JP2007073805A - Joining head and joining apparatus of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joining head of electronic components which efficiently transmits the vibration of a vibration amplifier to a crimp with a simple configuration, even if the crimp is attached to or detached from the vibration amplifier. <P>SOLUTION: The joining head 5 of electronic components for joining a substrate to electronic components 4 comprises: a vibration generator 30; a vibration amplifier 31 for amplifying vibration generated from the vibration generator 30; and a crimp 32 for crimping the electronic components 4 to the substrate while giving vibration amplified by the vibration amplifier 31 to the electronic components 4. A washer 34 that is formed by a metal member having lower hardness than that of the crimp 32 and is interposed between the crimp 32 and the vibration amplifier 31 is deformed, when connecting an external thread 32b and an internal thread 31d for detachably connecting the crimp 32 to the vibration amplifier 32 and adheres to the crimp 31 and the vibration amplifier 31. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component bonding head for bonding a substrate and an electronic component, and an electronic component bonding apparatus including the electronic component bonding head.

  Conventionally, as a method of joining a substrate and an electronic component in a state where the terminal portion formed on the substrate and the electrode portion formed on the electronic component are electrically connected, vibration such as ultrasonic vibration is applied to the electronic component. There is known a bonding method in which an electronic component is pressed and bonded to a substrate while being applied to the substrate. An electronic component bonding apparatus for bonding a substrate and an electronic component by such a bonding method includes a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies vibration generated by the vibration generating unit, and a vibration amplifying unit. A joining head having a pressure contact portion that presses the electronic component against the substrate while applying the amplified vibration to the electronic component is provided. Moreover, the vibration part is comprised by the vibration generation part and the vibration amplification part.

  In this type of joining head, when the substrate and the electronic component are joined, a load and vibration are applied to the suction surface (pressure contact surface) of the press contact portion that sucks the electronic component and presses the electronic component against the substrate. For this reason, if the bonding between the substrate and the electronic component is repeated, the suction surface is worn. If the adsorption surface becomes extremely worn, the substrate and the electronic component cannot be joined appropriately, and the pressure contact portion needs to be replaced. Therefore, as this type of joining head, a joining head is proposed in which the press contact portion is configured to be attachable to and detachable from the vibration amplifying portion, and only the press contact portion can be replaced instead of the entire vibration amplifying portion (for example, Patent Documents). 1 and 2).

  Patent Document 1 and Patent Document 2 disclose a joining head in which a pressure contact portion is configured to be detachable from a vibration amplification portion by using a screw to couple the pressure contact portion to the vibration amplification portion. For example, in Patent Document 1, a male screw part formed in a block-shaped pressure contact part is screwed with a male screw part of a bolt inserted into a vibration amplification part so that the pressure contact part can be attached to and detached from the vibration amplification part. An improved joining head is disclosed. Further, in Patent Document 2, for example, the pressure contact portion itself is configured by a bolt, and the male screw portion of the bolt is screwed to the female screw portion formed in the vibration amplification portion, so that the pressure contact portion can be attached to and detached from the vibration amplification portion. A structured joining head or the like is disclosed.

JP 2004-14775 A JP-A-10-52768

  In order to appropriately bond the substrate and the electronic component, it is necessary to efficiently transmit the vibration amplified by the vibration amplification unit to the pressure contact unit. In particular, in a joining head in which the pressure contact portion is formed separately from the vibration amplification portion and the pressure contact portion is configured to be detachable from the vibration amplification portion, the transmission efficiency of vibration from the vibration amplification portion to the pressure contact portion becomes a problem. For example, when the pressure contact portion is attached to the vibration amplification portion with an inclination, a gap is generated between the pressure contact portion and the vibration amplification portion, and the transmission efficiency of vibration to the pressure contact portion is deteriorated.

  Therefore, for example, in the joining head disclosed in Patent Document 1, a recess having a vertical surface and an inclined surface is formed on the lower surface of the vibration amplification unit. Moreover, the vertical surface and the inclined surface are formed in the press-contact part formed in the block shape. The vertical surface formed on the press contact portion and the vertical surface formed on the lower surface of the vibration amplification unit are slid between the inclined surface formed on the press contact portion and the inclined surface formed on the lower surface of the vibration amplification unit. Until the contact, the male screw portion of the bolt inserted into the vibration amplifying portion from above the vibration amplifying portion is screwed into the female screw formed in the press contact portion. By doing so, the vibration amplifying part and the pressure contact part are brought into close contact with each other, and the vibration of the vibration amplification part is efficiently transmitted to the pressure contact part.

  However, in the joining head disclosed in Patent Document 1, as described above, the configuration for efficiently transmitting the vibration of the vibration amplifying unit to the press contact unit is complicated. For this reason, it is difficult to manufacture the joining head, and the cost of the joining head increases. Moreover, in the joining head disclosed in Patent Document 2, a specific configuration for efficiently transmitting the vibration of the vibration amplifying unit to the press contact portion is not employed, or the vibration of the vibration amplifying unit is efficiently transmitted to the press contact portion. Even when a configuration for transmission is employed, the configuration is complicated as in the joining head disclosed in Patent Document 1.

  Therefore, the problem of the present invention is that even if the pressure contact portion can be attached to and detached from the vibration amplification portion (or vibration portion), the vibration of the vibration amplification portion (or vibration portion) can be transferred to the pressure contact portion with a simple configuration. It is an object of the present invention to provide an electronic component bonding head capable of efficiently transmitting, and an electronic component bonding apparatus including the electronic component bonding head.

  In order to solve the above-described problems, the present invention provides a vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies vibration generated by the vibration generating unit, and an electronic component that amplifies the vibration amplified by the vibration amplifying unit. And an electronic component joining head that joins the substrate and the electronic component, and is formed of a metal member having a lower hardness than the pressure contacting portion. And the male screw part and the female screw part that detachably couple the pressure contact part to the vibration amplifying part, and the intermediate member is deformed when the male screw part and the female screw part are coupled with each other. It is characterized by being in close contact with the vibration amplifying unit.

  The joining device of the present invention includes a male screw part and a female screw part that detachably couple the press contact part to the vibration amplifying part. That is, in the joining device of the present invention, the pressure contact portion is configured to be detachable from the vibration amplification portion by screw connection. For this reason, it is easy to attach and detach the pressure contact portion to the vibration amplification portion.

  In the joining device of the present invention, the interposed member formed of a metal member having a lower hardness than the press contact portion and interposed between the press contact portion and the vibration amplifying portion is deformed when the male screw portion and the female screw portion are coupled to each other. In close contact with the pressure contact portion and the vibration amplification portion. Therefore, the pressure contact portion and the vibration amplifying portion can be indirectly brought into close contact with each other by the interposition member that is in close contact with the pressure contact portion and the vibration amplification portion. Therefore, it is possible to suppress the occurrence of the natural vibration of the pressure contact portion during vibration of the vibration amplification portion, and to efficiently transmit the vibration of the vibration amplification portion to the pressure contact portion. That is, in the joining apparatus of the present invention, even if the pressure contact portion can be attached to and detached from the vibration amplification portion, the interposed member can be interposed between the pressure contact portion and the vibration amplification portion with a simple configuration. Vibration can be efficiently transmitted to the pressure contact portion.

  In the present invention, the interposition member is formed in a flat plate shape, and the thickness thereof is preferably 0.5 mm or less. In the present invention, the thickness of the interposed member is more preferably 0.3 mm or less. When the thickness of the interposed member is 0.5 mm or less, the vibration of the vibration amplifying part can be efficiently and appropriately transmitted to the pressure contact part. Further, when the thickness of the interposition member is 0.3 mm or less, the vibration of the vibration amplifying part can be transmitted to the pressure contact part more efficiently and appropriately.

  In the present invention, it is preferable that the press contact portion is constituted by a bolt having a head at one end and a male screw portion or a nut having a female screw portion. If comprised in this way, the structure of a press-contact part can be simplified.

  In the present invention, the bolt head or nut is preferably formed in a polygonal shape. If comprised in this way, the fastening operation | work of a male thread part and a female thread part will become easy. In addition, versatile bolts and nuts such as hexagon bolts and hexagon nuts can be used, and the cost of the joining head can be reduced.

  In order to solve the above-described problems, the present invention includes a vibration part and a pressure contact part to which vibration of the vibration part is transmitted, and presses the electronic component against the substrate while applying the vibration of the pressure contact part to the electronic component. The electronic component joining head for joining the substrate and the electronic component is formed of a metal member having a hardness equal to or lower than the hardness of the press contact portion, and includes an interposition member interposed between the press contact portion and the vibration portion, and the vibration portion The pressure contact portion is configured to be detachable, and the interposed member is deformed when the pressure contact portion is attached to the vibration portion, and is in close contact with the pressure contact portion and the vibration portion.

  In the joining device of the present invention, the interposition member formed by a metal member having a hardness equal to or lower than the hardness of the press contact portion is interposed when the press contact portion is attached to the vibration portion. It is in close contact with the pressure contact part and the vibration part. For this reason, the press contact portion and the vibration portion can be indirectly brought into close contact with the interposition member in close contact with the press contact portion and the vibration portion. Therefore, it is possible to suppress the occurrence of the natural vibration of the pressure contact portion during vibration of the vibration portion, and to efficiently transmit the vibration of the vibration portion to the pressure contact portion. That is, in the joining device of the present invention, even if the pressure contact portion can be attached to and detached from the vibration portion, the vibration of the vibration portion can be pressed against the vibration portion with a simple configuration in which the interposition member is interposed between the pressure contact portion and the vibration portion. Can be efficiently transmitted to the part.

  The electronic component bonding head of the present invention can be used in an electronic component bonding apparatus. In the electronic component bonding apparatus using the electronic component bonding head of the present invention, even if the pressure contact portion can be attached to and detached from the vibration amplification portion (or vibration portion), the interposition member is connected to the pressure contact portion and the vibration amplification portion ( Alternatively, the vibration of the vibration amplifying part (or the vibration part) can be efficiently transmitted to the pressure contact part with a simple configuration such as interposing between the vibration part and the vibration part.

  As described above, in the electronic component bonding head and the electronic component bonding apparatus according to the present invention, even if the pressure contact portion can be attached to and detached from the vibration amplification portion (or the vibration portion), with a simple configuration, The vibration of the vibration amplifying part (or the vibration part) can be efficiently transmitted to the pressure contact part.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

(Schematic configuration of electronic component joining device)
FIG. 1 is a plan view showing a schematic configuration of a main part of an electronic component bonding apparatus 1 according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a schematic configuration of a main part of the bonding apparatus 1 from the EE direction in FIG. 1. FIG. 3 is a diagram illustrating a schematic configuration of a main part of the bonding apparatus 1 from the FF direction in FIG. 1.

  An electronic component bonding apparatus 1 (hereinafter referred to as “bonding apparatus 1”) of this embodiment includes a terminal portion 3 (see FIG. 1) formed on a substrate 2 and an electrode portion formed on the electronic component 4. The electronic component 4 is configured to be pressed and joined to the substrate 2 while applying ultrasonic vibration to the electronic component 4 in a state where the electronic component 4 is in contact with the electronic component 4 (not shown). As shown in FIGS. 1 to 3, the bonding apparatus 1 includes a bonding mechanism unit 6 having a bonding head 5 for bonding the substrate 2 and the electronic component 4, and a conveyance mechanism unit 7 for conveying the substrate 2 in a predetermined direction. And a mounting mechanism portion 9 for mounting a plurality of semiconductor wafers 8 formed in a state where the electronic components 4 before bonding are divided into a mesh shape, and the electronic components 4 are taken out from the semiconductor wafer 8 and transferred to the bonding head 5. Positioning of the component supply mechanism 10 for supplying the component 4, the mounting table 11 on which the substrate 2 is placed when the electronic component 4 is bonded to the substrate 2, and the positioning of the terminal 3 and the electronic component 4 on the substrate 2 An imaging mechanism unit (not shown).

  In the following, the left-right direction in FIG. 1 is denoted as the X direction, the up-down direction is denoted as the Y direction, and a plane composed of the X direction and the Y direction is denoted as the XY plane. Further, the direction perpendicular to the paper surface of FIG.

  The substrate 2 in this embodiment is, for example, a COF (Chip On Film or Chip On Flexible Circuit Board) tape that is a flexible resin substrate. Moreover, the electronic component 4 in this embodiment is a small IC chip, for example. More specifically, the electronic component 4 is a small IC chip formed in a square of 5.8 mm square or less, for example. The substrate 2 may be a flexible resin substrate other than the COF tape or a substrate with high hardness such as ceramics. The electronic component 4 connected and fixed to the substrate 2 is not limited to an IC chip, and may be another electronic component such as a surface acoustic wave element or a resistance element.

  As shown in FIG. 1, the board | substrate 2 is formed in elongate shape, and the terminal part 3 is arrange | positioned by the predetermined space | interval on the surface. For joining the electronic component 4 and the substrate 2 (more specifically, joining the electrode portion of the electronic component 4 and the terminal portion 3), the substrate 2 is predetermined in the X direction (the right direction in FIG. 1 in this embodiment). It is performed in a state in which it is transported for an interval and stopped. Specifically, the conveyance and stop of the substrate 2 are repeatedly performed, and the substrate 2 and the electronic component 4 are joined one after another. The substrate 2 is divided at a predetermined position through a predetermined process after the electronic component 4 is bonded.

  The joining mechanism unit 6 is configured such that the joining head 5 can move in the height direction, the X direction, and the Y direction. Specifically, the joining mechanism unit 6 includes an elevating mechanism unit 13 (see FIG. 3) that raises and lowers the joining head 5 in the height direction, and a moving mechanism unit (shown) that moves the elevating mechanism unit 13 in the X direction and the Y direction. (Omitted). As shown in FIG. 3, the elevating mechanism unit 13 includes a motor 14, a ball screw (not shown), a linear guide (not shown), and a frame 15 to which these are fixed. The elevating mechanism unit 13 includes a head fixing unit 16 that moves up and down together with the bonding head 5. Similarly, the moving mechanism unit not shown includes a motor, a ball screw, a linear guide, and a frame to which these are fixed. In FIG. 1 and FIG. 2, the lifting mechanism unit 13 is not shown for convenience. The detailed configuration of the bonding head 5 will be described later.

  The transport mechanism unit 7 includes a transport guide 17 (see FIGS. 1 and 3) that guides both ends of the substrate 2 in the Y direction in the transport direction (X direction), and a substrate transport mechanism (not shown) that transports the substrate 2. ing. The substrate transport mechanism is engaged with engagement holes (not shown) formed on both ends of the substrate 2 in the Y direction and drives the engagement protrusions (not shown) for transporting the substrate 2 in the X direction and the engagement protrusions. Motor (not shown) and the like, and is configured to transport the substrate 2 at predetermined intervals in the X direction.

  The mounting mechanism unit 9 is configured so that the semiconductor wafer 8 can move in the X direction and the Y direction. More specifically, the mounting mechanism unit 9 includes a moving mechanism unit (not shown). The moving mechanism unit allows the semiconductor wafer 8 to move in the X direction and the Y direction.

  As shown in FIGS. 1 to 3, the component supply mechanism unit 10 includes a suction unit 18 that sucks the electronic component 4, and a moving mechanism that moves the suction unit 18 between the joining mechanism unit 6 and the mounting mechanism unit 9. Part 19 and an elevating mechanism part 20 for elevating and lowering the moving mechanism part 19 in the height direction.

  The suction portion 18 is formed with a suction hole (not shown) communicating with a suction device (not shown), and one electronic component 4 is sucked into the suction hole.

  The moving mechanism unit 19 includes a long arm 21 with the suction unit 18 fixed to the distal end side, a motor 22 that drives the arm 21, and a gear that transmits the driving force of the motor 22 to the base end side of the arm 21 ( And a frame 23 on which is omitted). As shown in FIG. 1, in the arm 21, the suction portion 18 swings about 90 ° in parallel with the XY plane between the joining mechanism portion 6 and the mounting mechanism portion 9 with the rotation axis of the motor 22 as the swing center. Is configured to do. Further, the arm 21 is configured to rotate 180 degrees around the rotation center of the arm 21 while rotating so as to turn the suction portion 18 upside down. That is, the arm 21 is configured to reverse the front and back of the electronic component 4 sucked by the suction portion 18 while rotating. A gear disposed on the frame 23 is configured so that the swinging and reversing operations of the arm 21 are performed by a single motor 22.

  The elevating mechanism unit 20 includes a motor 25, a ball screw (not shown), a linear guide (not shown), and a frame 26 to which these are fixed. Moreover, the moving mechanism fixing | fixed part 27 which goes up and down with the moving mechanism part 19 is provided.

  The imaging mechanism unit (not shown) includes a camera unit having a predetermined optical system and imaging unit, an image processing device that processes an image captured by the camera unit, and the like. Then, the bonding mechanism unit 6 finely adjusts the position of the bonding head 5 holding the electronic component 4 based on the processing result in the image processing apparatus, so that the terminal unit 3 and the electronic component 4 on the substrate 2 The position is adjusted.

(Configuration of electronic component joining head)
FIG. 4 is a partial sectional side view showing the bonding head 5 of the electronic component shown in FIG. FIG. 5 is a bottom view showing the joining head 5 of the electronic component from the GG direction of FIG. FIG. 6 is an enlarged side view showing a state when the pressure contact portion 32 is attached to the vibration amplifying portion 31 shown in FIG.

  The bonding head 5 is configured to bond the substrate 2 and the electronic component 4 by generating ultrasonic vibration. The bonding head 5 includes a vibration generating unit 30 composed of a vibrator such as a piezoelectric element serving as a generation source of ultrasonic vibrations, and a vibration amplifying unit 31 composed of a vibration horn that amplifies ultrasonic vibrations generated by the vibration generating unit 30. The vibration generating section 30 is connected to the pressure contact section 32 that presses the electronic component 4 against the substrate 2 while applying the vibration amplified by the vibration amplifying section 31 to the electronic component 4, and the vibration generating section 30 and the vibration amplifying section 31. And a vibration transmission unit 33 formed of a vibration cone for transmitting the vibration generated in (1) to the vibration amplification unit 31. Further, the joining head 5 includes a washer 34 as an interposed member interposed between a later-described head 32 a constituting the press contact portion 32 and the vibration amplifying portion 31. In this embodiment, the vibration generating unit 30 and the vibration amplifying unit 31 constitute a vibration unit.

  As shown in FIG. 4 and the like, both the vibration generating unit 30 and the vibration transmitting unit 33 are formed in a substantially rectangular parallelepiped shape, and the vibration transmitting unit 33 is fixed to the right side of the vibration generating unit 30 in the figure.

  The vibration amplifying unit 31 is made of a material such as powder high speed steel, alloy tool steel, or beryllium copper. As shown in FIGS. 4 and 5, the vibration amplifying unit 31 includes a substantially rectangular parallelepiped first vibration amplifying unit 31a fixed to the right side of the vibration transmitting unit 33 and a right side of the first vibration amplifying unit 31a. A substantially rectangular parallelepiped second vibration amplifying portion 31b extending in the right direction in the figure from the surface is configured. The first vibration amplifying unit 31a and the second vibration amplifying unit 31b are integrally formed.

  As shown in FIG. 4, the height of the first vibration amplification unit 31a is higher than the height of the second vibration amplification unit 31b. As shown in FIG. 5, the width of the first vibration amplification unit 31a in the Y direction is wider than the width of the second vibration amplification unit 31b in the Y direction. For example, the height or Y-direction width of the first vibration amplification unit 31a is 1.2 times the height or Y-direction width of the second vibration amplification unit 31b.

  A through hole 31c penetrating in the height direction is formed at a substantially central position of the first vibration amplifying portion 31a. Female threads are formed on the inner peripheral surface of the through hole 31c in the entire height direction, and the inner peripheral surface of the through hole 31c is a female thread portion 31d. Further, the upper end of the through hole 31c in FIG. 4 is connected to a suction device (not shown) including a vacuum pump or the like via a predetermined pipe.

  The press contact part 32 of this embodiment is formed of stainless steel, chrome molybdenum steel or the like that has been subjected to heat treatment. Moreover, the press-contact part 32 is a volt | bolt comprised from the head 32a and the external thread part 32b, as shown in FIG. More specifically, as shown in FIG. 5, the press contact portion 32 is a hexagonal bolt having a head portion 32 a formed in a hexagonal shape. In this embodiment, the distance H between two parallel side surfaces of the head portion 32a is, for example, 5.5 mm (see FIG. 5).

  The pressure contact portion 32 is formed with a suction hole 32 c that is a circular hole penetrating in the height direction (longitudinal direction of the pressure contact portion 32) in order to suck the electronic component 4. In addition, the lower surface of the head portion 32a in FIG. Further, as shown in FIG. 4, the suction hole 32 c communicates with a through hole 31 c connected to a suction device (not shown).

  In the present embodiment, the male screw portion 32b is screwed into the female screw portion 31d from the lower side of FIG. 4, so that the press contact portion 32 can be attached to and detached from the first vibration amplifying portion 31a. That is, the pressure contact portion 32 is detachably coupled to the first vibration amplifying portion 31a by screw coupling between the female screw portion 31d and the male screw portion 32b. As shown in FIG. 4, the coupling length L between the female screw portion 31d and the male screw portion 32b is, for example, 8 mm.

  The washer 34 is formed of a metal material whose hardness is lower than that of the press contact portion 32. More specifically, the washer 34 is made of brass, for example. The washer 34 is formed in a thin flat ring shape. The thickness of the washer 34 is, for example, 0.1 mm to 0.5 mm. Then, as shown in FIG. 6, the female screw portion 31 d and the male screw portion 32 b are screw-coupled in a state where the male screw portion 32 b of the press contact portion 32 is inserted into the inner peripheral side of the washer 34. The washer 34 is deformed (plastic deformation and / or elastic deformation) when the female screw portion 31d and the male screw portion 32b are coupled to each other, and is in close contact with the lower surface of the first vibration amplifying portion 31a and the upper surface of the press contact portion 32. .

  The diameter of the washer 34 may be smaller than the outer shape of the head portion 32a as shown in FIG. 4, or may be larger than the outer shape of the head portion 32a as shown in FIG. Further, the diameter of the washer 34 may be the same as the outer shape of the head portion 32a.

(Schematic operation of electronic device joining device)
The joining apparatus 1 configured as described above joins the substrate 2 and the electronic component 4 as follows.

  First, the component supply mechanism unit 10 takes out one electronic component 4 from the semiconductor wafer 8 on which a plurality of electronic components 4 in a state of being divided into a mesh are formed, and supplies the taken electronic component 4 to the bonding head 5. . More specifically, first, the suction unit 18 lowered to the top of the semiconductor wafer 8 by the elevating mechanism unit 20 sucks one electronic component 4. Thereafter, the suction unit 18 is lifted by the elevating mechanism unit 20, and is turned upside down by the moving mechanism unit 19 while rotating in parallel with the XY plane, and moves to the lower side of the bonding head 5. In this state, the suction unit 18 is further raised by the lifting mechanism unit 20, and the suction surface 32 d of the press contact part 32 sucks the electronic component 4, so that the joining head 5 receives the electronic component 4 from the suction unit 18 and sucks it. The electronic component 4 is held on the surface 32d.

  On the other hand, the transport mechanism unit 7 transports the substrate 2 to a predetermined position. That is, the transport mechanism unit 7 is arranged so that the position of the electrode part (not shown) of the electronic component 4 sucked and held on the suction surface 32d of the bonding head 5 and the terminal part 3 on the substrate 2 substantially coincide with each other. 2 is transported. In this state, the imaging mechanism unit performs shooting and image processing. Based on the imaging result of the imaging mechanism unit, the joining mechanism unit 6 finely adjusts the position of the electronic component 4 to position the electrode unit (not shown) of the electronic component 4 and the terminal unit 3 on the substrate 2. Match.

  When the alignment between the electronic component 4 and the terminal unit 3 is completed, the camera unit constituting the imaging mechanism unit is retracted. Thereafter, the joining head 5 is lowered by the elevating mechanism 13 and the electronic component 4 held by the suction surface 32d is pressed against the terminal portion 3 while being pressed (pressing), and ultrasonic vibration is applied to the electronic component 4. Then, the substrate 2 and the electronic component 4 are joined. At the time of this joining, for example, ultrasonic vibration having a frequency of 10 kHz to 60 kHz is applied to the electronic component 4. At the time of bonding the substrate 2 and the electronic component 4, the substrate 2 is mounted on the mounting table 11, and the mounting table 11 receives the pressure of the bonding head 5.

  When the joining of the substrate 2 and the electronic component 4 is completed, the joining head 5 is raised, and the transport mechanism unit 7 transports the substrate 2 by a predetermined interval. Further, the component supply mechanism section 10 supplies the next electronic component 4 to the bonding head 5, and the bonding mechanism section 6 bonds the substrate 2 and the next electronic component 4 in the same manner as described above. Before the component supply mechanism unit 10 takes out the next electronic component 4 from the semiconductor wafer 8, the mounting mechanism unit 9 moves the semiconductor wafer 8 in the X direction and / or the Y direction, and the suction unit 18 moves to the next. The electronic component 4 can be sucked.

(Main effects of this form)
As described above, the joining apparatus 1 of the present embodiment includes the male screw portion 32b and the female screw portion 31d that detachably couple the press-contact portion 32 to the first vibration amplifying portion 31a. That is, in the joining apparatus 1 of this embodiment, the press contact portion 32 is configured to be detachable from the first vibration amplifying portion 31a by screw connection between the male screw portion 32b and the female screw portion 31d. For this reason, the pressure contact portion 32 can be easily attached to and detached from the vibration amplification portion 31.

  Moreover, in the joining apparatus 1 of this form, it forms with the metal member whose hardness is lower than the press-contact part 32, and between the press-contact part 32 and the vibration amplification part 31 (more specifically, the lower surface of the 1st vibration amplification part 31a and The washer 34 interposed between the press contact portion 32 and the upper surface of the press contact portion 32 is deformed when the female screw portion 31d and the male screw portion 32b are coupled to each other, and is brought into close contact with the upper surface of the press contact portion 32 and the lower surface of the first vibration amplifying portion 31a. Yes. For this reason, the press contact portion 32 and the first vibration amplifying portion 31a can be brought into intimate contact with each other by the washer 34 in close contact with the press contact portion 32 and the first vibration amplifying portion 31a. Therefore, it is possible to suppress the occurrence of the natural vibration of the pressure contact portion 32 during the vibration of the first vibration amplification portion 31a, and to efficiently transmit the vibration of the first vibration amplification portion 31a to the pressure contact portion 32. That is, in the joining apparatus 1 of this embodiment, the washer 34 is interposed between the press contact portion 32 and the first vibration amplifying portion 31a, and the vibration of the first vibration amplifying portion 31a is efficiently transmitted to the press contact portion 32. Can communicate.

  In addition, if a material with small rigidity such as plastic is used as the material of the washer 34, the pressure contact portion 32 is inherently vibrated. In this embodiment, since a metal material is used as the material of the washer 34, such inherent vibration of the press contact portion 32 can be suppressed.

  Furthermore, in this embodiment, a washer 34 interposed between the press contact portion 32 and the vibration amplification portion 31 is in close contact with the upper surface of the press contact portion 32 and the lower surface of the first vibration amplification portion 31a. Therefore, it is possible to reduce air leakage when the bonding head 5 sucks the electronic component 4 with the suction surface 32d.

  In this embodiment, the washer 34 is formed in a flat plate shape and has a thickness of 0.1 to 0.5 mm. Therefore, the vibration of the first vibration amplifying part 31a can be transmitted to the press contact part 32 efficiently and appropriately. Hereinafter, the effect of the present embodiment that the vibration of the first vibration amplifying part 31a can be efficiently and appropriately transmitted to the pressure contact part 32 will be described in more detail with reference to FIG.

  FIG. 7 is a table summarizing the relationship between the amplitude at the suction surface 32d of the pressure contact portion 32 and the thickness of the interposed member (washer 34) when vibration is generated by the vibration generating portion 30. In addition, the lateral vibration in FIG. 7 refers to the vibration in the X direction of the suction surface 32d, and the vertical vibration in FIG. 7 refers to the vibration in the height direction of the suction surface 32d. Further, the larger the value of the lateral vibration, the more efficiently the vibration of the vibration amplifying unit 31 is transmitted to the press contact part 32. The smaller the value of the longitudinal vibration, the more appropriately the vibration of the vibration amplifying part 31 is transmitted. 32 is transmitted. In addition, when the value of longitudinal vibration becomes large, the electronic component 4 may be destroyed.

  The vibration generator 30 vibrates the vibration, and measures the amplitudes of the longitudinal vibration and the transverse vibration in the first vibration amplifying part 31a, and the amplitudes of the longitudinal vibration and the transverse vibration in the suction surface 32d of the press contact part 32. did. At this time, the amplitude of the longitudinal vibration of the first vibration amplifying unit 31a (specifically, the lower end side of the first vibration amplifying unit 31a) was 0.25 μm, and the amplitude of the lateral vibration was 3.6 μm. On the other hand, when the thickness of the washer 34 is 0.1 mm, 0.2 mm, or 0.3 mm, the amplitude of the longitudinal vibration on the suction surface 32d is 0.25 μm, and the amplitude of the lateral vibration is all. It was 3.4 μm. Further, when the thickness of the washer 34 was 0.5 mm, the amplitude of the longitudinal vibration on the suction surface 32d was 0.5 μm, and the amplitude of the lateral vibration was 3.1 μm. For reference, when the thickness of the washer 34 is 1.0 mm, the amplitude of the longitudinal vibration on the suction surface 32d is 1.0 μm, and the amplitude of the lateral vibration is 2.8 μm. The amplitude when the thickness of the washer 34 is set to 0.01 mm, for example, is not measured. From this measurement result, the amplitude is 0.25 μm in the longitudinal vibration, and the amplitude of the lateral vibration is close to 3.6 μm. Value. In this case, it is considered possible to improve the adhesion between the pressure contact portion 32 and the first vibration amplification portion 31a.

  As described above, when the washer 34 has a thickness of 0.5 mm or less, the vibration of the first vibration amplifying part 31a can be efficiently and appropriately transmitted to the press contact part 32. Further, when the thickness of the washer 34 is 0.3 mm or less, the vibration of the first vibration amplifying part 31a can be transmitted to the press contact part 32 more appropriately and more appropriately.

  In this embodiment, the press contact portion 32 is a bolt including a head portion 32a and a male screw portion 32b. Therefore, the structure of the press-contact part 32 can be simplified. In particular, in this embodiment, since the head portion 32a is formed in a hexagonal shape, the male screw portion 32b and the female screw portion 31d can be easily screwed together. Moreover, since the hexagon bolt is a versatile bolt, the cost of the joining head 5 can be reduced by configuring the press contact portion 32 with the hexagon bolt.

(Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the scope of the present invention. For example, in the form mentioned above, the internal peripheral surface of the through-hole 31c formed in the 1st vibration amplification part 31a is the internal thread part 31d. In addition, for example, as shown in FIG. 8, a nut 41 is disposed on the upper surface side of the first vibration amplifying portion 31a without forming a female screw on the inner peripheral surface of the through hole 31c, and is inserted into the through hole 31c. The pressure contact portion 32 is detachably coupled to the first vibration amplifying portion 31a by screw coupling between the distal end side portion of the male screw portion 32b of the pressure contact portion 32 and the female screw portion 41d formed on the inner peripheral surface of the nut 41. May be.

  Moreover, in the form mentioned above, although the press-contact part 32 is a hexagon bolt, as shown in FIG. 9, you may comprise the press-contact part 42 with a hexagon nut, for example. On the inner peripheral side of the press contact portion 42, a female screw is formed on the wall surface of the recess formed at a predetermined depth from the upper end of FIG. 9, and the portion where the female screw is formed is a female screw portion 42d. Further, the pressure contact portion 42 is formed with a suction hole 42c that communicates from the lower end of FIG. In this case, the bolt 43 having the head 43a and the male screw 43b as well as the hexagonal bolt constituting the press contact portion 32 in the above-described form and having the suction hole 43c formed thereon is connected to the upper surface of the first vibration amplifying unit 31a. The pressure contact portion 42 is inserted into the through-hole 31c where no female screw is formed from the side, and the pressure contact portion 42 is connected to the first vibration amplifying portion 31a by screw coupling between the tip side portion of the male screw portion 43b of the bolt 43 and the female screw portion 42d of the pressure contact portion 42. It suffices to detachably connect to.

  Further, as shown in FIG. 10, a male screw part 31e is formed so as to protrude downward from the lower surface of the first vibration amplifying part 31a, and the screw coupling between the female screw part 42d and the male screw part 31e of the pressure contact part 42 described above. Accordingly, the pressure contact portion 42 may be detachably coupled to the first vibration amplifying portion 31a. In this case, as shown in FIG. 10, in order to suck the electronic component 4 on the suction surface 42c, a suction hole 31f penetrating in the height direction may be formed in the first vibration amplifying part 31a and the male screw part 31e.

  Furthermore, the shape of the vibration amplifying unit 31 is not limited to the shape described in the above-described embodiment, and may be, for example, a shape as shown in FIG. That is, the vibration amplifying unit includes the first vibration amplifying unit 31a described above, and two substantially rectangular parallelepiped second vibration amplifying units 51b and 51b extending from both side surfaces in the X direction of the first vibration amplifying unit 31a to the outside in the X direction. May be a vibration amplifying part 51 formed integrally.

  Moreover, with the form mentioned above, the head part 32a of the press-contact part 32 is formed in the hexagon. In addition, for example, the head of the press contact part 32 may be an octagonal head 52a as shown in FIG. A circular suction hole 52c for sucking the electronic component 4 is formed in the head 52a so as to penetrate to the suction surface 52d. Furthermore, the head of the press contact part 32 may be formed in a polygon other than a hexagon or an octagon. Furthermore, as shown in FIG. 12B, the head portion of the pressure contact portion 32 has a shape having two parallel torque transmission surfaces 62b and 62b formed by cutting out a flat cylinder by two parallel surfaces. The head 62a may be used. A circular suction hole 62c for sucking the electronic component 4 is formed in the head 62a so as to penetrate to the suction surface 62d. Similarly, the shape of the press contact portion 42 shown in FIGS. 9 and 10 may be an octagon or other polygons, or may be a shape shown in FIG. Further, the cross-sectional shape of the suction hole may not be circular, but may be a polygon such as a triangle or a square diameter.

  Furthermore, in the embodiment described above, the washer 34 is formed of a metal material having a hardness lower than that of the press contact portion 32. In addition, for example, the washer 34 may be formed of a metal material having a hardness equivalent to the hardness of the press contact portion 32. Further, the hardness of the vibration amplifying unit 31 may be equal to or higher than the hardness of the washer 34, or may be equal to or lower than the hardness of the washer 34. When the hardness of the vibration amplifying unit 31 is higher than the hardness of the washer 34, it is possible to prevent the vibration amplifying unit 31 from being damaged when the male screw portion 32b and the female screw portion 31d are coupled to each other.

  Furthermore, the configuration of the present invention can also be applied to a joining head that does not have the vibration amplifying unit 31 and in which the press contact portion 32 is detachably attached to the vibration generating unit 30.

It is a top view which shows schematic structure of the principal part of the joining apparatus of the electronic component concerning embodiment of this invention. It is a figure which shows schematic structure of the principal part of a joining apparatus from the EE direction of FIG. It is a figure which shows schematic structure of the principal part of a joining apparatus from the FF direction of FIG. FIG. 2 is a partial cross-sectional side view showing a joining head of the electronic component shown in FIG. 1. It is a bottom view which shows the joining head of an electronic component from the GG direction of FIG. It is an enlarged side view which shows the state at the time of attachment of the press-contact part to the vibration amplification part shown in FIG. It is the table | surface which put together the relationship between the amplitude in the adsorption | suction surface of a press-contact part when a vibration was generated in the vibration generation part of the joining apparatus shown in FIG. 1, and the thickness of an interposed member (washer). It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a fragmentary sectional side view which shows the joining head concerning other embodiment of this invention. It is a top view which shows the other shape of the head of the press-contact part in the joining head used with the joining apparatus shown in FIG.

Explanation of symbols

1 Joining device (Electronic component joining device)
2 Substrate 4 Electronic component 5 Bonding head (Electronic component bonding head)
30 Vibration generation part (part of vibration part)
31, 51 Vibration amplification part (part of vibration part)
31d, 41d, 42d Female thread portion 32, 42 Pressure contact portion 32a, 52a Head portion 32b, 43b, 31e Male thread portion 34 Washer (intervening member)

Claims (7)

A vibration generating unit that generates a predetermined vibration, a vibration amplifying unit that amplifies the vibration generated by the vibration generating unit, and press-contacting the electronic component against the substrate while applying the vibration amplified by the vibration amplifying unit to the electronic component An electronic component joining head for joining the substrate and the electronic component.
An interposition member formed of a metal member having a hardness lower than that of the pressure contact portion and interposed between the pressure contact portion and the vibration amplification portion, and a male screw portion and a female screw that detachably couple the pressure contact portion to the vibration amplification portion. With
The electronic component joining head, wherein the interposition member is deformed when the male screw portion and the female screw portion are coupled to each other, and is in close contact with the pressure contact portion and the vibration amplifying portion.   2. The joining head for an electronic component according to claim 1, wherein the interposition member is formed in a flat plate shape and has a thickness of 0.5 mm or less.   3. The joining head for an electronic component according to claim 2, wherein the thickness of the interposition member is 0.3 mm or less.   The said press-contact part is comprised with the volt | bolt with which the male screw part was formed while providing the head at one end, or the nut with which the said female screw part was formed, The Claim 1 characterized by the above-mentioned. Bonding head for electronic components.   The head of the said bolt or the said nut is formed in the polygon, The joining head of the electronic component of Claim 4 characterized by the above-mentioned. A vibration part, and a pressure contact part to which vibration of the vibration part is transmitted,
In an electronic component joining head for joining the substrate and the electronic component by press-contacting the electronic component to a substrate while applying vibration of the pressure contact portion to the electronic component
It is formed of a metal member having a hardness equal to or lower than the hardness of the pressure contact portion, and includes an interposition member interposed between the pressure contact portion and the vibration portion,
The vibration part and the pressure contact part are configured to be detachable,
The electronic component joining head, wherein the interposition member is deformed when the pressure contact portion is attached to the vibration portion, and is in close contact with the pressure contact portion and the vibration portion.   An electronic component bonding apparatus comprising the electronic component bonding head according to claim 1.

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