JP2007165615A - Ceramic multilayer substrate and its production process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate which facilitates circuit design while exhibiting excellent high frequency characteristics. <P>SOLUTION: The ceramic multilayer substrate 10 has insulation layers 11A-11E composed of low temperature fired ceramics and conductive layers 12A-12E laminated alternately. The conductive layers 12A-12E are constituted of a conductor pattern 13 having an arbitrary plane shape, and an insulator spacer 14 formed in a region other than the region of the conductor pattern 13. Since the insulator spacer 14 plays a role for preventing deformation in cross-sectional shape of the conductor pattern 13 when it is hot pressed, rectangular cross-section of the conductor pattern 13 is sustained even after the ceramic insulation layers 11A-11E and the conductive layers 12A-12E are laminated alternately and hot pressed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a ceramic multilayer substrate and a method for manufacturing the same, and more particularly to a ceramic multilayer substrate that is preferably used for a high-frequency module for mobile communication and has excellent high-frequency characteristics and a method for manufacturing the same.

  In recent years, ceramic multilayer substrates using LTCC (Low Temperature Co-fired Ceramics) are widely used, and chip-type electronic components and module-type electronic components based on ceramic multilayer substrates are the mainstream. . According to the ceramic multilayer substrate using LTCC, a low resistance metal such as Ag or Cu can be used as a conductor material for forming a conductor pattern or a terminal electrode. It can be realized. In the manufacture of such an electronic component, first, a conductor pattern to be a passive element is formed on a ceramic sheet that can be fired at a low temperature by printing or transferring. Next, the plurality of ceramic sheets thus formed are stacked, dried, and fired at a low temperature. Thereafter, if necessary, external electrodes are formed on the surface of the substrate, and other chip components are mounted to complete an electronic component using a ceramic multilayer substrate (see Patent Document 1).

Further, as another manufacturing method, a concave portion is formed at a position where the inner layer electrode contacts on the lower surface of the laminated sheet stacked on the laminated sheet having the inner layer electrode, and the inner layer electrode is formed in the concave portion, so that the high frequency laminated component A method for improving the flatness is known (see Patent Document 2).
JP 2004-63703 A JP 2005-5153 A

  In a conventional ceramic multilayer substrate produced by printing a conductor pattern on a ceramic green sheet and laminating the ceramic green sheet, the conductor pattern of each layer is further reduced due to the fluidity of the conductor paste at the time of conductor pattern printing. As a result of being crushed at the time of thermocompression bonding for sheet lamination, as shown in FIG. 10, the cross-sectional shape of the conductor pattern 92 is not actually rectangular, and the outer peripheral portion has a bell shape (beak shape). In a portion that is thinner than the skin thickness in the skin effect, the high-frequency resistance at the peripheral portion of the conductor pattern 92 is high, and there is a problem that high-frequency characteristics such as the Q value of the resonator deteriorate. Further, when the capacitor pattern is constituted by such a conductor pattern 92, the printed conductor pattern is crushed at the time of thermocompression bonding, and the peripheral portion of the conductor pattern constituting the capacitor electrode is elongated to reduce the thickness. The capacitance may be slightly increased, and conversely, the portion where the thickness of the peripheral portion of the conductor pattern is thin does not contribute to the capacitor electrode, and the capacitance may be slightly reduced. It causes an error. When a meander or helical inductor is configured with such a conductor pattern, the distance between the wirings of the inductor is shortened, so that the self-resonant frequency of the inductor is lowered due to an increase in the stray capacitance component, and the apparent Q value is lowered. To do. Furthermore, when the transmission line is configured with such a conductor pattern, the thickness of the transmission line is not uniform, and the characteristic impedance is not constant.

  Accordingly, an object of the present invention is to provide a ceramic multilayer substrate that does not deteriorate high frequency characteristics due to a decrease in the thickness of the outer peripheral portion of a conductor pattern in an internal conductive layer, and a method for manufacturing the same.

  The object of the present invention is a multilayer substrate in which ceramic insulating layers and conductive layers are alternately laminated, wherein the ceramic insulating layers have via-hole conductors, and the conductive layers have a conductor pattern having an arbitrary planar shape. And an insulating spacer formed on substantially the entire surface excluding the region where the conductive pattern is formed.

  In this invention, the cross-sectional shape of the lamination direction of the said conductor pattern is a substantially rectangular shape. Moreover, it is preferable that the thickness of the insulator spacer is substantially the same as that of the conductor pattern.

  In the present invention, the thickness of the ceramic insulating layer is preferably thicker than that of the conductive layer, and it is particularly preferable that the uppermost and lowermost ceramic insulating layers are sufficiently thick. According to this, sufficient insulation between the conductive layers can be secured, and the mechanical strength of the ceramic multilayer substrate can be sufficiently secured.

  In the present invention, the insulator spacer is preferably made of a ceramic material different from the ceramic insulating layer. In particular, it is preferable that the shrinkage rate during firing of the ceramic material constituting the insulator spacer is lower than that of the ceramic material constituting the ceramic insulating layer. According to this, since the insulator spacer serves as a correction layer for correcting the shrinkage in the plane direction of the ceramic insulating layer, the dimensional fluctuation of the fired ceramic multilayer substrate can be extremely reduced, and the high frequency characteristics are excellent. A multilayer substrate can be manufactured.

  The above object of the present invention is also to provide a ceramic insulating layer forming step for forming a ceramic insulating layer having via-hole conductors, a conductor pattern having an arbitrary planar shape, and an insulation formed on substantially the entire surface excluding the conductor pattern forming region. A conductive layer forming step for forming a conductive layer including a body spacer, a plurality of ceramic insulating layers and a plurality of conductive layers are prepared, and the plurality of ceramic insulating layers and the plurality of conductive layers are alternately stacked to form a laminate. The present invention is also achieved by a method for producing a ceramic multilayer substrate comprising a lamination step for firing and a firing step for firing the laminate.

  In the present invention, the ceramic insulating layer forming step includes a step of preparing a first ceramic green sheet and forming a through hole in the first ceramic green sheet,

  The conductive layer forming step includes a step of preparing a second ceramic green sheet and forming an arbitrary groove pattern on the second ceramic green sheet, and the laminating step includes the step of forming the second ceramic green sheet. Forming a third ceramic green sheet having the groove pattern and the through-hole by laminating on the first ceramic green sheet; and inside the groove pattern and the through-hole of the third ceramic green sheet. A step of filling the conductive paste and forming the conductor pattern and the via-hole conductor, a plurality of the third ceramic green sheets having the conductor pattern and the via-hole conductor, and a plurality of the third ceramic green sheets It is preferable to include the process of laminating | stacking.

  ADVANTAGE OF THE INVENTION According to this invention, deterioration of the high frequency characteristic by the thickness of the outer peripheral part of the conductor pattern in a conductive layer becoming thin can be prevented, and a multilayer substrate with a favorable high frequency characteristic and its manufacturing method can be provided.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic exploded perspective view showing the structure of an electronic component 100 using a ceramic multilayer substrate 10 according to a preferred embodiment of the present invention.

  As shown in FIG. 1, the ceramic multilayer substrate 10 includes ceramic insulating layers 11A to 11E (layers using a first ceramic green sheet), a surface conductive layer 12A on which a conductor pattern 13 is formed, and internal conductive layers 12B to 12B. 12E (layer using a second ceramic green sheet) is alternately laminated. The illustrated ceramic multilayer substrate 10 is a multilayer substrate having a five-layer structure, and a ground pattern is formed by the conductor pattern 13 in the inner conductive layer 12E of the lowermost layer (first layer). Capacitor patterns and inductor patterns by the conductor pattern 13 are formed on the conductive layers 12B to 12D. Further, a land pattern by the conductor pattern 13 and a trimable inductor / capacitor pattern are formed on the uppermost (fifth) conductive layer 12A. An electronic component 100 using the ceramic multilayer substrate 10 according to the present embodiment is configured by mounting chip components 19 such as resistors, inductors, capacitors, and ICs on the upper surface of the ceramic multilayer substrate 10.

  FIG. 2 is a cross-sectional view (hereinafter simply referred to as a cross-sectional view) in a substantially laminating direction showing the structure of the ceramic multilayer substrate 10.

  As shown in FIG. 2, the ceramic multilayer substrate 10 is provided between the ceramic insulating layers 11A to 11E, the surface conductive layer 12A provided on the surface of the ceramic insulating layer 11A, and the ceramic insulating layers 11A to 11E. Internal conductive layers 12B to 12E are provided, and a conductive pattern 13 is formed on the surface conductive layer 12A and the internal conductive layers 12B to 12E. Each ceramic insulating layer 11A to 11D is provided with a via-hole conductor 15 for electrically connecting between the inner conductive layers 12B to 12E or between the surface conductive layer 12A and the inner conductive layers 12B to 12E. . Also, the conductive pattern 13 equivalent to the via-hole conductor is provided on the surface conductive layer 12A and the internal conductive layers 12B to 12E at predetermined positions corresponding to the via-hole conductor 15.

  The ceramic insulating layers 11A to 11E are made of a low-temperature fired ceramic material having a high dielectric constant and excellent high-frequency characteristics. Examples of the low-temperature fired ceramic material include a composition in which alumina powder is mixed with borosilicate glass powder at a predetermined weight ratio.

The thickness of the ceramic insulating layer 11 is preferably thicker than internal conductive layers 12B to 12E, which will be described later, in order to ensure insulation between the conductive layers and improve reliability. In particular, top and bottom layers of the ceramic insulating layers 11A and 11E, the ceramic multilayer substrate is also to fulfill the role of ensuring the mechanical strength of the whole, the thickness d ₁ of the ceramic insulating layer 11B to 11D thickness of the intermediate layer d ₂ It is preferable that it is thicker. On the other hand, the ceramic insulating layers 11B to 11D, which are intermediate layers, are used as capacitor insulators. In order to increase the capacitance of the capacitor, the upper and lower sides of the insulator layers are taken into consideration in view of reliability such as insulation failure. It is better to make the layer thickness as thin as possible within a range that does not become thinner than the conductor thickness. Therefore, for example, the thickness d ₁ of the uppermost and lowermost ceramic insulating layers 11A and 11E is set to about 10 to 200 μm, and the thickness d ₂ of the intermediate ceramic insulating layers 11B to 11D is set to about 5 to 60 μm.

  As described above, the surface conductive layer 12A and the internal conductive layers 12B to 12E are layers in which the conductor pattern 13 having an arbitrary planar shape is formed. However, the surface conductive layer 12A and the internal conductive layers 12B to 12E are formed on the entire conductive layer 12 excluding the formation region of the conductor pattern 13. Insulator spacers 14 are formed. The conductor pattern 13 is configured using a conductor material whose main component is at least one kind of low-resistance metal selected from Ag, Cu, Au, Ni, and Al. On the other hand, the insulator spacer 14 plays a role of preventing the deformation of the cross-sectional shape of the conductor pattern 13 when being thermocompression bonded. Due to the presence of the insulator spacer 14, the cross-sectional shape of the conductor pattern 13 is maintained in a rectangular shape even after the ceramic insulating layers 11A to 11E and the internal conductive layers 12B to 12E are alternately stacked and thermocompression bonded.

  The insulator spacer 14 is made of a ceramic material, but may be the same material as the ceramic insulating layer 11 or may be different. When the same material is used, the cost can be reduced by unifying the materials and the manufacturing process can be simplified. Further, as an example of using a different ceramic material, when a non-shrinkable ceramic material or a ceramic material having a sufficiently low shrinkage rate is used as the material of the insulator spacer 14, the insulator spacer 14 is made of the ceramic insulating layers 11A to 11A. Since it plays a role as a correction layer that suppresses the shrinkage in the planar direction that occurs during firing of 11E, the dimensional variation of the fired ceramic multilayer substrate can be made extremely small. As a result, it is possible to easily achieve high precision and high density wiring of the wiring conductor pattern, and it is possible to manufacture a multilayer substrate that is downsized, highly functional, and further excellent in high frequency characteristics.

  Note that the layer using the first ceramic green sheet preferably has a relatively high relative dielectric constant when, for example, a capacitor is formed in a multilayer substrate. When a capacitor is used for a filter circuit, it is preferable to use a ceramic material having a relative dielectric constant of about 5 to 50. When a capacitor is used for a power supply circuit, a ceramic material having a relative dielectric constant of about 30 to 5000 is used. It is preferable.

  Further, unlike the ceramic insulating layers 11A to 11E, the insulator spacer 14 serves only as a spacer, so that the relative dielectric constant may not be so high. Further, in consideration of the influence of parasitic capacitance due to electromagnetic coupling generated between adjacent conductor patterns formed on the same plane, it is preferable that the relative dielectric constant is as low as 0.1 to 10, preferably 5 or less. .

The thickness _{d 3} of the inner conductive layer 12B through 12E is sufficiently thinner than the ceramic insulating layer 11A to 11E, is set to, for example, about 2 to 10 [mu] m. In other words, the thickness _{d 2} of the ceramic insulating layers 11A, 11E of the thickness _{d 1} and a ceramic insulating layer 11B to 11D described above, sufficiently thicker than _{d 3} of the inner conductive layer 12B through 12E.

  The conductor pattern 13 and the insulator spacer 14 have substantially the same thickness. The conductor pattern 13 is formed by preparing a ceramic green sheet having a groove pattern formed in accordance with a desired circuit pattern and filling the inside of the groove pattern with a conductive paste. The cross-sectional shape of the conductor pattern 13 formed in this way is substantially rectangular. Due to the presence of the insulator spacers 14, this cross-sectional shape is maintained even after the ceramic multilayer substrate is finally completed, so that the Q value resulting from the skin effect, etc. due to the reduced thickness of the outer peripheral portion of the conductor pattern 13 etc. There will be no deterioration of the high frequency characteristics.

  FIG. 3 is a schematic cross-sectional view showing a comparison between the shape of the conventional conductor pattern 92 and the shape of the conductor pattern 13 of the present invention.

As shown in FIG. 3 (a), the cross-sectional shape of the conventional conductor pattern 92 is not rectangular, and both end portions are thinned in a beak shape. Therefore, in the portion P ₀ where the skin thickness δ in the skin effect is thinner. Although the high-frequency resistance is increased, as shown in FIG. 3B, when the cross-sectional shape of the conductor pattern is rectangular, there is no portion thinner than the skin thickness δ in the skin effect, and the skin thickness Since the portion having the thickness δ is ensured uniformly in the vicinity of the surface of the conductor pattern 13, high frequency characteristics can be improved.

  As described above, according to the ceramic multilayer substrate 10 of the present embodiment, since the insulator spacer 14 having the same thickness as the conductor pattern 13 is provided around the conductor pattern 13, the ceramic insulating layer 11 and the interior Even if the conductive layer 12 is laminated and thermocompression bonded, the cross-sectional shape of the conductor pattern 13 can be maintained in a substantially rectangular shape, and the thickness of the conductor pattern 13 can be made uniform. Therefore, it is possible to realize an electronic component using a ceramic multilayer substrate having good high frequency characteristics. Furthermore, according to this embodiment, since the cross-sectional shape of the conductor pattern is rectangular, fine electrode patterns such as transmission lines can be further thinned and highly accurate patterns can be easily formed. This can also contribute to further miniaturization of the high-frequency electronic component using.

  Next, an example of a method for manufacturing the ceramic multilayer substrate 10 will be described in detail with reference to FIGS.

In the production of the ceramic multilayer substrate 10, first, a slurry obtained by mixing a glass / ceramic raw material powder with a raw material containing an organic binder, a plasticizer, a solvent and the like is prepared. As the glass / ceramic raw material powder, a composition in which alumina powder is mixed with SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —Al ₂ O ₃ —CaO—BaO—MgO glass powder at a predetermined weight ratio is used. it can. Furthermore, in order to adjust the sinterability and linear expansion of the material, SiO ₂ (crystalline materials such as α-quartz, β-quartz and cristobalite) powder may be added, and the relative dielectric constant of the material may be increased. In order to increase it, a high dielectric constant material powder such as TiO ₂ or BaTiO ₃ may be added. Also, acrylic resin or polyvinyl butyral can be used as the organic binder, phthalic acid ester or di-n-butyl phthalate can be used as the plasticizer, and a mixed solution of toluene and ethyl alcohol or ethylene as the solvent. And a mixed liquid of isopropyl alcohol can be used. Next, the slurry is uniformly applied on a support sheet 31 such as a PET (polyethylene terephthalate) film by, for example, a doctor blade method to produce a ceramic green sheet (first ceramic green sheet) 32 for an insulating layer (FIG. 4). (A)). Although not particularly limited, the thickness of the ceramic green sheet for the intermediate layer is set to be about 15 μm after firing, and the thickness of the ceramic green sheet for the uppermost layer and the lowermost layer is about 40 μm after firing. Is set as follows.

  Next, if necessary, through holes 33 that penetrate the upper and lower surfaces of the ceramic green sheet 32 are formed (FIG. 4B). As a method for forming the through-hole 33, laser processing is preferable, but punching, photolithography, drilling, or the like can also be used. Although not particularly limited, the diameter of the through hole 33 is set to about 10 μm. Even in this case, since the thickness of the ceramic green sheet is as very thin as about 15 μm, the through hole 33 can be formed into a substantially cylindrical shape.

  On the other hand, after forming the ceramic green sheet (second ceramic green sheet) 42 for the conductive layer having a thickness of, for example, about 3 μm on the support sheet 41 by the same method as the ceramic green sheet 32 for the insulating layer (FIG. 5). (A)) A groove pattern 43 and a through hole 44 for forming a conductor pattern are formed in the ceramic green sheet 42 (FIG. 5B). Laser processing is preferable as a method of forming the groove pattern 43 and the through hole 44, but punching, photolithography, or the like can also be used. Although not particularly limited, the line width and space width of the groove pattern 43 are both set to 10 μm, and the diameter of the through hole 44 is set to about 10 μm. The position and size of the through hole formed in the ceramic green sheet 42 for the conductive layer and the position and size of the through hole formed in the ceramic green sheet 32 for the insulating layer are the same.

  Next, the ceramic green sheet 42 for the conductive layer is superposed on the ceramic green sheet 32 for the insulating layer, and the ceramic green sheet 42 is laminated on the ceramic green sheet 32 using a transfer method (FIG. 6A). ), A ceramic green sheet (third ceramic green sheet) 51 in which the groove pattern 43 and the through-hole 33 are formed is produced (FIG. 6B). Next, the conductive pattern 52 and the via-hole conductor 53 are formed by filling the inside of the groove pattern 43 and the through hole 33 of the ceramic green sheet 51 with a conductive paste, for example, by screen printing (FIG. 6C). As an electrically conductive paste, what knead | mixed the metal powder which has at least one sort of Ag, Cu as a main component, glass powder, an organic solvent, etc. can be used, for example. In addition, in order to adjust sintering temperature, metal powders, such as Pt, Pd, and Ni, can also be added or Ag and Cu can be mixed. Thereafter, the ceramic green sheet 51 is peeled off from the support sheet 31 to complete the ceramic green sheet 51 in which the conductor pattern 52 and the via-hole conductor 53 are formed (FIG. 6D).

  A plurality of ceramic green sheets 51 produced in this way are prepared, and after superposing them in a predetermined order, thermocompression bonding is performed at a temperature of 100 to 300 ° C. (FIG. 7A). A laminated body 61 is formed (FIG. 7B). Next, the ceramic green sheet laminate 61 is subjected to a binder removal process, and further fired at a temperature equal to or lower than the melting point of the metal component of the conductive paste, whereby the ceramic multilayer substrate 10 is completed. Thereafter, by mounting the chip component 72, the electronic component 100 using the ceramic multilayer substrate 10 is completed (FIG. 8).

  As described above, according to the manufacturing method of the present embodiment, the cross-sectional shape of the conductive pattern 13 of the surface conductive layer 12A and the internal conductive layers 12B to 12E of the ceramic multilayer substrate is substantially rectangular. It is possible to prevent the deterioration of the high frequency characteristics due to the skin effect due to the reduced thickness of the peripheral portion, and it is possible to provide a chip type electronic component or a module type electronic component with good high frequency characteristics.

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention, and these are also included in the scope of the present invention. Needless to say

  For example, in the above-described embodiment, the case where the dielectric spacers are provided in all the conductive layers on which the conductor pattern 13 is formed has been described. However, the present invention has a thin wire structure like the conductor pattern forming the inductor. Since the effect of improving the high-frequency characteristics is particularly great with respect to the line, the conductor pattern 13 on the ceramic insulating layer 11E, which is a ground pattern, for example, has a large area and the high-frequency loss at the pattern periphery is negligible. May adopt a conventional method of forming a conductor pattern on a ceramic green sheet by screen printing. The conductive pattern 13 in the conductive layers 12A to 12D is formed using a second ceramic green sheet. In the ceramic multilayer substrate thus manufactured, the thickness of the peripheral portion of the conductor pattern 13 is reduced as shown in FIG. 9A, but there is no influence on the high frequency characteristics of the multilayer substrate.

  Also, the conductor pattern 13 on the uppermost ceramic insulating layer 11A may be formed using photolithography, a thin film method, or the like after the ceramic green sheets are laminated. As shown in FIG. 9B, the conductor pattern 13 formed in this way has a thin peripheral portion. However, when the inductor / capacitor pattern is not formed on the substrate surface, the influence on the high frequency characteristics of the multilayer substrate is obtained. Is very small. Even when an inductor / capacitor pattern is formed on the surface of the substrate, such an inductor / capacitor pattern can be laser-trimmed, so that the effect on the high-frequency characteristics of the multilayer substrate can be sufficiently reduced by the trimming.

  Moreover, in the said embodiment, although the ceramic multilayer substrate of the 5 layer structure was demonstrated, the number of lamination | stacking is not specifically limited. In the above embodiment, a dielectric is used as the ceramic insulator. However, a magnetic material may be used, and a dielectric sheet and a magnetic sheet may be combined. It is also possible to form external electrodes on the side and bottom surfaces of the ceramic multilayer substrate by screen printing or the like. Further, the chip component may not be mounted on the surface of the ceramic multilayer substrate.

  In the above embodiment, the second ceramic green sheet is transferred to the first ceramic green sheet to form a third ceramic green sheet that is a laminate of these, and then formed on the third ceramic green sheet. The conductive pattern and the via hole conductor are formed by filling the inside of the formed through hole and groove pattern with a conductive paste, but the present invention is not limited to such an embodiment, and the first ceramic green sheet The step of filling the conductive paste in the through-hole formed in the step and the step of filling the conductive paste in the groove pattern formed in the second ceramic green sheet are performed separately. The third ceramic green sheet may be completed by laminating the sheets.

1 is a schematic exploded perspective view showing a structure of an electronic component 100 using a ceramic multilayer substrate 10 according to a preferred embodiment of the present invention. 1 is a cross-sectional view in a substantially laminating direction showing the structure of a ceramic multilayer substrate 10. FIG. 4 is a diagram showing a cross-sectional shape of a conductor pattern 13. 3 is a schematic cross-sectional view showing a part of the manufacturing process of the ceramic multilayer substrate 10 (formation and processing of a first ceramic green sheet). FIG. 4 is a schematic cross-sectional view showing a part of the manufacturing process of the ceramic multilayer substrate 10 (formation and processing of a second ceramic green sheet). FIG. 4 is a schematic cross-sectional view showing a part of the manufacturing process of the ceramic multilayer substrate 10 (creation of a third ceramic green sheet). FIG. 3 is a schematic cross-sectional view showing a part of the manufacturing process of the ceramic multilayer substrate 10 (lamination and firing of a third ceramic green sheet). FIG. 3 is a schematic cross-sectional view showing a part of the manufacturing process of the ceramic multilayer substrate 10 (formation of a surface conductive layer and mounting of components). FIG. It is a schematic sectional drawing which shows the structure of the ceramic multilayer substrate based on other preferable embodiment of this invention. It is a figure which shows the cross-sectional shape of the conventional conductor pattern 91. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ceramic multilayer substrate 11 Ceramic insulating layer 11A-11E Ceramic insulating layer 12 Conductive layer 12A Surface conductive layer 12B-12E Internal conductive layer 13 Conductor pattern 14 Insulator spacer 15 Via-hole conductor 16 Via-hole conductor 19 Chip component 31 Support sheet 32 For insulating layer Ceramic green sheet (first ceramic green sheet)
33 Through-hole 41 Support sheet 42 Ceramic green sheet for conductive layer (second ceramic green sheet)
43 Groove pattern 44 Through hole 51 Third ceramic green sheet 52 Conductor pattern 53 Via-hole conductor 61 Laminate 71 of ceramic green sheet Conductor pattern 71
72 Chip component 91 Ceramic insulating layer 92 Conductive pattern 100 Electronic component

Claims (8)

A multilayer substrate in which ceramic insulating layers and conductive layers are alternately laminated,
The ceramic insulating layer has a via-hole conductor;
The ceramic multi-layer substrate, wherein the conductive layer includes a conductor pattern having an arbitrary planar shape and an insulating spacer formed on substantially the entire surface excluding a region where the conductor pattern is formed.   The ceramic multilayer substrate according to claim 1, wherein a cross-sectional shape of the conductor pattern is a substantially rectangular shape.   The ceramic multilayer substrate according to claim 1, wherein a thickness of the insulator spacer is substantially the same as that of the conductor pattern.   4. The ceramic multilayer substrate according to claim 1, wherein the ceramic insulating layer is thicker than the conductive layer. 5.   The ceramic multilayer substrate according to any one of claims 1 to 4, wherein the insulator spacer is made of a ceramic material different from the ceramic insulating layer.   6. The ceramic multilayer substrate according to claim 5, wherein a shrinkage rate of the ceramic material constituting the insulator spacer during firing is lower than that of the ceramic material constituting the ceramic insulating layer. A ceramic insulating layer forming step of forming a ceramic insulating layer having a via-hole conductor;
A conductive layer forming step of forming a conductive layer including a conductive pattern having an arbitrary planar shape and an insulating spacer formed on substantially the entire surface excluding the formation region of the conductive pattern;
A plurality of ceramic insulating layers and a plurality of the conductive layers, a stacking step of firing the laminate by alternately stacking the plurality of ceramic insulating layers and the plurality of conductive layers;
The manufacturing method of the ceramic multilayer substrate characterized by including the baking process which bakes the said laminated body. The ceramic insulating layer forming step includes
Preparing a first ceramic green sheet and forming a through hole in the first ceramic green sheet;
The conductive layer forming step includes
Preparing a second ceramic green sheet and forming an arbitrary groove pattern in the second ceramic green sheet;
The laminating step includes
Laminating the second ceramic green sheet on the first ceramic green sheet to form a third ceramic green sheet having the groove pattern and the through holes;
Filling the inside of the groove pattern and the through hole of the third ceramic green sheet with a conductive paste to form the conductor pattern and the via-hole conductor;
The ceramic multilayer substrate according to claim 7, comprising a step of preparing a plurality of the third ceramic green sheets having the conductor pattern and the via-hole conductor and laminating the plurality of third ceramic green sheets. Manufacturing method.

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