JP2007123642A - Method of manufacturing solid-state imaging apparatus and sealing device therefor - Google Patents

Method of manufacturing solid-state imaging apparatus and sealing device therefor Download PDF

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JP2007123642A
JP2007123642A JP2005315524A JP2005315524A JP2007123642A JP 2007123642 A JP2007123642 A JP 2007123642A JP 2005315524 A JP2005315524 A JP 2005315524A JP 2005315524 A JP2005315524 A JP 2005315524A JP 2007123642 A JP2007123642 A JP 2007123642A
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package
state imaging
solid
imaging device
adhesive
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Hiroto Osaki
裕人 大崎
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To easily fix mobile dust which is mixed into a package and affects an image property without adding any other member. <P>SOLUTION: When manufacturing a solid-state imaging apparatus by sealing a transparent window member such as a glass pane 11 onto a recessed package 1 internally disposing a solid-state imaging device 3 before mounting the glass pane 11, mobile dust 12 entering the packet 1 is fixed by sticking the dust over adhesives 10 previously provided for fixing the glass pane 11 onto the package 1. For example, the adhesives 10 are semi-hardened, and then the package 1 is tilted, so that the dust 12 is forcibly moved to be stuck on the semi-hardened adhesives 10 and the adhesives 10 are the hardened completely. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、固体撮像素子をパッケージ内に配置した固体撮像装置の製造方法およびそのための封着装置に関し、特にパッケージ内に混入した移動性ダストによる画素欠陥を防止する技術に関するものである。   The present invention relates to a method for manufacturing a solid-state imaging device in which a solid-state imaging device is arranged in a package and a sealing device therefor, and more particularly to a technique for preventing pixel defects caused by mobile dust mixed in the package.

固体撮像素子をパッケージ内に配置した固体撮像装置を製造する従来の製造方法を図６および図７に示す。図６は固体撮像装置の組立フロー図、図７は同フローに沿って組立てられていく固体撮像装置の断面を示している。図６のフローに沿って、図７を参照しながら説明する。   6 and 7 show a conventional manufacturing method for manufacturing a solid-state imaging device in which a solid-state imaging element is arranged in a package. FIG. 6 is an assembly flow diagram of the solid-state imaging device, and FIG. 7 is a cross-sectional view of the solid-state imaging device assembled along the flow. A description will be given along the flow of FIG. 6 with reference to FIG.

まず、図７（ａ）に示すように、パッケージ１の凹部２の底面に、撮像機能を有する固体撮像素子３を熱硬化型樹脂からなる固着材４を介して搭載し、熱印加によって固着させる（図６の工程Ｓ１）。そして、図７（ｂ）に示すように、固体撮像素子３の電極５とパッケージ１の凹部２内の内部端子６とを金ワイヤー７でボンディングし、それにより固体撮像素子３をパッケージ１外の外部端子８まで電気的に導通させる（図６、Ｓ２）。   First, as shown in FIG. 7A, a solid-state imaging device 3 having an imaging function is mounted on the bottom surface of the recess 2 of the package 1 via a fixing material 4 made of a thermosetting resin, and is fixed by heat application. (Step S1 in FIG. 6). 7B, the electrode 5 of the solid-state image sensor 3 and the internal terminal 6 in the recess 2 of the package 1 are bonded with a gold wire 7, thereby the solid-state image sensor 3 is attached to the outside of the package 1. Electrical connection is made up to the external terminal 8 (FIG. 6, S2).

次に、図７（ｃ）に示すように、パッケージ１の上面９に熱或いは紫外線もしくは両者により硬化する接着剤１０を塗布し（図６、Ｓ３）、図７（ｄ）に示すようにガラス板１１などの透明窓部材を搭載する（図６、Ｓ４）。その後に、図７（ｅ）に示すように、接着剤１０の性質に応じて、熱硬化型であれば熱硬化炉内にて１５０℃で約９０分放置し、また紫外線硬化型であれば約２分の紫外線照射の後に熱硬化炉内にて１５０℃で約６０分放置することにより、接着剤１０を硬化させて、ガラス板１１を固着させる（図６、Ｓ５）。その後に画像特性検査などの検査を行う（図６、Ｓ６）。   Next, as shown in FIG. 7C, an adhesive 10 that is cured by heat, ultraviolet light, or both is applied to the upper surface 9 of the package 1 (FIG. 6, S3), and glass as shown in FIG. 7D. A transparent window member such as the plate 11 is mounted (FIG. 6, S4). After that, as shown in FIG. 7 (e), depending on the properties of the adhesive 10, if it is a thermosetting type, it is allowed to stand at 150 ° C. for about 90 minutes in a thermosetting furnace. After being irradiated with ultraviolet rays for about 2 minutes, the adhesive 10 is cured by being left in a thermosetting furnace at 150 ° C. for about 60 minutes, thereby fixing the glass plate 11 (FIG. 6, S5). Thereafter, an inspection such as an image characteristic inspection is performed (S6 in FIG. 6).

ところで、ガラス板１１を搭載するまでの工程で、図８（ａ）に示すようにパッケージ１内にダスト１２が混入することがある。その後の検査工程（画像特性検査）では、図８（ｂ）に示すように、固体撮像素子３の有効画素領域Ａ１外あるいはガラス板１１の画像有効領域Ａ２外にダスト１２が存在していれば、良品と判定される。しかし組立て後の輸送や使用状況等によってダスト１２が移動して、図８（ｃ）に示すように、固体撮像素子３の有効画素上やガラス板１１の画像有効領域Ａ２内に付着すると、画素欠陥が生じ、不良となる。   By the way, in the process until the glass plate 11 is mounted, dust 12 may be mixed in the package 1 as shown in FIG. In the subsequent inspection process (image characteristic inspection), if dust 12 exists outside the effective pixel area A1 of the solid-state imaging device 3 or outside the image effective area A2 of the glass plate 11, as shown in FIG. It is determined that the product is non-defective. However, if the dust 12 moves due to transportation or usage conditions after assembly and adheres to the effective pixels of the solid-state imaging device 3 or the image effective area A2 of the glass plate 11 as shown in FIG. Defects occur and become defective.

つまり、パッケージ１内に混入した移動性のダスト１２について、画像に影響を及ぼす領域（固体撮像素子３の有効画素領域４５、ガラス板１１の画像有効領域４６）内に存在しないことが間接的にわかるものの、前記領域外に存在するか否かを検知することはできず、その後に不良が発生する原因となっている。換言すると、メーカの組立工程内でダスト１２の混入を発見することは困難であり、ユーザへの出荷後に不良が発生することになるもので、非常に取り扱いにくい不良モードである。このようなダスト１２はサイズも数μｍと非常に小さいため、目視検査でも発見が困難である。   That is, it is indirectly that the movable dust 12 mixed in the package 1 does not exist in the area that affects the image (the effective pixel area 45 of the solid-state imaging device 3 and the image effective area 46 of the glass plate 11). As can be seen, it is not possible to detect whether or not it exists outside the region, which causes a defect after that. In other words, it is difficult to find out that the dust 12 is mixed in the assembly process of the manufacturer, and a defect will occur after shipment to the user. This is a defect mode that is very difficult to handle. Such dust 12 has a very small size of several μm and is difficult to find even by visual inspection.

このような不良を防止するために、図９（ａ）に示すように、パッケージ１内における固体撮像素子３表面を除く領域に粘着材１３を貼り付けておくことが提案されている。組立工程内で発見されなかったダスト１２が移動あるいは浮遊しても、図９（ｂ）に示すように粘着材１３に捕捉されることになる（特許文献１）。
特開昭６１−３４５３号公報 In order to prevent such a defect, as shown in FIG. 9A, it has been proposed to attach an adhesive material 13 to a region other than the surface of the solid-state imaging device 3 in the package 1. Even if the dust 12 not found in the assembly process moves or floats, it is captured by the adhesive 13 as shown in FIG. 9B (Patent Document 1).
Japanese Patent Laid-Open No. 61-3453

しかし特許文献１の方法では、ダスト１２を捕捉するための粘着材１３を取り付ける工程を追加する必要があり、またパッケージ１の小型化が進むにしたがって粘着材１３を貼り付けるスペースがなくなってきている。粘着材１３から発生するシロキサン等のガスが固体撮像素子の信頼性に影響を及ぼすことも懸念される。   However, in the method of Patent Document 1, it is necessary to add a process of attaching the adhesive material 13 for capturing the dust 12, and the space for attaching the adhesive material 13 is becoming smaller as the package 1 becomes smaller. . There is also a concern that a gas such as siloxane generated from the adhesive material 13 affects the reliability of the solid-state imaging device.

本発明は上記問題を解決するもので、パッケージ内に混入して画像特性に影響を与える移動性のダストを別部材を追加することなく簡単に固定化できるようにすることを目的とする。   SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and to make it possible to easily fix mobile dust mixed in a package and affecting image characteristics without adding another member.

上記課題を解決するために、本発明の固体撮像装置の製造方法は、固体撮像素子を内部に配置した凹状のパッケージに透明窓部材を封着して固体撮像装置を製造する際に、前記透明窓部材の搭載前にパッケージ内に侵入した移動性のダストを、前記透明窓部材をパッケージに固定するために予め設けた接着剤に付着させて固定化することを特徴とするもので、透明窓部材をパッケージに貼り付けるための接着剤を利用して、別途の部材を追加することなく、移動性ダストを簡単に固定化することができる。   In order to solve the above-mentioned problems, the method for manufacturing a solid-state imaging device according to the present invention is characterized in that the transparent window member is sealed in a concave package in which a solid-state imaging device is disposed to manufacture the solid-state imaging device. Movable dust that has entered the package before mounting the window member is fixed by attaching it to an adhesive provided in advance to fix the transparent window member to the package. By using an adhesive for attaching the member to the package, the movable dust can be easily fixed without adding a separate member.

詳細には、透明窓部材とパッケージとの間の接着剤を半硬化させてから、前記パッケージを傾けることにより、あるいは前記パッケージを高速で回転させることにより、パッケージ内に存在するダストを強制的に移動させて前記接着剤に付着させ、その後に接着剤を完全硬化させることができる。接着剤の硬化を半硬化と完全硬化という２段階で行い、且つダストを重力により或いは遠心力により強制的に接着剤側に移動させるようにしたもので、粘着性が残った接着剤でダストを捕捉して確実に固定化することができる。パッケージを傾ける角度は、固体撮像素子の上面が上下方向〜下向きとなる角度である。接着剤としては、熱硬化型樹脂または紫外線硬化型樹脂を使用することができる。   Specifically, after the adhesive between the transparent window member and the package is semi-cured, the dust existing in the package is forced by tilting the package or rotating the package at a high speed. It can be moved and attached to the adhesive, after which the adhesive can be fully cured. The adhesive is cured in two steps, semi-curing and complete curing, and the dust is forced to move to the adhesive side by gravity or by centrifugal force. It can be captured and fixed securely. The angle at which the package is tilted is an angle at which the upper surface of the solid-state imaging device is in the vertical direction to the downward direction. As the adhesive, a thermosetting resin or an ultraviolet curable resin can be used.

上記した固体撮像装置の製造方法で使用する封着装置は、透明窓部材との間の接着剤が半硬化されたパッケージを固定するステージと、前記パッケージが固定されたステージを所望の角度まで所望の速度で回転させる回転機構とを備えた構造とすることができる。   The sealing device used in the above-described method for manufacturing a solid-state imaging device includes a stage for fixing a package in which the adhesive between the transparent window member is semi-cured and a stage to which the package is fixed to a desired angle. And a rotation mechanism that rotates at a speed of 5 mm.

本発明の固体撮像装置の製造方法によれば、透明窓部材をパッケージに貼り付けるための接着剤を利用して移動性ダストを固定化することができ、ダストに起因する画像欠陥を防止できる。別途の部材を追加しないので、工程を一部変更するだけでよく、パッケージ内に設置スペースを要することもなく、また固体撮像素子の信頼性に影響を及ぼすガスの発生も回避できる。   According to the method for manufacturing a solid-state imaging device of the present invention, the movable dust can be fixed using an adhesive for attaching the transparent window member to the package, and image defects caused by the dust can be prevented. Since a separate member is not added, it is only necessary to change a part of the process, no installation space is required in the package, and generation of gas that affects the reliability of the solid-state imaging device can be avoided.

この固体撮像装置の製造方法で使用する封着装置を、パッケージを固定するステージを所望の角度まで所望の速度で回転させ得る構造としたことにより、パッケージ内に存在するダストを強制的に接着剤側に移動させるのが容易になる。   The sealing device used in the manufacturing method of the solid-state imaging device has a structure in which the stage for fixing the package can be rotated to a desired angle at a desired speed, thereby forcing the dust present in the package to be an adhesive. Easy to move to the side.

以下、本発明の実施の形態を図面を参照しながら説明する。
図１から図３は、本発明の第１の実施形態における固体撮像装置の製造方法を示す。固体撮像装置は、固体撮像素子をパッケージ内に配置した構造である。図１は同固体撮像装置の組立フロー図、図２および図３は同フローに沿って組立てられていく固体撮像装置の断面を示している。図１のフローに沿って、図２、図３を参照しながら説明する。 Embodiments of the present invention will be described below with reference to the drawings.
1 to 3 show a method for manufacturing a solid-state imaging device according to the first embodiment of the present invention. The solid-state imaging device has a structure in which a solid-state imaging device is arranged in a package. FIG. 1 is an assembly flow diagram of the solid-state imaging device, and FIGS. 2 and 3 show cross sections of the solid-state imaging device assembled along the flow. A description will be given along the flow of FIG. 1 with reference to FIGS.

まず、図２（ａ）に示すように、パッケージ１の凹部２の底面に、撮像機能を有する固体撮像素子３を熱硬化型樹脂からなる固着材４を介して搭載し、熱印加によって固着させる（図１の工程Ｓ１）。そして、図２（ｂ）に示すように、固体撮像素子３の電極５とパッケージ１の凹部２内の内部端子６とを金ワイヤー７でボンディングし、それにより固体撮像素子３をパッケージ１外の外部端子８まで電気的に導通させる（図１、Ｓ２）。   First, as shown in FIG. 2A, a solid-state imaging device 3 having an imaging function is mounted on the bottom surface of the recess 2 of the package 1 via a fixing material 4 made of a thermosetting resin, and is fixed by heat application. (Step S1 in FIG. 1). Then, as shown in FIG. 2B, the electrode 5 of the solid-state imaging device 3 and the internal terminal 6 in the recess 2 of the package 1 are bonded with a gold wire 7, whereby the solid-state imaging device 3 is attached outside the package 1. Electrical connection is made to the external terminal 8 (FIG. 1, S2).

次に、図２（ｃ）に示すように、パッケージ１の上面９に、熱或いは紫外線もしくは両者により硬化する接着剤１０を塗布し（図１、Ｓ３）、図２（ｄ）に示すようにガラス板１１などの透明窓部材を搭載する（図１、Ｓ４）。接着剤１０は、例えばエポキシを主成分とし、硬化剤を添加した樹脂である。図中の１２はガラス板１１の搭載に先立ってパッケージ１内に侵入した移動性のダスト、例えばパッケージの一部が欠落したセラミック片や樹脂片、その他製造装置の摺動部から発塵する金属片等である。   Next, as shown in FIG. 2 (c), an adhesive 10 that is cured by heat, ultraviolet light or both is applied to the upper surface 9 of the package 1 (FIG. 1, S3), as shown in FIG. 2 (d). A transparent window member such as a glass plate 11 is mounted (FIG. 1, S4). The adhesive 10 is, for example, a resin mainly composed of epoxy and added with a curing agent. Reference numeral 12 in the figure denotes mobile dust that has entered the package 1 prior to the mounting of the glass plate 11, for example, ceramic pieces or resin pieces from which a part of the package is missing, or other metal that generates dust from the sliding portion of the manufacturing apparatus. It is a piece.

次に、図３（ａ）に示すように、接着剤１０の性質に応じて、熱硬化型であれば熱硬化炉内にて１５０℃程度で５分から１０分程度の短時間の熱印加を行い、また紫外線硬化型であれば５秒から１０秒程度の短時間の紫外線照射を行うことにより、接着剤１０を半硬化させる（図１、Ｓ５−１）。ここで接着剤１０の半硬化とは、完全に硬化せず粘着性が残っていることを言い、ガラス板１１は、外力によって移動することがないように固定されている状態である。   Next, as shown in FIG. 3A, depending on the properties of the adhesive 10, if it is a thermosetting type, a short time heat application at about 150 ° C. for about 5 to 10 minutes is performed in a thermosetting furnace. If it is an ultraviolet curable type, the adhesive 10 is semi-cured by irradiating ultraviolet rays for a short time of about 5 to 10 seconds (FIG. 1, S5-1). Here, the semi-curing of the adhesive 10 means that the adhesive 10 is not completely cured and remains tacky, and the glass plate 11 is in a state of being fixed so as not to move by an external force.

そしてその状態で、図３(ｂ)に示すように、パッケージ１を治具２１に固定したうえで、固体撮像素子３の上面（ここではガラス板１１と平行である）が横方向（上向き）から上下方向（あるいは下向き）へと向きを変えるように９０度以上回転させ、停止させる（図１、Ｓ５−２）。   In this state, as shown in FIG. 3B, the package 1 is fixed to the jig 21, and the upper surface of the solid-state imaging device 3 (here, parallel to the glass plate 11) is lateral (upward). Rotate 90 degrees or more to change the direction from the vertical direction (or downward) to stop (FIG. 1, S5-2).

このことにより、パッケージ１内に侵入して固体撮像素子３の周辺の凹部２内面に付着していたダスト１２は、主に重力によってガラス板１１側へ移動し、ガラス板１１とパッケージ１の上面９との間から幾分か染み出している半硬化状態の接着剤１０の内周部分に捕捉される。   As a result, the dust 12 that has entered the package 1 and has adhered to the inner surface of the recess 2 around the solid-state imaging device 3 moves mainly to the glass plate 11 side by gravity, and the upper surface of the glass plate 11 and the package 1. 9 is trapped in the inner peripheral portion of the semi-cured adhesive 10 that is somewhat oozing out from between.

なお治具２１は、封着装置の一部をなすもので、パッケージ１を固定するための固定部２２が設けられたステージ２３と、ステージ２３を所望の角度まで所望の速度で回転させる回転軸２４などの回転機構とを有している。ここでは固定部２２として、真空ポンプ（図示せず）に接続する真空吸着路を示している。   Note that the jig 21 is a part of the sealing device, and includes a stage 23 provided with a fixing portion 22 for fixing the package 1 and a rotating shaft that rotates the stage 23 to a desired angle at a desired speed. 24 and the like. Here, a vacuum suction path connected to a vacuum pump (not shown) is shown as the fixing portion 22.

パッケージ１の回転停止のしばらく後に、接着剤１０の性質に応じて、図３(ｃ)に示すように、熱硬化型であれば熱硬化炉内にて１５０℃で約９０分放置し、また紫外線硬化型であれば約２分程度の紫外線照射の後に熱硬化炉内にて１５０℃で約６０分放置することにより、半硬化状態の接着剤１０を完全硬化させる（図１、Ｓ５−３）。このことにより、ガラス板１１がパッケージ１に固着されるとともに、その接着剤１０上のダスト１２が確実に固定される。   Some time after the rotation of the package 1 is stopped, depending on the properties of the adhesive 10, as shown in FIG. 3C, if it is a thermosetting type, it is left in a thermosetting furnace at 150 ° C. for about 90 minutes. In the case of the ultraviolet curable type, the semi-cured adhesive 10 is completely cured by leaving it at 150 ° C. for about 60 minutes in the thermosetting furnace after being irradiated with ultraviolet rays for about 2 minutes (FIG. 1, S5-3). ). As a result, the glass plate 11 is fixed to the package 1 and the dust 12 on the adhesive 10 is securely fixed.

このようにして組立てられた固体撮像装置について、特性検査装置で画像特性を検査する（図１、Ｓ６）。
以上の方法によれば、接着剤１０の硬化を半硬化と完全硬化という２段階で行い、且つパッケージ１を回転させる（傾ける）ことでダスト１２を強制的に接着剤１０側に移動させるようにしたので、粘着性が残った接着剤１０でダスト１２を捕捉し確実に固定化することができる。 The solid state imaging device thus assembled is inspected for image characteristics by the characteristic inspection device (FIG. 1, S6).
According to the above method, the adhesive 10 is cured in two stages of semi-curing and complete curing, and the dust 12 is forcibly moved to the adhesive 10 side by rotating (tilting) the package 1. Therefore, the dust 12 can be captured and fixed with certainty by the adhesive 10 that remains tacky.

図４は、本発明の第２の実施形態における固体撮像装置の製造方法を説明する組立フロー図、図５は同フローに沿って組立てられる途中の固体撮像装置の断面を示す。
この第２の実施形態の方法が上述した第１の実施形態の方法と相違するのは、パッケージ１の上面９とガラス板１１などの透明窓部材との間の接着剤１０を半硬化させた状態で、図５に示すように、パッケージ１を治具２１に固定したうえで、ガラス１１が外側になるように高速で回転させる点である（図４、Ｓ５−２´）。回転後には、第１の実施形態の方法と同様に、固体撮像素子３の上面が上下方向（あるいは下向き）となるように停止させる。 FIG. 4 is an assembly flow diagram illustrating a method for manufacturing a solid-state imaging device according to the second embodiment of the present invention, and FIG. 5 is a cross-sectional view of the solid-state imaging device being assembled along the flow.
The difference between the method of the second embodiment and the method of the first embodiment is that the adhesive 10 between the upper surface 9 of the package 1 and the transparent window member such as the glass plate 11 is semi-cured. In this state, as shown in FIG. 5, after fixing the package 1 to the jig 21, the glass 11 is rotated at a high speed so as to be on the outside (FIG. 4, S5-2 ′). After the rotation, similarly to the method of the first embodiment, the upper surface of the solid-state imaging device 3 is stopped so as to be in the vertical direction (or downward).

このことにより、パッケージ１内に侵入して固体撮像素子３の周辺の凹部２内面に付着していたダスト１２は、遠心力と重力とによりガラス板１１側へ移動し、ガラス板１１とパッケージ１の上面９との間から幾分か染み出している半硬化状態の接着剤１０の内周部分に捕捉され、接着剤１０の完全硬化を経て確実に固定される。なお治具２１は、第１の実施形態で説明したものと同様の構成であってよい。   As a result, the dust 12 that has entered the package 1 and has adhered to the inner surface of the recess 2 around the solid-state imaging device 3 moves to the glass plate 11 side due to centrifugal force and gravity, and the glass plate 11 and the package 1. It is captured by the inner peripheral portion of the adhesive 10 in a semi-cured state that is somewhat exuded from the space between the upper surface 9 and the adhesive 10 and is securely fixed after being completely cured. The jig 21 may have the same configuration as that described in the first embodiment.

本発明の固体撮像装置の製造方法およびそのための封着装置は、透明窓部材をパッケージに貼り付けるための接着剤を利用して、透明窓部材の封着前にパッケージ内に混入した移動性ダストを簡単にかつ確実に固定することができ、ダストに起因する画像欠陥を防止することが可能となる。別途の部材を追加しないので、小型のパッケージを用いる固体撮像装置の製造に特に有用である。   A manufacturing method of a solid-state imaging device and a sealing device therefor according to the present invention use an adhesive for adhering a transparent window member to a package, and moveable dust mixed in the package before the transparent window member is sealed. Can be fixed easily and reliably, and image defects caused by dust can be prevented. Since a separate member is not added, it is particularly useful for manufacturing a solid-state imaging device using a small package.

本発明の第１の実施形態における固体撮像装置の製造方法を説明する組立フロー図FIG. 4 is an assembly flow diagram illustrating the method for manufacturing the solid-state imaging device according to the first embodiment of the present invention. 図１のフローに沿って組立てられていく固体撮像装置の前半工程の断面図Sectional drawing of the first half process of the solid-state imaging device assembled along the flow of FIG. 図１のフローに沿って組立てられていく固体撮像装置の後半工程の断面図Sectional drawing of the latter half process of the solid-state imaging device assembled along the flow of FIG. 本発明の第２の実施形態における固体撮像装置の製造方法を説明する組立フロー図Assembly flow diagram for explaining a method of manufacturing a solid-state imaging device according to the second embodiment of the present invention 図４のフローに沿って組立てられる途中の固体撮像装置の断面図Sectional drawing of the solid-state imaging device in the middle of assembling along the flow of FIG. 従来の固体撮像装置の製造方法を説明する組立フロー図Assembly flow diagram for explaining a method of manufacturing a conventional solid-state imaging device 図６のフローに沿って組立てられていく固体撮像装置の断面図Sectional drawing of the solid-state imaging device assembled along the flow of FIG. 図６のフローに沿って組立てられていく途中で移動性のダストが混入した状態を示す断面図Sectional drawing which shows the state in which the movable dust was mixed in the middle of assembling along the flow of FIG. ダストを捕捉する粘着材が設けられた従来の固体撮像装置の断面図Sectional drawing of the conventional solid-state imaging device provided with the adhesive material which captures dust

符号の説明Explanation of symbols

１ パッケージ
２ 凹部
３ 固体撮像素子
９ 上面
10 接着剤
11 ガラス板
12 ダスト DESCRIPTION OF SYMBOLS 1 Package 2 Recessed part 3 Solid-state image sensor 9 Upper surface
10 Adhesive
11 Glass plate
12 dust

Claims (3)

固体撮像素子を内部に配置した凹状のパッケージに透明窓部材を封着して固体撮像装置を製造する際に、前記透明窓部材の搭載前にパッケージ内に侵入した移動性のダストを、前記透明窓部材をパッケージに固定するために予め設けた接着剤に付着させて固定化する固体撮像装置の製造方法。   When manufacturing a solid-state imaging device by sealing a transparent window member to a concave package having a solid-state imaging element disposed therein, the mobile dust that has entered the package before mounting the transparent window member is A method for manufacturing a solid-state imaging device, wherein a window member is fixed by being attached to an adhesive provided in advance to fix the window member to a package. 透明窓部材とパッケージとの間の接着剤を半硬化させてから、前記パッケージを傾けることにより、あるいは前記パッケージを高速で回転させることにより、パッケージ内に存在するダストを強制的に移動させて前記接着剤に付着させ、その後に接着剤を完全硬化させる請求項１記載の固体撮像装置の製造方法。   After semi-curing the adhesive between the transparent window member and the package, by tilting the package or rotating the package at a high speed, the dust present in the package is forcibly moved to The method of manufacturing a solid-state imaging device according to claim 1, wherein the solid-state imaging device is attached to an adhesive and then completely cured. 請求項１記載の固体撮像装置の製造方法で使用する封着装置であって、透明窓部材との間の接着剤が半硬化されたパッケージを固定するステージと、前記パッケージが固定されたステージを所望の角度まで所望の速度で回転させる回転機構とを備えた封着装置。   A sealing device used in the method for manufacturing a solid-state imaging device according to claim 1, comprising: a stage for fixing a semi-cured package with an adhesive between the transparent window member; and a stage to which the package is fixed. A sealing device including a rotation mechanism that rotates at a desired speed to a desired angle.
JP2005315524A 2005-10-31 2005-10-31 Method of manufacturing solid-state imaging apparatus and sealing device therefor Pending JP2007123642A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011109297A (en) * 2009-11-16 2011-06-02 Seiko Epson Corp Imaging unit, and method of manufacturing the same
CN109328318A (en) * 2016-04-15 2019-02-12 赫普塔冈微光有限公司 Optoelectronic module with alignment spaces part and the method for assembling the optoelectronic module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011109297A (en) * 2009-11-16 2011-06-02 Seiko Epson Corp Imaging unit, and method of manufacturing the same
CN109328318A (en) * 2016-04-15 2019-02-12 赫普塔冈微光有限公司 Optoelectronic module with alignment spaces part and the method for assembling the optoelectronic module
US10840396B2 (en) 2016-04-15 2020-11-17 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules with alignment spacers and methods for assembling the same
CN109328318B (en) * 2016-04-15 2021-11-02 赫普塔冈微光有限公司 Optoelectronic module with alignment spacers and method for assembling the optoelectronic module

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