JP2007043188A - Power module, manufacturing method therefor, and air conditioner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power module which can be manufactured at a low cost. <P>SOLUTION: The power module 5F comprises a power semiconductor 53a, a non-power semiconductor 53b, a sheet of resin substrate 51F, and a cooling jacket 58F. The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling jacket has a first plate part and a second plate part. The second plate part is so protruded toward the resin substrate side than the first plate part along a plate thickness direction of the first plate part as to contact to at least the rear side surface of a mounting surface for the power semiconductor out of the resin substrate, and a cooling fluid channel 59 is provided inside the second plate part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a power module that performs power conversion and a manufacturing method thereof. The present invention also relates to an air conditioner equipped with a power module.

In general, a power module mainly includes a power semiconductor mounting board on which a chip with relatively large heat generation such as a power semiconductor is mounted, a non-power semiconductor mounting board on which an IC chip with relatively small heat generation such as a microcomputer is mounted, And a cooling unit (for example, a heat radiating fin) for cooling the power semiconductor (see, for example, Patent Document 1).
JP 2004-116619 A

  By the way, normally, since it is necessary to discharge a large amount of heat generated from the power semiconductor to the outside of the system, a power semiconductor mounting substrate is made of aluminum or ceramic having high thermal conductivity. On the other hand, as the non-power semiconductor mounting substrate, since a semiconductor having a large calorific value such as a power semiconductor is not mounted, a substrate made of a resin such as a glass fiber reinforced epoxy resin is used. Usually, a mounting board made of aluminum or ceramic is more expensive than a mounting board made of resin, which is a major cause of increasing the cost of the power module. Further, separately mounting the power semiconductor and the non-power semiconductor on the two types of mounting substrates leads to an increase in labor costs and equipment costs when manufacturing the power module.

  The subject of this invention is providing the power module which can hold down manufacturing cost low.

  A power module according to a first invention includes a power semiconductor, a non-power semiconductor, a single resin substrate, and a cooling jacket. Here, the “power semiconductor” refers to, for example, a diode and a power transistor. Further, the “non-power semiconductor” referred to here is, for example, a microcomputer, a ROM (Read Only Memory), or the like. In addition, the “resin substrate” referred to here is, for example, a substrate manufactured only from a resin, a substrate manufactured from a fiber reinforced plastic, a substrate manufactured from a resin in which powder or the like is dispersed, and the like. It is a substrate on which a circuit pattern is formed on one side or inside. Incidentally, among such resin substrates, there are a double-sided resin substrate in which circuit patterns are formed on both sides, a laminated resin substrate in which a plurality of circuits are alternately laminated with insulating layers (resin layers) in the thickness direction, and the like. Particularly preferred. The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both a power semiconductor and a non-power semiconductor are mounted on the resin substrate. The cooling jacket has a first plate portion and a second plate portion. The second plate portion protrudes toward the resin substrate from the first plate portion along the thickness direction of the first plate portion so as to be in contact with at least the back side surface of the mounting surface of the power semiconductor in the resin substrate, and the cooling fluid is internally contained therein. A passage is provided.

  In a power module in which heat generated from a power semiconductor is discharged by a heat radiating fin, the heat generated from the power semiconductor is usually generated by supplying air to the heat radiating fin at a temperature of several tens of degrees Celsius or higher. It is discharged outside. When such a heat dissipation method is employed, in a power module, in order to ensure sufficient heat dissipation, a substrate having high thermal conductivity such as an aluminum substrate or a ceramic substrate is required as a substrate on which a power semiconductor is mounted. .

  However, if the cooling means of the power module according to the present invention uses, for example, a cooling medium having a temperature lower than usual (which may be gas or liquid), etc., a low thermal conductive resin as a power semiconductor mounting substrate Even when the substrate is employed, the heat generated from the power semiconductor can be sufficiently discharged from the power module. Of course, the temperature of the cooling medium at this time needs to be appropriately changed depending on the amount of heat generated from the power semiconductor and the thickness of the resin substrate. Under such a premise, in this power module, it is possible to mount the power semiconductor and the non-power semiconductor on one resin substrate. Therefore, in this power module, it is not necessary to employ an expensive aluminum substrate or ceramic substrate as a substrate on which the power semiconductor is mounted. As a result, in manufacturing the power module, the raw material cost of the base material, the labor cost, the equipment cost, and the like can be reduced. For this reason, this power module can be manufactured at a low manufacturing cost. In this power module, a space is formed between the first plate portion and the resin substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  The power module according to the second invention is the power module according to the first invention, further comprising temperature detecting means and temperature control means. The temperature detecting means detects the temperature of the power semiconductor or the vicinity thereof. The temperature control means controls the temperature of the cooling fluid so that the temperature detected by the temperature detection means becomes a predetermined temperature.

  In this power module, the temperature detecting means detects the temperature of the power semiconductor or the vicinity thereof. Then, the temperature control means controls the temperature of the cooling fluid so that the temperature detected by the temperature detection means becomes a predetermined temperature. For this reason, in this power module, the temperature of the cooling fluid can be appropriately maintained.

  A power module according to a third invention is the power module according to the first invention or the second invention, wherein the shortest distance between the power semiconductor and the cooling fluid passage is the shortest distance between the non-power semiconductor and the cooling fluid passage. Shorter than distance.

  In this power module, the shortest distance between the power semiconductor and the cooling fluid passage is shorter than the shortest distance between the non-power semiconductor and the cooling fluid passage. For this reason, in this power module, the heat generated from the power semiconductor can be efficiently discharged out of the power module than the heat generated from the non-power semiconductor.

  A power module according to a fourth aspect of the present invention is the power module according to any one of the first to third aspects of the present invention, wherein the portion of the resin substrate where the power semiconductor is mounted is the thickness of the portion where the non-power semiconductor is mounted. Thinner than.

  In this power module, the thickness of the portion where the power semiconductor is mounted in the resin substrate is thinner than the thickness of the portion where the non-power semiconductor is mounted. For this reason, in this power module, the power semiconductor is closer to the cooling fluid passage than the non-power semiconductor. Therefore, in this power module, heat generated from the power semiconductor can be efficiently discharged out of the power module rather than heat generated from the non-power semiconductor. Further, since the non-power semiconductor is arranged in a different level from the power semiconductor, it is less likely to be affected by heat generated from the power semiconductor.

  A power module according to a fifth aspect of the present invention is the power module according to the fourth or fifth aspect of the present invention, wherein the resin substrate is composed of a plurality of stacked unit bodies stacked in the thickness direction. Moreover, the thickness of the part which mounts a power semiconductor and the thickness of the part which mounts a non-power semiconductor are adjusted with the shape of each lamination | stacking unit body.

  In this power module, the resin substrate is composed of a plurality of laminated units that are laminated in the thickness direction. Moreover, the thickness of the part which mounts a power semiconductor and the thickness of the part which mounts a non-power semiconductor are adjusted with the shape of each lamination | stacking unit body. For this reason, in this power module, it is possible to manufacture a resin substrate having a complicated shape without performing complicated machining.

  A power module according to a sixth aspect of the present invention is the power module according to any one of the first to fifth aspects of the present invention, further comprising a heat diffusion part. The thermal diffusion part is for diffusing at least heat generated from the power semiconductor. Here, the “thermal diffusion part” is, for example, a heat spreader, thermal via, thermal conductive filler, thermal conductive sheet, or the like.

  The power module further includes a heat diffusion unit. For this reason, in the power module, heat generated from the power semiconductor can be more efficiently discharged out of the system of the power module.

  A power module according to a seventh aspect is the power module according to the sixth aspect, further comprising an electrical insulating layer. The electrical insulating layer is disposed between the heat diffusion portion and the cooling fluid passage. The “electrical insulating layer” mentioned here may be an electric insulating sheet, an adhesive, or a part of the resin layer of the multilayer resin substrate.

  In this power module, the electrical insulating layer is disposed between the heat diffusion portion and the cooling fluid passage. For this reason, in this power module, discharge can be effectively prevented.

  A power module according to an eighth aspect is the power module according to the sixth aspect or the seventh aspect, wherein the heat diffusion part includes a heat spreader. The heat spreader is disposed between the power semiconductor and the mounting surface of the resin substrate.

  In this power module, the heat spreader is disposed between the power semiconductor and the mounting surface of the resin substrate. For this reason, in this power module, the heat which arises from a power semiconductor can be processed efficiently.

  A power module according to a ninth aspect is the power module according to any one of the sixth to eighth aspects, wherein the thermal diffusion portion includes a thermal via. The thermal via is provided inside the resin substrate along a direction intersecting the plate surface of the resin substrate. The thermal via is preferably provided in a direction orthogonal to the plate surface of the resin substrate.

  In this power module, the thermal via is provided inside the resin substrate along the direction intersecting the plate surface of the resin substrate. For this reason, in this power module, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  A power module according to a tenth aspect of the present invention is the power module according to any of the sixth to ninth aspects of the present invention, wherein the thermal diffusion portion includes a thermally conductive filler. The thermally conductive filler is dispersed and blended in the resin portion of the resin substrate. Here, the “thermally conductive filler” is, for example, ceramic powder having insulating properties.

  In this power module, the heat conductive filler is dispersed and blended in the resin portion of the resin substrate. For this reason, in this power module, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  A power module according to an eleventh aspect of the invention is a power module according to the sixth aspect of the invention or the seventh aspect of the invention, wherein the heat diffusion portion includes a heat conductive sheet. The thermally conductive sheet is embedded in the resin portion of the resin substrate. The “thermally conductive sheet” referred to here is, for example, an insulating ceramic plate.

  In this power module, the heat conductive sheet is embedded in the resin portion of the resin substrate. For this reason, in this power module, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  A power module according to a twelfth aspect includes a power semiconductor, a non-power semiconductor, a single mounting board, and a cooling jacket. Here, the “power semiconductor” refers to, for example, a diode and a power transistor. Further, the “non-power semiconductor” referred to here is, for example, a microcomputer, a ROM (Read Only Memory), or the like. In addition, the “mounting substrate” referred to here is, for example, a substrate manufactured only from a resin, a substrate manufactured from a fiber reinforced plastic, a substrate manufactured from a resin in which powder or the like is dispersed, and the like. It is a substrate on which a circuit pattern is formed on one side or inside. Incidentally, among such resin substrates, there are a double-sided resin substrate in which circuit patterns are formed on both sides, a laminated resin substrate in which a plurality of circuits are alternately laminated with insulating layers (resin layers) in the thickness direction, and the like. Particularly preferred. The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both a power semiconductor and a non-power semiconductor are mounted on the mounting substrate. The thermal conductivity in the plate thickness direction of the mounting substrate is 10 W / (m · K) or less. The cooling jacket has a first plate portion and a second plate portion. The second plate portion projects from the first plate portion toward the mounting substrate side along the thickness direction of the first plate portion so as to contact at least the back side of the mounting surface of the power semiconductor in the mounting substrate, and is cooled inside. A fluid passage is provided.

  In a power module in which heat generated from a power semiconductor is discharged by a heat radiating fin, the heat generated from the power semiconductor is usually generated by supplying air to the heat radiating fin at a temperature of several tens of degrees Celsius or higher. It is discharged outside. When such a heat dissipation method is employed, in a power module, in order to ensure sufficient heat dissipation, a substrate having high thermal conductivity such as an aluminum substrate or a ceramic substrate is required as a substrate on which a power semiconductor is mounted. .

  However, if the cooling means of the power module according to the present invention uses, for example, a cooling medium (gas or liquid) having a temperature lower than usual, the thermal conductivity is 10 W as a power semiconductor mounting substrate. Even when a low thermal conductive mounting substrate of / (m · K) or less is employed, the heat generated from the power semiconductor can be sufficiently discharged from the power module. Of course, the temperature of the cooling medium at this time needs to be changed depending on the amount of heat generated from the power semiconductor and the thickness of the mounting substrate. Based on this premise, in this power module, it is possible to mount a power semiconductor and a non-power semiconductor on a single low thermal conductivity mounting board. Usually, low thermal conductivity mounting substrates with a thermal conductivity of 10 W / (m · K) or less are manufactured from resins, fiber reinforced plastics, etc., and abundantly cheaper than aluminum substrates and ceramic substrates. Exists. Therefore, in the production of this power module, the raw material cost of the base material, the labor cost, the equipment cost, etc. can be reduced. For this reason, this power module can be manufactured at a low manufacturing cost. In this power module, a space is formed between the first plate portion and the mounting substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  An air conditioner according to a thirteenth aspect includes a refrigerant circuit and a power module. The power module has a power semiconductor, a non-power semiconductor, a single resin substrate, and a cooling jacket. The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both a power semiconductor and a non-power semiconductor are mounted on the resin substrate. The cooling jacket has a first plate portion and a second plate portion. The second plate portion projects from the first plate portion toward the resin substrate along the thickness direction of the first plate portion so as to be in contact with at least the back side surface of the power semiconductor mounting surface of the resin substrate. The cooling jacket is provided with a cooling fluid passage for allowing the refrigerant flowing through the refrigerant circuit to pass therethrough.

  Usually, an air conditioner employs a power module of a type that discharges heat generated from a power semiconductor by means of a radiating fin. In such a power module, in general, the temperature of the air or a temperature of several tens of degrees Celsius is higher than that. The heat generated from the power semiconductor by being supplied to the radiating fins is discharged out of the system of the power module. When such a heat dissipation method is employed, in a power module, in order to ensure sufficient heat dissipation, a substrate having high thermal conductivity such as an aluminum substrate or a ceramic substrate is required as a substrate on which a power semiconductor is mounted. .

  However, there are places where the refrigerant temperature is sufficiently low in the refrigerant circuit of the air conditioner, and if such a refrigerant can flow through the refrigerant passage of the power module, a low thermal conductive resin substrate can be used as a power semiconductor mounting substrate. Even if it is adopted, heat generated from the power semiconductor can be sufficiently discharged from the power module. Of course, the temperature of the cooling medium at this time depends on the amount of heat generated from the power semiconductor and the thickness of the resin substrate. Under this premise, in the power module of this air conditioner, it is possible to mount the power semiconductor and the non-power semiconductor on one resin substrate. Therefore, in the power module of this air conditioner, it is not necessary to employ an expensive aluminum substrate or ceramic substrate as a substrate on which the power semiconductor is mounted. As a result, in manufacturing the power module, the raw material cost of the base material, the labor cost, the equipment cost, and the like can be reduced. For this reason, this power module can be manufactured at a low manufacturing cost. If it pulls, the manufacturing cost of an air conditioner can also be reduced. In this power module, a space is formed between the first plate portion and the resin substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  A power module manufacturing method according to a fourteenth aspect of the present invention includes a power semiconductor and a non-power semiconductor that constitute a power circuit for performing power conversion, a single resin substrate on which both the power semiconductor and the non-power semiconductor are mounted, The first plate portion and the resin substrate protrude from the first plate portion toward the resin substrate side along the thickness direction of the first plate portion so as to be in contact with at least the back side of the mounting surface of the power semiconductor. A method of manufacturing a power module having a cooling jacket having a second plate portion provided with a fluid passage, comprising a power semiconductor fixing step, a wire connecting step, a non-power semiconductor connecting step, and a cooling means fixing step. In the power semiconductor fixing step, the power semiconductor is fixed at a predetermined position on the resin substrate. In the wire connection step, the power semiconductor and the circuit provided on the resin substrate are wire-connected. In the non-power semiconductor connection step, the non-power semiconductor and the circuit are connected. In this non-power semiconductor connection step, it is preferable to adopt a reflow method. In the cooling jacket fixing step, the resin substrate is fixed to the cooling jacket. The power semiconductor fixing step, the wire connecting step, the non-power semiconductor connecting step, and the cooling jacket fixing step may be interchanged as appropriate.

  In this power module manufacturing method, the power semiconductor is fixed at a prescribed position on the resin substrate in the power semiconductor fixing step. In the wire connection step, the power semiconductor and the circuit provided on the resin substrate are wire-connected. In the non-power semiconductor connection step, the non-power semiconductor and the circuit are connected. In the cooling jacket fixing step, the resin substrate is fixed to the cooling jacket. For this reason, in this power module manufacturing method, the power semiconductor and the non-power semiconductor are mounted on one resin substrate. Therefore, if this power module manufacturing method is used, the raw material cost, labor cost, equipment cost, etc. of the base material can be reduced.

  The power module according to the first invention can be manufactured at a low manufacturing cost. In this power module, a space is formed between the first plate portion and the resin substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  In the power module according to the second invention, the temperature of the cooling fluid can be appropriately maintained.

  In the power module according to the third invention, heat generated from the power semiconductor can be efficiently discharged out of the power module than heat generated from the non-power semiconductor.

  In the power module according to the fourth aspect of the present invention, heat generated from the power semiconductor can be efficiently discharged out of the power module than heat generated from the non-power semiconductor. Further, since the non-power semiconductor is arranged in a different level from the power semiconductor, it is less likely to be affected by heat generated from the power semiconductor.

  In the power module according to the fifth aspect of the present invention, it is possible to manufacture a resin substrate having a complicated shape without performing complicated machining.

  In the power module according to the sixth aspect of the present invention, the heat generated from the power semiconductor can be more efficiently discharged out of the system of the power module.

  In the power module according to the seventh aspect of the invention, discharge can be effectively prevented.

  In the power module according to the eighth invention, heat generated from the power semiconductor can be efficiently processed.

  In the power module according to the ninth aspect, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  In the power module according to the tenth aspect, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  In the power module according to the eleventh aspect, the thermal conductivity inside the resin substrate can be increased. Therefore, in this power module, the heat generated from the power semiconductor can be more efficiently discharged out of the power module.

  The power module according to the twelfth invention can be manufactured at a low manufacturing cost. In this power module, a space is formed between the first plate portion and the mounting substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  The air conditioner according to the thirteenth aspect of the present invention can be manufactured at a low manufacturing cost. In this power module, a space is formed between the first plate portion and the resin substrate. For this reason, in this power module, a non-power semiconductor can be arranged in the space. Therefore, this power module can be made compact.

  In the power module manufacturing method according to the fourteenth aspect of the present invention, the power semiconductor and the non-power semiconductor are mounted on one resin substrate. Therefore, if this power module manufacturing method is used, the raw material cost, labor cost, equipment cost, etc. of the base material can be reduced.

[Overall configuration of air conditioner]
In FIG. 1, the external appearance perspective view of the air conditioner 1 which concerns on this Embodiment is shown.

  The air conditioner 1 includes a wall-mounted indoor unit 2 that is attached to an indoor wall surface, and an outdoor unit 3 that is installed outdoors.

  An indoor heat exchanger is housed in the indoor unit 2, and an outdoor heat exchanger is housed in the outdoor unit 3, and each heat exchanger is connected by a refrigerant pipe 4 to form a refrigerant circuit. Yes.

[Outline of configuration of refrigerant circuit of air conditioner]
The structure of the refrigerant circuit of the air conditioner 1 is shown in FIG. This refrigerant circuit mainly includes an indoor heat exchanger 20, an accumulator 31, a compressor 32, a four-way switching valve 33, an outdoor heat exchanger 30, and an electric expansion valve 34.

  The indoor heat exchanger 20 provided in the indoor unit 2 performs heat exchange with the air that comes into contact therewith. Further, the indoor unit 2 is provided with a cross flow fan 21 for sucking room air and passing the air through the indoor heat exchanger 20 to discharge the air into the room. The cross flow fan 21 is configured in a cylindrical shape, and is provided with blades in the direction of the rotation axis on the peripheral surface, and generates an air flow in a direction intersecting with the rotation axis. The cross flow fan 21 is rotationally driven by an indoor fan motor 22 provided in the indoor unit 2.

  The outdoor unit 3 is connected to a compressor 32, a four-way switching valve 33 connected to the discharge side of the compressor 32, an accumulator 31 connected to the suction side of the compressor 32, and a four-way switching valve 33. An outdoor heat exchanger 30 and an electric expansion valve 34 connected to the outdoor heat exchanger 30 are provided. The electric expansion valve 34 is connected to the pipe 41 via the filter 35 and the liquid closing valve 36, and is connected to one end of the indoor heat exchanger 20 via the pipe 41. The four-way switching valve 33 is connected to the pipe 42 via the gas closing valve 37 and is connected to the other end of the indoor heat exchanger 20 via the pipe 42. The pipes 41 and 42 correspond to the refrigerant pipe 4 in FIG. Further, the outdoor unit 3 is provided with a propeller fan 38 for discharging the air after heat exchange in the outdoor heat exchanger 30 to the outside. The propeller fan 38 is rotationally driven by a fan motor 39. The refrigerant circuit is also connected to a cooling jacket 58 (see FIG. 3) provided in a power module 5 (described later) that performs power conversion, such as the compressor 32, the fan motor 39, and the electric expansion valve 34.

[Configuration of power module]
FIG. 3A shows a longitudinal sectional view of the power module 5 according to the present embodiment.

  The power module 5 according to the present embodiment mainly includes a casing 50, a first electronic component 53a, a second electronic component 53b, a mounting substrate 51, and a cooling jacket 58.

  The casing 50 includes a side wall 50a erected on the mounting surface side of the electronic components 53a and 53b from the side edge of the mounting substrate 51, and a lid 50b provided so as to cover the top of the electronic components 53a and 53b from the upper end of the side wall 50a. Consists of

  The first electronic component 53a is a so-called power semiconductor (including a bare chip) that generates a large amount of heat when energized. In the present embodiment, the power semiconductor refers to, for example, a diode and a power transistor.

  The second electronic component 53b is a so-called non-power semiconductor or other electronic components (surface mounted components such as capacitors and resistors). In the present embodiment, the non-power semiconductor means, for example, a microcomputer, a ROM, or the like (including a bare chip).

The mounting substrate 51 mainly includes an area where the first electronic component 53a is mounted (hereinafter referred to as a first mounting area) and an area where the second electronic component 53b is mounted (hereinafter referred to as a second mounting area). Become. The first mounting area is formed of a one-ply sheet-like glass fiber reinforced epoxy resin (hereinafter referred to as a glass epoxy sheet) 51a, and its thickness is about 100 μm. Incidentally, this thickness is a value calculated in consideration of keeping the first electronic component 53a at 100 ° C. or less, assuming that the heat generation amount from the first electronic component 53a is 40 W, the heat generation area is 4 cm ² (FIG. 4). reference). In the first mounting area, the first electronic component 53a is mounted on a one-ply glass epoxy sheet 51a via a heat spreader 54 and a conductor, and is further sealed with a sealant such as a silicone gel 56. On the other hand, the second mounting area is formed of a laminated resin substrate in which the conductor pattern 52 and the glass epoxy sheet 51a are alternately laminated. In the second mounting area, the second electronic component 53b is mounted on the laminated resin substrate, and the second electronic component 53b is connected to the conductor pattern 52 disposed between the glass epoxy sheets 51a and has a three-dimensional shape. The complicated control circuit is formed. The first electronic component 53a is also connected to the conductor pattern 52 via the wire 55, and a part of the power supply circuit is formed. The lead 57 is used for connection to an external circuit. Incidentally, in order to form the mounting substrate 51 according to the present embodiment, (i) after preparing a uniform plate-shaped laminated mounting substrate, the thickness of the first mounting area of the mounting substrate 51 is reduced by machining. Method (circuit pattern must be formed in consideration of machining), or (ii) glass fiber fabrics are formed one by one so that the mounting substrate has a pre-designed shape, and the n-th stage glass After impregnating the epoxy resin stock solution into the fiber woven fabric, heating and compressing them, and then forming a circuit pattern on both sides or one side (hereinafter, this glass fiber reinforced epoxy resin is referred to as a circuit pattern holding glass epoxy sheet), Further, after that, the (n + 1) -th stage glass fiber fabric impregnated with the epoxy resin stock solution is sandwiched between the circuit pattern holding glass epoxy sheets and added again. Such as, how to compression is considered. In the latter case, a mold that conforms to the design shape is required.

  The cooling jacket 58 is a rectangular parallelepiped metal box, and is provided on the opposite side of the mounting surface of the electronic components 53 a and 53 b of the mounting substrate 51 so as to contact the surface opposite to the mounting surface of the mounting substrate 51. . In the cooling jacket 58, a plurality of hairpin-shaped passages (hereinafter referred to as refrigerant passages) 59 are formed in a portion corresponding to the first mounting area (see FIG. 3B). As shown in FIG. 2, the refrigerant passage 59 is connected to the refrigerant circuit so as to sandwich the electric expansion valve 34. For this reason, liquid refrigerant flows into the refrigerant passage 59 from the refrigerant circuit, and heat generated mainly from the first electronic component 53a is discharged from the power module 5 by the liquid refrigerant. . In general, the temperature of the liquid refrigerant flowing into the refrigerant passage is about 30 to 60 ° C.

[Manufacturing method of power module]
Here, the manufacturing method of the power module 5 which concerns on embodiment of this invention using FIG. 5 is demonstrated.

  In FIG. 5, in step S1, the first electronic component 53a and the heat spreader 54 are bonded. In step S <b> 2, the bonded product of the first electronic component 53 a and the heat spreader 54 obtained in step S <b> 1 is bonded to the first mounting area of the mounting substrate 51. At this time, the bonding product is bonded so that the heat spreader 54 is in close contact with the mounting substrate 51. In step S3, the first electronic component 53a and the conductor pattern 52 of the mounting substrate 51 are bonded via a wire. In step S4, the second electronic component 53b is heated to a predetermined temperature in a state where the second electronic component 53b is placed at a predetermined position of the conductor pattern 52, and the second electronic component 53b is soldered to the conductor pattern 52 by the reflow method. Note that a reflowable material (such as cream solder) is printed or applied on the conductor pattern 52 in advance. In step S5, the lead component 53c (included in the second electronic component 53b) is soldered to the conductor pattern 52 by the flow method.

[Features of the power module]
(1)
In the power module 5 according to the present embodiment, both the first electronic component 53a and the second electronic component 53b are mounted on the same mounting substrate 51 made of glass fiber reinforced epoxy resin. For this reason, the power module 5 can be manufactured at a lower cost than the conventional power module in which the mounting board for the first electronic component 53a and the mounting board for the second electronic component 53b are separately manufactured. it can.

(2)
In the power module 5 according to the present embodiment, the thickness of the first mounting area of the mounting substrate 51 is sufficiently thin, and the first electronic component 53a is effectively cooled by the coolant of approximately 50 ° C. Therefore, the power module 5 can be manufactured at a lower cost than a conventional power module that employs an aluminum substrate, a ceramic substrate, or the like for mounting the first electronic component 53a. Moreover, in this power module 5, since the mounting board | substrate 51 consists of glass fiber reinforcement epoxy resins, it is excellent in workability rather than the above conventional power modules. Moreover, in this power module 5, since the mounting substrate 51 is made of glass fiber reinforced epoxy resin, the mounting reliability of the first electronic component 53a is superior to the conventional power module as described above.

(3)
In the power module 5 according to the present embodiment, the shortest distance between the first electronic component 53a and the refrigerant passage 59 is shorter than the shortest distance between the second electronic component 53b and the refrigerant passage 59. For this reason, in this power module 5, heat generated from the power semiconductor can be efficiently discharged out of the system of the power module 5 rather than heat generated from the second electronic component 53b.

[Modification]
(A)
In the power module 5 according to the previous embodiment, the cooling jacket 58 is provided on the opposite side of the mounting surface of the electronic components 53a and 53b of the mounting substrate 51 so as to contact the surface opposite to the mounting surface of the mounting substrate 51. In addition, a refrigerant passage 59 is formed inside the cooling jacket 58. However, as shown in FIG. 6, the coolant passage 59A may be formed inside the mounting substrate 51A. In this way, the distance between the first electronic component 53a and the refrigerant passage 59A can be further shortened.

(B)
In the power module 5 according to the previous embodiment, the thickness of the first mounting area of the mounting substrate 51 is thinner than the thickness of the second mounting area, but the thickness of the first mounting area is the same as the thickness of the second mounting area. It doesn't matter. In this case, as shown in the table of FIG. 4, there is a concern that the heat generated from the first electronic component 53a may not be sufficiently discharged from the power module 5, so that as shown in FIG. It is preferable to provide a thermal via 54B inside the mounting substrate 51B. Furthermore, a contact heat transfer layer 57B may be provided between the cooling jacket 58 and the mounting substrate 51B. Furthermore, a heat spreader may be inserted between the first electronic component 53a and the mounting substrate 51A.

(C)
In the power module 5 according to the previous embodiment, the temperature of the refrigerant flowing into the refrigerant passage 59 is almost determined by the flow of the refrigeration cycle. However, a temperature sensor is provided around the first electronic component 53a, and an expansion valve is provided near the inlet / outlet of the refrigerant passage 59 to control the evaporation temperature of the refrigerant so that the temperature around the first electronic component 53a is kept constant. May be. In this way, the first electronic component can be protected more reliably. In such a case, the outlet of the refrigerant passage 59 may be connected to the suction pipe of the compressor 32.

(D)
In the power module 5 according to the previous embodiment, the thickness of the first mounting area of the mounting substrate 51 is about 100 μm. However, the thickness may be larger depending on the temperature flowing into the refrigerant passage 59. (See FIG. 4). On the contrary, the thickness of the first mounting area of the mounting substrate 51 may be 100 μm or less, but in this case, it is necessary to pay attention to the dielectric breakdown strength.

(E)
In the power module 5 according to the previous embodiment, an epoxy resin is used as a raw material of the mounting substrate 51. However, an epoxy resin containing an insulating ceramic particle or the like may be used. In this way, the thermal conductivity of the mounting substrate can be improved, and the heat generated from the first electronic component 53a can be efficiently discharged out of the power module 5.

(F)
In the power module 5 according to the previous embodiment, a laminated resin substrate is adopted as the mounting substrate 51. Instead, the conductive resin is conductive only on both sides as shown in FIGS. 8, 9, and 10. Double-sided resin substrates 51C, 51D, 51E provided with body patterns may be employed. In such power modules 5C, 5D, and 5E, in order to diffuse the heat generated from the first electronic component 53a in the direction of the refrigerant passage 59, the thermal via 54C is provided in the resin portion of the double-sided resin substrates 51C, 51D, and 51E, It is preferable to disperse the heat conductive filler 54D in the portion or insert the heat conductive sheet 54E into the resin portion. Further, it is more effective to provide a heat spreader 54 that diffuses heat generated from the first electronic component 53a along the mounting surface. In such a case, it is preferable to provide electrical insulating layers 57C, 57D, and 57E between the double-sided resin substrates 51C, 51D, and 51E and the cooling jacket 58 in order to ensure insulation of the double-sided resin substrates 51C, 51D, and 51E. . However, when the thermally conductive filler 54D and the thermally conductive sheet 54E are ceramic or the like and have electrical insulation, the electrical insulation layers 57C, 57D, and 57E can be omitted.

(G)
In the power module 5 according to the previous embodiment, the cooling jacket 58 having a flat contact surface with the mounting substrate 51 is adopted. Instead, a cooling jacket with a step as shown in FIG. 11 is used. 58F may be employed. In this way, the cooling jacket 58F contacts only the surface opposite to the mounting surface such as the first electronic component 53a, and double-sided mounting can be performed in other portions. Therefore, in such a power module 5F, unnecessary cooling (or heating) can be prevented, and at the same time, further compactization is possible. In this way, it is possible to cope with a case where a lead wire comes out on the surface opposite to the mounting surface. Further, an electrical insulating layer 57F may be provided between the cooling jacket 58F and the mounting substrate 51F.

(H)
In the method for manufacturing the power module 5 according to the previous embodiment, each process is performed in the order of step S1, step S2, step S3, step S4, and step S5. However, this order may be changed. For example, each process may be performed in the order of step S1, step S4, step S2, step S3, and step S5, or each process is performed in the order of step S1, step S2, step S4, step S3, and step S5. Alternatively, each process may be performed in the order of step S5 → step S1 → step S2 → step S3 → step S4.

(I)
In the power module 5 according to the previous embodiment, an epoxy resin is used as a raw material for the mounting substrate 51. However, other resins (for example, phenol resin, bismaleimide resin, polyimide resin, etc.) may be used. Absent.

  The power module according to the present invention is characterized in that it can be manufactured at a lower manufacturing cost than the conventional power module and can be made compact. Can contribute.

The external appearance perspective view of the air conditioner concerning this Embodiment. The refrigerant circuit figure of the air conditioner which concerns on this Embodiment. (A) The longitudinal cross-sectional view of the power module mounted in the air conditioner which concerns on this Embodiment, (b) The upper surface perspective view of the cooling jacket part of the power module which concerns on this Embodiment. The table | surface which shows the relationship between the thickness of the mounting substrate which concerns on this Embodiment, and a thermal radiation characteristic. The flowchart showing the manufacturing process of the power module which concerns on this Embodiment. The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (A). The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (B). The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (F). The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (F). The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (F). The fragmentary longitudinal cross-section of the power module mounted in the air conditioner which concerns on a modification (G).

Explanation of symbols

1 Air conditioner 5F Power module 51F Mounting board (resin board)
53a First electronic component (power semiconductor)
53b Second electronic component (non-power semiconductor)
57F Electrical insulation layer 58F Cooling jacket 59 Refrigerant passage

Claims (14)

A power semiconductor (53a) and a non-power semiconductor (53b) constituting a power supply circuit for performing power conversion;
A single resin substrate (51F) for mounting both the power semiconductor and the non-power semiconductor;
The first plate portion and the resin substrate side of the first plate portion along the thickness direction of the first plate portion so as to be in contact with at least the back surface of the mounting surface of the power semiconductor among the resin substrates. A cooling jacket (58F) having a second plate portion protruding inside and provided with a cooling fluid passage (59);
A power module (5F). Temperature detecting means for detecting the temperature of the power semiconductor or the vicinity thereof; and
Temperature control means for controlling the temperature of the cooling fluid so that the temperature detected by the temperature detection means becomes the predetermined temperature;
The power module according to claim 1, further comprising: A shortest distance between the power semiconductor and the cooling fluid passage is shorter than a shortest distance between the non-power semiconductor and the cooling fluid passage;
The power module according to claim 1 or 2. Of the resin substrate, the thickness of the portion for mounting the power semiconductor is thinner than the thickness of the portion for mounting the non-power semiconductor,
The power module according to claim 1. The resin substrate is composed of a plurality of laminated unit bodies laminated in the plate thickness direction,
The thickness of the portion for mounting the power semiconductor and the thickness of the portion for mounting the non-power semiconductor are adjusted by the shape of each of the stacked unit bodies,
The power module according to claim 4 or 5. A thermal diffusion unit for diffusing at least heat generated from the power semiconductor;
The power module according to claim 1. An electric insulation layer (57F) disposed between the heat diffusion portion and the cooling fluid passage;
The power module according to claim 6. The heat diffusion part includes a heat spreader disposed between the power semiconductor and the mounting surface of the resin substrate.
The power module according to claim 6 or 7. The thermal diffusion portion includes a thermal via provided in the resin substrate along a direction intersecting the plate surface of the resin substrate.
The power module according to claim 6. The thermal diffusion part includes a thermally conductive filler dispersed and blended in the resin part of the resin substrate.
The power module according to claim 6. The thermal diffusion part includes a thermally conductive sheet embedded in the resin part of the resin substrate.
The power module according to claim 6 or 7. A power semiconductor (53a) and a non-power semiconductor (53b) constituting a power supply circuit for performing power conversion;
One mounting substrate (51, 51A, 51B, 51C, 51D, 51E) having a thermal conductivity in the thickness direction of 10 W / (m · K) or less for mounting both the power semiconductor and the non-power semiconductor. , 51F),
The first plate portion and the mounting substrate side of the first plate portion along the thickness direction of the first plate portion so as to be in contact with at least the back surface of the mounting surface of the power semiconductor among the mounting substrate. A cooling jacket (58F) having a second plate portion protruding inside and provided with a cooling fluid passage (59);
A power module (5F). A refrigerant circuit;
A power semiconductor (53a) and a non-power semiconductor (53b) constituting a power supply circuit for performing power conversion, a single resin substrate (51F) on which both the power semiconductor and the non-power semiconductor are mounted, One plate part and the resin substrate side of the first plate part along the thickness direction of the first plate part so as to come into contact with at least the back side surface of the mounting surface of the power semiconductor among the resin substrates A power module (5F) having a cooling jacket (58F) having a second plate part provided with a cooling fluid passage (59) for allowing the refrigerant flowing through the refrigerant circuit to pass therethrough,
An air conditioner (1) comprising: A power semiconductor (53a) and a non-power semiconductor (53b) constituting a power supply circuit for performing power conversion, a single resin substrate (51F) on which both the power semiconductor and the non-power semiconductor are mounted, One plate part and the resin substrate side of the first plate part along the thickness direction of the first plate part so as to come into contact with at least the back side surface of the mounting surface of the power semiconductor among the resin substrates A method of manufacturing a power module (5F) having a cooling jacket (58F) having a second plate part provided with a cooling fluid passage (59) provided inside the protrusion,
A power semiconductor fixing step of fixing the power semiconductor to a prescribed position of the resin substrate;
A wire connection step of wire-connecting the power semiconductor and a circuit provided on the resin substrate;
A non-power semiconductor connection step of connecting the non-power semiconductor and the circuit;
A cooling jacket fixing step of fixing the resin substrate to the cooling jacket;
A method for manufacturing a power module.