JP2007070492A5 - - Google Patents
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- JP2007070492A5 JP2007070492A5 JP2005259851A JP2005259851A JP2007070492A5 JP 2007070492 A5 JP2007070492 A5 JP 2007070492A5 JP 2005259851 A JP2005259851 A JP 2005259851A JP 2005259851 A JP2005259851 A JP 2005259851A JP 2007070492 A5 JP2007070492 A5 JP 2007070492A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive grease
- thermally conductive
- coarse particles
- mixed powder
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (11)
前記無機粉末は、平均粒径が５〜１７μｍである粗粒を４０〜９０ｗｔ％と、平均粒径が前記粗粒の１/３〜１/４０である微粒を１０〜６０ｗｔ％と、を組み合わせた混合粉末を用い、
前記混合粉末を４０〜９０容量％に対して、界面活性剤を０．２〜２．０ｗｔ％添加して、前記基油を１０〜６０容量％混合して構成され、
前記混合粉末の粗粒と微粒は、それぞれ、粒子形状として多面体形状を有することを特徴とする熱伝導性グリース。 A thermally conductive grease comprising an inorganic powder and a base oil containing mineral oil or synthetic oil,
The inorganic powder is a combination of 40 to 90 wt% of coarse particles having an average particle diameter of 5 to 17 μm and 10 to 60 wt% of fine particles having an average particle diameter of 1/3 to 1/40 of the coarse particles. Used mixed powder,
The mixed powder is composed of 40 to 90% by volume, a surfactant is added by 0.2 to 2.0% by weight, and the base oil is mixed by 10 to 60% by volume,
The heat conductive grease characterized in that the coarse particles and fine particles of the mixed powder each have a polyhedral shape as a particle shape.
前記無機粉末は、酸化亜鉛、酸化マグネシウム、酸化チタン、窒化アルミニウム、酸化アルミニウム、窒化ホウ素から選択された少なくとも１種以上からなることを特徴とする熱伝導性グリース。 In the heat conductive grease of Claim 1,
The thermally conductive grease is characterized in that the inorganic powder comprises at least one selected from zinc oxide, magnesium oxide, titanium oxide, aluminum nitride, aluminum oxide, and boron nitride.
前記無機粉末は、規律性のある多面体形状を持つことを特徴とする熱伝導性グリース。 In the heat conductive grease of Claim 1,
The inorganic powder is a thermally conductive grease characterized by having a regular polyhedral shape.
前記界面活性剤は、ＨＬＢが９以下の非イオン系界面剤から選択された少なくとも１種以上からなることを特徴とする熱伝導性グリース。 In the heat conductive grease of Claim 1,
The surfactant comprises at least one selected from nonionic surfactants having an HLB of 9 or less.
前記基油は、鉱油、ポリオレフィン、ジエステル、ポリオールエステル、トリメリット酸エステル、ポリフェニルエーテル、アルキルフェニルエーテルから選択された少なくとも１種以上からなることを特徴とする熱伝導性グリース。 In the heat conductive grease of Claim 1,
The base oil comprises at least one selected from mineral oil, polyolefin, diester, polyol ester, trimellitic acid ester, polyphenyl ether, and alkylphenyl ether.
ちょう度が２００〜４００であることを特徴とする熱伝導性グリース。 In the heat conductive grease of Claim 1,
A thermally conductive grease having a consistency of 200 to 400.
機器に装着された電気・電子部品と、その部品の表面の近くに設置される冷却体とを備えた冷却装置であって、
前記電気・電子部品の発熱体表面と前記冷却体との間に、前記熱伝導性グリースを介在させたことを特徴とする冷却装置。 Using the thermally conductive grease according to any one of claims 1 to 6,
A cooling device comprising an electrical / electronic component mounted on a device and a cooling body installed near the surface of the component,
A cooling device, wherein the heat conductive grease is interposed between a surface of a heating element of the electric / electronic component and the cooling body.
前記無機粉末は、平均粒径が５〜１７μｍの粗粒を４０〜９０ｗｔ％と、平均粒径が前記粗粒の１/３〜１/４０である微粒を１０〜６０ｗｔ％と、を組み合わせた混合粉末を用い、
前記混合粉末４０〜９０容量％に対して、界面活性剤を０．２〜２．０ｗｔ％添加して、前記樹脂を１０〜６０容量％混合して構成され、
前記混合粉末の粗粒と微粒のそれぞれは、粒子形状として多面体形状を含むことを特徴とする熱伝導性接着剤。 A thermally conductive adhesive comprising inorganic powder and resin,
The inorganic powder is a combination of 40 to 90 wt% coarse particles having an average particle size of 5 to 17 μm and 10 to 60 wt% fine particles having an average particle size of 1/3 to 1/40 of the coarse particles. Using mixed powder,
Surfactant is added to 0.2 to 2.0 wt% of the mixed powder 40 to 90 vol%, and the resin is mixed with 10 to 60 vol%,
Each of the coarse particles and the fine particles of the mixed powder includes a polyhedral shape as a particle shape.
前記樹脂は、エポキシ、フェノール、シリコン、ポリスチレン、フッ素樹脂から選択された、少なくとも１種以上からなることを特徴とする熱伝導性接着剤。 The thermally conductive adhesive according to claim 8 ,
The resin is made of at least one selected from epoxy, phenol, silicon, polystyrene, and fluororesin, and a heat conductive adhesive.
前記無機粉末は、平均粒径が５〜１７μｍの粗粒を４０〜９０ｗｔ％と、平均粒径が前記粗粒の１/３〜１/４０である微粒を１０〜６０ｗｔ％と、を組み合わせた混合粉末を用い、
前記混合粉末を４０〜９０容量％に対して、界面活性剤を０．２〜２．０ｗｔ％添加して、前記樹脂を１０〜６０容量％混合して構成され、
前記混合粉末の粗粒と微粒のそれぞれは、粒子形状として多面体形状を含むことを特徴とする熱伝導性エラストマー組成物。 A thermally conductive elastomer composition comprising an inorganic powder and a resin,
The inorganic powder is a combination of 40 to 90 wt% coarse particles having an average particle size of 5 to 17 μm and 10 to 60 wt% fine particles having an average particle size of 1/3 to 1/40 of the coarse particles. Using mixed powder,
The mixed powder is composed of 40 to 90% by volume, a surfactant is added by 0.2 to 2.0% by weight, and the resin is mixed by 10 to 60% by volume,
Each of the coarse particles and the fine particles of the mixed powder includes a polyhedral shape as a particle shape.
前記樹脂は、エポキシ、フェノール、シリコン、ポリスチレン、フッ素樹脂から選択された、少なくとも１種以上からなることを特徴とする熱伝導性エラストマー組成物。 The thermally conductive elastomer composition according to claim 10 ,
The resin is composed of at least one selected from epoxy, phenol, silicon, polystyrene, and fluororesin, and a thermally conductive elastomer composition.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005259851A JP2007070492A (en) | 2005-09-07 | 2005-09-07 | Heat conductive grease, adhesive and elastomer composition, and cooling device |
| TW095120258A TW200712190A (en) | 2005-09-07 | 2006-06-07 | Thermal conductive adhesive and elastics composition and a cooling device |
| CN2006101056175A CN1928039B (en) | 2005-09-07 | 2006-07-17 | Heat-conductive lubricating grease, adhesive, elastic composition, and cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005259851A JP2007070492A (en) | 2005-09-07 | 2005-09-07 | Heat conductive grease, adhesive and elastomer composition, and cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007070492A JP2007070492A (en) | 2007-03-22 |
| JP2007070492A5 true JP2007070492A5 (en) | 2007-11-01 |
Family
ID=37858173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005259851A Pending JP2007070492A (en) | 2005-09-07 | 2005-09-07 | Heat conductive grease, adhesive and elastomer composition, and cooling device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007070492A (en) |
| CN (1) | CN1928039B (en) |
| TW (1) | TW200712190A (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5269366B2 (en) * | 2007-08-22 | 2013-08-21 | コスモ石油ルブリカンツ株式会社 | Heat-resistant thermal grease |
| US8435485B2 (en) * | 2008-10-28 | 2013-05-07 | Sakai Chemical Industry Co., Ltd. | Method for producing zinc oxide using ammonium bromide, exoergic filler, resin composition, exoergic grease and exoergic coating composition comprising the zinc oxide |
| US8546476B2 (en) | 2009-07-14 | 2013-10-01 | Sakai Chemical Industry Co., Ltd. | Exoergic filler composition, resin composition, exoergic grease and exoergic coating composition |
| JP2011021069A (en) | 2009-07-14 | 2011-02-03 | Sakai Chem Ind Co Ltd | Heat-radiating filler composition, resin composition, heat-radiating grease and heat-radiating coating composition |
| US8399092B2 (en) | 2009-10-07 | 2013-03-19 | Sakai Chemical Industry Co., Ltd. | Zinc oxide particle having high bulk density, method for producing it, exoergic filler, exoergic resin composition, exoergic grease and exoergic coating composition |
| CA2741218C (en) | 2009-10-07 | 2014-01-28 | Sakai Chemical Industry Co., Ltd. | Zinc oxide particle, method for producing it, exoergic filler, exoergic resin composition, exoergic grease and exoergic coating composition |
| JP2011179468A (en) * | 2010-03-03 | 2011-09-15 | Dow Corning Toray Co Ltd | Dispenser for high viscosity fluid |
| JP2012102301A (en) * | 2010-11-13 | 2012-05-31 | Nitto Denko Corp | Bubble-containing thermally conductive resin composition layer, method for manufacturing the same, and pressure-sensitive adhesive tape or sheet using the same |
| JP5781407B2 (en) * | 2011-09-05 | 2015-09-24 | コスモ石油ルブリカンツ株式会社 | Thermally conductive compound |
| JP2015216216A (en) * | 2014-05-09 | 2015-12-03 | 凸版印刷株式会社 | Sealant for solar batteries, and solar battery module |
| MX2017002779A (en) | 2014-09-22 | 2017-05-30 | Dow Global Technologies Llc | Thermal grease based on hyperbranched olefinic fluid. |
| JP6580949B2 (en) * | 2015-11-06 | 2019-09-25 | 株式会社トクヤマ | Composite filler and resin composition containing the same |
| JP6654637B2 (en) * | 2015-12-14 | 2020-02-26 | アルテコ エヌヴィ | Stabilization of hexagonal boron nitride nanoparticles |
| US11327034B2 (en) | 2016-12-13 | 2022-05-10 | Toyota Jidosha Kabushiki Kaisha | Measurement device for estimating thermal characteristics, and measurement method for estimating thermal characteristics by using same |
| JP6811670B2 (en) * | 2017-03-31 | 2021-01-13 | 太平洋セメント株式会社 | Magnesium oxide powder and composites |
| CN107760428A (en) * | 2017-11-20 | 2018-03-06 | 合肥鑫伟电力设备有限公司 | A kind of Heat sink grease of transformation cabinet |
| CN109913297A (en) * | 2019-03-06 | 2019-06-21 | 江苏龙蟠科技股份有限公司 | A kind of heat transfer lubricating grease and preparation method thereof |
| WO2023238797A1 (en) * | 2022-06-08 | 2023-12-14 | Ａｇｃ株式会社 | Composition |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252572A (en) * | 1993-02-23 | 1994-09-09 | Toshiba Corp | Radiator |
| JP3572692B2 (en) * | 1994-12-20 | 2004-10-06 | 住友化学工業株式会社 | α-Alumina powder-containing resin composition and rubber composition |
| JP2938428B1 (en) * | 1998-02-27 | 1999-08-23 | 信越化学工業株式会社 | Thermal conductive grease composition |
| JP3474839B2 (en) * | 1999-09-01 | 2003-12-08 | 北川工業株式会社 | Thermal conductive sheet and manufacturing method thereof |
| JP2002080726A (en) * | 2000-09-07 | 2002-03-19 | Aisin Seiki Co Ltd | Resin composition for sealing |
| JP3911554B2 (en) * | 2000-12-13 | 2007-05-09 | 独立行政法人産業技術総合研究所 | Spherical aluminum nitride filler and method for producing the same |
| JP4603700B2 (en) * | 2001-01-04 | 2010-12-22 | 株式会社日立製作所 | High thermal conductive grease composition and cooling device using the same |
| JP4796704B2 (en) * | 2001-03-30 | 2011-10-19 | 株式会社タイカ | Manufacturing method of containers filled and sealed with extrudable grease-like heat dissipation material |
-
2005
- 2005-09-07 JP JP2005259851A patent/JP2007070492A/en active Pending
-
2006
- 2006-06-07 TW TW095120258A patent/TW200712190A/en not_active IP Right Cessation
- 2006-07-17 CN CN2006101056175A patent/CN1928039B/en not_active Expired - Fee Related
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