JP2007172088A - Strap continuous body, inlet continuous body and manufacturing method for ic label continuous body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and surely prevent an IC chip from being damaged due to static electricity in a process for manufacturing an IC label or an IC card equipped with an IC chip and an antenna. <P>SOLUTION: A plurality of straps 40 respectively mounted with an IC chip 1 are arrayed so as to be connected to a pair of electrodes 42 installed with a required interval on one side of an insulating sheet material 41 for a strap so that a strap continuous body can be formed. Alternately, an antenna 12 having a pair of mounting parts 12a with a required interval is formed on one face of the insulating sheet material 11 for an inlet, and a plurality of inlets respectively mounted with the IC chip are arrayed between a pair of chip mounting parts so that the strap continuous body can be formed. Conductive lines 43 and 13 for ground extended to the array direction of the strap or the inlets are formed, and the electrodes or the antenna are connected to the conductive lines. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a strap continuum and an inlet continuum used for producing an IC label or an IC card having an IC chip and an antenna, and a method for producing an IC label continuum using an inlet continuum. In the process of manufacturing an IC label, an IC card, or the like, the feature is that it is possible to easily and surely prevent the IC chip from being damaged by static electricity.

  In recent years, an RFID (Radio Frequency Identification) system using an IC label or an IC card having an IC chip and an antenna has been used in various fields.

  Here, when manufacturing an IC label, an IC card, or the like used in the above RFID system, for example, as shown in FIG. 1, a chip mounting portion 12a is required on one side of an insulating inlet sheet material 11. A pair of antennas 12 are provided so as to be spaced from each other, and an inlet continuum in which a plurality of inlets 10 each having the IC chip 1 attached between the chip attachment portions 12a of the pair of antennas 12 are arranged is used. .

  And when manufacturing an IC label using this inlet continuum, for example, as shown in FIG. 2, the adhesive layer 21 is provided on the opposite surface of the inlet sheet material 11 on which the antenna 12 and the IC chip 1 are provided. While the release sheet 22 is attached via the adhesive sheet 23, the surface sheet 24 is adhered to the surface of the inlet sheet material 11 provided with the antenna 12 and the IC chip 1 via the adhesive layer 23. Thereafter, each inlet 10 in the inlet continuum is separated so that the top sheet 24 and the inlet sheet material 11 are die-cut, and a haze is removed so as to remove a portion that does not include the inlet 10. As shown in FIG. 3, an IC label continuous body in which IC labels 30 are arranged on the release sheet 22 so as to be peelable is manufactured.

  However, when manufacturing an IC label continuous body in which the IC labels 30 are arranged on the release sheet 22 as described above, static electricity is generated at each stage of the manufacturing process, and the IC chip 1 is damaged by the static electricity. There is a problem that defective products are generated and the production efficiency of the normal IC label 30 is deteriorated.

  For this reason, in recent years, in each process of producing an IC label continuous body as described above, a static elimination device using a static elimination cloth or a static elimination brush is provided, and each static elimination device is brought into contact with an inlet continuum or a surface sheet. There has been proposed one that performs static elimination (see, for example, Patent Document 1).

  However, in the case where a static eliminator is provided in each process of manufacturing an IC label continuous body as described above, many static eliminators are required, resulting in high costs and a large facility for manufacturing an IC label. There is a problem that the operation is troublesome.

  In addition, as described above, if the static elimination device using the static elimination cloth or the static elimination brush is brought into contact with the inlet continuum or the surface sheet, etc., the static elimination is only performed at the place where the static elimination device is in contact, There was still a problem that the IC chip was damaged by static electricity in a portion where the static eliminator was not in contact.

  Further, in manufacturing the inlet continuum as described above, as shown in FIG. 4, it is connected to a pair of electrodes 42 provided on one side of an insulating strap sheet material 41 via a required interval. Thus, a strap continuum in which a plurality of straps 40 to which the IC chip 1 is attached is arranged is manufactured, and each strap 40 is cut out from the strap continuum, and as shown in FIG. Is attached to the chip attachment portion 12a of the pair of antennas 12 to form the inlet 10 to which the IC chip 1 is attached between the chip attachment portions 12a.

Here, even when the strap continuum as described above is manufactured, static electricity is generated in the manufacturing process, and there is a problem that the IC chip 1 is damaged by the static electricity and a defective product is generated.
JP 2002-279389 A

  An object of the present invention is to solve the various problems described above in the case of manufacturing an IC label, an IC card, or the like provided with an IC chip and an antenna.

  That is, the present invention improves the strap continuum or inlet continuum used to manufacture an IC label or IC card equipped with an IC chip and an antenna, and provides static electricity when manufacturing an IC label or IC card. Therefore, it is an object of the present invention to easily and reliably prevent the IC chip from being damaged by the above.

  In the strap continuous body according to the present invention, in order to solve the above-described problems, the IC chip is connected to a pair of electrodes provided on one side of the insulating strap sheet material through a required interval. In a strap continuum in which a plurality of attached straps are arranged, a grounding conductive line extending in the strap arrangement direction is formed on the strap sheet material, and an electrode in each strap is connected to the conductive line. I made it.

  Here, as described above, a grounding conductive line extending in the strap arrangement direction is formed on the strap sheet material, and when the electrodes in each strap are connected to the conductive line, the conductive lines are connected to the strap in a pair. The electrodes in each strap can be connected to adjacent conductive lines.

  Further, in the inlet continuum in the present invention, in order to solve the above-described problems, an antenna having a pair of chip attachment portions with a required interval is formed on one surface of the insulating inlet sheet material. In an inlet continuum in which a plurality of inlets to which IC chips are attached are arranged between the pair of chip attaching portions, a ground conductive line extending in the inlet arrangement direction is formed on the inlet sheet material, An antenna in each inlet is connected to this conductive line.

  Here, in the above-described inlet sheet material, when a pair of separated antennas having a chip mounting portion is formed so as to have a necessary interval, conductive lines are provided on both sides of the pair of antennas, The antenna at each inlet can be connected to a nearby conductive line.

  Further, in the inlet continuum according to the present invention, when the IC chip is attached between the pair of chip attachment portions through the required interval, a strap to which the IC chip is attached so as to be connected to the pair of electrodes is used. It is also possible to attach the pair of electrodes in the strap to the pair of chip attachment portions.

  In the method for producing an IC label continuous body according to the present invention, an antenna having a pair of chip mounting portions with a required interval is formed on one side of an insulating inlet sheet material, and the pair of chip mounting portions. In manufacturing an IC label continuum using an inlet continuum in which a plurality of inlets each having an IC chip attached between them are arranged, grounding is performed via a grounding conductive part to which an antenna in each inlet is connected. It was.

  Here, in the method for producing an IC label continuous body according to the present invention, the inlet continuous body according to the present invention can be used as the inlet continuous body.

  In the strap continuum of the present invention, as described above, the grounding conductive lines extending in the strap arrangement direction are formed in the insulating strap sheet material, and the electrodes in each strap are connected to the conductive lines. By grounding this conductive line, even if static electricity is generated in the strap continuum, and static electricity is generated in the process of manufacturing each strap by separating each strap from the strap continuum, It flows through the conductive line and is grounded, and charges are less likely to accumulate.

  As a result, in the process of manufacturing the strap continuum and the strap continuum from the strap continuum, the IC chip connected to the pair of electrodes in each strap can be easily damaged by static electricity without providing a static eliminator. It will surely be prevented.

  In the inlet continuum according to the present invention, as described above, the conductive sheet for earth extending in the inlet arrangement direction is formed on the insulating inlet sheet material, and the antenna in each inlet is connected to the conductive line. Therefore, even if static electricity is generated in the process of manufacturing the inlet continuum or the process of manufacturing the IC label or IC card from the inlet continuum by grounding the conductive line, the static electricity is It flows through the conductive line and is grounded, and charges are less likely to accumulate.

  As a result, in each process of manufacturing an IC label, an IC card, and the like from this inlet continuum and this inlet continuum, there is no need to provide a static eliminator as in the prior art, between a pair of chip mounting portions in each inlet. The attached IC chip is easily and reliably prevented from being damaged by static electricity, so that it is not necessary to provide many static eliminators as in the past, and the cost is reduced and the IC label, IC card, etc. There is no need to carry out the troublesome work of setting each static eliminator at an appropriate position.

  As in the method of manufacturing an IC label continuous body according to the present invention, an antenna having a pair of chip mounting portions with a required interval is formed on one surface of an insulating inlet sheet material, and the pair of chip mounting portions In manufacturing an IC label continuum using an inlet continuum in which a plurality of inlets each having an IC chip attached thereto are arranged, when grounded via a ground conductive part to which an antenna in each inlet is connected, Static electricity flows from the antenna at each inlet and is grounded, so that charges are less likely to accumulate in the antenna at each inlet, and the IC chip is prevented from being damaged by static electricity. In particular, in manufacturing the IC label continuum, when the above-described inlet continuum in the present invention is used, static electricity appropriately flows through the above-described conductive line serving as a grounding conductive portion connected to the antenna in each inlet. As a result, it is possible to easily and reliably prevent charges from being accumulated in the antenna at each inlet.

  Hereinafter, the strap continuum and the inlet continuum according to the embodiment of the present invention and the method for producing an IC label continuum using the inlet continuum will be specifically described. In addition, the manufacturing method of the strap continuum and the inlet continuum and the IC label continuum according to the present invention is not particularly limited to those shown in the following embodiments, and can be changed as appropriate without changing the gist thereof. Can be implemented.

(Embodiment 1)
In the inlet continuum in the first embodiment, as shown in FIG. 6, a plurality of pairs of antennas 12 with the chip mounting portions 12a facing each other with a required interval are arranged on one side of the insulating inlet sheet material 11, Conductive lines 13 for grounding are formed on both sides of the pair of antennas 12 arranged in this way along the arrangement direction, and lead portions are provided on the conductive lines 13 on the side where the pair of antennas 12 are close to each other. What is connected by 12b is used.

  In the first embodiment, as shown in FIG. 7, the antennas 12 arranged as described above are grounded via the lead portions 12b and the conductive lines 13, and in this state, as described above. The IC chip 1 is mounted between the chip mounting portions 12a of each of the pair of antennas 12 arranged in the above, and an inlet continuous body in which a plurality of inlets 10 are arranged is manufactured.

  Here, if the IC chip 1 is mounted between the chip mounting portions 12a of the antenna 12 with each antenna 12 grounded via the lead portion 12b and the conductive line 13 as described above, static electricity is generated. However, this static electricity flows from each antenna 12 through each conductive line 13 and is grounded, so that the IC chip 1 is prevented from being damaged by the static electricity.

  Next, when manufacturing the IC label 30 using the inlet continuum in the first embodiment, the antennas 12 arranged as described above are grounded via the lead portions 12b and the conductive lines 13, and in this state 8 and 9, the release sheet 22 is attached to the opposite surface of the inlet sheet material 11 provided with the antenna 12 and the IC chip 1 via the adhesive layer 21, while the antenna 12 and A surface sheet 24 is adhered to the surface of the inlet sheet material 11 provided with the IC chip 1 via an adhesive layer 23.

  Here, when each antenna 12 is grounded via each conductive line 13 provided in the inlet continuum as described above, it is opposite to the inlet sheet material 11 provided with the antenna 12 and the IC chip 1 as described above. The step of attaching the release sheet 22 to the side surface via the adhesive layer 21, or the surface sheet 24 is adhered to the surface of the inlet sheet material 11 provided with the antenna 12 and the IC chip 1 via the adhesive layer 23. Even if static electricity is generated in a process or the like, the static electricity flows from each antenna 12 through each conductive line 13 and is grounded, and the IC chip 1 mounted between the chip mounting portions 12a of each antenna 12 is statically charged. It is surely prevented from being damaged.

  The release sheet 22 is attached to the opposite surface of the inlet sheet material 11 on which the antenna 12 and the IC chip 1 are provided as described above via the adhesive layer 21, and the antenna 12 and the IC chip 1 are provided. After the surface sheet 24 is bonded to the surface of the inlet sheet material 11 via the adhesive layer 23, the inlet 10 is separated from the conductive lines 13 as shown in FIG. The top sheet 24 and the inlet sheet material 11 are die-cut, and then the scraping is performed so as to remove the portion that excludes the portion including the inlet 10.

  If it does in this way, the IC label continuous body by which the IC label 30 was arranged on the peeling sheet 22 as shown in FIG.

  In the first embodiment, the IC label continuum in which the IC labels 30 are arranged is manufactured using the inlet continuum as described above, but the use of the inlet continuum is not particularly limited. Although not shown, for example, it is also possible to manufacture an IC card by attaching each inlet 10 in the inlet continuum to a card base (not shown).

  Further, in the inlet continuum in the first embodiment, the ground conductive lines 13 are formed along the arrangement direction on both sides of the pair of antennas 12 where the chip mounting portions 12a face each other with a required interval therebetween. Each antenna 12 to be connected is connected to the conductive line 13 on the adjacent side by the lead portion 12b. However, as shown in FIG. 11, one side of the pair of antennas 12 where the chip mounting portions 12a face each other with a required interval. The grounding conductive line 13 is formed only on the ground, and the opposing antenna 12 is connected to the grounding conductive line 13 on one side by the lead portion 12b, or the chip mounting portion 12a is formed as shown in FIG. A conductive line 13 for grounding is formed only on one side of a pair of antennas 12 that are opposed to each other with a required interval. A pair of antenna 12 electrically connected to the connecting portion 12c which can also be so as to connect the one side of the antenna 12 adjacent to the electrically conductive line 13 to the conductive line 13 by the lead portion 12b. Note that when the IC label 30 or the IC card is manufactured, at least a part of the connection unit 12c may be cut off to release the electrical connection.

(Embodiment 2)
In the strap continuum in the second embodiment, as shown in FIG. 13, a plurality of pairs of electrodes 42 opposed to each other with a required interval are arranged on one side of the insulating strap sheet material 41. Conductive lines 43 for grounding are formed on both sides of the pair of electrodes 42 arranged along the arrangement direction, and the pair of electrodes 42 are connected to the adjacent conductive lines 43 by lead portions 42a. I'm trying to use something.

  In the second embodiment, as shown in FIG. 14, the pair of electrodes 42 arranged as described above are grounded via the lead portions 42a and the conductive lines 43, and in this state, The IC chip 1 is attached between the pair of electrodes 42 so as to be connected to the pair of electrodes 42 arranged as described above, and a continuous strap body in which a plurality of straps 40 are arranged is manufactured.

  Here, when the IC chip 1 is attached between the pair of electrodes 42 in a state where the pair of electrodes 42 are grounded via the lead portion 42a and the conductive line 43 as described above, even if static electricity is generated. The static electricity flows from each electrode 42 through the conductive line 43 and is grounded, and the IC chip 1 is prevented from being damaged by the static electricity.

  In manufacturing the IC label 30 using the strap continuum in the second embodiment, the straps 40 in the strap continuum are connected to the lead portions 42a and the conductive lines 43 as shown in FIG. The die continuation is cut out and the inlet continuum is manufactured using each of the straps 40 thus cut out.

  Here, in manufacturing the inlet continuum in the second embodiment, as in the case of the first embodiment, as shown in FIG. 6, a pair of antennas in which the chip mounting portions 12a are opposed to each other with a required interval therebetween. 12 are arranged on one side of the insulating inlet sheet material 11, and ground conductive lines 13 are formed on both sides of the pair of antennas 12 arranged in this way along the arrangement direction. A pair of antennas 12 connected to the conductive lines 13 on the adjacent side by lead portions 12b is used.

  In the second embodiment, as shown in FIG. 16, the antennas 12 arranged as described above are grounded via the lead portions 12b and the conductive lines 13, and in this state, as described above. The pair of electrodes 42 of the strap 40 are connected to the chip mounting portions 12a of the pair of antennas 12 arranged in the same manner, and the straps 40 are mounted between the chip mounting portions 12a of the pair of antennas 12, respectively. The IC chip 1 is connected between 12a, and the inlet continuous body in which a plurality of inlets 10 are arranged is manufactured.

  Thereafter, as in the case of the first embodiment, an IC label continuous body in which the IC labels 30 are arranged on the release sheet 22 so as to be peelable can be manufactured. Further, using the inlet continuum manufactured as described above, each inlet 10 in the inlet continuum is attached to a card base (not shown) in the same manner as in the first embodiment, and the IC card is mounted. It is also possible to manufacture.

  Further, in the second embodiment, when manufacturing the strap continuum, conductive lines 43 for grounding are formed on both sides of the pair of electrodes 42 facing each other with a necessary interval along the arrangement direction thereof, and are opposed to each other. Each electrode 42 is connected to the adjacent conductive line 43 by the lead portion 42a. However, as shown in FIG. 17, only one side of the pair of electrodes 42 facing each other through a required interval is connected to ground. A line 43 is formed, and the pair of electrodes 42 are connected to the grounding conductive line 43 on one side by the lead portions 12a, respectively, or as shown in FIG. The conductive line 43 for grounding is formed only on one side of each of the electrodes, and a pair of opposing electrodes 42 are electrically connected by the connecting portion 42b, thereby It is also possible to be connected to one electrode 42 which is close to the in-43 to the conductive line 43 by the lead portion 42a. In addition, when manufacturing each strap 40, at least one part is cut off so that the said connection part 42b may cancel | release the electrical connection between said pair of electrodes 42. As shown in FIG.

It is the schematic plan view which showed the conventional inlet continuum. In manufacturing an IC label using a conventional inlet continuum, a release sheet is attached to the opposite surface of the inlet sheet material provided with the antenna and IC chip, and the inlet provided with the antenna and IC chip. It is sectional explanatory drawing of the direction orthogonal to the arrangement direction of the inlet which showed the state which adhere | attached the surface sheet on the surface of the sheet material. It is the schematic plan view which showed the IC label continuous body by which the IC label was arranged so that peeling was possible on a peeling sheet. It is the schematic plan view which showed the conventional strap continuous body used for manufacturing an inlet continuous body. It is the schematic plan view of the prior art example which showed the state which manufactures an inlet continuum using a strap. In the inlet continuum in Embodiment 1 of this invention, it is the schematic top view which showed the state which arranged the antenna on the single side | surface of the insulating sheet material for inlets. It is the schematic plan view which showed the state which manufactured the inlet continuous body in Embodiment 1. FIG. In manufacturing an IC label using the inlet continuum in Embodiment 1, a release sheet is attached to the opposite surface of the inlet sheet material provided with the antenna and IC chip, and the antenna and IC chip are provided. FIG. 6 is a cross-sectional explanatory view in the inlet arrangement direction showing a state in which a surface sheet is bonded to the surface of the inlet sheet material. FIG. 5 is a schematic plan view showing a state in which a surface sheet is bonded to a surface of an inlet sheet material provided with an antenna and an IC chip when an IC label is manufactured using the inlet continuum in the first embodiment. FIG. 3 is a schematic plan view showing a state in which each inlet is separated from each conductive line when the IC label is manufactured using the inlet continuum in the first embodiment. In the inlet continuum in Embodiment 1, it is the schematic top view which showed the 1st modification which changed the state of the antenna formed in the sheet material for insulation inlets. In the inlet continuum in Embodiment 1, it is the schematic plan view which showed the 2nd modification which changed the state of the antenna formed in the sheet material for insulation inlets. In the strap continuum in Embodiment 2 of this invention, it is the schematic plan view which showed the state which arranged the electrode on the single side | surface of the insulating strap sheet material. 6 is a schematic plan view showing a state in which a strap continuum in Embodiment 2 is manufactured. FIG. FIG. 10 is a schematic plan view showing a state in which each strap in the strap continuum in Embodiment 2 is cut out so as to be separated from each lead portion and a conductive line. In Embodiment 2, it is the schematic plan view which showed the state which manufactured the inlet continuous body using the strap which was die-cut as shown in FIG. In the strap continuum in Embodiment 2, it is the schematic plan view which showed the 1st modification which changed the state of the electrode formed in the sheet | seat material for straps. In the strap continuum in Embodiment 2, it is the schematic plan view which showed the 2nd modification which changed the state of the electrode formed in the sheet | seat material for straps.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC chip 10 Inlet 11 Inlet sheet material 12 Antenna 12a Chip mounting part 12b Lead part 12c Connection part 13 Conductive line 21 Adhesive layer 22 Release sheet 23 Adhesive layer 24 Surface sheet 30 IC label 40 Strap 41 Strap sheet material 42 Electrode 42a Lead part 42b Connection part 43 Conductive line (conductive part)

Claims (7)

  In a strap continuum in which a plurality of straps each having an IC chip attached so as to be connected to a pair of electrodes provided at a predetermined interval on one side of an insulating strap sheet material, A strap continuum characterized in that a grounding conductive line extending in the strap arrangement direction is formed on a sheet material, and an electrode in each strap is connected to the conductive line.   The strap continuum according to claim 1, wherein the conductive lines are provided on both sides of a pair of electrodes in the strap, and the electrodes in each strap are connected to adjacent conductive lines.   An antenna having a pair of chip mounting portions with a required interval is formed on one surface of an insulating inlet sheet material, and a plurality of inlets each having an IC chip mounted between the pair of chip mounting portions are arranged. In the inlet continuum, the inlet continuum is characterized in that a grounding conductive line extending in the inlet arrangement direction is formed on the inlet sheet material, and an antenna in each inlet is connected to the conductive line. .   4. The inlet continuum according to claim 3, wherein a pair of separated antennas having a chip mounting portion are formed on the inlet sheet material so as to have a required interval, and conductive on both sides of the pair of antennas. An inlet continuum characterized in that a line is provided and an antenna in each inlet is connected to a conductive line adjacent thereto.   5. The inlet continuum according to claim 3 or 4, wherein a strap to which an IC chip is attached so as to be connected to a pair of electrodes is used, and the pair of electrodes in the strap is attached to the pair of chip attachment portions. Inlet continuum characterized by being made.   An antenna having a pair of chip mounting portions with a required interval is formed on one surface of an insulating inlet sheet material, and a plurality of inlets each having an IC chip mounted between the pair of chip mounting portions are arranged. A method for producing an IC label continuum characterized in that, when an IC label continuum is produced using the inlet continuum, grounding is performed via a grounding conductive portion to which an antenna in each inlet is connected.   In the manufacturing method of the IC label continuous body of Claim 6, The IC label continuous characterized by using the inlet continuous body of any one of Claims 3-5 as said inlet continuous body. Body manufacturing method.

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