JP2007128864A - Fluid composition, and electrode, wiring pattern, as well as coating film formed by using it, and decoration goods forming the coating film - Google Patents

Fluid composition, and electrode, wiring pattern, as well as coating film formed by using it, and decoration goods forming the coating film Download PDF

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JP2007128864A
JP2007128864A JP2006248944A JP2006248944A JP2007128864A JP 2007128864 A JP2007128864 A JP 2007128864A JP 2006248944 A JP2006248944 A JP 2006248944A JP 2006248944 A JP2006248944 A JP 2006248944A JP 2007128864 A JP2007128864 A JP 2007128864A
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group
crosslinking agent
fluid composition
compound
metal particles
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JP4886444B2 (en
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Masanori Tomonari
雅則 友成
Hitomi Sadohara
一十三 佐渡原
Koji Goto
晃司 後藤
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Ishihara Sangyo Kaisha Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluid composition for obtaining a rigid coating film with excellent adhesion with a base material even by drying and heating at comparatively low temperature. <P>SOLUTION: The fluid composition contains at least crosslinking agent and solvent, and sulfuric compound having at least a kind of hydrophilic group selected from a carboxyl group, hydroxyl group, amino group, hydrazide group, and amide group, nitrogen compound, or phosphorus compound are chemically bonded on the surface of metal particles. As the crosslinking agent, an oxazoline system crosslinking agent, carbodiimide system crosslinking agent, blocked isocyanate system crosslinking agent, epoxy system crosslinking agent, and melamine system crosslinking agent are mixed. The fluid composition is suited for forming a fine electrode, a circuit wiring pattern or for forming a mirror-face coating film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、金属粒子を配合した流動性組成物、及びその流動性組成物を用いて形成した電極、配線パターン、塗膜並びにその塗膜を形成した装飾物品に関する。   The present invention relates to a fluid composition containing metal particles, an electrode formed using the fluid composition, a wiring pattern, a coating film, and a decorative article on which the coating film is formed.

金属粒子を配合した流動性組成物は、金属粒子を溶媒に分散し、必要に応じてバインダーや分散剤、粘度調整剤などの添加剤を更に配合した、一般にコーティング剤、塗料、ペースト、インキ、インクなどの組成物を含む総称であり、その金属粒子の性質を活用して、例えば電気的導通を確保するため、あるいは帯電防止、電磁波遮蔽または金属光沢を付与するためなどの種々の用途に用いられている。しかも、近年になって、配合する金属粒子として、平均粒子径が1〜100nm程度の金属コロイド粒子が用いられるようになり、その用途は多方面に拡大している。具体的には、金属コロイド粒子の高い導電性を活用して、ブラウン管、液晶ディスプレイ等の透明性部材の電磁波遮蔽に適用されている。また、ナノマテリアルである金属コロイド粒子を用いて、微細な電極、回路配線パターンを形成する技術が提案されている。これは、金属コロイド粒子を配合した流動性組成物を、スクリーン印刷、インクジェット印刷等の手法で基板上に電極や回路配線のパターンを塗布した後、比較的低温で加熱して金属コロイド粒子を融着させるもので、特に、プリント配線基板の製造に応用されつつある。更に、金属コロイド粒子は穏やかな加熱条件下においても容易に粒子の融着が進行し金属光沢が発現するため、簡便な鏡面の作製技術が、意匠・装飾用途において注目されている。   A fluid composition containing metal particles is generally dispersed in a solvent, and further added with additives such as binders, dispersants, viscosity modifiers, etc., generally coating agents, paints, pastes, inks, It is a generic term that includes compositions such as ink, and is used for various purposes such as securing electrical continuity, or providing antistatic properties, electromagnetic wave shielding, or metallic luster by utilizing the properties of the metal particles. It has been. Moreover, in recent years, as colloidal metal particles, metal colloidal particles having an average particle diameter of about 1 to 100 nm have been used, and their uses are expanding in various fields. Specifically, it is applied to electromagnetic wave shielding of transparent members such as cathode ray tubes and liquid crystal displays by utilizing the high conductivity of metal colloid particles. In addition, a technique for forming fine electrodes and circuit wiring patterns using metal colloidal particles, which are nanomaterials, has been proposed. This is because a flowable composition containing metal colloid particles is applied with a pattern of electrodes and circuit wiring on a substrate by a method such as screen printing or ink jet printing, and then heated at a relatively low temperature to melt the metal colloid particles. In particular, it is being applied to the production of printed wiring boards. Furthermore, since metal colloidal particles are easily fused even under mild heating conditions to develop a metallic luster, a simple mirror surface preparation technique is attracting attention in design and decoration applications.

このような流動性組成物として例えば、クエン酸ナトリウム、クエン酸カリウムなどの有機成分を分散安定化剤として金属コロイド粒子に含ませ、ブロックドイソシアネート等のポリウレタン樹脂、メラミン樹脂等を造膜助剤として用いた導電性インクが知られている(特許文献1参照)。   As such a fluid composition, for example, an organic component such as sodium citrate or potassium citrate is included in the metal colloid particles as a dispersion stabilizer, and a polyurethane resin such as blocked isocyanate, a melamine resin or the like is used as a film-forming aid. There is known a conductive ink used as (see Patent Document 1).

特開2001−325831号公報JP 2001-325831 A

特許文献1に記載の導電性インクを基材に塗布し、150℃程度の比較的低温での加熱によって得られる塗膜は、基材との密着性が低く、塗膜強度が脆弱であるため、クラック等の表面欠陥や剥離等の欠損が生じ易く、商品価値を損ねるばかりでなく、導電性等の特性が低下するという問題がある。具体的には、回路配線や電極を形成しても断線や電気的導通の低下等の障害が生じたり、形成した塗膜の帯電防止性、電磁波遮蔽性の低下が生じる。また、塗膜を乾燥する間に金属粒子が凝集して、塗膜の平滑性が低下し易く、金属光沢の低下や白濁が生じるという問題もある。   A coating film obtained by applying the conductive ink described in Patent Document 1 to a substrate and heating at a relatively low temperature of about 150 ° C. has low adhesion to the substrate, and the coating film strength is fragile. In addition, surface defects such as cracks and defects such as peeling are likely to occur, which not only impairs commercial value but also deteriorates properties such as conductivity. Specifically, even if circuit wiring or electrodes are formed, troubles such as disconnection or reduction in electrical continuity occur, and the antistatic property and electromagnetic wave shielding property of the formed coating film deteriorate. In addition, the metal particles aggregate while the coating film is dried, so that the smoothness of the coating film tends to be lowered, and there is a problem that the metallic luster is reduced and white turbidity is generated.

本発明者らは、上記の問題を解決すべく鋭意研究を重ねた結果、特許文献1に記載のクエン酸ナトリウム、クエン酸カリウムなどよりも強固に化学結合する特定の化合物を金属粒子の表面に存在させ、しかも、その化合物の末端等には親水性基を持たせること、そして、オキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤などを配合して流動性組成物を調製すると、150℃程度の比較的低温での加熱によっても塗膜の密着性が改良され、しかも塗膜の平滑性にも優れ、金属光沢等の仕上り外観も向上することを見出し、本発明を完成した。更に、上記の知見を詳細に検討した結果、使用する架橋剤に存在する活性基が、金属粒子の表面に化学結合した化合物に存在する親水性基と反応するとより一層密着性等が改良されることを見出し、本発明を完成した。   As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a specific compound that chemically bonds more strongly than the sodium citrate, potassium citrate and the like described in Patent Document 1 on the surface of the metal particles. Further, when a fluid composition is prepared by adding a hydrophilic group to the end of the compound, and blending an oxazoline crosslinking agent, a carbodiimide crosslinking agent, a blocked isocyanate crosslinking agent, etc. The present inventors have found that the adhesion of the coating film is improved by heating at a relatively low temperature of about 150 ° C., the coating film has excellent smoothness, and the finished appearance such as metallic luster is improved. Furthermore, as a result of examining the above findings in detail, when the active group present in the crosslinking agent used reacts with the hydrophilic group present in the compound chemically bonded to the surface of the metal particles, the adhesion and the like are further improved. As a result, the present invention has been completed.

即ち、本発明は、(1)金属粒子、架橋剤及び溶媒を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素と親水性基とを有する化合物が前記の元素を介して化学結合しており、架橋剤が前記化合物の親水性基と反応し得る活性基を有するものであることを特徴とする流動性組成物であり、また、(2)金属粒子、架橋剤及び溶媒を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素とカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基から選ばれる少なくとも1種の親水性基とを有する化合物が前記の元素を介して化学結合しており、架橋剤がオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤から選ばれる少なくとも1種であることを特徴とする流動性組成物であり、(3)前記の(1)、(2)の流動性組成物を用いて形成されることを特徴とする電極、配線パターンまたは塗膜であり、(4)前記の(3)の塗膜を形成したことを特徴とする装飾物品である。   That is, the present invention includes (1) a compound having at least one metal particle, a crosslinking agent, and a solvent, and having at least one element selected from sulfur, nitrogen, and phosphorus and a hydrophilic group on the surface of the metal particle. It is a fluid composition characterized in that it is chemically bonded via an element and the crosslinking agent has an active group capable of reacting with the hydrophilic group of the compound, and (2) metal particles, It contains at least a crosslinking agent and a solvent, and at least one hydrophilic property selected from a carboxyl group, a hydroxyl group, an amino group, a hydrazide group, and an amide group on the surface of the metal particles and at least one element selected from sulfur, nitrogen, and phosphorus. And a compound having a group are chemically bonded through the above-mentioned elements, and the crosslinking agent is an oxazoline-based crosslinking agent, a carbodiimide-based crosslinking agent, a blocked isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, It is a fluid composition characterized in that it is at least one selected from laminar crosslinking agents, and (3) is formed using the fluid composition of (1) and (2) above. (4) A decorative article characterized in that the coating film of (3) is formed.

本発明の流動性組成物は従来のものに比べて、乾燥や比較的低温での加熱によっても基材との密着性に優れた強固な塗膜が得られ、しかも平滑性に優れた、金属光沢による鏡面状の表面を有する塗膜が得られる。このため、塗膜表面の欠陥や塗膜の脱落、欠損などによる不良品が生じ難く、電気的導通を確保する材料、あるいは帯電防止、電磁波遮蔽または金属光沢を付与する材料などに信頼性良く用いられるほか、特に、塗膜の導電性を活用したプリント配線基板等の微細電極及び回路配線パターンの形成、塗膜の鏡面を活用した意匠・装飾用途に用いられる。   The fluid composition of the present invention is a metal film that is superior to conventional ones in that a strong coating film having excellent adhesion to a substrate can be obtained by drying or heating at a relatively low temperature, and also having excellent smoothness. A coating film having a specular surface due to gloss is obtained. For this reason, defective products due to coating surface defects, coating film dropouts, and defects are unlikely to occur, and can be used reliably for materials that ensure electrical continuity, or materials that provide antistatic, electromagnetic shielding, or metallic luster. In particular, it is used for the formation of fine electrodes such as printed circuit boards and circuit wiring patterns utilizing the conductivity of the coating film, and for design and decoration applications utilizing the mirror surface of the coating film.

本発明は、金属粒子、架橋剤及び溶媒を少なくとも含む流動性組成物であって、(1)金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素と親水性基とを有する化合物(以下、親水性化合物と記載する場合がある。)が前記の元素を介して化学結合しており、(2)架橋剤が前記化合物の親水性基と反応し得る活性基を有するものであることが重要である。前記の親水性化合物は、硫黄、窒素またはリンの元素を介して金属粒子と強い化学結合を形成するとともに、親水性基は金属粒子の外面に配向することで、金属粒子に優れた親水性を付与すると同時に、粒子の凝集を抑制する効果が高いと考えられる。一方、架橋剤が有する活性基は、外部に配向した親水性基、及び基材表面の水酸基等の活性水素と加熱条件下において反応し、金属粒子の融着により形成された金属膜と基材間を架橋すると考えられる。そのため本発明の流動性組成物から形成された金属膜は基材との密着性も高くなるものと推測される。また、金属粒子の表面に強く結合している親水性化合物は、その親水性化合物からの電子供与により金属表面の電子欠損を緩和すると同時に、立体反発により粒子間距離を一定に保つため、本発明の流動性組成物においては金属粒子の分散安定性が低下することはほとんどない。   The present invention is a fluid composition containing at least metal particles, a crosslinking agent and a solvent, and (1) at least one element selected from sulfur, nitrogen and phosphorus and a hydrophilic group on the surface of the metal particles. A compound having an active group capable of reacting with the hydrophilic group of the compound, wherein the compound has a chemical bond through the element (2) It is important that The hydrophilic compound forms a strong chemical bond with the metal particle through the element of sulfur, nitrogen or phosphorus, and the hydrophilic group is oriented on the outer surface of the metal particle, thereby making the metal particle excellent in hydrophilicity. At the same time, it is considered that the effect of suppressing the aggregation of particles is high. On the other hand, the active group possessed by the cross-linking agent reacts with an externally oriented hydrophilic group and active hydrogen such as a hydroxyl group on the substrate surface under heating conditions, and a metal film and substrate formed by fusion of metal particles It is thought that it bridges the gap. Therefore, it is estimated that the metal film formed from the fluid composition of the present invention also has high adhesion to the substrate. In addition, the hydrophilic compound strongly bonded to the surface of the metal particles relaxes the electron deficiency on the metal surface by electron donation from the hydrophilic compound, and at the same time, keeps the distance between particles constant by steric repulsion. In this fluid composition, the dispersion stability of the metal particles is hardly lowered.

本発明の流動性組成物は、一般にコーティング剤、塗料、ペースト、インキ、インクなどと称される組成物を包含し、流動性組成物における金属粒子、親水性化合物、架橋剤の配合量は、それぞれの用途に応じて適宜設定できる。金属粒子は、例えば、導電性が安定した電極、回路配線パターンを得るには、一回の塗工で膜厚の厚い塗布物を形成するのが望ましいので、電極材料用途において金属粒子はより高濃度で配合されるのが好ましく、その配合量は流動性組成物全重量に対して5重量%以上であれば良く、10重量%以上であればより好ましく、15重量%以上であれば更に好ましい。電極材料用途における金属粒子の配合量の上限値は、90重量%程度が可能であり、85重量%が好ましく、80重量%がより好ましい。一方装飾用途においてはコストの面から、より低濃度の金属粒子を用いて鏡面を呈する塗膜が得られることが望ましく、その配合量は50重量%以下であれば良く、20重量%以下であればより好ましく、15重量%以下であれば更に好ましい。塗装用途における金属粒子の配合量の下限値は、0.1重量%程度が可能であり、0.5重量%が好ましく、1重量%がより好ましい。親水性化合物は、金属粒子1000重量部に対し、0.01〜200重量部程度の範囲で存在していれば、所望の効果が得られるので好ましく、更に好ましい範囲は0.5〜100重量部程度である。架橋剤は、金属粒子100重量部に対し0.01〜10重量部の範囲であれば所望の効果が得られるので好ましく、この範囲より少なすぎると本発明の効果が得られ難いため好ましくなく、多すぎると硬化が進み過ぎ、塗料粘度が高くなり塗装性が阻害されるので好ましくない。より好ましい範囲は、0.01〜8重量部程度であり、0.01〜5重量部程度であれば更に好ましい。   The fluid composition of the present invention includes a composition generally referred to as a coating agent, paint, paste, ink, ink, etc., and the compounding amount of metal particles, hydrophilic compound, and crosslinking agent in the fluid composition is as follows. It can set suitably according to each use. For example, in order to obtain electrodes and circuit wiring patterns with stable conductivity, it is desirable to form a thick coating with a single coating. It is preferably blended at a concentration, and the blending amount may be 5% by weight or more with respect to the total weight of the fluid composition, more preferably 10% by weight or more, and even more preferably 15% by weight or more. . The upper limit of the amount of metal particles in the electrode material application can be about 90% by weight, preferably 85% by weight, and more preferably 80% by weight. On the other hand, in decorative applications, it is desirable that a coating film having a mirror surface is obtained by using metal particles having a lower concentration from the viewpoint of cost. The blending amount may be 50% by weight or less, and 20% by weight or less. More preferred is 15% by weight or less. The lower limit of the amount of metal particles in the coating application can be about 0.1% by weight, preferably 0.5% by weight, and more preferably 1% by weight. If the hydrophilic compound is present in a range of about 0.01 to 200 parts by weight with respect to 1000 parts by weight of the metal particles, the desired effect can be obtained, and a more preferable range is 0.5 to 100 parts by weight. Degree. Since the desired effect is obtained if the crosslinking agent is in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the metal particles, it is not preferred because the effect of the present invention is difficult to obtain if it is too small, If the amount is too large, curing is excessively advanced, and the viscosity of the paint is increased, so that the paintability is inhibited. A more preferable range is about 0.01 to 8 parts by weight, and further preferably about 0.01 to 5 parts by weight.

本発明の流動性組成物は、所定量の金属粒子、親水性化合物、架橋剤、溶媒とを公知の方法により混合して、親水性化合物を金属粒子の表面に化学結合させるとともに、金属粒子を溶媒に分散させる。また、別のより好ましい方法として、後述するように親水性化合物を化学結合した金属粒子の粉末やその金属粒子を溶媒に分散した分散液を予め製造した後で、架橋剤、溶媒と混合すると、より均一な分散状態とすることができる。混合方法としては、例えば、ディスパー等の撹拌機を用いた撹拌混合、サンドミル、コロイドミル等の湿式粉砕混合などの方法を用いることができる。混合の際に、必要に応じて、後述する水性バインダー等のその他の成分を添加し混合することもできる。架橋剤は他の成分と同様に予め混合して流動性組成物を調製しても良いが、架橋反応が急激に進む場合などは金属粒子の溶媒分散液と架橋剤の溶液との二液性組成物として、塗布前にそれらを混合して用いることもできる。   In the fluid composition of the present invention, a predetermined amount of metal particles, a hydrophilic compound, a crosslinking agent, and a solvent are mixed by a known method to chemically bond the hydrophilic compound to the surface of the metal particles, Disperse in solvent. Further, as another more preferable method, after preparing a powder of metal particles chemically bonded with a hydrophilic compound and a dispersion in which the metal particles are dispersed in a solvent as described later, when mixed with a crosslinking agent and a solvent, A more uniform dispersion state can be obtained. As a mixing method, for example, a method such as agitation and mixing using a stirrer such as a disper or a wet pulverization and mixing such as a sand mill or a colloid mill can be used. During mixing, other components such as an aqueous binder described later can be added and mixed as necessary. The cross-linking agent may be mixed in advance in the same manner as the other components to prepare a fluid composition. However, when the cross-linking reaction proceeds rapidly, the two-part property of the metal particle solvent dispersion and the cross-linking agent solution is used. As a composition, they can be mixed before use.

次に、本発明の流動性組成物に配合する各成分について説明する。
(1)金属粒子
本発明で用いる金属粒子は、その構成成分、粒子径等には特に制限はなく、用途に応じて適宜選択することができる。構成成分としては、1種の金属であっても、合金にしたり積層するなど2種以上の金属で構成されても良い。その金属成分としては周期表VIII族(鉄、コバルト、ニッケル、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金)及びIB族(銅、銀、金)からなる群より選ばれる少なくとも1種であれば、導電性が高いので好ましく、中でも銀、金、白金、パラジウム、銅は特に導電性が高くより好ましく、電極、回路配線パターン形成用の流動性組成物に用いるには、導電性とコストのバランスから銀または銅が特に好ましい。また、金属粒子には、製法上不可避の酸素、異種金属等の不純物を含有していても良く、あるいは、金属粒子の急激な酸化防止のために必要に応じて予め酸素、金属酸化物や有機化合物などが含まれていても良い。金属粒子の粒子径は、入手し易いことから1nm〜10μm程度の平均粒子径を有する金属粒子を適宜用いるのが好ましく、1nm〜1μm程度の平均粒子径の金属粒子がより好ましく、多方面の用途に用いることができることから1〜100nm程度の平均粒子径を有する金属コロイド粒子が更に好ましく、より微細な電極、回路配線パターンを得るためには、5〜50nmの範囲の平均粒子径を有する金属コロイド粒子を用いるのが更に好ましい。本発明では1種の金属粒子を用いても良いし、2種以上の金属粒子を混合して用いても良く、例えば平均粒子径が異なる2種以上の金属粒子、構成成分が異なる2種以上の金属粒子を混合して用いても良い。
Next, each component mix | blended with the fluid composition of this invention is demonstrated.
(1) Metal particles The metal particles used in the present invention are not particularly limited in terms of their constituent components, particle diameter, etc., and can be appropriately selected according to the intended use. The constituent component may be one kind of metal or may be composed of two or more kinds of metals such as an alloy or a laminate. If the metal component is at least one selected from the group consisting of group VIII (iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium, platinum) and group IB (copper, silver, gold) as the metal component In particular, silver, gold, platinum, palladium, and copper are more preferable because of their high conductivity. Among them, the balance between conductivity and cost is desirable for use in a fluid composition for forming electrodes and circuit wiring patterns. Particularly preferred is silver or copper. In addition, the metal particles may contain impurities such as oxygen and foreign metals that are unavoidable in the manufacturing method, or in advance, oxygen, metal oxides, and organics may be used in advance to prevent rapid oxidation of the metal particles. A compound etc. may be contained. Since the particle size of the metal particles is easily available, it is preferable to appropriately use metal particles having an average particle size of about 1 nm to 10 μm, more preferably metal particles having an average particle size of about 1 nm to 1 μm, and various uses. Metal colloid particles having an average particle diameter of about 1 to 100 nm are more preferable, and in order to obtain finer electrodes and circuit wiring patterns, metal colloids having an average particle diameter in the range of 5 to 50 nm. More preferably, particles are used. In the present invention, one kind of metal particles may be used, or two or more kinds of metal particles may be mixed and used. For example, two or more kinds of metal particles having different average particle diameters, two or more kinds having different constituent components. These metal particles may be mixed and used.

金属粒子は、公知の方法を用いて製造することができ、例えば、(1)金属を真空中で蒸発させて、気相中から金属粒子を凝結させる方法、(2)金属化合物溶液に還元剤を添加して、液相中から金属粒子を析出させる方法などを用いることができ、(2)の方法では廉価に金属コロイド粒子が得られるため、より好ましい方法である。(2)の方法において、金属粒子を製造するための原料である金属化合物は、例えば、前記金属の塩化物、硫酸塩、硝酸塩、炭酸塩等を用いることができる。金属化合物を溶解する媒液には、水またはアルコール等の有機溶媒、あるいはこれら2種以上の混合溶媒を用いることができる。金属化合物の媒液中の濃度は、金属化合物が溶解する範囲であれば特に制約はないが、工業的には5ミリモル/リットル以上とすることが好ましい。金属化合物が水に難溶のものであれば、金属成分と可溶性の錯体を形成する塩素イオンやアンモニア等を含む化合物を加えて用いることもできる。   The metal particles can be produced using a known method. For example, (1) a method in which a metal is evaporated in a vacuum to condense the metal particles from a gas phase, and (2) a reducing agent is added to the metal compound solution. Can be used to precipitate metal particles from the liquid phase, and the method (2) is more preferable because metal colloidal particles can be obtained at low cost. In the method (2), as the metal compound that is a raw material for producing metal particles, for example, the metal chloride, sulfate, nitrate, carbonate and the like can be used. An organic solvent such as water or alcohol, or a mixed solvent of two or more of these can be used for the medium for dissolving the metal compound. The concentration of the metal compound in the liquid medium is not particularly limited as long as the metal compound can be dissolved, but is preferably 5 mmol / liter or more industrially. If the metal compound is hardly soluble in water, a compound containing chlorine ions, ammonia, or the like that forms a soluble complex with the metal component can be added and used.

液相での反応に用いる還元剤としては公知のものを用いることができ、例えば、(1)ヒドラジンまたはその水和物、(2)ヒドラジン系化合物(例えば、塩酸ヒドラジン、硫酸ヒドラジン等)、(3)アルデヒド類((a)脂肪族アルデヒド類(例えば、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ブチルアルデヒド、イソブチルアルデヒド等)、(b)芳香族アルデヒド類(例えば、ベンズアルデヒド等)、(c)複素環式アルデヒド類等)、(4)アミン類((a)1級アミン類(例えば、ブチルアミン、エチルアミン、プロピルアミン、エチレンジアミン等)、(b)2級アミン類(例えば、ジブチルアミン、ジエチルアミン、ジプロピルアミン等)、(c)3級アミン類(例えば、トリブチルアミン、トリエチルアミン、トリプロピルアミン等)等)、(5)アミノアルデヒド類(例えば、アミノアセトアルデヒド等)、(6)アルカノールアミン類(例えば、エタノールアミン、ジエタノールアミン、トリエタノールアミン等)、(7)還元糖(例えば、ショ糖、トレパース、マルトース、ラクトース等)、(8)水素化合物(例えば、水素化ホウ素ナトリウム等)、(9)低次無機酸素酸(例えば、亜硫酸、亜硝酸、次亜硝酸、亜リン酸、次亜リン酸等)及びその水化物(例えば、亜硫酸水素)またはそれらの塩(例えば、ナトリウム等のアルカリ金属塩)等が挙げられ、これらを1種または2種以上を用いても良い。還元反応は任意の温度で行うことができ、水性媒液中で行う場合には、5〜90℃の範囲の温度であれば、反応が進み易いので好ましい。還元剤の添加量は金属に還元できる範囲であれば適宜設定することができ、金属化合物1モルに対して、0.2〜50モルであることが好ましい。添加量が0.2モル未満では還元反応が十分に進行し難いため好ましくなく、50モルを超えると生成した金属粒子の分散が不安定になり易いため好ましくない。   As the reducing agent used in the reaction in the liquid phase, a known reducing agent can be used. For example, (1) hydrazine or a hydrate thereof, (2) hydrazine compounds (for example, hydrazine hydrochloride, hydrazine sulfate, etc.), ( 3) Aldehydes ((a) aliphatic aldehydes (eg, formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, isobutyraldehyde, etc.), (b) aromatic aldehydes (eg, benzaldehyde, etc.), (c) heterocyclic Aldehydes), (4) amines ((a) primary amines (eg, butylamine, ethylamine, propylamine, ethylenediamine), (b) secondary amines (eg, dibutylamine, diethylamine, dipropylamine) Etc.), (c) tertiary amines (for example, tributylamine, triethyl) Amine, tripropylamine, etc.), (5) aminoaldehydes (eg, aminoacetaldehyde, etc.), (6) alkanolamines (eg, ethanolamine, diethanolamine, triethanolamine, etc.), (7) reducing sugar ( (E.g., sucrose, treperth, maltose, lactose, etc.), (8) hydrogen compounds (e.g., sodium borohydride, etc.), (9) low-order inorganic oxygen acids (e.g., sulfurous acid, nitrous acid, hyponitrous acid, phosphorous) Acid, hypophosphorous acid, etc.) and hydrates thereof (for example, hydrogen sulfite) or salts thereof (for example, alkali metal salts such as sodium), etc., and these may be used alone or in combination. . The reduction reaction can be carried out at any temperature, and when carried out in an aqueous medium, a temperature in the range of 5 to 90 ° C. is preferred because the reaction can proceed easily. The addition amount of the reducing agent can be appropriately set as long as it can be reduced to a metal, and is preferably 0.2 to 50 mol with respect to 1 mol of the metal compound. If the addition amount is less than 0.2 mol, it is not preferable because the reduction reaction is unlikely to proceed sufficiently.

金属化合物と還元剤の混合液のpHを8〜14の範囲に調整すると、金属化合物が媒液中に均一に分散し、還元反応が生じ易いので好ましい。更に好ましいpHの範囲は8〜13であり、8〜12であれば一層好ましい。具体的には、例えば、金属化合物を含む媒液のpHを調整した後、金属化合物を還元しても良く、あるいは、還元剤を混合した後、pHを調整しても良い。pH調整には、例えば、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等のアルカリ金属またはアルカリ土類金属の水酸化物や炭酸塩、アンモニア等のアンモニウム化合物、アミン類等の塩基性化合物を用いることができる。このようにして得られた金属粒子は、媒液のpHを5以下にすると容易に凝集するので、吸引ろ過、沈降分離等の比較的簡単な操作でろ別できる。より好ましいpHの範囲は0〜5である。ろ別した金属コロイド粒子は常法により洗浄することができ、可溶性塩類や残存する還元剤を十分に除去できる。pH調整には、例えば、塩酸、硫酸、硝酸等の無機酸、ギ酸、酢酸、プロピオン酸等の有機酸等の酸性化合物を用いることができる。   It is preferable to adjust the pH of the mixed solution of the metal compound and the reducing agent to a range of 8 to 14 because the metal compound is uniformly dispersed in the medium and a reduction reaction is likely to occur. A more preferable pH range is 8 to 13, and 8 to 12 is more preferable. Specifically, for example, after adjusting the pH of the liquid medium containing the metal compound, the metal compound may be reduced, or after mixing the reducing agent, the pH may be adjusted. For pH adjustment, for example, a basic compound such as an alkali metal or alkaline earth metal hydroxide or carbonate such as sodium hydroxide, potassium hydroxide or calcium hydroxide, an ammonium compound such as ammonia, or an amine is used. be able to. Since the metal particles obtained in this way easily aggregate when the pH of the liquid medium is 5 or less, they can be separated by a relatively simple operation such as suction filtration or sedimentation separation. A more preferable pH range is 0-5. The colloidal metal colloid particles can be washed by a conventional method, and soluble salts and remaining reducing agent can be sufficiently removed. For pH adjustment, for example, an inorganic compound such as hydrochloric acid, sulfuric acid or nitric acid, or an acidic compound such as organic acid such as formic acid, acetic acid or propionic acid can be used.

(2)親水性化合物
前記の金属粒子の表面に化学結合させる親水性化合物は、親水性基を有する化合物であって、しかも、硫黄、窒素、リンから選ばれる少なくとも1種の元素を含む化合物である。硫黄、窒素、リンのそれぞれの元素は金属粒子の表面に配位し化学結合するため、硫黄、窒素、リンの元素を含む親水性化合物は、これらの元素を介して金属粒子の表面に配位する。これらの元素の中でも硫黄が金属粒子との化学結合力が強いので好ましい。硫黄、窒素、リンの元素は親水性基とは別の官能基に含まれていても良く、親水性化合物が親水性基を2個以上有していれば、親水性基に含まれていても良い。ただし、本発明においては、金属粒子表面に存在する全ての親水性化合物が金属粒子と化学結合している必要は必ずしもなく、少なくとも一部が化学結合していれば本発明の効果が得られ、残部が粒子表面に吸着または沈着した状態にあっても良い。親水性基は、水と親和性を有する官能基を意味し、架橋剤が有する活性基と反応し得るものが好ましく、少なくとも1個の親水性基が存在した化合物を用いる。親水性基としては、例えば、カルボキシル基(−COOH)、水酸基(−OH)、アミノ基(−NH)、ヒドラジド基(−NH−NH)、アミド基(−CONH−)等が挙げられ、親水性化合物にはこれらが1種または2種以上含まれているのが好ましい。
(2) Hydrophilic compound The hydrophilic compound to be chemically bonded to the surface of the metal particles is a compound having a hydrophilic group and a compound containing at least one element selected from sulfur, nitrogen, and phosphorus. is there. Since each element of sulfur, nitrogen, and phosphorus is coordinated and chemically bonded to the surface of the metal particle, hydrophilic compounds containing the elements of sulfur, nitrogen, and phosphorus are coordinated to the surface of the metal particle through these elements. To do. Among these elements, sulfur is preferable because it has a strong chemical bonding force with metal particles. Sulfur, nitrogen and phosphorus elements may be contained in a functional group different from the hydrophilic group, and if the hydrophilic compound has two or more hydrophilic groups, they are contained in the hydrophilic group. Also good. However, in the present invention, it is not always necessary that all the hydrophilic compounds present on the surface of the metal particles are chemically bonded to the metal particles, and the effect of the present invention can be obtained if at least a portion is chemically bonded. The remaining part may be adsorbed or deposited on the particle surface. The hydrophilic group means a functional group having an affinity for water and is preferably capable of reacting with the active group of the crosslinking agent, and a compound having at least one hydrophilic group is used. Examples of the hydrophilic group include a carboxyl group (—COOH), a hydroxyl group (—OH), an amino group (—NH 2 ), a hydrazide group (—NH—NH 2 ), an amide group (—CONH—), and the like. The hydrophilic compound preferably contains one or more of these.

親水性基を有する硫黄化合物としては例えば、(a)メルカプトカルボン酸類(親水性基がカルボキシル基:例えば、メルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、ジメルカプトコハク酸、チオ酢酸、チオジグリコール酸等)、(b)チオグリコール類(親水性基が水酸基:例えば、メルカプトエタノール、チオジエチレングリコール等)、(c)アミノチオール類(親水性基がアミノ基:アミノエチルメルカプタン、チオジエチルアミン等)、(d)チオアミド類(親水性基がアミド基:例えば、チオホルムアミド等)、(e)含硫黄アミノ酸類(親水性基がアミノ基及びカルボキシル基:例えば、システイン、メチオニン等)が挙げられる。中でも、メルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、メルカプトエタノール、チオジエチレングリコール、チオジグリコール酸、アミノエチルメルカプタン、チオジエチルアミンから選ばれる少なくとも1種が好ましく、特にメルカプトプロピオン酸、メルカプト酢酸、メルカプトエタノールは、金属粒子、とりわけ金属コロイド粒子に親水性と分散安定性を付与する効果が高くより好ましい。
また、親水性基を有する窒素化合物としては、(a)アミノ酸類(親水性基がカルボキシル基:例えば、グリシン、アラニン等の中性アミノ酸類、ヒスチジン、アルギニン等の塩基性アミノ酸類、アスパラギン酸、グルタミン酸等の酸性アミノ酸類)、(b)アミノポリカルボン酸類(親水性基がカルボキシル基:例えば、エチレンジアミンテトラ酢酸(EDTA)、ニトリロトリ酢酸(NTA)、イミノジ酢酸(IDA)、エチレンジアミンジ酢酸(EDDA)、エチレングリコールジエチルエーテルジアミンテトラ酢酸(GEDA)等)、(c)アルカノールアミン類(親水性基が水酸基:例えば、エタノールアミン、ジエタノールアミン、トリエタノールアミン等)、(d)アミン類(親水性基がアミノ基:エチレンジアミン、ジエチレントリアミン、トリアミノトリエチルアミン等)が挙げられる。
また、親水性基を有するリン化合物としては、アルキルホスフィン(−PR:Rはアルキル基)のアルキル基の一部が親水性基を有する官能基と置換したものなどが挙げられる。
Examples of the sulfur compound having a hydrophilic group include (a) mercaptocarboxylic acids (the hydrophilic group is a carboxyl group: for example, mercaptopropionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, dimercaptosuccinic acid, thioacetic acid. Thiothioglycolic acid, etc.), (b) thioglycols (hydrophilic groups are hydroxyl groups: for example, mercaptoethanol, thiodiethylene glycol, etc.), (c) aminothiols (hydrophilic groups are amino groups: aminoethyl mercaptan, thio) Diethylamine, etc.), (d) thioamides (hydrophilic groups are amide groups, such as thioformamide), (e) sulfur-containing amino acids (hydrophilic groups are amino groups and carboxyl groups, such as cysteine, methionine, etc.) Can be mentioned. Among these, at least one selected from mercaptopropionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, mercaptoethanol, thiodiethylene glycol, thiodiglycolic acid, aminoethyl mercaptan, and thiodiethylamine is preferable, particularly mercaptopropionic acid, mercapto Acetic acid and mercaptoethanol are more preferred because they are effective in imparting hydrophilicity and dispersion stability to metal particles, particularly metal colloid particles.
Examples of the nitrogen compound having a hydrophilic group include (a) amino acids (the hydrophilic group is a carboxyl group: for example, neutral amino acids such as glycine and alanine, basic amino acids such as histidine and arginine, aspartic acid, Acidic amino acids such as glutamic acid), (b) aminopolycarboxylic acids (the hydrophilic group is a carboxyl group: for example, ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid (NTA), iminodiacetic acid (IDA), ethylenediaminediacetic acid (EDDA) , Ethylene glycol diethyl ether diamine tetraacetic acid (GEDA), etc.), (c) alkanolamines (hydrophilic groups are hydroxyl groups: for example, ethanolamine, diethanolamine, triethanolamine, etc.), (d) amines (hydrophilic groups are Amino group: ethylenediamine, diethyl Ntoriamin, triamino triethylamine etc.).
As the phosphorus compounds having a hydrophilic group, an alkyl phosphine (-PR 3: R is an alkyl group) and the like in which a part of the alkyl group is substituted with a functional group having a hydrophilic group.

金属粒子の表面に親水性化合物を予め化学結合させるには、金属粒子を分散した媒液中に親水性化合物を添加し混合するか、あるいは、前記の金属化合物と還元剤とを液相中で反応させる際に親水性化合物を存在させても製造することができる。後者の方法では還元反応の際に親水性化合物が存在しており、より高度に分散した金属粒子が得られ、特に微細な金属コロイド粒子が得られるため好ましい方法である。このことから、金属化合物と親水性化合物とを媒液に溶解した溶液と還元剤とを混合して還元する方法、金属化合物と親水性化合物とを媒液に溶解した溶液に還元剤を添加して還元する方法などがより好ましい方法である。   In order to chemically bond the hydrophilic compound to the surface of the metal particles in advance, the hydrophilic compound is added and mixed in a liquid medium in which the metal particles are dispersed, or the metal compound and the reducing agent are mixed in a liquid phase. It can be produced even when a hydrophilic compound is present in the reaction. The latter method is a preferred method because a hydrophilic compound is present during the reduction reaction, so that highly dispersed metal particles can be obtained, and particularly fine metal colloid particles can be obtained. From this, a method of reducing by mixing a reducing agent with a solution in which a metal compound and a hydrophilic compound are dissolved in a medium, a reducing agent is added to a solution in which a metal compound and a hydrophilic compound are dissolved in a medium. The reduction method is a more preferable method.

(3)架橋剤
流動性組成物に配合する架橋剤は、前記親水性化合物の親水性基と反応し得る活性基を有し、この架橋剤が有する活性基と、親水性化合物が有する親水性基とが架橋反応を行い得るものであって、例えば、先に挙げたカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基等とが、縮合、付加重合または開環重合し得るものを言う。このような活性基としては、オキサゾリン基(−CONC)、カルボジイミド基(−N=C=N−)、ブロックイソシアネート基、エポキシ基(−COC)、カルボニル基(−C=O)等が挙げられ、これらから選ばれる少なくとも1種の活性基を持つ架橋剤が好ましく、オキサゾリン基、カルボジイミド基、ブロックイソシアネート基から選ばれる少なくとも1種の活性基を持つ架橋剤がより好ましい。本発明では、これらの活性基は1種の架橋剤中に1種または2種以上含まれていても良く、異なる活性基を有する架橋剤を2種以上用いることも、同種の活性基を有する異種の架橋剤を2種以上用いることもできる。また、架橋剤としてメラミン、メラミン誘導体から選ばれる1種の化合物も用いることができる。具体的には、オキサゾリン系架橋剤としては、2、2’−ビス(2オキサゾリン)、2、2’−メチレン−ビス(2オキサゾリン)、2、2’−エチレン−ビス(4、4’ジメチル−2オキサゾリン)、2、2’−フェニレン−ビス(2オキサゾリン)、ビス(2−オキサゾリンシクロヘキサノン)スルフィド等が挙げられる。カルボジイミド系架橋剤としては、キシレンジイソシアネート、ヘキサメチレンジイソシアネート、トリレンジイソシアネート、イソホロンジイソシアネート等のジイソシアネート化合物の縮合物が挙げられる。ブロックイソシアネート系架橋剤としては、先に挙げたジイソシアネート化合物のイソシアネート基(−N=C=O)をアルコール系、フェノール系、オキシム系、酸アミド系等のブロック剤でブロックしたものが挙げられる。エポキシ系架橋剤としては、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、1、6−ヘキサンジオールグリシジルエーテル、グリシジルアクリレート等が挙げられる。カルボニル系架橋剤としては、ホルムアルデヒド、グリオキサール、グルタールアルデヒド等のアルデヒド系化合物、ジアセトン、シクロペンタジオン、ダイアセトンアクリルアミド、アジピン酸ヒドラジド、アセトアセトキシエチルメタクリレート、アセト酢酸アリル等のケトン系化合物等が挙げられる。メラミン系架橋剤としては、メラミン、メラミンとホルムアルデヒドを縮合して得られるメチロール化メラミン誘導体、メチロール化メラミンに低級アルコールを反応させて部分的あるいは完全にエーテル化した化合物、及びこれらの混合物が挙げられる。
(3) Cross-linking agent The cross-linking agent blended in the fluid composition has an active group capable of reacting with the hydrophilic group of the hydrophilic compound, and the active group of the cross-linking agent and the hydrophilic property of the hydrophilic compound. A group capable of undergoing a crosslinking reaction, for example, a group which can undergo condensation, addition polymerization or ring-opening polymerization with the above-mentioned carboxyl group, hydroxyl group, amino group, hydrazide group, amide group or the like. Examples of such an active group include an oxazoline group (—CONC 2 ), a carbodiimide group (—N═C═N—), a blocked isocyanate group, an epoxy group (—COC), and a carbonyl group (—C═O). A crosslinking agent having at least one active group selected from these is preferable, and a crosslinking agent having at least one active group selected from an oxazoline group, a carbodiimide group, and a blocked isocyanate group is more preferable. In the present invention, these active groups may be contained in one type or two or more types in one type of cross-linking agent, and two or more types of cross-linking agents having different active groups may be used, or the same type of active group may be used. Two or more different kinds of cross-linking agents can be used. Moreover, 1 type of compounds chosen from a melamine and a melamine derivative can also be used as a crosslinking agent. Specifically, as the oxazoline-based crosslinking agent, 2,2′-bis (2oxazoline), 2,2′-methylene-bis (2oxazoline), 2,2′-ethylene-bis (4,4′dimethyl) -2oxazoline), 2,2'-phenylene-bis (2oxazoline), bis (2-oxazolinecyclohexanone) sulfide, and the like. Examples of the carbodiimide-based crosslinking agent include condensates of diisocyanate compounds such as xylene diisocyanate, hexamethylene diisocyanate, tolylene diisocyanate, and isophorone diisocyanate. Examples of the blocked isocyanate crosslinking agent include those obtained by blocking the isocyanate group (—N═C═O) of the above-mentioned diisocyanate compound with a blocking agent such as alcohol, phenol, oxime, or acid amide. Examples of the epoxy-based crosslinking agent include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol glycidyl ether, and glycidyl acrylate. Examples of the carbonyl crosslinking agent include aldehyde compounds such as formaldehyde, glyoxal, and glutaraldehyde, ketone compounds such as diacetone, cyclopentadione, diacetone acrylamide, adipic acid hydrazide, acetoacetoxyethyl methacrylate, and allyl acetoacetate. It is done. Examples of the melamine crosslinking agent include melamine, a methylolated melamine derivative obtained by condensing melamine and formaldehyde, a compound partially or completely etherified by reacting a methylolated melamine with a lower alcohol, and a mixture thereof. .

親水性化合物と架橋剤の好ましい実施態様は、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素とカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基から選ばれる少なくとも1種の親水性基とを有する化合物が前記の元素を介して化学結合しており、架橋剤がオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤から選ばれる少なくとも1種であり、親水性化合物の親水性基と架橋剤の活性基との反応が塗布物において確認できない場合でも、優れた密着性等の本発明の効果が得られる。また、より好ましい実施態様は、金属粒子の表面には硫黄の元素とカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基から選ばれる少なくとも1種の親水性基とを有する化合物が前記の硫黄元素を介して化学結合しており、架橋剤がオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤から選ばれる少なくとも1種であり、硫黄化合物としてメルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、メルカプトエタノール、チオジエチレングリコール、チオジグリコール酸、アミノエチルメルカプタン、チオジエチルアミンから選ばれる少なくとも1種であることが更に好ましい。   In a preferred embodiment of the hydrophilic compound and the cross-linking agent, at least one element selected from sulfur, nitrogen, phosphorus and a carboxyl group, a hydroxyl group, an amino group, a hydrazide group, and an amide group is provided on the surface of the metal particle. A compound having a kind of hydrophilic group is chemically bonded through the above elements, and the crosslinking agent is an oxazoline-based crosslinking agent, a carbodiimide-based crosslinking agent, a blocked isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, or a melamine-based crosslinking agent. Even when the reaction between the hydrophilic group of the hydrophilic compound and the active group of the crosslinking agent cannot be confirmed in the coated product, the effects of the present invention such as excellent adhesion can be obtained. In a more preferred embodiment, a compound having a sulfur element and at least one hydrophilic group selected from a carboxyl group, a hydroxyl group, an amino group, a hydrazide group, and an amide group on the surface of the metal particle is the sulfur element. The crosslinking agent is at least one selected from an oxazoline crosslinking agent, a carbodiimide crosslinking agent, a blocked isocyanate crosslinking agent, an epoxy crosslinking agent, and a melamine crosslinking agent, and is a mercapto as a sulfur compound. More preferably, it is at least one selected from propionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, mercaptoethanol, thiodiethylene glycol, thiodiglycolic acid, aminoethyl mercaptan, and thiodiethylamine.

更に、親水性化合物と架橋剤の反応性を考慮すると、それぞれの親水性基、活性基の種類に応じて、適切な組合せを選択するのがより好ましい。例えば、親水性基がカルボキシル基であれば、オキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、メラミン系架橋剤、エポキシ系架橋剤から選ばれる少なくとも1種が優れた密着性等の本発明の効果が得られ更に好ましく、オキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤が更に好ましい。また、親水性基が水酸基であればブロックイソシアネート系架橋剤、メラミン系架橋剤等を選択し、アミノ基やアミド基であればブロックイソシアネート系架橋剤、エポキシ系架橋剤等を選択し、ヒドラジド基であればカルボニル系架橋剤を選択するのが更に好ましい。   Furthermore, considering the reactivity of the hydrophilic compound and the crosslinking agent, it is more preferable to select an appropriate combination according to the type of each hydrophilic group and active group. For example, when the hydrophilic group is a carboxyl group, at least one selected from an oxazoline-based crosslinking agent, a carbodiimide-based crosslinking agent, a blocked isocyanate-based crosslinking agent, a melamine-based crosslinking agent, and an epoxy-based crosslinking agent has excellent adhesion, etc. The effect of the present invention can be obtained, and an oxazoline-based crosslinking agent, a carbodiimide-based crosslinking agent, and a blocked isocyanate-based crosslinking agent are more preferable. In addition, if the hydrophilic group is a hydroxyl group, a blocked isocyanate-based crosslinking agent, a melamine-based crosslinking agent, or the like is selected. If an amino group or an amide group, a blocked isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, or the like is selected, and a hydrazide group is selected. In this case, it is more preferable to select a carbonyl-based crosslinking agent.

(4)溶媒
流動性組成物に配合する溶媒は、水、あるいはアルコール類、ケトン類等の有機溶媒のいずれでも良く、使用場面に応じて適宜設定することができるが、金属粒子の表面には親水性化合物が化学結合しているため、水や水を主体とした水性溶媒でも十分な分散安定性が得られることから、好適に用いることができる。水性溶媒中の水の含有量は使用場面に応じて適宜設定することができ、例えば電極、回路配線パターンを形成するには水が50重量%以上含まれているのが好ましく、80重量%以上であればより好ましい。一方、装飾用途の塗膜を形成するには水が1重量%以上含まれているのが好ましく、5重量%以上がより好ましく、10重量%以上がより好ましく、15重量%以上であれば更に好ましい。水性溶媒には、電極、配線パターン並びに塗膜を作製する際の溶媒の揮発速度を制御する目的で、メタノール、エタノール、プロパノール、エチレングリコール、ジアセトンアルコール、グリセリンなどのアルコール類、メチルエチルケトン、メチルイソブチルケトンなどのケトン類、エチレングリコールモノエチルエーテル、エチレングリコールモノメチルエーテルなどのグリコールエーテル類、等の親水性有機溶媒を混合することができる。水は表面張力が大きいので、必要に応じて、比誘電率が35以上、好ましくは35〜200の範囲の、沸点が100℃以上、好ましくは100〜250℃の範囲の有機溶媒を添加すると、加熱乾燥時や加熱焼成時に塗布物にシワや縮み等の表面欠陥が生じ難く、均一で密度の高い塗布物が得られ易いので好ましい。このような有機溶媒としてN−メチルホルムアミド(比誘電率190、沸点197℃)、ジメチルスルホキシド(比誘電率45、沸点189℃)、エチレングリコール(比誘電率38、沸点226℃)、4−ブチロラクトン(比誘電率39、沸点204℃)、アセトアミド(比誘電率65、沸点222℃)、1,3−ジメチル−2−イミダゾリジノン(比誘電率38、沸点226℃)、ホルムアミド(比誘電率111、沸点210℃)、N−メチルアセトアミド(比誘電率175、沸点205℃)、フルフラール(比誘電率40、沸点161℃)等が挙げられ、これらから選ばれる1種以上を用いることができる。中でも、表面張力が50×10−3N/m以下のN−メチルホルムアミド(表面張力38×10−3N/m)、ジメチルスルホキシド(表面張力43×10−3N/m)、エチレングリコール(表面張力48×10−3N/m)、4−ブチロラクトン(表面張力44×10−3N/m)、アセトアミド(表面張力39×10−3N/m)、1,3−ジメチル−2−イミダゾリジノン(表面張力41×10−3N/m)等であれば、更に効果が高く好ましい。これらの高比誘電率、高沸点の有機溶媒は、水を除く溶媒中に20〜100重量%の範囲で含まれているのが好ましく、40〜100重量%の範囲が更に好ましい。
(4) Solvent The solvent to be blended in the fluid composition may be water or an organic solvent such as alcohols and ketones, and can be set as appropriate according to the use situation. Since the hydrophilic compound is chemically bonded, sufficient dispersion stability can be obtained even with water or an aqueous solvent mainly composed of water, so that it can be suitably used. The content of water in the aqueous solvent can be appropriately set according to the usage scene. For example, in order to form electrodes and circuit wiring patterns, water is preferably contained in an amount of 50% by weight or more, and 80% by weight or more. Is more preferable. On the other hand, in order to form a coating film for decorative use, water is preferably contained in an amount of 1% by weight or more, more preferably 5% by weight or more, more preferably 10% by weight or more, and more preferably 15% by weight or more. preferable. Aqueous solvents include alcohols such as methanol, ethanol, propanol, ethylene glycol, diacetone alcohol, and glycerin, methyl ethyl ketone, methyl isobutyl for the purpose of controlling the volatilization rate of the electrode, wiring pattern, and coating solvent. A hydrophilic organic solvent such as ketones such as ketone, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, and the like can be mixed. Since water has a large surface tension, if necessary, an organic solvent having a relative dielectric constant of 35 or more, preferably 35 to 200, and a boiling point of 100 ° C. or more, preferably 100 to 250 ° C. is added. It is preferable because surface defects such as wrinkles and shrinkage hardly occur in the coated product during heat drying and heat baking, and a uniform and highly dense coated product is easily obtained. Examples of such organic solvents include N-methylformamide (dielectric constant 190, boiling point 197 ° C.), dimethyl sulfoxide (dielectric constant 45, boiling point 189 ° C.), ethylene glycol (relative dielectric constant 38, boiling point 226 ° C.), 4-butyrolactone. (Relative permittivity 39, boiling point 204 ° C.), acetamide (relative permittivity 65, boiling point 222 ° C.), 1,3-dimethyl-2-imidazolidinone (relative permittivity 38, boiling point 226 ° C.), formamide (relative permittivity 111, boiling point 210 ° C.), N-methylacetamide (relative dielectric constant 175, boiling point 205 ° C.), furfural (relative dielectric constant 40, boiling point 161 ° C.) and the like, and one or more selected from these can be used. . Among them, N-methylformamide (surface tension 38 × 10 −3 N / m) having a surface tension of 50 × 10 −3 N / m or less, dimethyl sulfoxide (surface tension 43 × 10 −3 N / m), ethylene glycol ( Surface tension 48 × 10 −3 N / m), 4-butyrolactone (surface tension 44 × 10 −3 N / m), acetamide (surface tension 39 × 10 −3 N / m), 1,3-dimethyl-2- Imidazolidinone (surface tension 41 × 10 −3 N / m) or the like is more effective and preferable. These organic solvents having a high relative dielectric constant and a high boiling point are preferably contained in a solvent other than water in a range of 20 to 100% by weight, and more preferably in a range of 40 to 100% by weight.

(5)その他の成分
本発明の流動性組成物に、必要に応じて水性バインダーを更に配合すると、塗布物と基材との密着性が一層向上するので好ましい。水性バインダーとしては、水溶解型、エマルジョン型、コロイダルディスパージョン型等を制限なく用いることができるが、前記架橋剤により硬化されるものであれば、硬度の高い塗布物が得られ易いので好ましく、水溶解型であれば更に好ましい。このような水性バインダーとしてタンパク質系高分子、水性アクリル樹脂、水性ポリエステル樹脂、水性ウレタン樹脂、水性セルロースが好適なものとして例示でき、これらから選ばれる少なくとも1種を用いるのが好ましい。特に、ゼラチン、アラビアゴム、カゼイン、カゼイン酸ソーダ、カゼイン酸アンモニウム等のタンパク質系高分子は、金属粒子との相互作用が強く架橋剤との反応においてより効率良く塗布物と基材間の密着性を向上させるので好ましく、特にゼラチンであれば更に好ましい。架橋剤との好適な組合せとしては、例えば、オキサゾリン系架橋剤やカルボジイミド系架橋剤に対しては、タンパク質系高分子、水性ウレタン樹脂、水性アクリル樹脂、水性ポリエステル樹脂等が好ましく、ブロックイソシアネート系架橋剤に対しては、タンパク質系高分子、水性アクリル樹脂、水性ポリエステル樹脂、水性ウレタン樹脂、水性セルロース等が好ましい。水性バインダー成分の配合量は、金属粒子100重量部に対し0.01〜10重量部程度の範囲が好ましく、より好ましい範囲は0.01〜8重量部程度であり、0.01〜5重量部程度であれば更に好ましい。
(5) Other components It is preferable to add an aqueous binder to the fluid composition of the present invention as necessary, since the adhesion between the coated material and the substrate is further improved. As the aqueous binder, a water-soluble type, an emulsion type, a colloidal dispersion type and the like can be used without limitation, but if it is cured by the cross-linking agent, it is preferable because a coating with high hardness is easily obtained, A water-soluble type is more preferable. Examples of suitable aqueous binders include protein-based polymers, aqueous acrylic resins, aqueous polyester resins, aqueous urethane resins, and aqueous cellulose, and it is preferable to use at least one selected from these. In particular, protein polymers such as gelatin, gum arabic, casein, sodium caseinate, and ammonium caseinate have a strong interaction with metal particles and more efficiently in the reaction with the cross-linking agent. In particular, gelatin is more preferable. As a suitable combination with a crosslinking agent, for example, a protein polymer, an aqueous urethane resin, an aqueous acrylic resin, an aqueous polyester resin and the like are preferable for an oxazoline-based crosslinking agent and a carbodiimide-based crosslinking agent. For the agent, protein-based polymer, aqueous acrylic resin, aqueous polyester resin, aqueous urethane resin, aqueous cellulose and the like are preferable. The amount of the aqueous binder component is preferably in the range of about 0.01 to 10 parts by weight with respect to 100 parts by weight of the metal particles, and more preferably in the range of about 0.01 to 8 parts by weight, and 0.01 to 5 parts by weight. If it is a grade, it is still more preferable.

また、本発明の流動性組成物には、前記の金属粒子、架橋剤、溶媒、水性バインダーの他に、界面活性剤、分散剤、増粘剤、可塑剤、防カビ剤等の添加剤を、必要に応じて適宜配合することもできる。例えば、界面活性剤は金属粒子の分散安定性を更に高める作用や、流動性組成物のレオロジー特性を制御し、塗工性を改良する作用を有するので好ましく、具体的には、第4級アンモニウム塩等のカチオン系、カルボン酸塩、スルホン酸塩、硫酸エステル塩、リン酸エステル塩等のアニオン系、エーテル型、エーテルエステル型、エステル型、含窒素型等のノニオン系等の公知の界面活性剤を用いることができ、これらから選ばれる1種以上を用いることができる。界面活性剤の配合量は、金属粒子の種類等によって異なるので、塗料組成に応じて適宜設定するが、一般的には金属粒子100重量部に対し、0.01〜0.5重量部程度の範囲が好ましい。   In addition to the metal particles, the crosslinking agent, the solvent, and the aqueous binder, the fluid composition of the present invention contains additives such as a surfactant, a dispersant, a thickener, a plasticizer, and an antifungal agent. Further, it can be appropriately blended as necessary. For example, the surfactant is preferable because it has an effect of further improving the dispersion stability of the metal particles and an effect of controlling the rheological properties of the fluid composition and improving the coatability. Specifically, the surfactant is a quaternary ammonium. Known surface activity such as cation type such as salt, anionic type such as carboxylate, sulfonate, sulfate ester salt, phosphate ester salt, nonionic type such as ether type, ether ester type, ester type, nitrogen type An agent can be used and 1 or more types chosen from these can be used. The compounding amount of the surfactant varies depending on the type of metal particles and the like, and is appropriately set according to the coating composition. Generally, it is about 0.01 to 0.5 parts by weight with respect to 100 parts by weight of the metal particles. A range is preferred.

次に、本発明の流動性組成物を用いた電極等について説明する。
電極、回路配線パターンは、本発明の流動性組成物を、例えば、スクリーン印刷、インクジェット印刷等の方法により、基板に塗布した後、塗布物を適当な温度で加熱焼成して得られる。また、塗膜は、前記流動性組成物を、例えば、スピンコート、ロールコート、スプレーコート、刷毛塗り等の方法により、基材に塗布し乾燥して得られる。あるいは、スクリーン印刷やインクジェット印刷などの印刷方法や転写方法を用いて塗膜を形成することもできる。流動性組成物に含まれる架橋剤と親水性化合物との反応、あるいは架橋剤と水性バインダーとの反応は、加熱することにより促進されるので、塗膜を得る場合にも適当な温度で加熱することが好ましい。また、加熱により、溶媒が短時間で揮発するので、塗膜表面にシワ、チヂレ、クボミ等が生じ難く、良好な外観が一層得られ易くなる。加熱条件は、架橋剤と親水性化合物や水性バインダーとの組合せ、基材の種類などにより適宜設定されるが、架橋剤が前記のオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤であれば、40〜300℃の範囲が好ましく、より好ましくは80〜200℃の範囲の温度で30分から2時間程度加熱すると、所望の効果が得られる。本発明の流動性組成物を用いて製造した塗膜は、金属粒子、硬化成分を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素と親水性基とを有する化合物が前記の元素を介して化学結合しており、硬化成分は前記化合物の親水性基と架橋剤が有する活性基とが反応して架橋した構成とすることができる。
Next, an electrode using the fluid composition of the present invention will be described.
An electrode and a circuit wiring pattern are obtained by applying the fluid composition of the present invention to a substrate by a method such as screen printing or inkjet printing, and then heating and baking the applied material at an appropriate temperature. The coating film is obtained by applying the fluid composition to a substrate and drying it by a method such as spin coating, roll coating, spray coating, or brush coating. Or a coating film can also be formed using printing methods, such as screen printing and inkjet printing, and a transfer method. Since the reaction between the crosslinking agent and the hydrophilic compound contained in the fluid composition or the reaction between the crosslinking agent and the aqueous binder is accelerated by heating, heating is performed at an appropriate temperature even when a coating film is obtained. It is preferable. In addition, since the solvent is volatilized in a short time by heating, wrinkles, wrinkles, dents and the like are hardly generated on the surface of the coating film, and it becomes easier to obtain a good appearance. The heating conditions are appropriately set depending on the combination of the crosslinking agent and the hydrophilic compound or aqueous binder, the type of substrate, etc., but the crosslinking agent is the oxazoline-based crosslinking agent, carbodiimide-based crosslinking agent, or blocked isocyanate-based crosslinking agent. If it exists, the range of 40-300 degreeC is preferable, A desired effect will be acquired when it heats for about 30 minutes to 2 hours at the temperature of the range of 80-200 degreeC more preferably. The coating film produced using the fluid composition of the present invention contains at least metal particles and a curing component, and the surface of the metal particles contains at least one element selected from sulfur, nitrogen and phosphorus and a hydrophilic group. The compound having a chemical bond is formed through the above-described elements, and the curing component can be configured to be crosslinked by the reaction between the hydrophilic group of the compound and the active group of the crosslinking agent.

本発明の装飾物品は、基材の表面の少なくとも一部に、前記の塗膜を形成したものであって、金属粒子の金属色や光沢を基材表面に付与したものである。基材表面の全面にわたって着色し光沢を付与することができるほか、基材表面の一部分に意匠、標章、ロゴマークを形成したり、その他の文字、図形、記号を形成したりすることもできる。基材としては、金属、ガラス、セラミック、コンクリートなどの無機質材料、ゴム、プラスチック、紙、木、皮革、布、繊維などの有機質材料、無機質材料と有機質材料とを併用あるいは複合した材料を用いることができる。それらの材質の基材を使用物品に加工する前の原料基材に塗膜を形成して装飾を施すこともでき、あるいは、基材を加工した後のあらゆる物品に装飾を施すこともできる。また、それらの基材表面に予め塗装したものの表面に装飾を施すことも含まれる。
装飾を施す物品の具体例としては、(1)自動車、トラック、バスなどの輸送機器の外装、内装、バンパー、ドアノブ、サイドミラー、フロントグリル、ランプの反射板、表示機器等、
(2)テレビ、冷蔵庫、電子レンジ、パーソナルコンピューター、携帯電話、カメラなどの電化製品の外装、リモートコントロール、タッチパネル、フロントパネル等、
(3)家屋、ビル、デパート、ストアー、ショッピングモール、パチンコ店、結婚式場、葬儀場、神社仏閣などの建築物の外装、窓ガラス、玄関、表札、門扉、ドア、ドアノブ、ショーウインド、内装等、
(4)照明器具、家具、調度品、トイレ機器、仏壇仏具、仏像などの家屋設備、
(5)金物、食器などの什器、
(6)飲料水、タバコなどの自動販売機、
(7)合成洗剤、スキンケア、清涼飲料水、酒類、菓子類、食品、たばこ、医薬品などの容器、
(8)表装紙、ダンボール箱などの梱包用具、
(9)衣服、靴、鞄、メガネ、人口爪、人口毛、宝飾品などの衣装・装飾品、
(10)野球のバット、ゴルフのクラブなどのスポーツ用品、つり具などの趣味用品、
(11)鉛筆、色紙、ノート、年賀はがきなどの事務用品、机、椅子などの事務機器、
(12)書籍類のカバーやオビ等、人形、ミニカーなどのおもちゃ、定期券などのカード類、CD、DVDなどの記録媒体、などが挙げられる。また、人間の爪、皮膚、眉毛、髪の毛などを基材とすることができる。
The decorative article of the present invention is such that the above-mentioned coating film is formed on at least a part of the surface of the substrate, and the metal color and gloss of the metal particles are imparted to the substrate surface. The entire surface of the substrate can be colored to give gloss, and a design, mark, logo mark can be formed on a part of the substrate surface, and other characters, figures and symbols can be formed. . As the base material, use inorganic materials such as metals, glass, ceramics, concrete, organic materials such as rubber, plastic, paper, wood, leather, cloth, and fibers, and materials that use a combination of inorganic materials and organic materials or composite materials. Can do. The base material of those materials can be decorated by forming a coating film on the raw material base material before being processed into an article to be used, or can be decorated on any article after processing the base material. Moreover, decorating the surface of those previously coated on the substrate surface is also included.
Specific examples of articles to be decorated include (1) exterior, interior, bumper, door knob, side mirror, front grill, lamp reflector, display device, etc. of transportation equipment such as automobiles, trucks, and buses,
(2) Exteriors of electrical appliances such as TVs, refrigerators, microwave ovens, personal computers, mobile phones, cameras, remote controls, touch panels, front panels, etc.
(3) Houses, buildings, department stores, stores, shopping malls, pachinko shops, wedding halls, funeral halls, exteriors of buildings such as shrines and temples, window glass, entrances, nameplates, gates, doors, doorknobs, show windows, interiors, etc. ,
(4) Lighting equipment, furniture, furniture, toilet equipment, Buddhist altar tools, Buddhist statues and other home equipment
(5) Fixtures such as hardware and tableware,
(6) Vending machines for drinking water, tobacco, etc.
(7) Containers for synthetic detergents, skin care, soft drinks, alcoholic beverages, confectionery, food, tobacco, pharmaceuticals,
(8) Packing tools such as cover paper and cardboard boxes,
(9) Costumes and accessories such as clothes, shoes, bags, glasses, artificial nails, artificial hair, jewelry,
(10) Sports equipment such as baseball bats and golf clubs, hobby goods such as fishing equipment,
(11) Office supplies such as pencils, colored paper, notebooks, New Year postcards, desks and chairs,
(12) Books covers and covers, dolls, toys such as minicars, cards such as commuter passes, recording media such as CDs and DVDs, and the like. In addition, human nails, skin, eyebrows, hair, and the like can be used as a base material.

以下に実施例を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例によって制限されるものではない。   The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

実施例1〜6、比較例1
(金属コロイド粒子の調製)
金属化合物として硝酸銀50g、親水性化合物として3−メルカプトプロピオン酸1.6gを純水220ミリリットルに溶解し、28%アンモニア水70ミリリットルを加え、pHを11.6に調整した。一方、還元剤として水素化ホウ素ナトリウム2.1gを、28%アンモニア水4ミリリットルを加えた295ミリリットルの純水に溶解した。両者を30分間かけて600ミリリットルの純水中に撹拌しながら同時に滴下し、硝酸銀を還元して、3−メルカプトプロピオン酸が表面に存在する銀コロイド粒子を媒液中に生成させた。次いで、得られた銀コロイド粒子の媒液を、硝酸(30%)を用いて媒液のpHを2.5に調整し、銀コロイド粒子を沈降させ、真空ろ過機で銀コロイド粒子(銀コロイド粒子1000重量部に対し、メルカプトプロピオン酸を3重量部含む。銀コロイド粒子の平均粒子径は約10nm)をろ別し、ろ液の比導電率が10μS/cm以下になるまで水洗した後、水中に再分散して、水性銀コロイド溶液(銀コロイド粒子を70重量%含有)を得た。
Examples 1-6, Comparative Example 1
(Preparation of metal colloidal particles)
50 g of silver nitrate as a metal compound and 1.6 g of 3-mercaptopropionic acid as a hydrophilic compound were dissolved in 220 ml of pure water, and 70 ml of 28% ammonia water was added to adjust the pH to 11.6. On the other hand, 2.1 g of sodium borohydride as a reducing agent was dissolved in 295 ml of pure water to which 4 ml of 28% ammonia water was added. Both were dripped simultaneously in 600 milliliters of pure water over 30 minutes, and silver nitrate was reduced to produce silver colloidal particles having 3-mercaptopropionic acid on the surface in the medium. Next, the medium liquid of the obtained silver colloid particles is adjusted to pH 2.5 with nitric acid (30%), the silver colloid particles are settled, and the silver colloid particles (silver colloid particles are collected by a vacuum filter). 3 parts by weight of mercaptopropionic acid with respect to 1000 parts by weight of the particles.The average particle diameter of the silver colloidal particles is about 10 nm), and after washing with water until the specific conductivity of the filtrate is 10 μS / cm or less, Re-dispersion in water gave an aqueous silver colloid solution (containing 70% by weight of silver colloid particles).

(流動性組成物の調製)
前記の銀コロイド溶液を用いて、表1に示す処方をスクリュー瓶に仕込み、10分間超音波分散して本発明及び比較対象の流動性組成物(銀コロイド粒子濃度:50重量%)を得た。それぞれを試料A〜Gとする。
(Preparation of fluid composition)
Using the silver colloid solution, the formulation shown in Table 1 was charged into a screw bottle and subjected to ultrasonic dispersion for 10 minutes to obtain a fluid composition (silver colloid particle concentration: 50% by weight) of the present invention and a comparative object. . Each is designated as samples AG.

Figure 2007128864
(1)オキサゾリン系架橋剤(日本触媒社製)
(2)ブロックイソシアネート系架橋剤(第一工業製薬社製)
(3)カルボジイミド系架橋剤(日清紡社製)
(4)分散剤(有効成分40重量%:ビックケミー社製)
Figure 2007128864
(1) Oxazoline-based crosslinking agent (manufactured by Nippon Shokubai Co., Ltd.)
(2) Blocked isocyanate crosslinking agent (Daiichi Kogyo Seiyaku Co., Ltd.)
(3) Carbodiimide type crosslinking agent (Nisshinbo Co., Ltd.)
(4) Dispersant (active ingredient 40% by weight: manufactured by Big Chemie)

比較例2〜8
(金属コロイド粒子の調製)
金属化合物として硝酸銀39.4gを純水に溶解した水溶液60ミリリットルを、表面保護剤としてクエン酸3ナトリウム2水和物262.8g、還元剤として硫酸第一鉄7水和物129.2gを、純水800ミリリットルに溶解した水溶液に、撹拌しながら20分間かけて滴下し、硝酸銀を還元して、クエン酸3ナトリウムが表面に存在する銀コロイド粒子を媒液中に生成させた。次いで、得られた銀コロイド粒子の媒液を、遠心分離機を用いて98000m/sで30分間遠心分離を行い、沈降分を回収して800ミリリットルの純水に再分散させ、更に、98000m/sで30分間遠心分離を行い沈降分を除去し、水性銀コロイド溶液を得た。この水性銀コロイド溶液の比導電率を測定したところ、10μS/cm以下であった。得られた水性銀コロイド溶液にアセトン800ミリリットルを添加し、銀コロイド粒子を凝集させ、再度、29400m/sで30分間遠心分離して沈降分を回収し、銀コロイド粒子のケーキ(銀コロイド粒子を61重量%含有)を得た。
Comparative Examples 2-8
(Preparation of metal colloidal particles)
60 ml of an aqueous solution obtained by dissolving 39.4 g of silver nitrate as a metal compound in pure water, 262.8 g of trisodium citrate dihydrate as a surface protective agent, and 129.2 g of ferrous sulfate heptahydrate as a reducing agent, The solution was dropped into an aqueous solution dissolved in 800 ml of pure water over 20 minutes while stirring to reduce silver nitrate, and silver colloid particles having trisodium citrate existing on the surface were generated in the medium. Next, the obtained silver colloid particle liquid is centrifuged at 98000 m / s 2 for 30 minutes using a centrifuge, and the sediment is recovered and redispersed in 800 ml of pure water. Further, 98000 m Centrifugation was performed at / s 2 for 30 minutes to remove sediment, and an aqueous silver colloid solution was obtained. When the specific conductivity of this aqueous silver colloid solution was measured, it was 10 μS / cm or less. 800 ml of acetone is added to the obtained aqueous silver colloid solution, the silver colloid particles are aggregated, and centrifuged again at 29400 m / s 2 for 30 minutes to collect a sediment, and a silver colloid particle cake (silver colloid particles Containing 61% by weight).

(流動性組成物の調製)
前記の銀コロイド粒子のケーキを用いて、表2に示す処方をスクリュー瓶に仕込み、10分間超音波分散して比較対象の流動性組成物(銀コロイド粒子濃度:20重量%)を得た。それぞれを試料H〜Nとする。
(Preparation of fluid composition)
Using the silver colloid particle cake, the formulation shown in Table 2 was charged into a screw bottle and subjected to ultrasonic dispersion for 10 minutes to obtain a fluid composition for comparison (silver colloid particle concentration: 20% by weight). Each is designated as samples H to N.

Figure 2007128864
(1)オキサゾリン系架橋剤(日本触媒社製)
(2)ブロックイソシアネート系架橋剤(第一工業製薬社製)
(3)カルボジイミド系架橋剤(日清紡社製)
(4)分散剤(有効成分40重量%:ビックケミー社製)
Figure 2007128864
(1) Oxazoline-based crosslinking agent (manufactured by Nippon Shokubai Co., Ltd.)
(2) Blocked isocyanate crosslinking agent (Daiichi Kogyo Seiyaku Co., Ltd.)
(3) Carbodiimide type crosslinking agent (Nisshinbo Co., Ltd.)
(4) Dispersant (active ingredient 40% by weight: manufactured by Big Chemie)

評価1:塗膜の比抵抗の評価
実施例1〜6、比較例1〜8の流動性組成物(試料A〜N)を、#16バーコーターでガラス板上に塗布し、150℃の温度で1時間焼きつけた。得られた塗膜の体積抵抗率を、ロレスタ−GP型低抵抗率計(三菱化学社製)を用いて測定した。結果を表3に示す。本発明の流動性組成物により得られる導電性塗膜は、従来の方法により得られる塗膜と同等の優れた導電性を示すことが判る。
Evaluation 1: Evaluation of specific resistance of coating film The fluid compositions (samples A to N) of Examples 1 to 6 and Comparative Examples 1 to 8 were applied on a glass plate with a # 16 bar coater, and the temperature was 150 ° C. And baked for 1 hour. The volume resistivity of the obtained coating film was measured using a Loresta-GP type low resistivity meter (manufactured by Mitsubishi Chemical Corporation). The results are shown in Table 3. It turns out that the electroconductive coating film obtained by the fluid composition of this invention shows the electroconductivity equivalent to the coating film obtained by the conventional method.

評価2:塗膜強度及び塗膜外観の評価
実施例1〜6、比較例3〜8の流動性組成物(試料A〜F、I〜N)を、#10バーコーターでPETフィルム上に塗布し、150℃の温度で1時間焼きつけた。得られた塗膜にカッターで10mm×10mm大のゴバン目状の切り込みを100個作り、その上にセロハンテープを貼付した後、90°の角度でセロハンテープを急激に剥離した。剥離後にPETフィルム上に残ったゴバン目の数を測定した。この数値が大きい程、塗膜強度が高いことを示す。また、塗膜を水及び70℃の温水に1晩浸漬した後、同様にして塗膜強度を評価した。更に、これらの塗膜の外観を目視により観察した。尚、比較例1、2は塗膜が硬化しないので、本評価は行っていない。結果を表3に示す。本発明の流動性組成物により得られる導電性塗膜は、塗膜強度が高く、しかも優れた外観が得られることが判る。以上は、親水性硫黄化合物を化学結合した銀粒子の具体例であるが、親水性窒素化合物、親水性リン化合物でも同様の結果が得られており、また、銀粒子以外の金属粒子でも同様の結果が得られることを確認した。
Evaluation 2: Evaluation of coating film strength and coating film appearance The fluid compositions (samples A to F and I to N) of Examples 1 to 6 and Comparative Examples 3 to 8 were applied onto a PET film with a # 10 bar coater. And baked at a temperature of 150 ° C. for 1 hour. The obtained coating film was made with 100 cutters having a size of 10 mm × 10 mm, and a cellophane tape was affixed thereon, and then the cellophane tape was peeled off at an angle of 90 °. The number of gobangs remaining on the PET film after peeling was measured. The larger this value, the higher the coating strength. Moreover, after immersing a coating film in water and 70 degreeC warm water overnight, the coating-film intensity | strength was evaluated similarly. Furthermore, the appearance of these coating films was visually observed. In Comparative Examples 1 and 2, since the coating film is not cured, this evaluation is not performed. The results are shown in Table 3. It can be seen that the conductive coating obtained by the fluid composition of the present invention has high coating strength and an excellent appearance. The above is a specific example of silver particles chemically bonded with a hydrophilic sulfur compound, but similar results have been obtained with hydrophilic nitrogen compounds and hydrophilic phosphorus compounds, and also with metal particles other than silver particles. It was confirmed that a result was obtained.

Figure 2007128864
Figure 2007128864

実施例7、比較例9
前記の実施例1と同様にして水性銀コロイド溶液(銀コロイド粒子を70重量%含有)を得、次いで、この水性銀コロイド溶液を用いて、表4に示す処方をスクリュー瓶に仕込み、10分間超音波分散して本発明及び比較対象のインク組成物(銀コロイド粒子濃度:10重量%)を得た。それぞれを試料O、Pとする。
Example 7 and Comparative Example 9
An aqueous silver colloid solution (containing 70% by weight of silver colloid particles) was obtained in the same manner as in Example 1, and then, using this aqueous silver colloid solution, the formulation shown in Table 4 was charged into a screw bottle for 10 minutes. Ultrasonic dispersion was performed to obtain an ink composition (silver colloid particle concentration: 10% by weight) of the present invention and a comparative object. Let them be samples O and P, respectively.

Figure 2007128864
(1)オキサゾリン系架橋剤(日本触媒社製)
(2)分散剤(有効成分40重量%:ビックケミー社製)
Figure 2007128864
(1) Oxazoline-based crosslinking agent (manufactured by Nippon Shokubai Co., Ltd.)
(2) Dispersant (active ingredient 40% by weight: manufactured by Big Chemie)

実施例7、比較例9のインク組成物(試料O、P)をスプレー塗装機の一種であるエアブラシ(アネスト岩田社製HP−CH)でPETフィルム、ガラス板、アクリル板上に塗布し、80℃または150℃の温度で1時間焼きつけた。得られた塗膜を前記の評価2の方法でカッターで10mm×10mm大のゴバン目状の切り込みを100個作り、その上にセロハンテープを貼付した後、90°の角度でセロハンテープを急激に剥離した。剥離後にPETフィルム、ガラス板、アクリル板上に残ったゴバン目の数を測定して、塗膜強度、塗膜外観を評価した結果を表5に示す。本発明の流動性組成物により得られた塗膜は、塗膜強度が高く、金属光沢の鏡面を有することが判った。   The ink composition (samples O and P) of Example 7 and Comparative Example 9 was applied onto a PET film, glass plate, and acrylic plate with an airbrush (HP-CH manufactured by Anest Iwata Co., Ltd.), which is a type of spray coating machine, and 80 Bake for 1 hour at a temperature of 150 ° C or 150 ° C. The obtained coating film was made with 100 cutters of 10 mm × 10 mm in size by using the method of evaluation 2 above, and after applying cellophane tape on it, the cellophane tape was sharply applied at an angle of 90 °. It peeled. Table 5 shows the results of measuring the number of gobangs remaining on the PET film, glass plate, and acrylic plate after peeling, and evaluating the coating strength and appearance. It was found that the coating film obtained from the fluid composition of the present invention had high coating film strength and had a metallic gloss mirror surface.

Figure 2007128864
Figure 2007128864

本発明の流動性組成物は、従来のものよりも基材との密着性等に優れており、従来から用いられている電気的導通を確保する材料、あるいは帯電防止、電磁波遮蔽または金属光沢を付与する材料などの用途に幅広く用いられるほか、比較的低温での加熱によっても優れた導電性、金属光沢を有する塗膜が得られることから、近年活発に開発が進められている電極、回路配線パターンの形成といったナノテクノロジーの新規用途にも適用でき、また、金属光沢による意匠性、装飾性の付与などのメッキ技術の代替用途にも適用できる。   The flowable composition of the present invention is superior in adhesion to the base material than the conventional ones, and has been used in the conventional materials for ensuring electrical continuity, or antistatic, electromagnetic shielding or metallic luster. In addition to being widely used for applications such as materials to be applied, coatings with excellent conductivity and metallic luster can be obtained by heating at relatively low temperatures, so electrodes and circuit wiring that have been actively developed in recent years It can be applied to new uses of nanotechnology such as pattern formation, and it can also be applied to alternative uses of plating technology such as design and decoration by metallic luster.

Claims (17)

金属粒子、架橋剤及び溶媒を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素と親水性基とを有する化合物が前記の元素を介して化学結合しており、架橋剤が前記化合物の親水性基と反応し得る活性基を有するものであることを特徴とする流動性組成物。 It contains at least metal particles, a crosslinking agent, and a solvent, and a compound having at least one element selected from sulfur, nitrogen, and phosphorus and a hydrophilic group is chemically bonded to the surface of the metal particles through the above elements. A fluid composition, wherein the cross-linking agent has an active group capable of reacting with the hydrophilic group of the compound. 金属粒子と化学結合している化合物の親水性基がカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基から選ばれる少なくとも1種であることを特徴とする請求項1に記載の流動性組成物。 The fluid composition according to claim 1, wherein the hydrophilic group of the compound chemically bonded to the metal particles is at least one selected from a carboxyl group, a hydroxyl group, an amino group, a hydrazide group, and an amide group. . 架橋剤が、オキサゾリン基、カルボジイミド基、ブロックイソシアネート基、エポキシ基から選ばれる少なくとも1種の活性基を有する化合物、若しくはメラミン及び/またはメラミン誘導体であることを特徴とする請求項1に記載の流動性組成物。 The fluid according to claim 1, wherein the crosslinking agent is a compound having at least one active group selected from an oxazoline group, a carbodiimide group, a blocked isocyanate group, and an epoxy group, or a melamine and / or a melamine derivative. Sex composition. 金属粒子、架橋剤及び溶媒を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素とカルボキシル基、水酸基、アミノ基、ヒドラジド基、アミド基から選ばれる少なくとも1種の親水性基とを有する化合物が前記の元素を介して化学結合しており、架橋剤がオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤から選ばれる少なくとも1種であることを特徴とする流動性組成物。 At least one element selected from a carboxyl group, a hydroxyl group, an amino group, a hydrazide group, and an amide group and at least one element selected from sulfur, nitrogen, and phosphorus on the surface of the metal particle, including at least metal particles, a crosslinking agent, and a solvent The compound having a hydrophilic group is chemically bonded through the above-mentioned elements, and the crosslinking agent is an oxazoline crosslinking agent, a carbodiimide crosslinking agent, a blocked isocyanate crosslinking agent, an epoxy crosslinking agent, or a melamine crosslinking agent. A fluid composition comprising at least one selected. 金属粒子と化学結合している化合物が硫黄化合物であることを特徴とする請求項1または4に記載の流動性組成物。 The fluid composition according to claim 1 or 4, wherein the compound chemically bonded to the metal particles is a sulfur compound. 硫黄化合物がメルカプトプロピオン酸、メルカプト酢酸、チオジプロピオン酸、メルカプトコハク酸、メルカプトエタノール、チオジエチレングリコール、チオジグリコール酸、アミノエチルメルカプタン、チオジエチルアミンから選ばれる少なくとも1種であることを特徴とする請求項5に記載の流動性組成物。 The sulfur compound is at least one selected from mercaptopropionic acid, mercaptoacetic acid, thiodipropionic acid, mercaptosuccinic acid, mercaptoethanol, thiodiethylene glycol, thiodiglycolic acid, aminoethyl mercaptan, and thiodiethylamine. Item 6. The fluid composition according to Item 5. 金属粒子と化学結合している化合物の親水性基がカルボキシル基であり、架橋剤がオキサゾリン系架橋剤、カルボジイミド系架橋剤、ブロックイソシアネート系架橋剤、エポキシ系架橋剤、メラミン系架橋剤から選ばれる少なくとも1種であることを特徴とする請求項1または4に記載の流動性組成物。 The hydrophilic group of the compound chemically bonded to the metal particles is a carboxyl group, and the crosslinking agent is selected from oxazoline crosslinking agents, carbodiimide crosslinking agents, blocked isocyanate crosslinking agents, epoxy crosslinking agents, and melamine crosslinking agents. The fluid composition according to claim 1 or 4, wherein the fluid composition is at least one. 金属粒子100重量部に対し架橋剤を0.01〜10重量部の範囲で含むことを特徴とする請求項1または4に記載の流動性組成物。 The fluid composition according to claim 1 or 4, comprising a crosslinking agent in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the metal particles. 金属粒子を構成する金属が、鉄、コバルト、ニッケル、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金、銅、銀及び金からなる群より選ばれる少なくとも1種であることを特徴とする請求項1または4に記載の流動性組成物。 The metal constituting the metal particles is at least one selected from the group consisting of iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, silver, and gold. Or the fluid composition of 4. 金属粒子が銀粒子であることを特徴とする請求項9に記載の流動性組成物。 The fluid composition according to claim 9, wherein the metal particles are silver particles. 更に、水性バインダーを含むことを特徴とする請求項1または4に記載の流動性組成物。 The fluid composition according to claim 1 or 4, further comprising an aqueous binder. 水性バインダーがタンパク質系高分子、水性アクリル樹脂、水性ポリエステル樹脂、水性ウレタン樹脂、水性セルロースから選ばれる少なくとも1種であることを特徴とする請求項11に記載の流動性組成物。 The fluid composition according to claim 11, wherein the aqueous binder is at least one selected from a protein polymer, an aqueous acrylic resin, an aqueous polyester resin, an aqueous urethane resin, and an aqueous cellulose. 請求項1または4に記載の流動性組成物を用いて形成されることを特徴とする電極。 An electrode formed using the flowable composition according to claim 1. 請求項1または4に記載の流動性組成物を用いて形成されることを特徴とする配線パターン。 A wiring pattern formed using the fluid composition according to claim 1. 請求項1または4に記載の流動性組成物を用いて形成されることを特徴とする塗膜。 A coating film formed using the fluid composition according to claim 1. 金属粒子、硬化成分を少なくとも含み、金属粒子の表面には硫黄、窒素、リンから選ばれる少なくとも1種の元素と親水性基とを有する化合物が前記の元素を介して化学結合しており、硬化成分は前記化合物の親水性基と架橋剤が有する活性基とが反応して架橋したものであることを特徴とする塗膜。 A metal particle, containing at least a curing component, and a compound having a hydrophilic group and at least one element selected from sulfur, nitrogen, and phosphorus is chemically bonded to the surface of the metal particle via the element, and cured. The component is a coating film obtained by reacting the hydrophilic group of the compound with the active group of the crosslinking agent to cause crosslinking. 基材の表面の少なくとも一部に、請求項15または16に記載の塗膜を形成したことを特徴とする装飾物品。 A decorative article comprising the coating film according to claim 15 or 16 formed on at least a part of a surface of a substrate.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011093962A (en) * 2009-10-27 2011-05-12 Ishihara Sangyo Kaisha Ltd Metal ink, metal-containing film using the same, and method for producing the same
JP2013211173A (en) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd Conductive paste and conductive circuit
JP2013210498A (en) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd Photosensitive conductive paste and conductive circuit
JP2015162502A (en) * 2014-02-26 2015-09-07 トヨタ紡織株式会社 Method for producing organic inorganic hybrid film, and organic inorganic hybrid film
CN115040699A (en) * 2021-03-09 2022-09-13 上海硕创生物医药科技有限公司 Heat-cured sodium hyaluronate coating, medical catheter and instrument
WO2023282006A1 (en) * 2021-07-07 2023-01-12 キヤノン株式会社 Conductive composition, method for producing same, method for recording conductive image, and conductive image

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002013999A1 (en) * 2000-08-11 2002-02-21 Ishihara Sangyo Kaisha, Ltd. Colloidal metal solution, process for producing the same, and coating material containing the same
JP2002329945A (en) * 2001-04-27 2002-11-15 Harima Chem Inc Method of forming inter-board conductivity, utilizing anisotrop conductive material
JP2003217350A (en) * 2002-01-24 2003-07-31 Nippon Paint Co Ltd Composition for forming conductive pattern and manufacturing method therefor
JP2004043977A (en) * 2003-09-05 2004-02-12 Daiken Kagaku Kogyo Kk Metallic superfine particle and its manufacturing method
WO2005025787A1 (en) * 2003-09-12 2005-03-24 National Institute Of Advanced Industrial Science And Technology Metal nano particle liquid dispersion capable of being sprayed in fine particle form and being applied in laminated state
JP2005163141A (en) * 2003-12-04 2005-06-23 Ishihara Sangyo Kaisha Ltd Copper powder, its production method, flowable composition with the same blended, and electrode obtained by using the same
JP2005251584A (en) * 2004-03-04 2005-09-15 Sekisui Chem Co Ltd Conductive fine particles, anisotropic electrical conducting material and conductive connection structure body
JP2006009125A (en) * 2004-06-29 2006-01-12 Kumamoto Technology & Industry Foundation Surface modified metal fine particle and paste containing this metal fine partice
JP2006196278A (en) * 2005-01-12 2006-07-27 Bando Chem Ind Ltd Composite particle dispersion and its manufacturing method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002013999A1 (en) * 2000-08-11 2002-02-21 Ishihara Sangyo Kaisha, Ltd. Colloidal metal solution, process for producing the same, and coating material containing the same
JP2002329945A (en) * 2001-04-27 2002-11-15 Harima Chem Inc Method of forming inter-board conductivity, utilizing anisotrop conductive material
JP2003217350A (en) * 2002-01-24 2003-07-31 Nippon Paint Co Ltd Composition for forming conductive pattern and manufacturing method therefor
JP2004043977A (en) * 2003-09-05 2004-02-12 Daiken Kagaku Kogyo Kk Metallic superfine particle and its manufacturing method
WO2005025787A1 (en) * 2003-09-12 2005-03-24 National Institute Of Advanced Industrial Science And Technology Metal nano particle liquid dispersion capable of being sprayed in fine particle form and being applied in laminated state
JP2005163141A (en) * 2003-12-04 2005-06-23 Ishihara Sangyo Kaisha Ltd Copper powder, its production method, flowable composition with the same blended, and electrode obtained by using the same
JP2005251584A (en) * 2004-03-04 2005-09-15 Sekisui Chem Co Ltd Conductive fine particles, anisotropic electrical conducting material and conductive connection structure body
JP2006009125A (en) * 2004-06-29 2006-01-12 Kumamoto Technology & Industry Foundation Surface modified metal fine particle and paste containing this metal fine partice
JP2006196278A (en) * 2005-01-12 2006-07-27 Bando Chem Ind Ltd Composite particle dispersion and its manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011093962A (en) * 2009-10-27 2011-05-12 Ishihara Sangyo Kaisha Ltd Metal ink, metal-containing film using the same, and method for producing the same
JP2013211173A (en) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd Conductive paste and conductive circuit
JP2013210498A (en) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd Photosensitive conductive paste and conductive circuit
JP2015162502A (en) * 2014-02-26 2015-09-07 トヨタ紡織株式会社 Method for producing organic inorganic hybrid film, and organic inorganic hybrid film
CN115040699A (en) * 2021-03-09 2022-09-13 上海硕创生物医药科技有限公司 Heat-cured sodium hyaluronate coating, medical catheter and instrument
WO2023282006A1 (en) * 2021-07-07 2023-01-12 キヤノン株式会社 Conductive composition, method for producing same, method for recording conductive image, and conductive image

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