the receiving port. A tube having a discharge port for discharging the gas received from the chamber into the chamber, and the plurality of gas flow conversion means includes a plurality of dispersion plates disposed to face each other in the tube, Each of the dispersion plates has a plurality of holes through which gas passes, and the dispersion plate disposed on the most upstream side of the gas flow among the plurality of dispersion plates faces the receiving port and is provided with the holes. Has no part.

  According to an eighth aspect of the present invention, in the organic EL element mask cleaning device according to the second aspect of the present invention, the gas discharge section includes a receiving port for receiving the gas sent from the transport pipe, and a receiving port for the receiving port. A tube having a discharge port for discharging the gas received from the chamber into the chamber, wherein the plurality of gas flow conversion means are arranged to face the reception port in the tube, and the reception port The gas flow conversion member which converts the flow of the said gas sent out from the front to the outward side is provided.

  In the invention of claim 9, in the organic EL element mask cleaning apparatus according to any one of claims 1 to 8, at least one of the plurality of gas flow conversion means comprises at least one of the plurality of gas flow conversion means. The surface portion is made of a fluorine-based resin.

  In the invention of claim 10, in the organic EL element mask cleaning apparatus according to any one of claims 1 to 8, at least one of the plurality of gas flow conversion means comprises at least one of the plurality of gas flow conversion means. The surface portion has conductivity and is set to a constant potential.

  According to an eleventh aspect of the present invention, in the organic EL element mask cleaning apparatus according to any one of the first to tenth aspects, the transport pipe introduces the plasma gas into the chamber from below.

  The invention of claim 12 is the organic EL element mask cleaning apparatus according to any one of claims 1 to 11, further comprising an exhaust pipe for exhausting the plasma gas, wherein the exhaust pipe The plasma gas is exhausted out of the chamber from above.

  The invention of claim 13 uses a step of cleaning a used mask using the organic EL element mask cleaning device according to any one of claims 1 to 12, and uses the cleaned mask. Forming a plurality of organic light emitting layers on the substrate, and forming a plurality of organic EL elements.

  According to the first and second aspects of the present invention, since the plurality of gas flow conversion means provided in stages disperse or redirect the gas flow, the uniformity of the gas applied to the mask is improved. Thus, mask temperature unevenness and etching unevenness are suppressed.

  Further, when the gas collides with the plurality of gas flow path conversion means provided in stages, the kinetic energy of the high energy particles in the gas is reduced, thereby suppressing the temperature rise of the mask. In addition, chemically active particles that contribute to etching, that is, active neutral radicals that easily react with organic substances on the mask surface are generated, which increases the chemical energy of the gas, thereby improving etching efficiency. I can plan.

  According to the invention described in claim 3, by using the dispersion plate provided with a plurality of holes, the gas applied to the mask is more effectively uniformed, and the kinetic energy of the high energy particles in the gas is increased. Reduction and chemical reactivity improvement are further promoted.

  According to invention of Claim 4, since the hole of a dispersion | distribution plate is provided so that adjacent dispersion | distribution plates may not oppose, while the gas applied to a mask is equalized more effectively, gas Reduction of kinetic energy and improvement of chemical reactivity of the high-energy particles therein are further promoted.

  According to the fifth aspect of the present invention, the hole provided in the dispersion plate on the most upstream side of the gas flow among the plurality of dispersion plates is dispersed so that the gas that has passed through the hole is blown obliquely outward. Inclined outwardly with respect to the plate. For this reason, the gas flow can be effectively dispersed outward, and as a result, the gas applied to the mask is more effectively uniformized.

  According to the invention described in claim 6, since the plurality of dispersion plates include at least one dispersion plate in which the diameter of the hole in the central portion is made smaller than the diameter of the hole in the peripheral portion, the gas flow is effective. Can be dispersed outward. For this reason, the gas flow can be effectively dispersed outward, and as a result, the gas applied to the mask is more effectively uniformized.

  According to the seventh aspect of the present invention, the dispersion plate disposed on the most upstream side of the plurality of dispersion plates provided in the gas discharge portion faces the receiving port of the gas discharge portion and is provided with a hole. Has no part. For this reason, the flow of the gas introduced into the gas discharge portion from the receiving port can be effectively dispersed outward, and the gas applied to the mask is more effectively uniformized.

  According to invention of Claim 8, the gas flow conversion member arrange | positioned so that it may oppose the receiving port in a gas discharge part converts the flow of the gas sent out from a receiving port to the front direction to the outward side. . For this reason, the flow of the gas introduced into the gas discharge part from the receiving port can be effectively dispersed outward. Thus, the gas flow can be effectively dispersed outward, and as a result, the gas applied to the mask is more effectively uniformized.

  According to the ninth aspect of the present invention, by forming at least the surface portion of the gas flow conversion means with a fluororesin, the energy loss of the gas when the gas flow is dispersed or redirected by the gas flow conversion means is reduced. Can be reduced.

  According to the tenth aspect of the present invention, since at least the surface portion of the gas flow converting means is set to a constant potential as conductivity, unnecessary charged particles in the gas are adsorbed to the gas flow converting means. ing. For this reason, it is possible to prevent the mask from being damaged by the charged particles in the gas and the temperature of the mask from rising.

  According to the eleventh aspect of the present invention, since the gas is introduced into the chamber from below, the organic matter attached to the lower surface side of the mask attached at the time of forming the organic layer can be efficiently removed.

  According to the twelfth aspect of the present invention, since the exhaust pipe exhausts the gas from above to the outside of the chamber, a flow from the bottom to the top of the gas can be easily formed in the chamber, and the lower surface side of the mask The etching efficiency with respect to is improved.

  According to the thirteenth aspect of the present invention, the mask is cleaned using the organic EL element mask cleaning device according to any one of the first to twelfth aspects, and the organic EL element is cleaned using the mask. Since the organic EL display is manufactured by forming the layer, damage such as deformation due to mask cleaning is small, and the mask can be reused in a good state. As a result, the yield of the organic EL display can be improved.

<Basic technology>
Before describing the embodiment, an organic EL element mask cleaning device 100 which is a basis of an organic EL element mask cleaning device according to an embodiment described later will be described with reference to FIG.

  As shown in FIG. 1, the organic EL element mask cleaning apparatus 100 includes a chamber 11, a plasma gas generation unit 12, a transport pipe 13, and a gas discharge unit 14. Used.

  As shown in FIG. 2, the mask 15 is a plate-like member made of metal, and is used for forming an organic layer of an organic EL device, and periodically removes organic substances adhering at the time of forming the organic layer. Need to be removed. In addition, since the gaseous organic material is applied to the substrate surface from below through the mask when the organic layer is formed, the organic matter to be removed adheres mainly to the lower surface side of the mask. Further, since the mask 15 is deformed by temperature rise or temperature unevenness, it is necessary to perform cleaning while suppressing the temperature rise or temperature unevenness.

The chamber 11 is held in a reduced pressure state (for example, a vacuum state) while the mask 15 is accommodated. The plasma gas generation unit 12 includes a cleaning gas supply source and a plasma generation device (not shown). Then, the cleaning gas supplied from the cleaning gas supply source is turned into plasma by the plasma generation device and sent out into the transport pipe 13. As the cleaning gas, for example, a mixed gas of CF ₄ and O ₂ is used. A carrier gas such as N ₂ may be mixed with the cleaning gas.

  The transport pipe 13 transports the plasma gas generated by the plasma gas generation unit 12 to the gas discharge unit 14 in the chamber 11. The gas discharge unit 14 is configured by, for example, a shower head, is installed below the mask 15 in the chamber 11, and discharges the plasma gas generated by the plasma gas generation unit 12 toward the mask 15 from below. Note that the plasma gas generated in the plasma gas generation unit 12 is a plasma-excited gas, and includes ions having charge and radicals having no charge, and some ions are included in the transport tube 13 and the gas. Since the plasma state may change to the radical state in the course of passing through the discharge unit 14, the gas introduced into the chamber 11 is not necessarily an ion having a charge.

  FIG. 3 is a graph showing the relationship between the etching rate and the temperature rise amount at the central portion 15a and the peripheral portion 15b of the mask 15 and the cleaning gas flow rate when the organic EL element mask cleaning apparatus 100 is used. A line L1a in FIG. 3 shows the relationship between the etching rate of the central portion 15a of the mask 15 and the cleaning gas flow rate, and a line L1b shows the relationship between the etching rate of the peripheral portion 15b of the mask 15 and the cleaning gas flow rate. Indicates the relationship between the temperature rise amount from the room temperature of the central portion 15a of the mask 15 and the cleaning gas flow rate, and the line L2b indicates the relationship between the temperature rise amount from the room temperature of the peripheral portion 15b of the mask 15 and the cleaning gas flow rate. Yes. The cleaning gas is a gas used for cleaning the mask by introducing a plasma gas generated outside the chamber into the chamber.

From the graph of FIG. 3, it can be seen that the central portion 15a of the mask 15 has a larger temperature increase during cleaning than the peripheral portion 15b. Moreover, it can be seen that the etching rate is lower than that of the peripheral portion 15b although the central portion 15a has a large temperature rise (that is, the energy level of the applied cleaning gas is high). This shows that the etching rate is not necessarily high if the energy of the etching particles is high. The energy of the gas is mainly divided into chemical energy and kinetic energy, but particles that are thought to contribute mainly to etching are particles with high chemical energy. In the cleaning apparatus, the organic matter on the mask surface is mainly evaporated by oxygen radicals reacting with the organic matter and being evaporated as H ₂ O, CO _x or the like. Further, when a metal atom is contained in the organic substance on the mask surface, the fluorine radical reacts with the metal atom to generate a metal fluoride to evaporate, whereby the organic substance on the mask surface is decomposed and removed. That is, particles that easily react with the organic substance on the mask surface and have high chemical energy contribute to the etching. In contrast, particles having low chemical energy are considered to contribute little to cleaning even if their kinetic energy is high. In the central portion 15a of the mask 15, it is presumed that the ratio of high energy particles having low chemical energy and high kinetic energy, which is considered not to contribute much to etching, is high.

  Accordingly, the inventors of the present application pay attention to the above characteristics of the plasma gas, and can suppress the temperature unevenness and etching unevenness of the mask 15 and can improve the etching efficiency while suppressing the temperature rise of the mask 15. Created a cleaning device. This will be described below.

<Embodiment>
FIG. 4 is a diagram schematically showing the configuration of the organic EL element mask cleaning apparatus 1 according to an embodiment of the present invention. FIGS. 5A and 5B are diagrams for the organic EL element mask of FIG. FIG. 2 is a front view and a cross-sectional view of a gas discharge unit 14 provided in the cleaning device 1. In addition, about the structure of each part of the mask cleaning apparatus 1 for organic EL elements shown in FIG. 4, the part which is common in the mask cleaning apparatus 100 for organic EL elements shown in FIG. .

  In the organic EL element mask cleaning apparatus 1 according to the present embodiment, as shown in FIGS. 4, 5A and 5B, the gas discharge unit 14 includes two dispersion plates 21 which are gas flow conversion means. , 22 are provided in stages. The dispersion plate 21 is provided so as to block the discharge port 23a of the tube body 23 constituting the gas discharge unit 14, and the dispersion plate 22 is disposed on the dispersion plate 21 upstream of the gas flow of the dispersion plate 21 in the tube body 23. Opposed to each other.

  Dispersion plates 21 and 22 are provided with a plurality of holes 21a and 22a through which dispersed gas is passed. The holes 21a and 22a are provided at different positions so that the holes 21a of the dispersion plate 21 and the holes 22a of the dispersion plate 22 do not face each other.

  With such a configuration, the gas introduced into the gas discharge unit 14 via the transport pipe 13 is effectively dispersed by the dispersion plates 21 and 22 provided in a two-stage configuration and applied to the mask 15. Yes. As a result, it is possible to reduce the bias of high energy particles or highly chemically reactive particles in the gas applied to the mask 15, improve the uniformity of the gas, and suppress the temperature unevenness and etching unevenness of the mask 15.

  In addition, when the gas collides with the two dispersion plates 21 and 22 provided in stages, the kinetic energy of the high energy particles in the gas decreases, and the interaction between the gas particles and the dispersion plates 21 and 22 The chemical energy of the gas rises due to the generation of chemically active particles that contribute to etching due to collisions, that is, active neutral radicals that easily react with organic substances on the mask surface of the object to be etched. Thus, the temperature rise of the mask 15 can be suppressed and the etching efficiency can be improved.

  Further, since the holes 21a and 22a of the dispersion plates 21 and 22 are provided so as not to face each other between the dispersion plates 21 and 22, the gas applied to the mask 15 is made more effective and uniform. Reduction of kinetic energy and improvement of chemical reactivity of the high-energy particles are further promoted.

  Further, the plasma gas generated in the plasma generation unit 12 is introduced into the chamber 11 from below by the transport pipe 13, and the gas introduced into the chamber 11 is discharged from below toward the mask 15 by the gas discharge unit 14. Therefore, organic substances on the lower surface side of the mask 15 attached when forming the organic layer can be efficiently removed.

  You may make it form the surface part or the whole in one or both of the dispersion plates 21 and 22 with a fluorine resin. Thus, it is possible to suppress the neutral radicals related to etching from losing activity (deactivation) when the gas flow is dispersed. Note that the inner wall portion of the tube body 23 of the gas discharge portion 14 may be formed of a fluorine-based resin.

  Next, a method for manufacturing an organic EL display using the above-described organic EL element mask cleaning apparatus 1 will be briefly described.

  (1) First, the mask 15 already used for vapor deposition of the organic layer or the like is cleaned using the above-described mask cleaning device.

  (2) Next, in order to use the cleaned mask 15 again, it is placed on the substrate on which the first electrode is deposited, and an organic material is deposited on the first electrode through the opening of the mask 15, Form a layer.

  (3) Then, by depositing the second electrode layer on the organic layer, a plurality of organic EL elements are formed on the substrate, and a protective film, a sealing substrate, etc. are formed on the organic EL element as necessary. Arrangement completes the organic EL display.

  At this time, since the above-described mask cleaning device is used for cleaning the mask 15, damage such as deformation due to mask cleaning is small, and the mask 15 can be reused in a good state. As a result, the yield of the organic EL display can be improved.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible within the range which does not deviate from this invention.

  For example, in the gas discharge unit 14a shown in FIGS. 6A and 6B, three dispersion plates 21, 22, and 24 are provided in a three-stage configuration. The dispersion plate 24 is provided with a plurality of holes 24a that allow gas to pass therethrough. Further, the positions of the holes 21a, 22a, 24a are shifted from each other between the adjacent dispersion plates 21, 22, 24.

  In the gas discharge portion 14b shown in FIGS. 7A and 7B, a hole 22a is provided in a region other than the central portion 22b facing the receiving port 23b of the tubular body 23 in the upstream dispersion plate 22. The central portion 22b is configured without the hole 22a. Thereby, the flow of the gas introduced into the gas discharge part 14b from the receiving port 23b via the transport pipe 13 can be effectively dispersed outward, and the gas applied to the mask 15 can be more effectively distributed. It is made uniform.

  In the gas discharge part 14 d shown in FIGS. 9A and 9B, a gas flow conversion member 26 is provided on the upstream side of the dispersion plate 21 instead of the dispersion plate 22. The gas flow conversion member 26 includes a shielding plate 26a disposed facing the receiving port 23b of the tube body 23, and a plurality of guide plates 26b. The shielding plate 26a has a substantially dish shape whose peripheral portion is inclined to one side, and is disposed with its concave surface facing the receiving port 23b. Therefore, the gas traveling in the front direction A1 indicated by the arrow A1 from the receiving port 23b hits the shielding plate 26a, and the flow of the gas is converted to the obliquely outward upstream side indicated by the arrow A2. The plurality of guide plates 26b are provided to guide the converted gas flow. For this reason, also in this modification, the flow of the gas introduced into the gas discharge portion 14d from the receiving port 23b through the transport pipe 13 can be effectively dispersed outward and applied to the mask 15. The gas is more effectively uniformized.

  In the gas discharge part 14e shown in FIGS. 10A and 10B, the hole 22a provided in the upstream dispersion plate 22 passes through the hole 22a and the gas is directed obliquely outward as indicated by an arrow A3. So as to be blown out obliquely with respect to the dispersion plate 22. Accordingly, when the gas passes through the dispersion plate 22, the gas flow can be effectively dispersed outward, and the gas applied to the mask 15 can be more effectively uniformized.

  In the gas discharge part 14f shown to Fig.11 (a) and FIG.11 (b), in the upstream dispersion plate 22, it sets so that the diameter of the hole 22a may become small toward the hole 22a provided in the center part. For this reason, when the gas passes through the dispersion plate 22, the gas flow can be effectively dispersed outward, and the gas applied to the mask 15 is more effectively uniformized.

  In the gas discharge part 14g shown in FIGS. 12 (a) and 12 (b), the gas transport groove 27 is arranged in a substantially comb-like shape on the upstream surface side (lower surface side) of the upstream dispersion plate 22. Yes. The holes 22 a of the dispersion plate 22 are disposed along the gas transport grooves 27. With such a configuration, the gas transport path on the upstream side of the upstream dispersion plate 22 in the gas discharge portion 14g is limited, and the collision with the wall of the gas particles and the collision between the particles are caused uniformly and reliably. However, the gas transportation distance can be secured. Then, after the gas has passed through the dispersion plate 22 on the downstream side, the gas is uniformly diffused in a wide space between the dispersion plates 21 and 22, and the uniformity of the gas is improved.

  In the organic EL element mask cleaning apparatus 1 a shown in FIG. 13, the tube body 23 of the gas discharge unit 14 is omitted, and the dispersion plates 21 and 22 are provided so as to partition the inside of the chamber 11.

  In the organic EL element mask cleaning apparatus 1 b shown in FIG. 14, an exhaust pipe 28 for exhausting gas is provided in the upper part of the chamber 11. The exhaust pipe 28 exhausts the gas from the top to the outside of the chamber 11 (for example, vacuum exhaust). Thereby, the flow from the bottom to the top of the gas can be easily formed in the chamber 12, and the etching efficiency for the lower surface side of the mask 15 is improved.

  Moreover, in the gas discharge part 14 which concerns on the above-mentioned embodiment, at least any one of the dispersion plates 21 and 22 (for example, the upstream dispersion plate 22) is formed of a conductive material such as metal, and the surface The part may be set to a constant potential. Thus, unnecessary charged particles in the gas are adsorbed on the surfaces of the dispersion plates 21 and 22. For this reason, it is possible to prevent the mask 15 from being damaged by charged particles in the gas and the temperature of the mask 15 from rising. The potential of the dispersion plates 21 and 22 set to a constant potential is set to a positive, negative, or zero potential level depending on the characteristics of charged particles in the gas.

It is a figure which shows typically the structure of the mask cleaning apparatus for organic EL elements used as the foundation of the mask cleaning apparatus for organic EL elements which concerns on one Embodiment of this invention. It is a top view of the mask of cleaning object. 2 is a graph showing the relationship between the etching rate and the temperature increase amount at the center and peripheral portions of the mask and the flow rate of the cleaning gas when the organic EL element mask cleaning apparatus of FIG. 1 is used. It is a figure which shows typically the structure of the mask cleaning apparatus for organic EL elements which concerns on one Embodiment of this invention. FIGS. 5A and 5B are a front view and a cross-sectional view of a gas discharge unit provided in the organic EL element mask cleaning apparatus of FIG. 6 (a) and 6 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). 7 (a) and 7 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). 8 (a) and 8 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). FIG. 9A and FIG. 9B are diagrams showing a modification of the configuration shown in FIG. 5A and FIG. 5B. 10 (a) and 10 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). 11 (a) and 11 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). 12 (a) and 12 (b) are diagrams showing a modification of the configuration shown in FIGS. 5 (a) and 5 (b). It is a figure which shows the modification of the structure shown in FIG. It is a figure which shows the modification of the structure shown in FIG.

Explanation of symbols

  1, 1a, 100 Organic EL element mask cleaning device, 11 chamber, 12 plasma gas generation unit, 13 transport pipe, 14, 14a to 14f gas discharge unit, 15 mask, 21, 22 dispersion plate, 21a, 22a hole, 23 Tubing body, 23a discharge port, 23b receiving port, 24 dispersion plate, 24a hole, 25, 26 gas flow converting member, 27 gas transport groove, 28 exhaust pipe.

Claims (13)

An organic EL element mask cleaning device for cleaning a mask used for forming an organic layer of an organic EL element,
A plasma gas generator for generating plasma gas;
A chamber containing the mask;
A transport pipe for transporting the plasma gas from the plasma gas generator into the chamber;
A plurality of gas flow converting means provided in the chamber for dispersing or redirecting a gas flow introduced by the transport pipe;
An organic EL element mask cleaning device comprising: An organic EL element mask cleaning device for cleaning a mask used for forming an organic layer of an organic EL element,
A plasma gas generator for generating plasma gas;
A chamber containing the mask;
A transport pipe for transporting the plasma gas from the plasma gas generator into the chamber;
A gas discharge means that is provided in the chamber and discharges the gas sent by the transport pipe toward the mask;
With
The gas discharge means is
A mask cleaning apparatus for an organic EL element, comprising a plurality of gas flow conversion means provided in a gas flow path of the gas discharge means for dispersing or redirecting the gas flow. In the organic EL element mask cleaning device according to claim 1 or 2,
The organic EL element mask cleaning device, wherein the plurality of gas flow conversion means includes at least one dispersion plate provided with a plurality of holes through which gas passes. In the organic EL element mask cleaning device according to claim 1 or 2,
The plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other,
Each of the dispersion plates has a plurality of holes through which gas passes,
The organic EL element mask cleaning device, wherein the holes of the respective dispersion plates are provided so as not to face each other between the adjacent dispersion plates. In the organic EL element mask cleaning device according to claim 1 or 2,
The plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other,
Each of the dispersion plates has a plurality of holes through which gas passes,
Of the plurality of dispersion plates, the hole provided in the dispersion plate on the most upstream side of the gas flow is inclined outwardly with respect to the dispersion plate so that the gas that has passed through the hole is blown obliquely outward. An organic EL element mask cleaning device, wherein the mask cleaning device is provided so as to be inclined toward the surface. In the organic EL element mask cleaning device according to claim 1 or 2,
The plurality of gas flow conversion means includes a plurality of dispersion plates arranged to face each other,
Each of the dispersion plates has a plurality of holes through which gas passes,
The organic EL element mask cleaning apparatus, wherein the plurality of dispersion plates include at least one dispersion plate in which a diameter of the hole in a central portion is smaller than a diameter of the hole in a peripheral portion. In the mask cleaning apparatus for organic EL elements according to claim 2,
The gas discharge part is
A tube having an inlet for receiving the gas sent from the transport pipe and an outlet for discharging the gas received from the inlet into the chamber;
The plurality of gas flow conversion means includes a plurality of dispersion plates disposed opposite to each other in the pipe body,
Each of the dispersion plates has a plurality of holes through which gas passes,
The dispersion plate disposed on the most upstream side of the gas flow among the plurality of dispersion plates,
A mask cleaning apparatus for an organic EL element, having a portion facing the receiving port and not provided with the hole. In the mask cleaning apparatus for organic EL elements according to claim 2,
The gas discharge part is
A tube having an inlet for receiving the gas sent from the transport pipe and an outlet for discharging the gas received from the inlet into the chamber;
The plurality of gas flow conversion means includes:
For an organic EL element, comprising a gas flow conversion member that is disposed so as to face the receiving port in the pipe and converts the flow of the gas fed from the receiving port in the front direction to the outside. Mask cleaning device. In the organic EL element mask cleaning device according to any one of claims 1 to 8,
The organic EL element mask cleaning apparatus, wherein at least one of the plurality of gas flow conversion means has at least a surface portion formed of a fluorine-based resin. In the organic EL element mask cleaning device according to any one of claims 1 to 8,
At least one gas flow conversion means among the plurality of gas flow conversion means has at least a surface portion that is conductive and is set to a constant potential. In the mask cleaning apparatus for organic EL elements according to any one of claims 1 to 10,
The transport pipe introduces the plasma gas into the chamber from below, and is a mask cleaning apparatus for an organic EL element. In the organic EL element mask cleaning device according to any one of claims 1 to 11,
An exhaust pipe for exhausting the plasma gas;
The organic EL element mask cleaning apparatus, wherein the exhaust pipe exhausts the plasma gas from above to the outside of the chamber. A step of cleaning a used mask using the organic EL element mask cleaning device according to any one of claims 1 to 12,
Forming a plurality of organic light emitting layers on the substrate using the washed mask, and forming a plurality of organic EL elements.

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