JP2007103473A - Solar cell device and solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solar cell device and solar cell module having a high yield by satisfying a function of a finger and improving the adhesive strength required for a bus bar electrode. <P>SOLUTION: The solar cell device includes a photoelectric conversion layer, and a collector electrode 6 formed on at least one face of the photoelectric conversion layer. The collector electrode 6 consists of a finger electrode 6a and the bus bar electrode 6b. The finger electrode 6a and the bus bar electrode 6b are formed of conductive paste of different components, and are so formed that the adhesive strength of the bus bar electrode 6b may be larger than that of the finger electrode 6a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a solar cell device and a solar cell module provided with a collector electrode.

  A collector electrode is provided on a light incident side surface (hereinafter referred to as a light receiving surface) of the solar cell device. The collector electrode is composed of a plurality of thin finger electrode portions for collecting a photocurrent generated by light incidence and a relatively thick bus bar electrode portion for taking out the collected photocurrent to the outside (for example, , See Patent Document 1).

  Such a collector electrode is formed, for example, by screen-printing a silver paste on the light receiving surface. A collector electrode is similarly formed on the surface opposite to the light receiving surface of the solar cell device (hereinafter referred to as the back surface).

  Moreover, a solar cell module is comprised by connecting a some solar cell apparatus (for example, refer patent document 1). When manufacturing a solar cell module, in order to connect adjacent solar cell devices in series, a tab made of solder-coated copper foil or the like is joined to the bus bar electrode portion of the collector electrode of each solar cell device. In this case, silver and solder are alloyed at the joint portion (interface portion) between the tab solder and the silver paste of the bus bar electrode portion. Thereby, good electrical contact can be obtained.

  As described above, the main roles of the finger electrode portion that is the collector electrode and the bus bar electrode portion that is the connection electrode are different. The finger portion is formed for the purpose of efficiently collecting the photocurrent generated from the solar cell without resistance loss. When the finger portion is formed on the light receiving surface side, it is preferable not to be a shadow when light is incident. . For this reason, it is desired to make it as thin as possible and reduce its resistance loss.

On the other hand, the bus bar electrode part has a strong role for connection to the tab, and the width of the bus bar electrode part is determined from the thickness and resistivity of the tab, and the optimum width of the tab is determined in consideration of resistance loss and photocurrent loss. Therefore, the width of the bus bar electrode portion is often determined according to this.
JP-A-2005-252108

  As described above, the bus bar electrode portion has a strong role for connection to the tab. For this reason, the bus bar electrode part needs connection strength between the tab and the solar cell device.

  Conventionally, the bus bar electrode portion and the finger electrode portion are formed by screen printing a conductive paste such as a silver paste. For this reason, the silver paste suitable for a finger electrode part is used focusing on reducing the resistance loss requested | required as a finger electrode part. However, there is still room for improvement in the adhesive strength between the solar cell devices.

  Moreover, when the adhesive strength of the bus bar electrode portion is low, the bus bar electrode may be peeled off in the process of manufacturing the solar cell module, which causes a decrease in yield.

  Accordingly, an object of the present invention is to provide a solar cell device and a solar cell module that satisfy the functions of the finger portions and improve the adhesive strength required for the bus bar electrode portions, and have a high yield.

  The solar cell device of the present invention includes a photoelectric conversion layer and a collector electrode provided on at least one surface of the photoelectric conversion layer, and the collector electrode includes a finger electrode portion and a bus bar electrode portion, and the finger electrode portion The bus bar electrode part is composed of conductive pastes of different components, and the adhesion strength of the bus bar electrode part is larger than the adhesion strength of the finger electrode part.

  Further, it is preferable that the bus bar electrode portion is provided with a connection convex portion corresponding to the number of finger electrode portions, and the finger electrode portion and the bus bar electrode portion are connected by this convex portion.

  Moreover, the solar cell module of the present invention includes a plurality of solar cell devices and a conductive connection member that connects the plurality of solar cell devices, and each of the plurality of solar cell devices includes a photoelectric conversion layer, A collector electrode provided on at least one surface of the photoelectric conversion layer and the other electrode provided corresponding to the collector electrode, the collector electrode including a finger electrode portion and a bus bar electrode portion, and the finger electrode And the bus bar electrode part are formed of conductive pastes of different components, the bus bar electrode part is formed such that the adhesive strength of the bus bar electrode part is larger than the adhesive strength of the finger electrode part, and the solar cell device of one of the plurality of solar cell devices The bus bar electrode portion and the connection member are joined, and the other electrode of the other solar cell device and the connection member among the plurality of solar cell devices are joined. .

  In addition, another solar cell module of the present invention includes a plurality of solar cell devices and a conductive connection member that connects the plurality of solar cell devices, and each of the plurality of solar cell devices includes photoelectric conversion. A collector electrode provided on one surface of the photoelectric conversion layer, and the other collector electrode corresponding to the collector electrode and provided on the other surface of the photoelectric conversion layer. And the bus bar electrode part, the finger electrode part and the bus bar electrode part are made of conductive pastes of different components, the contact strength of the bus bar electrode part is formed to be greater than the contact strength of the finger electrode part, and the plurality of solar cells Each bus bar electrode part of each solar cell device located on the light incident side of the device is joined by the connecting member, and each solar cell device located on the back side of the plurality of solar cell devices The bus bar electrode portions with each other is characterized in that it is joined by the connecting member.

  According to the configuration described above, it is possible to provide collector electrodes each having a function as a bus bar electrode portion and a function as a finger electrode portion, and it is possible to provide a solar cell device and a solar cell module with high yield.

  Embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated in order to avoid duplication of description.

  FIG. 1 is a cross-sectional view showing a configuration of a solar cell device according to an embodiment of the present invention, FIG. 2 is a plan view showing a collector electrode according to an embodiment of the present invention, and FIG. 3 is according to the embodiment shown in FIG. It is sectional drawing which showed the structure of the solar cell module using a solar cell apparatus.

  First, with reference to FIG. 1 thru | or FIG. 3, the structure of the solar cell apparatus by this embodiment and a solar cell module (solar cell apparatus) using the same is demonstrated.

  The solar cell device 1 according to this embodiment uses a heterojunction with intrinsic thin layer (HIT) structure. As shown in FIG. 1, the solar cell device 1 has an n-type single crystal silicon substrate 2 (hereinafter referred to as an n-type single crystal silicon substrate 2) having a resistivity of about 1 Ω · cm and a thickness of about 300 μm and having a (100) plane. Crystal silicon substrate 2). On the surface of the n-type single crystal silicon substrate 2, pyramidal irregularities having a height of several μm to several tens of μm are formed. A substantially intrinsic i-type amorphous silicon layer 3 having a thickness of about 5 nm is formed on the upper surface of the n-type single crystal silicon substrate 2. A p-type amorphous silicon layer 4 having a thickness of about 5 nm is formed on the i-type amorphous silicon layer 3.

An ITO film 5 as a transparent conductive film having a thickness of about 100 nm is formed on the p-type amorphous silicon layer 4. The ITO film 5 is made of In ₂ O ₃ to which SnO ₂ is added.

  Further, a collector electrode (paste electrode) 6 which is a feature of the present invention is formed in a predetermined region on the upper surface of the ITO film 5. The collector electrode 6 is composed of a conductive filler made of silver (Ag) and a thermosetting resin. As shown in FIG.1 and FIG.2, the collector electrode 6 is comprised by the finger electrode part 6a and the bus-bar electrode part 6b.

  A substantially intrinsic i-type amorphous silicon layer 7 having a thickness of about 5 nm is formed on the lower surface of the n-type single crystal silicon substrate 2. An n-type amorphous silicon layer 8 having a thickness of about 20 nm is formed on the i-type amorphous silicon layer 7. As described above, the i-type amorphous silicon layer 7 and the n-type amorphous silicon layer 8 are sequentially formed on the lower surface of the n-type single crystal silicon substrate 2, thereby forming a so-called BSF (Back Surface Field) structure. Is formed. An ITO film 9 having a thickness of about 100 nm is formed on the n-type amorphous silicon layer 8. A collector electrode (paste electrode) 10 is formed in a predetermined region on the ITO film 9. The other configurations of the i-type amorphous silicon layer 7, the n-type amorphous silicon layer 8, the ITO film 9, and the collector electrode 10 formed on the lower surface of the n-type single crystal silicon substrate 2 are as follows. The configuration is the same as that of the i-type amorphous silicon layer 3, the p-type amorphous silicon layer 4, the ITO film 5 and the collector electrode 6 formed on the upper surface of the n-type single crystal silicon substrate 2.

  In the above embodiment, an ITO film is used as the transparent conductive film, but another transparent conductive film, for example, a ZnO film may be used.

  In order to reduce the resistance of the finger electrode portion 6a, the collector electrode 6 according to the present invention is formed by screen printing using, for example, a paste material having an increased metal content and good printability. Further, the bus bar electrode portion 6b is formed by screen printing using a paste material in which the resin content is increased with emphasis on adhesive strength. Therefore, the finger electrode portion 6a is formed with a smaller resistance than the bus bar electrode portion 6b. And as for adhesive strength, the bus-bar electrode part 6b is formed more strongly than the finger electrode part 6a.

  In these pastes, silver particles are blended in the resin. In these pastes, as shown in FIG. 4, the silver particles are substantially granular fillers (spherical particles) 60 having a diameter of 5 μm or less, and flaky fillers having a maximum length (indicated by A or A ′ in the figure) of 20 μm or less. (Flake powder) 61 is mixed.

  For example, as the silver paste material of the finger electrode portion 6a, a material in which the weight ratio of silver to a resin mainly composed of an epoxy resin is 90% silver and 10% resin is used. As the silver, 3 μm spherical particles 60 and 10 μm flake powder 61 having a weight ratio of 50%: 50% are used. This silver paste has a specific resistance of 16 μΩ · cm.

  On the other hand, the silver paste used for the bus bar electrode portion 6b has a higher specific resistance but higher adhesion strength than the silver paste used for the finger electrode portion 6a. For example, the weight ratio of silver and the resin mainly composed of epoxy resin is 85% silver and 15% resin. As the silver, 3 μm spherical particles 60 and 10 μm flake powder 61 having a weight ratio of 40%: 60% are used. This silver paste has a specific resistance of 53 μΩ · cm.

  The adhesion strength of these silver pastes was measured by the grid pattern method of JISK5400. In the measurement, a 100 nm ITO film is formed by sputtering on a 10 cm square 0.3 mm thick glass plate. Then, a 2 cm × 2 cm pattern is printed on each silver paste by a screen printing method. Then, it is baked at a temperature of 200 ° C. for 1 hour and left at room temperature for 1 hour.

  Then, based on the grid pattern method of JISK5400, 1 mm square × 100 squares were cut with a cutter, peeled off with an adhesive tape, and evaluated according to the following table (Appendix 18 of JIS5400).

  The adhesion strength of the silver paste used for the finger electrode portion 6a was 4 points. Further, the adhesion strength of the silver paste used for the bus bar electrode portion 6b was 8 points.

  As described above, the silver paste used for the bus bar electrode portion 6b has a specific resistance slightly inferior to that of the finger electrode portion 6a, but the adhesion strength is increased.

  The thermosetting resin contains an epoxy resin as a main component, and the epoxy resin in the thermosetting resin resin is 70% or more and about 100% or less by volume. When the epoxy resin in the resin binder is less than 100%, the resin components other than the epoxy resin in the resin binder are all composed of a urethane resin.

  As described above, in the solar cell device 1 of the present invention, the silver paste used for the finger electrode portion 6a and the bus bar electrode portion 6b constituting the collector electrode 6 is formed by screen printing using a material suitable for each function. is doing. For this reason, screen printing is performed using a conductive paste (silver paste) having a small specific resistance suitable for the finger electrode portion 6a, and the bus bar electrode portion 6b is inferior in specific resistance characteristics to the finger electrode portion 6a, but the adhesion strength It is formed by screen printing using a large conductive paste (silver paste). Which electrode part is printed first will be described later.

  The solar cell module 11 using the solar cell device 1 according to this embodiment includes a plurality of solar cell devices 1 as shown in FIG. Each of the plurality of solar cell devices 1 is connected in series with another solar cell device 1 adjacent to each other via a tab 12 in which the surface of a flat copper foil is coated with lead (Pb) -free solder. Yes. One end side of the tab 12 is connected to the collector electrode 6 (see FIG. 1) on the upper surface side of the predetermined solar cell device 1, and the other end side is adjacent to the predetermined solar cell device 1. The solar cell device 1 is connected to a collector electrode 10 (see FIG. 1) on the lower surface side.

  The plurality of solar cell devices 1 connected by the tab 12 are covered with a filler 13 made of EVA (Ethylene Vinyl Acetate). A surface protective material 14 made of a glass substrate is provided on the upper surface of the filler 13. A back surface protection material 15 made of a glass substrate is provided on the lower surface of the filler 13.

  Next, a method for manufacturing the collector electrode 6 according to the present invention will be described. As described above, the collector electrode 6 is formed by screening the bus bar electrode portion 6b and the finger electrode portion 6a using silver paste suitable for the function of each electrode. Therefore, one of the electrode portions is screen-printed on the transparent conductive film on the light incident surface side, and then the other electrode portion is formed by screen printing.

  In the manufacturing method shown in FIG. 5, a screen plate having a pattern with a width (opening) of 1.5 mm was prepared as the bus bar electrode portion 6 b on the light incident side. First, the above-described silver paste for the bus bar electrode part is used, and the bus bar electrode part 6b is printed on the transparent conductive film (ITO film 5) using the screen plate for the bus bar electrode part (see FIG. 5A). .

  Subsequently, a collector electrode pattern (screen plate design) with a width (opening width) of the finger electrode portion 6a of 80 μm is prepared. This pattern includes the bus bar electrode 6b and forms an electrode portion on the entire surface of the transparent conductive film (ITO film 5). The finger electrode part 6a is formed using the screen plate of a collector electrode pattern (refer FIG.5 (b)).

  Thereafter, the collector electrode 6 is formed by baking at a temperature of 200 ° C. for 1 hour.

  Thus, according to the formed collector electrode 6, since the bus bar electrode part 6b is directly formed on the transparent conductive film (ITO film 5), the adhesion strength of the bus bar electrode part 6b is strong and hardly peeled off. However, since the finger electrode portion 6a exists on the bus bar electrode portion 6b, there is a problem that it becomes uneven and the tab attaching operation becomes difficult.

  The manufacturing method shown in FIG. 6 is different from that in FIG. 5 in the order of manufacturing the finger electrode portion and the bus bar electrode portion.

  A collector electrode pattern (screen plate design) is prepared in which the width (opening width) of the finger electrode portion 6a is 80 μm. This pattern includes the bus bar electrodes 6b and forms electrode portions on the entire surface of the transparent conductive film (ITO film 5). The finger electrode part 6a is formed using the screen plate of the collector electrode pattern (see FIG. 6A).

  Subsequently, a screen plate having a pattern with a width (opening) of 1.5 mm was prepared as the bus bar electrode portion 6b on the light incident side. After the finger electrode portion 6a is formed, the above-described silver paste for the bus bar electrode portion is used, and the bus bar electrode portion 6b is printed using the screen plate for the bus bar electrode portion (see FIG. 6B).

  Thereafter, the collector electrode 6 is formed by baking at a temperature of 200 ° C. for 1 hour.

  According to the collector electrode 6 thus formed, the surface of the bus bar electrode portion 6b is not easily uneven. However, there is a problem that the adhesion strength of the overlapping portion of the finger electrode portion 6a and the bus bar electrode portion 6b is weakened.

  The manufacturing method shown in FIG. 7 is a screen in which the pattern of the finger electrode portion 6a is slightly overlapped with the end portion of the bus bar electrode portion 6b, and the finger electrode portion 6a is not provided in the central portion of the bus bar electrode portion 6b. A version is used.

  A screen plate having a pattern with a width (opening) of 1.5 mm was prepared as the bus bar electrode portion 6b on the light incident side. First, the above-described silver paste for the bus bar electrode portion is used, and the bus bar electrode portion 6b is printed on the transparent conductive film (ITO film 5) using the screen plate for the bus bar electrode portion (see FIG. 7A). .

  Subsequently, a collector electrode pattern (screen plate design) is prepared in which the width (opening width) of the finger electrode portion 6a1 is 80 μm. The finger electrode portion 6a1 is formed by using a screen plate in which this pattern is slightly overlapped with the end portion of the bus bar electrode portion 6b and the finger electrode portion 6a1 is not provided in the central portion of the bus bar electrode portion 6b ( (Refer FIG.7 (b)). When the finger electrode portion 6a1 is formed, the finger electrode portion 6a2 is formed so as to slightly overlap at both ends of the bus bar electrode portion 6b.

  Thereafter, the collector electrode 6 is formed by baking at a temperature of 200 ° C. for 1 hour.

  Thus, according to the formed collector electrode 6, since the bus bar electrode part 6b is directly formed on the transparent conductive film, the adhesion strength of the bus bar electrode part 6b is strong and is not easily peeled off. However, the presence of the finger electrode portion 6a2 on both ends of the bus bar electrode portion 6b makes the both ends uneven, and there is a problem that the tab attaching operation is difficult although it is improved over that shown in FIG.

  The manufacturing method shown in FIG. 8 differs from that in FIG. 7 in the order of manufacturing the finger electrode portion 6a1 and the bus bar electrode portion 6b.

  A collector electrode pattern (screen plate design) is prepared in which the width (opening width) of the finger electrode portion 6a is 80 μm. The finger electrode portion 6a1 is formed by using a screen plate in which this pattern is slightly overlapped with the end portion of the bus bar electrode portion 6b and the finger electrode portion 6a1 is not provided in the central portion of the bus bar electrode portion 6b ( (See FIG. 8 (a)).

  Subsequently, a screen plate having a pattern with a width (opening) of 1.5 mm is prepared as the bus bar electrode portion 6b on the light incident side. The above-described silver paste for the bus bar electrode part is used, and a screen plate for the bus bar electrode part is used to print and form the bus bar electrode part 6b on the transparent conductive film (ITO film 5) including the finger electrode part 6a1 (FIG. 7 ( b)).

  According to the collector electrode 6 thus formed, the surface of the bus bar electrode portion 6b is not easily uneven. However, there is a problem that the overlapping portion of the finger electrode portion 6a1 and the bus bar electrode portion 6b remains, and the adhesion strength is slightly weakened.

  In the manufacturing method shown in FIG. 9, a convex portion 6b2 to which the end portion of the finger electrode portion 6a1 is connected is provided at the end portion of the bus bar electrode portion 6b1, and the finger electrode portion 6a1 is not provided at the center portion of the bus bar electrode portion 6b1. A screen plate on which a pattern of the finger electrode portion 6a1 is formed is used.

  A screen plate having a pattern with a width (opening) of 1.5 mm was prepared as the bus bar electrode portion 6b1 on the light incident side. First, the above-described silver paste for the bus bar electrode portion is used, the screen plate for the bus bar electrode portion is used, and the bus bar electrode portion having the convex portions 6b2 corresponding to the number of finger electrode portions on the transparent conductive film (ITO film 5). 6b1 is printed and formed (see FIG. 9A).

  Subsequently, a collector electrode pattern (screen plate design) is prepared in which the width (opening width) of the finger electrode portion 6a1 is 80 μm. The pattern is slightly overlapped with the convex portion 6b2 of the bus bar electrode portion 6b1, and the finger electrode portion 6a1 is formed using a screen plate in which the finger electrode portion 6a1 is not provided at the central portion of the bus bar electrode portion 6b1. (See FIG. 9B). When the finger electrode portion 6a1 is formed, the convex portion 6b2 of the bus bar electrode portion 6b1 and the end portion of the finger electrode portion 6a overlap each other.

  Thereafter, the collector electrode 6 is formed by baking at a temperature of 200 ° C. for 1 hour.

  Thus, according to the formed collector electrode 6, since the bus bar electrode part 6b is directly formed on the transparent conductive film, the adhesion strength of the bus bar electrode part 6b is strong and is not easily peeled off. Further, there is no unevenness on the bus bar electrode portion 6b, and a tab can be easily connected. However, the effective area of the light receiving area is slightly reduced.

  The manufacturing method shown in FIG. 10 differs from that in FIG. 9 in the order of manufacturing the finger electrode portion 6a1 and the bus bar electrode portion 6b1.

  A collector electrode pattern (screen plate design) is prepared in which the width (opening width) of the finger electrode portion 6a1 is 80 μm. The pattern is slightly overlapped with the convex portion 6b2 of the bus bar electrode portion 6b1, and the finger electrode portion 6a1 is formed using a screen plate in which the finger electrode portion 6a1 is not provided at the central portion of the bus bar electrode portion 6b1. (See FIG. 10A).

  Subsequently, the above-described silver paste for the bus bar electrode portion is used, and the bus bar electrode portion 6b1 having the convex portions 6b2 corresponding to the number of finger electrode portions is printed on the transparent conductive film using the screen plate for the bus bar electrode portion. (See FIG. 10B). When the bus bar electrode portion 6b1 is formed, the convex portion 6b2 of the bus bar electrode portion 6b1 and the end portion of the finger electrode portion 6a1 overlap each other.

  Thereafter, the collector electrode 6 is formed by baking at a temperature of 200 ° C. for 1 hour.

  Thus, according to the formed collector electrode 6, since the bus bar electrode part 6b1 is directly formed on the transparent conductive film (ITO film 5), the adhesion strength of the bus bar electrode part 6b1 is strong and hardly peeled off. Further, there is no unevenness on the bus bar electrode portion 6b1, and a tab can be easily connected. However, the effective area of the light receiving area is slightly reduced.

  In addition, it is better to form the collector electrode 10 on the back side in the same manner as the collector electrode 6 on the light receiving surface side, but the collector electrode is configured by one-time printing using only the conductive paste for the bus bar electrode part having high adhesion strength. You may do it. The resistance loss may be dealt with by the number of finger electrode portions or the width of the finger electrode portions.

  In the solar cell module 11 shown in FIG. 3, the tab 12 is connected in series from the bus bar electrode portion 6 a on the light receiving surface side of one solar cell device 1 to the electrode 10 on the back surface side of another adjacent solar cell device 1. Configured to connect. In the solar cell module 11 according to another embodiment of the present invention shown in FIG. 12, the light receiving surface side tabs 12a of adjacent solar cell devices 1a and 1b are connected to each other, and the back surface sides are connected to each other with the tab 12b. Are connected in series. For this reason, the solar cell devices 1a and 1b are composed of, for example, a double-sided incident type solar cell device, and the solar cell device 1a has the collector electrode 6 facing the surface-side protective material 11 side, while the solar cell device 1b is The collector electrode 10 is arranged toward the surface side protective material 11. And the collector electrode 6 and the collector electrode 10 are formed by the structure of the bus-bar electrode part 6b and the finger electrode part 6a concerning this invention.

  In the above, as the epoxy resin, bisphenol A type epoxy resin, resin using bifunctional compound such as stilbene and biphenyl, and resin using polyfunctional phenol compound such as polyphenol and phenol novolac In addition, there are resins made of dicyclopentadiene / phenolic polyadditions as raw materials, and the effect is the same regardless of which resin is used.

  Moreover, in said embodiment, silver was used as an electroconductive filler. However, the conductive filler is not particularly limited as long as it is a metal such as copper, nickel, and aluminum, or a conductive material such as carbon. For example, you may change the kind of conductive filler of the bus-bar electrode part 6b and the finger electrode 6a. Moreover, you may use the conductive filler which consists of nanoparticles for the finger electrode part 6a.

  Further, in the above-described embodiment, a solar cell device having a heterojunction with intrinsic thin layer (HIT) structure is used, but as a type of the solar cell, a thin film silicon system, a compound semiconductor system, a dye sensitization system, and an organic solar system are used. The same applies to the battery, and it is preferable that the present invention is applied to a solar cell device in which the semiconductor layer located under the transparent conductive film is an amorphous semiconductor or a microcrystalline semiconductor.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims for patent.

  The present invention can be applied to a solar power generation device such as a solar cell module.

It is sectional drawing which showed the structure of the solar cell apparatus by embodiment of this invention. It is a schematic diagram which shows the collector electrode of the solar cell apparatus by embodiment of this invention. It is sectional drawing which showed the structure of the solar cell module using the solar cell apparatus by embodiment shown in FIG. It is a schematic diagram which shows the electrically conductive paste by embodiment of this invention. It is a top view which shows the 1st manufacturing method of the collector electrode concerning embodiment of this invention. It is a top view which shows the 2nd manufacturing method of the collector electrode concerning embodiment of this invention. It is a top view which shows the 3rd manufacturing method of the collector electrode concerning embodiment of this invention. It is a top view which shows the 4th manufacturing method of the collector electrode concerning embodiment of this invention. It is a top view which shows the 5th manufacturing method of the collector electrode concerning embodiment of this invention. It is a top view which shows the 6th manufacturing method of the collector electrode concerning embodiment of this invention. It is sectional drawing which showed the structure of the solar cell module concerning other embodiment using the solar cell apparatus by embodiment shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solar cell apparatus 2 n-type single crystal silicon substrate 3 i-type amorphous silicon layer 4 p-type amorphous silicon layer 5 ITO film 6 Collector electrode 6a Finger electrode part 6b Bus bar electrode part 7 i-type amorphous silicon layer 8 n-type amorphous silicon layer 9 ITO film 10 Collector electrode 11 Solar cell module 12 Tab 12

Claims (4)

  A photoelectric conversion layer; and a collector electrode provided on at least one surface of the photoelectric conversion layer, wherein the collector electrode includes a finger electrode portion and a bus bar electrode portion, and the finger electrode portion and the bus bar electrode portion are electrically conductive with different components. The solar cell device is characterized in that it is made of a conductive paste, and the adhesion strength of the bus bar electrode portion is larger than the adhesion strength of the finger electrode portion.   2. The solar cell device according to claim 1, wherein the bus bar electrode portion is provided with a connecting convex portion corresponding to the number of finger electrode portions, and the finger electrode portion and the bus bar electrode portion are connected by the convex portion. .   A plurality of solar cell devices and a conductive connection member for connecting the plurality of solar cell devices, each of the plurality of solar cell devices is provided on at least one surface of the photoelectric conversion layer and the photoelectric conversion layer And the other electrode provided corresponding to the collector electrode, and the collector electrode includes a finger electrode portion and a bus bar electrode portion, and the finger electrode portion and the bus bar electrode portion are electrically conductive with different components. The bus bar electrode part is formed such that the adhesion strength of the bus bar electrode part is greater than the adhesion strength of the finger electrode part, and the bus bar electrode part of one solar cell device and the connection member are joined among the plurality of solar cell devices. The solar cell module, wherein the other electrode of the other solar cell device and the connection member are joined among the plurality of solar cell devices.   A plurality of solar cell devices, and a conductive connecting member for connecting the plurality of solar cell devices, each of the plurality of solar cell devices is provided on one surface of the photoelectric conversion layer and the photoelectric conversion layer And the other collector electrode corresponding to the collector electrode and provided on the other surface of the photoelectric conversion layer, the collector electrode including a finger electrode portion and a bus bar electrode portion, The bus bar electrode part is composed of conductive pastes of different components, and each of the solar cells located on the light incident side of the plurality of solar cell devices is formed such that the adhesion strength of the bus bar electrode part is larger than the adhesion strength of the finger electrode part The bus bar electrode portions of the device are joined by the connection member, and the bus bar electrode portions of the respective solar cell devices located on the back side of the plurality of solar cell devices are the connection members. Solar cell module, characterized in that bonded.

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