JP2007108542A - Optical fiber module - Google Patents

Optical fiber module Download PDF

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Publication number
JP2007108542A
JP2007108542A JP2005301080A JP2005301080A JP2007108542A JP 2007108542 A JP2007108542 A JP 2007108542A JP 2005301080 A JP2005301080 A JP 2005301080A JP 2005301080 A JP2005301080 A JP 2005301080A JP 2007108542 A JP2007108542 A JP 2007108542A
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optical fiber
light
wiring board
fiber module
housing
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Mitsusato Ishizaka
光識 石坂
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical fiber module that is free from light leak and highly reliable. <P>SOLUTION: The optical fiber module 1 covered with a shield case 2 is formed by joining a housing 5 being a resin formed product to a light receiving/emitting device 4. On one face of the housing 5, recesses 5a, 5b in which the mounting part of a light receiving/emitting element is housed are formed, while, on the opposite face, an insertion port 5c to/from which an optical fiber 3 can be inserted/extracted is formed. Between the recesses 5a, 5b, there is formed a partition wall 5f for separating the two recesses. Through holes 6a which are a plurality of external connecting electrodes are formed on one side face of a wiring board 6 composed of glass epoxy resin or the like. An LED 7 and a light emitting IC 8 as well as a PDi 9 and a light receiving IC 10 are mounted on the same wiring board 6 and sealed with a light transmitting sealing resin 11. A groove 6b is formed between the light emitting element and the light receiving element on the wiring board 6. A part of the partition wall 5f, forming a projected part 5g and projecting from the joining face with the wiring board 6 of the housing 5, is fitted to the groove 6b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は光ファイバを用いた受発信装置である光ファイバモジュールに関する。   The present invention relates to an optical fiber module which is a transmission / reception device using an optical fiber.

光ファイバは細径(直径0.1mm程度)、軽量(ガラスの比重は銅の比重の約1/4)、可とう性に優れている(曲率半径数cm以下)、電磁誘導を受けない、漏話に強い、低損失(例えば1dB/km)高帯域伝送が可能、資源問題が少ないなどの特徴を持つことから、光ファイバケーブルを用いた伝送方式は公衆通信の分野であるWANの領域はもとより、LANと言われる局内構成の伝送系やデータバス、データリンク、各種計測制御システム等広範囲な適用分野を有している。   The optical fiber is thin (about 0.1 mm in diameter), lightweight (the specific gravity of glass is about 1/4 of the specific gravity of copper), excellent in flexibility (with a radius of curvature of several centimeters or less), not subjected to electromagnetic induction, Because it has strong features such as crosstalk, low loss (for example, 1 dB / km) and high-bandwidth transmission, and few resource problems, transmission systems using optical fiber cables are used not only in the WAN area, which is a field of public communication. It has a wide range of application fields, such as a transmission system with internal configuration called a LAN, a data bus, a data link, and various measurement control systems.

また、ヨーロッパを中心としてMOST(Media Oriented
Systems Transport)と云われる車内ネットワーク規格が採用されている。これによってナビゲーションシステムをはじめ、オーディオ・電話等のインテリジェンス機能を繋いで相互に利用しあう環境を提供している。そこではPOF(Plastic Optical Fiber)を2本使用してデータ通信する2芯双方向型の光ファイバモジュールが用いられている(例えば、非特許文献1参照。)。また、こうした車載用の光ファイバモジュールに関しても鉛フリーの半田接合の要求が必須になってきている。
In addition, mainly in Europe, MOST (Media Oriented)
An in-vehicle network standard called Systems Transport) has been adopted. This provides an environment in which navigation systems and other intelligence functions such as audio and telephone can be connected to each other. In this case, a two-core bidirectional optical fiber module that uses two POFs (Plastic Optical Fibers) for data communication is used (for example, see Non-Patent Document 1). In addition, with respect to such an in-vehicle optical fiber module, a demand for lead-free solder bonding has become essential.

このような背景のもとで本願出願人は、マザーボードへの実装に際してリード端子を鉛フリーのリフローが可能な表面実装タイプに改良した信頼性の高い光ファイバモジュールを出願している(特許文献1参照)。図3は従来の光ファイバモジュールの部分断面底面図である。51は後述する受発光デバイスをハウジングに収納して双方向光伝送の機能を果たす表面実装型光ファイバモジュール(受発光モジュール)を示している。2は光ファイバモジュール51を覆っているシールドケースを示している。シールドケース2の側面と背面には光ファイバモジュール1を位置決め保持するためのリブ2aが内側に切り起こされている。3は光ファイバであり、先端部に係合ピン3aを有する差込部3bが嵌挿してある。   Under such circumstances, the applicant of the present application has applied for a highly reliable optical fiber module in which the lead terminals are improved to a surface mounting type capable of lead-free reflow when mounted on a motherboard (Patent Document 1). reference). FIG. 3 is a partial sectional bottom view of a conventional optical fiber module. Reference numeral 51 denotes a surface-mounting optical fiber module (light emitting / receiving module) that houses a light emitting / receiving device, which will be described later, in a housing and performs a bidirectional optical transmission function. Reference numeral 2 denotes a shield case covering the optical fiber module 51. Ribs 2a for positioning and holding the optical fiber module 1 are cut and raised on the side and back of the shield case 2. Reference numeral 3 denotes an optical fiber, into which a plug portion 3b having an engagement pin 3a is fitted at the tip.

更に、光ファイバモジュール51の構成について説明する。4は発光素子と受光素子とが同一配線基板上に実装されて成る受発光デバイスを示している。5は受発光デバイス4に接合された樹脂成形品であるハウジングである。ハウジング5には受発光素子の実装部が収納される凹部である凹部5a及び5b、並びに光ファイバ3の差込部3bが挿抜可能な差込口5cが形成されて凹部5a及び5bに通じている。差込部5cには係合ピン3aが挿入される挿入溝5eと、挿入溝5eに連通した円弧状溝部5dが形成されており、係合ピン3aが溝部5dに係合することによって光ファイバ3の脱落を防止している。   Further, the configuration of the optical fiber module 51 will be described. Reference numeral 4 denotes a light emitting / receiving device in which a light emitting element and a light receiving element are mounted on the same wiring board. Reference numeral 5 denotes a housing which is a resin molded product joined to the light emitting / receiving device 4. The housing 5 is formed with recesses 5a and 5b which are recesses in which the mounting portions of the light emitting and receiving elements are accommodated, and an insertion port 5c into which the insertion portion 3b of the optical fiber 3 can be inserted and removed, and leads to the recesses 5a and 5b. Yes. The insertion portion 5c is formed with an insertion groove 5e into which the engagement pin 3a is inserted, and an arcuate groove portion 5d communicating with the insertion groove 5e, and the engagement pin 3a engages with the groove portion 5d so that an optical fiber is formed. 3 is prevented from falling off.

6はガラスエポキシ樹脂等より成る配線基板であり、その一側面に複数の外部接続電極であるスルーホール6aが形成されている。スルーホール6aの端面はシールドケース2の開口のある底面に面一に露出している。7は変調された電気信号を光信号に変換する発光素子である発光ダイオード(LED)であり、8はロジックレベルの電気信号を発光素子駆動用信号に変換する発光ICであって、ともに配線基板6上に搭載され、ワイヤ配線されている。   Reference numeral 6 denotes a wiring board made of glass epoxy resin or the like, and a plurality of through holes 6a as external connection electrodes are formed on one side surface thereof. The end surface of the through hole 6a is exposed flush with the bottom surface of the shield case 2 having the opening. Reference numeral 7 denotes a light emitting diode (LED) which is a light emitting element that converts a modulated electric signal into an optical signal. Reference numeral 8 denotes a light emitting IC that converts a logic level electric signal into a light emitting element driving signal. 6 is mounted and wired.

9は光信号を電気信号に変換する受光素子であるフォトダイオード(PDi)であり、10はPDi9で受光した光信号を電気信号に変換し、更にロジックレベルに増幅するための受光ICであり、ともに配線基板6上に搭載され、ワイヤ配線されている。11はLED7及び発光IC8並びにPDi9及び受光IC10をそれぞれ封止している封止樹脂であり、可視光を透過する。
MOST概要、日経エレクトロニクス、日本、日経BP社、 1999年4月19日、No.741、p.108−121 特願2004−118380号(未公開)
Reference numeral 9 denotes a photodiode (PDi) that is a light receiving element that converts an optical signal into an electric signal, and reference numeral 10 denotes a light receiving IC that converts the optical signal received by the PDi 9 into an electric signal and further amplifies it to a logic level. Both are mounted on the wiring board 6 and wired. Reference numeral 11 denotes a sealing resin that seals the LED 7 and the light emitting IC 8, the PDi 9 and the light receiving IC 10, and transmits visible light.
Overview of MOST, Nikkei Electronics, Japan, Nikkei Business Publications, April 19, 1999, No. 741, p. 108-121 Japanese Patent Application No. 2004-118380 (unpublished)

しかし、従来のこのような光ファイバモジュールでは、受信側の受光感度を向上させて行く中で、受発光デバイスとハウジングとの接合面のわずかな隙間から発信側の光が受光側へリークして受信側が誤動作してしまうという問題があった。   However, in such a conventional optical fiber module, while improving the light receiving sensitivity on the receiving side, light on the transmitting side leaks to the light receiving side from a slight gap in the joint surface between the light receiving and emitting device and the housing. There was a problem that the receiving side malfunctioned.

本発明は、このような従来の問題を解決するためになされたものであり、その目的は、発光部から受光部への光のリークを無くした信頼性の高い光ファイバモジュールを提供することである。   The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a highly reliable optical fiber module that eliminates light leakage from the light emitting unit to the light receiving unit. is there.

前述した目的を達成するための本発明の手段は、光ファイバにより光信号を送受信する発光素子及び受光素子を、一側面に外部接続電極を設けた同一配線基板上に実装して受発光デバイスを形成するとともに、前記受発光デバイスを収納する凹部と前記光ファイバが挿抜可能な差込口とを設けたハウジングに前記受発光デバイスを接合して成る光ファイバモジュールにおいて、前記ハウジングの前記凹部には前記発光素子と前記受光素子との間を遮る隔壁を設けて、この壁面の一部が前記配線基板上に設けた溝部の中に嵌入していることを特徴とする。   The means of the present invention for achieving the above-described object is to mount a light emitting / receiving device by mounting a light emitting element and a light receiving element that transmit and receive an optical signal by an optical fiber on the same wiring board provided with an external connection electrode on one side surface. In the optical fiber module formed by joining the light emitting / receiving device to a housing provided with a recess for housing the light receiving / emitting device and an insertion port through which the optical fiber can be inserted / removed, the recess of the housing A partition wall is provided between the light emitting element and the light receiving element, and a part of the wall surface is fitted into a groove provided on the wiring board.

本発明によれば、光ファイバにより光信号を送受信する発光素子及び受光素子を、一側面に外部接続電極を設けた同一配線基板上に実装して受発光デバイスを形成するとともに、前記受発光デバイスを収納する凹部と前記光ファイバが挿抜可能な差込口とを設けたハウジングに前記受発光デバイスを接合して成る光ファイバモジュールにおいて、前記ハウジングの前記凹部には前記発光素子と前記受光素子との間を遮る隔壁を設けて、この壁面の一部が前記配線基板上に設けた溝部の中に嵌入しているようにしたので、発光部から受光部への光のリークが無くなってデータ伝送時に誤動作がなく信頼性の高い光ファイバーモジュールを提供することができる。   According to the present invention, a light emitting element and a light receiving element that transmit and receive an optical signal using an optical fiber are mounted on the same wiring board provided with an external connection electrode on one side surface to form a light receiving and emitting device. In the optical fiber module formed by joining the light emitting / receiving device to a housing provided with a recess for housing the optical fiber and an insertion port through which the optical fiber can be inserted and removed, the light emitting element and the light receiving element are provided in the recess of the housing. A partition wall is provided to block the gap, and a part of this wall is inserted into the groove provided on the wiring board. It is possible to provide a highly reliable optical fiber module that sometimes does not malfunction.

以下、本発明の実施の形態を図面に基づいて詳細に説明する。図1はこの本発明の実施である光ファイバモジュールの部分断面底面図である。図2はこの光ファイバモジュールの分解組立斜視図である。まず、本発明の実施の形態である光ファイバモジュールの構成を説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a partial sectional bottom view of an optical fiber module which is an embodiment of the present invention. FIG. 2 is an exploded perspective view of the optical fiber module. First, the structure of the optical fiber module which is embodiment of this invention is demonstrated.

図1において、1は後述する受発光デバイスをハウジングに収納して双方向光伝送の機能を果たす表面実装型光ファイバモジュール(受発光モジュール)を示している。ハウジング5に設けた受発光デバイス4の実装部を収納する凹部である発光側の凹部5aと受光側の凹部5bとの間には両者を隔てる隔壁5fが形成されている。隔壁5fの一部は配線基板6との接合面より外側へ突出して突条部5gを成している。配線基板6の上面には発光素子の実装部と受光素子の実装部との間に溝部6bが形成されている。突状部5gは溝部6bの中へ嵌入している。その他の構成は従来の光ファイバモジュール51とほぼ同様の構成をしているので、同じ構成要素には同じ符号と名称とを付して詳細な説明を省略する。   In FIG. 1, reference numeral 1 denotes a surface-mounting optical fiber module (light emitting / receiving module) that houses a light emitting / receiving device (to be described later) in a housing and performs a bidirectional optical transmission function. A partition wall 5f is formed between the light-emitting side recess 5a and the light-receiving side recess 5b, which is a recess for housing the mounting portion of the light emitting / receiving device 4 provided in the housing 5. A part of the partition wall 5f protrudes outward from the joint surface with the wiring substrate 6 to form a protrusion 5g. A groove 6b is formed on the upper surface of the wiring board 6 between the light emitting element mounting part and the light receiving element mounting part. The protruding portion 5g is fitted into the groove 6b. Since other configurations are substantially the same as those of the conventional optical fiber module 51, the same components are denoted by the same reference numerals and names, and detailed description thereof is omitted.

次に、本発明の実施の形態の効果について説明する。ハウジング5の凹部5aと5bとの間には隔壁5fを設けて、この隔壁5fの一部が突条部5gとなって配線基板6上に設けた溝部6bの中に嵌入するようにしてあるので、発光部から受光部への光のリークを無くすことができた。従って光ファイバーモジュール1はデータ伝送時に誤動作がなく信頼性の高い光ファイバーモジュールとなった。   Next, effects of the embodiment of the present invention will be described. A partition wall 5f is provided between the recesses 5a and 5b of the housing 5, and a part of the partition wall 5f serves as a protrusion 5g and is fitted into a groove 6b provided on the wiring board 6. Therefore, light leakage from the light emitting part to the light receiving part can be eliminated. Therefore, the optical fiber module 1 is a highly reliable optical fiber module without malfunction during data transmission.

本発明の光ファイバモジュールは、局内通信用又は車載のオーディオデータ通信用などに適用される。   The optical fiber module of the present invention is applied for intra-office communication or in-vehicle audio data communication.

本発明の実施の形態である光ファイバモジュールの部分断面底面図である。It is a partial section bottom view of the optical fiber module which is an embodiment of the invention. 本発明の実施の形態である光ファイバモジュールの分解組立斜視図である。1 is an exploded perspective view of an optical fiber module according to an embodiment of the present invention. 従来の光ファイバモジュールの部分断面底面図である。It is a fragmentary sectional bottom view of the conventional optical fiber module.

符号の説明Explanation of symbols

1 光ファイバモジュール
3 光ファイバ
4 受発光デバイス
5 ハウジング
5a、5b 凹部
5c 差込口
5f 隔壁
5g 突条部
6 配線基板
6a スルーホール
6b 溝部
7 LED
8 発光IC
9 PDi
10 受光IC
DESCRIPTION OF SYMBOLS 1 Optical fiber module 3 Optical fiber 4 Light emitting / receiving device 5 Housing 5a, 5b Recessed part 5c Insertion port 5f Partition 5g Projection part 6 Wiring board 6a Through hole 6b Groove part 7 LED
8 Light emitting IC
9 PDi
10 Light receiving IC

Claims (1)

光ファイバにより光信号を送受信する発光素子及び受光素子を、一側面に外部接続電極を設けた同一配線基板上に実装して受発光デバイスを形成するとともに、前記受発光デバイスを収納する凹部と前記光ファイバが挿抜可能な差込口とを設けたハウジングに前記受発光デバイスを接合して成る光ファイバモジュールにおいて、前記ハウジングの前記凹部には前記発光素子と前記受光素子との間を遮る隔壁を設けて、この壁面の一部が前記配線基板上に設けた溝部の中に嵌入していることを特徴とする光ファイバモジュール。
A light-emitting element and a light-receiving element that transmit and receive an optical signal using an optical fiber are mounted on the same wiring board provided with an external connection electrode on one side surface to form a light-receiving / emitting device, and a recess that houses the light-receiving / emitting device; In the optical fiber module in which the light receiving and emitting device is joined to a housing provided with an insertion port through which an optical fiber can be inserted and removed, a partition that blocks between the light emitting element and the light receiving element is formed in the concave portion of the housing. An optical fiber module, wherein a part of the wall surface is fitted in a groove provided on the wiring board.
JP2005301080A 2005-10-15 2005-10-15 Optical fiber module Pending JP2007108542A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175432A (en) * 2008-01-24 2009-08-06 Anritsu Corp Optical transmission and reception module and optical pulse tester
US8478129B2 (en) 2008-09-09 2013-07-02 Nec Corporation Optical communication device, optical transceiver using the same and manufacturing method of optical communication device
WO2023158687A1 (en) * 2022-02-15 2023-08-24 Avicenatech Corp. Packaging microled optical interconnects

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175432A (en) * 2008-01-24 2009-08-06 Anritsu Corp Optical transmission and reception module and optical pulse tester
US8478129B2 (en) 2008-09-09 2013-07-02 Nec Corporation Optical communication device, optical transceiver using the same and manufacturing method of optical communication device
WO2023158687A1 (en) * 2022-02-15 2023-08-24 Avicenatech Corp. Packaging microled optical interconnects

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