JP2007150336A - Substrate transporting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate transporting apparatus capable of transporting a substrate such as a semiconductor wafer with high precision for a long period of time, while reducing a thermal effect from a deposition treatment device to a minimum. <P>SOLUTION: The apparatus is provided with a heat conduction preventer for preventing heat conduction, for example, a cutting grooves 8 or a low-temperature melting substances etc. between the tip of a tip arm 4, 104 connected to a placing member 5 of a wafer W and the base end of the tip arm 4, 104. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate transfer apparatus, and more particularly to a substrate transfer apparatus that can transfer a substrate such as a semiconductor wafer with high accuracy over a long period of time while minimizing the influence of heat from a film forming apparatus or the like.

  In a semiconductor manufacturing process, a film forming process such as CVD (Chemical Vapor Deposition) or sputtering is performed to form an integrated circuit on a semiconductor wafer such as silicon (hereinafter referred to as “wafer”). In such a film forming process, a predetermined processing gas or the like is supplied into a vacuum vessel that has been evacuated and heated to a predetermined high temperature, and the wafer is carried in by a transfer device so that a predetermined metal or the like is formed on the wafer. It is a membrane. After the film forming process, the wafer is unloaded by the transfer device and transferred to other processes.

  As such a wafer transfer apparatus, as shown in FIG. 14, a first arm 2, a second arm 3, and a third arm 4 are sequentially and rotatably connected above the drive mechanism 1. An end effector 5 for placing a wafer is provided at the tip of the third arm 4. The end effector 5 has a fork-shaped tip so as to reduce the contact area with the wafer, and is formed of ceramics for preventing contamination, insulating, and the like. As described above, when the first to third arms 2 to 4 are moved up and down in the Z direction by driving the drive mechanism 1, the end effector 5 is moved up and down in the Z direction, and the first to third arms 2 to 4 are rotated. When it is moved, the end effector 5 is rotated in the θ direction and moved in the R-axis direction.

  Further, as shown in FIG. 15, the end effector 5 has a fork-like portion 6 on which the wafer W is placed, and is made of ceramic as described above. The base end portion of the end effector 5 is fitted and fixed to a fitting portion 7 provided at the distal end portion of the third arm 4, and the third arm 4 is used for preventing contamination. It is made of aluminum.

  However, in a film forming apparatus such as CVD, the wafer W is exposed to a very high temperature during the film forming process, and this high temperature is transferred from the wafer W through the end effector 5 on which the wafer W is mounted. Is transmitted to the third arm 4 made of good aluminum, and further transmitted from the third arm 4 to the second arm 3, the first arm 2, and the drive mechanism 1, and the influence of heat from the film forming apparatus. There are times when it receives.

  As described above, when the transfer device is affected by the heat from the film forming apparatus, the magnetic fluid used in the transfer device may be altered and the sealing performance of the magnetic fluid seal may be deteriorated. In addition, the grease and belt in the transport device may be altered or deformed to shorten the service life of the grease and belt, and relatively high-temperature heat is also transmitted to the metal parts of the transport device. In some cases, the metal parts are thermally expanded to deteriorate their accuracy.

  The present invention has been made in view of the circumstances as described above, and is a substrate transfer apparatus capable of transferring a substrate such as a semiconductor wafer with high accuracy over a long period of time while minimizing the influence of heat from a film forming apparatus or the like. The purpose is to provide.

  In order to achieve the above object, in the substrate transport apparatus according to the present invention, a mounting member for mounting a substrate is connected to the tip arms of a plurality of arms that are sequentially connected to a drive mechanism and are driven to rotate. In the substrate transport apparatus, a heat conduction suppression unit that suppresses heat conduction is provided between a distal end portion of the distal arm connected to the mounting member and a proximal end portion of the distal arm. Features.

  As described above, according to the present invention, even if the substrate mounting member is exposed to a relatively high temperature such as a film forming apparatus, the distal end portion and the proximal end portion of the distal arm connected to the mounting member Since a heat conduction suppression unit that suppresses heat conduction is provided in between, heat conduction to other arms, drive mechanisms, etc. of the transfer device is suppressed, and the influence of heat from the film formation processing device etc. Less. For this reason, the magnetic fluid used in the transfer device is rarely altered and the sealing performance of the magnetic fluid seal is less deteriorated. In addition, the grease and belt in the conveying device are rarely deteriorated or deformed, the life of the grease and belt is extended, and the number of maintenance is reduced. Furthermore, since it is difficult for high-temperature heat to be transmitted to the metal parts of the conveying device, the thermal expansion of these metal parts is reduced, and the accuracy is stabilized. Therefore, a substrate such as a semiconductor wafer can be transported with high accuracy over a long period of time while minimizing the thermal influence from the film forming apparatus and the like.

  Hereinafter, a wafer transfer apparatus according to an embodiment of the present invention will be described with reference to the drawings. The wafer transfer apparatus according to the embodiment of the present invention is the same as the substrate transfer apparatus shown in FIGS. 14 and 15 except for the parts described below.

  FIG. 1 is a plan view of a mounting member and an arm of a wafer transfer apparatus according to a first embodiment of the present invention. An end effector 5 (a mounting member) is used for mounting a wafer W (substrate). A fork-like portion 6 is provided, and a base end portion of the end effector 5 is fitted and fixed to a fitting portion 7 provided at a tip portion of the third arm 4 (tip arm).

  In the present embodiment, three cut grooves 8 are alternately formed between the distal end portion and the proximal end portion of the third arm 4. The portion formed between these cut grooves 8 constitutes a heat conduction path, but is formed relatively long by the cut grooves 8, so even if heat is transmitted from the end effector 5 side. Since heat is naturally radiated while being transmitted through the portion between the cut grooves 8, heat conduction from the film forming apparatus or the like to the first and second arms 2 and 3 and the drive mechanism 1 is suppressed. In the present embodiment, the portion between the cut grooves 8 constitutes a heat conduction suppressing portion that suppresses heat conduction.

  In the first embodiment and the following embodiments, the shape and number of the cut grooves are not limited to the respective embodiments.

  FIG. 2 is a plan view of the mounting member and the arm of the wafer conveyance device according to the second embodiment of the present invention. In this embodiment, the space between the distal end portion and the proximal end portion of the third arm 4 is shown. The five cut grooves 8 narrower than those of the first embodiment are alternately formed. Since the portion between the cut grooves 8 is formed longer than that in the first embodiment, the heat is further radiated more naturally at the portion between the cut grooves 8. Heat conduction to the arms 2 and 3 and the drive mechanism 1 is suppressed. Also in the present embodiment, the portion between the cut grooves 8 constitutes a heat conduction suppressing portion that suppresses heat conduction.

  FIG. 3 is a plan view of the mounting member and the arm of the wafer conveyance device according to the third embodiment of the present invention. In this embodiment, a cut groove 8 is formed at the side end of the third arm 4. In addition, a notch groove 9 is formed in the central portion of the third arm 4. For this reason, the heat conduction path in the portion between the cut grooves 8 and 9 is formed to be much longer, and natural heat is further radiated in this portion, so that the first and second arms 2 and 3 and the drive mechanism 1 are transferred. Is further suppressed. Also in the present embodiment, a portion between the cut grooves 8 and 9 constitutes a heat conduction suppressing portion that suppresses heat conduction.

  FIG. 4 is a plan view of the mounting member and the arm of the wafer conveyance device according to the fourth embodiment of the present invention. In this embodiment, the third arm 4 is connected to the proximal end portion 10 and the distal end portion 11. A thin plate member 12 made of stainless steel having a low thermal conductivity and curved several times is interposed between the distal end portion 10 and the proximal end portion 11. The thin plate member 12 constitutes a heat conduction suppressing portion, and the thin plate member 12 is formed of stainless steel having a low thermal conductivity and is bent several times so that the heat conduction path is long. Etc., heat conduction from the first to the second and second arms 2 and 3 and the drive mechanism 1 is suppressed.

  FIG. 5 is a plan view of a mounting member and an arm of a wafer conveyance device according to a fifth embodiment of the present invention. In this embodiment, a pair of thin plate members 12 of the fourth embodiment are provided symmetrically. ing. The pair of thin plate members 12 are made of stainless steel having a low thermal conductivity, bent several times to lengthen the heat conduction path, and heat conduction to the first and second arms 2 and 3 and the drive mechanism 1 is suppressed. Of course, this embodiment is stronger in strength than the fourth embodiment because a pair of thin plate members 12 are provided.

  FIG. 6A is a plan view of the mounting member and the arm of the wafer conveyance device according to the sixth embodiment of the present invention, and FIG. 6B is a side view of the mounting member and the arm shown in FIG. It is.

  In the present embodiment, between the tip of the third arm 4 and the substrate portion, an inclined surface 13 that receives radiant heat directly from the film forming apparatus or the like, and an inclination that does not receive radiant heat directly from the film forming apparatus or the like side. A surface 14 is formed. The inclined surface 13 and the top surface 15 between the two inclined surfaces are mirror-finished, and the radiant heat from the film forming apparatus and the like is reflected by the inclined surface 13 and the top surface 15 of the mirror surface. ing. Further, the inclined surface 14 is subjected to a black coloring process such as a radiant process so that heat from the third arm 4 is released. The inclined surface 13 and the top surface 15 of the mirror surface and the inclined surface 14 subjected to the black coloring process constitute a heat conduction suppressing portion. The back surface of the third arm 4 is configured in the same manner.

  FIG. 7A is a plan view of the mounting member and the arm of the wafer transfer apparatus according to the seventh embodiment of the present invention, and FIG. 7B is a side view of the mounting member and the arm shown in FIG. (C) is the elements on larger scale of (b).

  In the present embodiment, the third arm 4 is divided into a base end portion 10 and a tip end portion 11, and a thin plate extension portion 10 a and 11 b protruding from the split base end portion 10 and the tip end portion 11 toward each other. A thin plate member 18 made of stainless steel forms three grooves 8 between them. A Teflon resin layer 16 is sandwiched between the thin plate member 18 and the thin plate extensions 10a and 11b. Therefore, the heat conduction is suppressed by the natural heat dissipation of the groove 8 and the heat conduction is suppressed by the Teflon resin layer 16.

  FIG. 8A is a plan view of the mounting member and the arm of the wafer conveyance device according to the eighth embodiment of the present invention, and FIG. 8B is a side view of the mounting member and the arm shown in FIG. It is.

  In the present embodiment, the third arm 4 is divided into a base end portion 10 and a tip end portion 11, and a bridge member 17 coated with Teflon resin is provided on each of the divided base end portion 10 and tip end portion 11. The bridge member 17 is provided with a thin plate member 18 made of stainless steel. Thus, since the bridge member 17 is coated with Teflon resin to reduce the thermal conductivity, and the thin plate member 18 is made of stainless steel and has a low thermal conductivity, the heat conduction is suppressed by natural heat dissipation. The bridge member 17 and the thin plate member 18 constitute a heat conduction suppressing portion.

  FIG. 9A is a plan view of the mounting member and the arm of the wafer conveyance device according to the ninth embodiment of the present invention, and FIG. 9B is a side view of the mounting member and the arm shown in FIG. It is.

  In the present embodiment, as in the eighth embodiment, the third arm 4 is divided into a base end portion 10 and a tip end portion 11, and each of the divided base end portion 10 and tip end portion 11 is divided. A bridge member 19 coated with Teflon resin is provided, and a thin plate member 18 made of stainless steel is stretched over the bridge member 19 to suppress heat conduction.

  In the present embodiment, since the bridge member 19 is formed in a cylindrical shape, the angle between the proximal end portion 10 and the distal end portion 11 of the third arm 4 can be changed. The tilt angle and vertical position can be adjusted.

  FIG. 10 is a plan view of a mounting member and an arm of a wafer transfer apparatus according to a tenth embodiment of the present invention. In this embodiment, two ends are provided so that two wafers W can be transferred simultaneously. An effector 5 is provided, and these two end effectors 5 are fitted to one arm 20. As shown in FIG. 10, the arm 20 has cut grooves 21 formed vertically and horizontally. In particular, as compared with the first embodiment, the cut groove 21 is also formed in the width direction of the arm 20. Therefore, even if heat is transmitted from the end effector 5 side, natural heat is dissipated while being transmitted through the portion between the cut grooves 21, so that the first and second arms 2, 2 from the film forming apparatus or the like 3 and the heat conduction to the drive mechanism 1 are suppressed.

  Next, an eleventh embodiment of the present invention will be described with reference to FIG.

  In the eleventh embodiment, the configuration up to the driving device 1, the first arm 2, and the second arm 3 is the same as that in the prior art shown in FIG.

  In the eleventh embodiment to be described below, the third arm 104 is rotatably connected to the second arm 3, and an end effector 105 is fitted to the third arm. This is the same as the conventional example or the previous embodiments.

  The structure of the heat conduction suppressing portion in the third arm is different from that of the previous embodiments, and a low-melting substance (for example, sodium or naphthalene) that melts at about 120 ° C. or less is added to the third arm. When the heat from the wafer, which is the object to be transported, reaches this low-temperature melting material, it is absorbed as the heat of fusion, and heat conduction to other arms and drive mechanisms is suppressed. Yes.

  As shown in FIG. 13, the external shape of the third arm is the same as that of the third arm 4 of the conventional example shown in FIGS. 14 and 15, but the third arm 104 in the present embodiment has an appropriate area. A chamber portion 101 is formed, which is filled with naphthalene 102, which is a low-melting substance. A nonmagnetic aluminum lid 107 is fixed to the lower surface of the third arm 104 below the naphthalene 102 through the permanent magnet plate 103 so as to cover the entire chamber. In the present embodiment, the permanent magnet plate 103 has an N pole on the upper side and an S pole on the lower side, but this may be reversed.

  As shown in FIG. 11, a cooling device 110 is provided below the third arm 104 so as to be movable up and down. The cooling device 110 has a magnetic fluid portion 102 over the same area as the chamber portion 101 of the end effector 104 at the upper end thereof, and the magnetic fluid portion 102 faces and opposes the chamber portion 101 of the end effector 104 in the raised position. It is like that.

  The cooling device 110 has an electromagnet 112 near the magnetic fluid portion 102 at the upper end, and a cooling water pipe 113 that passes through a position close to the magnetic fluid portion 102 so that the cooling water is circulated. Yes.

  FIG. 12 is an enlarged view of part A in FIG. 11, showing the upper end of the cooling device 110 in the raised position, where (a) shows the state before excitation of the electromagnet, and (b) shows the state after excitation of the electromagnet. Show.

  The cooling device 110 having such a structure is surrounded by the bellows 115 and connected to the transfer chamber 130.

  In the eleventh embodiment, when the cooling device 110 is raised by a lifting device (not shown) and the electromagnet 112 is excited so as to have an N pole upward, as shown in FIG. Adsorbs in the chamber 101 and absorbs heat accumulated in a low-melting substance such as naphthalene. The sucked heat is sucked by the cooling water circulating through the cooling water pipe 113 and discharged. Further, by reversing the excitation of the electromagnet 112, the magnetic fluid can be separated from the third arm without being scattered.

  In addition, this invention is not limited to embodiment mentioned above, A various deformation | transformation is possible. In particular, what is transferred by the transfer device is not limited to a semiconductor wafer, and may be various substrates such as an LCD substrate.

(The invention's effect)
As described above, according to the present invention, even if the mounting member of the substrate is exposed to a relatively high temperature of a film forming apparatus or the like, the distal end portion and the proximal end of the distal arm connected to the mounting member Since a heat conduction suppression unit that suppresses heat conduction is provided between the two parts, heat conduction to other arms, drive mechanisms, etc. of the transport device is suppressed, and Impact is reduced. For this reason, the magnetic fluid used in the transfer device is rarely altered and the sealing performance of the magnetic fluid seal is less deteriorated. In addition, the grease and belt in the conveying device are rarely deteriorated or deformed, the life of the grease and belt is extended, and the number of maintenance is reduced. Furthermore, since it is difficult for high-temperature heat to be transmitted to the metal parts of the conveying device, the thermal expansion of these metal parts is reduced, and the accuracy is stabilized. Therefore, a substrate such as a semiconductor wafer can be transported with high accuracy over a long period of time while minimizing the influence of heat from the film forming apparatus or the like.

It is a top view of the mounting member and arm of a wafer transfer apparatus concerning a 1st embodiment of the present invention. It is a top view of the mounting member and arm of a wafer conveyance apparatus which concern on 2nd Embodiment of this invention. It is a top view of the mounting member and arm of a wafer conveyance apparatus which concern on 3rd Embodiment of this invention. It is a top view of the mounting member and arm of a wafer conveyance apparatus which concern on 4th Embodiment of this invention. It is a top view of the mounting member and arm of a wafer conveyance apparatus which concern on 5th Embodiment of this invention. (A) is a top view of the mounting member and arm of a wafer conveyance apparatus which concerns on 6th Embodiment of this invention, (b) is a side view of the mounting member and arm shown to (a). . (A) is a top view of the mounting member and arm of the wafer conveyance apparatus which concern on 7th Embodiment of this invention, (b) is a side view of the mounting member and arm shown to (a). (C) is a partially enlarged view of (b). (A) is a top view of the mounting member and arm of the wafer conveyance apparatus which concern on 8th Embodiment of this invention, (b) is a side view of the mounting member and arm shown to (a). . (A) is a top view of the mounting member and arm of the wafer conveyance apparatus which concern on 9th Embodiment of this invention, (b) is a side view of the mounting member and arm shown to (a). . It is a top view of the mounting member and arm of a wafer conveyance apparatus which concern on 10th Embodiment of this invention. It is explanatory drawing which looked at the wafer conveyance apparatus which concerns on 11th Embodiment of this invention from the front. FIG. 12 is an enlarged explanatory view of a part A in FIG. 11, (a) shows a state before excitation of the electromagnet, and (b) shows a state after excitation of the electromagnet. (A) is the top view of the mounting member and arm of a wafer conveyance apparatus which concern on 11th Embodiment, (b) is the figure which looked at these from the front, (c) is the bottom view of this arm. It is a perspective view of a wafer conveyance device. It is a top view of the mounting member and arm of the conventional wafer conveyance apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Drive mechanism 2 1st arm 3 2nd arm 4 and 104 3rd arm (tip arm)
5, 105 End effector (mounting member)
8 Incision groove 9 Incision groove 10 Base end portion 11 Tip portion 12 Thin plate member 13 Mirror surface inclined surface 14 Black colored inclined surface 15 Mirror surface top surface 16 Teflon resin layer 17 Bridge member 18 Thin plate member 19 Bridge member 20 Arm ( Tip arm)
102 Low temperature melting material

Claims (1)

  In the substrate transfer apparatus in which a mounting member for mounting a substrate is connected to the tip arms of a plurality of arms that are sequentially connected to a driving mechanism so as to freely rotate, the tip arm connected to the mounting member described above A substrate transfer apparatus, characterized in that a heat conduction suppressing portion for suppressing heat conduction is provided between the distal end portion of the first arm and the proximal end portion of the distal end arm.

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