JP2007123802A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of achieving a predetermined inductance value even when displacement occurs between upper/lower dielectric layers. <P>SOLUTION: The electronic component X1 is composed by embedding a coil-like conductor 20 inside a laminate formed by laminating three or more dielectric layers 10. The coil-like conductor 20 is composed so that three or more circular patterns 21, 22 interposed between the dielectric layers 10 adjacent to each other are arranged so as to be at least partially superposed on the other circular patterns 21, 22 adjacent in the laminating direction of the laminate in plane perspective view, and electrically connected with each other through a via-conductor 23, and a pattern width W1 of at least one circular pattern 21 among the three or more circular patterns 21, 22 is made narrower than a pattern width W2 of each of the circular patterns 22 located above and below the circular pattern 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component in which a coiled conductor is embedded in a laminated body formed by laminating dielectric layers.

  Coiled conductors are embedded inside a laminate formed by laminating dielectric layers as electronic components that are mounted on a circuit board together with active elements such as semiconductor elements and transmitter elements, functional elements, etc. to constitute electronic circuits. Electronic components are known.

  Such an electronic component functions as an inductor that temporarily converts applied electric energy into electromagnetic energy. Such an inductor function occurs when a current flows through any conductor. However, when a conductor is configured in a coil shape formed by laminating circular patterns, a magnetic field is generated inside the circular pattern, thereby increasing the magnetic field, thereby further improving the inductor Q value (coil characteristics). To do. That is, the inductance generates a magnetic field (magnetic flux) concentrically around the conductor when a current flows through the conductor. Therefore, when the conductor is formed into a coil shape, the magnetic flux is strengthened in the same direction inside the coil. By adjusting the number of turns, a magnetic field having a strength proportional to the number of turns can be generated, and an inductor having a desired inductance is formed. An inductor having such a configuration is disclosed in Patent Document 1, for example.

Here, a method for manufacturing an electronic component having the above functions will be described. First, an organic binder or solvent is added to and mixed with the aluminum oxide raw material powder to produce a slurry ceramic slurry. Next, the ceramic slurry is formed into a sheet shape using a sheet forming technique (for example, a doctor blade method) to obtain a ceramic green sheet (ceramic green sheet). Next, the obtained ceramic green sheets are laminated up and down in a predetermined order to form a green ceramic molded body. Next, this green ceramic molded body is fired at a high temperature of about 1500 ° C. in a reducing atmosphere. Thus, a desired electronic component is manufactured.
JP 2003-92214 A

  However, in such an electronic component, a positional shift may occur between the upper and lower dielectric layers, and a positional shift may occur between the upper and lower coiled conductors due to the positional shift.

  In such a case, the overlapping width when viewed in plan varies between the surrounding patterns adjacent to each other in the upper and lower directions or the position of the overlapping is shifted, so that the inner conductor and other surrounding patterns adjacent in the stacking direction are stacked. Due to the influence of the capacitance from the grounding conductor adjacent in the direction, there is a problem that a predetermined inductance value cannot be obtained or the position where the inductance is generated is shifted.

  Thus, when the inductance value of an inductor deviates from a predetermined value, the electrical characteristics of the electronic circuit on which the inductor is mounted deteriorates.

  The present invention has been conceived under such circumstances, and an electronic component capable of obtaining a predetermined inductance value even if positional deviation occurs between upper and lower dielectric layers. The purpose is to provide.

An electronic component according to the present invention is an electronic component in which a coiled conductor is embedded in a laminate formed by laminating three or more dielectric layers, and the coiled conductor is interposed between adjacent dielectric layers. on three or more orbiting pattern interposed, it was disposed so that they at least partially overlap with other cyclic pattern and plan perspective that adjoin in the stacking direction of the laminate, electrically connected through via conductor Thus, the pattern width of at least one of the three or more circular patterns is narrower than the pattern width of the circular pattern positioned above and below the pattern width.

  Preferably, the laminated body is formed by laminating four or more dielectric layers, and a pair of ground conductor layers facing the coiled conductor on both sides in the stacking direction of the laminated body with the coiled conductor interposed therebetween are arranged. ing.

  Preferably, among the circular patterns, the circular pattern having a narrow pattern width has a portion where the inner periphery and the outer periphery thereof are located inside the circular pattern arranged above and below, as seen through the laminate.

  Preferably, in the dielectric layer, the thickness between the ground conductor layer and the circumferential pattern adjacent to the ground conductor layer in the laminating direction is larger than the thickness between the circumferential patterns adjacent to each other in the laminating direction.

  Preferably, in the dielectric layer, the relative dielectric constant between the ground conductor layer and the surrounding pattern adjacent to the ground conductor layer in the stacking direction is smaller than the relative permittivity between the surrounding patterns adjacent in the stacking direction. .

  Preferably, the pair of ground conductor layers are electrically connected to each other via at least one through conductor penetrating the multilayer body in the thickness direction.

  Preferably, in each of the three or more circular patterns, the length of the center line passing through the central portion in each width direction is longer than the circular pattern positioned vertically.

  Preferably, the length of the center line of the narrow circular pattern is a length from the via conductor connected to the upper peripheral pattern to the via conductor connected to the lower peripheral pattern. The length of the upper and lower circular patterns is the length from the via conductor connected to the narrow circular pattern to the start or end of the coiled conductor.

  Preferably, corners on the inner periphery and outer periphery of the three or more circulation patterns are formed in an arc shape.

  In the electronic component of the present invention, the pattern width of at least one of the three or more circular patterns is narrower than the pattern width of the circular pattern positioned above and below the pattern. Therefore, in this electronic component, even if a positional deviation (lamination misalignment) occurs between the upper and lower dielectric layers, a circular pattern with a narrow pattern width is from a region that overlaps with a circular pattern adjacent to the upper and lower sides in plan view. Since it is difficult to disengage, occurrence of misalignment between the surrounding patterns, misalignment of overlapping patterns, misalignment of overlapping widths, and the like is suppressed between the upper and lower rotating patterns. Therefore, in this electronic component, since it is suppressed that the area (or position which opposes) the upper and lower surrounding patterns opposes largely from predetermined value, generation | occurrence | production of a new capacitance can be suppressed.

  In addition, this electronic component is a plan view of at least a part of three or more circular patterns in which coiled conductors are interposed between adjacent dielectric layers and other circular patterns adjacent in the stacking direction of the multilayer body. Are arranged so as to overlap each other and electrically connected via via conductors. Therefore, this electronic component can secure a sufficient number of circulation patterns and form an inductor having a high Q value in a small size.

  An electron in which a laminate is formed by laminating four or more dielectric layers, and a pair of ground conductor layers facing the coiled conductor on both sides in the stacking direction of the laminate with the coiled conductor interposed therebetween are arranged. Even when a strong magnetic field is generated in the coiled conductor, the component can suppress leakage of magnetic force to the outside by the pair of ground conductors. Therefore, in this electronic component, since it can suppress that other electronic components etc. are influenced by a magnetic field, it can be set as a more stable electronic component.

  An electronic component having a portion where the inner periphery and outer periphery of a circular pattern having a narrow pattern width among the circular patterns are located inside the circular pattern arranged vertically when the laminated body is seen through the plane is a narrow circular pattern. Substantially overlaps with the upper and lower circular patterns in plan view. Therefore, the electronic component is suitable for increasing the Q value because a magnetic field is generated more effectively.

  An electronic component in which the dielectric layer is thicker than the ground conductor layer and the circumferential pattern adjacent to the ground conductor layer in the stacking direction is larger than the thickness between the peripheral patterns adjacent to each other in the stack direction. And the dielectric layer interposed between the circumferential pattern adjacent to the ground conductor layer in the stacking direction is large. For this reason, in this electronic component, the capacitance generated between the ground conductor layer and the circumferential pattern facing each other can be effectively suppressed to a low level. Therefore, this electronic component has Q = 1 / ωcR (ω: angular frequency (frequency of an electric signal passing through the loop pattern), c: capacitance (capacitance generated between the loop pattern and the ground conductor layer), R: resistance ( It can be seen from the relational expression of the electrical resistance of the circular pattern)) that it is suitable for increasing the Q value.

  An electronic component in which the dielectric constant between the ground conductor layer and the surrounding pattern adjacent to the ground conductor layer in the stacking direction is smaller than the relative permittivity between the surrounding patterns adjacent in the stacking direction is The relative dielectric constant of the dielectric interposed between the ground conductor layer and the circumferential pattern adjacent to the ground conductor layer in the stacking direction is small. For this reason, in this electronic component, the capacitance generated between the ground conductor layer and the circumferential pattern facing each other can be effectively suppressed to a low level. Therefore, it turns out that this electronic component is suitable when raising Q value from the said relational expression.

  An electronic component in which a pair of ground conductor layers are electrically connected to each other via at least one through conductor penetrating the multilayer body in the thickness direction becomes an inductor having a lower electrical resistance of the pair of ground conductor layers. For this reason, the ground potential is further stabilized, and electromagnetic shielding between the coiled conductor and the outside is more effectively performed. Therefore, even when a strong magnetic field is generated in the coiled conductor, the pair of grounded conductor layers can generate a magnetic force. Can be more efficiently suppressed from leaking to the outside. Therefore, in this electronic component, the electromagnetic influence (noise leak etc.) with respect to the exterior can be suppressed more effectively.

  Electronic components in which the length of the center line passing through the center in the width direction of each of the three or more circular patterns is longer than the circular pattern positioned vertically is opposed to each other. Narrow circumferential pattern (because other circumferential patterns are interposed between the upper and lower ground conductor layers), the ratio of the coiled conductor to the total length of the circumferential pattern is almost unaffected by the capacitance from the grounding conductor layer. growing. For this reason, in this electronic component, a positional deviation occurs between the dielectric layers, and even if a positional deviation occurs between the upper and lower circular patterns due to the positional deviation, the capacitance is not changed and a more stable electronic component is provided. Can do.

  Preferably, the length of the center line of the narrow circumferential pattern is a length from the via conductor connected to the upper circumferential pattern to the via conductor connected to the lower circumferential pattern. The length of the upper and lower circular patterns is the length from the via conductor connected to the narrow circular pattern to the start or end of the coiled conductor. In this electronic component, the effective length of the narrow circumferential pattern that is hardly affected by the capacitance from the ground conductor layers facing each other increases the ratio of the effective coil-shaped conductor to the entire circumferential pattern. For this reason, in this electronic component, a positional deviation occurs between the dielectric layers, and even if a positional deviation occurs between the upper and lower coiled conductors due to the positional deviation, the electronic component should be a more stable electronic component that does not change in capacitance. Can do.

  In an electronic component in which the corners of the inner and outer circumferences of three or more circulation patterns are formed in an arc shape, the circle patterns adjacent to each other in the stacking direction overlap each other along the arc in a plan view. Therefore, even if a circular pattern positioned vertically and a circular pattern with a narrow width cause a rotational deviation (θ deviation) during stacking, the rotational deviation occurs along an arc-shaped pattern at the corners. It is possible to prevent the corners of the narrow circular pattern from popping out in plan view from the corners of the circular pattern positioned vertically.

  Therefore, the electronic component can have a higher Q value without being affected by the capacitance from the ground conductor layers facing each other.

  In addition, it is possible to more reliably suppress the areas (or positions) at which the upper and lower circular patterns face each other from deviating from a predetermined value.

  1A and 1B show an electronic component X1 according to a first embodiment of the present invention, in which FIG. 1A is a cross-sectional view taken along line A-A ′, and FIG. 1B is an exploded perspective view thereof. The electronic component X1 includes a plurality (four in this embodiment) of dielectric layers 10, a coiled conductor 20, and a pair of ground conductor layers 30.

  The dielectric layer 10 is made of an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a ceramic sintered body such as a mullite sintered body, an organic resin such as an epoxy resin or a polyimide resin, or an oxide. It is formed of an electrically insulating material such as a composite material formed by bonding inorganic powder such as aluminum with an organic resin such as an epoxy resin.

  Here, an example of a method for producing a laminated body in the case where an aluminum oxide sintered body is employed as a material constituting the dielectric layer 10 will be described. First, a raw material powder such as aluminum oxide (alumina) or glass is mixed with an organic solvent, a binder or the like to produce a slurry ceramic slurry. Next, the produced ceramic slurry is formed into a sheet shape by a predetermined sheet forming technique (for example, a doctor blade method or a calendar roll method) to obtain a ceramic green sheet (ceramic green sheet). Next, the obtained ceramic green sheets are laminated up and down in a predetermined order to form a green ceramic laminate. Next, this green ceramic molded body is fired at a high temperature of about 1300 to 1600 ° C. in a reducing atmosphere. The laminate is produced as described above. The method for manufacturing the dielectric layer 10 is not limited to the above-described manufacturing method, and the dielectric layer 10 may be manufactured by injection molding or transfer molding using the resin.

  The coiled conductor 20 includes the circulation patterns 21 and 22 and the via conductor 23, and is formed by electrically connecting the circulation pattern 21 and the circulation pattern 22 with the via conductor 23. The coiled conductor 20 is embedded in the multilayer body.

  When a current flows through the coiled conductor 20, a magnetic field is generated in each of the circulation patterns 21 and 22 in a direction in which a so-called right-hand screw advances. The magnetic flux generated in each of the circulation patterns 21 and 22 is in the same direction and the magnetic field is strengthened, and an inductance corresponding to the strength (H) of the magnetic field is generated inside the coil. Since the strength of the magnetic field is proportional to the number of turns of the coil, a magnetic field having a predetermined strength can be generated by adjusting the number of layers of the circulation patterns 21 and 22 (two in this embodiment). The electronic component X1 functions as, for example, an inductor due to the inductance generated by the magnetic field.

  The pattern width W1 of the circular pattern 21 is configured to be narrower than the pattern width W2 of the circular pattern 22. Further, the circumferential pattern 21 has a portion where the inner circumference and the outer circumference are located on the inner side in the width direction of the circumferential pattern 22 when the laminated body is seen through the plane.

  Examples of the material constituting the circumferential patterns 21 and 22 and the via conductor 23 include metal materials such as tungsten, molybdenum, manganese, copper, silver, gold, palladium, and platinum.

  Here, an example of a method of forming the circulation patterns 21 and 22 in the case where copper is adopted as the material constituting the circulation patterns 21 and 22 will be described. First, a copper paste is prepared. Next, this copper paste is printed on the surface of the ceramic green sheet to be the dielectric layer 10 by a predetermined printing method (for example, a screen printing method). As described above, the circulation patterns 21 and 22 are formed.

  In addition, the via conductor 23 has a through hole (not shown) formed in a predetermined part (a part connecting the upper and lower circumferential patterns) of the ceramic green sheet to be the dielectric layer 10, for example. Further, it can be formed by filling the same metal paste as that for forming the circular patterns 21 and 22.

  The circular patterns 21 and 22 are, for example, a frame shape or an annular pattern formed along the outer periphery between the layers of the rectangular dielectric layer 10, and non-formed portions are formed on the entire periphery or a part of the layers. Including what you have.

  The ground conductor layer 30 is provided so as to face the circumferential patterns 21 and 22 on both sides in the stacking direction of the multilayer body with the coiled conductor 20 interposed therebetween.

  In the electronic component X1 according to this embodiment, the pattern width W1 of one of the three patterns 21 and 22 is made narrower than the pattern width W2 of the pattern 22 positioned above and below the pattern. . Therefore, in the electronic component X1, even if a positional deviation (lamination misalignment) occurs between the upper and lower dielectric layers 10, the circular pattern 21 deviates from the region overlapping the adjacent circular patterns 22 in the plan view. Since it becomes difficult, the occurrence of misalignment between the revolving patterns 21, misalignment of overlapping positions, misalignment of overlapping widths, etc. is suppressed between the revolving patterns 22. Therefore, in the electronic component X1, since it is suppressed that the area (and the position which opposes) the upper and lower surrounding patterns 22 opposes largely from predetermined value, generation | occurrence | production of a new capacitance can be suppressed.

  The electronic component X1 includes three circular patterns 21 and 22 in which the coiled conductor 20 is interposed between adjacent dielectric layers 10, and at least a part of the circular patterns 21 adjacent in the stacking direction of the stacked body. , 22 are arranged so as to overlap with each other in plan view, and are electrically connected via via conductors 23. Therefore, the electronic component X1 can secure a sufficient number of the circulation patterns 21 and 22 and can form an inductor having a high Q value in a small size.

  The electronic component X1 is formed by stacking four dielectric layers 10 on the laminate, and a pair of coil conductors 20 facing the coil conductor 20 on both sides in the stacking direction of the laminate. A ground conductor layer 30 is disposed. Therefore, in the electronic component X1, even when a strong magnetic field is generated in the coiled conductor 20, the magnetic field extends from the one end of the coiled conductor to the other end (in the stacking direction). Since it is formed by the magnetic flux penetrating, it is blocked by the pair of ground conductor layers 30 and is prevented from leaking to the outside. Therefore, the electronic component X1 can suppress other electronic components from being affected by a magnetic field, and thus constitutes a more reliable electronic device (communication device such as a mobile phone or a wireless LAN, a computer) or the like. The electronic component can be made.

  In the electronic component X <b> 1, the inner periphery and the outer periphery of the circulation pattern 21 have portions located inside the circulation pattern 22 arranged vertically when the laminate is seen through in a plan view. Therefore, in the electronic component X1, the circulation pattern 21 overlaps with the upper and lower circulation patterns 22 in plan view in substantially the entire region. Therefore, the electronic component X1 is suitable for increasing the Q value because the magnetic field is generated more effectively.

  2A and 2B show an electronic component X2 according to the second embodiment of the present invention, in which FIG. 2A is a B-B ′ sectional view and FIG. 2B is an exploded perspective view thereof. In the electronic component X2, in the dielectric layer 10, the thickness between the grounding conductor layer 30 and the circumferential pattern 22 adjacent to the grounding conductor layer 30 in the stacking direction is equal to the thickness of the surrounding patterns 21 and 22 adjacent in the stacking direction. It differs from the electronic component X1 in that it is larger than the thickness between them. Other configurations of the electronic component X2 are the same as those described above regarding the electronic component X1.

  In the dielectric layer 10, the thickness between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the stacking direction is the thickness between the peripheral patterns 21 and 22 adjacent in the stacking direction. For example, the thickness of the ceramic green sheet itself constituting the dielectric layer 10 between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the laminating direction may be used as a method of making the thickness larger than the above. Examples thereof include a method of increasing the thickness and a method of increasing the number of layers to be stacked.

  In the electronic component X2 according to this embodiment, the thickness of the dielectric interposed between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the stacking direction is large. Therefore, in the electronic component X2, the capacitance generated between the ground conductor layer 30 and the circumferential pattern 22 that are opposed to each other can be effectively reduced. Therefore, the electronic component X2 has Q = 1 / ωcR (ω: angular frequency (frequency of an electric signal passing through the circulation pattern)), c: capacitance (capacitance generated between the circulation pattern and the ground conductor layer), R: resistance ( It can be seen from the relational expression of the electrical resistance of the circular pattern)) that it is suitable for increasing the Q value.

  In the electronic component X3 according to the third embodiment of the present invention, the dielectric layer 10 has a dielectric constant between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the stacking direction. It differs from the electronic component X1 in that it is smaller than the relative dielectric constant between the circumferential patterns 21 and 22 adjacent in the stacking direction. Other configurations of the electronic component X3 are the same as those described above regarding the electronic component X1.

In the dielectric layer 10, the relative dielectric constant between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the stacking direction is set between the peripheral patterns 21 and 22 adjacent in the stacking direction. As a method for reducing the dielectric constant relative to the relative dielectric constant, for example, the dielectric layer 10 is made of a metal composite oxide such as silver (Ag), aluminum (Al), or silicon (Si) (for example, AgO ₃ , Al ₂ O ₃ , And a method of adding SiO ₂ or the like.

  In the electronic component X3 according to the present embodiment, the relative dielectric constant of a dielectric interposed between the ground conductor layer 30 and the circumferential pattern 22 adjacent to the ground conductor layer 30 in the stacking direction is small. Therefore, in the electronic component X3, the capacitance generated between the ground conductor layer 30 and the circumferential pattern 22 that are opposed to each other can be effectively reduced. Therefore, it turns out that this electronic component is suitable when raising Q value from the said relational expression.

  3A and 3B show an electronic component X4 according to the fourth embodiment of the present invention, in which FIG. 3A is a C-C ′ cross-sectional view and FIG. 3B is an exploded perspective view thereof. The electronic component X4 differs from the electronic component X1 in that the pair of ground conductor layers 30 are electrically connected to each other via at least one through conductor 40 that penetrates the multilayer body in the thickness direction. Other configurations of the electronic component X4 are the same as those described above regarding the electronic component X1. In FIG. 3, the same parts as those in FIG.

  In the electronic component X4 according to this embodiment, the pair of ground conductor layers 30 are electrically connected to each other via at least one through conductor 40 that penetrates the multilayer body in the thickness direction. Layer 30 becomes a lower inductor. Therefore, the ground potential is further stabilized, and electromagnetic shielding between the coiled conductor 20 and the outside is more effectively performed. Therefore, even when a strong magnetic field is generated in the coiled conductor 20, the pair of ground conductor layers The leakage of the magnetic force to the outside by 30 can be more efficiently suppressed. Therefore, in this electronic component X4, the electromagnetic influence (noise leakage etc.) with respect to the exterior can be suppressed more effectively.

  The through conductor 40 can be formed by the same material and method as the via conductor 23, for example. If the through conductor 40 is made of copper, for example, a through hole (not shown) is formed so as to communicate from the upper layer to the lower layer when stacked on a plurality of ceramic green sheets to be the dielectric layer 10. The through conductor 40 is formed by filling the through hole with a copper paste.

  In the electronic components X1 to X4 of the present invention, the length of the center line passing through the central part in each width direction in each of the three or more circulation patterns 21 and 22 is greater than the circulation pattern 22 positioned above and below. However, it is preferable that the narrow circumferential pattern 21 is long.

  With this configuration, a narrow circumferential pattern 21 that is hardly affected by the capacitance from the ground conductor layers 30 facing each other (because other circumferential patterns 22 are interposed between the upper and lower ground conductor layers 30), The ratio of the coiled conductor to the entire length of the winding pattern is increased. For this reason, in this electronic component, a positional deviation occurs between the dielectric layers 10, and even if a positional deviation occurs between the upper and lower circumferential patterns 21 and 22 due to the positional deviation, the capacitance does not change and more electrical characteristics are obtained. Can be a stable electronic component.

  Moreover, the length of the center line which passes through the center part of each width direction in each of the three or more circular patterns 21 and 22 is smaller than the circular pattern 22 positioned above and below. When the pattern 21 is long, the length of the center line of the narrow circular pattern 21 is connected to the lower circular pattern 22 starting from the via conductor 23 connected to the upper peripheral pattern 22. The starting portion or the terminal end of the coiled conductor 20 starts from the via conductor 23 connected to the narrow circumferential pattern 21. It is even more preferable that the length is up to the portion.

  With this configuration, the effective length of the narrow circumferential pattern 21 that is hardly affected by the capacitance from the ground conductor layers 30 facing each other increases the ratio of the effective coil-shaped conductor to the entire circumferential pattern length. Therefore, in this electronic component, a positional deviation occurs between the dielectric layers 10, and even if a positional deviation occurs between the upper and lower circular patterns 21 and 22 due to the positional deviation, the capacitance does not change and is more stable. It can be an electronic component.

  Moreover, in the electronic components X1 to X4 of the present invention, it is preferable that the inner and outer corners of the three or more circulation patterns 21 and 22 are formed in an arc shape.

  In this case, even if the circular pattern 22 positioned above and below and the circular pattern 21 having a narrow width cause a rotational shift (θ shift) at the time of stacking, the circular pattern 22 in which corners of the circular pattern 21 having a narrow width are positioned vertically. Jumping out from the corners in a plan view is suppressed.

  Therefore, this electronic component can further increase the Q value without being affected by the capacitance from the ground conductor layers 30 facing each other.

  In addition, it is more reliably suppressed that the area (or the position at which they face each other) between the upper and lower circular patterns 21 and 22 are greatly deviated from a predetermined value.

  In addition, when making the corner | angular part of the circulation patterns 21 and 22 into circular arc shape, it is preferable to make the curvature radius of an arc the same between the upper and lower circulation patterns 21 and 22, and also on the outer peripheral side and the inner peripheral side. More preferably, the radius of curvature is approximately concentric. By adopting such a shape, even if a rotational deviation (θ deviation) occurs during stacking, the corner of the circular pattern 21 having a narrow width can jump out from the corner of the circular pattern 22 positioned above and below in plan view. , More suppressed.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  The electronic component X1 is not limited to being used alone as an inductor, but has a built-in inductance function and other functions (an antenna function, a function of mounting an electronic component element such as a semiconductor element, a piezoelectric element, or a sensor element). May be provided.

The electronic component which concerns on the 1st Embodiment of this invention is represented, (a) is the sectional drawing, (b) is the disassembled perspective view. (A) is A-A 'sectional drawing of (b). The electronic component which concerns on the 2nd Embodiment of this invention is represented, (a) is the sectional drawing, (b) is the disassembled perspective view. (A) is B-B 'sectional drawing of (b). The electronic component which concerns on the 4th Embodiment of this invention is represented, (a) is the sectional drawing, (b) is the disassembled perspective view. (A) is C-C 'sectional drawing of (b).

Explanation of symbols

X Electronic component 10 Dielectric layer 20 Coiled conductors 21 and 22 Circulating pattern 23 Via conductor 30 Grounding conductor layer 40 Through conductor

Claims (9)

An electronic component in which a coiled conductor is embedded in a laminate formed by laminating three or more dielectric layers, wherein the coiled conductor is interposed between adjacent dielectric layers. Are arranged such that at least a part of the circular pattern overlaps with another circular pattern adjacent in the stacking direction of the laminate in plan view, and is electrically connected via a via conductor, An electronic component, wherein a pattern width of at least one of the circulation patterns is narrower than a pattern width of a circulation pattern positioned above and below the pattern. The laminated body is formed by laminating four or more dielectric layers, and a pair of ground conductor layers facing the coiled conductor on both sides in the stacking direction of the laminated body with the coiled conductor interposed therebetween are arranged. The electronic component according to claim 1, wherein the electronic component is provided. Among the circular patterns, the circular pattern having a narrow pattern width has a portion in which an inner periphery and an outer periphery thereof are located inside the circular pattern arranged above and below when seen in a plan view of the stacked body. The electronic component according to claim 1 or claim 2. In the dielectric layer, a thickness between the ground conductor layer and the circumferential pattern adjacent to the ground conductor layer in the stacking direction is larger than a thickness between the peripheral patterns adjacent to each other in the stacking direction. The electronic component according to claim 2, wherein the electronic component is large. The dielectric layer has a relative dielectric constant between the ground patterns adjacent to each other in the stacking direction such that a relative dielectric constant between the ground conductor layer and the loop pattern adjacent to the ground conductor layer in the stacking direction. The electronic component according to claim 2, wherein the electronic component is smaller than the rate. The pair of ground conductor layers are electrically connected to each other through at least one through conductor that penetrates the multilayer body in the thickness direction. Electronic components. The length of the center line passing through the central portion in each width direction in each of the three or more circular patterns is longer than the circular pattern positioned above and below. The electronic component in any one of Claims 1-6. The length of the center line of the narrow circular pattern is the length from the via conductor connected to the upper peripheral pattern to the via conductor connected to the lower peripheral pattern, The length of the upper and lower circular patterns is a length from a via conductor connected to the narrow circular pattern to a starting point or a terminal part of a coiled conductor. 7. The electronic component according to 7. The electronic component according to any one of claims 1 to 8, wherein corners of an inner periphery and an outer periphery of the three or more circulation patterns are formed in an arc shape.

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