JP2007094164A - Cured film for liquid crystal display apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cured film for a liquid crystal display apparatus, the film having sufficient heat resistance, surface hardness, sputtering resistance and low degassing property and favorable patterning characteristics. <P>SOLUTION: The cured film is obtained by curing a curable resin composition containing: a polymerizable compound expressed by formula (1), wherein X represents an aromatic group having two or more aromatic rings connected, each Y independently represents a residue of a polyvalent carboxylic acid or its acid anhydride, R<SP>1</SP>is a group expressed by formula (2-1) (wherein R<SP>11</SP>represents a hydrogen atom or a methyl group, each R<SP>12</SP>independently represents a hydrogen atom or a methyl group), j represents an integer of 0 to 4, k represents an integer of 0 to 3, and n represents an integer of 1 or more, and having an acid value of 30 mgKOH/g or more; an epoxy resin which is a copolymer of a polymerizable unsaturated compound (a) showing a glass transition temperature of 150°C or higher in a homopolymer thereof and a polymerizable unsaturated compound (b) having an epoxy group or its residue and which has the weight average molecular weight of 10,000 or more and no carboxylic acid group in a molecular end; and a polyfunctional monomer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a novel cured film for a liquid crystal display device that is suitably used for, for example, a protective film in a color filter or an interlayer insulating film in a liquid crystal display device.

  Generally, a cured film obtained by curing a curable resin composition is used for a protective film in a color filter and an interlayer insulating film in a liquid crystal display device. This protective film and interlayer insulating film are smooth and tough, have transparency, have high heat resistance and light resistance, do not cause deterioration such as coloring, yellowing, and whitening over a long period of time. Further, performance such as excellent solvent resistance, acid resistance and alkali resistance is required. In particular, when the transparent electrode layer is formed on the protective film or the interlayer insulating film by sputtering, the film surface is locally exposed to a high temperature, and thus excellent heat resistance is required.

For example, in a color filter in which a colored layer, a protective film, etc. are formed on a substrate, if the protective film is formed on the entire surface of the substrate, a cut piece is generated or is difficult to cut when cut into a predetermined size. In some cases, the adhesion between the protective film and the sealing agent may be poor, and peeling may occur. Therefore, it is required to form the protective film in a pattern.
In general, the interlayer insulating film is formed in a pattern.
Therefore, patterning characteristics are also required for a cured film used as a protective film or an interlayer insulating film.

  In general, a thermosetting resin composition has excellent heat resistance and a simple film formation process, but cannot be patterned. Moreover, in the photocurable resin composition, although patterning is possible, it is inferior to heat resistance. For example, when a transparent electrode layer is formed by sputtering on a protective film formed of a photocurable resin composition that is generally used for color filters, the transparent electrode layer has cracks due to insufficient heat resistance. There is a problem that display defects occur due to the occurrence of wrinkles in the protective film. Further, when the protective film is exposed to a high temperature during manufacture or use of the liquid crystal display device, a gas component is generated from the protective film, bubbles are generated in the liquid crystal layer, and display performance is deteriorated.

  Therefore, as a photocurable resin composition that can be used for a protective film or an interlayer insulating film and has heat resistance, for example, Patent Document 1 discloses a residue of an aromatic group and a polyvalent carboxylic acid or an acid anhydride thereof. A photocurable resin composition containing an unsaturated compound, a (meth) acrylate, a compound containing an epoxy group, a photopolymerization initiator, and a sensitizer has been proposed. Further, for example, in Patent Document 2, an epoxy ester compound having a residue of a bisphenol fluorene skeleton and a polybasic carboxylic acid or its acid anhydride, a polyhydric alcohol, and a polybasic carboxylic acid or its acid anhydride are reacted. There has been proposed a photosensitive resin composition having an alkali-soluble resin obtained by the above process. Further, for example, in Patent Document 3, a polymerizable unsaturated compound having an epoxy group-containing alicyclic skeleton, a polymerizable unsaturated carboxylic acid or acid anhydride thereof, and a copolymer of a polymerizable unsaturated compound other than these, , A curable resin composition containing a cationically polymerizable compound and a radiation-sensitive acid generator, and two or more epoxy group-containing alicyclic skeletons in the molecule, an acetal structure, a ketal structure, t- A curable resin composition containing a polymer having at least one of a butoxycarbonyl structure, a cationic polymerizable compound, and a radiation-sensitive acid generator has been proposed.

  However, these materials require further improvement in performance, satisfying general performance requirements for protective films and interlayer insulation films, and excellent heat resistance, sputtering resistance, low degassing properties, and A cured film that satisfies the patterning characteristics and the like is desired.

JP 2004-300366 A JP 2002-194272 A JP 2005-8847 A

  The present invention has been made in view of the above-described problems, and satisfies the required characteristics, particularly heat resistance, surface hardness, sputtering resistance, low degassing properties, etc., and is cured for a liquid crystal display device with good patterning characteristics. The main purpose is to provide a membrane.

  In order to achieve the above object, the present invention provides a polymerizable compound represented by the following general formula (1) having an acid value of 30 mgKOH / g or more and a glass transition temperature of 150 ° C. or more when a homopolymer is used. A copolymer of a polymerizable unsaturated compound a and a polymerizable unsaturated compound b having an epoxy group or its residue, an epoxy having a weight average molecular weight of 10,000 or more and having no carboxylic acid group at the terminal A cured film for a liquid crystal display device is provided, which is obtained by curing a curable resin composition containing a resin and a polyfunctional monomer.

(In the formula (1), X represents an aromatic group in which two or more aromatic rings are linked, Y represents each independently a residue of a polyvalent carboxylic acid or an acid anhydride thereof, and R ¹ represents A group represented by the following formula (2-1) is shown, j is an integer of 0 to 4, k is an integer of 0 to 3, and n is an integer of 1 or more.)

(In formula (2-1), R ¹¹ represents a hydrogen atom or a methyl group, and R ¹² independently represents a hydrogen atom or a methyl group.)

  According to the present invention, a cured film for a liquid crystal display device having excellent heat resistance, surface hardness, sputtering resistance, low degassing property, patterning characteristics, and the like can be obtained by the above configuration. Therefore, the cured film for a liquid crystal display device of the present invention can be used for many applications such as a protective film in a color filter and an interlayer insulating film in a liquid crystal display device.

  In the present invention, in the above formula (1), X preferably represents a group represented by the following general formula (3-1). This is because, when the polymerizable compound contains such a group, the heat resistance can be further improved and the sputtering resistance can be improved.

(In the formula (3-1), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ) _2. -, -O-, -S-, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond, each R ³ independently represents a hydrogen atom, having 1 to 5 carbon atoms. An alkyl group, a phenyl group, or a halogen atom, R ⁴ represents —O— or —OCH ₂ CH ₂ O—.

  In the present invention, the polymerizable unsaturated compound a is preferably represented by the following general formula (4-1). In a cured film for a liquid crystal display device obtained by curing a curable resin composition containing an epoxy resin using such a polymerizable unsaturated compound a, the heat resistance is further increased and the spatter resistance is increased as in the above case. This is because the property is improved.

(In formula (4-1), R ²¹ represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and A represents a substituent having a dicyclopentanyl group, an isoboronyl group, or an adamantyl group.)

  In the present invention, the epoxy resin is a copolymer of the polymerizable unsaturated compound a, the polymerizable unsaturated compound b, and the polymerizable unsaturated compound c having a molecular weight of 150 or more. preferable. In addition to the polymerizable unsaturated compound a and the polymerizable unsaturated compound b, the epoxy resin is made into a copolymer using such a polymerizable unsaturated compound c, thereby increasing the weight average molecular weight of the epoxy resin. Because it can.

Furthermore, the cured film for a liquid crystal display device of the present invention has a glass transition temperature of 300 ° C. or higher, a thermal decomposition temperature of 320 ° C. or higher, 230 ° C., a weight reduction rate of 10% or less after holding for 8 hours, and a universal hardness of 500 N / it is preferably mm ² or more. A cured film for a liquid crystal display device having such characteristics is particularly useful as a protective film in a color filter, an interlayer insulating film in a liquid crystal display device, or the like.

The present invention also has a glass transition temperature of 300 ° C. or higher, a thermal decomposition temperature of 320 ° C. or higher, 230 ° C., a weight reduction rate of 10% or lower after 8 hours holding, a universal hardness of 500 N / mm ² or higher, A cured film for a liquid crystal display device comprising a polymerization initiator is provided.

  Since the cured film for a liquid crystal display device of the present invention has the above characteristics, it is excellent in all of heat resistance, surface hardness, sputtering resistance, low degassing property, patterning characteristics, and the like.

  In the said invention, it is preferable that the structure represented by following General formula (5) and an alicyclic skeleton are included. This is because the heat resistance can be further increased and the sputtering resistance can be improved.

(In the formula (5), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ) ₂ —, -O-, -S-, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond.

The present invention also provides a color filter having a protective film that is a cured film for a liquid crystal display device as described above, and a liquid crystal having an interlayer insulating film that is a cured film for the liquid crystal display device described above. Provided is a substrate for a display device.
Since the color filter and the substrate for a liquid crystal display device of the present invention have the above-mentioned cured film for a liquid crystal display device, when the transparent electrode layer is formed on the protective film or the interlayer insulating film by sputtering or the like, cracks in the transparent electrode layer In addition, the generation of wrinkles in the protective film and the interlayer insulating film can be prevented. In addition, when the color filter and the substrate for a liquid crystal display device of the present invention are used, a liquid crystal display device that can suppress the generation of bubbles in the liquid crystal layer and has excellent display quality is obtained. Can do.

  Furthermore, the present invention provides a liquid crystal display device comprising at least one of the color filter and the liquid crystal display device substrate. Since the liquid crystal display device of the present invention has the above-described cured film for a liquid crystal display device, it has excellent display performance.

  The cured film for a liquid crystal display device of the present invention has an effect that all of heat resistance, surface hardness, sputtering resistance, low degassing property, patterning characteristics, and the like are good. Therefore, when the transparent electrode layer is formed on the cured film for a liquid crystal display device of the present invention by sputtering, the generation of cracks in the transparent electrode layer and the wrinkle of the cured film for the liquid crystal display device can be prevented. When the cured film for a liquid crystal display device of the invention is used in a liquid crystal display device, the generation of bubbles in the liquid crystal layer can be suppressed, and the display performance can be improved.

  Hereinafter, the cured film for a liquid crystal display device of the present invention, a color filter using the same, and a substrate for a liquid crystal display device will be described in detail.

A. First, the cured film for a liquid crystal display device of the present invention will be described. The cured film for a liquid crystal display device of the present invention (hereinafter sometimes simply referred to as “cured film”) can be divided into two embodiments. Hereinafter, each aspect will be described.

1. 1st aspect The 1st aspect of the cured film for liquid crystal display devices of this invention is represented by the following general formula (1), and the glass transition when it is set as the homopolymer and the polymeric compound whose acid value is 30 mgKOH / g or more. A copolymer of a polymerizable unsaturated compound a having a temperature of 150 ° C. or higher and a polymerizable unsaturated compound b having an epoxy group or its residue, having a weight average molecular weight of 10,000 or higher, and a carboxylic acid at the terminal A curable resin composition containing an epoxy resin having no group and a polyfunctional monomer is cured.

Here, in the above formula (1), X represents an aromatic group in which two or more aromatic rings are linked, Y represents each independently a residue of a polyvalent carboxylic acid or an acid anhydride thereof, R ¹ represents a group represented by the following formula (2-1), j is an integer of 0 to 4, k is an integer of 0 to 3, and n is an integer of 1 or more. In the following formula (2-1), R ¹¹ represents a hydrogen atom or a methyl group, and R ¹² independently represents a hydrogen atom or a methyl group.

In this embodiment, the polymerizable compound has a bulky functional group called an aromatic group in which two or more aromatic rings are linked, and the glass transition temperature when the epoxy resin is a homopolymer is a predetermined range. By containing the unsaturated unsaturated compound a, excellent heat resistance and low degassing property can be exhibited. Moreover, since the polyfunctional monomer is polymerized, the crosslinking density can be increased and the surface hardness can be improved. Furthermore, when forming a cured film, not only the photocuring reaction by the unsaturated double bond of the polymerizable compound and the polyfunctional monomer, but also the residue of the polyvalent carboxylic acid of the polymerizable compound or its acid anhydride and the epoxy Since it is assumed that a thermosetting reaction with the resin can also occur, the surface hardness can be further increased. Therefore, when forming the transparent electrode layer by sputtering on the cured film, since the heat resistance and surface hardness of the cured film is high, the generation of cracks in the transparent electrode layer and wrinkles of the cured film for liquid crystal display devices is prevented. Since the cured film is excellent in low degassing property, the generation of bubbles in the liquid crystal layer can be suppressed, and the sputtering resistance can be improved.
Moreover, when the acid value of the polymerizable compound is within a predetermined range, alkali solubility can be expressed, and a cured film having good patterning characteristics can be obtained.
Thus, the cured film of this embodiment is excellent in heat resistance, surface hardness, sputtering resistance, patterning characteristics, low degassing property, and the like.
Hereinafter, the characteristics of the curable resin composition used in this embodiment, and the cured film of this embodiment, the production method, and the application will be described.

(1) Curable resin composition The curable resin composition used in this embodiment is represented by the above general formula (1) and has a polymerizable compound having an acid value of 30 mgKOH / g or more and a homopolymer. A copolymer of a polymerizable unsaturated compound a having a glass transition temperature of 150 ° C. or higher and a polymerizable unsaturated compound b having an epoxy group or its residue, having a weight average molecular weight of 10,000 or higher, It contains an epoxy resin having no carboxylic acid group and a polyfunctional monomer. Hereinafter, each component of the curable resin composition will be described.

(I) Polymerizable compound The polymerizable compound used in this embodiment is represented by the following general formula (1), and has an acid value of 30 mgKOH / g or more.

Here, in the above formula (1), X represents an aromatic group in which two or more aromatic rings are linked, Y represents each independently a residue of a polyvalent carboxylic acid or an acid anhydride thereof, R ¹ represents a group represented by the following formula (2-1), j is an integer of 0 to 4, k is an integer of 0 to 3, and n is an integer of 1 or more. In the following formula (2-1), R ¹¹ represents a hydrogen atom or a methyl group, and R ¹² independently represents a hydrogen atom or a methyl group.

  In the above formula (1), X is an aromatic group in which two or more aromatic rings are linked, and examples thereof include residues of bisphenols (including dihydroxy aromatics such as dihydroxybenzene and dihydroxynaphthalene). . Among these, X is preferably a group represented by the following general formula (3-1). This is because the heat resistance can be further improved.

Here, in the above formula (3-1), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ) ₂ —, —O—, —S—, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond, each R ³ independently represents a hydrogen atom, carbon number 1 ˜5 alkyl group, phenyl group, or halogen atom, R ⁴ represents —O— or —OCH ₂ CH ₂ O—.

  Among these, Z is preferably a group having a fluorene skeleton represented by the above formula (3-2), that is, X is preferably a group represented by the following formula (3-3). This is because the heat resistance can be further improved.

Here, in the above formula (3-3), each R ³ independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a phenyl group, or a halogen atom, and R ⁴ represents —O— or —OCH ₂ CH. ₂ O- is shown.

  The polymerizable compound used in this embodiment is, for example, epoxidizing a bisphenol having a fluorene skeleton represented by the above formula (3-2) to form an epoxy compound of a bisphenol, which is reacted with (meth) acrylic acid. Epoxy (meth) acrylates can be obtained by reacting the epoxy (meth) acrylates with a polybasic carboxylic acid or an acid anhydride thereof.

Preferred examples of bisphenols include those in which R ⁴ is —O— in the above formula (3-1), and this —O— is —OH.
Specific examples of bisphenols containing —CO— as Z include bis (4-hydroxyphenyl) ketone, bis (4-hydroxy-3,5-dimethylphenyl) ketone, bis (4-hydroxy-3,5-dichlorophenyl). ) Ketones and the like.
Specific examples of bisphenols containing —SO ₂ — as Z include bis (4-hydroxyphenyl) sulfone, bis (4-hydroxy-3,5-dimethylphenyl) sulfone, and bis (4-hydroxy-3,5- (Dichlorophenyl) sulfone and the like.
Specific examples of bisphenols containing —C (CF ₃ ) ₂ — as Z include 2,2-bis (4-hydroxyphenyl) hexafluoropropane and 2,2-bis (4-hydroxy-3,5-dimethyl). Phenyl) hexafluoropropane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) hexafluoropropane, and the like.
Specific examples of bisphenols containing —Si (CH ₃ ) ₂ — as Z include bis (4-hydroxyphenyl) dimethylsilane, bis (4-hydroxy-3,5-dimethylphenyl) dimethylsilane, and bis (4- And hydroxy-3,5-dichlorophenyl) dimethylsilane.
Specific examples of bisphenols containing —CH ₂ — as Z include bis (4-hydroxyphenyl) methane, bis (4-hydroxy-3,5-dibromophenyl) methane, bis (4-hydroxy-3,5- And dichlorophenyl) methane.
Specific examples of bisphenols containing —C (CH ₃ ) ₂ — as Z include 2,2-bis (4-hydroxyphenyl) propane and 2,2-bis (4-hydroxy-3,5-dimethylphenyl). Examples thereof include propane and 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane.
Specific examples of bisphenols containing —O— as Z include bis (4-hydroxyphenyl) ether, bis (4-hydroxy-3,5-dimethylphenyl) ether, bis (4-hydroxy-3,5-dichlorophenyl). ) Ether etc. can be mentioned.
Specific examples of bisphenols containing -S- as Z include bis (4-hydroxyphenyl) sulfide, bis (4-hydroxy-3,5-dimethylphenyl) sulfide, bis (4-hydroxy-3,5-dichlorophenyl). ) Sulfide and the like.
Specific examples of bisphenols containing a group having a fluorene skeleton represented by the above formula (3-2) as Z include 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis ( 4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-3-chlorophenyl) fluorene, 9,9-bis (4-hydroxy-3-bromophenyl) fluorene, 9,9-bis ( 4-hydroxy-3-fluorophenyl) fluorene, 9,9-bis (4-hydroxy-3-methoxyphenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dimethylphenyl) fluorene, 9,9 -Bis (4-hydroxy-3,5-dichlorophenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dibromophenyl) fluorene It can be mentioned.
Furthermore, specific examples of bisphenols in which Z is a single bond include 4,4′-biphenol and 3,3′-biphenol.

In the above formula (1), R ¹ represents a group represented by the following formula (2-1).

Here, in the formula (2-1), R ¹¹ represents a hydrogen atom or a methyl group, and R ¹² independently represents a hydrogen atom or a methyl group. Among these, R ¹² is preferably a hydrogen atom. This is because the polymerization reactivity of the unsaturated double bond is improved.

In said formula (1), Y shows each independently the residue of the polyhydric carboxylic acid which has 2-5 carboxyl groups, or its acid anhydride. Y may be a residue of an aliphatic carboxylic acid or an acid anhydride thereof, or may be a residue of an aromatic carboxylic acid or an acid anhydride thereof. Among them, an aromatic carboxylic acid or an acid anhydride thereof may be used. It is preferably a residue of a product. This is because heat resistance is improved.
Moreover, in said formula (1), j is respectively independently the integer of 0-4, k is an integer of 0-3. j and k are appropriately selected so that the polymerizable compound has a predetermined acid value. In order to set the acid value of the polymerizable compound within a predetermined range, it is preferable that j is 1 or more and k is 2 or more.

  Specific examples of the polyvalent carboxylic acid or anhydride thereof include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, methylendomethylenetetrahydrophthalic acid, chlorend Acid, dicarboxylic acid such as methyltetrahydrophthalic acid, glutaric acid or the acid anhydride thereof; tricarboxylic acid such as trimellitic acid or the acid anhydride thereof or acid anhydride thereof; pyromellitic acid, benzophenone tetracarboxylic acid, biphenyltetra Carboxylic acid, biphenyl ether tetracarboxylic acid, biphenylsulfone tetracarboxylic acid, 4- (1,2-dicarboxyethyl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid, butanetetracarboxylic acid, etc. Tetracarboxylic acid or These dianhydrides; and the like. These can be used independently and can also use 2 or more types together.

  The “polyvalent carboxylic acid or acid anhydride thereof” means at least one of a specific polyvalent carboxylic acid and a corresponding acid anhydride. For example, the polyvalent carboxylic acid may be phthalic acid. For example, it means at least one of phthalic acid and phthalic anhydride.

  Moreover, the acid value of a polymeric compound is 30 mgKOH / g or more, Preferably it is 40 mgKOH / g or more. It is because sufficient alkali solubility can be expressed if the acid value of the polymerizable compound is within the above range. On the other hand, the upper limit of the acid value of the polymerizable compound is not particularly limited, but is usually 150 mgKOH / g or less. The acid value is a value obtained by titration with a potassium hydroxide ethanol solution using phenolphthalein as an indicator.

In said formula (1), n is an integer greater than or equal to 1, Preferably it is an integer greater than or equal to 2, More preferably, it is an integer in the range of 3-5. Moreover, the weight average molecular weight of a polymeric compound is although it does not specifically limit, It is preferable to exist in the range of 1000-8000, More preferably, it exists in the range of 3000-5000. When the weight average molecular weight of the polymerizable compound is higher than the above range, the viscosity of the curable resin composition increases, and the applicability may deteriorate. In addition, when the curable resin composition is applied and exposed when forming the cured film of this embodiment, the exposed portion is less likely to be dissolved in the developer, and the target pattern is less likely to be obtained. It is in. On the other hand, when the weight average molecular weight of the polymerizable compound is smaller than the above range, a cured film may remain on the substrate when exposure and development are performed.
The weight average molecular weight is a value measured using tetrahydrofuran (THF) as a solvent using a gel permeation chromatograph (HLC-8220GPC manufactured by Tosoh Corporation). Conversion was performed using polystyrene as a molecular weight standard substance.

X, Y, R ^{1 and the} like in the above formula (1) need not all be the same in the polymerizable compound, and can be freely changed within the defined range.

Next, the manufacturing method of a polymeric compound is demonstrated.
The method for producing the polymerizable compound used in this embodiment is not particularly limited. For example, bisphenols having a fluorene skeleton represented by the above formula (3-3) are epoxidized to produce epoxy compounds of bisphenols. Compound (1) is reacted with (meth) acrylic acid to form epoxy (meth) acrylates, and a polybasic carboxylic acid or acid anhydride thereof is reacted with the epoxy (meth) acrylates to obtain a polymerizable compound. be able to. Hereinafter, a method for producing such a polymerizable compound will be described as an example.

Epoxidation of bisphenols can be performed in the same manner as a general epoxidation reaction. For example, a method in which bisphenols are dissolved in excess epichlorohydrin and then reacted in the presence of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide. The reaction temperature is preferably 50 to 150 ° C, more preferably 60 to 120 ° C. The reaction time is preferably 1 to 10 hours.
By epoxidation, for example, epoxy compounds of bisphenols represented by the following formula are obtained.

Here, R < ³ > shows a hydrogen atom, a C1-C5 alkyl group, a phenyl group, or a halogen atom each independently.

Moreover, in the reaction of the epoxy compound of bisphenols and (meth) acrylic acid, the ratio of (meth) acrylic acid is 0.8 to 1.5 mol with respect to 1 mol of the epoxy group of the epoxy compound of bisphenols. More preferably, it is in the range of 0.9 to 1.1 mol.
At this time, for example, methyl ethyl ketone, methyl cellosolve acetate, or the like can be used as a diluent. In order to accelerate the reaction, a catalyst such as triethylamine, benzyldimethylamine, methyltriethylammonium chloride, triphenylphosphine may be used. The amount of the catalyst used is preferably 0.1 to 10% by weight, more preferably 0.3 to 5% by weight, based on the reaction raw material mixture. Furthermore, in order to prevent polymerization of the (meth) acryloyl group during the reaction, a polymerization inhibitor such as p-methoxyphenol may be used as necessary. The addition amount of the polymerization inhibitor is 50 to 2000 ppm, more preferably 200 to 1000 ppm with respect to the reaction raw material mixture.
The reaction temperature is preferably 60 to 150 ° C., more preferably 80 to 120 ° C., and the reaction time is preferably 5 to 60 hours, more preferably 10 to 50 hours.
By reaction of the epoxy compound of bisphenols and (meth) acrylic acid, for example, epoxy (meth) acrylates represented by the following formula are obtained.

Here, R < ³ > shows a hydrogen atom, a C1-C5 alkyl group, a phenyl group, or a halogen atom each independently.

Furthermore, the reaction between the epoxy (meth) acrylates and the polyvalent carboxylic acid or acid anhydride thereof can be performed by a general method. For example, an epoxy (meth) acrylate and a polyvalent carboxylic acid or an acid anhydride thereof can be dissolved (suspended) in a cellosolve solvent such as ethyl cellosolve acetate or butyl cellosolve acetate and reacted by heating.
Epoxy (meth) acrylates can be used alone or as a mixture of two or more. Moreover, polyvalent carboxylic acid or its acid anhydride can also be used individually or in mixture of 2 or more types.
The term “a mixture of two or more polycarboxylic acids or acid anhydrides” means that at least two kinds of polycarboxylic acids or acid anhydrides thereof are present simultaneously. That is, at least two types of polycarboxylic acids or acid anhydrides are involved in the reaction.

The polyvalent carboxylic acid or acid anhydride thereof is preferably 0.4 to 1 equivalent in terms of acid anhydride group, more preferably 0. 0 equivalent to the total of 1 equivalent (mol) of hydroxyl groups of the epoxy (meth) acrylate. It is subjected to the reaction at a ratio of 75 to 1 equivalent. This is because if the polyvalent carboxylic acid or its acid anhydride is less than the above range in terms of acid anhydride group, the reaction may not proceed sufficiently. On the other hand, when the polyvalent carboxylic acid or its acid anhydride exceeds the above range in terms of an acid anhydride group, the unreacted carboxylic acid or its acid anhydride remains, which may reduce the patterning characteristics. Because.
In addition, acid anhydride group conversion shows the quantity when all the carboxyl groups and acid anhydride groups contained in the polyhydric carboxylic acid to be used or its acid anhydride are converted into acid anhydride.

  Moreover, as polyvalent carboxylic acid or its acid anhydride, dicarboxylic acid anhydride and tetracarboxylic dianhydride are used preferably. The ratio between the dicarboxylic acid anhydride and the tetracarboxylic dianhydride is preferably 1/99 to 90/10, and more preferably 5/95 to 80/20, as a molar ratio.

  In the reaction of epoxy (meth) acrylates with a polyvalent carboxylic acid or acid anhydride thereof, the reaction temperature is preferably 50 to 130 ° C, more preferably 70 to 120 ° C. When the reaction temperature exceeds the above range, polymerization of the (meth) acryloyl group may occur and the reaction product may gel. On the other hand, when the reaction temperature is less than the above range, the reaction does not proceed smoothly, and unreacted polyvalent carboxylic acid or its acid anhydride remains.

(Ii) Epoxy resin The epoxy resin used in this embodiment is a polymerizable unsaturated compound a having a glass transition temperature of 150 ° C. or higher and a polymerizable unsaturated compound b having an epoxy group or a residue thereof when a homopolymer is used. The weight average molecular weight is 10,000 or more and does not have a carboxylic acid group at the terminal.

The weight average molecular weight of the epoxy resin is 10,000 or more, preferably 11,000 or more, more preferably 12,000 or more. If the weight average molecular weight of the epoxy resin is smaller than the above range, the heat resistance may be lowered. On the other hand, the upper limit of the weight average molecular weight of the epoxy resin is about 30,000. This is because if the weight average molecular weight of the epoxy resin is higher than the above range, the viscosity of the curable resin composition becomes high and it becomes difficult to apply.
The weight average molecular weight is a value measured using THF as a solvent using a gel permeation chromatograph (HLC-8220GPC manufactured by Tosoh Corporation). Conversion was performed using polystyrene as a molecular weight standard substance.

The polymerizable unsaturated compound a used in this embodiment has a glass transition temperature of 150 ° C. or higher, preferably 170 ° C. or higher when it is a homopolymer. It is because heat resistance can be improved if the said glass transition temperature is the said range. On the other hand, the upper limit of the glass transition temperature is not particularly limited, but is usually 250 ° C. or lower.
The glass transition temperature is a value calculated from an endothermic curve prepared by raising the temperature of the resin piece at a rate of 10 ° C./min, measuring the calorific value with a differential scanning calorimeter (DSC).

  In addition, the polymerizable unsaturated compound a preferably has a bulky functional group, and more preferably has a functional group containing an alicyclic skeleton. This is because the heat resistance can be improved. The functional group containing an alicyclic skeleton may be any functional group as long as it does not inhibit copolymerization, and preferred examples include a dicyclopentanyl group, a dicyclopentenyl group, a cyclohexyl group, a cyclopentyl group, an isoboronyl group, and an adamantyl group. It is done. From the viewpoints of heat resistance and copolymerization, it is particularly preferable that the polymerizable unsaturated compound a has a dicyclopentanyl group.

Furthermore, the polymerizable unsaturated compound a has a polymerizable unsaturated double bond, and particularly preferably has an acryloyl group or a methacryloyl group.
Preferred examples of the polymerizable unsaturated compound a include those represented by the following general formula (4-1).

Here, in the above formula (4-1), R ²¹ represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group. A represents a dicyclopentanyl group, an isoboronyl group, or an adamantyl group, and preferably a dicyclopentanyl group.

Moreover, the polymerizable unsaturated compound b used in this embodiment has an epoxy group or a residue thereof. The polymerizable unsaturated compound b has a polymerizable unsaturated double bond, and particularly preferably has an acryloyl group or a methacryloyl group.
Preferred examples of the polymerizable unsaturated compound b include those represented by the following general formula (4-2) or (4-3).

Here, in the above formulas (4-2) and (4-3), R ²² represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group.

  The epoxy resin obtained by copolymerizing the polymerizable unsaturated compound a and the polymerizable unsaturated compound b is preferably one having a polymerizable unsaturated double bond. This is because the epoxy resin also has a photo-curing part, so that it is assumed that the surface hardness is improved.

  In this embodiment, the epoxy resin may be a copolymer of the polymerizable unsaturated compound a, the polymerizable unsaturated compound b, and the polymerizable unsaturated compound c having a molecular weight of 150 or more. This is because the addition of the polymerizable unsaturated compound c facilitates copolymerization and can increase the weight average molecular weight of the epoxy resin.

  The polymerizable unsaturated compound c used in this embodiment has a molecular weight of 150 or more, preferably in the range of 180 to 250. This is because the weight average molecular weight of the epoxy resin can be increased if the molecular weight is in the above range. Moreover, it is because it may become difficult to copolymerize when molecular weight is too high.

  The polymerizable unsaturated compound c preferably has a bulky functional group, and more preferably has an aromatic ring. This is because heat resistance is improved. Examples of the polymerizable unsaturated compound having an aromatic ring include styrene, α-methylstyrene, m-methylstyrene, o-methylstyrene, p-methoxystyrene and the like. Styrene is particularly preferable from the viewpoints of heat resistance, copolymerization, and weight average molecular weight of the epoxy resin.

  The ratio of the polymerizable unsaturated compound a, the polymerizable unsaturated compound b, and the polymerizable unsaturated compound c in the epoxy resin is preferably 10-60: 10-60: 0-50, more preferably 20 ~ 50: 20 ~ 50: 0 ~ 30. When the ratio of the polymerizable unsaturated compound a is too large, copolymerization may be difficult, and when it is too small, the heat resistance may be decreased. Moreover, when there are too many ratios of the polymerizable unsaturated compound b, storage stability may be missing, and when too small, heat resistance and adhesiveness may fall. Furthermore, since the ratio of the polymerizable unsaturated compound a and the polymerizable unsaturated compound b decreases as the ratio of the polymerizable unsaturated compound c increases, the heat resistance and adhesion may be reduced as described above.

  Further, the ratio of the polymerizable unsaturated double bond contained in the polymerizable unsaturated compound b is preferably 0 to 60 parts by weight, more preferably 0 parts by weight with respect to 100 parts by weight of the epoxy resin. Within the range of -40 parts by weight. This is because, if the ratio of the polymerizable unsaturated double bond contained in the polymerizable unsaturated compound b is in the above range, the surface hardness can be effectively increased by increasing the crosslinking density.

  The ratio of the epoxy resin is preferably 20 parts by weight to 100 parts by weight, more preferably 40 parts by weight to 80 parts by weight with respect to 100 parts by weight of the polymerizable compound. This is because when the proportion of the epoxy resin increases, the proportion of the polymerizable compound decreases, so that alkali solubility becomes insufficient and patterning may be difficult. Moreover, it is because heat resistance and adhesiveness may fall when the ratio of an epoxy resin is less than the said range.

  In this embodiment, the epoxy resin has no carboxylic acid group at the terminal. That is, the epoxy resin has no acid value.

(Iii) Polyfunctional monomer The polyfunctional monomer used in this embodiment is not particularly limited as long as it has a plurality of polymerizable functional groups and can be polymerized with the polymerizable compound. Among them, the polyfunctional monomer preferably has an acryloyl group or a methacryloyl group, that is, a polyfunctional (meth) acrylate.

  Examples of polyfunctional (meth) acrylates include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, hexanediol (meth) acrylate, long chain aliphatic di (meth) acrylate, and neopentyl glycol di (meth) acrylate. , Hydroxypivalate neopentyl glycol di (meth) acrylate, stearic acid modified pentaerythritol di (meth) acrylate, propylene di (meth) acrylate, glycerol (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (Meth) acrylate, tetramethylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, Reethylene glycol di (meth) acrylate, polypropylene di (meth) acrylate, triglycerol di (meth) acrylate, neopentyl glycol modified trimethylolpropane di (meth) acrylate, allylated cyclohexyl di (meth) acrylate, methoxylated cyclohexyl di ( (Meth) acrylate, acrylated isocyanurate, bis (acryloxyneopentyl glycol) adipate, bisphenol A di (meth) acrylate, tetrabromobisphenol A di (meth) acrylate, bisphenol S di (meth) acrylate, butanediol di (meth) ) Acrylate, phthalic acid di (meth) acrylate, phosphoric acid di (meth) acrylate, zinc di (meth) acrylate and other bifunctional (meth) acrylates It is.

  Examples of the polyfunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, glycerol tri (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) ) Acrylate, alkyl-modified dipentaerythritol tri (meth) acrylate, tri (meth) acrylate phosphate, tris (acryloxyethyl) isocyanurate, tris (methacryloxyethyl) isocyanurate, pentaerythritol tetra (meth) acrylate, dipenta Erythritol tetra (meth) acrylate, ditrimethylolpropane tetraacrylate, alkyl-modified dipentaerythritol tetra (meth) acrylate, dipen Erythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, alkyl-modified dipentaerythritol penta (meth) acrylate, urethane tri (meth) acrylate, ester tri (meth) acrylate, urethane hexa (meth) acrylate, Trifunctional or higher functional (meth) acrylates such as ester hexa (meth) acrylate are exemplified.

  These polyfunctional (meth) acrylates may be used alone or in combination of two or more.

  In particular, when excellent photocurability (high sensitivity) is required, the polyfunctional (meth) acrylate preferably has two (bifunctional) or more polymerizable double bonds in one molecule, Furthermore, it is preferable to have three (trifunctional) or more.

  The content of the polyfunctional monomer is preferably 30% by weight or more with respect to the solid content in the curable resin composition, more preferably 35% by weight or more, and further preferably 40% by weight to 70% by weight. Within range. If the polyfunctional (meth) acrylate content is too small, photocuring may not proceed sufficiently and the exposed part may be eluted. Moreover, when there is too much content of polyfunctional (meth) acrylate, it may become impossible to develop even in an unexposed part, and depending on the degree of polymerization, the non-tackiness of the cured film may be lost.

(Iv) Photopolymerization initiator The curable resin composition used in this embodiment may contain a photopolymerization initiator. That is, the cured film of this embodiment may contain a photopolymerization initiator. As the photopolymerization initiator, general ones can be used, and examples thereof include radical photopolymerization initiators such as Michler's ketone, and cationic photopolymerization initiators such as triarylsulfonium salts and diaryliodonium salts. be able to. These may be used alone or in combination of two or more.

  Moreover, such a photoinitiator can be used in combination with a photosensitizer. As the photosensitizer, a general one can be used, and examples thereof include N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, triethanolamine, and triethylamine. . These photosensitizers may be used alone or in combination of two or more.

  The content of the photopolymerization initiator is preferably 15% by weight or less, more preferably 10% by weight or less based on the solid content in the curable resin composition. Further, the content of the photopolymerization initiator in the cured film of this embodiment is preferably in the same range as the above range. If the content of the photopolymerization initiator is within the above range, the degassing component can be reduced, and the generation of bubbles in the liquid crystal layer is suppressed when the cured film of this embodiment is used in a liquid crystal display device. Because it can. On the other hand, the lower limit of the content of the photopolymerization initiator is about 3% by weight.

(V) Surfactant The curable resin composition used in this embodiment may contain a surfactant as necessary. That is, the cured film of this embodiment may contain a surfactant. The surfactant is used for improving the coatability and developability when forming the cured film of this embodiment.
Examples of the surfactant used in this embodiment include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether; polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl Polyoxyethylene aryl ethers such as ethers; nonionic surfactants such as polyoxyethylene dialkyl esters (for example, polyoxyethylene dilaurate and polyoxyethylene distearate); Ftop EF301, Ftop 303, Ftop 352 (Manufactured by Shin-Akita Kasei Co., Ltd.); Megafuck F171, Megafuck F172, Megafuck F173 (manufactured by Dainippon Ink & Chemicals, Inc.); Florard FC-430, Lollard FC-431 (manufactured by Sumitomo 3M); Asahi Guard AG710, Surflon S-382, Surflon SC-101, Surflon SC-102, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC- 106 (manufactured by Asahi Glass Co., Ltd.) and other commercially available fluorine-based surfactants; organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.); (meth) acrylic acid copolymer polyflow no. 57, 95 (manufactured by Kyoeisha Yushi Chemical Co., Ltd.); These may be used alone or in combination of two or more.

  The content of the surfactant is preferably 1% by weight or less, more preferably 0.5% by weight or less, based on the solid content in the curable resin composition.

(Vi) Adhesion aid The curable resin composition used in this embodiment may contain an adhesion aid as required. That is, the cured film of this embodiment may contain an adhesion assistant. The adhesion assistant is used to improve the adhesion between the cured film and the substrate, the transparent electrode layer, or the like. Examples of such adhesion assistants include silane coupling agents.

  The content of the adhesion assistant is preferably 10% by weight or less, more preferably 5% by weight or less, based on the solid content in the curable resin composition.

(Vii) Additive The curable resin composition used in this embodiment may contain an additive as necessary. That is, the cured film of this embodiment may contain an additive. Examples of the additive include an antistatic agent, a storage stabilizer, an antifoaming agent, a polymerization inhibitor, a plasticizer, a leveling agent, a pigment, and a dye.
Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, and tricresyl. Examples of the antifoaming agent and leveling agent include silicon-based, fluorine-based, and acrylic compounds.
(Viii) Solvent The curable resin composition used in this embodiment may contain a solvent, if necessary. The solvent is used to uniformly dissolve each component in the curable resin composition, for example, to facilitate application on a substrate.

  The solvent used in this embodiment is not particularly limited as long as it is an organic solvent that does not react with each component in the curable resin composition and can dissolve or disperse them. Specifically, alcohols such as methanol and ethanol; ethers such as tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether, and ethylene glycol monoethyl ether; methyl cellosolve acetate, ethyl Ethylene glycol alkyl ether acetates such as cellosolve acetate; diethylene glycols such as diethylene glycol monomethyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether; propylene glycol methyl ether Propylene glycol alkyl ether acetates such as cetate and propylene glycol ethyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, methyl amyl ketone, cyclohexanone and 4-hydroxy-4-methyl-2-pentanone And ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-2-methylbutanoate, Estes such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate Kind; and the like. These solvents may be used alone or in combination of two or more.

  Of these, glycol ethers, alkylene glycol alkyl ether acetates, diethylene glycol dialkyl ethers, and diethylene glycols are preferable as the solvent. Particularly preferred are ethyl 3-ethoxypropionate, ethyl lactate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, methyl amyl ketone, and diethylene glycol ethyl methyl ether.

  In the cured resin composition of this embodiment, the component excluding the solvent is preferably 5% by weight to 40% by weight, more preferably 10% by weight to 30% by weight. Thereby, it can be set as the viscosity suitable for application | coating.

(2) Characteristics of Cured Film The cured film of this embodiment has a glass transition temperature of 300 ° C. or higher, a thermal decomposition temperature of 320 ° C. or higher, 230 ° C., a weight reduction rate of 10% or less after holding for 8 hours, and a universal hardness of 500 N. / Mm ² or more is preferable. This is because when the cured film of this embodiment is used as a protective film in a color filter or an interlayer insulating film in a liquid crystal display device, the cured film preferably has such characteristics.
The glass transition temperature, the thermal decomposition temperature, the weight reduction rate, and the universal hardness will be described in detail in the second aspect to be described later, and will not be described here.

  Moreover, the film thickness of the cured film of this aspect is suitably adjusted according to a use. For example, when used as a protective film in a color filter, the film thickness of the cured film can be set to about 0.5 μm to 5.0 μm, among which 1.0 μm to 3.0 μm, particularly 1.0 μm to 2. It is preferable to be in the range of 0 μm. Further, for example, when used as an interlayer insulating film in a liquid crystal display device, the thickness of the cured film can be set to about 1.0 μm to 20.0 μm, among which 3.0 μm to 15.0 μm, particularly 3.0 μm. It is preferable to be within a range of ˜10.0 μm. Further, for example, when used as a planarizing film in a color filter or a liquid crystal display device, the thickness of the cured film can be set to about 0.5 μm to 5.0 μm, and in particular, the range of 1.0 μm to 3.0 μm. It is preferable to be within.

(3) Manufacturing method of cured film Next, the manufacturing method of the cured film of this aspect is demonstrated.
In this embodiment, the cured film can be formed in a pattern by applying the curable resin composition onto a substrate, drying it, and performing exposure and development.

The method for applying the curable resin composition is not particularly limited, and examples thereof include a spray coating method, a dip coating method, a bar coating method, a roll coating method, and a spin coating method.
The thickness of the coating film is appropriately controlled by adjusting the coating method, solid content concentration, viscosity, etc. of the curable resin composition.
After the curable resin composition is applied, the coating film is dried to remove the solvent. For example, it can be dried by heating the coating film using a hot plate or oven.

Next, the coating film is exposed through a mask having a predetermined pattern to polymerize the double bond sites of the acryloyl group and methacryloyl group contained in the polymerizable compound, the polyfunctional monomer or the like.
Examples of radiation used for exposure include ultraviolet rays such as low-pressure mercury lamps, high-pressure mercury lamps, and metal halide lamps, and electron beams. The exposure amount is appropriately adjusted depending on the light source used, the thickness of the coating film, and the like.
Moreover, in order to promote a polymerization reaction after exposure, you may heat-process. The heating conditions are appropriately selected depending on the blending ratio of each component in the curable resin composition, the thickness of the coating film, and the like.

After the exposure, development is performed using a developer, and a non-exposed portion is dissolved and removed to form a cured film with a desired pattern.
As the developer, a solution in which an alkali is dissolved in water or a water-soluble solvent is usually used. An appropriate amount of a surfactant or the like may be added to the alkaline solution.
Further, a general method can be adopted as the developing method. The development conditions may be general conditions.
After development, the developer is usually washed and the cured film is dried.

  Moreover, you may heat-process in order to fully harden a cured film after image development. The heating conditions are not particularly limited and are appropriately selected according to the use of the cured film.

(4) Use The cured film of this embodiment is useful as, for example, a protective film in a color filter or an interlayer insulating film in a liquid crystal display device. Further, the cured film of this aspect is suitably used for a protective film for electronic parts other than liquid crystal display devices (for example, a protective film used for integrated circuit elements, solid-state imaging elements, etc.), a planarizing film, a columnar spacer, or the like. It is done. Furthermore, the cured film of this embodiment is suitably used for various optical components (lenses, LEDs, plastic films, substrates, optical disks, etc.), protective films for these optical components, polarizing plates, holograms, and the like.
Moreover, the cured film of this aspect can also be used in the form of a dry film.

2. Second Aspect Next, a second aspect of the cured film for a liquid crystal display device of the present invention will be described.
The second embodiment of the cured film for a liquid crystal display device of the present invention has a glass transition temperature of 300 ° C. or higher, a thermal decomposition temperature of 320 ° C. or higher, 230 ° C., a weight reduction rate of 10% or less after holding for 8 hours, and a universal hardness. It is 500 N / mm ² or more, and contains a photopolymerization initiator.

The cured film of this embodiment is excellent in heat resistance because the glass transition temperature and thermal decomposition temperature are in a predetermined range, and excellent in surface hardness because the universal hardness is in a predetermined range, and transparent on the cured film by sputtering. When the electrode layer is formed, the generation of cracks in the transparent electrode layer and wrinkles in the cured film can be prevented. Furthermore, since the cured film of this embodiment has a thermal decomposition temperature and a weight reduction rate in a predetermined temperature range within a predetermined range, the cured film is excellent in low outgassing properties. When used in a liquid crystal display device, the liquid crystal layer The generation of bubbles in the inside can be suppressed. Therefore, the cured film of this aspect is excellent in sputtering resistance.
Moreover, since the cured film of this aspect contains the photoinitiator, it can be assumed that it was formed using the photocurable resin composition, and patterning is possible.
Hereinafter, the characteristics and components of the cured film of this embodiment will be described.

(1) Properties of cured film The cured film of this embodiment preferably has a glass transition temperature of 300 ° C or higher, more preferably 320 ° C or higher, and still more preferably 350 ° C or higher. This is because if the glass transition temperature is in the above range, excellent heat resistance can be obtained. From the viewpoint of heat resistance, the higher the glass transition temperature, the better. The upper limit of the glass transition temperature is not particularly limited, but for example, a cured film can be used as a protective film in a color filter, an interlayer insulating film in a liquid crystal display device, or the like. When used, the upper limit is usually about 400 ° C. in consideration of the temperature in the manufacturing process of the color filter and the liquid crystal display device and the temperature during use.
The glass transition temperature is calculated by raising the temperature of the cured film piece from room temperature in an Ar atmosphere at a rate of 10 ° C./min, measuring the heat value with a differential scanning calorimeter, and creating a temperature-heat value curve. It is the value. For measurement, a DSC2920 Differential Scanning Calorie meter manufactured by TA Instruments was used.

The cured film of this embodiment preferably has a thermal decomposition temperature of 320 ° C. or higher, more preferably 330 ° C. or higher, and further preferably 350 ° C. or higher. If the thermal decomposition temperature is in the above range, desorption of gas from the cured film can be suppressed. For example, when the cured film is used as a protective film in a color filter, an interlayer insulating film in a liquid crystal display device, etc. This is because bubbles can be effectively suppressed from being generated in the liquid crystal layer during the manufacture and use of the filter and the liquid crystal display device. From the viewpoint of degassing suppression, the higher the thermal decomposition temperature, the better. The upper limit of the thermal decomposition temperature is not particularly limited, but as described above, for example, a cured film is used in a protective film in a color filter or a liquid crystal display device. When used for an interlayer insulating film or the like, the upper limit is usually about 500 ° C. in consideration of the temperature at the time of manufacture and use of the color filter and the liquid crystal display device.
The thermal decomposition temperature is determined by heating and heating the cured film piece at 5 ° C./min with a thermogravimetric analyzer (TA Instruments TGA2950 Thermo gravimetric Analyzer) under a nitrogen gas purge of 30 cc / min. It was measured. Here, the temperature when the film weight is reduced by 5% is defined as the thermal decomposition temperature.

Furthermore, the cured film of this embodiment preferably has a weight reduction rate of 10% or less at 230 ° C. for 8 hours, and particularly preferably 8% or less. This is because if the weight reduction rate is in the above range, desorption of gas from the cured film can be suppressed. Similarly to the case of the above thermal decomposition temperature, for example, when a cured film is used as a protective film in a color filter, an interlayer insulating film in a liquid crystal display device, etc. It is possible to effectively suppress the generation of bubbles in the layer. From the viewpoint of degassing suppression, the lower the weight reduction rate, the better.
The weight reduction rate was measured by using a thermogravimetric measuring device (TA Instruments TGA2950 Thermo gravimetric Analyzer), and the cured film piece was heated to 230 ° C. at 5 ° C./min under a nitrogen gas purge of 30 cc / min. Then, the same temperature was maintained at 230 ° C. for 8 hours and measured. The weight reduction rate from the end of the temperature rise to the end of the holding was calculated with the weight after the temperature rise as 100.

Further, the cured film of this embodiment preferably has a universal hardness of 500 N / mm ² or more, more preferably 520 N / mm ² or more, and further preferably 550 N / mm ² or more. If the universal hardness is in the above range, excellent surface hardness can be obtained. For example, when a transparent electrode layer is formed on a cured film by sputtering, cracks in the transparent electrode layer and wrinkles in the cured film are effective. It is because it can prevent. The higher the universal hardness, the better. The upper limit of the universal hardness is not particularly limited.
The universal hardness is a value obtained by measuring a cured film having a thickness of 1.5 μm using a hardness measurement measure (Fischer Scope H-100V manufactured by Fischer Instrument Co., Ltd.).

(2) Constituent component of cured film The cured film of this embodiment contains a photopolymerization initiator. As a photoinitiator, a general thing can be used, for example, what was indicated in the 1st above-mentioned mode is mentioned.
The content of the photopolymerization initiator is preferably 15% by weight or less in the cured film from the viewpoint of low degassing property. In addition, about the preferable range etc. of content of a photoinitiator, since it is the same as that of what was described in the said 1st aspect, description here is abbreviate | omitted.

  Moreover, it is preferable that the cured film of this aspect contains the structure represented by following General formula (5).

Here, in the above formula (5), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ). _2- , -O-, -S-, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond.

  Among these, Z is preferably a group having a fluorene skeleton represented by the above formula (3-2). That is, it is preferable that the cured film of this embodiment includes a structure represented by the following formula (6-1). This is because the heat resistance can be further improved.

  Furthermore, it is preferable that the cured film of this aspect contains an alicyclic skeleton. This is because the heat resistance can be improved. Any alicyclic skeleton may be used as long as it does not hinder the copolymerization when producing a copolymer (epoxy resin) which is a precursor for forming a cured film. For example, dicyclopentanyl, dicyclo Pentenyl, cyclohexyl, cyclopentyl, isoboronyl, adamantyl and the like are preferred. From the viewpoints of heat resistance and copolymerization, dicyclopentanyl is particularly preferable.

(3) Others Since the thickness of the cured film, the manufacturing method, and the like are the same as those described in the first aspect, description thereof is omitted here.

B. Next, the color filter of the present invention will be described.
The color filter of the present invention is characterized by having a protective film which is the above-described cured film for a liquid crystal display device.

  FIG. 1 is a schematic sectional view showing an example of the color filter of the present invention. As illustrated in FIG. 1, the color filter of the present invention has a light shielding portion 2, a colored layer 3, and a protective film 4 sequentially laminated on a substrate 1. The colored layer 3 includes a red colored pattern 3R, a green colored pattern 3B, and a blue colored pattern 3B, and the protective film 4 is the above-described cured film.

  According to the present invention, since the above-described cured film is used as the protective film, the protective film is excellent in heat resistance, sputtering resistance, and surface hardness. For example, a transparent electrode layer is formed on the protective film of the color filter by sputtering. In this case, generation of cracks in the transparent electrode layer and wrinkles in the protective film can be prevented. In addition, since the protective film is excellent in low degassing properties, when the color filter of the present invention is used in, for example, a liquid crystal display device, generation of bubbles in the liquid crystal layer can be suppressed. Furthermore, the protective film has good patterning characteristics, and by providing the protective film in a pattern, when the color filter of the present invention is cut into a desired size, it can be easily cut without producing a cut piece. .

  The color filter of the present invention usually has a substrate, a colored layer formed on the substrate, and a protective film formed on the colored layer. Hereinafter, each configuration of the color filter of the present invention will be described.

1. Protective film The protective film used in the present invention is the above-described cured film for a liquid crystal display device. The cured film for a liquid crystal display device is described in the above section “A. Cured film for a liquid crystal display device”, and thus the description thereof is omitted here.

  The protective film may be formed on the entire surface of the colored layer or may be formed in a pattern, but when the color filter of the present invention is cut into a desired size, It is preferable that the protective film is formed in a pattern so as not to be formed. Thereby, generation | occurrence | production of a cut piece can be prevented. Moreover, when using the color filter of this invention for a liquid crystal display device, it is preferable to form in the pattern form so that a protective film may not be formed in the part to which a sealing compound is apply | coated. This is because the sealing agent comes into direct contact with the substrate and the like, and the adhesion between the color filter and the counter substrate is improved.

  The protective film can be formed by applying and curing a curable resin composition on the colored layer as described in the above section “A. Cured film for liquid crystal display device”. Can be formed on the colored layer directly or by sticking via an adhesive.

2. Colored layer The colored layer used in the present invention is usually composed of a red colored pattern, a green colored pattern, and a blue colored pattern, and each colored pattern is regularly arranged. The arrangement of each colored pattern is not particularly limited, and examples thereof include a stripe type, a mosaic type, a triangle type, and a four pixel arrangement type.

Each colored pattern constituting the colored layer contains a pigment or dye of each color and a binder resin.
Examples of the pigment used in the red coloring pattern include perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, and isoindoline pigments. These pigments may be used alone or in combination of two or more.
Examples of pigments or dyes used in the green coloring pattern include phthalocyanine pigments such as halogen polysubstituted phthalocyanine pigments or halogen polysubstituted copper phthalocyanine pigments, triphenylmethane basic dyes, isoindoline pigments, and isoindolinone pigments. And pigments. These pigments or dyes may be used alone or in combination of two or more.
Examples of the pigment used in the blue coloring pattern include copper phthalocyanine pigments, anthraquinone pigments, indanthrene pigments, indophenol pigments, cyanine pigments, dioxazine pigments and the like. These pigments may be used alone or in combination of two or more.

A transparent resin is used as the binder resin used for each colored pattern.
When a printing method is used as a method for forming the colored layer, examples of the binder resin include polymethyl methacrylate resin, polyacrylate resin, polycarbonate resin, polyvinyl alcohol resin, polyvinyl pyrrolidone resin, hydroxyethyl cellulose resin, carboxymethyl cellulose resin, polychlorinated resin. Examples of the resin include vinyl resin, melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, polyester resin, maleic acid resin, and polyamide resin.
In addition, when a photolithography method is used as a method for forming a colored layer, the binder resin is usually a photosensitive resin having a reactive vinyl group such as an acrylate, methacrylate, polycinnamate, or cyclized rubber. Resin is used.

  The colored layer can be formed by a general colored layer forming method, for example, a pigment dispersion method, a dyeing method, an electrodeposition method, a printing method, or the like. When the colored layer is formed by the pigment dispersion method, a pigment dispersion resist in which the above-described pigment is mixed, dispersed or solubilized in a binder resin is used.

3. Substrate The substrate used in the present invention is a support that supports a colored layer, a protective film, and the like, and is not particularly limited as long as it has a function of protecting the colored layer and the like and is transparent. Among them, a substrate having a smooth surface is preferably used, and for example, a glass substrate or a plastic substrate is used. Specifically, a glass substrate containing alkali-free glass, soda lime glass, or the like, or a transparent plastic substrate such as polyimide or methacrylic acid resin can be used.

4). Light Shielding Part In the present invention, a light shielding part may be formed between the colored patterns. The light shielding portion is provided to partition each colored pattern, prevent reflection of external light at the boundary between the colored patterns, and increase contrast.

The light-shielding part used in the present invention is usually formed in a pattern having openings such as a matrix or stripes.
Examples of the material for forming the light shielding part include a resin composition containing a black colorant such as carbon black, or a metal or metal oxide such as chromium.

  In addition, as a method for forming the light shielding portion, for example, a photolithography method, a printing method, or the like is used when using a resin composition, and when a metal or metal oxide is used, for example, an evaporation method, an ion plating method, a sputtering method, Examples include electroless plating.

5. Transparent electrode layer In this invention, the transparent electrode layer may be formed on the colored layer. As the transparent electrode layer, for example, indium tin oxide (ITO), zinc oxide (ZnO), tin oxide (SnO), or an alloy thereof is used.
The transparent electrode layer can be formed by a general film forming method such as a PVD method such as a sputtering method or a vacuum evaporation method, or a CVD method. Since the protective film is excellent in heat resistance, sputtering resistance and the like, it is preferable to form a transparent electrode layer by a PVD method. In the PVD method, the protective film is exposed to a high temperature. However, as described above, the protective film is excellent in heat resistance and sputtering resistance, so that problems such as generation of cracks and wrinkles can be avoided. But it is advantageous.

C. Next, the substrate for a liquid crystal display device of the present invention will be described.
The substrate for a liquid crystal display device of the present invention is characterized by having an interlayer insulating film which is the above-described cured film for a liquid crystal display device.

  FIG. 2 is a schematic cross-sectional view showing an example of the substrate for a liquid crystal display device of the present invention. As illustrated in FIG. 2, the substrate for a liquid crystal display device of the present invention has a TFT element 21 constituting a switching element, and includes a substrate 11, a gate electrode 12 formed on the substrate 11, and a gate electrode. 12, a gate insulating film 13 for insulating the other constituent members, a semiconductor layer 14 formed so as to overlap the gate electrode 12 on the gate insulating film 13, a source electrode 16 and a drain electrode 17, and a source Interlayer insulation formed in a pattern so that an ohmic contact layer 15 for connecting the electrode 16 and the drain electrode 17 and the semiconductor layer 14, a TFT protective film 18 for protecting the TFT element, and a contact hole 22 are provided. It has a film 19 and a transparent electrode layer 20 formed on the interlayer insulating film 19 so as to cover the exposed surface by the contact hole 22.

  According to the present invention, since the cured film described above is used as the interlayer insulating film, the interlayer insulating film is excellent in heat resistance, sputtering resistance, and surface hardness. For example, a transparent electrode layer is formed on the interlayer insulating film by sputtering. In this case, generation of cracks in the transparent electrode layer and wrinkles in the interlayer insulating film can be prevented. In addition, since the interlayer insulating film is excellent in low outgassing property, when the substrate for a liquid crystal display device of the present invention is used in, for example, a liquid crystal display device, generation of bubbles in the liquid crystal layer can be suppressed. Furthermore, the interlayer insulating film has good patterning characteristics and can be easily patterned.

The substrate for a liquid crystal display device of the present invention is not particularly limited as long as it has an interlayer insulating film between conductive portions such as a transparent electrode layer and a source electrode and a drain electrode.
The interlayer insulating film used in the present invention is the above-described cured film for a liquid crystal display device. The cured film for a liquid crystal display device is described in the above section “A. Cured film for a liquid crystal display device”, and thus the description thereof is omitted here.
In addition, when the substrate for a liquid crystal display element of the present invention is a TFT substrate, the TFT element, the transparent electrode layer and the like that are generally used for a TFT substrate can be used.

D. Next, the liquid crystal display device of the present invention will be described.
The liquid crystal display device of the present invention has at least one of the color filter and the substrate for a liquid crystal display device.

  FIG. 3 is a schematic cross-sectional view showing an example of the liquid crystal display device of the present invention. As illustrated in FIG. 3, the liquid crystal display device of the present invention includes a liquid crystal layer 51 provided between a color filter substrate 39 having a color filter 30 and a liquid crystal display device substrate (TFT substrate) 40. is there. The color filter substrate 39 includes a color filter 30 in which a light shielding portion 32, a colored layer (a red colored pattern 33R, a green colored pattern 33G, a blue colored pattern 33B) 33, and a protective film 34 are sequentially stacked on the substrate 31, and the color filter 30 It has a transparent electrode layer 35 and an alignment film 36 formed on the protective film 34 of the filter 30. In the TFT substrate 40, a TFT element (not shown) composed of a source electrode 42 and the like is formed on the substrate 41, and an interlayer insulating film 43 for insulating the source electrode 42 and the transparent electrode layer 44 is formed. An alignment film 45 is formed on the transparent electrode layer 44.

  According to the present invention, since the above-described color filter and liquid crystal display device substrate are used, the protective film in the color filter and the interlayer insulating film in the liquid crystal display device substrate are excellent in heat resistance, sputtering resistance, and surface hardness. In addition, the generation of cracks in the transparent electrode layer and the generation of wrinkles in the protective film and the interlayer insulating film can be prevented, and the generation of bubbles in the liquid crystal layer can be suppressed.

FIG. 3 shows an example in which the liquid crystal display device has both the above-described color filter and liquid crystal display device substrate, but the liquid crystal display device of the present invention is at least one of the color filter and the liquid crystal display device substrate. As long as it has.
In addition, about a liquid crystal layer, an alignment film, etc., what is generally used for a liquid crystal display device can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

Hereinafter, the present invention will be specifically described with reference to examples.
[Examples 1 and 2]
The components of the polymerizable compound (a), the polyfunctional monomer (b), the photopolymerization initiator (c), the epoxy resin (d), the additive (e), and the solvent (f) are as shown in Table 1 below. And curable resin composition was prepared. Each component is as follows.
Polymerizable compound (a)
a1: Bisfluorene type epoxy acrylate / bisphenyltetracarboxylic acid copolymer (weight average molecular weight 3,500, acid value 50 mgKOH / g)
・ Polyfunctional monomer (b)
b1: Dipentaerythritol hexaacrylate (Aronix M402, manufactured by Toagosei Co., Ltd.)
b2: Dipentaerythritol pentaacrylate (manufactured by Nippon Kayaku Co., Ltd., Sartomer SR399E)
-Photopolymerization initiator (c)
c1: 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (manufactured by Ciba Geigy Japan, IRGACURE907)
c2: 2,2′-bis (2chlorophenyl) -4,4′-5,5′tetrakisphenyl-1,2 ′ biimidazole (Kurokin Kasei Co., Ltd., biimidazole)
・ Epoxy resin (d)
d1: Dicyclopentanyl methacrylate / benzyl methacrylate / glycidyl methacrylate / methacrylic acid methacrylate copolymer (weight average molecular weight 10,000)
・ Additive (e)
e1: Fluorosurfactant (Sumitomo 3M, Fluorad FC-431)
e2: Acrylic silane coupling agent (manufactured by Shin-Etsu Silicone, KBE503)
・ Solvent (f)
f: Diethylene glycol diethyl ether

  Next, after applying the curable resin composition on an alkali-free glass substrate with a spinner so that the final film thickness becomes 1.5 μm, it is pre-baked on a hot plate at 90 ° C. for 3 minutes, and converted to I-line. The entire surface was irradiated and developed with an exposure amount of 100 mJ, and baked in an oven at 230 ° C. for 30 minutes. Thereby, a cured film was formed.

[Comparative example]
Using the components used in Examples and the following components, each component was blended as shown in Table 1 below to prepare a curable resin composition.
Polymerizable compound (a)
a2: Styrene / acrylic acid copolymer (weight average molecular weight 7,000, acid value 60 mgKOH / g)
・ Epoxy resin (d)
d2: phenol novolac type epoxy resin (manufactured by Yuka Shell Epoxy Co., Epicoat 154)

  Next, a cured film was formed in the same manner as in the example.

[Evaluation]
About the cured film of an Example and a comparative example, the glass transition temperature, the thermal decomposition temperature, the weight reduction rate, and universal hardness were measured. In addition, the measuring method of the physical property of a cured film is as having mentioned above. In addition, the sputter resistance and bubble generation were also evaluated.

(Spatter resistance)
On the cured film, an ITO film was sputtered using a sputtering apparatus under the conditions of 200 ° C., 6.0 × 10 ⁻³ torr, and 12 minutes. The thickness of the obtained ITO film was 1500 mm. After baking this board | substrate for 60 minutes at 250 degreeC in oven, it was evaluated whether the crack of the ITO film | membrane and the wrinkle of the cured film had generate | occur | produced with the microscope.

(Evaluation of bubble generation)
The substrate on which the cured film was formed and the non-alkali glass substrate were opposed to each other and bonded together with a sealant, and then a liquid crystal material was injected and sealed to prepare a liquid crystal cell for bubble evaluation. This cell was inserted into a pressure cooker test apparatus for 120 minutes under conditions of a temperature of 120 ° C., a humidity of 75%, and a pressure of 0.2 to 2.0 kg / cm ² to evaluate the presence or absence of bubbles.

  The evaluation results are shown in Table 1 below.

It is a schematic sectional drawing which shows an example of the color filter of this invention. It is a schematic sectional drawing which shows an example of the board | substrate for liquid crystal display devices of this invention. It is a schematic sectional drawing which shows an example of the liquid crystal display device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11,31,41 ... Board | substrate 2,32 ... Light-shielding part 3,33 ... Colored layer 4,34 ... Protective film (cured film for liquid crystal display devices)
19, 43 ... Interlayer insulating film (cured film for liquid crystal display device)
20, 35, 44 ... Transparent electrode layer 30 ... Color filter 40 ... Substrate for liquid crystal display device

Claims (10)

A polymerizable compound represented by the following general formula (1) and having an acid value of 30 mgKOH / g or more, a polymerizable unsaturated compound a having a glass transition temperature of 150 ° C. or more and an epoxy group when the homopolymer is used, or an epoxy group thereof A copolymer of a polymerizable unsaturated compound b having a residue, having a weight average molecular weight of 10,000 or more, and a curability containing an epoxy resin having no carboxylic acid group at the terminal and a polyfunctional monomer A cured film for a liquid crystal display device, which is obtained by curing a resin composition.

(In the formula (1), X represents an aromatic group in which two or more aromatic rings are linked, Y represents each independently a residue of a polyvalent carboxylic acid or an acid anhydride thereof, and R ¹ represents A group represented by the following formula (2-1) is shown, j is an integer of 0 to 4, k is an integer of 0 to 3, and n is an integer of 1 or more.)

(In formula (2-1), R ¹¹ represents a hydrogen atom or a methyl group, and R ¹² independently represents a hydrogen atom or a methyl group.) 2. The cured film for a liquid crystal display device according to claim 1, wherein in the formula (1), X represents a group represented by the following general formula (3-1).

(In the formula (3-1), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ) _2. -, -O-, -S-, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond, each R ³ independently represents a hydrogen atom, having 1 to 5 carbon atoms. An alkyl group, a phenyl group, or a halogen atom, R ⁴ represents —O— or —OCH ₂ CH ₂ O—.

The cured film for a liquid crystal display device according to claim 1, wherein the polymerizable unsaturated compound a is represented by the following general formula (4-1).

(In formula (4-1), R ²¹ represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and A represents a substituent having a dicyclopentanyl group, an isoboronyl group, or an adamantyl group.)   2. The epoxy resin is a copolymer of the polymerizable unsaturated compound a, the polymerizable unsaturated compound b, and a polymerizable unsaturated compound c having a molecular weight of 150 or more. The cured film for a liquid crystal display device according to any one of claims 1 to 3. The glass transition temperature is 300 ° C. or higher, the thermal decomposition temperature is 320 ° C. or higher, 230 ° C., the weight reduction rate after holding for 8 hours is 10% or lower, and the universal hardness is 500 N / mm ² or higher. The cured film for a liquid crystal display device according to any one of claims 1 to 4. Glass transition temperature is 300 ° C. or higher, thermal decomposition temperature is 320 ° C. or higher, 230 ° C., weight loss rate after holding for 8 hours is 10% or lower, universal hardness is 500 N / mm ² or higher, and contains a photopolymerization initiator. A cured film for a liquid crystal display device. The cured film for a liquid crystal display device according to claim 6, comprising a structure represented by the following general formula (5) and an alicyclic skeleton.

(In the formula (5), Z represents —CO—, —SO ₂ —, —C (CF ₃ ) ₂ —, —Si (CH ₃ ) ₂ —, —CH ₂ —, —C (CH ₃ ) ₂ —, -O-, -S-, a group having a fluorene skeleton represented by the following formula (3-2), or a single bond.

  A color filter comprising a protective film that is a cured film for a liquid crystal display device according to any one of claims 1 to 7.   A substrate for a liquid crystal display device comprising an interlayer insulating film which is the cured film for a liquid crystal display device according to any one of claims 1 to 7.   A liquid crystal display device comprising at least one of the color filter according to claim 8 and the substrate for liquid crystal display device according to claim 9.

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