JP2007063582A - Film-forming method and film-forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film-forming apparatus which forms a compact film consisting of particles that are mutually combined through a mechanochemical reaction with an AD method, by removing particles that have not contributed to the formation of the film, and has a simple structure. <P>SOLUTION: This film-forming apparatus comprises: an aerosol-forming section for forming an aerosol by dispersing a raw powder in a gas; a film-forming chamber 8 for arranging a substrate therein; a spray nozzle 9 which is arranged in the film-forming chamber and spouts a supplied fluid toward the substrate therethrough; a supply passage for supplying the aerosol formed in the aerosol-forming section, to the spray nozzle; a valve 6 for opening/closing the supply passage; and a gas supply section 7 for supplying a gas to be spouted through the spray nozzle. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a film forming method and a film forming apparatus using an aerosol deposition method in which raw material powder is sprayed onto a substrate to deposit the raw material powder on the substrate.

  In recent years, in the field of micro electrical mechanical systems (MEMS), electrons that exhibit a predetermined function by applying voltage, such as dielectrics, piezoelectrics, magnetics, pyroelectrics, and semiconductors. Research for manufacturing elements including functional materials such as ceramics by using a film forming technique is actively underway.

  For example, in order to enable high-definition and high-quality printing in an inkjet printer, it is necessary to make the ink nozzles of the inkjet head fine and highly integrated. Therefore, miniaturization and high integration are also required for the piezoelectric actuator that drives each ink nozzle. In such a case, a film forming technique capable of forming a layer thinner than the bulk material and capable of forming a fine pattern is advantageous.

  Recently, an aerosol deposition method (hereinafter referred to as “AD method”), which is known as a film forming technique for ceramics and metals, has been attracting attention. The AD method is a film forming method in which a raw material powder (raw material powder) is made into an aerosol state and sprayed from a nozzle toward the substrate to deposit the raw material on the substrate. Here, the aerosol refers to solid or liquid fine particles suspended in a gas. The AD method is also called a jet deposition method or a gas deposition method.

  In the AD method, a raw material powder is crushed by colliding with a substrate or a structure formed earlier, and a film is formed by a mechanism in which fine particles of the raw material powder are bonded to each other on an active new surface generated at that time. . This film forming mechanism is called mechanochemical reaction. According to the AD method, since a dense and strong film can be formed, it is expected to improve the performance of a device to which various functional films are applied.

  As a related technique, Patent Document 1 discloses an ultrafine particle material in order to produce a film with sufficient bonding of the ultrafine particle material in the film, a fine structure, a smooth surface, and a uniform density. An ultrafine particle material spraying film forming method for forming an ultrafine particle material film by a deposited film formed by spraying on a substrate surface, wherein at least a part of the flow of the ultrafine particle material spray is oblique to the substrate surface An incident film forming method is disclosed.

Further, in Patent Document 2, in the aerosol deposition method, fine particles of a brittle material are introduced into a gas in order to prevent the occurrence of defects due to the aggregated powder adhering to the substrate or the structure on the substrate during the structure preparation. The dispersed aerosol is sprayed from the nozzle toward the base material, the aerosol is made to collide with the substrate surface, the fine particles are crushed and deformed by the impact of the collision, and the structure made of the constituent material of the fine particles is made the base material In the composite structure manufacturing apparatus to be formed on top, a composite structure manufacturing apparatus having an air blow function is disclosed in order to remove the substrate that has not contributed to the structure formation and the aggregated powder adhering to the structure on the substrate. ing.
Japanese Patent Application Laid-Open No. 2002-20878 (first page) JP 2005-76104 A (first page)

  In such an AD method, it is desirable that the particle size of the raw material powder be as uniform as possible. The reason is that the kinetic energy of the injected aerosol particles is used as the collision energy of the aerosol particles, and this kinetic energy depends on the mass of the raw material powder. Therefore, for example, when the raw material powder contains particles with a small particle size, the green compact without causing a mechanochemical reaction by colliding with the substrate or the like particles that do not have sufficient kinetic energy. In this state, it is taken into the film. This causes a problem that the density of the film is lowered. In addition, when such a film is annealed, the portion of the green compact becomes pores (pores or voids). For example, when the film is used as a piezoelectric body, dielectric breakdown starting from the pores Is likely to occur.

  However, it is extremely difficult to make the particle size of the raw material powder completely uniform. Therefore, in order to solve such a problem, in Patent Document 1, the spray angle of the nozzle is changed and aerosol is sprayed on the film, or particles having high hardness or large particle diameter are used as pulverization particles. The film is flattened by removing particles that have not contributed to the film formation or by pressing the formed film. However, the apparatus disclosed in Patent Document 1 is complicated and there is a possibility that foreign matter may be mixed into the formed film.

  Moreover, in patent document 2, the particle | grains which did not contribute to film-forming are removed by using an air blow apparatus. However, the configuration of the apparatus disclosed in Patent Document 2 is also complicated, and the airflow of the aerosol is disturbed by the air blow, which may prevent stable film formation.

  Accordingly, in view of the above points, the present invention can form a dense film in which particles are bonded to each other by a mechanochemical reaction by removing particles that have not contributed to film formation in the AD method. It is a first object to provide a method. A second object of the present invention is to provide a film forming apparatus having a simple apparatus configuration in order to implement such a film forming method.

  In order to solve the above-described problem, a film forming method according to one aspect of the present invention includes a deposition method using an aerosol deposition method in which a raw material powder is sprayed on a substrate to deposit the raw material powder on the substrate to form a film. A film method, in which an aerosol is generated by dispersing raw material powder with a gas (a), and the aerosol generated in the step (a) is sprayed from a spray nozzle, and is disposed in a film forming chamber After the step (b) of forming a film on the substrate by spraying on the substrate, the supply of the raw material powder to the injection nozzle is shut off after the step (b), and the gas is supplied to the injection nozzle, and the step (b) And (c) spraying the gas onto the film formed on the substrate by injecting the gas at a speed higher than the aerosol injection speed.

  A film forming apparatus according to one aspect of the present invention is a film forming apparatus using an aerosol deposition method in which a raw material powder is sprayed on a substrate to deposit the raw material powder on the substrate to form a film. , An aerosol generating means for generating an aerosol by dispersing raw material powder with a gas, a film forming chamber in which a substrate is disposed, and an injection nozzle that is disposed in the film forming chamber and injects the supplied fluid toward the substrate And a supply path for supplying the aerosol generated by the aerosol generation means to the injection nozzle, a valve for opening and closing the supply path, and a gas supply means for supplying a gas for injection from the injection nozzle.

  According to the present invention, after the film forming process, particles that did not contribute to film formation can be removed by spraying a gas containing almost no particles such as raw material powder on the film, which affects the spraying of the aerosol. In addition, a stable film can be formed without any problem, and a dense film without the possibility of foreign matters being mixed can be easily produced. Further, according to the present invention, the supply of aerosol to the injection nozzle is shut off, and the gas is supplied to the injection nozzle for injection, so that the aerosol spray and the gas spray are sequentially performed with a simple apparatus configuration. Is possible.

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. The same constituent elements are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 1 is a schematic diagram showing a configuration of a film forming apparatus according to the first embodiment of the present invention. As shown in FIG. 1, the film forming apparatus according to the present embodiment includes an aerosol generation chamber 1, a vibration table 2, a hoisting gas nozzle 3, and an pressure generating gas nozzle 4, and gas supply adjusting units 3 a and 4 a. A film including an aerosol transport pipe 5, a valve 6 provided in the aerosol transport pipe 5, a gas supply unit 7 and a gas supply control unit 7 a, a film formation chamber 8, an injection nozzle 9, and a substrate stage 10. Part, exhaust pipe 11, vacuum valve 12, and control unit 13. The control unit 13 controls the operation of each unit of the film forming apparatus according to this embodiment.

The aerosol generation chamber 1 is a container in which the raw material powder 20 is disposed, and aerosol is generated here. The aerosol generation chamber 1 is installed on a vibration table 2 that vibrates at a predetermined frequency in order to stir the raw material powder 20.
The winding gas nozzle 3 generates a cyclone flow by introducing a carrier gas supplied from an external gas cylinder into the aerosol generation chamber 1. Thereby, the raw material powder 20 arrange | positioned in the aerosol production | generation chamber 1 is wound up and disperse | distributed, and an aerosol is produced | generated.

On the other hand, the pressure adjusting gas nozzle 4 adjusts the gas pressure in the aerosol generating chamber 1 by introducing a carrier gas supplied from an external gas cylinder into the aerosol generating chamber 1. By controlling the pressure in the aerosol generation chamber 1 in this way, the speed of the air flow (winding gas) generated in the aerosol generation chamber 1 is controlled.
Examples of the carrier gas supplied by the hoisting gas nozzle 3 and the pressure adjusting gas nozzle 4 include helium (He), oxygen (O ₂ ), nitrogen (N ₂ ), argon (Ar), a mixed gas thereof, or dry air. Etc. are used.

The gas supply adjusting units 3 a and 4 a adjust the flow rate of the carrier gas supplied to the aerosol generation chamber 1 through the hoisting gas nozzle 3 and the pressure adjusting gas nozzle 4 under the control of the control unit 13. As the gas supply adjusting units 3a and 4a, those that can cope with electromagnetic control such as a mass flow controller are used.
The aerosol transport pipe 5 is a supply path for supplying the aerosol generated in the aerosol generation chamber 1 to the injection nozzle 9 disposed in the film forming chamber 8.

  The valve 6 shuts off the supply of aerosol from the aerosol generating unit side to the film forming unit side by closing the aerosol passage in the aerosol transport pipe 5 under the control of the control unit 13. As the valve 6, any type such as an L-shaped valve, a straight valve, a butterfly valve, and a gate type valve can be used as long as the valve is compatible with electromagnetic control. Here, the butterfly valve is a valve that adjusts the degree of opening and closing of the valve by changing the angle of the butterfly.

The gas supply unit 7 supplies gas supplied from an external gas cylinder to the aerosol transport pipe 5. As the gas supplied from the gas supply unit 7, helium (He), oxygen (O ₂ ), nitrogen (N ₂ ), argon (Ar), a mixed gas thereof, dry air, or the like is used. The composition of this gas may be the same as or different from the aerosol carrier gas. As will be described later, this gas is used to remove particles that have not contributed to the film formation from the surface of the film formed on the substrate by being injected from the injection nozzle 9. Therefore, in order to enhance the particle removal effect, it is desirable to increase the flow rate of the gas. For this purpose, it is desirable to use a gas having a relatively small mass (eg, a carrier gas) such as helium.

  The gas supply adjusting unit 7 a adjusts the flow rate of the gas supplied from the gas supply unit 7 under the control of the control unit 13. As the gas supply adjusting unit 7a, an apparatus capable of handling electromagnetic control such as a mass flow controller is used.

  The inside of the film forming chamber 8 is evacuated by an evacuation pump connected to an evacuation pipe 11, thereby maintaining a predetermined degree of vacuum. The vacuum valve 12 adjusts the pressure in the film forming chamber 8 by opening and closing the valve under the control of the control unit 13. As the vacuum valve 12, any L-shaped valve, straight valve, butterfly valve, gate type valve, or the like may be used as long as it can cope with electromagnetic control.

  The injection nozzle 9 has an opening having a predetermined shape and size, and the aerosol supplied from the aerosol generation chamber 1 via the aerosol carrier pipe 5 and the gas supplied from the gas supply unit 7 are passed through the opening. Spray toward the substrate 21.

  The substrate stage 10 on which the substrate 21 is placed is a three-dimensionally movable stage for controlling the relative position and relative speed between the substrate 21 and the injection nozzle 9. By adjusting this relative speed, the thickness of the film formed per reciprocation can be controlled.

  The control unit 13 controls each unit so that the aerosol generated in the aerosol generation chamber 1 and the gas supplied from the gas supply unit 7 are alternately injected from the injection nozzle 9. For example, when injecting aerosol, the valve 6 is opened and the gas supply adjusting unit 7a stops the gas supply. On the other hand, when injecting gas, the valve 6 is closed and the gas supply adjusting unit 7a is started to supply gas. Moreover, the control part 13 controls each part so that the gas supplied from the gas supply part 7 may be injected at a desired speed. For example, in order to increase the gas injection speed, the gas supply control unit 7a is increased in gas supply amount (flow rate) or the pressure in the film forming chamber 8 is decreased.

Next, a film forming method according to the first embodiment of the present invention will be described with reference to FIGS. This film forming method is used in the film forming apparatus shown in FIG.
First, in the film forming apparatus shown in FIG. 1, the raw material powder 20 is placed in the aerosol generating chamber 1, and the substrate 21 is set on the substrate stage 10 and kept at a predetermined film forming temperature. Further, the pressure in the aerosol generation chamber 1 and the pressure in the film forming chamber 8 are set to predetermined values.

  Next, as shown in FIG. 2A, film formation is performed by spraying aerosol from the spray nozzle 9 and spraying it onto the substrate 21. The aerosol is sucked from the aerosol generation chamber 1 to the film formation chamber 8 side through the aerosol transport pipe 5 by giving a difference between the pressure in the aerosol generation chamber 1 and the pressure in the film formation chamber 8. Injected from the injection nozzle 9 at a speed corresponding to the pressure difference. At that time, the substrate stage 10 is moved at a predetermined speed, and a predetermined region on the substrate 21 is scanned a predetermined number of times by aerosol sprayed from the nozzle, whereby the film 30 is formed in the region. The film 30 is generally dense due to a mechanochemical reaction, but a portion where the green compact is deposited locally exists.

  Next, the valve 6 shown in FIG. 1 is closed to shut off the supply of the aerosol, and the gas is supplied from the gas supply unit 7 to the injection nozzle 9 through the aerosol transport pipe 5. Thereby, the gas which hardly contains particles, such as raw material powder, is injected from the injection nozzle 9. Then, as shown in FIG. 2B, the gas injected from the injection nozzle 9 is sprayed onto the film 30 on the substrate 21. Since the green compact deposited on the film 30 has a weak bond with the lower layer, it is removed by such gas spraying.

  Such a film forming process and a gas spraying process are repeated until the film 30 has a desired thickness. The ratio between the number of scans in the film forming process and the number of scans in the gas spraying process is not limited. However, in order to effectively remove the green compact, one gas spraying process is performed each time one film is formed. It is desirable to perform the film formation and the gas spraying process alternately. Thereby, a dense and high-quality film can be formed.

  In the film forming method according to the present embodiment, the gas spraying process may be performed on the substrate 21 before film formation. Thereby, the dirt adhering to the substrate 21 can be removed and the substrate 21 can be cleaned.

Next, a film forming method according to the second embodiment of the present invention will be described with reference to FIGS.
The film forming method according to the present embodiment is characterized in that aerosol with an increased injection speed is sprayed onto the film 30 instead of the gas spraying process in the first embodiment of the present invention.

  Here, when the spray speed of the aerosol is higher than the speed suitable for film formation, the raw material powder cannot be deposited by mechanochemical reaction, and conversely, a blast phenomenon occurs that scrapes the formed film. . Therefore, as shown in FIG. 3, the green compact deposited on the film 30 can be removed by spraying the aerosol whose spray speed is increased on the film 30.

In order to increase the aerosol injection speed, for example, the following three methods are conceivable.
As a first method, the flow rate of the gas supplied from the hoisting gas nozzle 3 shown in FIG. 1 is increased. Thereby, since the pressure in the aerosol generation chamber 1 is increased, the aerosol injection speed is increased.

  As a second method, the degree of vacuum of the film forming chamber 8 shown in FIG. 1 is increased. That is, by increasing the difference between the pressure in the aerosol generation chamber 1 and the pressure in the film formation chamber 8, the aerosol is sucked more strongly toward the film formation chamber 8, so that the aerosol injection speed is increased. Get faster.

  As a third method, a gas having a mass smaller than that of the carrier gas is supplied from the gas supply unit 7 shown in FIG. 1 and mixed with the aerosol passing through the aerosol transport pipe 5. Thereby, since carrier gas becomes light, the injection speed of aerosol becomes high.

Experiments were performed to produce PZT (lead zirconate titanate) films using the film forming methods according to the first and second embodiments of the present invention. Common film formation conditions in the following Examples 1 to 6 and Comparative Example are as follows.
Raw material powder: PZT particles, 40 g (PZT-LQ manufactured by Sakai Chemical Industry Co., Ltd.
Dried in air for 24 hours)
Substrate: YSZ (yttrium stabilized zirconia) substrate 25 mm square, thickness 1 mm
(Nippon Fine Ceramics Co., Ltd.)
Substrate temperature: 600 ° C
Carrier gas type: Oxygen Winding gas flow rate: 4 liters / minute Pressure adjustment gas flow rate: 2.5 liters / minute

  Moreover, in the following Examples 1-6 and a comparative example, after forming a film | membrane by the predetermined method, post-annealing was further performed at 800 degreeC for 1 hour. Evaluation of film quality (strength of dielectric breakdown electric field) was performed on this PZT film.

Example 1
As shown in FIG. 4, as a process for removing particles that did not contribute to film formation after forming a film by performing two reciprocal scans of a predetermined region on the substrate with aerosol under the above conditions, 1 Batch (one-way) gas spray treatment was performed. In this gas spraying process, the supply of aerosol to the injection nozzle 9 is shut off, and oxygen is supplied from the gas supply unit 7 to 6.5 liters / minute, so that the film is formed by oxygen gas containing almost no particles. I scanned one way. By repeating such a film forming process and a gas spraying process to form a total of 20 reciprocating films, a PZT film having a thickness of about 20 μm was obtained.

(Example 2)
As shown in FIG. 5, under the above conditions, after a film is formed by scanning a predetermined area on the substrate with aerosol for one way (forward path), the area is scanned with oxygen gas for one way (return path). A gas spray treatment was performed. The conditions in this gas spraying process are the same as in the first embodiment. By repeating such a film forming process and a gas spraying process to form a total of 20 reciprocating films, a PZT film having a thickness of about 20 μm was obtained.

(Comparative example)
As shown in FIG. 6, a PZT film having a thickness of about 20 μm was obtained by scanning a predetermined region on the substrate 20 times by aerosol under the above conditions.

(Result 1)
The results of Examples 1 and 2 and the comparative example are as follows.
Ratio of gas spray treatment Gas type Dielectric breakdown field Example 1 1 time / 2 reciprocations (4 scans) O ₂ gas 55 kV / cm
Example 2 1 time / 0.5 reciprocation (1 scan) O ₂ gas 63 kV / cm
Comparative example None 48kV / cm
Here, the ratio of the gas spray processing represents (gas spray scan count) / (film formation scan amount (scan count)).
From the above results, it was confirmed that a film having a high dielectric breakdown electric field can be obtained by performing the gas spraying process. Moreover, it became clear that the dielectric breakdown electric field of a film | membrane becomes high, so that the ratio of a gas spray process is high.

(Example 3)
As in Example 1, a PZT film having a thickness of about 20 μm was obtained by repeating film formation for two reciprocations and gas spraying for one way. Further, in the gas spraying process, the gas supply amount from the gas supply unit 7 shown in FIG.

(Result 2)
The results of Example 3 are shown below in comparison with Example 1 and Comparative Example.
Gas flow rate Dielectric breakdown field Example 3 8 liters / minute 58 kV / cm
Example 1 6.5 l / min 55 kV / cm
Comparative example None 48 kV / cm
From the above results, it was found that the dielectric breakdown electric field of the film is increased by increasing the gas flow rate in the gas spraying process.

Example 4
As in Example 1, a PZT film of about 20 μm was obtained by repeating the film formation for two reciprocations and the gas spraying for one way. Further, in the gas spraying process, helium gas was supplied from the gas supply unit 7 shown in FIG. The gas flow rate was 6.5 liters / minute, as in Example 1.

(Result 3)
The results of Example 4 are shown below in comparison with Example 1 and Comparative Example.
Gas type Dielectric breakdown field Example 4 Helium 57 kV / cm
Example 1 Oxygen 55 kV / cm
Comparative example None 48 kV / cm
From the above results, it was revealed that the dielectric breakdown electric field of the film is increased by using a gas having a smaller mass in the gas spraying process. This is presumably because the use of a light gas increases the flow rate of the gas injected from the injection nozzle 9 (FIG. 1), thus increasing the effect of blowing the green compact and the like.

(Example 5)
Instead of the gas spraying process shown in FIG. 4, aerosol spraying at a high spray rate was performed as a process for removing particles that did not contribute to film formation. In this aerosol spraying process, the pressure adjusting gas flow rate was increased to 4 liters / minute, compared to 2.5 liters / minute during film formation. That is, the total carrier gas flow rate was increased from 6.5 liters / minute to 8 liters / minute. Then, a PZT film having a thickness of about 20 μm was obtained by repeating the two-way film formation and the one-way aerosol spraying process.
(Example 6)
Instead of the gas spraying process shown in FIG. 5, aerosol spraying at a high spray rate was performed as a process for removing particles that did not contribute to film formation. This aerosol spraying process is the same as in Example 5. Then, by repeating the film formation for one way and the aerosol spraying process for one way, a PZT film of about 20 μm was obtained.

(Result 4)
The results of Examples 5 and 6 are shown below in comparison with the comparative example.
Ratio of spray treatment Flow rate of aerosol Dielectric breakdown field Example 5 1 time / 2 reciprocations (4 scans) 8 L / min 53 kV / cm
Example 6 1 time / 0.5 reciprocation (1 scan) 8 L / min 55 kV / cm
Comparative example None 48 kV / cm
Here, the ratio of the spray process represents (the number of scans of aerosol spray with an increased spray speed) / (the scan amount of film formation (the number of scans)).

  From the above results, it was confirmed that the dielectric breakdown electric field of the film was also increased by performing the aerosol spraying process at a high injection speed. Moreover, the hardness of a film | membrane became high by performing this aerosol spraying process, and the tendency became remarkable, so that the ratio of this aerosol spraying process became high.

  In the first and second embodiments of the present invention described above, the operation of the gas supply adjusting units 3a, 4a, and 7a and the valves 6 and 12 shown in FIG. However, these operations may be controlled manually. In that case, a valve or an ordinary flow meter that does not support electromagnetic control can be used.

  The present invention can be used in a film forming method and a film forming apparatus using an aerosol deposition method in which raw material powder is sprayed onto a substrate to deposit the raw material powder on the substrate.

It is a schematic diagram which shows the structure of the film-forming apparatus which concerns on one Embodiment of this invention. It is a schematic diagram for demonstrating the film-forming method which concerns on the 1st Embodiment of this invention. It is a schematic diagram for demonstrating the film-forming method which concerns on the 2nd Embodiment of this invention. It is a figure which shows the scanning method of the nozzle in the case of performing the gas spraying process for 1 time (for one way) with respect to the film formation for 2 reciprocations. It is a figure which shows the scanning method of the nozzle in the case of performing the gas spraying process for once (for one way) with respect to the film formation for one way. It is a figure which shows the scanning method of the nozzle in the case of performing only film-forming.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Aerosol production | generation chamber 2 Shaking table 3 Hoisting gas nozzle 3a, 4a, 7a Gas supply adjustment part 4 Pressure adjustment gas nozzle 5 Aerosol conveyance pipe 6 Valve 7 Gas supply part 8 Film formation chamber 9 Injection nozzle 10 Substrate stage 11 Exhaust pipe 12 Vacuum valve 13 Control unit 20 Raw material powder 21 Substrate 30 Film

Claims (19)

A film forming method using an aerosol deposition method in which a raw material powder is sprayed on a substrate to deposit the raw material powder on the substrate to form a film,
A step (a) of generating an aerosol by dispersing raw material powder with a gas;
(B) forming a film on the substrate by spraying the aerosol generated in the step (a) from a spray nozzle and spraying the aerosol on the substrate disposed in the film forming chamber;
After the step (b), the supply of the raw material powder to the injection nozzle is shut off, and the gas is supplied to the injection nozzle to inject the gas at a speed higher than the aerosol injection speed in the step (b). , A step (c) of blowing a gas to the film formed on the substrate;
A film forming method comprising:   The film forming method according to claim 1, wherein the step (c) includes injecting a gas having a composition different from that of the gas in which the raw material powder is dispersed in the step (a).   The film forming method according to claim 2, wherein the step (c) includes injecting a gas having a smaller mass than the gas in which the raw material powder is dispersed in the step (a).   The film forming method according to claim 1, further comprising a step of repeating steps (b) and (c) a predetermined number of times. A film forming method using an aerosol deposition method in which a raw material powder is sprayed on a substrate to deposit the raw material powder on the substrate to form a film,
A step of generating an aerosol by dispersing the raw material powder with a gas (a),
A step (b) of forming a film on the substrate by spraying the aerosol generated in the step (a) from a spray nozzle and spraying it on the substrate disposed in the film forming chamber;
After the step (b), the aerosol generated in the step (a) is sprayed at a speed higher than the aerosol spraying speed in the step (b) and sprayed onto the film formed on the substrate (c). When,
A film forming method comprising: 6. The film forming method according to claim 5, further comprising a step of repeating steps (b) and (c) a predetermined number of times.
A film forming method comprising: A film forming apparatus in which an aerosol deposition method is used to deposit a raw material powder on a substrate to form a film by spraying the raw material powder onto the substrate,
Aerosol generating means for generating an aerosol by dispersing raw material powder with gas;
A film forming chamber in which a substrate is disposed;
An injection nozzle that is disposed in the film forming chamber and injects a supplied fluid toward the substrate;
A supply path for supplying the aerosol generated by the aerosol generating means to the spray nozzle;
A valve for opening and closing the supply path;
Gas supply means for selectively supplying a gas to be injected from the injection nozzle to the injection nozzle;
A film forming apparatus comprising:   Control means for controlling the valve so as to cut off the supply of aerosol to the injection nozzle and controlling the gas supply means so as to supply gas to the injection nozzle when gas is injected from the injection nozzle. The film forming apparatus according to claim 7, further comprising:   The film forming apparatus according to claim 8, wherein the control unit performs control so that an injection speed of the gas supplied by the gas supply unit is faster than an injection speed of the aerosol.   The film forming apparatus according to claim 9, wherein the control unit increases a supply amount of gas supplied by the gas supply unit.   The film forming apparatus according to claim 9 or 10, wherein the control means reduces the pressure in the film forming chamber.   The control means operates the valve and the gas supply means so that the aerosol generated by the aerosol generation means and the gas supplied by the gas supply means are alternately injected from the injection nozzle. The film-forming apparatus of any one of Claims 8-11 to control.   The film forming apparatus according to claim 7, wherein the gas supply unit supplies a gas having a composition different from that of the gas supplied to the container of the aerosol generation unit.   The film forming apparatus according to claim 13, wherein the gas supply unit supplies a gas having a smaller mass than a gas supplied to the container of the aerosol generation unit. A film forming apparatus in which an aerosol deposition method is used to deposit a raw material powder on a substrate to form a film by spraying the raw material powder onto the substrate,
Aerosol generating means for generating an aerosol by dispersing raw material powder with gas;
A film forming chamber in which a substrate is disposed;
An injection nozzle that is disposed in the film formation chamber and injects the aerosol generated by the aerosol generation means toward the substrate;
A supply path for supplying the aerosol generated by the aerosol generating means to the spray nozzle;
Control means for performing control so that the velocity of the aerosol ejected from the ejection nozzle is increased in a predetermined period;
A film forming apparatus comprising:   The film forming apparatus according to claim 15, wherein the control unit controls the aerosol generation unit so as to increase a flow rate of a gas for dispersing the raw material powder in the aerosol generation unit.   The film forming apparatus according to claim 15, wherein the control unit controls the pressure in the film forming chamber so as to reduce the pressure in the film forming chamber. Gas supply means for mixing a second gas having a smaller mass than the gas for dispersing the raw material powder in the aerosol generating means in the aerosol conveyed to the injection nozzle,
The control means controls the gas supply means to supply the second gas in a predetermined period;
The film-forming apparatus of any one of Claims 15-17.   The film forming apparatus according to any one of claims 15 to 18, wherein the control means repeatedly performs control for increasing the aerosol injection speed at predetermined intervals.

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