JP2007155682A - Electronic component module for evaluating characteristic, and wiring board therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means capable of measuring easily, accurately and stably a characteristic of an electronic component. <P>SOLUTION: This filter module 1 for evaluating the characteristic has a wiring board 2 mounted with a SAW filter 3 of an evaluation object and coupled integrally with input side and output side connectors 4, 5. A wiring pattern of the wiring board comprises linear input side and output side wires 11, 13 comprising wiring portions 11a, 11b, 13a, 13b divided by slots 12, 14, and grounding side wires 15, 16, 21, 22 arranged separately with a slight distance in sideways thereof. A desired impedance matching circuit is constituted by selecting a section between the fellow input side and output side wiring portions, and a section between the grounding side wires adjacent thereto to be connected directly with a coil or a capacitor. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides, for example, an electronic component module for evaluating characteristics for evaluating the characteristics and performance of an electronic component before mounting the electronic component such as a filter to be used on the final product electronic device such as a communication device, and It is related with the wiring board suitable for it.

  Conventionally, a manufacturer of an electronic device such as a communication device, for example, purchases an electronic component such as a filter from a specialized manufacturer and mounts it on its own circuit board or the like to manufacture and sell the final product. There are many. Therefore, it is necessary to confirm in advance whether the purchased electronic component can exhibit desired characteristics under actual use conditions. In general, for example, a commercially available network analyzer such as a network analyzer is used for evaluating the characteristics of electronic components (see, for example, Patent Documents 1 and 2).

  In particular, for accurate transmission of electrical signals, it is important to match the impedances on the sending side and the receiving side, that is, equalize them so that the power obtained on the receiving side is maximized and efficiently transmitted. In the case of a SAW (surface acoustic wave) filter used in a communication device, a manufacturer provides information such as a circuit configuration example suitable for a simulation tool for impedance matching with respect to its own SAW filter (for example, Non-patent documents 1 to 3). In this case, the filter characteristic is measured using a network analyzer, and an impedance matching circuit suitable for the filter characteristic is illustrated. In particular, Non-Patent Document 2 describes a configuration example of a test wiring board suitable for a SAW filter. In addition, these non-patent documents describe that input / output ground terminals are separated and connected to a common ground layer through via holes in order to reduce crosstalk.

  In addition, in the measurement of transmission characteristics of capacitor parts and coil parts, which are devices under test, it is possible to apply a voltage or current that does not affect the transmission characteristics to the device under test, and to perform measurements that are in line with actual use conditions. A measuring device is known (see, for example, Patent Document 1). In addition, a distributed constant type directional coupler having a mounting portion for the substance to be evaluated and a connected to it, so that the electrical characteristics of the substance can be easily evaluated under almost the same conditions as in actual use. An evaluation device including an S parameter measurement device is known (see, for example, Patent Document 2).

  In addition, in order to evaluate the characteristics of the package IC before shipping, the IC to be measured is supplied by supplying the power supply voltage and the bias voltage via the electrodes provided on the power supply pin and the bias pin of the IC to be measured. Improve the matching of impedance by eliminating wiring patterns and circuit elements for voltage supply from the evaluation board to be mounted, making it possible to provide sufficient grounding pattern patterns, and increasing the degree of freedom with respect to the mounting position of circuit elements. An easy measuring jig has been proposed (see, for example, Patent Document 3).

  Further, in order to accurately and stably evaluate various characteristics of the semiconductor device, the lead terminal of the semiconductor device is passed through the printed wiring board, and the lead terminal and the wiring of the printed wiring board are connected by a contactor. There is known a semiconductor evaluation apparatus that shortens the distance to the surrounding wiring and shortens the distance affected by the uncertain factor from the outside as much as possible (see, for example, Patent Document 4).

EPCOS AG, “SAW Components-Data Sheet B3550”, <http://www.epcos.com/inf/40/ds/ae/B3550.pdf> EPCOS AG, “Application Note SAW-Components-Matching of the B3550 and optimising the crosstalk by evaluating a good RF layout App.Note # 4”, <http://www.epcos.com/web/generator /Web/Sections/ProductCatalog/SAWComponents/AutomotiveElectronics/OnePortResonators/PDF/PDF__AN4,property=Data__en.pdf;/PDF_AN4.pdf> EPCOS AG, `` Application Note SAW-Components-Matching of different EPCOS front end SAW filters to the integrated RKE receiver TDA520x from Infineon '', <http://www.epcos.com/web/generator/Web/ Sections / ProductCatalog / SAWComponents / AutomotiveElectronics / OnePortResonators / PDF / PDF__AN90, property = Data__en.pdf; /PDF_AN90.pdf> JP 11-174104 A JP 2005-265703 A Japanese Patent Laid-Open No. 2001-42000 Japanese Patent Laid-Open No. 5-232182

  As described in each of the above-mentioned patent documents, it is difficult to measure the characteristics of an electronic component using a general measuring instrument under the same conditions as the actual usage state. Therefore, it is necessary for a purchaser of an electronic component to match between the impedance on the circuit on which the electronic component is mounted and the impedance of the measuring instrument, and there is a problem that much time and effort are required for measuring the characteristics of the electronic component.

  In particular, the filter used in a communication device is an important component because the amount of attenuation greatly affects the sensitivity of the receiver. There is a possibility that the impedance changes depending on other electronic components, circuit elements, and wiring patterns to be mounted. Therefore, there is a problem that the filter characteristics at the time of shipment cannot be accurately evaluated.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide means capable of easily and accurately measuring characteristics of an electronic component. For this reason, the present invention can be connected to a measuring instrument such as a commercially available network analyzer as it is, and can always measure under the same test conditions, so that a desired impedance can always be obtained stably. It is an object of the present invention to provide an electronic component module for characteristic evaluation that enables a purchaser of an electronic component to perform measurement under the same conditions as at the time of shipment and enables accurate and stable characteristic evaluation.

  A further object of the present invention is to provide a wiring board suitable for producing such an electronic component module for characteristic evaluation.

According to the present invention, in order to achieve the above object, an electronic component to be evaluated having an input terminal and an output terminal, a plurality of circuit elements connected to the electronic component to form an impedance matching circuit, an electronic component, A rectangular wiring board having a wiring pattern for mounting circuit elements, and an input side and an output that are integrally coupled to the edge of the wiring board and electrically connected to an input terminal and an output terminal of an electronic component, respectively Side connector,
The wiring pattern includes an input side wiring that electrically connects an input terminal of an electronic component to an input side connector, an output side wiring that electrically connects an output terminal of the electronic component to an output side connector, and a ground side wiring. A first input side wiring portion that extends linearly from the input terminal side of the electronic component, and is separated from the tip of the first input side wiring portion with a slight separation distance; A first input side wiring portion extending linearly from the output terminal side of the electronic component; and a first output side wiring portion extending linearly from the output terminal side of the electronic component. The second output side wiring portion is divided from the tip of the output side wiring portion with a slight separation distance and extends linearly toward the output side connector, and the ground side wiring is the first and / or first 2 on the side of the input side wiring part An input-side ground wiring that is separated from the wiring portion by a small distance, and an output-side ground wiring that is separated from the output-side wiring portion by a small distance to the side of the first and / or second output-side wiring portions. And
Between the first input side wiring portion and the second input side wiring portion, between the first output side wiring portion and the second output side wiring portion, the input side wiring portion and the input side ground wiring adjacent thereto. And the separation distance between the output-side wiring portion and the output-side ground wiring adjacent to the output-side wiring portion can be directly communicated by the circuit element,
One or both of the plurality of circuit elements is between the first input side wiring portion and the second input side wiring portion, between the first output side wiring portion and the second output side wiring portion. Selective direct connection between the input side wiring portion and the adjacent input side ground wiring, and either one or both of the output side wiring portions and the adjacent output side ground wiring for connection. Thereby, the electronic component module for characteristic evaluation which comprised the impedance matching circuit is provided.

  By forming the input side and output side wiring in a straight line in this way, a wiring pattern with reduced parasitic capacitance can be obtained, and the influence of external noise can be further reduced. The performance can be measured more accurately and stably. Further, it is advantageous because a larger area for providing ground side wiring can be secured on the upper surface of the wiring board on both sides of the input side and output side wiring, and the line width can be increased.

  Further, according to the present invention, the wiring portions having the same wiring pattern can be used to connect the wiring portions of the input / output wirings and / or the grounding wiring adjacent thereto with different positions and / or circuit elements. Accordingly, impedance matching circuits having different configurations can be easily configured and manufactured in accordance with the electronic component to be evaluated and / or the evaluation conditions.

  In one embodiment, the first input-side wiring portion and the second input-side wiring portion and / or the first output-side wiring portion and the second output-side wiring portion are respectively on the same straight line. By arranging, the input side and output side wirings connected in series by the circuit elements can be formed in a straight line with a minimum length.

  In another embodiment, the first input side wiring portion and the second input side wiring portion and / or the first output side wiring portion and the second output side wiring portion are divided at positions. In such a case, the input side and the output side wiring connected in series by the circuit elements can be formed substantially in a straight line.

  In addition, the present invention can be applied to a wide range of electronic components. In one embodiment, a two-terminal type electronic component having one input and one output is mounted, and an input side connector and an output side connector are respectively provided correspondingly. One by one can be provided. In another embodiment, the present invention can be applied to a 4-terminal type electronic component having 2 inputs and 2 outputs, and two input side and output side connectors can be provided correspondingly.

  In one embodiment, the wiring board is formed of a multilayer board having a ground layer in the lowermost layer and / or the inner layer, and the ground side wiring is electrically connected to the ground layer through the via hole, whereby the input / output side Since it can be separated from the wiring sufficiently and via a separate line for each, the influence of external noise and parasitic capacitance on the measurement of the characteristics of electronic components is eliminated or effectively suppressed be able to.

  In the case where the electronic component is actively operated, such as an oscillator, a power supply layer can be further provided on the multilayer substrate, and when this is arranged on the inner layer, the characteristic of the electronic component is measured. It can be mitigated so that it is not affected.

According to another aspect of the present invention, an electronic component to be evaluated having a wiring pattern and having an input terminal and an output terminal, and a plurality of circuit elements connected to the electronic component and constituting an impedance matching circuit are mounted. Therefore, a rectangular wiring board for integrally connecting the input side and output side connectors electrically connected to the input terminal and output terminal of the electronic component to the edge thereof,
The wiring pattern includes an input side wiring that electrically connects an input terminal of an electronic component to an input side connector, an output side wiring that electrically connects an output terminal of the electronic component to an output side connector, and a ground side wiring. A first input side wiring portion that extends linearly from the input terminal side of the electronic component, and is separated from the tip of the first input side wiring portion with a slight separation distance; A first input side wiring portion extending linearly from the output terminal side of the electronic component; and a first output side wiring portion extending linearly from the output terminal side of the electronic component. The second output side wiring portion is divided from the tip of the output side wiring portion with a slight separation distance and extends linearly toward the output side connector, and the ground side wiring is the first and / or second On the side of the input side wiring part, the input side wiring An input-side ground wiring separated from the output-side wiring portion by a distance from the output-side wiring portion, and an input-side ground wiring separated from the output-side wiring portion by a side from the output-side wiring portion. Have
Between the first input side wiring portion and the second input side wiring portion, between the first output side wiring portion and the second output side wiring portion, the input side wiring portion and the input side ground wiring adjacent thereto. And the separation distance between the output side wiring portion and the output side ground wiring adjacent to the output side wiring portion is set so that the circuit element can directly communicate,
A plurality of circuit elements are arranged between the first input-side wiring portion and the second input-side wiring portion, between the first output-side wiring portion and the second output-side wiring portion, or one or both of them. Impedance matching circuit by selectively connecting between the input side wiring portion and the input side ground wiring adjacent thereto, and between one or both of the output side wiring portions and the output side ground wiring adjacent thereto. A wiring board of the electronic component module for characteristic evaluation that can be configured is provided.

  Accordingly, the electronic component module for characteristic evaluation having the electronic component to be evaluated and / or the impedance matching circuit corresponding to the evaluation condition by appropriately selecting and arranging a plurality of circuit elements using the same wiring board Can be easily manufactured.

  In the following, referring to the attached drawings, as a preferred embodiment of the present invention, the configuration of the electronic component module for characteristic evaluation according to the present invention will be described in detail when a SAW filter for a communication device is used as an electronic component to be evaluated. Explained.

  FIG. 1 shows a first embodiment of a SAW filter module for characteristic evaluation to which the present invention is applied. As shown in FIG. 1A, the SAW filter module 1 includes a rectangular wiring board 2 and a SAW filter 3 to be evaluated. The SAW filter 3 of this embodiment is a 1-input 1-output 2-terminal type low-pass filter, and is surface-mounted at the center of the upper surface of the wiring board 2. Correspondingly, the input side connector 4 and the output side connector 5 are integrally coupled to the left and right sides 2a and 2b of the wiring board 2 facing each other. A wiring pattern to be described later is formed on the upper surface of the wiring board 2, and capacitors C11 and C21 on the input side and output side and coils L11 and L21 are mounted as circuit elements for constituting a desired impedance matching circuit. .

  As shown in FIGS. 1 (A) and 1 (B), each connector has connector portions 4a and 5a projecting outward, flange portions 4b and 5b, and the flange portion on the opposite side to the connector portion. And center pins 4c and 5c projecting coaxially. A coaxial cable (not shown) for connecting to an external measuring device such as a network analyzer is detachably coupled to the connector portions 4a and 5a. As will be described later, the center pins 4c and 5c are connected to the input / output terminals of the SAW filter 3 via the input side and output side wirings of the wiring board 2, respectively, and the flange portions 4b and 5b are grounded.

  The wiring board 2 is preferably composed of a multilayer board, and a ground layer is preferably provided in the lowermost layer and the inner layer. As shown in FIG. 1C, the wiring board 2 of this embodiment includes a first layer 7a provided on the upper surfaces of base materials 6a to 6c made of a known material such as a glass epoxy resin, and a second intermediate layer. It has a four-layer structure including a layer 7b and a third layer 7c, and a fourth layer 7d provided on the lower surface. The first layer 7a constitutes an electrode pad portion for mounting the SAW filter 3, the capacitor, the coil, and the like and a wiring pattern for connecting them. The electrode pad portion and the wiring pattern are formed by a conventionally known method, for example, by patterning a copper foil provided on the surface of the uppermost base material 2a by wet etching. The second layer 7b to the fourth layer 7d in the present embodiment are ground layers. In another embodiment, when the electronic component to be evaluated is not a SAW filter but a SAW oscillator, the second layer 7b or the third layer 7c can constitute a power supply layer, not a ground layer.

  On the upper surface of the wiring board 2, as shown in FIG. 2, an input-side electrode pad portion 8 and an output-side electrode pad portion 9 corresponding to the input / output terminals of the SAW filter 3 are provided at the left and right positions, respectively. Four ground side electrode pad portions 10a to 10d corresponding to the ground terminal of the SAW filter are provided so as to sandwich the input side 8 and the output side electrode pad portion 9 from above and below in the figure. An input-side wiring 11 extends from the input-side electrode pad portion 8 toward the left side 2 a of the wiring board 2 to which the input-side connector 4 is coupled. The wiring 11 is formed in a straight line shape perpendicular to the left side 2a of the wiring board 2 and having a substantially constant width so as to minimize the length thereof. Further, the wiring 11 is divided into two wiring portions 11a and 11b by a slit 12 at a substantially intermediate position. The slit 12 is determined so that the wiring portions 11a and 11b are connected by the coil L11 as described later.

  Similarly, the output-side wiring 13 extends from the output-side electrode pad portion 9 toward the right side 2 b of the wiring board 2 that fixes the output-side connector 5. The wiring 13 is formed in a straight line shape perpendicular to the right side 2b of the wiring board 2 and having a substantially constant width so as to minimize the length thereof. Further, the wiring 13 is divided into two wiring portions 13a and 13b by a slit 14 at a substantially intermediate position. The slit 14 is determined so that the wiring portions 13a and 13b are connected by the coil L21 as will be described later.

  A wiring 15 is provided on one side of the wiring portion 11a on the input side on the lower side 2c side of the wiring board 2 in this embodiment. The wiring 15 is formed so as to extend vertically and short with respect to the wiring portion 11a while being separated from the wiring portion 11a by a small distance. This separation distance is determined so as to be connected to the wiring portion 11a by the coil L11 as will be described later with reference to FIG. The wiring 15 is a ground-side wiring connected to the ground layer of the wiring board 2 through the via hole 17.

  Similarly, a wiring 16 is provided on one side of the output-side wiring portion 13a on the upper side 2d side of the wiring board 2 in this embodiment. The wiring 16 is formed to extend vertically and short with respect to the wiring portion 13a while being separated from the wiring portion 13a by a small distance. The separation distance is determined so as to be connected to the wiring portion 13a by the coil L21 as will be described later with reference to FIG. The wirings 16 are ground side wirings connected to the ground layer of the wiring board 2 through via holes 18 respectively.

  In each of the ground side electrode pad portions 10a to 10d, wirings 19a to 19d continuous with these are formed. The wirings 19a to 19c are grounding wirings connected to the ground layer of the wiring board 2 through the via holes 20a to 20c, respectively.

  Furthermore, ground-side wirings 21 and 22 are formed that extend along the upper and lower sides 2d and 2c of the wiring board 2 and reach the left and right sides 2a and 2b of the wiring board 2, respectively. The wiring 21 is provided such that portions 21a and 21b adjacent to the left and right sides 2a and 2b of the wiring board 2 are spaced apart from the input-side wiring portion 11b and the output-side wiring portion 13b, respectively, by a certain slight distance. . The wiring 22 is provided so that the portions 22a and 22b adjacent to the left and right sides 2a and 2b of the wiring board 2 are separated from the input-side wiring portion 11b with a certain slight interval. These separation distances are determined so as to be connected by the corresponding wiring portions 11b and 13b and capacitors C11 and C21 as will be described later. Similarly, the wirings 21 and 22 are connected to the ground layer of the wiring board 2 through the via holes 23 and 24.

  The input side electrode pad portion 8 and the ground side electrode pad portions 10a and 10b adjacent thereto and the output side electrode pad portion 9 and the ground side electrode pad portions 10c and 10d adjacent thereto are separated from each other with a slight gap therebetween. And the ground side wiring 25 extended in the direction orthogonal to the input side wiring 11 and the output side wiring 13 is formed. Similarly, the wiring 25 is connected to the ground layer of the wiring board 2 through the via hole 26.

  As shown in FIG. 1A, the input side connector 4 has a flange portion 4b connected to the wirings 21 and 22 with solders 27a and 27b on the upper surface of the wiring board 2, respectively. It is integrally fixed to the wiring board 2 so as to be connected to the ground layer 7d. The center pin 4c of the input side connector 4 is connected to the wiring portion 11b of the input side wiring by the solder 28.

  Similarly, in the output side connector 5, the flange portion 5b is connected to the wirings 21 and 22 with solders 29a and 29b on the upper surface of the wiring board 2, and the ground layer 7d with solder (not shown) in the same manner on the lower surface of the wiring board. It is integrally fixed to the wiring board 2 so as to be connected to the wiring board 2. The center pin 5c of the output side connector 5 is connected to the wiring portion 13b of the output side wiring by the solder 30.

  In the filter module 1 for characteristic evaluation of the present embodiment, the input-side wiring portions 11a and 11b are electrically connected by a coil L11 disposed so as to close the slit 12 that divides them. Further, the wiring portion 11b is electrically connected to the wiring portion 22a of the adjacent ground side wiring 22 by a capacitor C11 arranged so as to close the gap between them. Similarly, the output-side wiring portions 13a and 13b are electrically connected by a coil L21 disposed so as to close the slit 14 that divides them. Further, the wiring portion 13b is electrically connected to the wiring portion 21b of the adjacent ground side wiring 21 by a capacitor C21 arranged so as to close the gap therebetween.

  In another embodiment, the input side wiring portion 11b can be electrically connected to the wiring portion 21a of the ground side wiring 21 adjacent to the opposite side by the capacitor C11 arranged so as to close the gap therebetween. Correspondingly, on the output side, the wiring portion 13b can be electrically connected to the wiring portion 22b of the ground-side wiring 22 adjacent to the opposite side by the capacitor C21 arranged so as to close the gap therebetween. preferable.

  With this configuration, the characteristic evaluation filter module 1 including the low-pass filter impedance matching circuit shown in the equivalent circuit of FIG. 1D can be obtained. In general, a commercially available network analyzer used for evaluating the characteristics of the SAW filter 3 has an impedance of 50Ω. Accordingly, in the present embodiment, the capacitors C11 and C21 and the coils L11 and L21 are selected so that the impedances at both ends of the characteristic evaluation filter module 1, that is, the input side and output side connectors 4 and 5, are 50Ω. Of course, when the impedance of the measuring device is different, each capacitor and coil may be selected so that an impedance matching circuit corresponding to the impedance is obtained.

  According to the present embodiment, the input and output wirings 11 and 13 are formed in a straight line in the left-right direction and with substantially the same width in the center of the wiring board as described above, thereby reducing the parasitic capacitance of the wiring pattern. In addition, the operation of the SAW filter 3 to be evaluated and the influence of external noise on the input side and output side wirings 11 and 13 can be reduced. Further, on the upper surface of the wiring board 2, a wide area for providing the ground side wiring is secured on both sides of the input side and output side wirings 11 and 13, that is, on the upper side and the lower side in the drawing. In addition, since the ground side wiring is connected to the ground layer through the via hole and grounded, the operation of the SAW filter 3 and the influence on the input side and output side wirings 11 and 13 are reduced. Therefore, the characteristics of the SAW filter 33 can be measured more accurately and stably, which is advantageous.

  Further, the present invention uses a wiring board having the same wiring pattern to connect the wiring portions of input / output wirings and / or the ground side wiring adjacent thereto to positions and / or impedance matching circuit elements different from those in FIG. Thus, an impedance matching circuit having a configuration different from that in FIG. 1 can be configured. 3 and 4 illustrate such different circuit configurations.

  FIG. 3 shows a modification of the first embodiment of FIG. The characteristic evaluation filter module 1 according to this modification has the same wiring substrate 2 of FIG. 2 as that of the first embodiment, but differs from the first embodiment in the following points. As shown in FIG. 3A, the wiring portions 11a and 11b of the input side wiring 11 are electrically connected by a capacitor C11, and the wiring portion 11a and the wiring 15 adjacent to the side thereof are electrically connected by a coil L11. It is connected to the. Correspondingly, the wiring portions 13a and 13b of the output side wiring 13 are electrically connected by the capacitor C21, and the wiring portion 13a and the wiring portion 16 adjacent to the side thereof are electrically connected by the coil L21. ing.

  With such a configuration, a characteristic evaluation filter module including an impedance matching circuit for a high-pass filter shown in the equivalent circuit of FIG. Also in this modified example, the capacitors C11 and C21 and the coils L11 and L21 are selected so that the impedance at both ends of the characteristic evaluation filter module 1 is 50Ω in consideration of characteristic evaluation by a commercially available network analyzer.

  FIG. 4 shows still another modification of the modification of FIG. The characteristic evaluation filter module 1 according to this modification has the same wiring substrate 2 of FIG. 2 as that of the first embodiment, but differs from the embodiment of FIG. 3 in the following points. As shown in FIG. 4A, the wiring portions 11a and 11b of the input side wiring 11 are electrically connected by a capacitor C11, and the wiring portion 11a and the wiring 15 adjacent to the side thereof are electrically connected by a coil L11. In addition, the wiring portion 11b and the wiring portion 22a of the ground side wiring 22 adjacent to the wiring portion 11b are electrically connected by the coil L12. Further, the wiring portions 13a and 13b of the output side wiring 13 are electrically connected by the capacitor C21, and the wiring portion 13a and the wiring 16 adjacent to the side thereof are electrically connected by the coil L21. Thus, the wiring portion 13b and the wiring portion 21b of the ground side wiring 21 adjacent thereto are electrically connected by the coil L22.

  With such a configuration, a filter module for characteristic evaluation including an impedance matching circuit shown in the equivalent circuit of FIG. Also in this modification, the capacitors C11 and C21 and the coils L11, L12, L21, and L22 are selected so that the impedance at both ends of the characteristic evaluation filter module 1 is 50Ω in consideration of the characteristic evaluation by a commercially available network analyzer. To do.

  FIG. 5 shows a second embodiment of the filter module for characteristic evaluation to which the present invention is applied. The filter module 31 for characteristic evaluation of this embodiment has a rectangular wiring board 32, and the SAW filter 33 to be evaluated, which is surface-mounted at the center of the upper surface, is a two-input two-output four-terminal type. Correspondingly, two input-side connectors 34 and 35 and output-side connectors 36 and 37 are integrally coupled to the opposite upper and lower sides 32c and 32d of the wiring board 32, respectively. A wiring pattern, which will be described later with reference to FIG. 6, is formed on the upper surface of the wiring board 32, and in order to configure a desired impedance matching circuit, capacitors C11, C12, C21, C22 on the input side and output side, and a coil L11 , L12, L21, L22 are implemented. The wiring board 32 is preferably composed of a multilayer board as in the first embodiment, and a ground layer is preferably provided in the lowermost layer and the inner layer.

  As shown in FIG. 5 (A), the connectors include connector portions 34a, 35a, 36a, 37a projecting outward, flange portions 34b, 35b, 36b, 37b, and the connector portions from the flange portions. Has center pins 34c, 35c, 36c, 37c projecting coaxially on the opposite side. A coaxial cable (not shown) for connecting to an external measuring device such as a network analyzer is detachably coupled to the connector portion. The center pins are connected to the input / output terminals of the SAW filter 33 via the input side and output side wirings of the wiring board 32, respectively, and the flanges are grounded.

  On the upper surface of the wiring board 32, as shown in FIG. 6, two input-side electrode pad portions 38, 39 and output-side electrode pad portions 40, 41 respectively corresponding to the input / output terminals of the SAW filter 33 are provided at the center thereof. And two ground-side electrode pad portions 42a and 42b corresponding to the ground terminal of the SAW filter are provided so as to be sandwiched between the input-side and output-side electrode pad portions in the vertical direction in the figure. The input side wiring 43 extends from one input side electrode pad portion 38 toward the upper side 32 c of the wiring board to which the corresponding input side connector 34 is coupled. The input-side wiring 43 has a linear wiring portion 43a that extends straight toward the wiring substrate left side 32a, and a linear wiring portion 43b that extends orthogonally to the wiring substrate and toward the wiring substrate upper side 32c. . Both wiring parts 43a and 43b have substantially the same width, and their tips are separated by a slight slit 43c. The separation width of the slit 43c is determined so that the wiring portions 43a and 43b are connected by the capacitor C11 as will be described later.

  The input-side wiring 44 extends from the other input-side electrode pad portion 39 toward the wiring board upper side 32 c to which the corresponding input-side connector 35 is coupled. The input side wiring 44 includes a linear wiring portion 44a that extends straight toward the right side 32b of the wiring substrate 32, and a linear wiring portion that extends perpendicularly to the wiring substrate upper side 32c perpendicular to the wiring portion. 44b. Both wiring parts 44a and 44b have substantially the same width, and their tips are separated by a slit 44c. The separation width of the slit 44c is determined so that the wiring portions 44a and 44b are connected by the capacitor C21 as will be described later.

  Similarly, the output-side wiring 45 extends from one output-side electrode pad portion 40 toward the wiring substrate lower side 32d to which the corresponding output-side connector 36 is coupled. The output-side wiring 45 includes a linear wiring portion 45a that extends straight toward the wiring substrate left side 32a, and a linear wiring portion 45b that extends perpendicularly to the wiring substrate lower side 32d perpendicular to the wiring portion. Have Both wiring portions 45a and 45b have substantially the same width, and their tips are separated by a slit 45c. The separation width of the slit 45c is determined so that the wiring portions 45a and 45b are connected by the capacitor C12 as will be described later.

  The output-side wiring 46 extends from the other output-side electrode pad portion 41 toward the wiring board lower side 32d to which the corresponding output-side connector 37 is coupled. The output-side wiring 46 includes a linear wiring portion 46a that extends straight toward the right side 32b of the wiring board, and a linear wiring portion 46b that extends perpendicularly to the lower side 32d of the wiring board and perpendicular to the wiring portion. Have Both wiring portions 46a and 46b have substantially the same width, and their tips are separated by a slit 46c. The separation width of the slit 46c is determined so that the wiring portions 46a and 46b are connected by the capacitor C22 as will be described later.

  Further, the ground-side wirings 47a and 47b extend linearly from the ground-side electrode pad portions 42a and 42b toward the opposing wiring board left side 32a and right side 32b, respectively, and are formed along the wiring board left side 32a and right side 32b, respectively. Are connected to the grounded wirings 48a and 48b. Furthermore, the input side electrode pad portions 38 and 39, the ground side electrode pad portions 42a and 42b, and the output side electrode pad portions 40 and 41 are separated from them with a slight gap and extended in the vertical direction in the figure. A side wiring 49 is formed, and both ends thereof are connected to ground side wirings 50a and 50b formed along the upper side 32c and the lower side 32d of the wiring board, respectively. These ground-side wirings 48a, 48b, 49, 50a, and 50b are connected to ground layers provided in the inner layer or the lowermost layer of the wiring board through via holes 51a, 51b, 52, 53a, and 53b, respectively.

  The input side and output side wirings and the ground side wiring adjacent thereto are formed to be separated from each other with a slight distance. This separation distance is determined so that it can be connected by, for example, a coil or a capacitor so as to fill the gap.

  As shown in FIG. 5A, the input side connectors 34 and 35 are connected to the wires 48a, 50a, and 48b on the upper surface of the wiring board 32 by solders 54a, 54b, and 54c, respectively. The wiring board 2 is integrally fixed so as to be similarly connected to the ground layer on the lower surface of the wiring board with solder (not shown). Similarly, each output side connector 36, 37 has its flange portions 36b, 37b connected to the wires 48a, 50a, 48b on the upper surface of the wiring board 32 by solders 55a, 55b, 55c, respectively, and the ground layer on the lower surface of the wiring board. Similarly, it is fixed integrally to the wiring board 2 so as to be connected by solder (not shown). The center pins 34c, 35c, 36c, and 37c of each connector are connected to the corresponding wiring portions 43b, 44b, 45b, and 46b of the corresponding input side or output side wiring by solders 55a, 55b, 55c, and 56c, respectively.

  The filter module 31 for characteristic evaluation of the present embodiment includes capacitors C11 and C12 arranged so that the wiring portions 43a and 43b and 44a and 44b on the input side close the gaps between the slits 43c and 44c that divide them. Electrically connected. Similarly, the output side wiring portions 45a, 45b and 46a, 46b are electrically connected by capacitors C21, C22 arranged so as to close the gaps between the slits 45c, 46c dividing them. Further, the input-side wiring portions 43a and 44a are electrically connected to the adjacent ground-side wiring 50a by coils L11 and L21 disposed so as to close the gap between them. Similarly, the output-side wiring portions 45a and 45a are electrically connected to the adjacent ground-side wiring 50b by coils L21 and L22 arranged so as to close the gap therebetween.

  In another embodiment, the input-side wiring portions 43b and 44b can be electrically connected to the adjacent ground-side wirings 48a, 48b, and 50a, respectively, by capacitors or coils arranged so as to close the gaps therebetween. . Correspondingly, the output-side wiring portions 45b, 46b can be electrically connected to the adjacent ground-side wirings 48a, 48b, 50b, respectively, by capacitors or coils arranged so as to close the gaps therebetween. .

  With this configuration, the characteristic evaluation filter module 31 including the impedance matching circuit shown in the equivalent circuit of FIG. 5B is obtained. Also in this embodiment, in consideration of characteristic evaluation by a commercially available network analyzer, the capacitors C11, C12, C21, C22 and the coils L11, L12, L21, L22 have an impedance of 50Ω at both ends of the characteristic evaluation filter module 1. Choose to be.

  Also in the present embodiment, the respective wiring portions constituting the input and output wirings 43 to 46 are formed in a straight line with substantially the same width toward the side of the wiring board 32 as described above, and by the respective slits. By electrically connecting the divided portions with capacitors or coils, the input / output terminals of the SAW filter 33 and the connectors are electrically connected with substantially the same width and linear input and output wirings. Can be connected. As a result, as in the first embodiment, the operation of the SAW filter 33 to be evaluated and the influence of external noise on the input and output wirings 43 to 46 can be further reduced. Further, a large area is provided on the upper surface of the wiring board 32 for providing grounding wirings on both sides of the input and output wirings 43 to 46. In addition, since each of the grounding wires is grounded via a via hole, the operation of the SAW filter 33 and the influence on the input and output wires are further reduced. Therefore, the characteristics of the SAW filter 33 can be measured more accurately and stably, which is advantageous.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiments, and various modifications and changes can be made within the technical scope thereof. For example, the present invention can be applied to various electronic components such as a piezoelectric oscillator and a semiconductor device in addition to a SAW filter as an evaluation target. Even in this case, a desired impedance matching circuit can be designed by configuring the wiring pattern as described above and connecting the wiring pattern with a capacitor and / or a coil.

(A) is a plan view of a first embodiment of a filter module for characteristic evaluation to which the present invention is applied, and (B) is an end view thereof. (C) The figure is a fragmentary sectional view in the II line of (A) figure, (D) figure is the equivalent circuit schematic of the filter module for characteristic evaluation of (A) figure. The top view of the wiring board of FIG. (A) is a plan view of a modification of the first embodiment, and (B) is an equivalent circuit diagram thereof. (A) is a plan view of still another modification of FIG. 3, and (B) is an equivalent circuit diagram thereof. (A) is a plan view of a second embodiment of the filter module for characteristic evaluation to which the present invention is applied, and (B) is an equivalent circuit diagram thereof. The top view of the wiring board of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,31 ... Filter module for characteristic evaluation, 2, 32 ... Wiring board, 2a, 32a ... Left side, 2b, 32b ... Right side, 2c, 32d ... Bottom side, 2d, 32c ... Top side, 3, 33 ... SAW filter, 4, 34, 35 ... input side connector, 4a, 5a, 34a to 37a ... connector part, 4b, 5b, 34b to 37b ... flange part, 4c, 5c, 34c to 37c ... center pin, 5, 36, 37 ... output side connector, 6a to 6c ... base material, 7a to 7d ... ground layer, 8, 38, 39 ... input side electrode pad part, 9, 40, 41 ... output side electrode pad part, 10a to 10d, 42a, 42b ... ground side electrode pad 11, 13, 15, 16, 19a to 19d, 21, 22, 25, 43 to 46, 47a, 47b, 48a, 48b, 49, 50a, 50b... Wiring, 11a, 11b, 13 , 13b, 21a, 21b, 22a, 22b, 43a to 46a, 43b to 46b ... wiring portion, 12, 14, 43c to 46c ... slit, 17, 18, 20a to 20c, 23, 24, 26, 51a, 51b, 52, 53a, 53b ... via holes, 27a, 27b, 28, 29a, 29b, 30, 54a to 54c, 55a to 55c ... solder, C11, C12, C21, C22 ... capacitors, L11, L12, L21, L22 ... coils.

Claims (8)

A rectangle having an electronic component to be evaluated having an input terminal and an output terminal, a plurality of circuit elements connected to the electronic component to form an impedance matching circuit, and a wiring pattern for mounting the electronic component and the circuit element A wiring board, and an input side and an output side connector that are integrally coupled to the edge of the wiring board and electrically connected to the input terminal and the output terminal of the electronic component, respectively.
The wiring pattern includes an input side wiring that electrically connects the input terminal of the electronic component to the input side connector, and an output side wiring that electrically connects the output terminal of the electronic component to the output side connector. And ground side wiring,
The input-side wiring is divided into a first input-side wiring portion that extends linearly from the input terminal side of the electronic component, and a slight separation distance from the tip of the first input-side wiring portion, and the input A second input side wiring portion extending linearly toward the side connector,
The output side wiring is divided into a first output side wiring portion extending linearly from the output terminal side of the electronic component and a slight separation distance from a tip of the first output side wiring portion, and the output A second output side wiring portion extending linearly toward the side connector,
The ground-side wiring is located on the side of the first and / or second input-side wiring portion, with the input-side ground wiring separated by a slight distance from the input-side wiring portion, and the first and / or first 2 on the side of the output-side wiring portion, and an output-side ground wiring separated from the output-side wiring portion by a slight distance;
Between the first input side wiring portion and the second input side wiring portion, between the first output side wiring portion and the second output side wiring portion, and adjacent to the input side wiring portion. The separation distance between the input-side ground wiring and between the output-side wiring portion and the output-side ground wiring adjacent thereto is set so that it can be directly communicated with the circuit element,
The plurality of circuit elements are either between the first input side wiring portion and the second input side wiring portion, or between the first output side wiring portion and the second output side wiring portion. Or selectively connecting both of the input side wiring portions and the input side ground wiring adjacent thereto, and either or both of the output side wiring portions and the output side ground wiring adjacent thereto. By doing so, the characteristic matching electronic component module comprises the impedance matching circuit.   The first input side wiring portion and the second input side wiring portion and / or the first output side wiring portion and the second output side wiring portion are respectively arranged on the same straight line. The electronic component module for characteristic evaluation according to claim 1.   The first input-side wiring portion and the second input-side wiring portion and / or the first output-side wiring portion and the second output-side wiring portion are orthogonal to each other at the divided positions. The electronic component module for characteristic evaluation according to claim 1, wherein the electronic component module for characteristic evaluation is arranged.   4. The electronic component according to claim 1, wherein the electronic component is a two-terminal type of one input and one output, and one input side and one output side connector are provided correspondingly. Electronic component module for characteristic evaluation.   4. The electronic component according to claim 1, wherein the electronic component is of a four-terminal type with two inputs and two outputs, and two each of the input side and output side connectors are provided correspondingly. Electronic component module for characteristic evaluation.   2. The wiring board is formed of a multilayer board having a ground layer in the lowermost layer and / or inner layer thereof, and the ground side wiring is electrically connected to the ground layer through a via hole. The electronic component module for characteristic evaluation according to any one of 1 to 5.   The electronic component module for characteristic evaluation according to claim 6, wherein the multilayer substrate further includes a power supply layer. Mounting an electronic component to be evaluated having a wiring pattern and having an input terminal and an output terminal and a plurality of circuit elements connected to the electronic component and constituting an impedance matching circuit, and the input terminal of the electronic component And a rectangular wiring board for integrally connecting the input side and output side connectors electrically connected to the output terminals to the edges thereof,
The wiring pattern includes an input side wiring that electrically connects the input terminal of the electronic component to the input side connector, and an output side wiring that electrically connects the output terminal of the electronic component to the output side connector. And ground side wiring,
The input-side wiring is divided into a first input-side wiring portion that extends linearly from the input terminal side of the electronic component, and a slight separation distance from the tip of the first input-side wiring portion, and the input A second input side wiring portion extending linearly toward the side connector,
The output side wiring is divided into a first output side wiring portion extending linearly from the output terminal side of the electronic component and a slight separation distance from a tip of the first output side wiring portion, and the output A second output side wiring portion extending linearly toward the side connector,
The ground-side wiring is located on the side of the first and / or second input-side wiring portion, with the input-side ground wiring separated by a slight distance from the input-side wiring portion, and the first and / or first 2 on the side of the output-side wiring portion, and an output-side ground wiring separated from the output-side wiring portion by a slight distance;
Between the first input side wiring portion and the second input side wiring portion, between the first output side wiring portion and the second output side wiring portion, and adjacent to the input side wiring portion. The separation distance between the input-side ground wiring and between the output-side wiring portion and the output-side ground wiring adjacent thereto is set so that it can be directly communicated with the circuit element,
The plurality of circuit elements are either between the first input side wiring portion and the second input side wiring portion, or between the first output side wiring portion and the second output side wiring portion. Or selectively connecting both of the input side wiring portions and the input side ground wiring adjacent thereto, and either or both of the output side wiring portions and the output side ground wiring adjacent thereto. Thus, the wiring board of the electronic component module for characteristic evaluation, wherein the impedance matching circuit can be configured.

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