JP2007117824A - Transfer apparatus of paste like material and transfer method of paste like material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer apparatus of a paste like material which can prevent climbing-up phenomenon of a paste like material adhering to the tip part of a pin to surely transfer at the determined position of the abutting side on which the tip of the pin abuts. <P>SOLUTION: A transfer head 10 constituting the transfer apparatus includes a space part 18 having a bottom part constituted of a pin holding plate 16 having a penetrating hole 14 into which a plurality of pins 12 are inserted vertically movably, a cushion member 20 which is inserted in the space part 18 and presses flange parts 12a of a plurality of pins 12 to the direction of the pin holding plate 16, and a compressed-air supplying way 24 which supplies a compressed air from an opening part opened to the inner wall side of the space part 18 into the space part 18 so that an air flow can blow out from each penetrating hole 14 of the pin holding plate 16 with the pin 12 inserted to the front-end part direction of the pin 12 to prevent a paste like material from climbing up to the rear-end part direction of the pin 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a paste material transfer apparatus and a paste material transfer method, and more specifically, paste material is attached to each tip portion of a plurality of pins suspended independently from each other from a transfer head, and the pins The present invention relates to a paste-like material transfer device and a paste-like material transfer method for transferring the paste-like material with each of its tips abutting a predetermined location.

When external connection terminals made of solder bumps are formed on each of pads 102, 102,... Of a BGA (Ball Grid Array) 100 as a semiconductor device shown in FIG. 4A, as shown in FIG. After applying the flux 104, which is a paste-like material, to each of the pads 102, 102,..., The solder balls 106 are mounted [FIG. 4 (c)], and the external connection terminals 108 are formed on the pads 102 by reflowing. It is formed [FIG. 4 (d)].
In forming the external connection terminals, the flux 104 is applied to each of the pads 102, 102... Using the transfer device 200 shown in FIG. In this transfer device 200, pins 204, 204,... Are implanted in the form of a sword mountain on one surface side of a plate-like member 202 provided so as to be movable up and down.
In the transfer apparatus 200, the tips of the pins 204, 204,... Contact a film-like body having a predetermined thickness made of a flux 208 formed on the stage 210 by a squeegee 206, as shown in FIG. To descend.
Next, as shown in FIG. 5B, the flux 208 is attached to the tips of the pins 204, 204,. Yes. As shown in FIG. 5B, the transfer device 200 is placed so that the tip portions of the pins 204, 204,. Descent.
Thereafter, the transfer device 200 is lifted, and the tips of the pins 204, 204,... Are separated from the corresponding predetermined positions of the semiconductor device 100, whereby the flux is applied to the predetermined positions of the semiconductor device 100 as shown in FIG. 208 is transferred.

In the transfer device 200 shown in FIG. 5, pins 204, 204... Are implanted in a sword mountain shape on one surface side of the plate-like member 202. On the other hand, there is variation in the height or the like of the predetermined portion where the flux 208 of the semiconductor device 100 is transferred.
For this reason, among the pins 204, 204,... Of the transfer apparatus 200, there are those in which the tip of the pin 204 cannot come into contact with a predetermined portion of the semiconductor device 100, and the flux 208 is not sufficiently transferred. For this reason, the transfer amount and the like of the flux 208 applied to each of the predetermined portions of the semiconductor device 100 vary.
As a transfer device capable of absorbing the variation at a predetermined portion of the semiconductor device 100, the following Patent Document 1 proposes a transfer device 300 shown in FIGS.
6 and 7, the bottom of the transfer head 302 is provided by a pin holding plate 306 having a through hole into which a plurality of pins 304, 304,. The formed space portion 308 and a cushion member 310 that is inserted into the space portion 308 and presses the rear end portions of the plurality of pins 304, 304... Toward the pin holding plate 306.
The pin 304 is formed with a bowl-shaped portion having a diameter larger than that of the through hole of the pin holding plate 306 at the rear end portion, and each of the plurality of pins 304, 304. It is suspended from the through hole 306. Further, a protective sheet 312 is provided on the contact surface of the cushion member 310 that contacts the rear end of the pin 304.
JP-A-8-266980

6 and 7, when the tips of the pins 304, 304... Abut on the contact surface 314 as shown in FIG. 6, the pins 304, 304. The pressing force received at the tip of can be absorbed by the cushion member 310 contracting.
Therefore, if the contact surface 314 with which the tips of the pins 304, 304... Contact is uneven, the other pins 304 are pressed until the tip of the pin 304 corresponding to the recess contacts the bottom of the recess. The flux 208 adhering to the tip portions of the pins 304, 304,... Can be transferred to a predetermined location.
In this case, each of the pins 304 and 304 is a contact surface of the pin 304 whose tip is in contact with the top surface of the convex portion of the contact surface and the pin 304 whose tip is in contact with the bottom surface of the recess of the contact surface. A different pressing force is received from 314. The pressing force received by each of the pins 304, 304,... Can be absorbed by the cushion member 310 contracting according to the pressing force.
When the tips of the pins 304, 304,... Are separated from the contact surface 314, the rear end surfaces of the pins 304, 304,. Biased in the direction.

According to the transfer device 300 shown in FIGS. 6 and 7, a paste-like material such as flux can be transferred to a predetermined portion of the contact surface 314 even if the contact surface 314 has some unevenness.
By the way, the flux 208 of the paste-like material on the stage 210 forms a film-like body with the squeegee 206 while adding the consumed amount of flux, but there is no problem in the initial characteristics of the flux, but with the passage of time. In some cases, the viscosity of the flux 208 decreases. It has been found that the amount of flux transferred to a predetermined portion of the contact surface 314 fluctuates due to the decrease in the viscosity of the flux 208.
This is shown in FIG. In FIG. 8, time progresses from the direction of FIG. 8A to the direction of FIG. 8E, and in the initial stage shown in FIG. 8A, the flux 208a adhering to the pin 304 adheres near the tip of the pin 304. is doing. On the other hand, when the viscosity of the flux 208 decreases with time, the flux 208a adhering to the tip of the pin 304 gradually rises above the pin 304 as shown in FIGS. 8 (b) to 8 (c). A rising phenomenon occurs, and the amount of flux 208b transferred to the contact surface of the tip of the pin 304 gradually increases.
Further, when the viscosity of the flux 208 is reduced, the amount of the soot that rises above the pin 304 of the flux 208a is increased, and the amount of flux near the tip of the pin 304 is reduced, as shown in FIG. 8 (d). In addition, the amount of flux 208b transferred to the contact surface at the tip of the pin 304 decreases.

For this reason, when the lifting of the flux 208a onto the pin 304 occurs, the pins 304, 304,... May be washed, or the flux 208 with reduced viscosity on the stage 210 may be replaced with a new flux. Necessary.
However, the cleaning operation of the pins 304, 304,... Is extremely complicated because the number of pins 304 is extremely large.
In addition, during the flux exchange operation, the manufacture of the semiconductor device is stopped. Moreover, although the exchanged flux (flux with reduced viscosity) has initial performance as a flux, it must be disposed of and is not preferable from the viewpoint of resource saving and the like.
Accordingly, an object of the present invention is to prevent the phenomenon of the paste-like material adhering to the tip of the pin from being lifted and to transfer the paste-like material that can be reliably transferred to a predetermined location on the contact surface with which the tip of the pin contacts. An object is to provide an apparatus and a paste material transfer method.

The present inventor has made various investigations on means for preventing the phenomenon of the flux 208a adhering to the tip portion of the pin 304, and as a result, the tip portion of the pin 304 is inserted from the through hole of the pin holding plate 306 into which each pin 304 is inserted. Knowing that it is effective to inject airflow in the direction, the present invention has been reached.
That is, the present invention attaches a paste-like material to the respective tip portions of a plurality of pins suspended independently from each other from the transfer head, and places the paste-like material at a predetermined location on the contact surface where each tip of the pins abuts. In a transfer device for paste-like material for transferring material, a space portion in which a bottom portion is formed by a pin holding plate in which a through hole into which each of a plurality of pins is inserted in a vertically movable manner is formed in the transfer head And a cushion member that is inserted into the space and presses each rear end of the plurality of pins in the direction of the pin holding plate, and a direction of the tip of the pin from each through hole of the pin holding plate in which the pin is inserted Compressed air is supplied into the space from an opening formed in the inner wall surface of the space so that an air flow is ejected to prevent the paste-like material from creeping up toward the rear end of the pin. Air supply path In the transfer device of the pasty material characterized Rukoto.

  Further, the present invention provides a paste-like material attached to each tip portion of a plurality of pins suspended independently from each other from the transfer head, and the paste-like material is formed at a predetermined position on a contact surface with which each tip tip abuts. When transferring the material, as the transfer head, a space part having a bottom formed by a pin holding plate in which a through hole into which each of a plurality of pins is inserted so as to be movable up and down is formed, and in the space part A cushion member that is inserted and presses each rear end portion of the plurality of pins in the direction of the pin holding plate; and a compressed air supply passage that is opened in an inner wall surface of the space portion and supplies compressed air into the space portion. In order to prevent the paste-like material adhering to the tip end portion of the pin from creeping up in the direction of the rear end portion of the pin, the compressed air is passed through the compressed air supply path using the transfer head provided. Supply to the inside, It is also a method for transferring a paste-like material, in which an air flow is ejected from a through hole of a pin holding plate into which each of the pins is inserted toward the tip of the pin and is transferred to a predetermined location on the contact surface. .

In this invention, the cushion member can be prevented from being damaged by the rear end of the pin by providing the protective sheet on the contact surface that contacts the rear end of the pin of the cushion member.
By using a sponge-like cushion member as this cushion member, compressed air can pass through the cushion member, and air flows easily from the through hole of the pin holding plate into which each pin is inserted toward the tip of the pin. Can be ejected.
In addition, by using a pin in which a bowl-shaped portion having a larger diameter than the through hole of the pin holding plate is formed at the rear end as the pin, the pin can be easily suspended from the through hole of the pin holding plate.
In addition, as a paste-form material, when using the paste-form material which a viscosity falls with time, this invention can be applied suitably.

According to the present invention, the paste-like material is adhered to the tip of the pin while ejecting an air flow from the through hole of the pin holding plate into which each of the pins is inserted toward the tip of the pin.
By this air flow ejected in the direction of the tip of the pin, the paste-like material that adheres to the tip of the pin and crawls in the direction of the rear end can be blown toward the tip of the pin, It is possible to prevent the soaking phenomenon of the adhered paste-like material.
As a result, a predetermined amount of paste-like material can be attached to the tip of the pin, and the predetermined amount of paste-like material can be reliably transferred to a predetermined portion of the contact surface with which the tip of the pin contacts.
Further, even if it is a paste-like material whose viscosity decreases with time, its replacement frequency can be reduced and the pin cleaning interval can be extended, so that the productivity of the transfer device can be improved.

  An example of a transfer head constituting the transfer apparatus according to the present invention is shown in FIG. FIG. 1 is a partial cross-sectional view of the transfer head 10, and the transfer head 10 is provided so as to be movable up and down. A space 18 is formed in the transfer head 10, and the bottom of the space 18 is formed by a pin holding plate 16 having a plurality of through holes 14, 14. Each of the through holes 14, 14... Is inserted with a pin 12 having a hook-shaped portion 12 a having a larger diameter than the through hole 14 at the rear end, and the tip 12 b of the pin 12 is a pin. The holding plates 16 project independently from each other below. Each of the pins 12, 12,... Is inserted into the through hole 14 of the pin holding plate 16 so as to be movable up and down, and the pin 12 is prevented from coming off from the pin holding plate 16 by the hook-shaped portion 12a.

A cushion member 20 is inserted into the space 18 formed in the transfer head 10, and the flanges 12 a of the pins 12, 12... Are pressed by the cushion member 20 toward the pin holding plate 16. Yes.
A protective sheet 22 is provided between the cushion member 20 and the flanges 12a of the pins 12, 12,..., And the cushion member 20 is damaged due to contact with the flange 12a of the pins 12 or the like. Can be prevented.
A compressed air supply path 24 is opened on the inner wall surface of the space 18 into which the cushion member 20 is inserted. As shown in FIG. 1, the compressed air supply path 24 compresses the space 18 by overcoming the pressing force of the cushion member 20 even if the opening of the inner wall surface of the space 18 is closed by the cushion member 20. Supply compressed air at a pressure that allows air to be injected. The pressure of the compressed air is preferably about 0.49 MPa.
Thus, since the opening part of the inner wall face of the space part 18 is obstruct | occluded by the cushion member 20, the sponge-like cushion member 20 which can pass air can be used suitably as the cushion member 20. FIG. Further, the protective sheet 22 may be made of resin or metal as long as it can be deformed together with the cushion member 20.
The air supply path 24 is not necessarily required to open to the inner wall surface of the space 18 in which the cushion member 20 is inserted. However, as shown in FIG. It is preferable that the elastic force of the cushion member 20 can be supplemented by opening.

By the way, the hook-shaped portion 12a is in contact with the inner wall surface of the pin holding plate 16, but the hook-shaped portion 12a is used to prevent the pin 12 from coming off from the through hole 14 of the pin holding plate 16. There is a gap between the portion 12 a and the inner wall surface of the pin holding plate 16.
Therefore, the compressed air supplied from the compressed air supply path 24 into the space 18 through the opening is inserted into the pin 12 from the gap between the flange 12a of the pin 12 and the pin holding plate 16. It enters into the through hole 14, passes between the inner wall surface of the through hole 14 and the outer peripheral surface of the pin 12, and is ejected to the outside of the through hole 14.
The compressed air flow ejected to the outside of the through hole 14 flows down along the pin 12 in the direction of the tip 12b of the pin 12.
In order to stably eject a certain amount of compressed air flow to the outside of the through hole 14, for example, as shown in FIGS. 2 (a) and 2 (b), the pin 12 faces the holding plate 16 of the bowl-shaped portion 12a. It is preferable to form slit grooves 15, 15... Radially from the central portion to the outer peripheral edge on the opposing surface.

The transfer head 10 shown in FIG. 1 is made of a paste-like material having a predetermined thickness formed on one side of the stage 26 while jetting compressed air along the pin 12 from the through hole 14 toward the tip 12b of the pin 12. The film descends toward the film-like body 28. The film-like body 28 can be formed into a film having a predetermined thickness using a squeegee 206 shown in FIG.
The transfer head 10 is lowered, and each tip of the pin 12 suspended from each of the through holes 14 of the pin holding plate 16 is in contact with one surface of the stage 26 on which the film-like body 28 is formed. Is shown in FIG.
A force received from one surface of the abutted stage 26 acts on the pins 12, 12,..., And a pin holding plate received from the cushion member 20 by the flange 12a formed at the rear end of the pins 12, 12,. The cushion member 20 is pressed against the pressing force in the 16 directions. For this reason, as shown in FIG. 3, the clearance gap between the hook-shaped part 12a of the pin 12 and the pin holding | maintenance board 16 becomes large, and the compressed air flow injected to the outward of the through-hole 14 increases.

The compressed air flow ejected to the outside of the through-hole 14 flows down along the pin 12 and can prevent creeping from the tip end portion 12b of the pin-like material 12 forming the film-like body 28. Therefore, when the transfer head 10 is raised and the tips of the pins 12, 12,... Are separated from one surface of the stage 26, as shown in FIG. Is attached.
Next, a predetermined amount of paste-like material can be transferred by bringing the tips of the pins 12, 12,... Into contact with predetermined portions of the corresponding contact surface of the semiconductor device or the like.

As this paste-like material, a paste-like material whose viscosity decreases with time, such as a flux, can be used.
Conventionally, a pasty material having a reduced viscosity increases the amount of the paste material remaining at the tip 12b of the pin 12 and repeats the transfer, and thus it becomes easier to curl along the pin 12. Replacement was necessary.
At the time of this replacement, the transfer device must be stopped even if there is no problem in the characteristics of the paste-like material, although the viscosity has decreased, and the replaced paste-like material will be disposed of. From the viewpoint of resource saving, it is not preferable.
In this regard, in the transfer device shown in FIGS. 1 and 3, a compressed air flow is ejected from the through hole 14 through which the pin 12 is inserted, and the air flow flowing down along the pin 12 causes the paste-like material to be fed to the pin 12. The paste-like material can be transferred while preventing creeping up.
For this reason, when a paste-like material such as a flux whose viscosity decreases with time is used, even if the viscosity of the paste-like material is reduced, the air current flowing down along the pin 12 causes the pin 12 of the paste-like material. Can prevent creeping up. As a result, paste-like materials such as flux can be used continuously while satisfying initial characteristics other than viscosity, although only the viscosity decreases with time.

When transfer was performed by the transfer apparatus shown in FIGS. 6 and 7 using a flux whose viscosity decreases with time, the exchange frequency of the flux was about once per hour.
On the other hand, when the transfer is performed by the transfer device shown in FIGS. 1 and 3 using the same flux, the exchange frequency of the flux can be set to about once every 4 hours. I was able to improve.
6 and 7, when cleaning the pins 304, 304..., The pin holding plate 306 holding the pins 304, 304. It is necessary to immerse the pins 304, 304,. At the time of such cleaning, careful attention is required to prevent the pins 304, 304... From dropping from the pin holding plate 306.

1 and 3, the transfer head 10 is removed from the transfer device main body, the pin holding plate 16 is attached to the transfer head 10, and the alcohol solution is applied to the pins 12, 12. Get down to. Then, the compressed air is supplied to the compressed air supply passage 24 and the compressed air is injected from each through hole 14 to clean the pins 12, 12,.
As described above, in the transfer device shown in FIGS. 1 and 3, since the pin holding plate 16 can be cleaned with the transfer head 10 attached, the fear that the pins 12, 12,... Fall from the pin holding plate 16 can be eliminated. The pins 12, 12,... Can be cleaned with peace of mind.
In addition, although the flux is mentioned as a paste-form material, an adhesive agent may be sufficient.

It is a fragmentary sectional view of the transfer head which constitutes the transfer device concerning the present invention. It is explanatory drawing explaining the other example of the pin used for the transfer apparatus shown in FIG. FIG. 2 is a partial cross-sectional view illustrating a state in which a tip of a transfer head pin illustrated in FIG. 1 is in contact with a stage. It is process drawing explaining the process of mounting the solder ball as an external connection terminal of BGA. It is process drawing explaining the transfer method which transcribe | transfers a flux to each of the pad shown in FIG. It is a fragmentary sectional view explaining the improved transfer head. FIG. 7 is a partial cross-sectional view illustrating a state in which the tip of the transfer head pin shown in FIG. 6 is separated from the contact surface. It is explanatory drawing explaining the climbing condition to the pin of paste material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Transfer head 12 Pin 12a Pin-shaped part 12b of pin 12 Tip part 14 of pin 12 Through-hole 16 Pin holding plate 18 Space part 20 Cushion member 22 Protective sheet 24 Compressed air supply path 26 Stage 28 Film-like body

Claims (10)

Paste-like material in which paste-like material is attached to each tip portion of a plurality of pins suspended independently from each other from the transfer head, and the paste-like material is transferred to a predetermined location on the abutting surface where each tip tip abuts In material transfer equipment,
In the transfer head, a space portion having a bottom formed by a pin holding plate having a through-hole into which each of a plurality of pins is inserted so as to freely move up and down, and
A cushion member inserted into the space portion and pressing each rear end portion of the plurality of pins toward the pin holding plate;
The space portion is configured so that an air flow is ejected from each through hole of the pin holding plate into which the pin is inserted toward the tip end portion of the pin, and the paste-like material is prevented from creeping up toward the rear end portion of the pin. A paste-like material transfer device, comprising: a compressed air supply passage for supplying compressed air into a space portion from an opening portion opened in an inner wall surface of the substrate.   2. The paste-like material transfer device according to claim 1, wherein a protective sheet is provided on a contact surface that contacts the rear end of the pin of the cushion member.   3. The paste material transfer device according to claim 1, wherein the cushion member is a sponge-like cushion member.   The transfer device for paste-like material according to any one of claims 1 to 3, wherein the pin is a pin in which a bowl-shaped portion having a diameter larger than that of the through hole of the pin holding plate is formed at a rear end portion.   The transfer apparatus for paste-like material according to any one of claims 1 to 4, wherein the paste-like material is a paste-like material whose viscosity decreases with time. When the paste-like material is attached to each tip portion of a plurality of pins suspended independently from each other from the transfer head, and the paste-like material is transferred to a predetermined location on the contact surface with which each tip tip abuts ,
As the transfer head, a space part having a bottom formed by a pin holding plate in which a through hole into which each of a plurality of pins is inserted so as to freely move up and down is inserted, and the plurality of pins are inserted into the space part. A transfer head comprising: a cushion member that presses each rear end portion of the pin in the direction of the pin holding plate; and a compressed air supply path that supplies compressed air into the space portion from an opening portion opened in the inner wall surface of the space portion. Use
In order to prevent the paste-like material attached to the tip of the pin from creeping up in the direction of the rear end of the pin, compressed air is supplied from the compressed air supply path into the space, and the pin A method for transferring a paste-like material, wherein an air flow is jetted from a through hole of a pin holding plate into which each of the pins is inserted toward a tip of the pin, and is transferred to a predetermined portion of the contact surface.   The method for transferring a paste-like material according to claim 6, wherein a protective sheet is provided on a contact surface that contacts the rear end of the pin of the cushion member.   The paste material transfer device according to claim 6 or 7, wherein a sponge-like cushion member is used as the cushion member.   The method for transferring a paste-like material according to any one of claims 6 to 8, wherein the pin is a pin in which a bowl-shaped part having a diameter larger than the through hole of the pin holding plate is formed at the rear end part.   The paste-like material transfer method according to any one of claims 6 to 9, wherein a paste-like material whose viscosity decreases with time is used as the paste-like material.

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