JP2007057335A - Apparatus and method for measuring dimension of object to be measured - Google Patents

Apparatus and method for measuring dimension of object to be measured Download PDF

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JP2007057335A
JP2007057335A JP2005241837A JP2005241837A JP2007057335A JP 2007057335 A JP2007057335 A JP 2007057335A JP 2005241837 A JP2005241837 A JP 2005241837A JP 2005241837 A JP2005241837 A JP 2005241837A JP 2007057335 A JP2007057335 A JP 2007057335A
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measured
base
measurement
light
dimension
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JP4438096B2 (en
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Akira Itami
亮 伊丹
Makoto Takasugi
真 高杉
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TDK Lambda Corp
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TDK Lambda Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To easily measure dimensions of an object to be measured existing on some coordinate positions without increasing the number of sensors. <P>SOLUTION: An apparatus for measuring the dimensions is provided with: a base member 2 on which the object to be measured X with a lead Y is mounted in its implementation state; and a measurement sensor 6 having a light emitting device 3 and a light receiving device 4 being respectively disposed on both sides of the base member 2, wherein reference light from the light emitting device 3 is captured by the light receiving device 4, and the dimensions of the object to be measured X is measured from a detection output of the receiving device 4. The base member 2 is set rotatable in a manual or electric operation. Therefore, only an appropriate operation of rotating the base member, on which the object to be measured X is previously mounted, enables various portions of the object to be measured X to be located in an optical path of the reference light from the light emitting device 3 to the light receiving device 4, whereby the dimensions of the object to be measured X existing on the some coordinate positions can be measured easily. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、投光器と受光器とを有する光学式の測定センサを用いて、基台に実装状態で装着されたリード付きの被測定物の寸法を非接触に測定する電子部品の寸法測定装置および寸法測定方法に関する。   The present invention relates to an electronic component size measuring apparatus that uses a optical measuring sensor having a projector and a light receiver to measure the size of an object with a lead mounted in a mounted state on a base in a non-contact manner, and The present invention relates to a dimension measuring method.

一般に、オンボード電源のようなパッケージ化されたリード付きの電子機器は、その製造工程や組立工程の終了時に、高さ寸法の検査が必要不可欠である。その場合、電子機器単独の高さ(厚さ)寸法を測定するのは勿論のこと、電子機器を基板に装着した状態で、装着姿勢の傾きや浮きを検出するために、この電子機器の各エッジの高さ寸法を測定するようにしている。   In general, an electronic device with a packaged lead such as an on-board power source is indispensable to inspect a height dimension at the end of the manufacturing process and the assembly process. In that case, not only the height (thickness) dimension of the electronic device alone is measured, but also in order to detect the inclination and floating of the mounting posture with the electronic device mounted on the substrate, The height of the edge is measured.

このような基板上に被測定物を装着した状態で、当該被測定物の高さ寸法を測定する装置としては、例えば特許文献1における電子部品装着装置が知られている。ここでは、投光器と受光器とを有する光学式の測定センサ(距離センサ)を用いて、同じ座標位置で電子部品を基板に装着する前と、基板に装着した後の高さの差を測定し、これを予め記憶しておいた電子部品の厚さ情報と比較することで、実装状態における電子部品の浮きや傾きを検出している。
特開2002−176292号公報
As an apparatus for measuring the height dimension of a measurement object with the measurement object mounted on such a substrate, for example, an electronic component mounting apparatus in Patent Document 1 is known. Here, an optical measurement sensor (distance sensor) having a projector and a light receiver is used to measure the difference in height before and after mounting the electronic component on the substrate at the same coordinate position. By comparing this with the electronic component thickness information stored in advance, the floating or inclination of the electronic component in the mounted state is detected.
JP 2002-176292 A

上記従来技術の場合、被測定物の複数の部位について、その高さ寸法を測定するためには、少なくともその数に対応した幾つかの測定センサが必要になる。ところが測定センサは高額であり、幾つもの測定センサを購入するとなると、その分だけ被測定物の製品コストが上昇する。また、被測定物が比較的小型の場合には、被測定物の周囲に設置できる測定センサの数に限界があるなどの問題を生じる。   In the case of the above prior art, in order to measure the height dimension of a plurality of parts of the object to be measured, several measurement sensors corresponding to at least the number are required. However, the measurement sensor is expensive, and if a number of measurement sensors are purchased, the product cost of the object to be measured increases accordingly. Further, when the object to be measured is relatively small, there arises a problem that the number of measurement sensors that can be installed around the object to be measured is limited.

本発明は上記の課題に着目してなされたもので、測定センサの数を増やすことなく、幾つかの座標位置における被測定物の寸法を簡単に測定できる被測定物の寸法測定装置および寸法測定方法を提供することをその目的とする。   The present invention has been made paying attention to the above-mentioned problem, and it is possible to easily measure the dimension of the measurement object at several coordinate positions without increasing the number of measurement sensors, and the dimension measurement of the measurement object. Its purpose is to provide a method.

本発明における被測定物の寸法測定装置は、リード付きの被測定物を実装状態で装着する基台と、前記基台の両側に投光器と受光器とをそれぞれ配置し、前記投光器からの参照光を前記受光器で捕捉して前記被測定物の寸法を測定する測定センサとを備えた被測定物の高さ測定装置において、前記基台を回転可能にしたことを特徴とする。   An apparatus for measuring a dimension of an object to be measured according to the present invention includes a base on which an object to be measured with a lead is mounted in a mounted state, a projector and a light receiver on both sides of the base, and a reference light from the projector In the device for measuring the height of the object to be measured, which is provided with a measurement sensor for measuring the size of the object to be measured by capturing the light with the light receiver, the base is made to be rotatable.

また、本発明における被測定物の寸法測定方法は、測定センサを構成する投光器と受光器との間に回転可能な基台を配置し、前記基台にリード付きの被測定物を実装状態で装着し、前記被測定物を装着した基台を回転させながら、前記投光器からの参照光を前記受光器で捕捉して前記被測定物の寸法を測定するものである。   Further, in the method for measuring a dimension of an object to be measured in the present invention, a rotatable base is disposed between a projector and a light receiver that constitute a measurement sensor, and the object to be measured with a lead is mounted on the base. The reference light from the projector is captured by the light receiver while the base on which the object to be measured is mounted is rotated, and the dimension of the object to be measured is measured.

上記の装置および方法によれば、予め被測定物を装着した基台を適宜回転させるだけで、測定センサの投光器から受光器に至る参照光の光路中に、被測定物の様々な部位を位置させることができる。したがって、複数の高額な測定センサを被測定物の周囲に配置する必要がなく、受光器から得られる被測定物の寸法に見合う検出出力から、幾つかの座標位置における被測定物の寸法を簡単に測定できる。   According to the above-described apparatus and method, various parts of the object to be measured are positioned in the optical path of the reference light from the light projector to the light receiver of the measurement sensor simply by appropriately rotating the base on which the object to be measured is previously mounted. Can be made. Therefore, there is no need to place multiple expensive measurement sensors around the object to be measured, and the dimensions of the object to be measured at several coordinate positions can be easily obtained from the detection output that matches the dimensions of the object to be measured obtained from the light receiver. Can be measured.

本発明における被測定物の寸法測定装置および寸法測定方法によれば、測定センサの数を増やすことなく、幾つかの座標位置における被測定物の寸法を簡単に測定できる。   According to the dimension measuring apparatus and the dimension measuring method of the object to be measured in the present invention, the dimensions of the object to be measured at several coordinate positions can be easily measured without increasing the number of measurement sensors.

以下、本発明における被測定物の寸法測定装置および寸法測定方法の好ましい実施形態について、添付図面を参照しながら詳細に説明する。   Hereinafter, preferred embodiments of a dimension measuring apparatus and a dimension measuring method of an object to be measured according to the present invention will be described in detail with reference to the accompanying drawings.

先ず、装置の機構的な構成を図1および図2に基づき説明する。同図において、1は製造工程や組立工程のライン中に設置された固定の工具テーブル、2は工具テーブル1に対して回転可能に設けられた扁平円盤状の基台であり、この基台2は、工具テーブル1の水平上面に対して垂直な回転軸Cを中心として、正逆両方向に回転できるようになっている。また3,4は、基台2の一側と他側にそれぞれ配置された投光器と受光器であり、これらは工具テーブル1の適所に設けられたアンプユニット5と共に、後述する被測定物Xの高さ寸法を測定するを構成している。   First, the mechanical configuration of the apparatus will be described with reference to FIGS. In the figure, reference numeral 1 denotes a fixed tool table installed in a production process or assembly process line, and 2 denotes a flat disk-shaped base that is rotatably provided with respect to the tool table 1. Is capable of rotating in both forward and reverse directions about a rotation axis C perpendicular to the horizontal upper surface of the tool table 1. Reference numerals 3 and 4 denote a projector and a light receiver respectively disposed on one side and the other side of the base 2, and these together with an amplifier unit 5 provided at an appropriate position of the tool table 1, a later-described object X to be measured. Configure to measure height dimension.

ここで上記各部の構成について詳しく説明すると、基台2は平坦状の載置面を形成する載置部11と、この載置部11の外周に形成した環状凸部12とにより構成され、載置部11には複数のリード挿入孔13が設けられる。このリード挿入孔13は、被測定物Xの本体底面が載置部11の上面(載置面)に載るように、被測定物Xの本体底面から突出したリードYに対向して配置される。また好ましくは、複数種の被測定物XのリードYに対応して、載置部11に前記リード挿入孔13が設けられる。こうすれば、共通する基台2によって複数種の被測定物Xの高さ寸法を測定することが可能になる。なお、基台2は円盤状である必要はなく、また被測定物Xの本体底面の形状に合せて、対向する載置部11の上面形状を任意に形成してもよい。環状凸部12は、基台2に被測定物Xを装着する際に、基台2から被測定物Xが滑り落ちないようにするためのものである。   Here, the configuration of each part will be described in detail. The base 2 is composed of a mounting part 11 that forms a flat mounting surface and an annular convex part 12 formed on the outer periphery of the mounting part 11. The placement portion 11 is provided with a plurality of lead insertion holes 13. The lead insertion hole 13 is disposed to face the lead Y protruding from the bottom surface of the measurement object X so that the bottom surface of the measurement object X is placed on the upper surface (mounting surface) of the placement portion 11. . Preferably, the lead insertion hole 13 is provided in the mounting portion 11 so as to correspond to the leads Y of the plurality of types of objects to be measured X. If it carries out like this, it will become possible to measure the height dimension of multiple types of to-be-measured object X with the common base 2. FIG. Note that the base 2 does not have to be disk-shaped, and the upper surface shape of the mounting portion 11 facing the substrate 2 may be arbitrarily formed in accordance with the shape of the bottom surface of the body of the DUT X. The annular convex portion 12 is for preventing the object to be measured X from sliding off the base 2 when the object to be measured X is mounted on the base 2.

また、投光器3と受光器4は、工具テーブル1の上に載置された一対の台座16,17にそれぞれ配設される。これらの台座16,17には、工具テーブル1のねじ孔(図示せず)に螺合する調整用のねじ18,19が各々設けられており、ねじ18を緩めて台座16を水平方向に動かすことにより、投光器3の位置を調整できると共に、別なねじ19を緩めて台座17を水平方向に動かすことにより、受光器4の位置を調整できるようになっている。   The light projector 3 and the light receiver 4 are respectively disposed on a pair of bases 16 and 17 placed on the tool table 1. These pedestals 16 and 17 are respectively provided with adjusting screws 18 and 19 that are screwed into screw holes (not shown) of the tool table 1, and the pedestal 16 is moved in the horizontal direction by loosening the screws 18. Thus, the position of the light projector 4 can be adjusted, and the position of the light receiver 4 can be adjusted by loosening another screw 19 and moving the base 17 in the horizontal direction.

本実施例における測定センサ6は、投光器3と受光器4が向かい合うように配置される。ここで測定センサ6による測定原理について、図3に基づき説明すると、投光器3は半導体レーザなどの光源21と、光源21から拡散する出射光を平行光に変換するコリメータレンズ22とにより構成され、また受光器4は、投光器3からの平行なレーザ光を集光する集光レンズ23と、集光したレーザ光を受ける受光素子としてのホトダイオード24とにより構成される。そして測定に際しては、投光器3から受光器4に向かって平行なレーザ光を出射し、受光器4側で集光レンズ23によりホトダイオード24に集光する。このとき、投光器3と受光器4との間に被測定物Xが置かれると、ホトダイオード24に取り込まれるレーザ光の受光量が減少するので、被測定物Xの高さ寸法に応じたリニアな出力が、ホトダイオード24から得られることになる。   The measurement sensor 6 in this embodiment is arranged so that the projector 3 and the light receiver 4 face each other. Here, the measurement principle by the measurement sensor 6 will be described with reference to FIG. 3. The projector 3 is composed of a light source 21 such as a semiconductor laser, and a collimator lens 22 that converts the emitted light diffused from the light source 21 into parallel light. The light receiver 4 includes a condensing lens 23 that condenses the parallel laser light from the projector 3 and a photodiode 24 as a light receiving element that receives the condensed laser light. In the measurement, parallel laser light is emitted from the light projector 3 toward the light receiver 4, and is condensed on the photodiode 24 by the condenser lens 23 on the light receiver 4 side. At this time, if the object to be measured X is placed between the projector 3 and the light receiver 4, the amount of received laser light taken into the photodiode 24 decreases, so that the linearity corresponding to the height dimension of the object to be measured X is reduced. An output will be obtained from the photodiode 24.

なお、本実施例における測定センサ6は、いわゆるホトダイオード24に取り込まれるレーザ光の受光量によって、被測定物Xの高さ寸法を測定するものであるが、例えば受光器4にCCDイメージセンサを用いたり、投光器3からのレーザの細径ビームをスキャンさせながら出射させるものなど、他の光学式の測定センサ6を利用してもよい。何れにせよ、どのような方式の測定センサ6であっても、本実施例では基台2が回転可能になっているので、被測定物Xの周囲に複数の測定センサ6を設けなくても、被測定物Xの様々な部位の高さを単独の測定センサ6により測定できる。   The measurement sensor 6 in this embodiment measures the height dimension of the measurement object X based on the amount of light received by the so-called photodiode 24. For example, a CCD image sensor is used for the light receiver 4. Alternatively, another optical measurement sensor 6 may be used, such as a laser beam emitted from the projector 3 while being scanned. In any case, since the base 2 is rotatable in this embodiment regardless of the type of measurement sensor 6, it is not necessary to provide a plurality of measurement sensors 6 around the object to be measured X. The height of various parts of the measurement object X can be measured by the single measurement sensor 6.

次に、装置の制御系統における構成を図4に基づき説明する。同図において、31は本実施例における寸法測定装置の各部を制御する制御部で、この制御部31の入力ポートには、測定開始を指示する操作手段としての開始スイッチ32が接続されると共に、制御部32の出力ポートには、基台2に回転力を与える駆動源としてのロータリーアクチュエータ(エアシリンダー)33と、測定結果の合否判定を行なう例えばLEDやブザーなどの出力手段34が接続される。ロータリーアクチュエータ33は基台2の回転位置を検知するエンコーダ(図示せず)を備えており、このエンコーダの検知出力が制御部31の入力ポートに与えられるようになっている。また、前記測定センサ6の投光器3や受光器4は、アンプユニット5を経由して制御部31に接続される。制御部31は、ロータリーアクチュエータ33の動作(回転または停止)を制御するアクチュエータ制御手段35が設けられると共に、アンプユニット5により増幅された受光器4の検知出力に基づいて被測定物Xの高さを求め、この被測定物Xの高さが予め記憶された許容範囲内にあるか否かを判断して、その結果を出力手段に転送する判定手段36が設けられる。   Next, the configuration of the control system of the apparatus will be described with reference to FIG. In the same figure, 31 is a control unit that controls each part of the dimension measuring apparatus in the present embodiment, and an input port of this control unit 31 is connected with a start switch 32 as an operation means for instructing measurement start, Connected to the output port of the control unit 32 are a rotary actuator (air cylinder) 33 as a drive source for applying a rotational force to the base 2 and an output means 34 such as an LED or a buzzer for performing pass / fail judgment of the measurement result. . The rotary actuator 33 includes an encoder (not shown) that detects the rotational position of the base 2, and the detection output of this encoder is given to the input port of the control unit 31. The light projector 3 and the light receiver 4 of the measurement sensor 6 are connected to the control unit 31 via the amplifier unit 5. The control unit 31 is provided with actuator control means 35 for controlling the operation (rotation or stop) of the rotary actuator 33, and the height of the object X to be measured based on the detection output of the light receiver 4 amplified by the amplifier unit 5. Determination means 36 is provided for determining whether or not the height of the object X to be measured is within a pre-stored allowable range and transferring the result to the output means.

なお、上記制御系統の構成では、例えばロータリーアクチュエータ33に代わり基台2を手動で動かせるように構成し、基台2が一回転したのを図示しない例えばエンコーダなどの回転検出センサで検出したら、判定手段35によって被測定物Xの高さに関する合否判定を行なうようにしてもよい。また、測定センサ6が制御部31の機能を兼用してもよい。   In the above control system configuration, for example, the base 2 can be manually moved instead of the rotary actuator 33, and if the base 2 is rotated once by a rotation detection sensor such as an encoder (not shown), the determination is made. You may make it perform the pass / fail determination regarding the height of the to-be-measured object X by the means 35. FIG. The measurement sensor 6 may also function as the control unit 31.

次に、上記寸法測定装置を利用した被測定物Xの高さ測定方法を、図5のフローチャートに基づき説明する。先ず被測定物Xの測定に先立ち、工具テーブル1の所定位置には、測定センサ6を構成する投光器3と受光器4とを向かい合わせ、投光器3からの参照光の一部が被測定物Xに当たるように、投光器3と受光器4との間に基台2を回転可能に配設する(ステップS1)。なお、この測定センサ6と基台2の配置は、被測定物Xの測定前に一度だけ行なえばよく、被測定物Xの寸法を測定する毎に行なう必要はない。   Next, a method for measuring the height of the measurement object X using the dimension measuring apparatus will be described with reference to the flowchart of FIG. First, prior to the measurement of the measurement object X, the projector 3 and the light receiver 4 constituting the measurement sensor 6 are opposed to each other at a predetermined position of the tool table 1, and a part of the reference light from the projector 3 is measured. The base 2 is rotatably arranged between the light projector 3 and the light receiver 4 (step S1). Note that the arrangement of the measurement sensor 6 and the base 2 need only be performed once before the measurement of the measurement object X, and need not be performed every time the dimension of the measurement object X is measured.

次のステップS2では、製造工程および組立工程を経て完成に至った例えば電子機器としてのオンボード電源を、被測定物Xとして基台2の上に載せる。この場合、被測定物Xの本体底面より突出する複数のリードYを、これに対応するそれぞれのリード挿入孔13に挿入し、基台2の載置部11上に被測定物Xの本体底面が載るようにする。   In the next step S <b> 2, for example, an on-board power source as an electronic device that has been completed through a manufacturing process and an assembling process is placed on the base 2 as an object to be measured X. In this case, a plurality of leads Y protruding from the bottom surface of the body of the object to be measured X are inserted into the corresponding lead insertion holes 13 and the bottom surface of the body of the object to be measured X is placed on the mounting portion 11 of the base 2. To be placed.

こうして、基台2の載置部11に被測定物Xを実装状態で装着したら、ステップS3に移行して開始スイッチ32を押動操作子、被測定物Xについての高さ寸法の測定を開始する。ここでは制御部31のアクチュエータ制御手段35によってロータリーアクチュエータ33に動作電圧が与えられ、基台2が所定の速度で回転を開始する。それと共に判定手段36は、投光器3からの参照光が当たる被測定物Xの部位について、受光器4に取り込まれる参照光の光量に見合う検出出力を当該受光器4から取り込んで、被測定物Xの高さ寸法を求める。この被測定物Xの高さ寸法の算出は、特定のサンプリング時間若しくは基台2が特定の位置に達する毎に行なわれ、被測定物Xの様々な部位の高さ寸法が判定手段36に記憶されて行く。   In this way, when the measurement object X is mounted on the mounting portion 11 of the base 2 in a mounted state, the process proceeds to step S3 where the start switch 32 is pushed, and measurement of the height dimension of the measurement object X is started. To do. Here, an operating voltage is applied to the rotary actuator 33 by the actuator control means 35 of the control unit 31, and the base 2 starts to rotate at a predetermined speed. At the same time, the determination means 36 takes in a detection output corresponding to the amount of reference light taken into the light receiver 4 from the light receiver 4 for the part of the object X to which the reference light from the projector 3 hits. Find the height dimension. The calculation of the height dimension of the measurement object X is performed every time a specific sampling time or the base 2 reaches a specific position, and the height dimensions of various parts of the measurement object X are stored in the determination means 36. Going to be.

ロータリーアクチュエータ33からの検知出力により基台2が少なくとも1回転以上回ったと判定手段36が判定すると、当該判定手段36は予め記憶した許容範囲に対して、それまで測定記録した被測定物Xの各部の高さ寸法が含まれているか否かを判断し、その結果を出力手段34に出力する(ステップS4)。このステップS4の合否判定において、仮にリードYが曲がっているなどして、被測定物Xが基台2の載置部11に正しく装着できなければ、測定センサ6により測定した被測定物Xの各部の高さ寸法の一部または全てが、許容範囲を外れることになり、その旨を出力手段34から報知または表示する。逆に被測定物Xが基台2の載置部11に正しく装着できていれば、被測定物Xの各部の高さ寸法の全てが許容範囲内に収まり、この場合もその旨が出力手段34から報知または表示される。なお、このステップS4の合否判定は、判定手段36が被測定物Xの高さ寸法を算出する毎に行なってもよい。   When the determination means 36 determines that the base 2 has rotated at least one revolution or more based on the detection output from the rotary actuator 33, the determination means 36 measures each part of the measured object X measured and recorded up to the previously stored allowable range. It is determined whether or not the height dimension is included, and the result is output to the output means 34 (step S4). In the pass / fail determination in step S4, if the measurement object X cannot be correctly mounted on the mounting portion 11 of the base 2 because the lead Y is bent or the like, the measurement object 6 measured by the measurement sensor 6 is measured. A part or all of the height dimension of each part is out of the allowable range, and the fact is notified or displayed from the output means 34. On the contrary, if the object to be measured X is correctly mounted on the mounting portion 11 of the base 2, all the height dimensions of each part of the object to be measured X are within the allowable range. Notification or display from 34. In addition, you may perform the pass / fail determination of this step S4 whenever the determination means 36 calculates the height dimension of the to-be-measured object X.

以上のように本実施例では、リードY付きの被測定物Xを実装状態で装着する基台2と、基台2の両側に投光器3と受光器4とをそれぞれ配置し、投光器3からの参照光を受光器4で捕捉して、受光器4からの検出出力により被測定物Xの寸法を測定する測定センサ6とを備えた被測定物Xの寸法測定装置において、基台2を手動若しくは電動で回転可能にしたことを特徴としている。   As described above, in this embodiment, the base 2 on which the measurement object X with the lead Y is mounted in the mounted state, and the projector 3 and the light receiver 4 are arranged on both sides of the base 2, respectively. A base 2 is manually operated in a dimension measuring apparatus 6 having a measuring sensor 6 that captures reference light by a light receiver 4 and measures a dimension of the object X by a detection output from the light receiver 4. Alternatively, it is characterized in that it can be rotated electrically.

また本実施例では、測定センサ6を構成する投光器3と受光器4との間に回転可能な基台2を配置し、基台2にリードY付きの被測定物Xを実装状態で装着し、被測定物Xを装着した基台2を手動若しくは電動で回転させながら、投光器3からの参照光を受光器4で捕捉して、受光器4からの検出出力により被測定物Xの寸法を測定する寸法測定方法を採用している。   In this embodiment, a rotatable base 2 is disposed between the projector 3 and the light receiver 4 constituting the measurement sensor 6, and a measurement object X with a lead Y is mounted on the base 2 in a mounted state. The reference light from the projector 3 is captured by the light receiver 4 while rotating the base 2 on which the object X is mounted manually or electrically, and the dimension of the object X is determined by the detection output from the light receiver 4. The dimension measurement method to measure is adopted.

これらの寸法測定装置および寸法測定方法の何れにおいても、予め被測定物Xを装着した基台2を適宜回転させるだけで、測定センサ6の投光器3から受光器4に至る参照光の光路中に、被測定物Xの様々な部位を位置させることができる。したがって、複数の高額な測定センサ6を被測定物Xの周囲に配置する必要がなく、受光器4から得られる被測定物Xの寸法に見合う検出出力から、幾つかの座標位置における被測定物Xの寸法を簡単に測定できる。   In any of these dimension measuring apparatuses and dimension measuring methods, the base 2 on which the object to be measured X is mounted in advance is rotated as appropriate in the optical path of the reference light from the light projector 3 to the light receiver 4 of the measurement sensor 6. Various parts of the measurement object X can be positioned. Therefore, it is not necessary to arrange a plurality of expensive measurement sensors 6 around the object to be measured X, and the object to be measured at several coordinate positions can be obtained from the detection output corresponding to the dimension of the object to be measured X obtained from the light receiver 4. The dimension of X can be easily measured.

また実施例上の効果として、基台2は被測定物Xを載せる載置部11の周りを囲んで、突出部たる環状凸部12が設けられているので、この環状凸部12によって、基台2に被測定物Xを装着するときに、基台2から被測定物Xが滑り落ちないようにできる。さらに、基台2が何らかの原因で浮き上がったりすれば、投光器3からの参照光の一部が環状凸部12に当たって、受光器4からの検出出力に変化を生じるので、基台2が正しく回転しているか否かを環状凸部12により判断できる。   Further, as an effect of the embodiment, since the base 2 surrounds the mounting portion 11 on which the measurement object X is placed and is provided with an annular convex portion 12 as a protruding portion, the annular convex portion 12 causes the base 2 to When the measurement object X is mounted on the table 2, the measurement object X can be prevented from sliding off from the base 2. Furthermore, if the base 2 floats up for some reason, a part of the reference light from the projector 3 hits the annular convex portion 12 and changes in the detection output from the light receiver 4, so that the base 2 rotates correctly. It can be judged by the annular convex part 12 whether it is.

なお、本発明は上記実施例に限定されるものではなく、本発明の要旨の範囲において種々の変形実施が可能である。本実施例では、特に被測定物Xの高さ方向の寸法を測定するように構成したが、被測定物Xの幅や奥行きなどの寸法を測定するものにも、同様に適用できる。   In addition, this invention is not limited to the said Example, A various deformation | transformation implementation is possible in the range of the summary of this invention. In the present embodiment, the configuration is such that the dimension in the height direction of the measurement object X is measured in particular, but the present invention can be similarly applied to the measurement of dimensions such as the width and depth of the measurement object X.

本発明の一実施例における寸法測定装置の主要部分を示す斜視図である。It is a perspective view which shows the principal part of the dimension measuring apparatus in one Example of this invention. 同上、基台に被測定物を装着し、(a)→(b)→(c)の順で基台を回転させたときの状態を示す平面図である。It is a top view which shows a state when mounting a to-be-measured object to a base and rotating a base in order of (a)-> (b)-> (c) same as the above. 同上、測定センサの測定原理に関する説明図である。It is explanatory drawing regarding the measurement principle of a measurement sensor same as the above. 同上、制御系統を示すブロック図である。It is a block diagram which shows a control system same as the above. 同上、測定手順を示すフローチャートである。It is a flowchart which shows a measurement procedure same as the above.

符号の説明Explanation of symbols

2 基台
3 投光器
4 受光器
6 測定センサ
X 被測定物

2 base 3 projector 4 light receiver 6 measurement sensor X DUT

Claims (2)

リード付きの被測定物を実装状態で装着する基台と、前記基台の両側に投光器と受光器とをそれぞれ配置し、前記投光器からの参照光を前記受光器で捕捉して前記被測定物の寸法を測定する測定センサとを備えた被測定物の寸法測定装置において、前記基台を回転可能にしたことを特徴とする被測定物の寸法測定装置。   A base on which a measurement object with a lead is mounted in a mounted state, a light projector and a light receiver are arranged on both sides of the base, and the reference light from the light projector is captured by the light receiver and the measurement object An apparatus for measuring a dimension of an object to be measured, comprising a measurement sensor for measuring the dimension of the object, wherein the base is rotatable. 測定センサを構成する投光器と受光器との間に回転可能な基台を配置し、
前記基台にリード付きの被測定物を実装状態で装着し、
前記被測定物を装着した基台を回転させながら、前記投光器からの参照光を前記受光器で捕捉して前記被測定物の寸法を測定することを特徴とする被測定物の高さ測定方法。


A rotatable base is placed between the projector and receiver that make up the measurement sensor,
Mount the object to be measured with leads on the base in a mounted state,
A method for measuring the height of an object to be measured, comprising: measuring a dimension of the object to be measured by capturing the reference light from the light projector with the light receiver while rotating a base on which the object to be measured is mounted. .


JP2005241837A 2005-08-23 2005-08-23 Dimension measurement device Expired - Fee Related JP4438096B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7360342B2 (en) 2020-02-20 2023-10-12 株式会社ジャノメ Tool position detection device and robot equipped with the device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7360342B2 (en) 2020-02-20 2023-10-12 株式会社ジャノメ Tool position detection device and robot equipped with the device

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