JP2007129107A - Light-emitting diode and method for correcting chromaticity of the light-emitting diode - Google Patents

Light-emitting diode and method for correcting chromaticity of the light-emitting diode Download PDF

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JP2007129107A
JP2007129107A JP2005321464A JP2005321464A JP2007129107A JP 2007129107 A JP2007129107 A JP 2007129107A JP 2005321464 A JP2005321464 A JP 2005321464A JP 2005321464 A JP2005321464 A JP 2005321464A JP 2007129107 A JP2007129107 A JP 2007129107A
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emitting diode
light
resin
chromaticity
led
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JP4906316B2 (en
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Kazu Oishi
和 大石
Junji Miyashita
純二 宮下
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

<P>PROBLEM TO BE SOLVED: To improve a light-emitting diode and aging properties of the method for correcting its chromaticity. <P>SOLUTION: The light-emitting diode has a light-emitting diode element, and a covering member for covering the light-emitting diode element. Staining the covering member in a staining fluid with a resin component mixed hardens the resin component with a dye or a pigment in an covering member to be able to stain with the heat resistance, that is, with the heat-resistant aging properties. The covering member is the same type of resin as that of the resin mixed in the staining fluid. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は発光ダイオード、及び発光ダイオードの色度補正方法に関する。   The present invention relates to a light emitting diode and a method for correcting chromaticity of the light emitting diode.

近来、ブック型のコンピュータ、携帯電話機のような小型、薄型の情報機器の表示装置として、照明機構付き液晶等の受光型表示装置が用いられている。
かかる表示装置の照明手段としては発光源と光路変換部材を有する面状光源（バックライトユニット、フロントライトユニット等）が従来より知られている。このような面状光源に使用する前記発光源としては、蛍光ランプ、発光ダイオード（以下ＬＥＤと略記する）が従来、使用されてきた。この中で近年は更なる小型化、薄型化と長寿命化を目的として、発光源としてＬＥＤを用いたものが多く使用されるようになってきている。 Recently, a light-receiving display device such as a liquid crystal with an illumination mechanism has been used as a display device for small and thin information devices such as book-type computers and mobile phones.
Conventionally known as illumination means for such display devices are planar light sources (backlight unit, front light unit, etc.) having a light emitting source and an optical path changing member. Conventionally, fluorescent lamps and light-emitting diodes (hereinafter abbreviated as LEDs) have been used as the light-emitting sources used for such planar light sources. Among these, in recent years, for the purpose of further miniaturization, thinning, and long life, those using LEDs as light emitting sources are increasingly used.

発光ダイオードは従来用いられていた光源に比べ、発光波長のばらつきが少ないものの、さらなる色再現性向上のため、良品と見なされる色度範囲が狭められてきている。そのため発光光色度の選別が行われ、該選別作業によって廃棄される発光ダイオードが多くなっている。   Although light emitting diodes have less variation in light emission wavelength than conventionally used light sources, the chromaticity range considered as non-defective products has been narrowed to further improve color reproducibility. For this reason, sorting of emitted light chromaticity is performed, and more light emitting diodes are discarded by the sorting operation.

このような状況を改善するため、ＬＥＤの発光光の色度を補正して所望の色度とする種々の方法が考えられている。
その１つとして蛍光物質を含んだ被覆材をＬＥＤにかぶせ、ＬＥＤ出力光の色度を補正するという提案がある（例えば特許文献１参照）。
しかし、このような被膜材によって、ＬＥＤの寸法が厚くなってしまう、外形サイズが変わってしまうという問題があり、補正不要なＬＥＤとの差をどうするか等の問題も含め実施することが難しかった。 In order to improve such a situation, various methods for correcting the chromaticity of light emitted from the LED to obtain a desired chromaticity have been considered.
One of the proposals is to cover the LED with a covering material containing a fluorescent substance to correct the chromaticity of the LED output light (see, for example, Patent Document 1).
However, there is a problem that the size of the LED becomes thicker due to such a coating material, and the outer size changes, and it is difficult to implement including the problem of how to deal with the difference from the LED that does not require correction. .

また照明装置の、ＬＥＤ光源を離れた照明光の経路中に蛍光物質を含んだ層を置き、該層中の蛍光物質でＬＥＤ出力光の色度を補正するという提案もある（例えば特許文献２参照）。
しかしこの提案によると照明装置の光源の問題が照明装置全体の問題となってしまうため、該光源を独立して扱うことが出来なくなってしまう点や、補正用の前記層を各種用意するために費用が大きくなってしまうという点が問題となって実現が困難であった。 There is also a proposal to place a layer containing a fluorescent material in the path of illumination light away from the LED light source of the lighting device and correct the chromaticity of the LED output light with the fluorescent material in the layer (for example, Patent Document 2). reference).
However, according to this proposal, the problem of the light source of the illuminating device becomes a problem of the entire illuminating device, so that it becomes impossible to handle the light source independently, and in order to prepare various layers for correction It was difficult to realize due to the problem of increased costs.

さらに被覆材である樹脂の上にインクジェット法等で色印刷という提案もあったが、外気に直接触れているため、比較的短時間で印刷層が変質してしまうという問題があった。   Furthermore, although there has been a proposal for color printing on a resin as a coating material by an ink jet method or the like, there is a problem that the printed layer is altered in a relatively short time because it is directly in contact with the outside air.

これらの問題を解決するため、ＬＥＤ素子であるＬＥＤチップを被膜する被膜部材をＬＥＤの色度によって異る染色液により着色し、該着色された層の働きで、ＬＥＤ出力光の色度を補正するという提案もある（例えば特許文献３参照）。
この提案によればＬＥＤの外形サイズが変わってしまうという問題、光源を独立して扱うことが出来なくなってしまう問題、外気の影響等の問題はなくなり効果があった。
ところが、染色直後の色度制御は可能であったが、リフロー、通電等により封止樹脂に熱がかかると退色が起こり、目的とする色度を維持することが出来ないという問題が生じてきた。例えば１００℃を越えるリフロー雰囲気にさらされたり、発光させるための通電で１００℃前後の温度環境に長く置かれることにより、封止樹脂に高温がかかり、そのためと思われる退色が観測されている。
すなわち初期的特性は満足できるが耐熱エージング性が良くないという問題が生じている。 In order to solve these problems, the coating member that coats the LED chip, which is an LED element, is colored with a staining solution that varies depending on the chromaticity of the LED, and the chromaticity of the LED output light is corrected by the action of the colored layer. There is also a proposal to do (see, for example, Patent Document 3).
According to this proposal, the problem that the external size of the LED changes, the problem that the light source cannot be handled independently, the problem such as the influence of outside air, and the like are eliminated.
However, although chromaticity control was possible immediately after dyeing, there was a problem that when the sealing resin was heated by reflow, energization, etc., fading occurred and the target chromaticity could not be maintained. . For example, the encapsulating resin is exposed to a reflow atmosphere exceeding 100 ° C. or placed in a temperature environment of around 100 ° C. for a long time by energization to emit light, and the discoloration considered to be caused by this is observed.
That is, there is a problem that the initial characteristics can be satisfied but the heat aging resistance is not good.

特開平１１−８７７８４JP-A-11-87784 特開２０００−１５６５２６JP 2000-156526 A 特開２００４−８８００３JP 2004-88003 A

解決しようとする課題は発光ダイオード及びその色度補正方法のエージング性改善である。   The problem to be solved is to improve the aging property of the light emitting diode and its chromaticity correction method.

本発明の発光ダイオードは、発光ダイオード素子と、該発光ダイオード素子を被膜する被膜部材とを有する発光ダイオードにおいて、該被膜部材が染色液により着色されており、該染色液中に樹脂成分が混在されていることを特徴とする。   The light-emitting diode of the present invention is a light-emitting diode having a light-emitting diode element and a coating member that coats the light-emitting diode element. The coating member is colored with a staining solution, and a resin component is mixed in the staining solution. It is characterized by.

また本発明の発光ダイオードは、前記被膜部材と前記染色液中に混在された樹脂とが同種の樹脂であることを特徴とする。   The light-emitting diode of the present invention is characterized in that the coating member and the resin mixed in the staining liquid are the same type of resin.

本発明の発光ダイオードの色度補正方法は、発光ダイオード素子と、該発光ダイオード素子を被膜する被膜部材とを有する発光ダイオードの色度調整方法において、該被膜部材を樹脂成分を混在させた染色液中で着色したことを特徴とする。   The method for correcting chromaticity of a light-emitting diode according to the present invention is a method for adjusting the chromaticity of a light-emitting diode having a light-emitting diode element and a coating member that coats the light-emitting diode element. It is characterized by being colored inside.

また本発明の発光ダイオードの色度補正方法は、前記被膜部材と前記染色液中に混在された樹脂とが同種の樹脂であることを特徴とする。   In the light-emitting diode chromaticity correction method of the present invention, the coating member and the resin mixed in the staining solution are the same type of resin.

本発明によれば、発光ダイオードの色度を目的とする値に補正し、その色度を保持することが出来る。また染色後に外表面を樹脂にてコーティングする方法と異なり、封止樹脂内に着色材を浸透させているため、外形サイズを従来と同じに保つことが可能である。また染色液中に混在された樹脂成分が従来の封止樹脂中で硬化して着色材を固定するため耐熱エージング性のある色度補正が可能となる。   According to the present invention, the chromaticity of the light emitting diode can be corrected to a target value and the chromaticity can be maintained. Further, unlike the method of coating the outer surface with a resin after dyeing, since the coloring material is infiltrated into the sealing resin, the outer size can be kept the same as the conventional size. Moreover, since the resin component mixed in the dyeing solution is cured in the conventional sealing resin and fixes the coloring material, chromaticity correction with heat aging resistance becomes possible.

発光ダイオード素子と、該発光ダイオード素子を被膜する被膜部材とを有する発光ダイオードにおいて、該被膜部材を樹脂成分を混在させた染色液中で着色した。また前記被膜部材と前記染色液中に混在された樹脂とを同種の樹脂とした。   In a light-emitting diode having a light-emitting diode element and a coating member that coats the light-emitting diode element, the coating member was colored in a dyeing solution in which resin components were mixed. Further, the coating member and the resin mixed in the dyeing liquid are the same kind of resin.

図１は本発明によるＬＥＤを説明する断面図で、図１（ａ）が染色前のＬＥＤ、図１（ｂ）が染色後のＬＥＤを示している。
図１（ａ）において、ＬＥＤ素子であるＬＥＤチップ１２は基板１４に設けられたカソード電極１６上にダイボンドされてＬＥＤチップ１２のカソードが電気的に接続されており、ＬＥＤチップ１２のアノードはワイヤ２４によってアノード電極１８にワイヤボンドされている。カソード電極１６及びアノード電極１８は、例えば基板１４のスルーホールにより、基板１４の下面に引き回されてＬＥＤ１０の接続用電極となっている。
２２はワイヤー２４およびＬＥＤチップ１２を被覆して保護する被覆部材である。該被覆部材２２はモールド樹脂中に蛍光体２０を混練して形成している。該モールド樹脂としてはエポキシ系の樹脂やシリコーンを用いることが出来、該蛍光体はＬＥＤ１０の所望の発光色にあわせて選択される。例えば白色光を出力する場合は青色光を発するＬＥＤチップをＹＡＧ系の蛍光体を混練した樹脂でモールドしている。 FIG. 1 is a cross-sectional view illustrating an LED according to the present invention. FIG. 1 (a) shows an LED before dyeing, and FIG. 1 (b) shows an LED after dyeing.
In FIG. 1A, an LED chip 12 which is an LED element is die-bonded on a cathode electrode 16 provided on a substrate 14, and the cathode of the LED chip 12 is electrically connected. The anode of the LED chip 12 is a wire. 24 is wire-bonded to the anode electrode 18. The cathode electrode 16 and the anode electrode 18 are routed to the lower surface of the substrate 14 by, for example, through holes in the substrate 14 to serve as connection electrodes for the LED 10.
Reference numeral 22 denotes a covering member that covers and protects the wire 24 and the LED chip 12. The covering member 22 is formed by kneading the phosphor 20 in a mold resin. As the mold resin, an epoxy resin or silicone can be used, and the phosphor is selected in accordance with a desired light emission color of the LED 10. For example, when white light is output, an LED chip that emits blue light is molded with a resin in which a YAG phosphor is kneaded.

図１（ａ）に示したＬＥＤから図１（ｂ）に示した本発明によるＬＥＤを得る工程を示したのが図２の工程である。
図２の工程１で図１（ａ）に示したＬＥＤ１０は、所望の色度範囲に入っており染色の必要のないもの、染色によって色度補正の必要なものに分類される。色度補正の必要なものは特許文献３の−００２５−以下に詳細に述べられているようにさらに色度によって細かく分類される。
次に図２の工程２で、該分類結果に従って染色液を選択する。染色液中の染料もしくは顔料は該分類結果によって選択されるが、例えば染料については特許文献３の−００２７−以下に詳細に述べられている。
染色液中は溶媒が主成分となっており、該溶媒としてはアルコール類ならばエタノール、メタノール、ＩＰＡ等が、ケトン類ならばアセトン、ＭＥＫ等を用い得る。 The process of obtaining the LED according to the present invention shown in FIG. 1B from the LED shown in FIG. 1A is shown in FIG.
The LEDs 10 shown in FIG. 1A in step 1 of FIG. 2 are classified into those that are in the desired chromaticity range and do not need to be dyed, and those that need chromaticity correction by dyeing. Items that require chromaticity correction are further classified according to chromaticity as described in detail in Patent Document 3 below.
Next, in step 2 of FIG. 2, a staining solution is selected according to the classification result. The dye or pigment in the dyeing liquid is selected according to the classification result. For example, the dye is described in detail in Patent Document 3 below -0027-.
In the dyeing solution, a solvent is a main component. As the solvent, ethanol, methanol, IPA or the like can be used for alcohols, and acetone, MEK or the like can be used for ketones.

本発明においては該染色液の中に、さらに未硬化状態の樹脂成分を混在させたことを特徴としている。染色液をこのように構成したことにより、封止樹脂である被覆部材２２に染色液が浸透する際、染料と共に樹脂も浸透する。
該染色液中に混在させる樹脂はモールド樹脂であるＬＥＤの被膜部材２２と同種の樹脂とすることが好ましい。例えば被膜部材２２がエポキシならばエポキシに、シリコーンならばシリコーンとすることが硬化した際の密着力を高める意味で好ましい。
また被膜部材２２がシリコンの場合は分子間の距離が大きくなるため、着色剤として顔料も用い得る。 The present invention is characterized in that an uncured resin component is further mixed in the dyeing solution. By configuring the staining liquid in this way, when the staining liquid permeates the covering member 22 that is a sealing resin, the resin also permeates with the dye.
The resin mixed in the dyeing liquid is preferably the same type of resin as the LED coating member 22 which is a mold resin. For example, if the coating member 22 is an epoxy, it is preferable to use an epoxy, and if it is a silicone, it is preferable to use a silicone in order to increase the adhesion when cured.
Further, when the coating member 22 is made of silicon, the distance between molecules becomes large, and therefore a pigment can also be used as a colorant.

次に図２の工程３で、選択した染色液でＬＥＤを染色する。
該染色は染色液中の溶媒によって封止樹脂を膨潤させ、封止樹脂の分子間に染色液を浸透させることによって行う。
次に図２の工程４で洗浄を行う。該洗浄は水もしくは染料を溶かさない有機溶媒にて行い、製品表面、端子等に付着した樹脂成分の除去および染色溶媒の置換を行う。この工程でＬＥＤの表面状態を染色前と同様にすることが出来る。
なお洗浄剤は、例えば染色材中の溶媒がケトンであった場合はアルコール類、染色材中の溶媒がアルコールであった場合は水とするように、前記染色材中の溶媒よりも洗浄力が１ランク下のなじみやすいものとすることが望ましい。
このように洗浄するので、染色による色度補正を行ったＬＥＤと、染色を行う必要の無かったＬＥＤとの表面状態をほぼ同一にすることが出来る。
次に図２の工程５で乾燥及びキュアーを行う。
この工程で染料もしくは顔料の着色剤と共に浸透した樹脂成分が従来の封止樹脂中で硬化し、着色剤を固定しつつ同種の樹脂である被膜部材２２と一体化している。 Next, in step 3 of FIG. 2, the LED is dyed with the selected dyeing solution.
The dyeing is performed by causing the sealing resin to swell with a solvent in the dyeing liquid and allowing the dyeing liquid to penetrate between the molecules of the sealing resin.
Next, cleaning is performed in step 4 of FIG. The washing is performed with an organic solvent that does not dissolve water or dye, and the resin component adhering to the product surface, terminals, etc. is removed and the dyeing solvent is replaced. In this step, the surface state of the LED can be made the same as before dyeing.
The cleaning agent is more detersive than the solvent in the dyeing agent, for example, alcohols when the solvent in the dyeing agent is ketone, and water when the solvent in the dyeing agent is alcohol. It is desirable to make it one level below.
Since cleaning is performed in this manner, the surface state of the LED that has been subjected to chromaticity correction by dyeing and that of the LED that did not need to be dyed can be made substantially the same.
Next, drying and curing are performed in step 5 of FIG.
In this step, the resin component that has penetrated together with the colorant of the dye or pigment is cured in the conventional sealing resin, and is integrated with the coating member 22 that is the same kind of resin while fixing the colorant.

図１（ｂ）に示したＬＥＤ１０は本発明によるＬＥＤの完成後の断面を示したもので、被覆部材２２の表面に近い一部が染色液により着色された着色層２６となっている。該着色層２６内では染色液中に混在されていた樹脂が着色剤を固定しつつ硬化している。
そのため耐熱エージング性の良いＬＥＤとすることが出来た。 The LED 10 shown in FIG. 1B shows a cross-section after completion of the LED according to the present invention, and a part close to the surface of the covering member 22 is a colored layer 26 colored with a staining solution. In the colored layer 26, the resin mixed in the dyeing solution is cured while fixing the colorant.
Therefore, it was possible to obtain an LED having good heat aging resistance.

ここで注目すべきは、従来は図２の工程１で色度補正が必要と分類されたＬＥＤは規格外品として良品扱いできなかった点である。
従来の手法によれば外形寸法が変わってしまったり、色度のエージング性が悪く使用が難しかったが、本発明によれば色度補正して良品と出来るＬＥＤ及びＬＥＤの色度補正方法が実現できた。 What should be noted here is that conventionally, LEDs classified as needing chromaticity correction in step 1 of FIG. 2 could not be treated as non-standard products.
According to the conventional method, the outer dimensions have changed or the aging of chromaticity is poor and difficult to use. However, according to the present invention, an LED and a chromaticity correction method for LED that can be made good by correcting the chromaticity are realized. did it.

なお本発明で用いた手法は樹脂封止タイプのすべてのＬＥＤに応用可能である。
また、本明細書ではＬＥＤを完成後色度を測定する方法を述べたが、例えばＬＥＤチップ製造段階で発光色度の変動が測定された場合は、あらかじめ補正用の染色液を用意することも可能になる。
さらに、染色液中の樹脂成分に、公知の、紫外線除去特性を持った樹脂を混在させることも可能で、そのようにすれば耐熱性に加え耐光性も向上させることが出来る。
さらにまた、染色後に荒れた封止樹脂表面のコーティングをしたり、該コーティング材を紫外線除去特性を持った材料とすることも効果がある。 The method used in the present invention is applicable to all resin-sealed type LEDs.
In this specification, the method of measuring the chromaticity after completion of the LED has been described. However, for example, when a variation in luminescent chromaticity is measured in the LED chip manufacturing stage, a correction dyeing solution may be prepared in advance. It becomes possible.
Furthermore, it is possible to mix a resin having a UV-removing characteristic with the resin component in the dyeing solution. In this way, light resistance can be improved in addition to heat resistance.
Furthermore, it is also effective to coat the rough sealing resin surface after dyeing, or to use the coating material as a material having an ultraviolet removing property.

本発明によるＬＥＤを説明する断面図である。It is sectional drawing explaining LED by this invention. 本発明によるＬＥＤを得る工程を示した図である。It is the figure which showed the process of obtaining LED by this invention.

符号の説明Explanation of symbols

１２ 発光ダイオード素子
２２ 被膜部材
１０ 発光ダイオード
12 Light-Emitting Diode Element 22 Film Member 10 Light-Emitting Diode

Claims (4)

発光ダイオード素子と、該発光ダイオード素子を被膜する被膜部材とを有する発光ダイオードにおいて、
該被膜部材が染色液により着色されており、
該染色液中に樹脂成分が混在されていることを特徴とする発光ダイオード。 In a light emitting diode having a light emitting diode element and a coating member that coats the light emitting diode element,
The coated member is colored with a staining solution;
A light-emitting diode characterized in that a resin component is mixed in the dyeing solution. 前記被膜部材と前記染色液中に混在された樹脂とは同種の樹脂であることを特徴とする請求項１記載の発光ダイオード。   2. The light emitting diode according to claim 1, wherein the coating member and the resin mixed in the staining liquid are the same kind of resin. 発光ダイオード素子と、該発光ダイオード素子を被膜する被膜部材とを有する発光ダイオードの色度調整方法において、
該被膜部材を樹脂成分を混在させた染色液中で着色したことを特徴とする発光ダイオードの色度補正方法。 In a method for adjusting chromaticity of a light emitting diode having a light emitting diode element and a coating member that coats the light emitting diode element,
A method for correcting chromaticity of a light emitting diode, characterized in that the coating member is colored in a staining solution in which a resin component is mixed. 前記被膜部材と前記染色液中に混在された樹脂とは同種の樹脂であることを特徴とする請求項３記載の発光ダイオードの色度補正方法。
4. The light emitting diode chromaticity correction method according to claim 3, wherein the coating member and the resin mixed in the staining liquid are the same kind of resin.
JP2005321464A 2005-11-04 2005-11-04 Light emitting diode and method for correcting chromaticity of light emitting diode. Expired - Fee Related JP4906316B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223749A (en) * 1999-01-29 2000-08-11 Seiwa Electric Mfg Co Ltd Light emitting diode lamp and its manufacture chip type light emitting diode element, and dot matrix type light emitting diode unit
JP2004088003A (en) * 2002-08-29 2004-03-18 Citizen Electronics Co Ltd Light-emitting diode and manufacturing method thereof
JP2004253745A (en) * 2003-02-24 2004-09-09 Citizen Electronics Co Ltd Method of producing pastel led
JP2005019663A (en) * 2003-06-26 2005-01-20 Nichia Chem Ind Ltd Light emitting device and its fabricating process
WO2005104247A1 (en) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. Method for fabricating led illumination light source and led illumination light source

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223749A (en) * 1999-01-29 2000-08-11 Seiwa Electric Mfg Co Ltd Light emitting diode lamp and its manufacture chip type light emitting diode element, and dot matrix type light emitting diode unit
JP2004088003A (en) * 2002-08-29 2004-03-18 Citizen Electronics Co Ltd Light-emitting diode and manufacturing method thereof
JP2004253745A (en) * 2003-02-24 2004-09-09 Citizen Electronics Co Ltd Method of producing pastel led
JP2005019663A (en) * 2003-06-26 2005-01-20 Nichia Chem Ind Ltd Light emitting device and its fabricating process
WO2005104247A1 (en) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. Method for fabricating led illumination light source and led illumination light source

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