JP2007053011A - Device for preventing electrostatic discharge, electronic component imaging apparatus, and automatic teaching device for component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for preventing electrostatic discharge or the like capable of preventing electronic components of an imaging object from the effect by the electrostatic discharge. <P>SOLUTION: The device 100 is applied to an electronic component imaging apparatus 200 in which an electronic component to be mounted on a mounting board is placed on a translucent plate 201, and the electronic component is scanned from the lower part and imaged, and equipped with a sheet-shaped or plate-shaped translucent member 101 arranged between the electronic component and the electronic component imaging apparatus 200 and transmitting reflected light from the electronic component and having conductivity on at least the electronic component side, and a frame 102 having a part conducting to the translucent member 101 on at least the electronic component side and supporting the peripheral part of the translucent member 101, and a grounding means 103 capable of grounding the translucent member. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrostatic breakdown preventing device applied to an electronic component imaging device that images an electronic component mounted on a mounting substrate, an electronic component imaging device having an antistatic function, and a component including the electronic component imaging device The present invention relates to an automatic teaching device.

  Conventionally, as a device that provides data relating to the form of an electronic component to be mounted on a component mounter that mounts the electronic component on a substrate, by processing an image obtained by imaging the electronic component, An automatic component teaching apparatus that creates component teaching data indicating characteristic dimensions (forms) has been proposed (see, for example, Patent Document 1).

The component automatic teaching device (component recognition data creation device) of Patent Document 1 includes a flat bed scanner, and generates an image of the electronic component by capturing an image of the electronic component with the flat bed scanner. Then, the component automatic teaching device extracts the body of the electronic component and the outer shape of the electrode displayed in the color image by image processing, and creates component teaching data by measuring the dimensions thereof.
JP 2004-213562 A

  However, when an electronic component is imaged by a flat bed scanner used in the automatic component teaching apparatus, the electronic component to be imaged is electrostatically broken due to discharge from the glass surface of the flat bed scanner or a resin casing. Sometimes.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electrostatic breakdown prevention device or the like that makes an imaging-symmetric electronic component less susceptible to static electricity.

  In order to achieve the above object, an electrostatic breakdown preventing device according to the present invention is an electronic device in which an electronic component mounted on a mounting board is placed on a translucent plate, and the electronic component is scanned from below to take an image. An electrostatic breakdown preventing device that is applied to a component imaging device, and is a translucent member that is disposed between the electronic component and the electronic component imaging device and transmits reflected light from the electronic component, and at least the A sheet-like or plate-like translucent member having electrical conductivity on the electronic component side, a frame body that includes at least the portion that conducts with the translucent member on the electronic component side, and supports a peripheral portion of the translucent member; And a grounding means capable of bringing the translucent member into a grounded state.

  With this configuration, the electronic component to be imaged and the electronic component imaging device are separated from each other by the electrostatic breakdown preventing device in a grounded state, so that the electronic component can be protected from electrostatic breakdown.

  Further, it is preferable that the light transmitting member is supported and retained by the frame body in a protruding state so that the light transmitting member can be in close contact with the light transmitting plate of the electronic component imaging device.

  With this configuration, the translucent member can be brought into close contact with the translucent plate of the electronic component imaging device without interference between the frame and the housing of the electronic component imaging device. It becomes possible to arrange electronic components inside.

  Moreover, it is preferable that the said translucent member is provided with a nonelectroconductive board | substrate and the transparent conductive film provided in the surface of the said board | substrate.

  With this configuration, it is possible to arbitrarily select a wide range of physical properties other than conductivity as a light-transmitting member such as rigidity and strength on the substrate, while the electrostatic breakdown prevention function is sufficient with the conductivity of the transparent conductive film. It can be secured.

  The translucent member preferably has a thickness of 2 mm or less.

  With this configuration, the electronic component can be arranged within the depth of field of the electronic component imaging device.

  In order to achieve the above object, an electronic component imaging apparatus according to the present invention is an electronic component imaging apparatus that acquires an image of an electronic component mounted on a mounting board, and irradiates means for irradiating the electronic component with light. And a light-transmitting plate that transmits the reflected light from the electronic component, the light-transmitting plate having conductivity at least on the side where the electronic component is disposed, and the electronic component that transmits the light-transmitting plate. An image pickup means for acquiring an image of the electronic component based on reflected light, and a grounding means for bringing the light-transmitting plate into a grounded state are provided.

  With this configuration, it is possible to exert the same effect as described above.

  In order to achieve the above object, an automatic component teaching apparatus according to the present invention is an automatic component teaching apparatus that creates component teaching data indicating the form of an electronic component mounted on a mounting board, and emits light to the component. An irradiating means for irradiating, a translucent plate that transmits reflected light from the component, and a translucent plate having conductivity on at least the side where the component is disposed; and transmitted light that is transmitted through the translucent plate Based on the imaging means for acquiring the image of the component, the grounding means capable of bringing the light-transmitting plate into a grounded state, and the image acquired by the imaging means, the form of the electronic component is specified and the component teaching data And a data creation means for creating the data.

  With this configuration, even when teaching data relating to the form of an electronic component is created, the electronic component can be protected from electrostatic breakdown with the same effect as described above.

  The electrostatic breakdown preventing device of the present invention can protect an electronic component from discharge from the electronic component imaging apparatus, and has versatility.

  The electronic component imaging apparatus of the present invention can prevent electrostatic breakdown of an electronic component that is an imaging target.

  According to the automatic component teaching apparatus of the present invention, it is possible to create teaching data regarding the form of an electronic component while protecting the electronic component from electrostatic breakdown.

(Embodiment 1)
Hereinafter, an electrostatic breakdown preventing device according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an electrostatic breakdown preventing device and an electronic component imaging device as an application target in an embodiment of the present invention.

  The electrostatic breakdown preventing device 100 includes a translucent member 101, a frame body 102, and a grounding means 103.

  The translucent member 101 is obtained by depositing a transparent conductive film 105 such as ITO (Indium Tin Oxide) on a glass substrate 104. In addition, the shape is slightly smaller than the shape of the translucent plate 201 provided in the electronic component imaging apparatus 200. In the present embodiment, the translucent member 101 has a thickness of 1.5 mm.

  In addition, as for the thickness of the translucent member 101, 2 mm or less is desirable. This is because the depth of field of the electronic component imaging device 200 that is an application target is about several millimeters from the surface of the light transmission plate 201, and the light transmission is considered in consideration of the three-dimensional shape (unevenness) of the electronic component that is the imaging target. This is because the thickness of the member 101 needs to be 2 mm or less.

  The light-transmitting member 101 is made of a material in which an ITO film is deposited on a glass substrate 104. The light-transmitting property and strength are borne by the glass substrate 104, and the film thickness of the deposited film is sufficiently charged. This is because the prevention effect is exhibited.

  The frame body 102 is a rectangular plate-shaped member made of aluminum, and includes a rectangular hole that can support the translucent member 101 at the center. The size of the electronic component imaging apparatus 200 can cover the entire housing 202.

  In the present embodiment, aluminum is used for the frame body 102 because it is lightweight and has an appropriate rigidity and has good workability.

  In this specification, the term “aluminum” is used to include not only aluminum but also aluminum alloys.

  The grounding means 103 is a covered conductor, and both ends are peeled off. One end of the grounding means 103 is connected to the frame body 102. On the other hand, the other end can be connected to ground.

  FIG. 2 is an enlarged cross-sectional view showing a joint portion between the translucent member 101 and the frame body 102 of the electrostatic breakdown preventing device 100 and showing a relationship with the electronic component imaging apparatus 200.

  As shown in the figure, the frame 102 has a flange 106 extending toward the hole, and the flange 106, the hole wall, and the translucent member 101 are joined with a conductive adhesive, and the frame 102 and the transparent body 101 are transparent. Conduction with the optical member 101 is achieved.

  The translucent member 101 is joined to the frame body 102 in a state of protruding from the lower surface of the frame body 102. This is because the electronic component imaging apparatus 200 is provided with the light-transmitting plate 201 in a state where the electronic component imaging apparatus 200 falls from the casing 202, and the frame body 102 of the electrostatic breakdown preventing device 100 and the casing 202 of the electronic component imaging apparatus 200 are separated. This is because the translucent member 101 and the translucent plate 201 are brought into contact without interference. In this way, unless the translucent member 101 and the translucent plate 201 are brought into contact with each other, the electronic component cannot be disposed within the depth of field, and an air layer is formed between the translucent member 101 and the translucent plate 201. This is because the image may be distorted.

  Next, a method for using the electrostatic breakdown preventing device 100 will be described.

  First, as a preparation stage, the free end of the grounding means 103 provided in the electrostatic breakdown preventing device 100 is connected to the ground. As a result, the entire electrostatic breakdown preventing device 100 is in a grounded state.

  Next, the surface from which the translucent member 101 protrudes is faced down, and the electrostatic breakdown preventing device 100 is placed on the upper surface of the electronic component imaging apparatus 200. Since the housing 202 on the upper surface of the electronic component imaging apparatus 200 is higher than the translucent plate 201, the translucent member 101 is inserted so that the protruding portion of the translucent member 101 is inserted into the hole of the housing 202. By mounting, the protrusion side wall of the translucent member 101 and the housing 202 interfere with each other, so that the electrostatic breakdown preventing device 100 does not slide off the electronic component imaging device 200.

  Thus, the preparation stage is completed. Thereafter, an electronic component may be arranged on the light transmitting member 101 of the electrostatic breakdown preventing device 100 and the electronic component may be imaged according to the function of the electronic component imaging device 200.

  With the electrostatic breakdown preventing device 100 configured as described above, the frame body 102 and the translucent member 101 can be brought into a grounded state via the grounding means 103. Therefore, it is possible to avoid the electrostatic breakdown of the electronic component placed on the electrostatic breakdown prevention tool 100. In addition, since the casing 202 of the electronic component imaging device 200 is covered with the grounded frame 102, when the operator places the electronic component, the casing 202 and the electronic component of the electronic component imaging device 200 are separated from each other. It is possible to avoid as much as possible the occurrence of electrostatic breakdown due to sudden contact.

  In the present embodiment, an ITO film is exemplified as the transparent conductive film. However, the present invention is not limited to this, and any film that has conductivity and can transmit light may be used.

  Further, although aluminum is adopted as the material of the frame body 102, a resin body provided with a conductive film may be adopted as the frame body 102.

  Further, the light transmitting member 101 employs a rigid plate material such as the glass substrate 104. However, the present invention is not limited to this, but a sheet-like member including a flexible and flexible film. It doesn't matter. Further, the translucent member 101 needs to have translucency, but it is not necessary to transmit light of all wavelengths in the visible region. If the electronic component can be imaged and its outer shape can be grasped, the predetermined wavelength region is You may employ | adopt the raw material which has the physical property which does not permeate | transmit as a translucent member.

(Embodiment 2)
Next, an electronic component imaging device according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 3 is a perspective view showing the electronic component imaging apparatus 300 according to the embodiment of the present invention.

  FIG. 4 is a cross-sectional view virtually illustrating a case where the electronic component imaging apparatus 300 is cut along the line I-I illustrated in FIG. 3.

  As shown in FIG. 3, the electronic component imaging apparatus 300 includes a light transmitting plate 301, a housing 302, and a grounding unit 303. In addition, inside the housing 302, an irradiation unit (not shown) that irradiates the electronic component on the transparent plate 301 through the transparent plate 301 and imaging based on the reflected light from the electronic component. Means (not shown) are arranged. These irradiating means and imaging means are arranged elongated along the entire short side direction of the translucent plate 301, and the translucent plate 301 is scanned by scanning these irradiating means and imaging means in the long side direction of the translucent plate 301. The upper electronic component can be imaged two-dimensionally.

  As shown in FIG. 4, the translucent plate 301 is obtained by depositing a transparent conductive film 305 such as ITO (Indium Tin Oxide) on a rectangular substrate 304 made of glass.

  The housing 302 is a resin box that can accommodate an irradiation unit, an imaging unit, and the like. The housing 302 is formed by vertically joining a frame portion 302a and a main body portion 302b. By sandwiching an edge portion of the translucent plate 301 between the frame body 302a and the main body portion 302b, A translucent plate 301 is fixed to the housing 302.

  A conductive sheet 306 made of aluminum is attached to the outer surface of the frame portion 302a. The conductive sheet 306 includes a frame portion 302 a extending toward the inside of the frame portion 302 a and an unattached portion. The light-transmitting plate 301 is sandwiched between the casing 302 and the unattached portion. In this case, the transparent conductive film 305 is disposed so as to be in close contact with the buffer material 307. By setting it as such a structure, the translucent board 301 and the upper part of the housing | casing 302 will be in a conduction | electrical_connection state.

  The grounding means 303 is a coated conductor, and the coating is peeled off at both ends. One end of the grounding means 303 is connected to a screw attached to the upper portion of the housing 302 and is electrically connected to the upper portion of the housing 302. On the other hand, the other end can be connected to ground.

  FIG. 5 is a perspective view showing an electronic component imaging apparatus 300 provided with a cover 120.

  As shown in the figure, the electronic component imaging apparatus 300 employs a cover 120 whose height can be adjusted so that an electronic component having a thickness can be imaged.

  The cover 120 is a generally rectangular plate-shaped metal cover main body 121, four support columns 123 that support the cover main body 121, and a user's turning operation to move the cover main body 121 up and down with respect to the four support columns 123. An elevating handle 124 serving as a gap adjusting means to be provided, and a stopper lever 125 for fixing the cover main body 121 to the four columns 123 by a rotation operation by the user.

  Such a cover 120 is installed such that the cover main body 121 faces the light transmitting plate 301 of the electronic component imaging apparatus 300 with a gap.

  The cover body 121 has a frame plate 121a having a substantially rectangular opening a1 formed in the center, and an opening / closing unit that is attached to the periphery of the opening a1 with a hinge so as to be opened and closed so as to close and open the opening a1 of the frame plate 121a. And a body 121b.

  Such an opening / closing body 121b includes a substantially rectangular opening / closing plate b1, a substantially U-shaped handle b2 for opening / closing the opening / closing plate b1, an air passage opening b3 provided in the opening / closing plate b1, and an electronic component. And a nozzle for holding by vacuum suction.

  FIG. 6 is a perspective view showing a state in which the opening / closing body 121b of the cover 120 is opened.

  When the user opens the opening / closing body 121b, the glass plate 112 of the scanner main body 110 can be looked into from the opening a1 of the frame plate 121a.

  Then, the user starts air suction from the tip of the nozzle b5 by driving an air suction machine or the like, adsorbs an electronic component to the tip of the nozzle b5, and then closes the opening / closing body 121b to increase the thickness. A certain electronic component can be imaged.

  With the electronic component imaging apparatus 300 having the above configuration, the surface of the translucent plate 301 and the upper part of the housing 302 facing the electronic components can be brought into a grounded state via the grounding means 303. Therefore, it is possible to avoid electrostatic breakdown of the electronic component placed on the electronic component imaging apparatus 300. In addition, when an operator places electronic components, it is possible to avoid as much as possible the occurrence of electrostatic breakdown due to sudden contact between the housing 302 of the electronic component imaging apparatus 300 and the electronic components.

  In the present embodiment, an ITO film is exemplified as the transparent conductive film. However, the present invention is not limited to this, and any film that has conductivity and can transmit light may be used.

  Further, although the case 302 is made of a material made of resin and a conductive sheet is attached to the upper surface thereof, the case 302 itself or the frame portion 302 may be made of metal.

  Further, the translucent plate 301 needs to have translucency, but it is not necessary to transmit light of all wavelengths in the visible region. If the electronic component can be imaged and its outer shape can be grasped, the predetermined wavelength region is You may employ | adopt the board | plate material which has the physical property which does not permeate | transmit as a translucent board.

(Embodiment 3)
Next, an automatic component teaching apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 7 is a configuration diagram showing the configuration of the component automatic teaching apparatus according to the embodiment of the present invention.

  The component automatic teaching apparatus A creates component teaching data indicating the form of an electronic component, that is, the shape and characteristic dimensions of the component, and the component electronic data shown in the second embodiment for imaging the component in color. The component imaging device 300, an operation unit 210 that receives an operation by a user, a display unit 230 configured by, for example, a liquid crystal display, and the electronic component imaging device 300 and the display unit 230 based on the operation received by the operation unit 210. And a control unit 220 for controlling. The control unit 220 includes a peripheral device control unit 221, an input / output processing unit 222, and an image processing unit 223.

  In response to an instruction from the peripheral device control unit 221 of the control unit 220, the electronic component imaging device 300 captures an electronic component in color and generates a color image. The electronic component imaging apparatus 300 outputs the generated color image to the image processing unit 223 of the control unit 220.

  Note that the cover used in the electronic component imaging apparatus 300 of the present embodiment is the cover 120 shown in FIG. 6, but the back surface of the opening / closing body 121b is blue or red. This is because when the electronic component is imaged using the cover 120, the background color of the electronic component is blue or red.

  The input / output processing unit 222 of the control unit 220 acquires the operation content received by the operation unit 210 and outputs the operation content to the peripheral device control unit 221 and the image processing unit 223. In addition, the input / output processing unit 222 acquires a color image generated by the electronic component imaging apparatus 300 and outputs the color image to the image processing unit 223.

  The peripheral device control unit 221 acquires the operation content received by the operation unit 210 via the input / output processing unit 222, and controls the electronic component imaging device 300 and the display unit 230 based on the operation content.

  The image processing unit 223 performs predetermined processing on the color image of the component generated by the electronic component imaging apparatus 300 to generate a black and white grayscale image in which the external shape of the component is expressed in black and white. The image is displayed on the display unit 230.

  Here, when generating a monochrome grayscale image from a color image, when the image processing unit 223 recognizes that the background of the color image is blue, the blue conversion formula X = ((R + G) / 2−B) / 2 + 128). Is used to convert the RGB value indicated by each pixel of the color image into a black and white grayscale value X of 256 gradations. Here, R represents the gray value of 256 gradations of red, G represents the gradation value of 256 gradations of green, and B represents the gradation value of 256 gradations of blue. Further, when the image processing unit 223 recognizes that the background of the color image is red, each pixel of the color image indicates by using a red conversion formula (X = ((B + G) / 2−R) / 2 + 128). The RGB value is converted into a black and white grayscale value X of 256 gradations. In this way, by converting a color image into a black-and-white gray image using a blue color conversion formula or a red color conversion formula, the contrast between the component shown in the black and white gray image and the background can be increased. Note that the image processing unit 223 may further perform an expansion process for widening the density of the black and white image. Thereby, the contrast can be further increased.

  Further, the image processing unit 223 acquires the operation content received by the operation unit 210 via the input / output processing unit 222, and based on the operation content, the component teaching data indicating the external shape and characteristic dimensions of the component is obtained. Determine creation conditions for creation. Then, the image processing unit 223 creates component teaching data from the black and white image and the creation conditions. That is, the image processing unit 223 constitutes a data creation unit.

  According to the component automatic teaching apparatus having the above configuration, it is possible to create component teaching data while avoiding electrostatic breakdown of electronic components.

  The present invention can be applied to an imaging apparatus that images an electronic component.

It is a perspective view which shows the electrostatic breakdown prevention tool in embodiment of this invention, and the electronic component imaging device which is application object. It is sectional drawing which expands and shows the junction part of the translucent member of an electrostatic breakdown prevention tool, and a frame, and shows the relationship with an electronic component imaging device. It is a perspective view which shows the electronic component imaging device in the 2nd Embodiment of this invention. It is sectional drawing which shows virtually the case where an electronic component imaging device is cut | disconnected by the II line | wire shown in FIG. It is a perspective view which shows the electronic component imaging device provided with the cover. It is a perspective view which shows the state which the opening / closing body of the cover opened. It is a block diagram which shows the function structure of a components automatic teaching apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Electrostatic destruction prevention tool 101 Translucent member 102 Frame 103 Grounding means 104 Substrate 105 Transparent conductive film 200 Electronic component imaging device 201 Translucent plate 202 Case 300 Electronic component imaging device 301 Translucent plate 302 Housing 303 Grounding unit 304 Substrate 305 Transparent conductive film 306 Conductive sheet

Claims (6)

An electrostatic breakdown preventing device applied to an electronic component imaging apparatus that mounts an electronic component mounted on a mounting substrate on a translucent plate and scans the electronic component from below to capture an image,
A translucent member that is disposed between the electronic component and the electronic component imaging device and transmits reflected light from the electronic component, and has a sheet-like or plate-like translucency having conductivity at least on the electronic component side Members,
A frame body provided at least on the electronic component side to be electrically connected to the translucent member, and supporting a peripheral portion of the translucent member;
An electrostatic breakdown preventing device comprising grounding means capable of bringing the translucent member into a grounded state.   2. The electrostatic breakdown preventing device according to claim 1, wherein the translucent member is supported by the frame body in a projecting state so as to be in close contact with the translucent plate of the electronic component imaging device. The translucent member is
A non-conductive substrate;
The electrostatic breakdown preventing device according to claim 1, further comprising a transparent conductive film provided on a surface of the substrate.   4. The electrostatic breakdown preventing device according to claim 1, wherein the translucent member has a thickness of 2 mm or less. 5. An electronic component imaging device for obtaining an image of an electronic component mounted on a mounting board,
Irradiating means for irradiating the electronic component with light;
A light-transmitting plate that transmits reflected light from the electronic component, and at least a light-transmitting plate having conductivity on the side where the electronic component is disposed;
Imaging means for acquiring an image of the electronic component based on reflected light from the electronic component that is transmitted through the translucent plate;
An electronic component imaging apparatus comprising: grounding means capable of bringing the translucent plate into a grounded state. A component automatic teaching device for creating component teaching data indicating a form of an electronic component mounted on a mounting board,
Irradiating means for irradiating the component with light;
A light-transmitting plate that transmits reflected light from the component, the light-transmitting plate having conductivity at least on the side where the component is disposed;
An imaging means for acquiring an image of the component based on transmitted light transmitted through the light transmitting plate;
A grounding unit capable of bringing the light-transmitting plate into a grounded state; and a data creating unit that identifies the form of the electronic component from the image acquired by the imaging unit and creates the component teaching data. Automatic component teaching device.

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