JP2007149514A - Socket for electrical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for electrical components capable of regulating wiping with respect to electrical component terminals by a movable side contact part. <P>SOLUTION: In an IC socket 11, in which a movable contact piece 15c that is to be elastically deformed is formed in a contact pin 15 mounted on the socket body 13 where an IC package 12 is housed, and in which the movable side contact part 15f, contacted with and released from an IC lead 12b is formed at the tip part of the movable contact piece 15c, a wiping regulating part 15j is formed in the vicinity of the movable side contact part 15f at the movable contact piece 15c, and the wiping regulating part 15j regulates the sliding amount of the movable side contact part 15f to slide on the IC lead 12b, since the movable-side contact part 15f is contacted with a stopper part 15k, in a state of being in contact with the IC lead 12b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention provides an electrical component socket for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), and in particular, an improvement for restricting wiping of a contact pin that comes in contact with a terminal of the electrical component. It is related with the socket for electrical components made.

  Conventionally, this type of “electrical component socket” includes an IC socket that detachably holds an IC package that is an “electrical component”.

  This IC package is called a so-called gull wing type, and a plurality of IC leads as “terminals” project in a crank shape from two opposite sides of a substantially rectangular parallelepiped package body.

  On the other hand, as shown in a part of FIG. 7, the IC socket is formed with a mounting portion 1 a for mounting the IC package 6 on the socket body 1 and is in contact with the IC lead 6 a of the IC package 6. A plurality of contact pins 2 are provided. The contact pin 2 has a movable contact piece 3 and a fixed contact piece 4. The movable contact piece 3 is formed with a movable contact portion 3a that is separated from and in contact with the upper surface of the IC lead 6a. 4, a fixed-side contact portion 4a that is in contact with the lower surface of the IC lead 6a is formed.

  Further, although not shown in the figure, the socket body 1 is provided with an operation member that can be moved up and down, and by lowering the operation member against the urging force of the movable contact piece 3 of the contact pin 2, An operation piece (not shown) of the movable contact piece 3 of the contact pin 2 is pressed outward by the cam portion of the operation member.

  As a result, the unillustrated spring portion of the movable contact piece 3 of the contact pin 2 is elastically deformed to separate the movable contact portion 3a from the IC lead 6a, and the operating member is raised, whereby the spring. The movable side contact portion 3a is restored by the elastic force of the contact portion and comes into contact with the upper surface of the IC lead 6a to hold it from above. The IC lead 6a is sandwiched between the fixed side contact portion 4a and the contact pin 2 and the IC The lead 6a is electrically connected.

When the movable side contact portion 3a comes into contact with the upper surface of the IC lead 6a, the movable side contact portion 3a slides on the upper surface of the IC lead 6a by the elastic force of the movable contact piece 3. L1 will be wiped.
Japanese Patent Application Laid-Open No. 2000-195629.

  However, in such a conventional device, when the surface of the IC lead 6a is plated with lead-containing solder, the wiping is ensured by positively wiping as described above. However, in the case where the surface of the IC lead 6a is plated with a so-called lead-free solder that does not have lead, the plating layer on the surface of the IC lead 6a is scraped off by wiping, and contact scratches are caused. There is a risk that a large amount of plating waste will be generated.

  Then, this invention makes it the subject to provide the socket for electrical components which can control the wiping with respect to the electrical component terminal by a movable side contact part.

  In order to achieve this object, the invention according to claim 1 includes a socket main body in which an electrical component is accommodated, and a contact pin attached to the socket main body, and the contact pin is elastically deformed. In the electrical component socket in which a movable contact piece is formed, and a movable side contact portion that is in contact with and separated from a terminal of the electrical component is formed at a distal end portion of the movable contact piece, the movable contact piece includes the movable side contact portion. A wiping restricting portion is formed near the wiping restricting portion, and the wiping restricting portion contacts the stopper portion in a state where the movable side contact portion is in contact with the electric component terminal, whereby the electric component of the movable side contact portion is The socket for an electrical component is configured to restrict sliding on the terminal.

  The invention described in claim 2 is characterized in that, in addition to the configuration described in claim 1, the wiping restricting portion has a convex shape protruding toward the stopper portion.

  According to a third aspect of the present invention, in addition to the configuration of the first aspect, the contact pin is formed with a fixed contact piece having a fixed side contact portion that contacts the lower surface side of the electrical component terminal. The stopper is formed on the contact piece.

  The invention described in claim 4 is characterized in that, in addition to the structure described in claim 1, the stopper portion is formed in the socket body.

  According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, the wiping restricting portion has a convex shape protruding toward the stopper portion side, and the movable side contact portion At the time of contact with the electrical component terminal, the stopper is configured to move along an approximately arc-shaped locus from an obliquely upward position to an obliquely downward position, while the stopper portion is substantially along the movement locus of the wiping restricting portion. The wiping restricting portion is formed in an arc shape and is configured to move with a slight gap with respect to the stopper portion when the wiping restricting portion is moved.

  According to the first aspect of the present invention, the movable contact piece has the wiping restricting portion formed in the vicinity of the movable contact portion, and the wiping restricting portion is in a state in which the movable contact portion is in contact with the electrical component terminal. Since the sliding of the movable contact portion on the electric component terminal is restricted by contacting the stopper portion, the wiping of the movable contact portion with respect to the electric component terminal can be restricted, and so-called lead-free solder is plated. Even if it is a terminal, the plating layer on the surface is greatly scraped off, so that a large contact scratch does not occur and a large amount of plating scraps can be prevented.

  According to the third aspect of the present invention, the contact pin is formed with the fixed contact piece having the fixed side contact portion that contacts the lower surface side of the electrical component terminal, and the stopper portion is formed on the fixed contact piece. The wiping regulation can be performed only by slightly improving the structure of the contact pin.

  According to the invention described in claim 5, the wiping restricting portion has a convex shape protruding toward the stopper portion side, and when the movable side contact portion is brought into contact with the electrical component terminal, from the obliquely upward position toward the obliquely downward position. The stopper portion is formed in a substantially arc shape along the movement locus of the wiping restricting portion, and the wiping restricting portion moves relative to the stopper portion when the wiping restricting portion moves. Therefore, even if the thickness of the terminal is different, the movable side contact part can be reliably contacted with the electrical component terminal, and the wiping regulation is also ensured. It can be carried out.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 4 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 that is an “electrical component”. The IC lead 12b as the “terminal” 12 is electrically connected to the wiring board (not shown) of the measuring instrument (tester).

  As shown in FIG. 1, the IC package 12 is a so-called gull wing type, and a large number of IC leads 12b protrude in a crank shape from two opposite sides of a rectangular package body 12a to the side. Yes.

  On the other hand, the IC socket 11 generally has a socket body 13 to be mounted on the wiring board. The socket body 13 is formed with an accommodation surface portion 13a for accommodating the IC package 12, and the IC package 12 A guide portion 13b is provided corresponding to each corner of the package body 12a, and a mold guide 13g for guiding the package body 12a is provided. In addition, between the guide portions 13b, partition walls 13c are formed on two opposing sides around the accommodation surface portion 13a, and a number of slits 13d are formed at predetermined intervals in the partition wall 13c.

  The socket body 13 is provided with a plurality of elastically deformable contact pins 15 that are separated from and in contact with the IC leads 12b, and a rectangular frame-shaped operation member 16 that elastically deforms the contact pins 15 is vertically moved. It is arranged freely.

  The contact pin 15 is made of a material having elasticity and excellent conductivity, and is formed in a shape as shown in FIG. 2 and the like, and is press-fitted into the outer surface of the housing surface portion 13a of the socket body 13 and disposed. .

  Specifically, as shown in FIG. 2, the contact pin 15 is formed with a fixing portion 15 a fixed to the socket body 13 on the lower side, and the fixing portion 15 a is press-fitted and fixed to the press-fitting hole 13 e of the socket body 13. . A fixed contact piece 15b and a movable contact piece 15c project from the fixed portion 15a upward.

  The fixed contact piece 15b is formed with a fixed-side contact portion 15d that contacts the lower surface of the IC lead 12b at the upper end portion. As shown in FIG. 1 and the like, the fixed side contact portion 15d has a substantially rectangular shape and is locked so as to be hooked on a locking notch 13f formed in the socket body 13. The IC lead 12b is placed on and in contact with the upper surface portion of the fixed side contact portion 15d.

  The movable contact piece 15c is formed with a spring portion 15e that is curved in an approximately S shape, and a movable contact portion 15f is extended above the spring portion 15e toward the central portion of the socket body 13. ing. The movable-side contact portion 15f is configured such that the IC lead 12b is sandwiched between the fixed-side contact portion 15b and the fixed-side contact portion 15b by abutting against and pressing the upper surface of the IC lead 12b. .

  Further, the contact pin 15 is provided with an operation piece 15g pressed by an operation member 16, which will be described in detail later, branched from the movable contact portion 15f side and extended upward. In addition, below the fixed portion 15a, a lead portion 15h connected to a wiring board (not shown) is extended downward.

  Furthermore, the movable contact piece 15c is formed with a convex wiping restricting portion 15j near the lower side of the movable contact portion 15f. The wiping restricting portion 15j is configured such that the movable contact portion 15f is connected to the IC lead 12b. The amount of sliding of the movable side contact portion 15f sliding on the IC lead 12b is regulated by contacting the stopper portion 15k formed near the lower side of the fixed side contact portion 15d of the fixed contact piece 15b. Is configured to do.

  Specifically, when the movable contact portion 15c of the movable contact piece 15c is in contact with the IC lead 12b, the wiping restricting portion 15j is inclined obliquely from the upper position to the state indicated by the two-dot chain line in FIG. It is comprised so that it may move to a substantially circular arc shape toward a position.

  On the other hand, the stopper portion 15k is formed in a substantially arc shape along the movement locus of the wiping restricting portion 15j, and when the wiping restricting portion 15j moves, the wiping restricting portion 15j has a slight gap C with respect to the stopper portion 15k. And is configured to move along the arc.

  When the movable contact portion 15f is slightly slid from the state in which the movable contact portion 15f is in contact with the upper surface of the IC lead 12b, the gap C is small, so that the wiping restricting portion 15j of the movable contact piece 15c is replaced with the fixed contact piece 15b. Abutting on the stopper portion 15k, the sliding amount of the movable side contact portion 15f sliding (wiping) on the IC lead 12b is regulated.

  On the other hand, as shown in FIG. 1, the operation member 16 has a rectangular frame shape corresponding to the shape of the IC package 12, and has an opening 16a of a size into which the IC package 12 can be inserted. The IC package 12 is inserted through the socket body 13 so as to be housed on the upper side of the housing surface portion 13 a of the socket body 13. The operation member 16 is disposed so as to be movable up and down with respect to the socket body 13 and is urged upward by a coil spring (not shown), and a locking claw (not shown) is attached to the socket body 13 at the highest position. The operation member 16 is prevented from coming off by being locked by the locked portion.

  Furthermore, the operating member 16 is formed with a cam portion 16c slidably contacting the operating piece 15g of the contact pin 15. By lowering the operating member 16, the operating piece 15g of the contact pin 15 is moved to the cam portion 16c. Thus, the spring portion 15e is elastically deformed, and the movable contact portion 15f is displaced toward the substantially arcuate Kise toward the obliquely upward outer side.

  Next, a method of using the IC socket 11 having such a configuration will be described.

  First, the lead portions 15h of the contact pins 15 of the IC socket 11 are inserted into the insertion holes of the wiring board and soldered in advance, thereby arranging the plurality of IC sockets 11 on the wiring board.

  Then, the IC package 12 is set and electrically connected to the IC socket 11 by, for example, an automatic machine as follows.

  That is, the IC package 12 is conveyed by an automatic machine, and the operation member 16 is resisted against the urging force of the contact pin 15 by the automatic machine in a state where the IC package 12 is held at a position above the accommodation surface portion 13 a of the socket body 13. Then press down and lower. Then, the contact pin operation piece 15g is pressed by the cam portion 16c of the operation member 16, the spring portion 15e is elastically deformed, and the movable side contact portion 15f is displaced obliquely upward and opened to the maximum, and the IC package. 12 is retracted from the insertion range (see the two-dot chain line in FIG. 3).

  In this state, when the IC package 12 is released from the automatic machine, the IC lead 12b of the IC package 12 is guided and received by the guide portion 13b on the receiving surface portion 13a of the socket body 13, and the fixed-side contact portion 15d of the contact pin 15 is accommodated. It will be in the state which touched up.

  Next, when the pressing force applied to the operation member 16 by the automatic machine is released, the operation member 16 rises due to the elastic force of the spring portion 15e of the movable contact piece 15c of the contact pin 15 and the coil spring, and the elastic force of the spring portion 15e. As a result, the movable contact portion 15f of the contact pin 15 begins to return. When the operation member 16 is raised to a predetermined position, the movable contact portion 15f of the contact pin 15 is in contact with and electrically connected to the upper surface of the predetermined IC lead 12b of the positioned IC package 12. It will be.

  At this time, the movable contact portion 15f moves along a substantially arc-shaped locus from an obliquely upward position to an obliquely downward position, and the wiping restricting portion 15j is also substantially directed from an obliquely upward position to an obliquely downward position. Move to an arc shape. In the wiping restricting portion 15j, the stopper portion 15k of the fixed contact piece 15b is formed in a substantially arc-shaped locus along the movement locus of the wiping restricting portion 15j. It moves with a slight gap C.

  Accordingly, since the wiping restricting portion 15j does not rub against the stopper portion 15k when the movable contact portion 15f is elastically deformed, the contact pin 15 does not wear or the operating force does not increase due to sliding resistance. Etc. can be maintained.

  Then, after the movable side contact portion 15f comes into contact with the upper surface of the IC lead 12b, the movable side contact portion 15f is further slid (wiped) in the direction of arrow A in FIG. 3 by the urging force of the spring portion 15e. At the time when the gap C moves, the wiping restricting portion 15j comes into contact with the stopper portion 15k. As a result, the movement (wiping) is restricted, and even if the surface of the IC lead 12b is so-called lead-free solder, the plating layer of the IC lead 12b is not peeled off and is not damaged greatly.

  By the way, although the thickness of the IC lead 12b may be different depending on the IC package 12, even when the IC package 12 is accommodated, the movable contact portion 15f can be reliably brought into contact with the upper surface of the IC lead 12b. At the same time, wiping regulation can be performed reliably. Incidentally, the one shown in FIG. 1 has an IC lead 12b thickness of 0.25 mm and a gap C (wiping amount) of 0.07 mm, and the one shown in FIG. 4 has an IC lead 12b thickness of 0.15 mm. The gap C (wiping amount) is 0.06 mm.

  That is, the movable-side contact portion 15f moves along a substantially arc-shaped locus from an obliquely upward position to an obliquely downward position and contacts the IC lead 12b. For example, when the thickness of the IC lead 12b is reduced, the movable-side contact portion 15f If the wiping restricting portion 15j comes into contact with the stopper portion 15k and the movement of the movable contact portion 15f is restricted before the portion 15f contacts the IC lead 12b, the contact between the movable contact portion 15f and the IC lead 12b There is a risk of poor contact.

  However, here, since the stopper portion 15k is formed in an arc shape in accordance with the movement locus of the wiping restricting portion 15j, even if the thickness of the IC lead 12b is different, the movable side contact portion 15f is being moved. Thus, the movable contact portion 15f can be reliably brought into contact with the IC lead 12b without the wiping restricting portion 15j coming into contact with the stopper portion 15k (see FIGS. 1 and 4).

In addition, as described above, when the movable contact portion 15f is further slid (wiped) in the direction of arrow A in FIG. 4, the wiping restricting portion 15j comes into contact with the stopper portion 15k when it moves by the gap C. The movement (wiping) is restricted.
[Embodiment 2 of the Invention]

  FIG. 5 shows a second embodiment of the present invention.

  In the first embodiment, the wiping restricting portion 15j of the movable contact piece 15c is formed in a convex shape, but in the second embodiment of the present invention, the stopper portion 15k of the fixed contact piece 15b is formed in a convex shape, The wiping restricting portion 15j of the movable contact piece 15c is formed in a flat shape.

  Even in such a case, the wiping restricting portion 15j of the movable contact piece 15c abuts against the stopper portion 15k of the fixed contact piece 15b, thereby restricting the wiping of the movable contact portion 15f to the IC lead 12b. Become.

Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
Embodiment 3 of the Invention

  FIG. 6 shows a third embodiment of the present invention.

  In the second embodiment, the contact pin 15 has a so-called two-point configuration. In the third embodiment, the contact pin 15 has a so-called one-point configuration in which only the movable contact piece 15c is provided.

  The movable contact piece 15c is formed with a protruding wiping restricting portion 15j near the lower side of the movable contact portion 15f. The wiping restricting portion 15j abuts against the stopper portion 13j of the inclined surface of the socket body 13. Thus, the wiping of the movable contact portion 15f is regulated.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. Further, the IC package 12 is applied to the case where the IC lead 12b protrudes from two opposite sides of the package body 12a, but the IC package protrudes from the four sides of the package body toward the side. It can also be applied to. Furthermore, it goes without saying that the shape of the IC lead 12b (terminal) is not limited to the so-called gull wing type, but can be applied to a straight type or the like.

It is sectional drawing of the IC socket which concerns on Embodiment 1 of this invention. It is a front view which shows the contact pin of the IC socket which concerns on the same Embodiment 1. FIG. It is a principal part expanded sectional view of the IC socket which concerns on the same Embodiment 1. FIG. FIG. 6 is a half cross-sectional view showing a state where an IC package having a thin IC lead is accommodated in the IC socket according to the first embodiment. FIG. 5 is a half sectional view corresponding to FIG. 4, showing a second embodiment of the present invention. FIG. 5 is a half sectional view corresponding to FIG. 4 and showing Embodiment 3 of the present invention. It is a principal part expanded sectional view which shows a prior art example.

Explanation of symbols

11 IC socket (Socket for electrical parts)
12 IC package (electrical parts)
12a Package body
12b IC lead (terminal)
13 Socket body
13a Containment surface
13b Guide section
13c Bulkhead
13j Stopper section
15 Contact pin
15b Fixed piece
15c movable contact
15d Fixed side contact area
15e Spring part
15f Movable contact part
15g operation piece
15j Wiping regulation department
15k stopper
16 Operation parts

Claims (5)

It has a socket body in which an electrical component is accommodated, and a contact pin attached to the socket body, and the contact pin is formed with a movable contact piece that is elastically deformed. In the electrical component socket in which the movable side contact portion that is separated from and contacting the terminal of the electrical component is formed,
In the movable contact piece, a wiping restricting portion is formed in the vicinity of the movable contact portion, and the wiping restricting portion contacts the stopper portion in a state where the movable contact portion is in contact with the electrical component terminal. Accordingly, the electrical component socket is configured to restrict sliding of the movable side contact portion on the electrical component terminal. The electrical component socket according to claim 1, wherein the wiping restricting portion has a convex shape protruding toward the stopper portion. 2. The contact pin is formed with a fixed contact piece having a fixed contact portion that contacts a lower surface side of the electrical component terminal, and the stopper portion is formed on the fixed contact piece. Socket for electrical parts as described in 1. The electrical component socket according to claim 1, wherein the stopper portion is formed in the socket body. The wiping restricting portion has a convex shape that protrudes toward the stopper portion, and moves in a substantially arc-shaped locus from an obliquely upward position to an obliquely downward position when the movable side contact portion contacts the electrical component terminal. While configured to
The stopper portion is formed in a substantially arc shape along the movement locus of the wiping restricting portion, and the wiping restricting portion moves with a slight gap with respect to the stopper portion when the wiping restricting portion is moved. 5. The electrical component socket according to claim 1, wherein the electrical component socket is configured as described above.

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