JP2007137457A - Component supply tape and manufacturing method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To carry out a process of picking up a surface mounting component in a stable manner without a suction failure, the component being supplied to a component carrier device with a paper tape. <P>SOLUTION: A component supply tape 1 has a component housing pocket 2 which houses an air core coil L. A component housing pocket 2 consists of a first pocket 2a which is a cavity for housing the air core coil L therein, and a second pocket 2b which has an opening formed to be larger than that of the first pocket 2a. The depth of the first pocket 2a is made greater in dimension than the radius of the housed air core coil L. The short side of the second pocket 2b is made greater in dimension than the sum of the length of the short side of a suction mounting nozzle 4, which sucks to pick up the air core coil L, and an error resulting from an irregularity in feeding of the component supply tape 1. The long side of the second pocket 2b is made greater in dimension than the sum of the length of the long side of the suction mounting nozzle 4 and an error resulting from irregular meandering of the tape 1 in feeding of the tape 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pick-up technique for surface-mounted components, and more particularly to a technique effective for housing an air-core coil housed in a paper tape.

  An air-core coil mounted on an IC module such as a high-frequency power module is generally delivered in a state of being mounted on a paper tape for supplying surface mount components. The pocket shape of the paper tape is a simple square shape, and an air-core coil is disposed in the pocket.

  When mounting the air-core coil, when the air-core coil is picked up from the paper tape, the air-core coil in the pocket is picked up and picked up by the suction mounting nozzle. As the suction mounting nozzle, a so-called cylindrical mounting suction nozzle for a cylindrical part having a rounded tip is used to stabilize the suction posture of the air-core coil during suction.

  However, the present inventors have found that the above-described technology for storing an air-core coil using a paper tape has the following problems.

  The air core coil is supplied to the component mounting machine by a tape feeder. At this time, in order to stably attract the air core coil, it is necessary to reduce the distance between the suction mounting nozzle and the air core coil.

  However, if the distance between the suction mounting nozzle and the air-core coil is too short, the suction mounting nozzle will come into contact with the upper surface of the paper tape around the pocket, which will hinder the suction.

  For this reason, there is a problem that the distance between the suction mounting nozzle and the air-core coil at the time of suction is inevitably limited, and pickup by stable suction is hindered.

  An object of the present invention is to provide a technique capable of stably performing pickup of a surface mount component such as an air-core coil supplied to a component mounting machine by a paper tape without causing a suction error.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The component supply tape according to the present invention is a component storage pocket comprising a first pocket for storing a surface-mounted component, and a second pocket formed at an upper portion of the first pocket and having a wider opening than the first pocket. It is equipped with.

  In the component supply tape according to the present invention, the surface mount component housed in the component storage pocket is an air-core coil.

  Further, in the component supply tape according to the present invention, the depth of the first pocket is deeper than the radius of the air-core coil L.

  In the component supply tape according to the present invention, the dimension of the short side of the second pocket is larger than the sum of the length in the short side direction of the suction mounting nozzle and the error in the variation in feeding of the component supply tape. The size of the long side of the second pocket is larger than the sum of the length in the long side direction of the suction mounting nozzle and the error of the meandering variation at the time of tape feeding of the component supply tape. .

  Furthermore, the outline | summary of the other invention of this application is shown briefly.

  A method of manufacturing a semiconductor device according to the present invention includes a component storage pocket including a first pocket for storing a surface-mounted component, and a second pocket formed above the first pocket and having a wider opening than the first pocket. And a step of preparing a tape for supplying a component provided with a component, and a step of sucking and picking up a surface-mounted component stored in a component storage pocket by a suction mounting nozzle and mounting it on an arbitrary position of a printed wiring board Yes.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  (1) Adsorption and mounting of surface-mounted components can be performed stably.

  (2) According to the above (1), the surface-mounted component can be mounted efficiently and reliably.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

  1 is a plan view of a component supply tape according to an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of the component supply tape of FIG. 1, and FIG. 3 is a diagram of the component supply tape of FIG. FIG. 4 is a cross-sectional view in the width direction, and FIG. 4 is an explanatory diagram showing an outline when the air-core coil L accommodated in the component supply tape of FIG. 1 is mounted on the module substrate.

  In the first embodiment, the component supply tape 1 is a tape for automatic supply in an air-core coil L that is a surface-mounted component mounted on an RF module or the like, and is made of, for example, a paper tape. As shown in FIG. 1, the component supply tape 1 has rectangular component storage pockets 2 in which air-core coils L are stored at equal intervals.

  Sprocket holes 3 are formed at equal intervals above the component storage pocket 2. The sprocket hole 3 is a hole to be fitted to a sprocket provided in the component mounting machine, and the component supply tape 1 is moved by a constant pitch by rotating the sprocket.

  FIG. 2 shows a cross section in the longitudinal direction of the component supply tape 1 (the drawing direction of the component supply tape 1), and FIG. 3 shows a cross section in the width direction of the component supply tape 1. is there.

  As shown in FIGS. 2 and 3, the component storage pocket 2 has a first pocket 2 a and a second pocket 2 b each having a two-stage size from the back surface side to the main surface side of the component supply tape 1. Consisting of The first pocket 2a is a cavity that houses the air-core coil L.

  The opening of the first pocket 2a is slightly larger than the outer dimension of the air core coil L, and the depth of the first pocket 2a is larger than the radius of the air core coil L to be accommodated. Is formed.

  Here, the depth of the first pocket 2a may be a depth that stabilizes the housing posture of the air core coil L when the air core coil L is housed, but if the depth is large (air core coil L When the air core coil L is attracted, the suction mounting nozzle 4 may come into contact with the first pocket 2a due to an attachment error of the suction mounting nozzle 4.

  Therefore, the depth of the first pocket 2a takes into account the mounting accuracy of the suction mounting nozzle 4 when the air-core coil L is sucked, and the first pocket 2a has a maximum position error when the suction mounting nozzle 4 is lowered. The depth is set such that the pocket 2 a does not contact the suction mounting nozzle 4.

  The second pocket 2b has a larger opening than the first pocket 2a. The short side direction in the second pocket 2b is larger than the sum of the length in the short side direction of the suction mounting nozzle 4 that sucks and picks up the air-core coil L and the error of the feed variation of the component supply tape 1. Is formed.

  Further, the long side direction of the second pocket 2b is formed to have a dimension larger than the length of the long side direction of the suction mounting nozzle 4 and the error of the meandering variation when the component supply tape 1 is fed. .

  Next, the operation of the component supply tape 1 according to this embodiment will be described.

  FIG. 4 is an explanatory view showing an outline when the air-core coil L accommodated in the component supply tape 1 is mounted on a module substrate (printed wiring substrate) MP such as an RF module.

  As shown in the figure, the air-core coil L accommodated in the component supply tape 1 is adsorbed by a suction mounting nozzle 4 formed in an R shape so that the tip matches the shape of the air-core coil L, and pickup is performed. .

  At this time, as shown in FIGS. 2 and 3, since the second pocket 2b is formed larger than the suction mounting nozzle 4, it is sufficient to stably suck the suction mounting nozzle 4 to the air-core coil L. Even when the distance is reduced, it is possible to reliably prevent the component supply tape 1 from coming into contact with the suction mounting nozzle 4.

  In addition, since the first pocket 2a is also formed with a depth larger than the radius of the air core coil L to be stored, the posture of the air core coil L can be stabilized.

  Subsequently, as shown in FIG. 4, the suction mounting nozzle 4 that sucks the air-core coil L moves to above the module substrate MP, moves the suction mounting nozzle 4 downward, and an arbitrary position on the module substrate MP. The air-core coil L is mounted on.

  By repeating the above operation, each air-core coil L is mounted on the module substrate MP.

  Thus, according to the present embodiment, when the air-core coil L is attracted, the mounting of the component storage pocket 2 on the component supply tape 1 is reliably prevented while being attracted and mounted on the air-core coil L at the time of suction. Since the distance to the nozzle 4 can be sufficiently reduced, the air-core coil L can be stably adsorbed.

  Further, since adjustment of the feeding accuracy of the tape feeder or the like on the component mounting machine side becomes unnecessary, the air-core coil L can be efficiently mounted at low cost.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above embodiment, the first pocket 2a (FIG. 1) of the component supply tape 1 is individually provided. However, as shown in FIGS. 5 and 6, the first pocket 2a is supplied as a component. You may make it form as one pocket so that it may connect continuously in the length direction of the tape 1 for work.

  With this configuration, the first pocket 2a can be easily processed, and the cost of the component supply tape 1 can be reduced.

  The present invention is suitable for a stable pickup technique for surface-mounted components housed in paper tape or the like.

It is a top view of the tape for component supply by one embodiment of this invention. It is sectional drawing of the longitudinal direction of the tape for component supply of FIG. It is sectional drawing of the width direction in the component supply tape of FIG. It is explanatory drawing which showed the outline | summary at the time of mounting the air-core coil L accommodated in the component supply tape of FIG. 1 on a module board. It is a top view of the tape for component supply by other embodiment of this invention. FIG. 6 is a cross-sectional view taken along the line A-A ′ of the component supply tape of FIG. 5.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Parts supply tape 2 Parts storage pocket 2a 1st pocket 2b 2nd pocket 3 Sprocket hole 4 Suction mounting nozzle L Air-core coil MP Module board (printed wiring board)

Claims (5)

  A component comprising a component storage pocket comprising a first pocket for storing a surface mount component, and a second pocket formed above the first pocket and having a wider opening than the first pocket. Supply tape. In the tape for component supply of Claim 1,
The surface-mounted component stored in the component storage pocket is an air-core coil. In the tape for component supply of Claim 2,
The depth of the first pocket is
A tape for supplying parts, wherein the tape is deeper than a radius of the air-core coil. In the tape for component supply of Claim 2 or 3,
The short side dimension of the second pocket is:
It consists of a size that is larger than the length of the suction mounting nozzle in the short side direction and the error of the feed variation of the component supply tape,
The long side dimension of the second pocket is:
A component supply tape having a size larger than a length obtained by adding a length in a long side direction of the suction mounting nozzle and an error of meandering variation during tape feeding of the component supply tape. A component supply tape having a component storage pocket including a first pocket for storing a surface mount component and a second pocket formed at an upper portion of the first pocket and having a wider opening than the first pocket is prepared. Process,
A method of manufacturing a semiconductor device, comprising: picking up and picking up a surface-mounted component stored in the component storage pocket by a suction mounting nozzle and mounting it on an arbitrary position of a printed wiring board.

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