JP2007035861A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

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Publication number
JP2007035861A
JP2007035861A JP2005216104A JP2005216104A JP2007035861A JP 2007035861 A JP2007035861 A JP 2007035861A JP 2005216104 A JP2005216104 A JP 2005216104A JP 2005216104 A JP2005216104 A JP 2005216104A JP 2007035861 A JP2007035861 A JP 2007035861A
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Prior art keywords
anode
lead
anode lead
solid electrolytic
external
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JP2005216104A
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Japanese (ja)
Inventor
Junichi Sawayama
淳一 澤山
Yutaka Suzuki
裕 鈴木
Kazuyuki Iida
和幸 飯田
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Lincstech Circuit Co Ltd
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Hitachi AIC Inc
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Priority to JP2005216104A priority Critical patent/JP2007035861A/en
Publication of JP2007035861A publication Critical patent/JP2007035861A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and thin solid electrolytic capacitor suitable, which is demanded as an apparatus becomes thin and small, and a power supply and its peripheral circuit are mounted in a very dense state. <P>SOLUTION: This chip-type solid electrolytic capacitor comprises a capacitor element having external terminals at both ends thereof, a lead for an anode led out therefrom, and a cathode layer formed on the peripheral surface thereof; and has the exterior resin coating as a whole. A high hardness insulator is provided at the root of the anode lead and a V-cut is provided in the anode lead, and the anode lead is bent at that portion as a starting point, and the portion of the anode lead more distal than the V-cut is connected to an external anode terminal plate on the capacitor element side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、固体電解コンデンサに関するものである。さらに詳しくは、固体電解コンデンサの端子構造に関するものである。   The present invention relates to a solid electrolytic capacitor. More specifically, the present invention relates to a terminal structure of a solid electrolytic capacitor.

電子機器のデジタル化、高周波化が進む中で、機器の電源回路に組み込まれる固体電解コンデンサも高周波特性の良好なものが要求される。また、機器の小型薄型化に伴い、電源やその周辺回路の実装も高密度になり、小型薄型の固体電解コンデンサが求められている。
小型薄型化として、チップ形の、特に外部端子をチップ本体の側面側に設けた構造が提案されている。この例として、図4に示すように、一対の金属材をコンデンサ素子の両側に配置させて外部端子とし、コンデンサ素子の陰極層側と外部陰極端子金属板7を接続し、外部陽極端子金属板8にスリットを設け、そのスリット部17に陽極用リード2を通過させ、その突出部を折り曲げ、溶接している(特開昭56−61120号公報)。
また、図5に示すように、陽極用リード2の先部を曲げて、その曲げた部分を導電層18で埋封した陽極端子構造が提案されている(特開昭56−49511号公報)。
特開昭56−61120号公報 特開昭56−49511号公報
With the progress of digitalization and higher frequency of electronic devices, solid electrolytic capacitors incorporated in power supply circuits of devices are required to have good high frequency characteristics. In addition, with the miniaturization and thinning of devices, the power supply and its peripheral circuits are also mounted with high density, and a small and thin solid electrolytic capacitor is required.
As a reduction in size and thickness, a chip-shaped structure, in particular, an external terminal provided on the side surface of the chip body has been proposed. As an example of this, as shown in FIG. 4, a pair of metal materials are arranged on both sides of the capacitor element as external terminals, the cathode layer side of the capacitor element and the external cathode terminal metal plate 7 are connected, and the external anode terminal metal plate 8 is provided with a slit, the anode lead 2 is passed through the slit portion 17, and the protruding portion is bent and welded (Japanese Patent Laid-Open No. 56-61120).
Further, as shown in FIG. 5, an anode terminal structure in which the tip of the anode lead 2 is bent and the bent portion is buried with a conductive layer 18 has been proposed (Japanese Patent Laid-Open No. 56-49511). .
JP-A-56-61120 JP 56-49511 A

外部端子の外側に陽極リードが露出している場合、片方が突起をもった異形端子構造をもっているなど、寸法精度が維持でき難いので、製品の包装時において、キャリアテープに挿入する際に高速化が難しいなどの問題があった。
また、陽極用リード線の先部を曲げて、その曲げた部分を導電層で埋封した陽極端子構造では、その曲げた部分の端子の体積が大きくなりやすく、小型化が難しい問題があった。
When the anode lead is exposed to the outside of the external terminal, it is difficult to maintain the dimensional accuracy, such as having a deformed terminal structure with one protrusion on the other, so the speed when inserting into the carrier tape during product packaging There were problems such as difficult.
In addition, in the anode terminal structure in which the tip of the anode lead wire is bent and the bent portion is embedded with a conductive layer, the volume of the bent portion of the terminal tends to increase, and there is a problem that miniaturization is difficult. .

陽極用リードを引き出し、周面に陰極層を形成したコンデンサ素子と、前記陽極用リードに接続した外部陽極端子金属板と、前記陰極層に接続した外部陰極端子金属板と、を有し、全体として樹脂で外装被覆したチップ形固体電解コンデンサにおいて、前記陽極リードの根元に絶縁体を設けると共に、前記陽極リードにVカット部を設け、そこを起点に折り曲げ、前記陽極リードの前記Vカット部より先部が、前記外部陽極端子板に、前記コンデンサ素子側で接続されていることを特徴とする固体電解コンデンサを提供するものである。   A capacitor element in which a lead for the anode is drawn out and a cathode layer is formed on the peripheral surface, an external anode terminal metal plate connected to the anode lead, and an external cathode terminal metal plate connected to the cathode layer In the chip-type solid electrolytic capacitor externally coated with a resin, an insulator is provided at the base of the anode lead, and a V-cut portion is provided on the anode lead, bent at the starting point, and from the V-cut portion of the anode lead. A tip portion is connected to the external anode terminal plate on the capacitor element side, and a solid electrolytic capacitor is provided.

本発明は、陽極リードが、Vカットされて鋭角に曲げられるので、長さ方向の外径寸法が短くすることができる。
また、陽極リードが、Vカットされて曲げられるので、屈曲点が正確に位置だしされるのと、外部陽極端子金属板の内側に溶接され、外部陽極端子に突起がないので、外径寸法が安定化している。
In the present invention, since the anode lead is V-cut and bent at an acute angle, the outer diameter dimension in the length direction can be shortened.
In addition, since the anode lead is V-cut and bent, the bending point is accurately positioned, and it is welded to the inside of the external anode terminal metal plate, and the external anode terminal has no protrusion, so the outer diameter dimension is It is stabilized.

以下、本発明の実施の形態を図に基づいて説明する。
図1は本願発明の固体電解コンデンサの一例を示す断面図である。
1は、コンデンサ素子で、タンタルやニオブ等の弁作用金属の線状や短冊薄板状からなる陽極用リード2の一端を埋め込んで、タンタルやニオブ等の弁作用金属の微粉末にバインダーを混合した粉末をプレス加圧成形し、次いで真空中において焼結して形成した海綿状の陽極焼結体と、この焼結体に陽極酸化皮膜と、二酸化マンガンや導電性高分子等層と、カーボン層や銀層からなる陰極層3とを順次設けたものからなる。
陰極層3は、導電性接着剤4等により外部陰極端子金属板5に接続される。
6は、絶縁体で、ボリエステル樹脂、エポキシ樹脂、ポリイミド樹脂、ウレタン樹脂、珪素樹脂、フッ素樹脂などの有機高分子からできていて絶縁性の高い材料からなる。陽極用リード2の突き出し根本にあって、陽極用リード2と陽極焼結体との接続を安定化させる目的をもつ。絶縁体の硬度は高いほうが好ましいが、たとえば単なるエポキシ樹脂よりもウレタンなどで変性させある程度衝撃緩和できるほうがより好ましい。また若干ある程度陽極焼結体に浸透するとより接続をより安定化させるので好ましい。また、液状体を硬化させても、始めから板状の硬化物でもかまわない。
陽極用リード2は、丸状や角状などの線材でもよいし、板状体でもかまわない。陽極用リード2は、その引出部で、Vカット部7を設け、そこを起点に略直角に折り曲げる。陽極焼結体となる埋め込み場所は、中心でもかまわないが、陽極用リード2がL字形になるため、中心よりはずらすのが好ましい。また、Vカットは、少なくとも陽極用リード2の突き出し根本を、押さえ治具等により押さえながらおこなうのが好ましい。また、Vカットは、一箇所でも2箇所以上の複数箇所でもかまわない。
外部陽極端子金属板8は、抵抗やレーザ溶接等の溶接のほかコールドプレスや、回転ツールを用いた摩擦撹拌接合などにより、陽極用リード2の折り曲げである端部に接続部9を設けて接続される。
外部陽極または陰極端子金属板材質としては、42アロイ、銅または洋銀等からなる。表面にめっき層を設ける場合もある。
10は、封止充填樹脂で、フェノール樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、またはポリイミド樹脂等の熱硬化性樹脂からなる。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing an example of the solid electrolytic capacitor of the present invention.
Reference numeral 1 denotes a capacitor element, in which one end of a lead 2 for anode made of a valve metal such as tantalum or niobium is embedded, and a binder is mixed with fine powder of the valve metal such as tantalum or niobium. Sponge-like anode sintered body formed by press-pressing powder and then sintering in vacuum, anodized film, manganese dioxide or conductive polymer layer, carbon layer on this sintered body And a cathode layer 3 made of a silver layer.
The cathode layer 3 is connected to the external cathode terminal metal plate 5 by a conductive adhesive 4 or the like.
Reference numeral 6 denotes an insulator, which is made of an organic polymer such as a polyester resin, an epoxy resin, a polyimide resin, a urethane resin, a silicon resin, or a fluorine resin, and is made of a highly insulating material. It has the objective of stabilizing the connection between the anode lead 2 and the anode sintered body at the root of the anode lead 2 protruding. It is preferable that the hardness of the insulator is high, but it is more preferable that the insulator can be modified with urethane or the like, for example, rather than a simple epoxy resin, and the impact can be alleviated to some extent. Further, it is preferable that the anode sintered body penetrates to some extent because the connection is further stabilized. Further, even if the liquid is cured, it may be a plate-shaped cured product from the beginning.
The anode lead 2 may be a round or square wire, or may be a plate. The lead 2 for the anode is provided with a V-cut portion 7 at the lead-out portion, and is bent at a substantially right angle from the starting point. The embedding place to be the anode sintered body may be the center, but the anode lead 2 is L-shaped, and is preferably shifted from the center. Further, it is preferable to perform the V-cut while pressing at least the protruding root of the anode lead 2 with a pressing jig or the like. Further, the V-cut may be performed at one place or a plurality of places including two or more places.
The external anode terminal metal plate 8 is connected by providing a connecting portion 9 at the end of the anode lead 2 bent by cold press or friction stir welding using a rotary tool in addition to resistance and laser welding. Is done.
The material of the external anode or cathode terminal metal plate is 42 alloy, copper, or silver. A plating layer may be provided on the surface.
Reference numeral 10 denotes a sealing filling resin, which is made of a thermosetting resin such as a phenol resin, an epoxy resin, an unsaturated polyester resin, or a polyimide resin.

図2は、本願発明の製造方法の一例を説明するための説明図である。
まず、図2(a)のように、取付バー11に固定して複数個のコンデンサ素子1を製作し、陽極用リード2の突き出し根本に絶縁体6と、それとは反対側に導電性接着剤4をそれぞれ設ける。
次に、図2(b)のように、左台座12には、外部陰極端子金属板5とスペーサ13とを設け、外部陰極端子金属板5と導電性接着剤4とを接続させ、スペーサ13の上には個々のコンデンサ素子1を横にして載せる。
このスペーサ13は、バルク材のほか、スポンジ状、編み目状、中空状、波板状など特に限定はないが、封止充填樹脂10と物性値が近接しているほうが好ましい。
また、右回転台座14上には、外部陽極端子金属板7を設け、陽極用リード2の絶縁体6の外側から押さえ治具15により陽極用リード2を押さえながら、Vカット部7や接続部9を設けた後、図上では時計と反対方向にVカット部7を中心に略90度回転させる。
次に、図2(c)のように、右回転台座を取り除いて、代わりに左台座16を左台座12と合体するように設ける。この合体座台は上部開放の容器形状になっている。
次に、図2(d)のように、上記合体座台内に封止充填樹脂10を流し込み、硬化させる。
次に、図2(e)のように、合体座台をはずし、表面を研磨製面後、各コンデンサに切り分けされる。
FIG. 2 is an explanatory diagram for explaining an example of the manufacturing method of the present invention.
First, as shown in FIG. 2 (a), a plurality of capacitor elements 1 are manufactured by being fixed to a mounting bar 11, an insulator 6 at the base of the anode lead 2, and a conductive adhesive on the opposite side. 4 are provided.
Next, as shown in FIG. 2B, the left pedestal 12 is provided with the external cathode terminal metal plate 5 and the spacer 13, and the external cathode terminal metal plate 5 and the conductive adhesive 4 are connected to each other. Each capacitor element 1 is placed on the side.
The spacer 13 is not limited to a bulk material, but may be a sponge shape, a stitch shape, a hollow shape, a corrugated plate shape, or the like, but it is preferable that the physical properties of the sealing filler resin 10 are close to each other.
Further, an external anode terminal metal plate 7 is provided on the right rotating pedestal 14, and while holding the anode lead 2 with the holding jig 15 from the outside of the insulator 6 of the anode lead 2, the V cut portion 7 and the connecting portion are provided. After 9 is provided, it is rotated approximately 90 degrees around the V-cut portion 7 in the opposite direction to the clock in the figure.
Next, as shown in FIG. 2 (c), the right rotating pedestal is removed, and the left pedestal 16 is provided so as to be combined with the left pedestal 12 instead. This united seat has a container shape with an open top.
Next, as shown in FIG. 2D, the sealing filling resin 10 is poured into the united seat and cured.
Next, as shown in FIG. 2E, the united seat is removed, the surface is polished, and then cut into each capacitor.

まず、図2(a)、(b)のように、コンデンサ素子を加工後、図2(c)の代わりに、図3のようにコンデンサ素子1を下型19、上型20で挟み込んで、モールドキャビティ21から封止充填樹脂を流し込み、充填させた後、硬化させる。次に、モールド下型19、モールド上型20をはずした後、各コンデンサに切り分けされる。   First, after processing the capacitor element as shown in FIGS. 2A and 2B, the capacitor element 1 is sandwiched between the lower mold 19 and the upper mold 20 as shown in FIG. 3 instead of FIG. The sealing filling resin is poured from the mold cavity 21, filled, and then cured. Next, after removing the mold lower mold 19 and the mold upper mold 20, each of the capacitors is cut.

本願発明の固体電解コンデンサの一例を示す断面図である。It is sectional drawing which shows an example of the solid electrolytic capacitor of this invention. 本願発明の製造方法の一例を説明するための説明図である。(実施例1)It is explanatory drawing for demonstrating an example of the manufacturing method of this invention. Example 1 本願発明の製造方法の別例の、モールド工程を説明するための説明図である。(実施例2)It is explanatory drawing for demonstrating the mold process of another example of the manufacturing method of this invention. (Example 2) 従来例を示す斜視図および断面図である。It is the perspective view and sectional drawing which show a prior art example. 別の従来例を示す断面図である。It is sectional drawing which shows another prior art example.

符号の説明Explanation of symbols

1…コンデンサ素子、2…陽極用リード、3…陰極層、4…導電性接着剤、5…外部陰極端子金属板、6…絶縁体、7…Vカット部、8…外部陽極端子金属板、9…接続部、10…封止充填樹脂、11…取付バー、12…左台座、13…スペーサ、14…右回転台座、15…押さえ治具、16…左台座、17…スリット部、18…導電層、19…モールド下型、20…モールド上型、21…モールドキャビティ。   DESCRIPTION OF SYMBOLS 1 ... Capacitor element, 2 ... Lead for anode, 3 ... Cathode layer, 4 ... Conductive adhesive, 5 ... External cathode terminal metal plate, 6 ... Insulator, 7 ... V cut part, 8 ... External anode terminal metal plate, DESCRIPTION OF SYMBOLS 9 ... Connection part, 10 ... Sealing filling resin, 11 ... Mounting bar, 12 ... Left base, 13 ... Spacer, 14 ... Right rotation base, 15 ... Holding jig, 16 ... Left base, 17 ... Slit part, 18 ... Conductive layer, 19 ... lower mold, 20 ... upper mold, 21 ... mold cavity.

Claims (1)

陽極用リードを引き出し、周面に陰極層を形成したコンデンサ素子と、前記陽極用リードに接続した外部陽極端子金属板と、前記陰極層に接続した外部陰極端子金属板と、を有し、全体として樹脂で外装被覆したチップ形固体電解コンデンサにおいて、前記陽極リードの根元に絶縁体を設けると共に、前記陽極リードにVカット部を設け、そこを起点に折り曲げ、前記陽極リードの前記Vカット部より先部が、前記外部陽極端子板に、前記コンデンサ素子側で接続されていることを特徴とする固体電解コンデンサ。   A capacitor element in which a lead for the anode is drawn out and a cathode layer is formed on the peripheral surface, an external anode terminal metal plate connected to the anode lead, and an external cathode terminal metal plate connected to the cathode layer In a chip-type solid electrolytic capacitor externally coated with a resin, an insulator is provided at the base of the anode lead, and a V-cut portion is provided on the anode lead, bent at the starting point, and from the V-cut portion of the anode lead. A solid electrolytic capacitor characterized in that a tip portion is connected to the external anode terminal plate on the capacitor element side.
JP2005216104A 2005-07-26 2005-07-26 Solid electrolytic capacitor Pending JP2007035861A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100914889B1 (en) * 2007-07-10 2009-08-31 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same
KR100935323B1 (en) 2007-06-05 2010-01-06 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379262A (en) * 1976-12-23 1978-07-13 Nippon Electric Co Method of extending out capacitor lead terminals
JPS5715415A (en) * 1980-07-02 1982-01-26 Matsushita Electric Ind Co Ltd Solid electrolytic condenser and method of producing same
JPS5799721A (en) * 1980-12-11 1982-06-21 Matsushita Electric Ind Co Ltd Method of producing solid electrolytic condenser
JPH02256221A (en) * 1989-03-29 1990-10-17 Matsushita Electric Ind Co Ltd Manufacture of chip-type solid state electrolytic capacitor
JPH0878290A (en) * 1994-08-31 1996-03-22 Elna Co Ltd Manufacture of solid electrolytic chip capacitor
JP2004522311A (en) * 2001-06-28 2004-07-22 エプコス アクチエンゲゼルシャフト Capacitor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5379262A (en) * 1976-12-23 1978-07-13 Nippon Electric Co Method of extending out capacitor lead terminals
JPS5715415A (en) * 1980-07-02 1982-01-26 Matsushita Electric Ind Co Ltd Solid electrolytic condenser and method of producing same
JPS5799721A (en) * 1980-12-11 1982-06-21 Matsushita Electric Ind Co Ltd Method of producing solid electrolytic condenser
JPH02256221A (en) * 1989-03-29 1990-10-17 Matsushita Electric Ind Co Ltd Manufacture of chip-type solid state electrolytic capacitor
JPH0878290A (en) * 1994-08-31 1996-03-22 Elna Co Ltd Manufacture of solid electrolytic chip capacitor
JP2004522311A (en) * 2001-06-28 2004-07-22 エプコス アクチエンゲゼルシャフト Capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100935323B1 (en) 2007-06-05 2010-01-06 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same
KR100914889B1 (en) * 2007-07-10 2009-08-31 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same

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