JP2007119655A - Through-hole-forming adhesive sheet and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a through-hole-forming adhesive sheet in which productivity can be improved and to provide the through-hole-forming adhesive sheet having high productivity. <P>SOLUTION: In the method for producing a through-hole-forming adhesive sheet 1 in which through-holes 2 are formed into a bilayer sheet 1P' composed of a substrate 11 and an adhesive layer 12 by irradiating the bilayer sheet 1P' with laser beam by using a laser processing apparatus equipped with a galvano-unit 33 scanning the laser beam in a prescribed range at a prescribed interval, laser beam is repeatedly scanned by the galvano-unit 33 in a direction perpendicular to the conveying direction while conveying the bilayer sheet 1P' and the formed through holes 2 are arranged in continuous wedge-like shape. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pressure-sensitive adhesive sheet having a through-hole that can prevent or remove air pockets and blisters, and a method for producing the same.

  When the pressure-sensitive adhesive sheet is manually attached to the adherend, air can be trapped between the adherend and the pressure-sensitive adhesive surface, which may impair the appearance of the pressure-sensitive adhesive sheet. Such air pockets are likely to occur particularly when the area of the adhesive sheet is large.

  In addition, resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin may generate gas either by heating or not by heating. When an adhesive sheet is affixed, blisters (bulges) are generated in the adhesive sheet by the gas generated from the adherend.

In order to solve the above problems, Patent Document 1 proposes a pressure-sensitive adhesive sheet in which through holes having a hole diameter of 0.1 to 300 μm are formed at a hole density of 30 to 50,000 holes / 100 cm ² . . According to such a through-hole-formed pressure-sensitive adhesive sheet, it is possible to prevent air accumulation or blistering of the pressure-sensitive adhesive sheet by drawing air or gas on the pressure-sensitive adhesive side from the through-hole to the pressure-sensitive adhesive sheet surface side.

  Laser drilling may be used to form the through holes in the through hole forming pressure-sensitive adhesive sheet. As the laser drilling apparatus, for example, an apparatus provided with a galvano unit as a scanning apparatus and a laser beam irradiation apparatus having an fθ lens is used.

In order to perform drilling using the above laser drilling apparatus, while conveying the adhesive sheet, the galvano unit scans the laser beam in the width direction of the adhesive sheet (direction perpendicular to the conveying direction), and the fθ lens. The adhesive sheet is irradiated with a laser beam through.
International Publication No. 2004/061031 Pamphlet

  Conventionally, the through holes are arranged in a lattice pattern by the laser drilling process, but the transport speed of the pressure-sensitive adhesive sheet cannot be increased because the scanning speed of the galvano unit is limited. Therefore, the productivity of the through-hole forming pressure-sensitive adhesive sheet is not necessarily high.

  This invention is made in view of such a situation, and it aims at providing the through-hole formation adhesive sheet which can improve productivity, and the through-hole formation adhesive sheet with high productivity. To do.

  In order to achieve the above object, first, the present invention uses a laser processing apparatus including a scanning device that scans laser light at a predetermined range within a predetermined range, and at least a base material and an adhesive layer are provided. Irradiating a laser beam to the pressure-sensitive adhesive sheet provided, a through-hole forming pressure-sensitive adhesive sheet manufacturing method for forming a through-hole in the pressure-sensitive adhesive sheet, while relatively moving the pressure-sensitive adhesive sheet and the scanning device, Provided is a method for producing a through-hole-formed pressure-sensitive adhesive sheet, wherein a laser beam is reciprocally scanned by the scanning device in a direction perpendicular to the moving direction, and the array of through-holes is continuously wedged. Item 1).

  In this specification, “sheet” includes the concept of film and tape, and “film” includes the concept of sheet and tape. In addition, examples of the “scanning device” in the present invention include a unit (scanner) including a galvanometer mirror, a polygon mirror, and the like. In addition, “relatively moving the pressure-sensitive adhesive sheet and the scanning device” includes a case where the scanning device is fixed and the pressure-sensitive adhesive sheet is moved, a case where the pressure-sensitive adhesive sheet is fixed and the scanning device is moved, and a pressure-sensitive adhesive sheet. And a case where the scanning device is moved in directions opposite to each other.

  According to the above invention (invention 1), since the relative movement speed between the adhesive sheet and the scanning device can be set higher than in the case where the through holes are arranged in a grid pattern, the laser drilling process is performed. Speed can be improved and productivity of a through-hole formation adhesive sheet can be improved.

  In the above invention (invention 1), laser processing is performed such that 0 <tan θ ≦ 1 when θ is an angle of the array of the through holes with respect to the wedge symmetry line in the wedge-shaped array of the through holes. (Claim 2).

  In the above inventions (inventions 1 and 2), a plurality of the scanning devices are provided, and a plurality of through-hole groups arranged in parallel are formed by the plurality of scanning devices, and one through-hole group in an adjacent through-hole group is formed. It is preferable to perform laser processing so that the narrow gap side of the arrangement of the wedge-shaped through-holes enters the wide gap side of the arrangement of the wedge-shaped through-holes of the other through-hole group without overlapping each other. (Claim 3).

  According to the above invention (invention 3), the hole density of the through holes in the wide interval portion of the array of the wedge-shaped through holes is improved, and the hole density of the through holes in the obtained through hole forming pressure-sensitive adhesive sheet is made to be air bleed. Control within an excellent range can be facilitated.

  In the above invention (invention 3), in the adjacent through hole group, the narrow interval side of the arrangement of the wedge-shaped through holes of one through hole group is the wide interval side of the arrangement of the wedge-shaped through holes of the other through hole group. Laser processing is preferably performed so that 0 <P ≦ 0.7, where P is a ratio of the width of entering to the width of the array of wedge-shaped through-holes of the other through-hole group. Item 4).

In the above invention (claim 1), the pore density of the through holes is preferably performed with a laser processing so that 30～50,000 pieces / 100 cm ² (Claim 5).

  2ndly, this invention is a through-hole formation adhesive sheet provided with the base material and the adhesive layer, and the through-hole formation adhesive sheet in which multiple through-holes penetrated from one surface to the other surface are formed, A through-hole-forming pressure-sensitive adhesive sheet characterized by being arranged in a wedge shape in a plan view is provided (claim 6).

  The through-hole-formed pressure-sensitive adhesive sheet according to the above invention (invention 6) is manufactured, for example, by reciprocally scanning laser light in a direction orthogonal to the conveyance direction while conveying the pressure-sensitive adhesive sheet at a high speed. Therefore, productivity is high compared with the through-hole formation adhesive sheet in which the through-hole was arranged in the shape of a lattice.

  In the above invention (invention 6), it is preferable that 0 <tan θ ≦ 1 when θ is an angle of the arrangement of the through holes with respect to the wedge symmetry line in the wedge-shaped arrangement of the through holes. (Claim 7).

  In the above inventions (inventions 6 and 7), the plurality of through-hole groups arranged in a continuous wedge shape are formed in the adhesive sheet in parallel, and one through-hole group in the adjacent through-hole group It is preferable that the narrow interval side of the array of wedge-shaped through-holes penetrates into the wide interval side of the array of wedge-shaped through-holes of the other through-hole group without overlapping each other. 8).

  The through-hole-forming pressure-sensitive adhesive sheet according to the above invention (invention 8) is likely to be excellent in air bleedability because the hole density of the through-holes in the wide interval portion of the wedge-shaped through-hole arrangement is high. .

  In the above invention (invention 8), the narrow interval side of the wedge-shaped through-hole arrangement of one through-hole group in the adjacent through-hole group is the wide interval side of the arrangement of the wedge-shaped through-holes of the other through-hole group It is preferable that 0 <P ≦ 0.7, where P is a ratio of the width of entering to the width of the array of wedge-shaped through-holes in the other through-hole group.

In the above invention (Invention 6-9), it is preferred pore density of the through hole is 30～50,000 pieces / 100 cm ² (claim 10).

  According to the present invention, the productivity of the through-hole forming pressure-sensitive adhesive sheet can be improved. Moreover, according to this invention, a highly productive through-hole formation adhesive sheet can be provided.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic side view of a laser drilling apparatus used in an embodiment of the present invention, and FIG. 2 is a plan view showing an installation position of a galvano unit in the laser drilling apparatus. FIG. 4 is a schematic front view of the laser drilling apparatus, FIG. 4 is an example of the arrangement of through holes in the through hole forming adhesive sheet according to one embodiment of the present invention, and FIG. 5 is the through hole forming adhesive. It is sectional drawing of a sheet | seat.

  Here, in FIGS. 1-5, 1P shows the adhesive sheet (adhesive sheet before through-hole formation) formed by laminating | stacking the base material 11, the adhesive layer 12, and the peeling material 13, and code | symbol 1P ' 2 shows a two-layer sheet composed of a base material 11 and a pressure-sensitive adhesive layer 12 from which the release material 13 has been peeled off from the pressure-sensitive adhesive sheet 1P. A hole-forming two-layer sheet is shown, and reference numeral 1 is composed of a base material 11 on which a through-hole 2 is formed, a pressure-sensitive adhesive layer 12 and a peeling material 13, in which a peeling material 13 is laminated on a through-hole forming double-layer sheet 1 ′ A through-hole formation adhesive sheet is shown.

  In addition, the material of the base material 11 and the pressure-sensitive adhesive layer 12 is not particularly limited as long as the through-hole 2 can be formed by laser processing.

  As shown in FIGS. 1 and 2, the laser drilling apparatus used in the present embodiment includes a roll R1 around which a long adhesive sheet 1P is wound, and a roll R2 around which the through-hole-forming adhesive sheet 1 is wound. , Separation roll R3 for peeling the release material 13 from the adhesive sheet 1P, a sticking roll R4 for attaching the release material 13 to the through-hole forming two-layer sheet 1 ′, and a roll for winding the release material 13 peeled by the separation roll R3 R5, a roll R6 around which a release material 13 for laminating on the through-hole forming two-layer sheet 1 ′ is wound, and a laser beam irradiation device 3 installed between the roll R1 and the roll R2. .

  The laser light irradiation device 3 includes a laser oscillator 31 that oscillates laser light, a first half mirror 32a that divides the laser light from the laser oscillator 31 into two, and two more laser lights from the first half mirror 32a. Two second half mirrors 32b branching into two, four third half mirrors 32c branching the laser light from the second half mirror 32b into two, and laser light from each third half mirror 32c are scanned. Eight galvano units 33 (including a galvano mirror that scans in the X direction and a galvano mirror that scans in the Y direction), and eight fθ that irradiate the two-layer sheet 1P ′ with the laser light from each galvano unit 33 A lens 34, and two roll-shaped supports 35 that support the two-layer sheet 1P ′ below the two-layer sheet 1P ′ irradiated with the laser light; Suction conveying device provided in the front and rear and between the two roll-like support 35 of and a (suction belt) 36.

  As shown in FIG. 2, the eight galvano units 33 (33a to 33h) are arranged in two rows of four, and the four galvano units 33 (33a, 33c, 33e, 33g / 33b, 33d, 33f, 33h) are arranged in series in the width direction of the two-layer sheet 1P ′. These eight galvano units 33 can be scanned in the order of 33a to 33h at predetermined intervals in the width direction of the double-layer sheet 1P ′ (see FIG. 3), so that the galvano units 33a, 33c, 33e, 33g and the galvano units 33b, 33d, 33f, and 33h in the other row are arranged so as to be shifted from each other in the width direction of the double-layer sheet 1P ′.

The type of the laser oscillator 31 is not particularly limited, and for example, a carbon dioxide (CO ₂ ) laser, a TEA-CO ₂ laser, a YAG laser, a UV-YAG laser, an excimer laser, a semiconductor laser, a YVO ₄ laser, and a YLF laser. Any of femtosecond lasers and the like may be used.

Laser drilling by the laser drilling apparatus is performed as follows.
The pressure-sensitive adhesive sheet 1P fed out from the roll R1 is peeled off from the release material 13 by the separation roll R3 to become a two-layer sheet 1P ′. The two-layer sheet 1P ′ is conveyed at a predetermined speed toward the installation position of the laser beam irradiation device 3 with the adhesive layer 12 on the upper side and the base material 11 on the lower side.

  The two-layer sheet 1 </ b> P ′ is sucked downward by the suction / conveyance device 36 in the laser light irradiation device 3, and conveyed while being in close contact with the upper outer peripheral surface of the roll-shaped support 35.

  The eight galvano units 33 in the laser beam irradiation device 3 reciprocately scan the laser beam at predetermined intervals in the width direction of the two-layer sheet 1P ′, respectively, and roll-like supports 35 of the moving two-layer sheet 1P ′. A laser beam is irradiated through the fθ lens 34 to the close contact portion. By this laser light irradiation, a plurality of through-holes 2 penetrating the pressure-sensitive adhesive layer 12 and the base material 11 are formed in the two-layer sheet 1P ′ to form a through-hole-formed two-layer sheet 1 ′ (see FIG. 5).

  In the present embodiment, the through-hole 2 of the through-hole forming double-layer sheet 1 ′ obtained by the laser beam irradiation constitutes eight through-hole groups 20 arranged in parallel in the sheet width direction corresponding to the eight galvano units 33. In each through-hole group 20, they are arranged in a continuous wedge shape. In FIG. 4, as a part of the through-hole forming double-layer sheet 1 ′, a through-hole group 20a formed by the galvano unit 33a, a through-hole group 20b formed by the galvano unit 33b, and a through-hole formed by the galvano unit 33c Group 20c is shown.

  In order to arrange the through holes 2 in a continuous wedge shape as described above, a laser beam may be reciprocated in the width direction of the two-layer sheet 1P ′ by the galvano unit 33 while conveying the two-layer sheet 1P ′. However, compared with the case where the through-holes 2 are arranged in a lattice pattern, the conveyance speed of the two-layer sheet 1P ′ can be set high. Therefore, the processing speed of the laser drilling process can be improved, and the productivity of the through hole forming pressure-sensitive adhesive sheet 1 can be increased. The galvano unit 33 may scan so that the laser beam is tilted not only in the width direction of the double-layer sheet 1P 'but also in the length direction (conveyance direction) of the double-layer sheet 1P'.

  Here, although it is a grade of the inclination of the array 22 (linear shape) of the through-hole 2 which comprises the wedge-shaped array (wedge 21) of the through-hole 2, the symmetrical line S of the wedge 21 (in this embodiment, double-layer sheet) 0 <tan θ ≦ 1, particularly 0 <tan θ ≦ 0.5, where θ is the angle of the array 22 of the through holes 2 with respect to a line perpendicular to the conveying direction of 1P ′. preferable. When tan θ is larger than 0, the conveyance speed of the two-layer sheet 1P ′ can be increased and the productivity of the through-hole forming pressure-sensitive adhesive sheet 1 can be increased. On the other hand, if tan θ exceeds 1, the degree of inclination of the array 22 of the through-holes 2 constituting the wedge 21 becomes too large, and the hole density of the through-holes 2 may be difficult to control within a range excellent in air bleedability. There is.

  In the present embodiment, the tip of the wedge 21 on the narrow interval side has a predetermined gap, but this gap may not be present. That is, the tip of the wedge 21 may be sharp.

  As shown in FIG. 4, the wedge-shaped penetration of one through-hole group 20 in the adjacent through-hole group 20 (in FIG. 4, through-hole group 20a and through-hole group 20b, through-hole group 20b and through-hole group 20c). The narrow gap side of the arrangement of the holes 2 (wedge 21) is inserted into the wide gap side of the arrangement of the wedge-shaped through holes 2 (wedge 21) of the other through hole group 20 without overlapping each other. Yes. In this way, by making one adjacent wedge 21 enter the other wedge 21, the hole density of the through hole 2 in the wide interval portion of the wedge 21 is improved, and the hole density of the through hole 2 is excellent in air bleedability. It can be easily controlled within the range.

  The arrangement of the through holes 2 as described above can be formed by adjusting the conveyance speed of the two-layer sheet 1 </ b> P ′, the scanning timing of the galvano unit 33, and the interval between the two roll-shaped supports 35.

Here, one of the wedge 21 adjacent an amount entering the other of the wedge 21, the width W ₂ of the narrow gap side of one of the wedge 21 adjacent enters the wide pitch side of the other of the wedge 21, the other wedge 21 the ratio of the width _{W 1} when the P, 0 <is preferably P ≦ 0.7, is especially preferred 0 <P ≦ 0.4. When P is larger than 0, the hole density of the through holes 2 can be improved. On the other hand, if P exceeds 0.7, the scanning width by the galvano unit 33 becomes too large, and there is a possibility that the processing efficiency of the laser drilling process is lowered or the shape of the through hole 2 is broken.

The hole density of the through holes 2 in the through hole forming pressure-sensitive adhesive sheet 1 is preferably 30 to 50,000 / 100 cm ² , and particularly preferably 100 to 10,000 / 100 cm ² . If the hole density of the through holes 2 is less than 30/100 cm ² , air or gas is difficult to escape, and if the hole density of the through holes 2 exceeds 50,000 / 100 cm ² , the mechanical strength of the pressure-sensitive adhesive sheet 1 is increased. May decrease.

  It is preferable that the hole diameter in the base material 11 and the adhesive layer 12 of the through-hole 2 is 0.1-300 micrometers, and it is especially preferable that it is 0.1-150 micrometers. When the hole diameter of the through hole 2 is less than 0.1 μm, it is difficult for air or gas to escape from the through hole 2, and when the hole diameter of the through hole 2 exceeds 300 μm, the through hole 2 becomes conspicuous.

  The hole diameter of the through-hole 2 may be constant in the thickness direction of the pressure-sensitive adhesive sheet 1 or may vary in the thickness direction of the pressure-sensitive adhesive sheet 1, but the hole diameter of the through-hole 2 is the thickness of the pressure-sensitive adhesive sheet 1. When changing in the vertical direction, it is preferable that the thickness gradually decreases from the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer 12 to the surface of the base material 11. Thus, when the hole diameter of the through-hole 2 changes, the through-hole 2 becomes less conspicuous on the surface of the base material 11, and the external appearance of the adhesive sheet 1 can be kept favorable.

  When the through-hole 2 is formed by laser processing, the through-hole 2 often has a tapered taper. Therefore, the through-hole 2 having the above shape is formed from the adhesive surface side of the adhesive layer 12 as in the present embodiment. It can be formed by irradiation with laser light.

  The release material 13 fed from the roll R6 is attached to the through-hole forming two-layer sheet 1 ′ in which the through-holes 2 are formed as described above by the application roll R4. As shown in FIG. 11, the through-hole forming pressure-sensitive adhesive sheet 1 that is a laminate of the pressure-sensitive adhesive layer 12 and the release material 13 is wound around a roll R2.

  In the present embodiment, the release material 13 is peeled from the pressure-sensitive adhesive layer 12 and irradiated with laser light. The reason is as follows.

  When the release material 13 is laminated on the pressure-sensitive adhesive layer 12 and irradiated with laser light from the release material side, depending on the material of the release material 13, the dross formed at the periphery of the opening of the through hole 2 of the release material 13 may adhere. The opening part of the through-hole 2 of the agent layer 12 may be expanded, and in this case, the accuracy of the hole diameter and hole density of the through-hole 2 formed in the pressure-sensitive adhesive sheet 1 is lowered. Moreover, if the opening part of the through-hole 2 of the adhesive layer 12 spreads, the internal space of the through-hole 2 will become large, and after sticking the adhesive sheet 1 to a to-be-adhered body, in the air in the through-hole 2, or in the through-hole 2 There is a possibility that the water or the like entered may have some influence on the surface of the pressure-sensitive adhesive sheet 1.

  On the other hand, if the adhesive layer 12 is directly irradiated with laser light as in the present embodiment, the opening of the through hole 2 of the adhesive layer 12 does not expand, and the accuracy of the hole diameter and the hole density is high. The through hole 2 having a small internal space can be formed. Further, by not interposing the release material 13 in the laser beam irradiation on the adhesive layer 12, the laser beam irradiation time can be shortened or the laser output energy can be reduced. If the output energy of the laser is small, the thermal effect on the pressure-sensitive adhesive layer 12 and the substrate 11 is small, and it is possible to form a well-shaped through-hole 2 with little thermal deformation or the like.

  By performing the laser drilling process as described above, the conveyance speed of the two-layer sheet 1P ′ can be increased to improve the productivity of the through-hole forming pressure-sensitive adhesive sheet 1, and the hole density of the through-holes 2 can be increased. The through-hole-forming pressure-sensitive adhesive sheet 1 that is enhanced and excellent in air bleedability can be produced.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the number of galvano units 33 in the laser light irradiation device 3 may not be eight, and the galvano units 33 may not be in two rows. In addition, the laser beam may be irradiated with the release material 13 laminated on the pressure-sensitive adhesive layer 12, or the laser beam may be irradiated from the substrate 11 side. Further, the release material 13 to be attached by the sticking roll R4 may be the release material 13 peeled by the separation roll R3. Furthermore, the suction conveyance device 36 may be a conveyance roll.

  The through-hole-formed pressure-sensitive adhesive sheet of the present invention is useful as a pressure-sensitive adhesive sheet used when air pockets or blisters are likely to occur, and the production method of the present invention can produce such a through-hole-formed pressure-sensitive adhesive sheet with high productivity. Useful.

It is a schematic side view of the laser drilling apparatus used in one embodiment of the present invention. It is a top view which shows the installation position of the galvano unit in the laser drilling apparatus. It is a schematic front view of the laser drilling apparatus. It is an example of an arrangement of a penetration hole in a penetration hole formation adhesive sheet concerning one embodiment of the present invention. It is sectional drawing of the same through-hole formation adhesive sheet.

Explanation of symbols

1P ... Adhesive sheet (before through-hole formation)
DESCRIPTION OF SYMBOLS 1P '... Double-layer sheet 1' ... Through-hole formation double-layer sheet 1 ... Through-hole formation adhesive sheet 11 ... Base material 12 ... Adhesive layer 13 ... Release material 2 ... Through-hole 20 ... Through-hole group 21 ... Through-hole wedge Array (wedge)
DESCRIPTION OF SYMBOLS 22 ... Through-hole arrangement | sequence 3 ... Laser beam irradiation apparatus 31 ... Laser oscillator 32a, 32b, 32c ... Half mirror 33 ... Galvano unit 34 ... f (theta) lens 35 ... Roll-shaped support body 36 ... Suction conveyance apparatus (suction belt)

Claims (10)

Using a laser processing apparatus provided with a scanning device that scans laser light at a predetermined interval within a predetermined range, the adhesive sheet having at least a base material and an adhesive layer is irradiated with laser light, and the adhesive A method for producing a through hole forming pressure-sensitive adhesive sheet for forming a through hole in a sheet,
A laser beam is reciprocally scanned by the scanning device in a direction perpendicular to the moving direction while relatively moving the adhesive sheet and the scanning device, and the array of the through holes is continuously wedged. The manufacturing method of the through-hole formation adhesive sheet characterized by the above-mentioned.   2. The laser processing is performed so that 0 <tan θ ≦ 1 when θ is an angle of the array of the through holes with respect to a wedge symmetry line in the wedge-shaped array of the through holes. The manufacturing method of the through-hole formation adhesive sheet of description.   A plurality of the scanning devices are provided, and a plurality of through-hole groups arranged in parallel by the plurality of scanning devices are formed, and a narrow interval of an array of wedge-shaped through-holes of one through-hole group in adjacent through-hole groups 3. The through-hole according to claim 1, wherein the laser processing is performed so that the through-holes do not overlap each other on the wide interval side of the wedge-shaped through-hole arrangement of the other through-hole group. A method for producing a hole-forming pressure-sensitive adhesive sheet.   In the adjacent through hole group, the other through hole having a width in which the narrow interval side of the wedge-shaped through hole array of one through hole group enters the wide interval side of the wedge-shaped through hole array of the other through hole group 4. The through-hole forming adhesive according to claim 3, wherein laser processing is performed so that 0 <P ≦ 0.7, where P is the ratio of the wedge-shaped through-holes in the group to the width of the array. Sheet manufacturing method. The method for producing a through-hole-forming pressure-sensitive adhesive sheet according to any one of claims 1 to 4, wherein laser processing is performed so that a hole density of the through-holes is 30 to 50,000 / 100 cm ² . A through-hole forming pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer, wherein a plurality of through-holes penetrating from one surface to the other surface are formed,
The through-hole-forming pressure-sensitive adhesive sheet, wherein the plurality of through-holes are arranged in a wedge shape in plan view.   The penetration according to claim 6, wherein 0 <tan θ ≦ 1 when θ is an angle of the arrangement of the through holes with respect to a wedge symmetry line in the wedge-shaped arrangement of the through holes. Hole-forming adhesive sheet. A plurality of through-hole groups arranged in a continuous wedge shape are formed in an adhesive sheet in parallel,
In the adjacent through hole group, if the narrow interval side of the wedge-shaped through hole array of one through hole group overlaps the wide interval side of the wedge-shaped through hole array of the other through hole group, the through holes overlap each other. The through-hole-forming pressure-sensitive adhesive sheet according to claim 6 or 7, wherein the pressure-sensitive adhesive sheet penetrates into the hole.   In the adjacent through hole group, the other through hole having a width in which the narrow interval side of the wedge-shaped through hole array of one through hole group enters the wide interval side of the wedge-shaped through hole array of the other through hole group 9. The through-hole-forming pressure-sensitive adhesive sheet according to claim 8, wherein 0 <P ≦ 0.7, where P is a ratio to the width of the array of wedge-shaped through-holes in the group. Through hole forming the pressure-sensitive adhesive sheet according to any one of claims 6 to 9 hole density of the through hole is characterized in that it is a 30～50,000 pieces / 100 cm ^2.

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