JP2007150152A - Manufacturing method of solid electrolytic capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor of low ESR. <P>SOLUTION: The solid electrolytic capacitor is formed by subjecting tantalum powder, consisting of valve-action metal to pressure forming, and forming a dielectric oxide film layer 3, a solid electrolytic layer 4, a carbon layer 5, and a silver layer which is a mixture layer of a binder 62 and solver powder 61 in the surface of an anode body 2 wherein an anode lead 1 is plated in a sintered body and constituting a capacitor element. In the solid electrolytic capacitor, a binder is not exposed to the surface of the silver layer. In the manufacturing method of the solid electrolytic capacitor, after the formation of the silver layer; the capacitor element is immersed in an organic solvent, the binder formed in the surface of the silver layer is removed, the organic solvent comprises one or more kinds from among butyl cellosolve acetate, butyl acetate or butyl carbinol, and furthermore, the binder comprises one or more kinds of epoxy resin, acrylic resin or polyester resin. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a solid electrolytic capacitor, and more particularly to a method for manufacturing a solid electrolytic capacitor with reduced ESR.

  In recent years, with the increase in the frequency of CPUs of information communication devices and personal computers, low equivalent series resistance (hereinafter referred to as ESR) is required for solid electrolytic capacitors.

A conventional solid electrolytic capacitor is a dielectric oxide film layer formed by press-molding a valve metal such as tantalum and oxidizing the surface of a sintered sintered body, manganese dioxide or a conductive polymer. After sequentially forming a solid electrolyte layer, carbon layer, and silver layer made of a conductive material such as, the anode lead frame and anode lead wire are connected by resistance welding, and the cathode lead frame and silver layer are connected using a conductive adhesive. However, it is produced by coating with an exterior resin (for example, see Patent Document 1).
Japanese Patent Laid-Open No. 10-284351

However, since the silver paste used to form the above silver layer is a mixture of silver powder and a thermosetting resin that is a binder or a thermoplastic resin and a dispersant, the formed silver layer is bonded to the silver powder. It became a mixed layer of the adhesive, and the resistance was considerably larger than that of silver alone, which was a factor in increasing ESR.
In particular, the binder on the surface of the silver layer reduces the surface area of the exposed silver powder and increases the interfacial resistance value with the conductive adhesive, which causes an increase in ESR.

  The present invention solves the above problem, and provides a method for producing a solid electrolytic capacitor having a low ESR by removing the binder on the surface of the silver layer and reducing the interface resistance value with the conductive adhesive. It is what.

In order to solve the above problem, the present invention is a method in which a tantalum powder made of a valve metal is pressure-molded, and a sintered oxide is provided with a dielectric oxide film layer, a solid, In a solid electrolytic capacitor formed by forming an electrolyte layer, a carbon layer, a silver layer which is a mixed layer of a binder and silver powder, and constituting a capacitor element,
A solid electrolytic capacitor characterized in that a binder is not exposed on the surface of the silver layer.

In addition, dielectric oxide film layer, solid electrolyte layer, carbon layer, binder on the anode body surface, where tantalum powder made of valve metal is pressure-molded and the anode lead wire is planted in the sintered body In a method for producing a solid electrolytic capacitor, a silver layer that is a mixed layer of silver powder and a capacitor element is formed.
After the silver layer is formed, the capacitor element is immersed in an organic solvent to remove the binder formed on the surface of the silver layer.

  Furthermore, the organic solvent contains one or more of butyl cellosolve acetate, butyl acetate, or butyl carbinol.

  Moreover, the said binder is a manufacturing method of the solid electrolytic capacitor characterized by including 1 or more types in an epoxy resin, an acrylic resin, or a polyester resin.

  By removing the binder on the surface of the conductive silver layer, the area of the silver powder exposed on the surface of the silver layer can be increased and the interface resistance with the conductive adhesive can be reduced, thus reducing the ESR. The solid electrolytic capacitor can be provided.

[Example]
Embodiments of the present invention will be described with reference to the drawings.
First, tantalum powder made of a valve metal is pressure-molded and sintered to produce an anode body having a size of 4.3 × 3.2 × 1.0 mm, and the surface of the anode body is subjected to chemical conversion (electrolytic oxidation) treatment. To form a dielectric oxide film layer made of tantalum oxide, then sequentially form a solid electrolyte layer made of manganese dioxide and a carbon layer, and then apply and cure a silver paste in which silver powder is dispersed in an epoxy resin To form a silver layer.
Then, after dipping in butyl cellosolve acetate for 10 seconds to dissolve and remove the binder on the surface of the silver layer, it was dried at 80 ° C. for 10 minutes to produce a capacitor element.
Subsequently, the anode lead and the anode lead frame of the capacitor element are resistance welded, and the cathode lead frame and the silver layer are connected using a conductive adhesive, and then coated with an exterior resin to produce 50 solid electrolytic capacitors. did.

(Conventional example)
After the silver layer was formed, 50 solid electrolytic capacitors were produced in the same manner as in Example, except that the binder was not washed with butyl cellosolve acetate.

  The solid electrolytic capacitors of Examples and Conventional Examples were each applied with a capacitance of 120 Hz, an ESR of 100 kHz and 10 V, and a leakage current value after 1 minute was measured to calculate an average value. The results are shown in Table 1 below.

  As is clear from Table 1, the example has the same capacitance and leakage current value as the conventional example, but the ESR is reduced. This is because, by immersing the capacitor element in butyl cellosolve acetate, the binder on the surface of the silver layer is removed and the silver powder area on the surface of the silver layer is increased, so that the interface resistance with the conductive adhesive is increased. This is probably because the ESR of the solid electrolytic capacitor was reduced.

In the above embodiment, a silver paste having an epoxy resin as a binder is used. However, even if a silver paste having a thermosetting resin such as acrylic or a thermoplastic resin such as polyester as a binder is used, the same applies. The effect is obtained.
In addition, butyl cellosolve acetate was used as the organic solvent to be immersed, but the same effect can be obtained by using an organic solvent that dissolves a binder such as butyl acetate or butyl carbinol.

It is sectional drawing of a solid electrolytic capacitor. It is sectional drawing of the capacitor | condenser element after removing the binder on the silver powder surface in an Example. It is sectional drawing of the capacitor | condenser element in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode lead 2 Anode body 3 Dielectric oxide layer 4 Solid electrolyte layer 5 Carbon layer 6 Silver layer 7 Conductive adhesive 8 Exterior resin 9 Anode lead frame 10 Cathode lead frame 61 Silver powder 62 Binder

Claims (4)

Pressurized tantalum powder made of valve metal and sintered anode body with anode lead wire on sintered body, dielectric oxide film layer, solid electrolyte layer, carbon layer, binder and silver powder In a solid electrolytic capacitor formed by forming a silver layer that is a mixed layer of
A solid electrolytic capacitor, wherein a binder is not exposed on the surface of the silver layer. Pressurized tantalum powder made of valve metal and sintered anode body with anode lead wire on sintered body, dielectric oxide film layer, solid electrolyte layer, carbon layer, binder and silver powder In the method for producing a solid electrolytic capacitor formed by forming a silver layer that is a mixed layer of
A method for producing a solid electrolytic capacitor, wherein the capacitor element is immersed in an organic solvent after the silver layer is formed, and the binder formed on the surface of the silver layer is removed.   3. The method for producing a solid electrolytic capacitor, wherein the organic solvent according to claim 2 contains at least one of butyl cellosolve acetate, butyl acetate, and butyl carbinol.   The method for producing a solid electrolytic capacitor, wherein the binder according to claim 2 contains one or more of an epoxy resin, an acrylic resin, or a polyester resin.

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