JP2007096142A - Composite substrate apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite substrate apparatus having the structure wherein its more favorable repairing workability than the one of conventional ones can be expected. <P>SOLUTION: In the mounting of the composite substrate apparatus, one end of a connecting pin 3A is connected with the circuit pattern built in a first substrate 2, and the other end of the connecting pin 3A is connected by soldering with a circuit pattern 4 built in a second substrate 1A. Further, the end of the connecting pin 3A which is inserted into a through hole 8 formed in the second substrate 1A is buried in the inside of the through hole 8, and moreover, an other-end opening S2 of the through hole 8 is made larger than its opening S1 at the end of the side whereinto the connecting pin 3A is inserted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a composite substrate device configured by electrically connecting substrates, and particularly to application in a mobile device.

  In recent years, mobile information devices typified by mobile phones have been further reduced in size, weight, and thickness, and ingenuity is required. Therefore, there is a demand for an electronic circuit device in which individual components themselves are reduced in size and weight, the pattern accuracy of the circuit board is miniaturized, and high-density mounting on the board is pursued. Most of these pursuits are two-dimensional efforts on a circuit board.

  However, in reality, when considering the overall dimensions, design, and multi-model deployment of mobile information devices, there is a need for three-dimensional inter-module connection and mounting structure, such as utilization and storage of space in the chassis. Is growing.

  Conventionally, in this type of electronic circuit device, the density of component mounting is increased by reducing the size of components, reducing the wiring pitch, increasing the number of stacked circuit boards, and connecting multiple circuit boards. It was realized.

For example, a method for connecting a plurality of circuit boards in the vertical direction is described in the following (Patent Document 1). For example, as shown in FIG. 3A, a module circuit board 1 on which surface-mounted components or semiconductor bare chips are mounted is electrically connected to a base printed board 2 on which component mounting similar to that of the module circuit board 1 is performed. It is inserted into the other end of the connected connection pin 3 and then the wiring pattern 4 of the module circuit board 1 and the connection pin 3 are connected by solder 6 as shown in FIG. The base printed circuit board 2 and the module circuit board 1 are connected by a plurality of connection pins 3. The plurality of connection pins 3 are intermediate connection bodies embedded in a frame block 11 made of an insulating material as shown in FIG. In the actual assembly process, the intermediate connection body 5 is sandwiched between the base printed board 2 and the module circuit board 1, and each connection pin 3 is connected to the circuit by soldering with the solder 6. Connected to pattern 4.
JP 9-121079 A

  However, at present, the workability of repair for replacing the failed module circuit board 1 with a normal operation product is poor. Specifically, when repairing, as shown in FIG. 3C, a heating means 7 such as a solder rivet is pressed against the tip of the connection pin 3 to melt the solder 6, and the solder 6 is melted. During the state, the defective module circuit board 1 is lifted and removed from the connection pins 3 as indicated by phantom lines.

  When the solder 6 is melted, the heat transfer path is such that the heat is transferred from the heating means 7 to the tip of the connection pin 3, and the heat is transferred to the base end of the connection pin 3, and the temperature of the solidified solder is increased. Ascending gradually, the entire solder 6 is melted and the defective module circuit board 1 can be removed. What is illustrated as the heating means 7 is a jig having a convex portion that abuts against a plurality of connection pins 3, and this jig is heated with a soldering iron to connect the module substrate 1 and all the connection pins 3. It is necessary to melt the solder 6 in the meantime, but it takes time to melt the solder, and repair workability is poor.

  It is an object of the present invention to provide a composite substrate device having a structure that can be expected to have better repair workability than before.

  In the composite substrate device according to claim 1 of the present invention, one end of the connection pin is connected to a circuit pattern constructed on the first substrate, and a circuit pattern constructed on the second substrate is connected to the other end of the connection pin. A composite substrate device that is soldered and mounted with the second substrate mounted on the first substrate, the other end of the connection pin inserted in a through hole formed in the second substrate The tip is embedded in the through hole, and the through hole has a larger opening on the opposite side than the opening on the end where the connection pin is inserted.

  In the composite substrate device according to claim 2 of the present invention, one end of the plurality of connection pins is connected to a circuit pattern constructed on the first substrate, and the other end of the connection pins is constructed on the second substrate. A circuit board device in which the second circuit board is mounted on the first board and mounted by soldering the circuit pattern, and the plurality of connection pins are embedded in the first board and the second board. An intermediate connection body interposed therebetween, the tip of the other end of the connection pin inserted in the through hole formed in the second substrate is embedded in the through hole, and the through hole The hole is characterized in that the opening on the opposite side is larger than the opening on the end where the connecting pin is inserted.

  According to the present invention, since the tip of the other end of the connection pin is embedded in the solder inside the through hole, a heating means such as a solder rod can be directly pressed against the solder inside the through hole. The heat from the heating means is transmitted to the solder without passing through the connection pins to start melting, and all the solder between the connection pins and the second substrate can be melted in a shorter time than before. .

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 (a) shows a composite substrate apparatus that has been soldered.
5A is an intermediate connector in which a plurality of connection pins 3A are embedded in an insulating material in the same manner as the intermediate connector 5 shown in FIG. 4, and 1A is a module as a second substrate on which surface-mounted components, semiconductor bare chips, etc. are mounted A circuit board 2 is a base printed board as a first board on which component mounting similar to that of the module circuit board 1A is performed. In the actual assembly process, the intermediate connection body 5A is sandwiched between the base printed board 2 and the module circuit board 1A, and each connection pin 3A is connected to the circuit pattern 4 by soldering with the solder 6.

  In this embodiment, the length of the connection pin 3A and the shape of the through hole 8 formed in the module circuit board 1A are different from the conventional one. Specifically, the connecting pin 3A protrudes from the opening at the end on the side where the connecting pin 3A is inserted into a portion without the through hole 8, and the tip 9 at the other end of the connecting pin 3A is inside the through hole 8. The connection pin 3A does not protrude from the upper surface of the module circuit board 1A. The through hole 8 is formed so that the opening S2 on the opposite side is larger than the opening S1 on the end on the side where the connection pin 3A is inserted.

  Since it comprised in this way, in the case of repair, as shown in FIG.1 (b), the heating means 7, such as a soldering iron, can be directly pressed on the surface of the solder 6 inside the said through-hole 8. FIG. . Thus, the heat from the heating means 7 is not transmitted via the connection pin 3A as in the prior art, but the heat from the heating means 7 is directly transmitted to the solder 6 and is shown in FIG. 1 (c). Thus, melting can be started and all the solder 6 between the connection pins 3A and the module substrate 1A can be melted in a shorter time than in the past. Then, as in the prior art, while the solder 6 is in a molten state, the defective module circuit board 1A is lifted from the base printed board 2 side and removed from the connection pins 3A.

Furthermore, when the through-hole 8 is conical and has a shape along the outer shape of the tip of the heating means 7, the heat of the heating means 7 is further transmitted.
In FIG. 1, the end surfaces of the plurality of connection pins 3A are formed flat. However, the connection pins 3A can be connected by sharpening the tip as shown in FIG. 2 (a) or by attaching a radius as shown in (b). By tapering the pins 3A, the module circuit board 1A can be easily inserted into the connection pins 3A. Particularly, when there are a plurality of pins in one unit, the module circuit board 1A is slightly inserted at the time of insertion. The displacement is also automatically corrected following the shape of the tip of the connection pin 3A. The connection pin 3A is easier to insert than a flat end surface, and the workability during assembly and soldering is improved.

  The composite substrate device of the present invention can be widely used in various mobile devices such as mobile phones and the like that are required to be highly functional, multifunctional and compact.

The expanded sectional view of the embodiment of the composite substrate device of the present invention The expanded sectional view of the important section of another embodiment Expanded sectional view of a conventional composite substrate device The perspective view of the intermediate connection body of the conventional example

Explanation of symbols

1A Module circuit board (second board)
2 Base printed circuit board (first board)
3A connection pin 4 circuit pattern 5A intermediate connection body 6 solder 8 through hole 9 tip of connection pin 3A S1 opening of through hole 8 on the side where the connection pin 3A is inserted S2 penetration opposite to the side where the connection pin 3A is inserted Opening of hole 8

Claims (3)

One end of the connection pin is connected to the circuit pattern constructed on the first substrate, the circuit pattern constructed on the second substrate is solder-connected to the other end of the connection pin, and the first substrate is connected to the first substrate. 2 is a composite board device mounted with two boards mounted thereon.
The tip of the other end of the connection pin inserted in the through hole formed in the second substrate is embedded in the through hole, and the through hole is on the side where the connection pin is inserted. A composite substrate device in which the opening on the opposite side is larger than the opening at the end. One end of a plurality of connection pins is connected to a circuit pattern built on a first board, and a circuit pattern built on a second board is soldered to the other end of the connection pins, and the first board is connected to the first board. A composite substrate device mounted with the second substrate mounted thereon,
Providing an intermediate connection body in which the plurality of connection pins are embedded and interposed between the first and second substrates;
The tip of the other end of the connection pin inserted in the through hole formed in the second substrate is embedded in the through hole, and the through hole is on the side where the connection pin is inserted. A composite substrate device in which the opening on the opposite side is larger than the opening at the end. The composite substrate device according to claim 1, wherein a shape of the other end of the connection pin is a tapered shape.

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