JP2007081023A - Semiconductor checking board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a less expensive probe card in which inherent data read automatically upon loading is recorded on the probe card itself. <P>SOLUTION: The probe card 30 is provided with connection terminals 31v to 31z for recording an inherent number of the probe card 30. For these connection terminals 31v to 31z, surplus connection terminals which are not used for checking are utilized. The connection terminal 31v is used for a power supply, the connection terminal 31z for the ground, and the connection terminals 31w to 31y for holding data. Upon loading the probe card 30; a potential of the connection terminals 31w, 31x becomes at H level, and a potential of the connection terminal 31y becomes at L level. These potentials are arranged as the inherent data of the probe card 30. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor testing board used when testing electrical characteristics of a semiconductor device.

  In a semiconductor manufacturing process, it is common to make a pass / fail judgment by a semiconductor inspection apparatus in the state of a semiconductor wafer on which a large number of semiconductor elements are formed. The semiconductor inspection apparatus includes a tester apparatus that inspects electrical characteristics of each semiconductor element of a semiconductor wafer and a prober apparatus that transports the semiconductor wafer. The tester device is equipped with a probe card (semiconductor inspection board) having a plurality of probe needles corresponding to the number of electrodes of the semiconductor element, and an electrical signal is transmitted between the tester device and the semiconductor element via the probe card. It is given and received.

  In the inspection by the semiconductor inspection apparatus, the contact between the electrode of the semiconductor element and the probe needle is repeatedly performed by the number of semiconductor elements to be inspected. When the electrode of the semiconductor element and the probe needle come into contact with each other, the probe needle bends and the electrical continuity is maintained by the elasticity at this time. For this reason, the probe needles may be fatigued or worn during repeated contact, resulting in uneven deflection among the plurality of probe needles, resulting in inaccurate electrical characteristics. .

  In order to prevent the above problems, the number of contact of the probe needle of the probe card is managed. When the number of contact of the probe needle reaches a predetermined number of times, the use of the probe card is temporarily suspended, and the probe card is used again after correcting the unevenness of the probe needle.

  Conventionally, a computer connected to a tester device has been used as a method for managing the number of contact times of the probe needle (see, for example, Patent Document 1). In the computer, for each probe card, the unique number, the limit of the number of times of contact, and the number of times of contact so far are registered. Each time the probe card is used, its unique number and the number of contacts are reported to the computer. The computer updates the number of times of contact up to the present and compares it with the limit of the number of times of contact, and issues a warning if this is exceeded.

Conventionally, as a method of reporting the unique number of a probe card to a computer, it has been performed by manually inputting from a terminal or by passing a magnetic card attached to the probe card through a card reader. However, in the case of manual input, there is a possibility that an incorrect unique number is input. Further, when using a magnetic card, the work of passing the magnetic card through the card reader becomes a troublesome work, and the magnetic card must always be managed in correspondence with the probe card. Therefore, in the probe card described in Patent Document 2, a memory element is mounted on the probe card substrate, information such as a unique number and the total number of contacts is recorded in the memory element, and the information is automatically read out. Has been.
JP 7-169800 A JP-A-5-297021

  However, the technique described in Patent Document 2 has a problem that the manufacturing cost of the probe card is significantly increased because the memory element must be mounted on the probe card.

  It is an object of the present invention to provide an inexpensive semiconductor inspection board while recording unique data automatically read at the time of mounting on the semiconductor inspection board itself.

  The present invention relates to a semiconductor testing board that is connected to a tester device and transfers electrical signals between the tester device and the semiconductor device in order to inspect the electrical characteristics of the semiconductor device, and is connected to the tester device. Among the connection terminals to be connected, a plurality of connection terminals not used for inspection are set to either H level or L level potentials when connected, and these potentials are read out to the tester device for semiconductor inspection. It is characterized as board specific data.

  A connection terminal for supplying power to which power is supplied from the tester device, and a connection terminal for ground that is connected to the ground. The connection terminal that becomes an H level potential at the time of connection is connected via a resistor. It is preferable that a connection terminal connected to the power supply connection terminal and having an L level potential at the time of the connection is connected to the ground connection terminal.

  The board for semiconductor inspection of the present invention is connected to a tester device and transfers electrical signals between the tester device and the semiconductor device. Among the connection terminals connected to the tester device, a plurality of terminals not used for inspection are used. These connection terminals are set to potentials of H level or L level at the time of connection, respectively, and these potentials are read out to the tester device and used as specific data of the semiconductor inspection board. A very simple electronic circuit is configured using the terminals, and the unique data of the semiconductor inspection board can be recorded by this electronic circuit, so the unique data that is automatically read out at the time of connection is stored in the semiconductor inspection board itself. An inexpensive board for semiconductor inspection can be provided while recording. The unique data is used to specify the semiconductor inspection board, and the semiconductor inspection board is managed based on data such as the limit contact number and the total contact number recorded in correspondence with the unique data.

  As shown in FIG. 1, the semiconductor inspection apparatus 2 includes a prober apparatus 4 that conveys a semiconductor wafer 3, a tester apparatus 5 that inspects the electrical characteristics of semiconductor elements formed on the semiconductor wafer 3, and the tester apparatus 5. It is comprised from the connected high-order computer 6.

  The prober device 4 includes a stage 10 on which the semiconductor wafer 3 is fixed, and a stage driving mechanism 11 that moves the stage 10 in three axial directions. The stage driving mechanism 11 positions the stage 10 so that the electrodes of the semiconductor elements on the semiconductor wafer 3 are in contact with the probe needles 33 described later, and the plurality of semiconductor elements on the semiconductor wafer 3 are continuously connected to the probe needles 33. The stage 10 is transported so as to contact sequentially.

  The tester device 5 includes a tester device body 20 and a test head 21. The tester device body 20 and the test head 21 are connected by a cable (not shown). The test head 21 is provided with a connector 22, and a probe card (semiconductor inspection board) 30 is attached to the connector 22 for use.

  As shown in FIG. 2, the probe card 30 has a rectangular shape, and a plurality of connection terminals 31a to 31z are provided at one end. These connection terminals 31 a to 31 z are connected to the connector 22 of the test head 21. A rectangular opening 32 is formed on the other end side of the probe card 30, and a probe needle 33 is provided in the opening 32 so as to protrude downward (see FIG. 1). The semiconductor wafer 3 is brought closer to the probe card 30 from below, and the electrode of the semiconductor element is brought into contact with the probe needle 33.

  The connection terminals 31a to 31z are divided into connection terminals 31a to 31u for inspection and connection terminals 31v to 31z for recording a unique number of the probe card 30. The connection terminals 31a to 31u for inspection are respectively connected to the probe needle 33 via wiring not shown.

  As the connection terminals 31v to 31z for recording the unique number, the remaining connection terminals that are not used for the inspection are used. As shown in FIG. 3, the connection terminal 31v is for power supply, the connection terminal 31z is for ground, and the connection terminals 31w to 31y are for data holding. The data holding connection terminals 31w to 31y are respectively connected to a power supply connection terminal 31v via a resistor R. Of these connection terminals 31w to 31y, only the connection terminal 31y is a ground connection terminal. 31z. Thereby, when the probe card 30 is mounted, the potentials of the connection terminals 31w and 31x become H level and the potential of the connection terminal 31y becomes L level. For convenience, when expressed in the form of (the potential of the connection terminal 31w, the potential of the connection terminal 31x, the potential of the connection terminal 31y), it becomes (H, H, L), and this potential arrangement is the data of the unique number of the probe card 30. The Note that. In the present embodiment, since three connection terminals for holding data are used, different probe cards for 3 bits (eight kinds) can be identified. However, a connection terminal for holding data is added to increase the number of probes. The card may be identifiable.

  The tester device main body 20 transmits a test signal to the semiconductor element via the test head 21 and the probe card 30. At this time, a test signal is transmitted through the connection terminals 31a to 31u for inspection of the probe card 30. The semiconductor element operates in response to the test signal, and the output signal is received by the tester apparatus body 20 via the probe card 30 and the test head 21 to inspect the electrical characteristics of the semiconductor element. The tester apparatus body 20 compares the output signal of the semiconductor element with the expected output signal, determines whether the semiconductor element is good or bad, and accumulates the good / bad data.

  Further, the tester device main body 20 reads the potentials of the connection terminals 31w to 31y of the probe card 30 through the test head 21, thereby obtaining the unique number data of the probe card 30 using this. This unique number data is sent to the host computer 6.

  The host computer 6 includes a control unit 40, a memory 41, a display unit 42, and the like. In the memory 41, the unique numbers of the plurality of probe cards 30 are recorded, and the limit contact number and the total contact number of the probe card 30 to which the unique numbers are assigned are recorded corresponding to these unique numbers. Yes. Here, the limit number of contact times represents the number of contact times when maintenance is required due to repeated contact of the probe needle 33, and the total number of contact times refers to the probe needle from the time maintenance is performed until the present time. 33 represents the number of times of contact.

  When the host computer 6 receives the unique number data of the probe card 30 being used, the probe card 30 is identified from the unique number data, and the limit contact number and total contact number data of the probe card 30 are read out. Then, when the current inspection is completed, the number of contacts with which the probe needle 33 is contacted in the current inspection is added to the total number of contacts, and this is set as a new total number of contacts. The new total contact count is compared with the limit contact count, and if the new total contact count is larger, a warning that maintenance is necessary is displayed on the display unit 42. Note that a counter is provided in the tester device body 20 in order to count the number of times the probe needle 33 has contacted.

  Hereinafter, the operation of the above configuration will be described. When performing the inspection, the probe card 30 matched with the semiconductor wafer 3 to be inspected is selected, and the probe card 30 is mounted on the test head 21. Thereby, each connection terminal 31a-31z of the probe card 30 and the connector 22 of the test head 21 are connected. The tester apparatus main body 20 reads the potential of the connection terminals 31w to 31y for recording the unique number, that is, the unique number data of the probe card 30, and confirms whether or not the probe card 30 corresponds to the semiconductor wafer 3 to be inspected this time.

  Thereafter, the stage 10 is driven, and a plurality of semiconductor elements formed on the semiconductor wafer 3 on the stage 10 sequentially contact the probe needles 33 of the probe card 30. Each time each semiconductor element comes into contact with the probe needle 33, a test signal is given, and the quality of the semiconductor element is judged based on an output signal corresponding to the test signal, and the quality data is stored in the tester apparatus body 20. Further, the tester device body 20 counts the number of times the probe needle 33 is contacted in the current examination.

  When all the semiconductor elements on the semiconductor wafer 3 have been inspected, the unique number data of the probe card 30 and the data of the number of contacts counted in the current inspection are sent from the tester apparatus body 20 to the host computer 6. The host computer 6 identifies the probe card 30 from the unique number data, and reads the limit contact number and the total contact number recorded in the memory 41. Then, the number of contacts counted in the current inspection is added to the read total number of contacts, and the new total number of contacts added and the limit number of contacts are compared. If the new total number of contacts is larger, a warning that maintenance is necessary is displayed on the display unit 42.

  As described above, according to the probe card 30 of the present invention, a very simple electronic circuit is configured using the remaining connection terminals 31v to 31z that are not used for the inspection, and the unique number data of the probe card 30 is formed by this electronic circuit. Therefore, it is possible to provide an inexpensive probe card 30 while recording the unique number data automatically read at the time of connection on the probe card 30 itself.

  In the above embodiment, the probe card is maintained when the probe needle contact count exceeds the limit contact count. However, the probe card is maintained when the probe card usage period exceeds the limit use interval. It may be. Furthermore, it may be performed when maintenance is required due to either the probe needle contact count exceeding the limit contact count or the probe card usage period exceeding the limit use period.

  In the above embodiment, only one tester device is connected to the host computer, but a plurality of tester devices may be connected to simultaneously manage a plurality of probe cards.

  In the above embodiment, a probe card for inspecting each semiconductor element on a semiconductor wafer has been described as a semiconductor inspection board. However, the test board for inspecting a packaged semiconductor device can also be used. The present invention can be applied.

It is a schematic block diagram of a semiconductor inspection apparatus. It is a top view of a probe card. It is the schematic of the connection terminal for a specific number recording, and the electronic circuit formed around this connection terminal.

Explanation of symbols

2 Semiconductor inspection device 3 Semiconductor wafer 4 Prober device 5 Tester device 6 Host computer 30 Probe card 31a to 31u Connection terminal for inspection 31v to 31z Connection terminal for inherent number recording

Claims (2)

In order to inspect the electrical characteristics of the semiconductor device, in a semiconductor inspection board that is connected to a tester device and transfers electrical signals between the tester device and the semiconductor device,
Among the connection terminals connected to the tester device, a plurality of connection terminals not used for inspection are set to either H level or L level potentials at the time of connection, and these potentials are read to the tester device. A semiconductor inspection board, characterized in that the data is unique data of the semiconductor inspection board. It has a connection terminal for power supply to which power is supplied from the tester device, and has a connection terminal for ground connected to the ground,
The connection terminal having the H level potential is connected to the connection terminal for supplying power via a resistor, and the connection terminal having the L level potential is connected to the ground connection terminal. The board for semiconductor inspection according to claim 1, wherein:

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