JP2007043203A - Exposure apparatus, device manufacturing method using it, and stage apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve throughput and exposure precision of an exposure apparatus by eliminating displacement and vibration of a structure and a lens barrel plate which are generated by stage scan at the time of a scan exposure. <P>SOLUTION: In the exposure apparatus in which a pattern of an original is exposed to a substrate by projecting, in a slit, the pattern drawn on an original surface onto a substrate through a projection optical system and relatively scanning the original and the substrate relative to the projection optical system, a movable part, which is movable opposite to a scan direction of an original stage which holds the original, is provided, and, at the time of the scan exposure, the original stage and the movable part are made to move in synchronism with each other, along substantially the same straight line and in directions opposite to each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus used in a semiconductor manufacturing process, and more particularly to a projection exposure apparatus for projecting and transferring a reticle pattern onto a silicon wafer, and in particular, when performing reticle exposure of a reticle pattern on a wafer. The present invention relates to a scanning exposure apparatus that scans a silicon wafer and a silicon wafer in synchronization with a projection exposure system.

Conventionally, in a batch exposure type exposure apparatus (stepper), when the projection optical system is constituted by a lens, the imaging region is circular. However, since the semiconductor integrated circuit is generally rectangular, the transfer area in the case of collective exposure is a rectangular area inscribed in the imaging area of the circle of the projection optical system. Therefore, even in the largest transfer region, one side is a square of 1 / √2 of the diameter of the circle.

On the other hand, the transfer area is enlarged by scanning and moving the reticle and wafer in synchronism using the slit-shaped exposure area having the diameter of the circular image formation area of the projection optical system. A scanning exposure method (step-and-scan method) has been proposed. In this system, when a projection optical system having an imaging region of the same size is used, it is possible to perform batch exposure for each transfer region larger than a conventional stepper using a projection lens. That is, since there is no restriction by the optical system in the scanning direction, it can be ensured by the stroke of the scanning stage, and a transfer area approximately √2 times that of the conventional stepper is ensured in the direction perpendicular to the scanning direction. it can.

An exposure apparatus for manufacturing a semiconductor integrated circuit is desired to expand a transfer region and improve resolution in order to cope with manufacture of a highly integrated chip. The adoption of a smaller projection optical system is advantageous in terms of optical performance and cost, and the step-and-scan type exposure method is attracting attention as a mainstream of future exposure apparatuses.

An outline of such a step-and-scan exposure apparatus is shown in FIG. The exposure apparatus shown in FIG. 14 projects a part of the pattern of the reticle substrate 102 on the reticle stage 101 onto the wafer 6 on the wafer stage 7 via the projection optical system 12, and is relative to the projection optical system 12. The pattern of the reticle substrate 102 is projected onto the wafer 6 on the wafer stage 7 by synchronously scanning the substrate 102 and the wafer 6 in the Y direction. This is a step-and-scan type exposure apparatus that performs the scan exposure while interposing a step movement for repeatedly performing a plurality of transfer regions (shots) on the wafer 6.

As shown in detail in FIG. 15, reticle stage 101 is driven in the Y direction by linear motors 103 </ b> A, B, C, and D provided symmetrically on both sides thereof. Reference numerals 103A and 103B denote coils for driving the reticle stage 101, and reference numerals 103C and 103D denote yokes for a magnetic circuit including a magnet for applying a magnetic field to the coils 103A and 103B.

When exposure is performed by the conventional exposure apparatus described above, as shown in FIGS. 16 and 17, the reticle stage 101 starts scanning as the reticle stage 101 is moved in the Y direction (FIG. 17 (2). )), The center of gravity of the load of the reticle stage 101 is in the Y direction and is located at a dimension C from the end surface of the stage, but in a state immediately after the scanning exposure is performed and the reticle stage 101 is moved in the Y direction (FIG. 17 (3)). The position of the center of gravity of the load of the reticle stage 101 moves from the stage end face in the Y direction to the dimension position D as the stage moves. In addition, after performing scanning exposure, reticle stage 101 returns to the position shown in FIG. 17 (4) to prepare for the next exposure. That is, along with the scanning exposure, the load center of gravity of the reticle stage 101 moves between the C dimension and the D dimension in the Y direction before and after the scanning exposure, in synchronization with the above movement of the reticle stage 101, as shown in FIG. from the reticle stage 101 to the load W _C and the load W _D will apply at the position C and D with respect to structure 113 which supports the reticle stage 101. At this time, the upper surface plate of the structure 113 is displaced in the Z direction to cause a deflection deformation of the dimension ΔZ, and scanning exposure is performed with the deformation of the structure 113. As the structure 113 is deformed in this way, there is a drawback that the tilt of the reticle stage 101 and the distortion of the support system of the reduction exposure system and the entire exposure optical system are generated, and the exposure accuracy is deteriorated.

Further, when exposure is performed by a conventional exposure apparatus, thrust and reaction force are generated in the linear motor coil 103B and the yoke 103D that move the reticle stage 101 as the reticle stage 101 is scanned as shown in FIG. For example, when scanning of the reticle stage 101 is started, as shown in FIG. 18A, a thrust F _m is generated in the linear motor coil 103B (103A), and accordingly, a reaction force F _m is applied to the fixed-side yoke 103D (103C). _' Occurs. Further, the reaction force F _{m ′} generated in the yoke 103D (103C) works integrally with the structure 113 to which the yoke 103D (103C) is fixed, and reacts in the direction in which the structure 113 is moved in the −Y direction. Force is generated, and minute displacement and vibration are generated on the structure 113 and the lens barrel surface plate 11 (FIG. 14).

Here, the minute displacement and vibration act as disturbances for the scanning exposure system, and for the exposure control system that ensures stable exposure accuracy when performing synchronous scanning of the reticle stage 101 and the wafer stage 7 during scanning exposure. As a result, the control becomes unstable.

On the other hand, in the apparatus disclosed in Japanese Patent Laid-Open Nos. 3-21894 and 3-107639, a balancer that is not a reticle but moves in a direction opposite to the moving direction of the wafer stage that holds the wafer is used. A technique for reducing vibration associated with acceleration / deceleration of the wafer stage is disclosed.
JP-A-3-21894 Japanese Patent Laid-Open No. 3-107639

However, in the devices disclosed in these, the stage drive source and the balancer drive source are completely different, and further, because the drive source uses a feed screw mechanism, the size and weight of the device are increased. It has the problem of causing an increase. Further, since the axis of movement of the center of gravity of the stage and the axis of movement of the center of gravity of the balancer do not match, the reaction axes of the reaction forces of the stage and balancer do not match. For this reason, a moment force is generated between the two at the time of movement, so that there is a problem that perfect balance is difficult. These problems become more serious in the reticle stage having a higher center of gravity than the wafer stage.

In the present invention, the above conventional example is further improved, and the structure is caused by the deformation of the structure accompanying the movement of the load center of gravity of the reticle stage that occurs during the scanning of the reticle stage, and the reaction force that occurs in the linear motor fixed side yoke during the scanning exposure. A stage apparatus capable of eliminating minute displacement and vibration of the body and the lens barrel surface plate and improving the total apparatus throughput and exposure accuracy when used in an exposure apparatus, and an exposure apparatus using such a stage apparatus The purpose is to provide.

In order to achieve the above object, an exposure apparatus of the present invention projects a pattern drawn on an original surface onto a substrate in a slit shape via a projection optical system, and the original plate and the substrate are relative to the projection optical system. In the exposure apparatus that exposes the pattern of the original plate on the substrate by scanning, a movable portion that is movable in a direction opposite to the scanning direction of the original stage holding the original plate is provided, and the original stage and the movable portion are movable during scanning exposure. The parts are moved on the substantially same axis in synchronization with each other in opposite directions.

According to one embodiment of the present invention, a movable part and a driving means (dynamic damper) that move in a direction substantially coaxial with the scanning movement direction of the reticle stage, a reticle stage guide, and a fixed side yoke ( A coil support member (when a magnet is provided on the movable side) or a coil support member (when a coil is provided on the movable side) is provided.

With the above configuration, the movable portion is moved and controlled so as to cancel out the movement of the load center of gravity of the reticle stage unit and the reaction force generated on the fixed side of the linear motor, which has been a problem in the conventional example, due to the scanning of the reticle stage. However, the problem of the conventional example can be solved by acting as a dynamic damper.

As described above, at the time of scanning exposure, deformation, minute displacement and vibration of the structure of the exposure apparatus and the lens barrel surface plate due to movement of the stage for scanning the original plate can be prevented or reduced more than before, and stable. Thus, the synchronized scanning exposure can be performed, and the exposure accuracy and the throughput can be improved. In addition, since a large structure such as a reaction force caused by driving the scanning stage to escape outside the apparatus is unnecessary, the exposure apparatus can be made compact.

Examples of the present invention will be described below. FIG. 1 is a perspective view showing the appearance of an exposure apparatus according to an embodiment of the present invention, and FIG. 2R> 2 is a view schematically showing the exposure apparatus of FIG. 1 as viewed from the side.

As shown in these drawings, this exposure apparatus projects a part of a pattern of a reticle substrate 2 on a reticle stage 1 onto a wafer 6 on a wafer stage 7 via a projection optical system 12, thereby projecting the projection optical system. The pattern of the reticle substrate 2 is transferred to the wafer 6 on the wafer stage 7 by synchronously scanning the reticle substrate 2 and the wafer 6 in the Y direction relative to the substrate 12, and this synchronous scanning in the Y direction and the resulting reticle are performed. This is a step-and-scan type exposure apparatus that performs pattern transfer with respect to a plurality of transfer regions (shots) on the wafer 6 while interposing step movements for repeated transfer.

Reticle stage 1 is driven in the Y direction by linear motors 3A and 3B, X stage 7B of wafer stage 7 is driven in the X direction by a linear motor (not shown), and Y stage 7C is driven in the Y direction by a linear motor (not shown). It is supposed to be.

Further, in this embodiment, as shown in FIGS. 5 and 6, the Y stage guide of the reticle stage 1 can be moved 180 ° opposite to the scanning movement direction of the reticle stage 1, and the reticle stage 1 and A movable part 4 having a load combined with the reticle substrate 2 is provided, linear motor coils 5A and 5B are provided on both sides of the movable part 4, and the movable part 4 sharing the yokes 3C and 3D of the linear motor 3 is provided. Drive.

A position sensor 5C for detecting the position of the linear motor coil 5A in the Y direction is provided outside the linear motor coil 5A. When the reticle stage 1 scans and moves, the position of the linear motor coil 5A (that is, the position of the movable unit 4). Position) is detected by the position sensor 5C, and the position of the reticle stage 1 in the Y direction is measured by the laser interferometer 16, and the movement distance and movement speed of the reticle stage 1 and the movable part 4 are determined from the respective detection and measurement signals. It is driven while being controlled.

Referring to FIG. 1 and FIG. 2, in the synchronous scanning of reticle substrate 2 and wafer 6, reticle stage 1 and Y stage 7C are moved at a constant speed ratio in the Y direction (for example, 4: -1, “−” is reversed in direction). This is done by driving in the above. Further, the step movement in the X direction is performed by the X stage 7B. The X stage 7B is provided with a Z stage 7A for moving in the Z direction and adjusting θ around the Z axis. The wafer stage 7 is provided on a stage surface plate 8, and the stage surface plate 8 is placed horizontally with high accuracy with respect to the base frame 9. The reticle stage 1 and the projection optical system 12 are provided on a lens barrel surface plate 11, and the lens barrel surface plate 11 is supported on a base frame 9 installed on a floor or the like. The damper 10 is an active damper that actively suppresses or dampens disturbance vibration transmitted to the base frame 9 from the floor or the like. However, a passive damper may be used or may be supported without a damper.

The exposure apparatus also includes a focus sensor for detecting whether the wafer 6 on the wafer stage 7 is positioned on the focus surface of the projection optical system 12. That is, as shown in FIG. 2, the light projecting means 14 fixed to the lens barrel surface plate 11 irradiates the wafer 6 with light from an oblique direction, and the position of the reflected light is detected by the light receiving means 15. The position of the wafer surface in the optical axis direction of the projection optical system is detected.

Further, light emitted from a laser interferometer light source (not shown) is introduced into the Y-direction laser interferometer 16 for reticle stage. The light introduced into the Y-direction laser interferometer 16 is transmitted to a fixed mirror (not shown) in the laser interferometer 16 by a beam splitter (not shown) in the laser interferometer 16 and a movable mirror in the Y direction (not shown). It breaks up with the light going to (not shown). The light traveling toward the Y direction moving mirror enters the Y direction moving mirror fixed to the reticle stage 1 through the Y direction measuring optical path. The light reflected here returns again to the beam splitter in the laser interferometer through the Y-direction length measuring optical path, and is superimposed on the light reflected by the fixed mirror. The movement distance in the Y direction is measured by detecting a change in light interference at this time. Thus, the measured movement distance information is fed back to a scanning control device (not shown), and the positioning control of the scanning position of the reticle stage 1 is performed.

Further, light emitted from a laser interferometer light source (not shown) is introduced into the Y-direction laser interferometer 17 for wafer stage. The light introduced into the Y-direction laser interferometer 17 is transmitted to a fixed mirror (not shown) in the laser interferometer 17 by a beam splitter (not shown) in the laser interferometer 17 and a movable mirror in the Y direction (not shown). It breaks up with the light going to (not shown). The light traveling toward the Y-direction moving mirror is incident on the Y-direction moving mirror fixed to the wafer stage 7 through the Y-direction measuring optical path. The light reflected here returns again to the beam splitter in the laser interferometer 17 through the Y-direction measuring optical path, and is superposed on the light reflected by the fixed mirror. The movement distance in the Y direction is measured by detecting a change in light interference at this time. Thus, the measured movement distance information is fed back to a scanning control device (not shown), and positioning control of the scanning position of the wafer stage 7 is performed.

Similarly to the measurement in the Y direction, light emitted from a laser interferometer light source (not shown) is introduced into an X direction laser interferometer (not shown) for a wafer stage, and is introduced into the X direction laser interferometer. Is separated into light directed to a fixed mirror (not shown) in the laser interferometer and light directed to a moving mirror (not shown) in the X direction by a beam splitter (not shown) in the laser interferometer. The light traveling toward the X-direction moving mirror enters the X-direction moving mirror fixed to the wafer stage 7 through the X-direction measuring optical path. The light reflected here returns again to the beam splitter in the laser interferometer through the X-direction measuring optical path, and is superimposed on the light reflected by the fixed mirror. The movement distance in the X direction is measured by detecting a change in light interference at this time. Thus, the measured movement distance information is fed back to a scanning control device (not shown), and positioning control of the scanning position of the wafer stage 7 is performed.

Reference numeral 13 denotes a structure for supporting and fixing yokes 3C and 3D (stator) provided on a fixed side of a linear motor which is a driving means of the reticle stage 1, and is mounted on the lens barrel surface plate 11.

When the wafer 6 is loaded onto the wafer stage 7 through a transfer path on the front surface of the apparatus by a wafer transfer means (not shown) and predetermined alignment is completed, the exposure apparatus repeats scanning exposure and step movement while repeating the exposure on the wafer 6. The pattern of the reticle substrate 2 is exposed and transferred to a plurality of exposure areas. In scanning exposure, the reticle stage 1 and the Y stage 7C are moved at a predetermined speed ratio in the Y direction (scanning direction), and the pattern on the reticle substrate 2 is scanned with slit-shaped exposure light. By scanning the wafer 6, a pattern on the reticle substrate 2 is exposed to a predetermined exposure region on the wafer 6. During the scanning exposure, the height of the surface of the wafer 6 is measured by the focus sensor, and the height and tilt of the wafer stage 7 are controlled in real time based on the measured value to perform focus correction. When the scanning exposure for one exposure region is completed, the X stage 7B is driven in the X direction to move the wafer stepwise, thereby positioning the other exposure region with respect to the scanning exposure start position and performing the scanning exposure. It should be noted that each exposure region is configured so that a plurality of exposure regions on the wafer 6 are sequentially and efficiently exposed by a combination of the step movement in the X direction and the movement for scanning exposure in the Y direction. , The Y scanning direction to positive or negative, the exposure order to each exposure area, and the like are set.

With the above configuration, when the reticle substrate 2 and the wafer 6 are synchronously scanned on the reticle stage 1, the reticle stage 1 and the movable portion 4 move in opposite directions as shown in FIGS. 7 (1) to (4). To do. Here, FIG. 7B is the position of the reticle stage 1 and the movable part 4 at the start of scanning exposure, and the center of gravity of the load of the entire reticle stage unit is at the position of the distance A in the Y direction from the stage end. Further, as the drive current is passed through the coils 3A and 3B (movable element) of the reticle stage 1 to perform scanning exposure, the movable part 4 is also caused to flow through the coils 5A and 5B (movable element) in synchronism with the exposure. As a result, the load center of gravity of the entire reticle stage unit remains the same as the dimension of the Y-direction distance A from the end of the stage that is the same as the load center of gravity before the scanning exposure. It will be.

At this time, from the position of FIG. 7 (2) to the position of FIG. 7 (3), the center of gravity of the load is continuously unchanged in the dimension of the distance A in the Y direction from the stage end. Further, even if the reticle stage 1 is returned to the scanning start position after scanning exposure, as shown in FIG. 8 (4), the load gravity center is naturally changed continuously to the dimension of the distance A in the Y direction from the end of the stage. There is.

As described above, as shown in FIGS. 7 (1) and 10 (1), the movable portion 4 provided on the reticle stage 1 shown in the present embodiment is scanned and moved in the direction opposite to the reticle scanning direction. to no movement of the center of gravity of the load W _a of the entire reticle stage unit, a result, the conventional example a top plate 13A of the structure 13 as shown in FIG. 10 (1) (FIG. 8 (2) and 10 (2)) of Thus, the scanning exposure can be stably performed without being deformed by the movement of the load center of gravity.

With the above configuration, when the reticle substrate 2 and the wafer 6 are synchronously scanned on the reticle stage 1, the reticle stage 1 and the movable unit 4 move in opposite directions as shown in FIGS. To do. Here, FIG. 9A shows the positions of the reticle stage 1 and the movable portion 4 at the start of scanning exposure. Here, at the start of scanning, the reticle stage 1 generates _a thrust Fa in the scanning movement direction due to the drive current passed through the coils 3A and 3B provided on both sides of the reticle stage, and at the same time, is provided on the fixed side of the linear motor. A reaction force Fa _′ opposite to the thrust is generated in the yokes 3C and 3D. The coil 5A movable portion 4 is provided on both sides of the movable portion, the 5B, thrust F _d is generated in the movable portion by synchronously driving current is applied to the driving current of the reticle stage, the movable part Is moved in a direction opposite to the scanning direction of the reticle stage 1 by 180 °. At the same time, a reaction force F _{d ′} opposite to the thrust is generated in the yokes 3C and 3D provided on the fixed side of the linear motor. At this time, the reaction force F _{a ′} and the reaction force F _{d ′} generated in the linear motor yoke are generated in the opposite directions of 180 °, and the equal reaction force is generated. As a result, the reaction force generated in the yokes 3C and 3D of the linear motor becomes almost zero. Further, FIG. _9B shows the reaction force F _{b ′} similar to the reaction thrust F _b at the time of deceleration stop at the end of scanning. Also shows the anti-thrust during deceleration stop of the movable portion 4 F _e and the reaction force F _{e '.} Here again, the reaction force vectors generated in the yokes 3C and 3D at the time of deceleration stop are canceled and become zero as in the case of the start of scanning. FIG. 9 (3) shows the reaction force F _{c ′} as well as the reaction thrust F _c at the time of deceleration stop when returning to the scan start position after the end of scanning. Further, the counter thrust F _f and the counter force F _{f ′} when the movable part 4 is decelerated and stopped are shown. Here again, the reaction force vectors generated in the yokes 3C and 3D at the time of deceleration stop are canceled and become zero as in the case of the start of scanning. As described above, in the scanning exposure shown in this embodiment, unlike the conventional example, the structure 13 and the lens barrel surface plate 11 are not slightly displaced or vibrated by the reaction force generated in the yoke. Synchronous scanning exposure can be performed stably.

The movement control method of the movable part 4 shown above is shown below. FIG. 3 shows a control system configuration diagram of the movable part, and FIG. 4 shows frequency characteristics obtained by measuring the transmission rate from the reticle stage drive signal to the reticle stage yoke or the fixed part at each drive frequency. In FIG. 4, the solid line shows the case without active damper control (conventional example), and the broken line shows the case with active damper control (this example).

As shown in FIG. 3, when the reticle stage 1 (FIG. 1) moves in the scanning direction, an analog signal indicating the movement position of the reticle stage 1 in the Y direction measured by the Y-direction laser interferometer 16 for the reticle stage is obtained. The movement position analog signal is amplified by an amplifier 18, converted into a digital signal by an A / D converter 19, processed by a DSP (digital signal processor) 20, and processed as control information by a host computer 21. Based on this, the host computer 21 outputs to the DSP 20 the control information of the active damper composed of the movable part 4 and the linear motor coils 5A and 5B, and the DSP 20 calculates and outputs a digital signal which is an active damper control signal. The calculated output is further converted from a digital signal to an analog signal by the D / A converter 22, and the analog signal is amplified by the power amplifier 23 to a current value sufficient to drive the linear motor coils 5A and 5B. Then, a drive current is applied to the linear motor coils 5A and 5B so that the movable portion 4 cancels the load center of gravity movement of the stage unit that occurs with the scanning movement of the reticle stage 1 and the reaction force that occurs on the linear motor fixed side. Drive controlled.

FIG. 4 shows frequency characteristics obtained by measuring the transmission rate from the reticle stage drive signal to the reticle stage yokes 3C and 3D or the fixed portion at each drive frequency with and without the active damper control described above. Here, the curve fit shown by the solid line is the case where the active damper control is not applied, and the drive coils 3A and 3B of the reticle stage 1 are set to frequencies f ₁ , f ₂ , f ₃ , f ₄ ,. When used as an excitation source, reticle stage yokes 3C and 3D generated by the reaction force and vibration modes (primary mode, secondary mode, tertiary mode,...) Generated on the fixed side are generated. Here, the curve fit when the control by the active damper including the movable portion 4 and the linear motor coils 5A and 5B described above is applied is indicated by a broken line. As shown, the resonance peak at f ₁ g ₁ is seen that the amplitude to a peak g _{1 'by} the active damper control is held down. It is likewise held down from the resonance peaks g ₂ at f ₂ to g _{2 '.} By sufficiently widening the control band of the active damper, it becomes possible to hold down the vibration peak with the active damper up to the fifth mode (f ₅ ) as shown by the broken line in FIG.

As described above, the reaction control generated in the reticle stage unit can be canceled by performing the drive control of the active damper by detecting the scanning movement position of the reticle stage 1.

In the above description, the linear motor 3 that drives the reticle stage 1 has been described using an example in which the fixed side is a yoke and the movable side is a coil. However, a linear motor having a movable side as a magnet and a fixed side as a coil is used. Of course, the same idea as in the present embodiment can be applied. That is, in this case, the coil support member that supports the fixed coil may be shared as the magnetic circuit of the active damper.

According to the present embodiment, (1) the movable portion and the driving means (dynamic damper) that move in the direction opposite to the scanning movement direction of the reticle stage are provided, the reticle stage guide and the fixed side yoke of the magnetic circuit (the coil is provided on the movable side). ) Or a coil support member (when a magnet is provided on the movable side) is shared so that the load center of gravity of the reticle stage unit accompanying the scanning of the reticle stage has been a problem in the conventional example. The movement of the movable part is controlled so as to cancel the movement of the position and the reaction force generated on the fixed side of the linear motor, and by acting as a dynamic damper, there is no movement of the center of gravity of the entire reticle stage unit, resulting in the structure of the exposure apparatus. Stable scanning exposure without deforming the body, exposure accuracy and throughput There can be achieved the effect of improvement.

(2) Further, a movable part and a driving means (dynamic damper) that move in the direction opposite to the scanning movement direction of the reticle stage are used as a reticle stage guide and a fixed yoke of the magnetic circuit (when a coil is provided on the movable side) or A coil support member (when a magnet is provided on the movable side) is provided so as to share the counter force vector of the reaction force generated in the linear motor yoke, and the exposure apparatus structure and There is no need to give a minute displacement or vibration to the lens barrel surface plate, so that stable synchronous scanning exposure is possible, and the effect of improving the exposure accuracy and the throughput of the apparatus can be obtained.

(3) Furthermore, since the driving reaction force generated when the reticle stage is moved is canceled inside the stage, a large structure such as releasing the reaction force to the outside of the apparatus becomes unnecessary, so that the exposure apparatus is made compact. It becomes possible.

In the above embodiment, the movable portion that moves in the opposite direction to the scanning direction of the reticle stage and moves as a dynamic damper is moved by a guide guide coaxial with the reticle stage, and the driving means is driven by the same yoke. In addition, as shown in FIG. 11 (1), movable parts 4A and 4B each having guide guides 3G and 3H on the outside are provided in parallel so that the linear motor yokes 3E and 3F of the reticle stage 1 are shared. It is good. Even in this configuration, when the reticle stage 1 and the movable parts 4A and 4B are scanned and moved, the load center of gravity of the stage unit moves from the position of the dimension E from the stage end surface as shown in FIGS. 11 (2) and 11 (3). And scanning exposure can be performed. Further, when the reticle stage 1 starts scanning, a drive current flows through the drive coils 3A and 3B of the reticle stage 1, and thrusts _Fi and _Fg are generated for the respective coils. The linear motor yokes 3E and 3F simultaneously Reaction forces F _{i ′} and F _{g ′} are generated. The movable portion 4A in a direction opposite to the reticle stage 1, a current coil 5C to drive the 4B, the thrust F _h on the flow respective coils 5D, F _j is generated at the same time the linear motor yokes 3E, the to 3F reaction force F F _{h ′} and F _{j ′ of the same} magnitude as _{i ′} and F _{g ′} are generated. Therefore, the sum of the reaction force vectors generated in the linear motor yokes 3E and 3F is canceled out, and the generation of the reaction force is almost zero. As described above, an effect substantially equal to that of the above-described embodiment can be obtained.

(Example of device production method)
Next, an embodiment of a device manufacturing method using the above-described exposure apparatus or exposure method will be described.

FIG. 12 shows a flow of manufacturing a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.).
In step 1 (circuit design), a device pattern is designed.
In step 2 (mask production), a mask on which the designed pattern is formed is produced.
On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass.
Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer.
The next step 5 (assembly) is referred to as a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, such as an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including.
In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test.
Through these steps, the semiconductor device is completed and shipped (step 7).

FIG. 13 shows a detailed flow of the wafer process.
In step 11 (oxidation), the wafer surface is oxidized.
In step 12 (CVD), an insulating film is formed on the wafer surface.
In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition.
In step 14 (ion implantation), ions are implanted into the wafer.
In step 15 (resist process), a resist is applied to the wafer.
In step 16 (exposure), the circuit pattern of the mask is arranged in a plurality of shot areas on the wafer and printed by exposure using the above-described exposure apparatus or exposure method.
In step 17 (development), the exposed wafer is developed.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. If the production method of the present embodiment is used, a large-sized device that has been difficult to manufacture can be manufactured at low cost.

1 is an overall perspective view of an exposure apparatus according to an embodiment of the present invention. It is a whole side view of the apparatus of FIG. It is a control system circuit diagram of the movable part of the apparatus of FIG. It is a reticle stage frequency characteristic diagram in FIG. It is a perspective view of the reticle stage in FIG. FIG. 2 is a top view of the reticle stage in FIG. 1. FIG. 2 is a side view of the reticle stage in FIG. 1. FIG. 2 is a gravity center view of the reticle stage in FIG. 1. FIG. 2 is a thrust and reaction force instruction diagram of the reticle stage in FIG. 1. It is a structure side view of the exposure apparatus of FIG. It is a reticle stage figure concerning other examples of the present invention. It is a figure which shows the flow of manufacture of a microdevice. It is a figure which shows the detailed flow of the wafer process in FIG. It is a general view of the conventional exposure apparatus. It is a perspective view of the reticle stage of the exposure apparatus of FIG. It is a top view of the reticle stage of the exposure apparatus of FIG. FIG. 15 is a load gravity center diagram of the reticle stage of the exposure apparatus of FIG. 14. FIG. 15 is a diagram illustrating thrust and reaction force instruction of the reticle stage of the exposure apparatus of FIG. 14.

Explanation of symbols

1: reticle stage, 2: reticle substrate, 3A, 3B: coil, 3C, 3D: yoke, 4: movable part, 5A, 5B: coil, 6: wafer, 7: wafer stage, 7A: Z stage, 7B, 7C : Linear motor, 8: Stage platen, 9: Base frame, 10: Damper, 11: Lens barrel platen, 12: Projection optical system, 13: Structure, 14: Light projecting means, 15: Light receiving means, 16: Y-direction laser interferometer for reticle stage, 17: Y-direction laser interferometer for wafer stage, 18: amplifier, 19: A / D converter, 20: DSP (digital signal processor), 21: host computer, 22: D / A Converter, 23: Power amplifier, 101: Reticle stage, 102: Reticle substrate, 103A, 103B: Coil, 103C, 103D: Yoke, 11 : Structure.

Claims (6)

The pattern drawn on the original plate surface is projected onto the substrate in a slit shape through the projection optical system, and the original plate pattern is exposed to the substrate by scanning the original plate and the substrate relative to the projection optical system. In the exposure apparatus, a movable part is provided that is movable in a direction opposite to the scanning direction of the original stage holding the original, and the original stage and the movable part are synchronized with each other on the same axis in the opposite directions during scanning exposure. An exposure apparatus characterized by being moved. 2. An exposure apparatus according to claim 1, further comprising means for detecting acceleration or position in the scanning direction of the original plate, wherein the original stage and the movable portion are driven and controlled by a detection signal from the detection means. 3. An exposure apparatus according to claim 1, wherein the original stage and the movable portion are guided by a common guide guide and are moved synchronously on the same axis of the guide guide. 4. The exposure apparatus according to claim 1, wherein each of the original stage and the movable portion is driven by a linear motor having a common stator . 5. The exposure apparatus according to claim 1, wherein the original stage and the movable part are each driven by a linear motor, and the linear motor is disposed on both sides of the drive shaft. A device manufacturing method comprising: manufacturing a device by a step of preparing and exposing the exposure apparatus according to claim 1.

Images