JP2007049211A5 - - Google Patents
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- JP2007049211A5 JP2007049211A5 JP2006319318A JP2006319318A JP2007049211A5 JP 2007049211 A5 JP2007049211 A5 JP 2007049211A5 JP 2006319318 A JP2006319318 A JP 2006319318A JP 2006319318 A JP2006319318 A JP 2006319318A JP 2007049211 A5 JP2007049211 A5 JP 2007049211A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor element
- manufacturing
- semiconductor device
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (5)
パッドを備えた半導体素子を前記半導体素子搭載部の前記半導体素子搭載領域に搭載する工程と、
外部回路への接続のためのパターンが備えられた枠状のプリント板と前記半導体素子搭載部の前記リブ部とを固定する工程と、
前記半導体素子の前記パッドと前記プリント板の前記パターンとをワイヤによって電気的に接続する工程と、
前記ワイヤ及び前記ワイヤによる接続部を樹脂によって封止成型する工程と、
を備えた半導体装置の製造方法。 Preparing a semiconductor element mounting portion comprising a recess provided with a semiconductor element mounting region, and a rib portion connected to the recess and surrounding the recess;
Mounting a semiconductor element having a pad on the semiconductor element mounting region of the semiconductor element mounting portion;
And fixing the printed board pattern is a frame-like that provided for connection to an external circuit and with said rib portion of said semiconductor element mounting portion,
A step of electrically connecting the pattern of the pad and the printed circuit board of the semiconductor device by wires,
Sealing and molding the wire and the connecting portion by the wire with a resin;
A method for manufacturing a semiconductor device comprising:
請求項１記載の半導体装置の製造方法。 A method for manufacturing a semiconductor device according to claim 1.
請求項１又は請求項２記載の半導体装置の製造方法。 A method for manufacturing a semiconductor device according to claim 1.
前記半導体装置の前記半導体素子搭載部の背面同士を同じ方向に搭載させて固定する工程と、 Mounting and fixing back surfaces of the semiconductor element mounting portions of the semiconductor device in the same direction;
を備えた半導体マルチパッケージの製造方法。 A method for manufacturing a semiconductor multi-package, comprising:
前記半導体装置の前記半導体素子搭載部の背面同士が対応するように搭載させて固定する工程と、 Mounting and fixing so that the back surfaces of the semiconductor element mounting portions of the semiconductor device correspond to each other;
を備えた半導体マルチパッケージの製造方法。 A method for manufacturing a semiconductor multi-package, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006319318A JP4369465B2 (en) | 2006-11-27 | 2006-11-27 | Semiconductor device manufacturing method and semiconductor multi-package manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006319318A JP4369465B2 (en) | 2006-11-27 | 2006-11-27 | Semiconductor device manufacturing method and semiconductor multi-package manufacturing method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09013898A Division JP3939429B2 (en) | 1998-04-02 | 1998-04-02 | Semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007049211A JP2007049211A (en) | 2007-02-22 |
| JP2007049211A5 true JP2007049211A5 (en) | 2007-04-26 |
| JP4369465B2 JP4369465B2 (en) | 2009-11-18 |
Family
ID=37851712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006319318A Expired - Fee Related JP4369465B2 (en) | 2006-11-27 | 2006-11-27 | Semiconductor device manufacturing method and semiconductor multi-package manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4369465B2 (en) |
-
2006
- 2006-11-27 JP JP2006319318A patent/JP4369465B2/en not_active Expired - Fee Related
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