JP2007042834A - Mounting device and mounting method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide mounting device/method of electronic components, with which the electronic components sucked by a multiple string nozzle can precisely and efficiently be recognized. <P>SOLUTION: The device is provided with a first recognition means 14 recognizing the first electronic components P1 or the second electronic components P2 sucked by the multiple string nozzle 21 from below and a second recognition means 13 recognizing the first electronic components P1 sucked by the multiple string nozzle 21 from a side. Control for controlling heights of respective nozzles 21a of the multiple string nozzle 21 which repetitively sucks the first electronic components P1 at every repetition of a mounting operation to prescribed heights and control for controlling the heights of the respective nozzles 21b of the multiple string nozzle 21 and arranging heights of installation faces of the second electronic components P2 sucked to the respective nozzles 21b in a horizontal direction are selectively performed. The electronic components are recognized by a recognition method corresponding to a form of the electronic components. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for attracting an electronic component by a multiple nozzle and mounting it on a mounting target such as a substrate.

  In the mounting field of electronic components (hereinafter referred to as “components”), the components of the electronic component supply unit are picked up and picked up by a nozzle provided in the transfer head, and transferred to a mounting target such as a substrate for mounting. Electronic component mounting apparatuses that repeatedly perform a series of operations are widely used. In addition, in order to increase the mounting efficiency of components, there is known one in which a plurality of nozzles (multiple nozzles) are mounted on a transfer head.

  In this type of mounting apparatus, in order to accurately mount a component on a mounting point on a substrate, it is an important issue to suck and hold the component in a normal posture on a nozzle. For this reason, after the components are attracted and picked up by the multiple nozzles, an operation of recognizing the components by a recognition means such as a camera is performed.

As a method for recognizing this component, a method of recognizing a plurality of types of components sucked and held by the multiple nozzles from the side by a line sensor and measuring the height of the component is known (for example, see Patent Document 1). . In addition, the height of the mounting surface of the multiple types of components sucked and held by the multiple nozzles is aligned in the horizontal direction at the focal position of the line camera, and the line camera moves relatively horizontally below the multiple components. A method of continuously recognizing the mounting surface of the component and detecting the positional deviation of the component is known (for example, see Patent Document 2).
Japanese Patent Laid-Open No. 61-289692 Japanese Patent Laid-Open No. 2002-9495

  By the way, the method disclosed in Patent Document 1 is to detect abnormal suction that is sucked in a horizontal or oblique orientation that may occur when sucked by a nozzle from a component supply unit, and is sucked by a line sensor. The height of the detected component is detected from the side, and the component suction posture is determined by comparison with the component thickness during normal suction. However, the height of each nozzle is not adjustable, so if there is a large difference in the height of the parts, the height of the mounting surface will vary. It cannot be scanned.

  In the method disclosed in Patent Document 2, the mounting surface is aligned with the focal position of the line camera regardless of the height of the component attracted to each nozzle, and the height of each nozzle is the height of this focal position. The height is adjusted so that the height of the part is reduced. That is, the height of each nozzle is managed as an absolute value. The height of each nozzle is adjusted by connecting the nozzle to a nut screwed into the ball screw to control the axial rotation of the ball screw. For this reason, the error due to the processing accuracy of the ball screw directly affects the amount of vertical movement of the nozzle when adjusting the height of the nozzle. This error is, for example, about ± 50 μm for a 300 mm stroke, and when the nozzle height is managed as an absolute value, the nozzle height includes an error of about ± 50 μm.

In recent years, with the reduction in size and weight of parts, the dimensions of parts such as length, width, height, and slant have become extremely small. For this reason, the difference in height between normal suction and abnormal suction of parts is extremely small. For example, in the case of 0603 chip parts, the lateral dimension is 0.3 mm,
The oblique dimension is 0.35 mm, and the difference is 0.05 mm (50 μm).

  For this reason, if the height of a micro component that has to be accurately detected by detecting a difference of 50 μm and judged whether it is normal suction or abnormal suction is detected by adsorbing it to a nozzle that includes a similar height error, There is a risk of misrecognizing the posture.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and mounting method that can accurately and efficiently recognize an electronic component adsorbed by a multiple nozzle.

  The invention according to claim 1 is an electronic component mounting apparatus that repeatedly performs a mounting operation in which the first electronic component or the second electronic component is attracted to the multiple nozzles and transferred to the mounting target. A first recognizing means for recognizing the first electronic component or the second electronic component adsorbed by the nozzle from below, and a second recognizing the first electronic component adsorbed by the multiple nozzle from the side. Recognizing means and nozzle height control means for independently adjusting the height of each nozzle of the multiple nozzles, and the nozzle height control means removes the first electronic component each time the mounting operation is repeated. Control for adjusting the height of each nozzle of the multiple nozzle repeatedly adsorbed to a certain height, and adjusting the height of each nozzle of the multiple nozzle, respectively, and the second electrons adsorbed to each nozzle Select the control to align the height of the component mounting surface in the horizontal direction. Performed.

  According to a second aspect of the present invention, in the first aspect of the invention, the height of each nozzle of the multiple nozzle in which the nozzle height control means repeatedly adsorbs the first electronic component every time the mounting operation is repeated. Is adjusted to a preset nozzle reference height for each nozzle.

  The invention according to claim 3 is an electronic component mounting method for repeatedly performing a mounting operation of attracting the first electronic component or the second electronic component to the multiple nozzle and transferring it to the mounting target. A first adjustment step of adjusting the height of each nozzle of the multiple nozzle that repeatedly adsorbs the first electronic component each time it is repeated to a fixed height; and A first recognition step for recognizing the first electronic component sucked by each nozzle from the side and below, and a second recognition step for adjusting the height of each nozzle of the multiple nozzles respectively. A second adjusting step of aligning the height of the mounting surface of the electronic component in the horizontal direction; and a second recognition step of recognizing the second electronic component having the aligned mounting surface height from below.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the first adjusting step is configured such that the height of each nozzle of the multiple nozzle that repeatedly adsorbs the electronic component each time the mounting operation is repeated, The nozzle reference height is adjusted to a preset nozzle reference height.

  According to the present invention, since the electronic component is recognized by the recognition method corresponding to the type of electronic component, the electronic component sucked by the multiple nozzles can be accurately and efficiently recognized.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2A is a front view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4B is a side view of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 3 is a configuration diagram of the control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4A is an explanatory diagram of a first component recognition method according to an embodiment of the present invention, FIG. 4B is an explanatory diagram of a second component recognition method according to an embodiment of the present invention, and FIG. It is a flowchart of operation | movement of the mounting device of the electronic component in one embodiment of this invention.

  First, the overall configuration of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a conveyance path 2 extending in the X direction is disposed at a substantially center on a base 1. The conveyance path 2 conveys the substrate 3 as a mounting target and positions it at a predetermined position. In the present invention, the substrate transport direction is the X direction, and the direction perpendicular to the substrate in the horizontal plane is the Y direction. Electronic component supply units 4 are arranged on both sides in the Y direction of the transport path 2. The electronic component supply unit 4 includes a parts feeder that supplies an electronic component (hereinafter referred to as “component”) to the mounting apparatus. In the present embodiment, a plurality of tape feeders 5 are detachably arranged in parallel. Has been. A number of parts are stored in the tape feeder 5.

  A pair of Y tables 6 are disposed at both ends of the base 1 in the X direction. An X table 7 is installed on these Y tables 6 and moves in the Y direction by driving the Y table 6. A transfer head 8 is disposed on the side of the X table 7 and moves in the X direction by driving the X table 7. The Y table 6 and the X table 7 are horizontal moving means for moving the transfer head 8 horizontally on the base 1.

  2A and 2B, the transfer head 8 is mounted on the X table 7 via the plate 9. A plurality of nozzle units 20 are mounted on the plate 9 while being held by the frame 10. In the present embodiment, two nozzle unit rows in which four nozzle units 20 are arranged in series are arranged in the Y direction.

  In FIG. 2B, a nozzle 21 is attached to the lower end portion of each nozzle unit 20. Each nozzle unit 20 is provided with a raising / lowering drive unit 22 and a rotation drive unit 23 (see FIG. 3) as drive means for the nozzle 21. The raising / lowering drive part 22 consists of the ball screw arrange | positioned in the perpendicular direction which is not shown in figure, the nut screwed together with this ball screw, and the motor which carries out a shaft rotation of the ball screw, and the nozzle 21 is connected with this nut. As the ball screw rotates, the nut moves up and down, and the nozzle 21 moves up and down. In this way, by controlling the drive of the lifting drive unit 22 of each nozzle unit 20, the height of each nozzle 21 can be adjusted independently. Moreover, each nozzle 21 rotates independently by the drive of the rotational drive part 23, and can change the direction in the horizontal direction of the components P adsorbed by each nozzle 21. FIG.

  2 (a) and 2 (b), the transfer head 8 is provided with a line sensor 13, which is located on the side of a component suction surface (hereinafter referred to as "suction surface") at the lower end of each nozzle 21. Held in position. The line sensor 13 moves to a position facing each nozzle 21 while maintaining a constant height, and continuously recognizes the part P sucked on the suction surface of each nozzle 21 from the side. Thereby, the height of the mounting surface of each component P adsorbed by each nozzle 21 is detected. The mounting surface of the component P is a surface that comes into contact with the upper surface of the substrate when mounted on the substrate, and is usually the lower surface of the electrode. In the case of a component with a bump, the lower end of the bump is the mounting surface. It becomes. The line sensor 13 serves as a second recognizing means for recognizing a part adsorbed by the multiple nozzles from the side.

  In FIG. 1, a line camera 14 is disposed between the conveyance path 2 and the electronic component supply unit 4, and recognizes a component picked up and picked up by the nozzle 21 of the transfer head 8 from below. The line camera 14 captures the mounting surface of the component, and the captured image is subjected to image processing by the image processing unit 39 (see FIG. 3) to recognize the presence / absence of the component, the suction posture, and the like. The line camera 14 serves as a first recognition means for recognizing a component adsorbed by the multiple nozzles from below.

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. The control unit 30 includes a transport path 2, a Y table 6, an X table 7, a line sensor 13, and a line camera 1.
4. Connected to each drive system of the elevation drive unit 22 and the rotation drive unit 23 of the nozzle unit 20 by a bus 31 and controls the drive of each drive system based on the NC program 37. The NC program 37 is stored in a data section 32 connected to the bus 31. In addition to the NC program 37, the data section 32 includes a component library 33, nozzle data 34, substrate data 35, and control parameters 36. It is remembered. Among these, the part data 33 stores part dimension data 33a for each product type. The nozzle data 34 stores reference height data 34a of each nozzle 21 that serves as a reference when measuring the height of the component. The reference height data 34a includes the height data of the suction surface of each nozzle 21. Further, the control unit 30 is connected to the calculation unit 38, the image processing unit 39, the display unit 40, and the operation / input unit 41 through the bus 31.

  Next, a method of recognizing parts by the line sensor 13 and the line camera 14 will be described with reference to FIG. In the present invention, the target component to be mounted is divided into a first component and a second component, and the first component and the second component are recognized by different recognition methods.

  In the present invention, the first component is a micro component such as 0402, 0603, 1005 capacitor chip, and is a component with extremely small dimensional differences such as length, width, thickness, and slant. In addition, a chip component having a component thickness of 0.5 mm or less, although the dimensional difference is not small, such as 1608R and 2625R capacitor chips, is also included. On the other hand, the second part is a part that is not classified into the first part and is a relatively large part. The first part has no significant difference between the varieties in the height dimension, but the second part has a large dimensional difference between the varieties in the height dimension.

  First, a method for recognizing the first component will be described with reference to FIG. FIG. 4A shows the positional relationship between the first component P1 adsorbed by each nozzle 21a, the line sensor 13, and the line camera 14. The first parts P1 having different sizes are adsorbed to the nozzles 21a.

  The height of each nozzle 21 a is adjusted based on the reference height data 34 a of each nozzle 21 a by driving of the lifting drive unit 22. The reference height of each nozzle 21a is such that the side surface of the first component P1 adsorbed by each nozzle 21a is located within the recognizable range (upper limit L1 to lower limit L2) of the line sensor 13, and the mounting surface thereof is a line camera. It is set so as to be located within 14 focal ranges (within a recognizable range).

  The side surfaces of all the first components P1 adsorbed by the nozzles 21a adjusted to the reference height are located within the recognizable range of the line sensor 13 (upper limit L1 to lower limit L2), and the mounting surfaces thereof are Since it is located within the focal range (recognizable range) of the line camera 14, the line sensor 13 is sequentially moved to the side of each first component P1 at a constant height, so that each of the first components P1 is moved. The height of the mounting surface can be detected continuously. Further, the first component P1 adsorbed by each nozzle 21a can be sequentially moved above the line camera 14 to continuously image the mounting surface of each first component P1.

  The height of the first component P1 is calculated by calculating the difference between the height of the mounting surface of the first component P1 detected by the line sensor 13 and the height of the suction surface of the nozzle 21 included in the reference height data 34a. It is calculated | required by calculating in 38.

  Even in the recognition of the first component P1 repeatedly adsorbed to each nozzle 21a every time the mounting operation is repeated, the repetition height of each nozzle 21a is controlled to be constant with the respective reference height. Thereby, also about the height of the 1st component P1 newly attracted | sucked, the suction of the nozzle 21a contained in the height of the mounting surface of the 1st component P1 detected by the line sensor 13, and the reference | standard height data 34a It is obtained by calculating the difference in surface height.

  If the repeated height of the nozzle 21a is made constant, the nut of the elevating drive unit 22, which is the height control means of the nozzle 21a, is repeatedly screwed at the same location of the ball screw. It is possible to suppress the influence of general errors. For this reason, it becomes possible to suppress the variation in the repeated height of the suction surface of the nozzle 21a, the height of which is repeatedly adjusted based on the reference height data 34a, and the height of the first component P1 can be accurately measured. it can.

  The reference height of the nozzle 21a can be arbitrarily set for each nozzle 21a as long as the sucked first component P1 is positioned within the recognizable range of the line sensor 13 and the line camera 14. Each nozzle 21a is independently adjusted so that the repetition height thereof is constant with the respective reference height, so that the height of the first component P1 adsorbed to each nozzle 21a can be accurately adjusted. Can be measured.

  In FIG. 4A, the first part P1 is shown large so that it can be easily discriminated. However, in actuality, it is a very small part, and there is no significant difference between the heights. Accordingly, the mounting surfaces of all the first components P1 can be continuously imaged by the line camera 14 without aligning the mounting surfaces of the first components P1 in the horizontal direction.

  Next, a method for recognizing the second component will be described with reference to FIG. FIG. 4B shows the positional relationship between the second part P2 adsorbed by each nozzle 21b and the line camera 14. The second parts P2 having different sizes are adsorbed to the nozzles 21b.

  The height of each nozzle 21b is adjusted based on the dimension data 33a of each second component P2 by driving the elevating drive unit 22, and the height of the mounting surfaces of all the second components P2 is level L3 and horizontal. Aligned in the direction. The level L3 is set to a height that is within the focal range (recognizable range) of the line camera 14, and the second component P2 adsorbed by each nozzle 21b is sequentially moved above the line camera 14 so that each level The mounting surface of the second component P2 can be continuously imaged.

  As described above, the second camera P2 having a large dimensional difference between products in the height dimension can be continuously recognized by the line camera 14 by aligning the mounting surfaces in the horizontal direction. In the above description, the nozzles 21 are numbered 21a and 21b. However, this is for convenience of description, and the nozzles 21a and 21b are the same nozzle 21.

  Next, the operation of the electronic component mounting apparatus will be described with reference to the flowchart of FIG. First, it is determined whether a component to be mounted is a first component or a second component (ST1). When the mounting target component is the first component, the height of each nozzle 21 is adjusted to the respective reference height after suction (ST2). Thereafter, the line sensor 13 is moved to recognize the first component adsorbed by each nozzle 21 from the side, and the height of the mounting surface of each first component is detected (ST3). Further, each nozzle 21 that has sucked the first component is sequentially moved on the line camera 14 to recognize the first component from below, and the mounting surface of each first component is imaged (ST4). That is, ST3 and ST4 are the first recognition process for recognizing the first component adsorbed by the nozzles 21 of the multiple nozzles whose heights are adjusted from the side and the bottom.

Next, the height of the first component is calculated from the difference between the height of the mounting surface of the first component detected in ST3 and the height of the suction surface of the nozzle 21 included in the reference height data 34a. Comparison with the dimension data 33a of the library 33 is performed. When the calculated height of the first part exceeds the allowable value of the height of the first part included in the dimension data 33a, it is not a normal posture with the mounting surface facing downward, It is determined that the suction is performed in the abnormal posture, and the abnormal suction processing is performed (ST5). Further, the image of the mounting surface of the first part imaged in ST4 is processed in the image processing unit 39 based on the dimension data 33a. If it is determined that the component is different in size or misaligned and cannot be mounted, an abnormal suction process is performed (ST6). If abnormal suction processing is performed in ST5 or ST6, the first part is discarded and a new first part is sucked (ST1). The operation of the above ST2 to ST4 is repeated for the newly picked up first part, and if abnormal suction is recognized over a predetermined number of times, the machine is stopped as an error stop.

  If it is recognized in ST3 and ST4 that it is attracted in a normal posture, the position of the component P is corrected by the horizontal movement, vertical movement, and rotation of the nozzle 21 (ST7), and mounted on each mounting point on the substrate 3. (ST8).

  Thereafter, the mounting operation of ST1 to ST8 is continuously repeated until the mounting is completed. The repetition height of each nozzle 21 that adsorbs a new first component each time this repetition is performed is adjusted to the respective reference height (ST2). In other words, this is a first adjustment step in which the height of each nozzle of the multiple nozzle that repeatedly adsorbs the first component each time the mounting operation is repeated is adjusted to a nozzle reference height preset for each nozzle. ing.

  On the other hand, when the mounting target component is the second component, the height of each nozzle 21 is adjusted based on the dimension data 33a, and the heights of the mounting surfaces of all the second components are aligned in the horizontal direction (ST9). This ST9 is a second adjustment step in which the height of each nozzle of the multiple nozzles is adjusted to align the height of the mounting surface of the second component adsorbed by each nozzle in the horizontal direction.

  Next, each nozzle 21 that has sucked the second component is sequentially moved on the line camera 14 to recognize the second component from below, and the mounting surface of each second component is imaged (ST10). This ST10 is a second recognition step for recognizing from the lower side the second component having the same mounting surface height.

  The image of the mounting surface of the second part imaged in ST10 is processed in the image processing unit 39 based on the dimension data 33a, and when abnormal suction such as displacement is recognized, the nozzle 21 is rotated or horizontally moved. The position of the second part is corrected (ST11). The second component that is recognized to be sucked in a normal posture or whose position has been corrected in ST10 is mounted on each mounting point on the substrate 3 (ST12). Thereafter, the mounting operations of ST9 to ST12 are continuously repeated until the mounting is completed.

  The component recognition (ST3) by the line sensor 13 and the component recognition (ST4) by the line camera 14 may be performed in any order or simultaneously. In the present embodiment, since the line sensor 13 is attached to the transfer head 8, it is possible to perform detection work during the movement of the transfer head 8, and the nozzle 21 that sucks the first component is the line camera 14. In addition, by performing component recognition by the line sensor 13 when moving above the board 3, the work time is shortened and an efficient mounting work can be realized. The parts can also be recognized by arranging the line sensor 13 on the base 1 and moving the transfer head 8 to the side thereof.

  As described above, according to the electronic component mounting apparatus and mounting method according to the present invention, different component recognition methods are used depending on whether the mounting target component is the first component or the second component. A part can be recognized by a recognition method suitable for the type of the target part. For the first component, which is a micro component, the height of the component adsorbed to each nozzle of the multi-nozzle is measured by using the good repetitive height accuracy of the nozzle, and is also adsorbed to the multi-nozzle. In addition, since a plurality of components can be recognized continuously, it is possible to recognize components efficiently and accurately, thereby preventing the occurrence of defective substrates and improving the operation efficiency of the mounting apparatus.

  According to the electronic component mounting apparatus and mounting method of the present invention, it is possible to accurately and efficiently recognize the electronic components sucked by the multiple nozzles. Thus, it is useful in the field of mounting on a mounting target such as a substrate.

The top view of the mounting device of the electronic component in one embodiment of this invention (A) Front view of transfer head of electronic component mounting apparatus in one embodiment of the present invention (b) Side view of transfer head of electronic component mounting apparatus in one embodiment of the present invention 1 is a configuration diagram of a control system of an electronic component mounting apparatus according to an embodiment of the present invention. (A) Explanatory drawing of the recognition method of the 1st electronic component in one embodiment of this invention (b) Explanatory drawing of the recognition method of the 2nd electronic component in one embodiment of this invention The flowchart of operation | movement of the mounting device of the electronic component in one embodiment of this invention

Explanation of symbols

3 Substrate 13 Line sensor 14 Line camera 21 Nozzle 22 Elevating drive unit P1 First electronic component P2 Second electronic component

Claims (4)

An electronic component mounting apparatus that repeatedly performs a mounting operation in which the first electronic component or the second electronic component is attracted to the multiple nozzle and transferred to a mounting target.
First recognition means for recognizing the first electronic component or the second electronic component adsorbed by the multiple nozzles from below, and the first electronic component adsorbed by the multiple nozzles from the side Second recognition means, and nozzle height control means for independently adjusting the height of each nozzle of the multiple nozzles,
The nozzle height control means adjusts the height of each nozzle of the multiple nozzle that repeatedly sucks the first electronic component each time the mounting operation is repeated to a constant height, and the multiple nozzle The electronic component mounting apparatus is configured to selectively adjust the height of each nozzle of the second electronic component so that the height of the mounting surface of the second electronic component adsorbed by each nozzle is aligned in the horizontal direction. .   The nozzle height control means adjusts the height of each nozzle of the multiple nozzle that repeatedly sucks the first electronic component each time the mounting operation is repeated to a nozzle reference height set in advance for each nozzle. The electronic component mounting apparatus according to claim 1, wherein control is performed. An electronic component mounting method for repeatedly performing a mounting operation of attracting the first electronic component or the second electronic component to the multiple nozzle and transferring it to a mounting target,
A first adjusting step of adjusting the height of each nozzle of the multiple nozzle that repeatedly adsorbs the first electronic component each time the mounting operation is repeated to a certain height; A first recognition step for recognizing the first electronic component adsorbed to each nozzle of the continuous nozzle from the side and the lower side, and the height of each nozzle of the multiple nozzle are adjusted to be adsorbed to each nozzle. A second adjusting step of aligning the height of the mounting surface of the second electronic component in the horizontal direction; and a second recognition step of recognizing the second electronic component having the aligned height of the mounting surface from below. A method for mounting an electronic component, comprising:   The first adjustment step adjusts the height of each nozzle of the multiple nozzle that repeatedly picks up an electronic component each time the mounting operation is repeated to a nozzle reference height set in advance for each nozzle. The electronic component mounting method according to claim 3, wherein:

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