JP2007035827A5 - - Google Patents

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Publication number
JP2007035827A5
JP2007035827A5 JP2005215446A JP2005215446A JP2007035827A5 JP 2007035827 A5 JP2007035827 A5 JP 2007035827A5 JP 2005215446 A JP2005215446 A JP 2005215446A JP 2005215446 A JP2005215446 A JP 2005215446A JP 2007035827 A5 JP2007035827 A5 JP 2007035827A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005215446A
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Japanese (ja)
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JP2007035827A (ja
JP4271674B2 (ja
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Publication date
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Priority to JP2005215446A priority Critical patent/JP4271674B2/ja
Priority claimed from JP2005215446A external-priority patent/JP4271674B2/ja
Publication of JP2007035827A publication Critical patent/JP2007035827A/ja
Publication of JP2007035827A5 publication Critical patent/JP2007035827A5/ja
Application granted granted Critical
Publication of JP4271674B2 publication Critical patent/JP4271674B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005215446A 2005-07-26 2005-07-26 ワイヤボンディング装置 Expired - Fee Related JP4271674B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005215446A JP4271674B2 (ja) 2005-07-26 2005-07-26 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005215446A JP4271674B2 (ja) 2005-07-26 2005-07-26 ワイヤボンディング装置

Publications (3)

Publication Number Publication Date
JP2007035827A JP2007035827A (ja) 2007-02-08
JP2007035827A5 true JP2007035827A5 (pt) 2007-05-24
JP4271674B2 JP4271674B2 (ja) 2009-06-03

Family

ID=37794731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005215446A Expired - Fee Related JP4271674B2 (ja) 2005-07-26 2005-07-26 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP4271674B2 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7537149B2 (en) * 2006-09-26 2009-05-26 Orthodyne Electronics Corporation Deep access large ribbon bond head
CH700015B1 (de) * 2007-04-04 2010-06-15 Oerlikon Assembly Equipment Ag Ultraschall Transducer.
JP4874445B2 (ja) * 2007-11-07 2012-02-15 超音波工業株式会社 超音波接合ツール及び超音波接合ツールの取付方法
US10847491B2 (en) 2009-02-06 2020-11-24 Kulicke And Soffa Industries, Inc. Ribbon bonding tools and methods of using the same
CN102308374B (zh) * 2009-02-06 2016-02-03 奥托戴尼电气公司 带式焊接工具及采用所述工具的方法
JP5804644B2 (ja) * 2012-02-21 2015-11-04 超音波工業株式会社 超音波ワイヤボンディング装置および超音波ワイヤボンディング方法
JP6427813B2 (ja) * 2015-01-06 2018-11-28 株式会社アドウェルズ ワイヤボンディング装置

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