JP2007109085A5 - - Google Patents

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Publication number
JP2007109085A5
JP2007109085A5 JP2005300507A JP2005300507A JP2007109085A5 JP 2007109085 A5 JP2007109085 A5 JP 2007109085A5 JP 2005300507 A JP2005300507 A JP 2005300507A JP 2005300507 A JP2005300507 A JP 2005300507A JP 2007109085 A5 JP2007109085 A5 JP 2007109085A5
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JP
Japan
Prior art keywords
heat generation
control
generation state
state
application
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005300507A
Other languages
English (en)
Japanese (ja)
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JP2007109085A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005300507A priority Critical patent/JP2007109085A/ja
Priority claimed from JP2005300507A external-priority patent/JP2007109085A/ja
Priority to PCT/JP2006/314385 priority patent/WO2007043231A1/ja
Priority to US12/067,315 priority patent/US8068940B2/en
Publication of JP2007109085A publication Critical patent/JP2007109085A/ja
Publication of JP2007109085A5 publication Critical patent/JP2007109085A5/ja
Pending legal-status Critical Current

Links

JP2005300507A 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム Pending JP2007109085A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005300507A JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム
PCT/JP2006/314385 WO2007043231A1 (ja) 2005-10-14 2006-07-20 発熱制御方法および発熱制御装置
US12/067,315 US8068940B2 (en) 2005-10-14 2006-07-20 Method and apparatus for controlling heat generation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300507A JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム

Publications (2)

Publication Number Publication Date
JP2007109085A JP2007109085A (ja) 2007-04-26
JP2007109085A5 true JP2007109085A5 (enExample) 2008-02-28

Family

ID=37942493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300507A Pending JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム

Country Status (3)

Country Link
US (1) US8068940B2 (enExample)
JP (1) JP2007109085A (enExample)
WO (1) WO2007043231A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4804490B2 (ja) * 2008-02-18 2011-11-02 富士通株式会社 情報処理装置、情報処理方法、情報処理プログラム
KR101894282B1 (ko) * 2011-07-29 2018-09-03 삼성전자 주식회사 단말기 온도 제어 방법 및 이를 지원하는 단말기
KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
JPWO2013073188A1 (ja) * 2011-11-15 2015-04-02 パナソニックＩｐマネジメント株式会社 車載用光ディスク装置
US9274805B2 (en) * 2012-02-24 2016-03-01 Qualcomm Incorporated System and method for thermally aware device booting
US9383789B2 (en) * 2012-06-21 2016-07-05 Apple Inc. Thermal control apparatus and methodology
US9250666B2 (en) 2012-11-27 2016-02-02 International Business Machines Corporation Scalable data collection for system management
CN105468498A (zh) * 2014-09-03 2016-04-06 中兴通讯股份有限公司 一种热处理的方法和装置
DE102015007245B4 (de) * 2015-06-05 2024-09-19 Audi Ag Verfahren zum Betreiben einer Datenbrilleneinrichtung und Datenbrilleneinrichtung
JP6797487B2 (ja) * 2017-04-24 2020-12-09 株式会社ユニバーサルエンターテインメント 遊技機
JP6797486B2 (ja) * 2017-04-24 2020-12-09 株式会社ユニバーサルエンターテインメント 遊技機
JP6797488B2 (ja) * 2017-04-24 2020-12-09 株式会社ユニバーサルエンターテインメント 遊技機
JP7146622B2 (ja) 2018-12-26 2022-10-04 ルネサスエレクトロニクス株式会社 半導体装置、温度制御装置、及び方法
US11347198B2 (en) 2020-09-04 2022-05-31 Apple Inc. Adaptive thermal control system
EP4361755A4 (en) * 2021-06-24 2024-07-31 Sony Group Corporation INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING SYSTEM
WO2023074196A1 (ja) 2021-10-25 2023-05-04 ソニーグループ株式会社 情報処理装置、遠隔操作装置、情報処理方法および遠隔操作方法

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US7194646B1 (en) * 1989-10-30 2007-03-20 Texas Instruments Incorporated Real-time thermal management for computers
US6463396B1 (en) * 1994-05-31 2002-10-08 Kabushiki Kaisha Toshiba Apparatus for controlling internal heat generating circuit
US7822996B2 (en) * 1995-12-07 2010-10-26 Texas Instruments Incorporated Method for implementing thermal management in a processor and/or apparatus and/or system employing the same
US6029119A (en) * 1996-01-16 2000-02-22 Compaq Computer Corporation Thermal management of computers
JP2000298782A (ja) * 1999-04-14 2000-10-24 Mitsubishi Electric Corp プラント監視装置
US6823516B1 (en) * 1999-08-10 2004-11-23 Intel Corporation System and method for dynamically adjusting to CPU performance changes
US6948082B2 (en) * 2002-05-17 2005-09-20 International Business Machines Corporation Method and apparatus for software-assisted thermal management for electronic systems
DE60320854D1 (de) * 2003-01-13 2008-06-19 Koninkl Philips Electronics Nv Plattenlaufwerk
US6934658B2 (en) * 2003-03-27 2005-08-23 International Business Machines Corporation Computer chip heat responsive method and apparatus
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US20040268159A1 (en) * 2003-06-30 2004-12-30 Microsoft Corporation Power profiling
US7451332B2 (en) * 2003-08-15 2008-11-11 Apple Inc. Methods and apparatuses for controlling the temperature of a data processing system
US7127625B2 (en) * 2003-09-04 2006-10-24 Hewlett-Packard Development Company, L.P. Application management based on power consumption
US7287173B2 (en) * 2003-12-19 2007-10-23 Intel Corporation Method for computing power consumption levels of instruction and recompiling the program to reduce the excess power consumption
US7194641B2 (en) * 2004-01-22 2007-03-20 International Business Machines Corporation Method and apparatus for managing power and thermal alerts transparently to an operating system in a data processing system with increased granularity in reducing power usage and thermal generation
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US7194645B2 (en) * 2005-02-09 2007-03-20 International Business Machines Corporation Method and apparatus for autonomic policy-based thermal management in a data processing system
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US7624318B2 (en) * 2005-09-27 2009-11-24 International Business Machines Corporation Method and apparatus for automatically identifying multiple combinations of operational and non-operational components on integrated circuit chips with a single part number

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