JP2007080713A - Organic el panel and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress occurrence of leak in an organic EL element and prevent deterioration of the organic EL element by preventing permeation of adhesive into the EL element and mixing of air bubbles in the adhesion part, in the organic EL panel made thin by pasting and sealing the substrate and the sealing member. <P>SOLUTION: In the organic EL panel 10, an EL element 2 arranged with a plurality of light emitting parts A is formed on an element substrate 1 (a), an adhesive sheet 3 which surrounds the light emitting part A with a recessed part 3a is positioned over the EL element 2 (b), the adhesive sheet 3 is pasted on the element substrate 1 (c), a sealing substrate 4 is pasted on the adhesive sheet 3 and the adhesive sheet 3 is cured (d), and a gap is provided between the light emitting part A and the adhesive sheet 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL panel in which an element substrate on which an organic EL element is formed and a sealing member for sealing the organic EL element are bonded together with an adhesive sheet, and a method for manufacturing the same.

  An organic EL (electroluminescence) panel is a spontaneous emission type display, and has characteristics such as a wide viewing angle, high contrast, and quick response reactivity.

  An organic EL element is formed by sequentially laminating a transparent conductive film such as ITO (Indium Tin Oxide) as an anode on a transparent substrate such as glass, a single or multilayer organic light emitting layer thereon, and a metal such as Al as a cathode. It is an element of the structure.

  In the organic EL element, the cathode is oxidized or peeled off at the interface with the organic compound due to the influence of moisture or oxygen entering from a defect such as a pinhole, thereby generating a dark spot (non-light emitting region). This dark spot causes deterioration in display quality and reduction in luminance.

  In order to prevent the influence of moisture and oxygen, as a sealing method of the organic EL element, there is a method in which a metal can having a hollow structure is bonded to the back surface of the panel using an epoxy adhesive. The sealing part is only the peripheral part of the panel, and dry nitrogen is sealed in the hollow part.

In the disclosure of Patent Document 1, a sealing space is provided between a sealing plate such as glass and the organic layer of the substrate, and the outer peripheral portion of the sealing plate is bonded to the substrate with a sealing agent such as resin. In the part, the convex part formed in the board | substrate and the concave part formed in the sealing board are bonded together so that it may mutually mesh. As a result, the spread of the sealing agent is absorbed by the concave portion, the penetration of the sealing agent into the light emitting element portion is prevented, and the deterioration of the element is suppressed. Moreover, the path | route until a water | moisture content penetrate | invades into sealing space by providing a recessed part is enlarged, and the sealing characteristic is improved.
Japanese Patent Laid-Open No. 2001-210464 (paragraphs 0015, 0018 and 0019)

  However, in Patent Document 1, it is necessary to provide a recess in the sealing plate, but the sealing plate is generally made of a metal material or a glass material, and the process of forming the recess in such a hard material is complicated and manufactured. It is costly. Moreover, in order to provide a recessed part in a sealing plate, it is necessary to make the sealing plate itself thick, and the whole organic EL panel tends to be thick. In addition, when the adhesive is applied to the concave portion of the sealing plate, the concave portion may be filled with the adhesive, and further, the adhesive may protrude and spread to the light emitting element portion at the time of bonding. Moreover, in patent document 1, only the outer peripheral position surrounding the whole light emission area | region is adhere | attached, and when there exist a some light emission part corresponding to a some pixel, a sealing plate and between between adjacent light emission parts are provided. It does not bond to the substrate.

  On the other hand, in order to make the organic EL panel thinner, a resin is directly applied on the organic EL element formed on the substrate, a sealing substrate is attached thereon, and then the resin is cured, and the organic EL element There is a bonding sealing method for sealing. In this method, after several layers of inorganic films are formed on the organic EL element, a resin is applied on the inorganic film, whereby the penetration of the resin into the organic EL element can be more effectively prevented. .

  However, in the bonding sealing method, since the adhesive is fixed to the organic EL element in a solid state, solid sealing is performed. In such solid sealing, since the resin cures in a state where the resin is directly applied to the organic EL element, if there is a minute defect or dust on the organic EL element, the organic EL element is There is a problem that it is slightly deformed and leaks easily occur.

  When a leak occurs, if there is a space between the sealing can and the organic EL element as in the sealing can, the leak may be repaired in that space. However, when resin is applied directly on the organic EL element, there is no space for self-repair when a leak occurs, and the influence of the leak tends to increase.

  In addition, in the bonding sealing method, the organic EL element and the adhesive resin are in direct contact with each other. If the resin soaks into the organic layer from the pinhole of the cathode of the organic EL element, the organic layer is damaged. There is.

  If a liquid adhesive is used, the adhesive is likely to penetrate when the adhesive is applied. However, if a solid adhesive sheet is used, it can be attached to the organic EL element in a solid state, thereby preventing the adhesive from penetrating. it can. However, since the adhesive sheet comes into contact with the organic EL element in a solid state when being attached, there is a problem that bubbles are likely to enter the adhesive surface with the organic EL element. When such bubbles are mixed, moisture contained in the bubbles may damage the organic layer.

  Accordingly, an object of the present invention is to provide an organic EL panel that suppresses the occurrence of leakage of the organic EL element and prevents the penetration of the adhesive into the organic EL element and the mixing of bubbles into the bonded portion, and a method for manufacturing the same. It is.

  The organic EL panel according to the present invention includes a first electrode layer, an organic functional layer formed on the first electrode layer and containing an organic light emitting material, and a second electrode layer formed on the organic functional layer. An organic EL element, an element substrate that supports the organic EL element, a sealing member that seals the organic EL element, and the element substrate and the sealing member between the element substrate and the sealing member. An adhesive layer to be bonded, and the adhesive layer includes a concave portion surrounding the light emitting portion where the organic functional layer is sandwiched between the electrodes by providing a gap, and the light emitting portion is formed on the element substrate. It is characterized by adhering to a non-existing area.

  In the method for manufacturing an organic EL panel according to the present invention, an organic EL element is formed by laminating a first electrode layer, an organic functional layer containing an organic light emitting material, and a second electrode layer on an element substrate, and the organic EL element A method for producing an organic EL panel in which the element substrate and the sealing member are bonded to each other by affixing a sealing member for sealing the element substrate to the element substrate via an adhesive sheet and curing the adhesive sheet. A concave portion is formed in the adhesive sheet surrounding the light emitting portion where the organic functional layer is sandwiched between the electrodes, and the concave portion of the adhesive sheet is aligned with the light emitting portion, and the adhesive sheet is attached to the element substrate. It adheres to the area | region in which the said light emission part is not formed among the top.

  According to the present invention, in an organic EL panel that is thinned by bonding and sealing an element substrate and a sealing member, the occurrence of leakage of the organic EL element is suppressed, and the penetration and adhesion of the adhesive to the organic EL element are suppressed. It is possible to prevent air bubbles from entering the part and to prevent the organic EL element from deteriorating. Moreover, such an organic EL panel can be easily manufactured at low cost.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In addition, the illustration in the following description does not limit this invention.

  FIG. 2 is a schematic sectional view showing Embodiment 1 of the organic EL panel according to the present invention.

  In FIG. 2, an organic EL panel 10 includes an EL element 2 in which a plurality of light emitting portions A are arranged on an element substrate 1, and a gap is provided between the light emitting portion A and the EL element 2. An adhesive sheet 3 surrounding A with a recess 3 a is attached, and a sealing substrate 4 is attached on the adhesive sheet 3.

  The element substrate 1 is a flat plate having rigidity, and is made of a transparent material having optical transparency. A glass material or a resin material with a moisture-proof film is used. The element substrate may be a flexible film in order to produce a curved organic EL panel in addition to a rigid flat plate.

  As shown in the partial enlarged view of FIG. 3, in the EL element 2, an ITO layer 2b as an anode is formed in a display area on the element substrate 1, and an organic functional layer 2a is formed on the plurality of light emitting portions A on the ITO layer 2b. Correspondingly, they are formed at a plurality of locations apart from each other, and an Al layer 2c as a cathode is formed on the organic functional layer 2a so as to face the ITO layer 2b. The organic functional layer 2a is a layer containing an organic light emitting material having electroluminescence characteristics. The light emitting portion A is a portion where the organic functional layer 2a is sandwiched between the electrodes by the ITO layer 2b and the Al layer 2c, and emits light when energized.

  In a monochromatic organic EL panel, a plurality of light emitting portions A are formed of the same light emitting material, and each light emitting portion A corresponds to one pixel. In the multi-color organic EL panel, the light emitting materials for each color of red (R), green (G), and blue (B) are formed so as to be alternately arranged, and three colors corresponding to R, G, and B are formed. The light emitting part A corresponds to one pixel.

  As shown in the enlarged front view of the organic EL panel 10 in FIG. 4, the plurality of light emitting portions A are arranged in a matrix in which a plurality of rectangular light emitting portions A are aligned in the horizontal direction and the vertical direction. The plurality of light emitting units A are controlled to emit light for each light emitting unit A, and the display image of the entire organic EL panel 10 is adjusted.

  In the present embodiment, the first electrode layer formed on the element substrate is an anode and the second electrode layer formed on the light emitting portion is a cathode, but the first electrode layer is a cathode and the second electrode layer is It is good also as an anode. Further, an anode as a first electrode layer was formed in a plurality of locations in the display area on the element substrate in accordance with the light emitting portion, and an organic functional layer and a cathode as a second electrode layer were formed on the entire display area. The present embodiment can also be applied to the configuration.

  Moreover, you may provide functional layers, such as an electron carrying layer and a positive hole transport layer, in an organic EL element. Further, a structure such as a cathode partition or an insulating film may be provided.

  The adhesive sheet 3 is a material that has plasticity and is cured by heat or ultraviolet rays. For example, a thermosetting resin such as an epoxy resin is preferable. The adhesive sheet 3 is cured and adhered to the element substrate 1 in a state where the adhesive sheet 3 is attached to the element substrate 1 to form an adhesive layer. The plasticity and curing characteristics can be appropriately adjusted by changing the film thickness and material.

  The adhesive sheet 3 has a sheet shape, and a plurality of recesses 3a are formed on one side. The light emitting portion A of the organic EL element 2 and the adhesive sheet 3 are surrounded by the recess 3a without contacting the light emitting portion A, and the adhesive sheet 3 adheres to a region of the element substrate 1 where the light emitting portion A is not formed. That is, the adhesive sheet 3 is adhered on the element substrate 1 between the adjacent light emitting portions A, and a gap is formed between the light emitting portion A and the adhesive sheet 3. The gap is such that the light emitting portion A and the adhesive sheet 3 do not contact each other, and further, such a clearance that the adhering material such as defects and dust on the light emitting portion A and the adhesive sheet 3 do not contact each other is preferable.

  The depth of the concave portion 3a is deeper than the height of the rectangular shape of the light emitting portion A, and the outer peripheral shape of the concave portion 3a is larger than the outer peripheral shape of the light emitting portion A, whereby the adhesive sheet 3 emits light without contacting the light emitting portion A in the concave portion 3a. Enclose part A.

  The plurality of recesses 3 a are arranged in accordance with the intervals of the plurality of light emitting portions A on the element substrate 1, and the plurality of light emitting portions A formed in the display area of the element substrate 1 are formed by one adhesive sheet 3. Each is enclosed and covers the entire EL element 2.

  The concave portion 3a of the adhesive sheet 3 may have any shape that is not in contact with the light emitting portion A, such as a cross-sectional arc shape, in addition to the above-described rectangular shape.

  In the multicolor organic EL panel, one concave portion is provided for three light emitting portions A for one pixel corresponding to R, G, and B, for example. Further, in the case where one light emitting portion is formed on one surface in the light emitting region on the element substrate, one concave portion may be provided in the adhesive sheet corresponding to the one light emitting portion.

  The sealing substrate 4 is a rigid flat plate and is made of a moisture-proof material for sealing moisture. A glass material or a resin material with a moisture-proof film is used. In addition to a flat plate having rigidity as the sealing substrate 4, a curved organic EL panel can be manufactured if the sealing substrate 4 is formed into a flexible film together with the element substrate 1.

  In the case of a top emission type organic EL panel, a transparent material is selected for the adhesive sheet 3 and the sealing substrate 4 so that the light emitted from the EL element 2 is also transmitted to the sealing substrate 4 side.

  FIG. 1 is a diagram for explaining a sealing method of an EL element according to this embodiment.

  FIG. 1A shows a state in which the EL element 2 is formed on the element substrate 1. The ITO layer 2b is vapor-deposited on the display area of the element substrate 1, and the organic functional layers 2a are vapor-deposited on the ITO layer 2b so as to correspond to the plurality of light emitting portions A, spaced apart from each other at regular intervals. An Al layer 2c is deposited on the organic functional layer 2a so as to face the ITO layer 2b, and the organic EL element 2 is produced. In the light emitting portion A, the organic functional layer 2a is sandwiched between the ITO layer 2b and the Al layer 2c, and emits light when energized.

  The plurality of organic functional layers 2a are formed by, for example, a shadow mask. In a multi-color organic EL panel, the first color organic functional layer is deposited by aligning the shadow mask with the light emitting portion of the first color, and the next color organic functional layer is deposited by aligning the shadow mask with the light emitting portion of the next color. Then, light emitting portions of a plurality of colors are formed in order.

  FIG. 1B shows a state in which the EL element 2 and the adhesive sheet 3 on the element substrate 1 are aligned. The adhesive sheet 3 is prepared so as to be wider than the light emitting region, and a plurality of concave portions 3a are arranged corresponding to the plurality of light emitting portions A, respectively. The adhesive sheet 3 is moved to the upper part of the element substrate 1, and the position of the adhesive sheet 3 is further adjusted and aligned so that the light emitting part A and the concave part 3a face each other.

  The adhesive sheet 3 is formed with concave portions 3a in accordance with the arrangement, number and shape of the light emitting portions A. The concave portion 3a has a shape substantially equal to the shape of the light emitting portion A. The inner peripheral dimension of the concave portion 3a is slightly larger than the outer peripheral shape of the light emitting portion A, and the concave portion 3a is separated from the light emitting portion A and surrounds the light emitting portion A.

  The concave portion 3a of the adhesive sheet 3 can be formed by forming a convex pattern corresponding to the concave portion 3a on a rigid member and transferring this to a flat adhesive sheet. Since the adhesive sheet is made of a soft resin, the convex pattern can be easily transferred.

  FIG. 1C shows a state in which the adhesive sheet 3 is pasted on the element substrate 1. After the adhesive sheet 3 is aligned with the element substrate 1, the adhesive sheet 3 is pressed against the element substrate 1 side, and the adhesive sheet 3 and the element substrate 1 are attached. At this time, the adhesive sheet 3 is adhered between the adjacent light emitting portions A on the element substrate 1, and the plurality of light emitting portions A are not in contact with the adhesive sheet 3 by the concave portions 3a. Moreover, since the adhesive sheet 3 is in contact with the EL element 2 in a solid state, it is possible to prevent the adhesive from flowing out from the bonded portion and coming into contact with the light emitting portion A.

  By adhering the adhesive sheet 3 to the element substrate 1 in an inert gas with a vacuum laminator or a roller, the adhesive sheet 3 can be adhered more closely and uniformly. In the vacuum laminator, the adhesive sheet 3 is pressed against the element substrate 1 in a vacuum state. Since it is a vacuum, the air between the element substrate 1 and the adhesive sheet 3 can be removed to prevent bubbles from entering. In the roller, the adhesive sheet 3 is pressed against the element substrate 1 and pressed from above with the roller. Since the pressing portion is pressed while being moved by the roller, air between the element substrate 1 and the adhesive sheet 3 can be removed, and bubbles can be prevented from being mixed.

  In this state, the adhesive sheet 3 is not cured, and the sealing substrate 4 is pasted as will be described later, then the adhesive sheet 3 is cured, and the element substrate 1 and the sealing substrate 4 are fixed by the adhesive sheet 3.

  FIG. 1D shows a state in which the sealing substrate 4 is pasted on the adhesive sheet 3 and the adhesive sheet 3 is cured. The sealing substrate 4 is opposed to the adhesive sheet 3 attached to the element substrate 1, and the sealing substrate 4 and the adhesive sheet 3 are pressed and bonded. Next, the adhesive sheet 3 is cured, the adhesive sheet 3 and the element substrate 1 are fixed, the adhesive sheet 3 and the sealing substrate 4 are fixed, and the element substrate 1 and the sealing substrate 4 are bonded.

  By sticking the adhesive sheet 3 and the sealing substrate 4 with a vacuum laminator or a roller, the adhesive sheet 3 and the sealing substrate 4 can be more closely adhered and uniformly bonded. In the vacuum laminator, the sealing substrate 4 is pressed against the adhesive sheet 3 in a vacuum state. Since it is a vacuum, the air between the adhesive sheet 3 and the sealing substrate 4 is removed, and bubbles can be prevented from being mixed. In the roller, the sealing substrate 4 is pressed against the adhesive sheet 3 and the roller is pressed from above the sealing substrate 4. Since the pressing portion is pressed while moving by the roller, the air between the adhesive sheet 3 and the sealing substrate 4 can be removed and mixing of bubbles can be prevented.

  When the adhesive sheet 3 is a thermosetting resin, the adhesive sheet 3 is cured by heating for a predetermined time in a state where the sealing substrate 4 is bonded.

  Further, in the top emission type organic EL panel, the adhesive sheet 3 and the sealing substrate 4 are made of a transparent material, and light is transmitted from the sealing substrate 5 side to the adhesive sheet 3. The adhesive sheet 3 can be cured by irradiating ultraviolet rays from the sealing substrate 4 side using an ultraviolet curable resin.

  The element substrate 1 and the adhesive sheet 3 can be attached after the adhesive sheet 3 is attached on the sealing substrate 4. In this case, after the adhesive sheet 3 not formed with the recesses 3a is attached to the sealing substrate 4, the convex pattern is transferred to the adhesive sheet 3 to form the recesses 3a, and then the adhesive sheet 3, the element substrate 1, Can be pasted.

  In the above-described embodiment, since the light emitting portion A of the EL element 2 does not come into contact with the adhesive sheet 3, it is difficult for the light emitting portion A to be affected by curing shrinkage of the adhesive sheet when the adhesive sheet 3 is cured. Damage can be prevented. When there is a minute dust on the EL element, the adhesive shrinks when it is cured when it is applied and cured on the dust. Stress may be concentrated and leakage may occur. When a leak occurs in the light emitting portion A, the element of the light emitting portion A is damaged, and light emission for one pixel may be lost corresponding to the damaged light emitting portion A.

  Further, since a space is formed on the light emitting part A, even if a leak occurs on the light emitting part A, the leak is likely to be settled because there is a space for the cathode on the light emitting part A to scatter or rise. If there is no such space and the adhesive is applied over the entire light-emitting portion A, the leak is difficult to settle, heat is generated by the leak, and the light-emitting portion A is damaged in a wide range by the heat, causing a large light-emitting defect. May occur.

  In addition, since the space is divided for each light emitting part A by the adhesive sheet 3, even if the cathode scatters or rises in one light emitting part A, the influence is given to other light emitting parts A adjacent or nearby. Hateful. Further, when the space is divided for each light emitting portion A by the adhesive sheet 3, the adhesive sheet 3 is supported by the element substrate 1 around each light emitting portion A, and the strength in the attaching direction of the adhesive sheet 3 is maintained. When the adhesive sheet 3 is pasted on the EL element 2 or when the sealing substrate 4 is pasted on the adhesive sheet 3, the concave portion 3 a of the adhesive sheet 3 is crushed and the adhesive sheet 3 hits the EL element 2. To prevent.

  Further, since the adhesive sheet 3 does not come into contact with the light emitting portion A, it is possible to prevent the adhesive from penetrating into the light emitting portion A even if the adhesive sheet 3 melts at the time of bonding. Although the adhesive sheet 3 is in a solid state, it is heated at the time of bonding, and bonding is performed with a very liquid surface. At this time, if the adhesive sheet 3 is in contact with the light emitting portion A, the liquid may enter from the pinhole or the like of the cathode of the EL element 2 and an abnormality may occur in the light emission of the EL element 2.

  In addition, since the adhesive sheet 3 has a plurality of recesses 3a, even if bubbles are mixed between the adhesive sheet 3 and the element substrate 1, if the adhesive sheet 3 is further pressed against the element substrate 1, the bubbles are generated. It can enter into the concave portion 3a in the vicinity, remove bubbles from the bonded portion, and can be bonded well. In the case where the adhesive sheet has a flat surface with no recesses, the EL element and the adhesive are adhered and adhered over the entire surface of the element substrate, and the adhesion area is large and the entire area is adhered without air bubbles being mixed. It is difficult to put on.

  Further, since the space on the light emitting portion A is formed by the concave portion 3a of the adhesive sheet 3, the sealing substrate 3 itself is not required to be processed in order to maintain such a space, and is used as a flat surface. be able to. Therefore, as the sealing substrate 3, a hard material, a thin shape, a film shape, or the like can be used as appropriate according to the application. For example, the adhesive sheet is 20 μm, and the entire organic EL panel can be thinned by using a thin member such as 0.15 mm attached glass for the sealing member.

  Further, since the adhesive sheet 3 is made of a soft resin or the like, the concave portion 3a of the adhesive sheet 3 can be formed by a simple method such as a transfer pattern. Thus, if the recessed part 3a is formed in the adhesive sheet 3, sealing for every light emission part A can be performed at low cost, without making the manufacturing process of the organic electroluminescent panel 10 complicated.

  Thus, according to the present embodiment, in the bonding and sealing method in which the element substrate 1 and the sealing substrate 4 are bonded via the adhesive sheet 3 and the organic EL panel 10 is thinned, Since the recess 3a is provided and a gap is provided between the adhesive sheet 3 and the light emitting part A, it is possible to prevent stress due to curing shrinkage of the adhesive sheet 3 from being applied to the EL element 2 and to prevent the EL element 2 from leaking. it can. Further, even if leakage of the EL element 2 occurs, self-repair can be promoted because there is a space between the adhesive sheet 3 and the light emitting portion A when the cathode is scattered due to the leakage.

  Moreover, since the light emission part A and the adhesive sheet 3 do not touch directly, the penetration of the adhesive to the organic light emitting material of the light emission part A can be prevented. In addition, since a plurality of the recesses 3 a are formed on the bonding surface of the bonding sheet 3, it is possible to make it difficult for bubbles to enter the bonding portion with the element substrate 1.

  A second embodiment is shown in FIG. The same members as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the second embodiment, as shown in FIG. 5, the EL element 2 is formed on the element substrate 1, the protective film 5 is formed on the EL element 2, and the adhesive sheet 3 is pasted on the protective film 5. Then, the sealing substrate 4 is attached on the adhesive sheet 3 and the adhesive sheet 3 is cured.

  The protective film 5 covers the entire surface of the EL element 2, protects the adhesive portion with the adhesive sheet 3, and protects the light emitting portion A from gas components and dust generated from the adhesive sheet 3. The protective film 5 is made of an inorganic film such as silicon nitride, silicon oxide, silicon nitride oxide, aluminum oxide, DLC (diamond-like carbon), and is deposited on the element substrate 1.

  Even if gas is generated from the adhesive sheet 3 in the space between the light emitting portion A and the recess 3a by forming the protective film 5 between the EL element 2 and the adhesive sheet 3, the light emitting portion A is generated from this gas component. And the deterioration of the organic material of the EL element 2 can be more effectively prevented.

  Embodiment 3 is shown in FIG. The same members as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In Embodiment 3, as shown in FIG. 6, the protective film 6 is used as a sealing member. The protective film 6 is a moisture-proof thin film material and is formed on the adhesive sheet 3. The protective film 6 can be made of the same material as the protective film 5 described above, and the protective film 6 is formed in a film shape by being deposited on the adhesive sheet 3.

  In order to provide a space on the light emitting portion A, if the concave portion 3a is formed on the EL element 2 side of the adhesive sheet 3, the sealing member side becomes flat. Therefore, a flat and thin sealing member is used. be able to. Therefore, a thin film such as the protective film 6 can be used for the sealing member. Since the protective film 6 is a thin film, the entire organic EL panel 10 can be made thinner. If the element substrate 1 is made of a flexible material, the curved organic EL panel 10 can be manufactured together with the thin protective film 6.

  A fourth embodiment is shown in FIG. The same members as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the fourth embodiment, as shown in FIG. 7, the display area of the element substrate 1 is divided into light emitting unit groups each including a predetermined number of light emitting units A, and the respective light emitting unit groups are separated by the concave portions 3a of the adhesive sheet 3 and bonded. A plurality of light emitting portions A are surrounded by one concave portion 3 a of the sheet 3. In FIG. 7, a plurality of light emitting portions A are arranged in a dot matrix, among which 10 columns in the vertical direction and 10 rows in the horizontal direction constitute one light emitting portion group, and each light emitting portion group is surrounded by a single recess 3a with a gap. . The number of light emitting units included in the light emitting unit group can be changed as appropriate.

  As described above, when one concave portion is provided for several tens of pixels, the concave portion of the adhesive sheet is formed and the adhesive sheet and the element substrate are compared with the case where the concave portion is provided for each pixel for each pixel. Bonding is easy. If the area of the concave portion is increased, the concave portion of the adhesive sheet may be crushed and hit the EL element when the adhesive sheet and the element substrate are bonded together or when a sealing substrate or a protective film is attached on the adhesive sheet. Therefore, the area of a recessed part is suitably changed in the suitable range which maintains the intensity | strength of the affixing direction of an adhesive sheet, and the recessed part of an adhesive sheet is not crushed.

It is a figure for demonstrating the manufacturing process (a) to (d) of the organic electroluminescent panel of Embodiment 1 which concerns on this invention. It is a cross-sectional schematic diagram of the organic electroluminescent panel of Embodiment 1 which concerns on this invention. FIG. 3 is a partially enlarged view of the EL element shown in FIG. 2. It is a front enlarged view of the organic EL panel shown in FIG. It is a cross-sectional schematic diagram of the organic electroluminescent panel of Embodiment 2 which concerns on this invention. It is a cross-sectional schematic diagram of the organic EL panel of Embodiment 3 which concerns on this invention. It is a front enlarged view of the organic electroluminescent panel of Embodiment 4 which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Element substrate 2 EL element 3 Adhesive sheet 4 Sealing substrate A Light emission part

Claims (14)

  An organic EL element comprising a first electrode layer, an organic functional layer formed on the first electrode layer and containing an organic light emitting material, and a second electrode layer formed on the organic functional layer, the organic EL element An element substrate to support, a sealing member for sealing the organic EL element, and an adhesive layer for bonding the element substrate and the sealing member between the element substrate and the sealing member; The adhesive layer includes a concave portion surrounding the light emitting portion sandwiched between the electrodes by providing a gap, and adheres to a region of the element substrate where the light emitting portion is not formed. Organic EL panel.   The organic EL element includes a plurality of the light emitting portions, and the concave portion of the adhesive layer is provided for each light emitting portion of the plurality of light emitting portions, and surrounds each light emitting portion with a gap. Item 2. An organic EL panel according to Item 1.   The organic EL element includes a plurality of light emitting portions, and the concave portion of the adhesive layer is provided for each light emitting portion group including a predetermined number of light emitting portions among the plurality of light emitting portions, and a gap is provided around the light emitting portion group. The organic EL panel according to claim 1, wherein the organic EL panel is provided and surrounded.   The organic EL panel according to any one of claims 1 to 3, further comprising a protective film provided between the organic EL element and the adhesive layer to protect the organic EL element.   The organic EL panel according to claim 1, wherein the sealing member is a film.   An organic EL element is formed by laminating a first electrode layer, an organic functional layer containing an organic light emitting material, and a second electrode layer on an element substrate, and a sealing member for sealing the organic EL element is formed on the element substrate. A method of manufacturing an organic EL panel in which the element substrate and the sealing member are bonded together by being bonded via an adhesive sheet and curing the adhesive sheet, wherein the organic functional layer is sandwiched between electrodes A concave portion surrounding the portion with a gap is formed in the adhesive sheet, the concave portion of the adhesive sheet is aligned with the light emitting portion, and the light emitting portion is not formed on the element substrate in the adhesive sheet. A method for producing an organic EL panel, characterized by adhering to an organic EL panel.   A plurality of the light emitting portions are formed on the element substrate, the concave portion of the adhesive sheet is provided for each light emitting portion of the plurality of light emitting portions, and is formed so as to surround each light emitting portion with a gap therebetween, The method for manufacturing an organic EL panel according to claim 6, wherein the adhesive sheet is bonded onto the element substrate with the concave portion of the adhesive sheet aligned with each light emitting portion.   A plurality of the light emitting portions are formed on the element substrate, and the concave portion of the adhesive sheet is provided for each light emitting portion group including a predetermined number of light emitting portions among the plurality of light emitting portions, and a gap is formed around the light emitting portion group. The organic EL panel according to claim 6, wherein the organic EL panel is formed so as to be provided and surrounded, and the adhesive sheet is bonded onto the element substrate with the concave portion of the adhesive sheet aligned with the light emitting unit group. Method.   The method for producing an organic EL panel according to claim 6, wherein a protective film for protecting the organic EL element is formed between the organic EL element and the adhesive sheet.   The method for manufacturing an organic EL panel according to claim 6, wherein the sealing member is formed in a film shape.   10. The method of manufacturing an organic EL panel according to claim 6, wherein after bonding the element substrate and the adhesive sheet, the adhesive sheet and the sealing member are bonded. .   The method for manufacturing an organic EL panel according to any one of claims 6 to 9, wherein after the sealing member and the adhesive sheet are bonded, the adhesive sheet and the element substrate are bonded. .   13. The method for manufacturing an organic EL panel according to claim 12, wherein the concave portion is formed in the adhesive sheet after the sealing member and the adhesive sheet are bonded.   The method for producing an organic EL panel according to claim 6, wherein the concave portion is formed by transferring a convex pattern to the adhesive sheet.

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