JP2007056346A5 - - Google Patents
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- Publication number
- JP2007056346A5 JP2007056346A5 JP2005245612A JP2005245612A JP2007056346A5 JP 2007056346 A5 JP2007056346 A5 JP 2007056346A5 JP 2005245612 A JP2005245612 A JP 2005245612A JP 2005245612 A JP2005245612 A JP 2005245612A JP 2007056346 A5 JP2007056346 A5 JP 2007056346A5
- Authority
- JP
- Japan
- Prior art keywords
- electroless
- hydrazine
- edta
- nickel plating
- electroless nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 2
- 239000004327 boric acid Substances 0.000 claims 2
- 239000004310 lactic acid Substances 0.000 claims 2
- 235000014655 lactic acid Nutrition 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 150000002815 nickel Chemical class 0.000 claims 1
- 229940078494 nickel acetate Drugs 0.000 claims 1
- 239000006179 pH buffering agent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005245612A JP4577156B2 (ja) | 2005-08-26 | 2005-08-26 | 無電解ニッケルめっき浴およびそれを用いた無電解めっき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005245612A JP4577156B2 (ja) | 2005-08-26 | 2005-08-26 | 無電解ニッケルめっき浴およびそれを用いた無電解めっき方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007056346A JP2007056346A (ja) | 2007-03-08 |
| JP2007056346A5 true JP2007056346A5 (https=) | 2008-08-14 |
| JP4577156B2 JP4577156B2 (ja) | 2010-11-10 |
Family
ID=37920074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005245612A Expired - Fee Related JP4577156B2 (ja) | 2005-08-26 | 2005-08-26 | 無電解ニッケルめっき浴およびそれを用いた無電解めっき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4577156B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020208998A1 (ja) * | 2019-04-10 | 2020-10-15 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001192850A (ja) * | 2000-01-11 | 2001-07-17 | Ebe Katsuo | 摺動部品用表面処理液及び摺動部品の表面処理方法及び摺動部品 |
| JP2001214279A (ja) * | 2000-01-28 | 2001-08-07 | Kyocera Corp | 無電解ニッケルめっき浴 |
| EP2339050A1 (en) * | 2001-10-24 | 2011-06-29 | Rohm and Haas Electronic Materials LLC | Stabilizers for electroless plating solutions and methods of use thereof |
-
2005
- 2005-08-26 JP JP2005245612A patent/JP4577156B2/ja not_active Expired - Fee Related
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