JP2007165366A5 - - Google Patents

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Publication number
JP2007165366A5
JP2007165366A5 JP2005355944A JP2005355944A JP2007165366A5 JP 2007165366 A5 JP2007165366 A5 JP 2007165366A5 JP 2005355944 A JP2005355944 A JP 2005355944A JP 2005355944 A JP2005355944 A JP 2005355944A JP 2007165366 A5 JP2007165366 A5 JP 2007165366A5
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JP
Japan
Prior art keywords
substrate
coating
processing
processing liquid
contact angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005355944A
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English (en)
Japanese (ja)
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JP2007165366A (ja
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Publication date
Application filed filed Critical
Priority to JP2005355944A priority Critical patent/JP2007165366A/ja
Priority claimed from JP2005355944A external-priority patent/JP2007165366A/ja
Publication of JP2007165366A publication Critical patent/JP2007165366A/ja
Publication of JP2007165366A5 publication Critical patent/JP2007165366A5/ja
Withdrawn legal-status Critical Current

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JP2005355944A 2005-12-09 2005-12-09 基板処理装置および基板処理方法 Withdrawn JP2007165366A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005355944A JP2007165366A (ja) 2005-12-09 2005-12-09 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005355944A JP2007165366A (ja) 2005-12-09 2005-12-09 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2007165366A JP2007165366A (ja) 2007-06-28
JP2007165366A5 true JP2007165366A5 (cg-RX-API-DMAC7.html) 2007-12-06

Family

ID=38247987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005355944A Withdrawn JP2007165366A (ja) 2005-12-09 2005-12-09 基板処理装置および基板処理方法

Country Status (1)

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JP (1) JP2007165366A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201418A (ja) * 2012-02-24 2013-10-03 Ebara Corp 基板処理方法
JP6363876B2 (ja) * 2014-05-21 2018-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6575538B2 (ja) * 2017-01-23 2019-09-18 信越半導体株式会社 半導体ウェーハの洗浄方法
KR102553643B1 (ko) 2021-05-17 2023-07-13 세메스 주식회사 기판 처리 장치 및 기판 반송로봇
JP7563329B2 (ja) * 2021-08-12 2024-10-08 株式会社Sumco 半導体ウェーハの洗浄方法及び半導体ウェーハの製造方法

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