JP2007031940A - Heat insulating plate with pressure sensitive adhesive and heat insulating construction method using this heat insulating plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat insulating plate with a pressure sensitive adhesive, a heat insulating plate assembly and also a heat insulating construction method using such a heat insulating plate with the pressure sensitive adhesive, capable of storing and carrying by stacking high without requiring separation paper. <P>SOLUTION: This heat insulating plate with the pressure sensitive adhesive has an application pattern 12 of the pressure sensitive adhesive on one surface of the heat insulating plate 11. The application pattern 12 has a low part application area 12a and a high part application area 12b different in the application height. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat insulating plate with a pressure-sensitive adhesive attached to a housing or the like of a building structure and a heat insulating method for a structure using the same.

  When attaching a heat insulating plate to a housing of a building structure or the like, if a temporary fixing is required, a heat insulating plate with an adhesive to which an adhesive is previously applied may be used. The conventional heat-insulating board with adhesive is applied to the entire surface of one side of the heat-insulating board, or evenly applied to the entire surface of one side in stripes, etc., and this adhesive-coated surface is covered with release paper, The release paper is peeled off with, for example, and temporarily fixed to the housing.

  For example, in Patent Documents 1 and 2, after heat-insulating a floor or roof slab of RC or SRC structure, a deck plate is laid as a lower mold frame, and a heat-insulating plate with an adhesive is pasted thereon and temporarily fixed. A construction method of a heat insulating slab in which concrete is placed and concrete is placed is disclosed.

  By using a heat-insulating plate with an adhesive as described above, even a lightweight heat-insulating plate such as that made of synthetic resin foam is not blown away by wind or misaligned. Can be increased. In addition, since the pressure-sensitive adhesive application surface is covered with release paper, the heat insulating plates can be stacked and stored and transported.

JP-A-6-212722 JP 7-54433 A

  However, the conventional heat-insulating plate with an adhesive has a problem that the release paper is used for each heat-insulating plate, so that the cost of the release paper and the cost of the release paper processing at the site are high, resulting in high costs. .

  Accordingly, the present invention provides a novel heat-insulating plate with an adhesive, a heat-insulating plate assembly, and a heat-insulating method using the heat-insulating plate with an adhesive, which can be stored and transported in a pile even without release paper. For the purpose.

The configuration of the present invention made to achieve the above object is as follows.
That is, the present invention is a heat-insulating plate with an adhesive having an adhesive application pattern on one side of the heat-insulating plate, the application pattern having a low-part application region and a high-part application region having different application heights. It is characterized by being.
In addition, the high-part application region is distributed in a dotted pattern.
The application pattern is applied by a spiral spray method.

The heat insulating plate assembly of the present invention is characterized in that a plurality of the heat insulating plates with pressure-sensitive adhesives of the present invention are integrated by adhering the pressure-sensitive adhesive coated surface and the pressure-sensitive adhesive non-coated surface.
Another heat insulating plate assembly of the present invention is characterized in that the two heat insulating plates with pressure-sensitive adhesive of the present invention are integrated by adhering the pressure-sensitive adhesive application surfaces to each other. In this case, it is preferable that the adhesive application patterns of the two heat insulating plates with the adhesive do not overlap.
Moreover, in the heat insulating board aggregate | assembly of this invention, it is preferable that the said heat insulating boards with an adhesive are adhere | attached only with the adhesive of the said high part application | coating area substantially.

  Further, the present invention provides a heat-insulated adhesive with a pressure-sensitive adhesive separated from the heat-insulating plate assembly of the present invention in a heat-insulating method that requires temporary fixing of the heat-insulating plate when attaching the heat-insulating plate to the structure. The plate is adhered and temporarily fixed with adhesives in both the low part application region and the high part application region.

  According to the heat-insulating plate with the adhesive of the present invention, the application pattern of the adhesive has a low application area and a high application area with different application heights, so when a relatively small pressure is applied. Adhesion with a small adhesive force due to some adhesives (adhesives in high-part application areas), and when relatively large pressure is applied, large adhesive force due to adhesives in both low-part application areas and high-part application areas Can be adhered. For this reason, by applying a relatively small pressure to adhere the heat-insulating plates with pressure-sensitive adhesives with a part of the pressure-sensitive adhesive (pressure-sensitive adhesive in the high-part coating area), the heat-insulating plates can be easily separated and used later Aggregates can be constructed. In addition, during the heat insulation construction of the structure, by applying a relatively large pressure to the heat insulating plate with the adhesive separated from the heat insulating plate assembly, it is possible to adhere both the low part application area and the high part application area to the adherend member. Adequate temporary fixing force can be obtained by adhering the heat insulating plate with the agent.

  Therefore, according to the present invention, it is possible to store and transport the heat insulating plates with adhesives in a pile without requiring release paper, and it is possible to reduce the production cost of the heat insulating plates with adhesives and also at the site of heat insulation construction. Since no release paper treatment (peeling and disposal) is required, the construction cost can be reduced, and a double cost reduction effect is obtained.

  Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to such embodiments.

  FIG. 1 is a plan view showing an example of a heat insulating plate with an adhesive according to the present invention. The heat-insulating plate 10 with an adhesive has an adhesive application pattern 12 on one surface of the heat-insulating plate 11.

  The heat insulating plate 11 is preferably a lightweight and excellent heat insulating material. Specifically, for example, synthesis of polystyrene foam, polyethylene foam, polypropylene foam, polyurethane foam, phenol foam, etc. Resin foam is preferred.

  The type of pressure-sensitive adhesive (pressure-sensitive adhesive) is not particularly limited, and for example, an acrylic pressure-sensitive adhesive, a synthetic rubber pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, or the like can be used.

  The adhesive application pattern 12 in this example is applied by a spiral spray method. In this spiral spray system, an adhesive is discharged from the center of a swirling air flow, and the adhesive is made into a spiral fiber and applied to a traveling object (heat insulating plate 11) in a spiral application pattern. For example, disclosed in JP-A-63-283774, JP-A-11-244774, JP-A-2000-343006, etc., and generally used in the manufacture of paper diapers, etc. It is.

  FIG. 2 is an enlarged view schematically showing the application pattern 12 of the adhesive of this example. At the intersection of the spirals applied by the spiral spray method, the adhesive twice as much as that of the other part is applied, resulting in a high application area 12b having a high application height, which are distributed in the form of dots as shown in the figure. Will do. On the other hand, the part other than the high part application region 12b becomes a low part application region 12a having a low application height. By using the spiral spray method in this way, the coating pattern 12 having the low coating region 12a and the high coating region 12b having different coating heights can be formed very easily like a single stroke. Moreover, the ratio and arrangement | positioning of the low part application | coating area | region 12a and the high part application | coating area | region 12b can be arbitrarily set by setting suitably the magnitude | size of a spiral, the running speed of a to-be-coated object (heat insulation board 11), etc.

  The coating pattern 12 in the present invention is not limited to the spiral pattern as described above as long as it has a low coating region 12a and a high coating region 12b. Any pattern is possible. For example, in the case of stripes (or dots), the coating height is increased at a ratio of one to several or several tens (or a ratio of one point to several or several tens) to increase the high coating area. Can be formed. Further, in the case of a lattice shape, the intersection portion can be set as a high portion application region in the same manner as the spiral shape.

  In the present invention, the ratio of the adhesive application area (the sum of the areas of the low-part application area 12a and the high-part application area 12b) to the area of the heat insulating plate, and the ratio of the area of the high-part application area 12b to the adhesive application area In consideration of the adhesive force required when temporarily fixing the heat insulating plate to the adherend member in the heat insulating method of the present invention, and the adhesive force required when configuring the heat insulating plate assembly of the present invention It can be designed as appropriate.

  Although the ratio of the application area of the adhesive with respect to the area of a heat insulating plate is based also on the kind of adhesive, etc., about 2 to 20% is preferable normally. When this ratio is less than 2%, it is difficult to obtain a sufficient temporary fixing force when temporarily fixing the heat insulating plate to the adherend member in the heat insulating method of the present invention. On the other hand, if it exceeds 20%, an increase in cost due to the use of an unnecessary pressure-sensitive adhesive is caused.

  Moreover, although the ratio of the area of the high part application | coating area | region 12b with respect to the application area of an adhesive agent also depends on the kind of adhesive etc., about 5 to 50% is preferable normally. If this ratio is less than 5%, while a large number of heat-insulating plates with adhesive are stacked and stored and transported, depending on the distribution state of the high-part application region 12b, only the high-part application region 12b Instead, it is also adhered by the adhesive in the lower coating region 12a and is easily adhered with an excessive adhesive force, and when the heat insulating plate is separated and used, a part of the heat insulating plate is easily damaged. On the other hand, if it exceeds 50%, when constituting the heat insulating plate assembly of the present invention, even if only sticking with the adhesive of the high portion application region 12b, it becomes easy to stick with excessive adhesive force, When separating and using a heat insulation board, a part of heat insulation board becomes easy to be damaged.

  The heat insulation board aggregate | assembly of this invention adheres the above heat insulating boards with an adhesive, and was integrated, The structural example is shown in FIG.3 and FIG.4. In these drawings, (a) is an overall perspective view, and (b) is a schematic diagram for explaining an adhesive state.

  The heat insulating plate assembly 30 in FIG. 3A is composed of nine heat insulating plates 31 with an adhesive according to the present invention having the above-described configuration, and one sheet (the uppermost one) not coated with an adhesive. As shown in FIG. 3B, the adhesive application surface 33 and the adhesive non-application surface 34 are adhered and integrated as shown in FIG.

  The heat insulating plate assembly 40 in FIG. 4 (a) is an assembly of two heat insulating plates 41 and 42 with pressure-sensitive adhesive of the present invention having the above-described configuration, and the pressure-sensitive adhesive application surfaces are adhered to each other. It has become. When the adhesive application surfaces are thus adhered to each other, as shown in FIG. 4B, the application pattern 43 of the heat-insulating board 41 with adhesive and the application pattern 44 of the heat-insulating board 42 with adhesive do not overlap. It is preferable to do so.

  In the heat-insulating plate with an adhesive of the present invention, the adhesive application pattern has a low application area 12a and a high application area 12b with different application heights. As shown in 3 (b) and FIG. 4 (b), the heat insulating plates can be adhered to each other substantially only by the adhesive in the high-part coating region 12b. In addition, in the example of FIG.3 (b) and FIG.4 (b), although the low part application | coating area | region 12a has left | separated completely from the other party heat insulating board, you may contact | connect partially.

  In the heat insulating plate assembly in which a plurality of heat insulating plates with pressure-sensitive adhesives are integrated as described above, the heat insulating plate can be easily peeled off and used on site. That is, since the heat insulating plates are adhered to each other with a small adhesive force by a part of the applied adhesive (high portion application region 12b), the heat insulating plates can be easily separated without being damaged at the time of peeling. In particular, in the case where the high portion application region 12b is distributed in the form of dots, it can be separated very well.

Next, the heat insulation construction method of this invention is demonstrated.
The heat insulation method of the present invention is constructed by laying a deck plate as a formwork and insulating heat on this, as in the heat insulation construction of RC and SRC structure floors and roof slabs as described in Patent Documents 1 and 2, for example. It is a construction method that requires temporary fixing of the heat insulating plate so that the heat insulating plate is not blown by wind or misalignment when laying the plate, and on the adherend member (the deck plate in the above example) The heat-insulating plate with the adhesive separated from the above-described heat-insulating plate assembly of the present invention is adhered and temporarily fixed by the adhesives in both the low-part application region 12a and the high-part application region 12b.

  In the heat insulating plate with the pressure sensitive adhesive separated from the heat insulating plate assembly of the present invention, the pressure sensitive adhesive in the low-part coating region 12a keeps the initial adhesive force as it is, almost in the state at the time of manufacture. Moreover, although the adhesive of the high part application | coating area | region 12b will be in the state collapsed a little, it is maintaining the adhesive force. Then, as shown in FIG. 5, when a relatively large pressure (pressure greater than the pressure applied when forming the heat insulating plate assembly) is applied, the pressure-sensitive adhesive heat insulating plate 50 is adhered to the adherend member 51. Adhesiveness of both the low part application area 12a and the high part application area 12b can be used to obtain a sufficient temporary fixing force.

  As described above, according to the present invention, heat insulating plates with pressure-sensitive adhesive can be stored and transported in a pile without requiring release paper, and the production cost of heat-insulating plates with pressure-sensitive adhesive can be reduced, Since no release paper treatment (peeling and disposal) is required even at the site, construction costs can be reduced.

It is a top view which shows an example of the heat insulating board with an adhesive of this invention. It is an enlarged view which shows typically the application pattern of the adhesive in the heat insulating board with an adhesive of FIG. An example of the heat insulation board aggregate | assembly of this invention is shown, (a) is a whole perspective view, (b) is typical sectional drawing for demonstrating the state of adhesion. The another example of the heat insulation board assembly of this invention is shown, (a) is a whole perspective view, (b) is typical sectional drawing for demonstrating the state of adhesion. It is typical sectional drawing for demonstrating the state of temporary fixing of the heat insulation board with an adhesive in the heat insulation construction method of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Heat insulation board 11 with adhesive agent Heat insulation board 12 Application pattern 12a of adhesive part Low application | coating area 12b High application | coating area 30 Heat insulation board assembly 31 Heat insulation board 32 with adhesive agent Heat insulation board 33 with which adhesive agent is not applied Surface 34 Adhesive non-application surface 40 Insulating plate aggregates 41, 42 Insulating plates 43, 44 with adhesive Adhesive application pattern 50 Insulating plate 51 with adhesive Adhesive member

Claims (8)

  A heat-insulating plate with an adhesive having a pressure-sensitive adhesive application pattern on one side of the heat-insulating plate, wherein the application pattern has a low-part application region and a high-part application region having different application heights. Insulation board with adhesive.   The heat-insulating plate with an adhesive according to claim 1, wherein the high-part application region is distributed in a dotted pattern.   The heat insulating plate with an adhesive according to claim 1 or 2, wherein the application pattern is applied by a spiral spray method.   A heat insulating plate assembly comprising a plurality of heat-insulating plates with pressure-sensitive adhesive according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive-coated surface and the pressure-sensitive adhesive non-coated surface are bonded together.   The heat insulating board aggregate | assembly characterized by sticking the adhesive application surfaces and integrating the two heat insulating board with an adhesive in any one of Claims 1 thru | or 3.   The heat-insulating plate assembly according to claim 5, wherein the adhesive application patterns of the two heat-insulating plates with pressure-sensitive adhesive do not overlap.   The heat-insulating plate assembly according to any one of claims 4 to 6, wherein the heat-insulating plates with pressure-sensitive adhesives are substantially adhered only with the pressure-sensitive adhesive in the high-part coating region.   In the heat insulation method which requires temporary fixing of a heat insulating board when attaching a heat insulating board to a structure, an adhesive is attached to the member to be adhered to the heat insulating board aggregate according to any one of claims 4 to 7. A heat insulation method characterized in that a heat insulating plate is adhered and temporarily fixed with adhesives in both the low part application region and the high part application region.

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