JP2007027674A - Maintenance method, exposure method, exposure apparatus, and device producing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a maintenance method with which influence of liquid to an exposure apparatus can be reduced. <P>SOLUTION: An exposure apparatus emits exposure light EL with a space KS between specific optical elements LS1, LS2, filled with liquid LQ, out of plural optical elements included in a projection optical system. When the exposure light EL is not emitted, the liquid LQ in the space KS is replaced with another function liquid LK. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus maintenance method, an exposure method, an exposure apparatus, and a device manufacturing method.

In a photolithography process that is one of the manufacturing processes of microdevices such as semiconductor devices and liquid crystal display devices, an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. This exposure apparatus has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and projects the mask pattern onto the substrate via a projection optical system while sequentially moving the mask stage and the substrate stage. is there. In the manufacture of micro devices, miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this demand, it is desired to further increase the resolution of the exposure apparatus. As one of means for realizing the high resolution, the liquid immersion area is formed by filling the space between the projection optical system and the substrate as disclosed in Patent Document 1 below. An immersion exposure apparatus has been devised that performs an exposure process through a region of liquid.
International Publication No. 99/49504 Pamphlet

  In immersion exposure systems and immersion optical systems installed in immersion exposure systems, if the liquid that fills the predetermined space through which exposure light passes is left for a long period of time, the liquid may deteriorate due to the generation of bacteria. The member (such as an optical element) that is in contact with the liquid may be deteriorated. Further, if the liquid in the predetermined space is simply collected (discharged), the liquid may remain on the member (optical element) that has been in contact with the liquid, and contaminants may adhere to the member. .

  SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances. An exposure apparatus maintenance method, an exposure method, an exposure apparatus, an exposure method thereof, and the same thereof, which can maintain desired performance even when the immersion method is used. It is an object to provide a device manufacturing method using an exposure apparatus.

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 8 shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, a maintenance method for an exposure apparatus (EX) that exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) via a projection optical system (PL). In the exposure of the substrate (P), a predetermined space (K2, KS) between the specific optical elements (LS1, LS2) among the plurality of optical elements (LS1 to LS7) constituting the projection optical system (PL) is set to the first. This is performed by irradiating the exposure light (EL) in a state filled with one liquid (LQ), and when the exposure light (EL) is not irradiated, the predetermined space (K2, KS) is changed to the first liquid (LQ). A maintenance method for replacing with a second liquid (LK) different from the above is provided.

  According to the first aspect of the present invention, it is possible to prevent the deterioration of the first liquid, the optical element, and the contamination by replacing the predetermined space with the second liquid when the exposure light is not irradiated. it can.

  According to the second aspect of the present invention, in the maintenance method of the exposure apparatus (EX) that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL), the exposure of the substrate (P) is performed. The exposure light (EL) is irradiated by irradiating the exposure light (EL) in a state where a predetermined space (K2, KS) of a part of the optical path space of the exposure light (EL) is filled with the liquid (LQ). In order to remove the liquid (LQ) from the predetermined space (K2, KS), the temperature of the object (LS1, LS2) that forms the predetermined space (K2, KS) is adjusted while the temperature is not adjusted. A maintenance method for supplying gas (G) to K2, KS) is provided.

  According to the 2nd aspect of this invention, when removing a liquid, the temperature change of the object accompanying supply of gas can be suppressed by supplying gas, adjusting the temperature of an object.

  According to the third aspect of the present invention, exposure that exposes a substrate by irradiating the substrate (P) with exposure light (EL) through a projection optical system (PL) including a plurality of optical elements (LS1 to LS7). A method of exposing light (EL) to a substrate in a state where a predetermined space (K2, KS) between specific optical elements (LS1, LS2) among the plurality of optical elements is filled with a first liquid (LQ). And an exposure method including replacing the predetermined space (K2, KS) with a second liquid (LK) different from the first liquid when the exposure light (EL) is not irradiated. .

  According to the third aspect of the present invention, it is possible to prevent deterioration of the first liquid, optical element, and contamination by replacing the predetermined space with the second liquid when the exposure light is not irradiated. it can.

  According to the fourth aspect of the present invention, in the exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL) via the projection optical system (PL), the substrate (P) When irradiating exposure light (EL) to a predetermined space (K2, KS) between specific optical elements (LS1, LS2) among a plurality of optical elements (LS1 to LS7) constituting the projection optical system (PL). An immersion mechanism that fills with the first liquid (LQ) and replaces the predetermined space (K2, KS) with a second liquid (LK) different from the first liquid (LQ) when the exposure to the exposure light (EL) is stopped. An exposure apparatus (EX) provided with (35 etc.) is provided.

  According to the fourth aspect of the present invention, when the exposure light is not irradiated, the predetermined space is replaced with the second liquid, thereby degrading the first liquid used in the exposure apparatus or the optical element, Contamination can be prevented.

  According to the fifth aspect of the present invention, in the exposure apparatus that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL), the substrate (P) is irradiated with exposure light (EL). Sometimes, a liquid immersion mechanism (such as 35) that fills a predetermined space (K2, KS) of a part of the optical path space of the exposure light (EL) with liquid (LQ), and a predetermined space when irradiation of the exposure light (EL) is stopped. In order to remove the liquid (LQ) from (K2, KS), the gas supply system (50) for supplying the gas (G) to the predetermined space (K2, KS) and the predetermined space when supplying the gas (G) An exposure apparatus (EX) is provided that includes a temperature adjustment device (61, 62) that adjusts the temperature of the objects (LS1, LS2) that form (K2, KS).

  According to the fifth aspect of the present invention, when removing the liquid, by supplying the gas while adjusting the temperature of the object, it is possible to suppress the temperature change of the object accompanying the supply of the gas.

  According to a sixth aspect of the present invention, there is provided an exposure apparatus (EX) that exposes the substrate (P) by irradiating the substrate (P) with exposure light (EL), the plurality of optical elements (LS1 to LS7). ) And a liquid that fills a predetermined space (K2, KS) between the specific optical elements (LS1, LS2) among the plurality of optical elements (LS1 to LS7) with the liquid (LQ). An exposure apparatus (EX) including an immersion mechanism (35, etc.) and a gas supply system (50) for supplying gas (G) to the predetermined space (K2, KS) when the exposure light (EL) is not irradiated. ) Is provided.

  In the exposure apparatus of the sixth aspect, the gas supply system supplies gas to the predetermined space to dry the inside of the predetermined space, thereby reducing adverse effects in immersion exposure.

  According to the seventh aspect of the present invention, there is provided a device manufacturing method using the exposure apparatus (EX) of the above aspect.

  According to the seventh aspect of the present invention, a device having a desired performance can be manufactured by using an exposure apparatus in which the influence from the liquid is reduced.

  According to the eighth aspect of the present invention, there is provided a device manufacturing method using the above exposure method.

According to the eighth aspect of the present invention, a device having a desired performance can be manufactured by using an exposure method in which the influence from the liquid is reduced.

  According to the present invention, exposure accuracy and measurement accuracy can be maintained even when the immersion method is used.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<First Embodiment>
A first embodiment will be described with reference to the drawings. FIG. 1 is a schematic block diagram showing an exposure apparatus according to the first embodiment, and FIG. 2 is an enlarged view of a main part of FIG. 1 and 2, the exposure apparatus EX has a mask stage MST that can move while holding the mask M, and a substrate holder PH that holds the substrate P, and can move the substrate holder PH that holds the substrate P. Substrate stage PST, illumination optical system IL for illuminating mask M held on mask stage MST with exposure light EL, and substrate on which a pattern image of mask M illuminated with exposure light EL is held on substrate stage PST A projection optical system PL that performs projection exposure on P, and a control device CONT that controls the overall operation of the exposure apparatus EX are provided. The projection optical system PL includes a plurality of optical elements LS1 to LS7, and the plurality of optical elements LS1 to LS7 are supported by a lens barrel PK.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to substantially shorten the exposure wavelength to improve the resolution and substantially widen the depth of focus. Among the plurality of optical elements LS1 to LS7 included in the PL, the optical path space between the first optical element LS1 closest to the image plane of the projection optical system PL and the substrate P is filled with the liquid LQ, and the first immersion region LR1. The first liquid immersion mechanism 1 is formed. In the exposure apparatus EX of the present embodiment, a liquid that is larger than the projection area AR and smaller than the substrate P is partially formed on the substrate P including the projection area AR (area where the exposure light EL is irradiated) of the projection optical system PL. A local liquid immersion method for locally forming the first liquid immersion region LR1 of the LQ is employed.

  As will be described later, the projection optical system PL includes a first optical element LS1 closest to the image plane of the projection optical system PL, and a second optical element LS2 closest to the image plane of the projection optical system PL after the first optical element LS1. The exposure apparatus EX fills the optical path space between the first optical element LS1 and the second optical element LS2 with the liquid LQ, so that the first optical element is filled with the liquid LQ. A second immersion mechanism 2 is also provided that forms a second immersion region LR2 on the upper surface T2 of the element LS1.

  The first immersion mechanism 1 includes a first nozzle member 71 having a first supply port 12 for supplying the liquid LQ and a first recovery port 22 for recovering the liquid LQ, and a first supply provided in the first nozzle member 71. An image of the projection optical system PL via the first liquid supply mechanism 10 that supplies the liquid LQ to the image plane side of the projection optical system PL via the port 12 and the first recovery port 22 provided in the first nozzle member 71. And a first liquid recovery mechanism 20 that recovers the liquid LQ on the surface side. The first nozzle member 71 is provided in the vicinity of the image plane side of the projection optical system PL, and is formed in an annular shape so as to surround the first optical element LS1 above the substrate P (substrate stage PST). Here, the first optical element LS1 in the present embodiment is exposed from the lens barrel PK. The operation of the first immersion mechanism 1 is controlled by the control device CONT.

  The second immersion mechanism 2 includes a second nozzle member 72 having a second supply port 32 for supplying the liquid LQ and a second recovery port 42 for recovering the liquid LQ, and a second supply provided in the second nozzle member 72. A second liquid supply mechanism 30 that supplies the liquid LQ to the optical path space between the first optical element LS1 and the second optical element LS2 via the port 32, and a second recovery port 42 provided in the second nozzle member 72. And a second liquid recovery mechanism 40 that recovers the liquid LQ supplied by the second liquid supply mechanism 30. The second nozzle member 72 is provided above the first nozzle member 71, and is formed in an annular shape so as to surround the optical path space between the first optical element LS1 and the second optical element LS2. The operation of the second immersion mechanism 2 is controlled by the control device CONT.

  Here, in the following description, the optical path space between the first optical element LS1 and the substrate P (substrate stage PST) is defined as “first space K1”, and between the first optical element LS1 and the second optical element LS2. The optical path space including the second space K2 and the second space K2 and surrounded by the first optical element LS1, the second optical element LS2, and the second nozzle member 72 is appropriately referred to as a “replacement space KS”. .

  Therefore, the second immersion mechanism 2 can supply the liquid LQ to the replacement space KS using the second liquid supply mechanism 30 and can recover the liquid LQ in the replacement space KS using the second liquid recovery mechanism 40. It is. Further, as will be described later, the second liquid supply mechanism 30 of the second liquid immersion mechanism 2 can supply a liquid (functional liquid) LK different from the liquid LQ to the replacement space KS.

  The second nozzle member 72 also has a function as a holding member (lens cell) that holds the first optical element LS1, and constitutes a part of the lens barrel PK. That is, in the present embodiment, the lens barrel PK is connected to the lens barrel main body PKA that holds the optical elements LS2 to LS7 and the lower end portion of the lens barrel main body PKA, and the holding member (first member) that holds the first optical element LS1. 2 nozzle member) 72. The second nozzle member 72 does not necessarily constitute a part of the lens barrel PK, and may be a member that is completely separated from the lens barrel PK.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis, and A direction perpendicular to the Y-axis direction and coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a photosensitive material (resist), and the “mask” includes a reticle on which a device pattern to be projected onto the substrate is reduced.

The illumination optical system IL includes an exposure light source that emits exposure light EL, an optical integrator that equalizes the illuminance of the exposure light EL emitted from the exposure light source, a condenser lens that collects the exposure light EL from the optical integrator, and a relay. A lens system and a field stop for setting an illumination area on the mask M by the exposure light EL are included. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the exposure light source, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, Further, vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used for the liquid LQ that forms the first immersion region LR1 and the liquid LQ that forms the second immersion region LR2. That is, in the present embodiment, the liquid LQ that forms the first immersion region LR1 and the liquid LQ that forms the second immersion region LR2 are the same type of liquid. Pure water can transmit not only ArF excimer laser light but also far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). It is. If the exposure light EL is transmissive, the liquid LQ that forms the first liquid immersion region LR1 and the liquid LQ that forms the second liquid immersion region LR2 are different types in order to obtain desired optical characteristics. It may be liquid. Further, even if the same type of liquid is used, the properties (temperature, specific resistance, TOC, etc.) of the liquid forming the first immersion region LR1 and the liquid forming the second immersion region LR2 are different. May be.

  Mask stage MST is movable while holding mask M. Mask stage MST holds mask M by vacuum suction (or electrostatic suction). The mask stage MST is in a plane perpendicular to the optical axis AX of the projection optical system PL in a state where the mask M is held by driving a mask stage driving device MSTD including a linear motor controlled by the control device CONT, that is, XY. It can move two-dimensionally in the plane and can rotate slightly in the θZ direction. A movable mirror 91 is provided on the mask stage MST. A laser interferometer 92 is provided at a position facing the moving mirror 91. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 92. The measurement result of the laser interferometer 92 is output to the control device CONT. The control device CONT drives the mask stage drive device MSTD based on the measurement result of the laser interferometer 92, and controls the position of the mask M held on the mask stage MST.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β. In this embodiment, the projection magnification β is, for example, 1/4, 1/5, or 1 This is a / 8 reduction system and a refraction system that does not include a reflective element. The projection optical system PL may be a reflection system or a catadioptric system. Further, the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the first optical element LS1 is a non-refractive parallel plane plate capable of transmitting the exposure light EL, and the lower surface T1 and the upper surface T2 of the first optical element LS1 are substantially parallel. On the other hand, the second optical element LS2 has a refractive power (lens action). Note that the first optical element LS1 may have refractive power (lens action).

  The substrate stage PST has a substrate holder PH that holds the substrate P, and is movable on the base member BP on the image plane side of the projection optical system PL. The substrate holder PH holds the substrate P by, for example, vacuum suction. A recess 96 is provided on the substrate stage PST, and a substrate holder PH for holding the substrate P is disposed in the recess 96. The upper surface 97 of the substrate stage PST other than the recess 96 is a flat surface (flat portion) that is substantially the same height (flat surface) as the upper surface of the substrate P held by the substrate holder PH.

  The substrate stage PST is driven in the XY plane on the base member BP in a state where the substrate P is held via the substrate holder PH by driving the substrate stage driving device PSTD including a linear motor and the like controlled by the control device CONT. Dimensional movement is possible, and minute rotation is possible in the θZ direction. Furthermore, the substrate stage PST is also movable in the Z-axis direction, the θX direction, and the θY direction. Therefore, the upper surface of the substrate P supported by the substrate stage PST can move in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. A movable mirror 93 is provided on the side surface of the substrate stage PST. A laser interferometer 94 is provided at a position facing the moving mirror 93. The position and rotation angle of the substrate P on the substrate stage PST in the two-dimensional direction are measured in real time by the laser interferometer 94. Further, the exposure apparatus EX, for example, disclosed in JP-A-8-37149, is an oblique incidence type focus leveling detection that detects surface position information of the upper surface of the substrate P supported by the substrate stage PST. A system (not shown) is provided. The focus / leveling detection system detects surface position information of the upper surface of the substrate P (position information in the Z-axis direction and inclination information of the substrate P in the θX and θY directions). The focus / leveling detection system may employ a system using a capacitive sensor. The measurement result of the laser interferometer 94 is output to the control device CONT. The detection result of the focus / leveling detection system is also output to the control device CONT. The control device CONT drives the substrate stage drive device PSTD based on the detection result of the focus / leveling detection system, and controls the focus position (Z position) and the tilt angles (θX, θY) of the substrate P to control the substrate P. The upper surface is adjusted to the image plane of the projection optical system PL, and the position control of the substrate P in the X-axis direction, the Y-axis direction, and the θZ direction is performed based on the measurement result of the laser interferometer 94.

  Next, the first liquid immersion mechanism 1 and the second liquid immersion mechanism 2 will be described. The first liquid supply mechanism 10 of the first immersion mechanism 1 is for supplying the liquid LQ to the optical path space (first space) K1 between the first optical element LS1 of the projection optical system PL and the substrate P. The liquid supply unit 11 can supply the liquid LQ, and the first supply pipe 13 is connected to the liquid supply unit 11 at one end thereof. The other end of the first supply pipe 13 is connected to the first nozzle member 71. A first valve 13B for opening and closing the flow path is provided in the middle of the first supply pipe 13. Inside the first nozzle member 71, an internal flow path (supply flow path) that connects the other end of the first supply pipe 13 and the first supply port 12 is formed. The liquid supply unit 11 of the first immersion mechanism 1 includes a tank that stores the liquid LQ, a pressure pump, a filter unit that removes foreign matter in the liquid LQ, and the like. The supply operation of the liquid supply unit 11 and the opening / closing operation of the first valve 13B are controlled by the control device CONT.

  The first liquid recovery mechanism 20 of the first liquid immersion mechanism 1 is for recovering the liquid LQ supplied by the first liquid supply mechanism 10, and includes a liquid recovery unit 21 that can recover the liquid LQ, and a liquid The recovery part 21 is provided with the 1st recovery pipe 23 which connects the one end part. The other end of the first recovery pipe 23 is connected to the first nozzle member 71. A second valve 23B for opening and closing the flow path is provided in the middle of the first recovery pipe 23. An internal flow path (recovery flow path) that connects the other end portion of the first recovery pipe 23 and the first recovery port 22 is formed inside the first nozzle member 71. The liquid recovery unit 21 of the first immersion mechanism 1 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ Etc. The recovery operation of the liquid recovery unit 21 and the opening / closing operation of the second valve 23B are controlled by the control device CONT.

  The first supply port 12 for supplying the liquid LQ and the first recovery port 22 for recovering the liquid LQ are formed on the lower surface 71A of the first nozzle member 71. The lower surface 71A of the first nozzle member 71 is provided at a position facing the upper surface of the substrate P and the upper surface 97 of the substrate stage PST. A plurality of first supply ports 12 are provided on the lower surface 71A of the first nozzle member 71 so as to surround the first optical element LS1 of the projection optical system PL (the optical axis AX of the projection optical system PL). Further, the first recovery port 22 is provided on the lower surface 71A of the first nozzle member 71 away from the first supply port 12 with respect to the first optical element LS1. 1 is provided so as to surround the supply port 12.

  The second liquid supply mechanism 30 of the second immersion mechanism 2 is liquid in the replacement space KS including the optical path space (second space) K2 between the first optical element LS1 and the second optical element LS2 of the projection optical system PL. It is for supplying LQ, and includes a liquid supply unit 31 that can supply liquid LQ, and a second supply pipe 33 that connects one end of the liquid supply unit 31 to the liquid supply unit 31. The other end of the second supply pipe 33 is connected to the second nozzle member 72. A third valve 33B for opening and closing the flow path is provided in the middle of the second supply pipe 33. An internal flow path (supply flow path) that connects the other end of the second supply pipe 33 and the second supply port 32 is formed inside the second nozzle member 72. The liquid supply unit 31 of the second immersion mechanism 2 includes a tank that stores the liquid LQ, a pressure pump, a filter unit that removes foreign matters in the liquid LQ, and the like. The supply operation of the liquid supply unit 31 and the opening / closing operation of the third valve 33B are controlled by the control device CONT.

  The second liquid recovery mechanism 40 of the second liquid immersion mechanism 2 is for recovering the liquid LQ supplied by the second liquid supply mechanism 30, and includes a liquid recovery unit 41 that can recover the liquid LQ, and a liquid The recovery part 41 is provided with the 2nd recovery pipe 43 which connects the one end part. The other end of the second recovery pipe 43 is connected to the second nozzle member 72. A fourth valve 43B for opening and closing the flow path is provided in the middle of the second recovery pipe 43. An internal flow path (recovery flow path) that connects the other end of the second recovery pipe 43 and the second recovery port 42 is formed inside the second nozzle member 72. The liquid recovery unit 41 of the second immersion mechanism 2 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ Etc. The recovery operation of the liquid recovery unit 41 and the opening / closing operation of the fourth valve 43B are controlled by the control device CONT.

  The second supply port 32 for supplying the liquid LQ and the second recovery port 42 for recovering the liquid LQ are formed on the inner surface of the second nozzle member 72, and each of the second supply port 32 and the second recovery port 42 is formed. The replacement space KS including the second space K2 is connected. In the present embodiment, the second supply port 32 is provided on one side (+ X side) of the inner surface of the second nozzle member 72 with respect to the optical axis AX, and the second recovery port 42 is disposed on the other side (− X side).

  Note that the tanks, pressure pumps, filter units, and the like of the liquid supply units 11 and 31 do not have to be all provided in the exposure apparatus main body EX, but are replaced with facilities such as a factory in which the exposure apparatus main body EX is installed. May be. Similarly, the vacuum system, the gas-liquid separator, the tank and the like of the liquid recovery units 21 and 41 do not have to be all provided in the exposure apparatus main body EX, and facilities such as a factory in which the exposure apparatus main body EX is installed. You may substitute. Here, the first and second liquid immersion mechanisms 1 and 2 are provided with the liquid supply parts 11 and 31 independent of each other. However, the first and second liquid immersion mechanisms 1 and 2 are provided as one liquid supply part. May also be used. Similarly, the first and second liquid immersion mechanisms 1 and 2 may also serve as one liquid recovery unit.

  The second liquid supply mechanism 30 of the second immersion mechanism 2 includes a functional liquid supply unit 35 that can supply a functional liquid LK having a predetermined function. One end of a third supply pipe 37 is connected to the functional liquid supply unit 35, and the other end of the third supply pipe 37 is connected in the middle of the second supply pipe 33. A fifth valve 37B for opening and closing the flow path is provided in the middle of the third supply pipe 37. The functional liquid supply unit 35 includes a tank that stores the functional liquid LK, a pressure pump, a filter unit that removes foreign matter in the functional liquid LK, and the like. However, the tank, pressure pump, filter unit, etc. for the functional liquid LK need not all be provided in the exposure apparatus main body EX, and can be replaced by equipment such as a factory in which the exposure apparatus main body EX is installed. Good. The supply operation of the functional liquid supply unit 35 is controlled by the control device CONT. The functional liquid LK has a function of suppressing the generation of viable bacteria, and is an aqueous solution of hydrogen peroxide in the present embodiment. The supply operation of the functional liquid supply unit 35 and the opening / closing operation of the fifth valve 37B are controlled by the control device CONT.

  The control device CONT drives each of the third valve 33B and the fifth valve 37B, closes the flow path of the second supply pipe 33 connected to the liquid supply unit 31, and is connected to the functional liquid supply unit 35. By opening the flow path of the third supply pipe 37, the functional liquid LK delivered from the functional liquid supply section 35 is supplied to the second supply of the third supply pipe 37, the second supply pipe 33, and the second nozzle member 72. It can be supplied to the replacement space KS including the second space K2 through the mouth 32. That is, the control device CONT controls the operation of the third and fifth valves 33B and 37B, thereby supplying the liquid LQ to the replacement space KS by the liquid supply unit 31 via the second supply port 32 and the functional liquid supply unit. The supply of the functional liquid LK to the replacement space KS by 35 can be switched.

  Next, an operation for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  As shown in FIG. 2, at least during the transfer of the pattern image of the mask M onto the substrate P, the control device CONT uses the first immersion mechanism 1 to use the first optical element LS1 and its image plane. The optical path space (first space) K1 with the substrate P disposed on the side is filled with the liquid LQ to form the first liquid immersion region LR1, and the second liquid immersion mechanism 2 is used to form the first optical element. An optical path space (second space) K2 between LS1 and the second optical element LS2 is filled with the liquid LQ to form a second immersion region LR2.

  When filling the first space K1 with the liquid LQ, the control device CONT drives each of the liquid supply unit 11 and the liquid recovery unit 21 of the first liquid immersion mechanism 1. In addition, the control device CONT drives the first and second valves 13B and 23B, the flow path of the first supply pipe 13 connected to the liquid supply section 11, and the first recovery pipe 23 connected to the liquid recovery section 21. Open each of the channels. When the liquid LQ is delivered from the liquid supply unit 11 under the control of the control device CONT, the liquid LQ delivered from the liquid supply unit 11 flows through the first supply pipe 13 and then the first nozzle member 71. Is supplied from the first supply port 12 to the image plane side of the projection optical system PL through the supply flow path. When the liquid recovery unit 21 is driven under the control device CONT, the liquid LQ on the image plane side of the projection optical system PL flows into the recovery flow path of the first nozzle member 71 through the first recovery port 22. Then, after flowing through the first recovery pipe 23, it is recovered by the liquid recovery part 21.

  The control device CONT supplies a predetermined amount of the liquid LQ onto the substrate P using the first liquid supply mechanism 10, and collects a predetermined amount of the liquid LQ on the substrate P using the first liquid recovery mechanism 20. A first immersion region LR1 of the liquid LQ is locally formed on the substrate P. During the irradiation of the exposure light EL at least on the substrate P, the control device CONT applies the first light so that the optical path space (first space) K1 between the first optical element LS1 and the substrate P is filled with the liquid LQ. The liquid LQ supply operation and the recovery operation by the liquid immersion mechanism 1 are continuously performed.

  Further, when the second space K2 is filled with the liquid LQ, the control device CONT drives each of the liquid supply unit 31 and the liquid recovery unit 41 of the second liquid immersion mechanism 2. At this time, the control device CONT drives the third and fifth valves 33B and 37B to open the flow path of the second supply pipe 33 connected to the liquid supply unit 31, and to connect to the functional liquid supply unit 35. The flow path of the supply pipe 37 is closed. Further, the control device CONT drives the fourth valve 43B to open the flow path of the second recovery pipe 43 connected to the liquid recovery unit 41. When the liquid LQ is delivered from the liquid supply unit 31 under the control of the control device CONT, the liquid LQ delivered from the liquid supply unit 31 flows through the second supply pipe 33 and then the second nozzle member 72. Is supplied from the second supply port 32 to the replacement space KS including the second space K2. Further, when the liquid recovery unit 41 is driven under the control device CONT, the liquid LQ in the replacement space KS flows into the recovery flow path of the second nozzle member 72 via the second recovery port 42, and the second recovery is performed. After flowing through the tube 43, it is recovered by the liquid recovery part 41.

  The control device CONT supplies a predetermined amount of liquid LQ to the replacement space KS including the second space K2 using the second liquid supply mechanism 30, and uses the second liquid recovery mechanism 40 to supply the liquid LQ in the replacement space KS. By collecting a predetermined amount, at least the second space K2 of the replacement space KS is filled with the liquid LQ. The control device CONT supplies the liquid LQ by the second immersion mechanism 2 so that the optical path space (second space) K2 between the first optical element LS1 and the second optical element LS2 is filled with the liquid LQ. Perform a collection operation.

  The second immersion mechanism 2 is configured to fill only a part of the replacement space KS including the optical path space (second space) K2 between the first optical element LS1 and the second optical element LS2 with the liquid LQ. Alternatively, the replacement space KS may be filled with the liquid LQ. In short, it is sufficient that the optical path space (second space) K2 of the exposure light EL between the first optical element LS1 and the second optical element LS2 is filled with the liquid LQ.

  Further, the amount of liquid supplied by the second immersion mechanism 2 may be smaller than that of the first immersion mechanism 1, and when the exposure light EL passes through the projection optical system PL, the second immersion mechanism 2 The liquid supply operation and the liquid recovery operation are stopped, and the liquid supply operation and the liquid recovery operation by the second liquid immersion mechanism 2 are performed only when the exposure light EL does not pass through the projection optical system PL such as during the exchange of the substrate P. It may be.

  Then, the control device CONT fills the liquid LQ and the projection optical system PL in the first and second spaces K1, K2 in a state where the first space K1 and the second space K2 which are optical path spaces of the exposure light EL are filled with the liquid LQ. The pattern of the mask M is projected and exposed onto the substrate P by irradiating the substrate P with the exposure light EL that has passed through the mask M via the. The exposure light EL emitted from the illumination optical system IL enters the projection optical system PL from the object plane side, passes through each of the plurality of optical elements LS7 to LS3, and then is a predetermined region on the upper surface T4 of the second optical element LS2. After passing through a predetermined region of the lower surface T3, the light enters the second immersion region LR2. The exposure light EL that has passed through the second liquid immersion region LR2 passes through a predetermined region on the upper surface T2 of the first optical element LS1, and then is emitted from the predetermined region on the lower surface T1, and then enters the first liquid immersion region LR1. It reaches on the substrate P.

  In the present embodiment, the space between the first optical element LS1 including the first space K1 and the substrate P and the replacement space KS including the second space K2 are independent spaces, and the first space K1 and The liquid LQ and the functional liquid LK do not enter or exit from one side of the second space K2 (replacement space KS) to the other. The control device CONT supplies and recovers the liquid LQ to the first space K1 by the first liquid immersion mechanism 1, and supplies the liquid LQ to the second space K2 (substitution space KS) by the second liquid immersion mechanism 2. The collecting operation can be performed independently of each other.

  Then, by filling each of the first space K1 and the second space K2 with the liquid LQ, the difference in refractive index at the interface between the second optical element LS2 and the first optical element LS1 and the first space K1 and the second space K2. Therefore, the reflection loss on the lower surface T3 of the second optical element LS2 and the upper surface T2 of the first optical element LS1 is reduced, and the substrate P can be exposed well in a state where a large image-side numerical aperture is ensured. it can.

  Next, a maintenance method for the exposure apparatus EX will be described with reference to FIG. FIG. 3A is a diagram showing a state when the exposure light EL is irradiated on the substrate P. FIG. As described above, when irradiating the exposure light EL, the control device CONT controls the third and fifth valves 33B and 37B to open the flow path of the second supply pipe 33 connected to the liquid supply unit 31, and The flow path of the third supply pipe 37 connected to the functional liquid supply unit 35 is closed. At this time, the control device CONT controls the fourth valve 43B to open the flow path of the second recovery pipe 43 connected to the liquid recovery part 41. By doing so, when the control device CONT irradiates the substrate P with the exposure light EL, among the plurality of optical elements LS1 to LS7 included in the projection optical system PL, the specific first and second optical elements LS1 and LS2 are selected. The second space K2 (replacement space KS) in between can be filled with liquid (pure water) LQ.

  When the operation of the exposure apparatus EX is stopped for a predetermined period, such as during maintenance of the exposure apparatus EX, the irradiation of the exposure light EL is stopped. When the irradiation of the exposure light EL is stopped, as shown in FIG. 3B, the control device CONT controls the third and fifth valves 33 </ b> B and 37 </ b> B and connects to the liquid supply unit 31. The flow path of the third supply pipe 37 connected to the functional liquid supply unit 35 is opened. That is, when the irradiation of the exposure light EL is stopped, the functional liquid LK is supplied to the replacement space KS by the functional liquid supply unit 35, and the supply of the liquid LQ by the liquid supply unit 31 is stopped. At this time, the flow path of the second recovery pipe 43 connected to the liquid recovery part 41 is open, and the recovery operation by the liquid recovery part 41 (second liquid recovery mechanism 40) is continued. The replacement space KS including the second space K2 is obtained by performing the supply operation of the functional liquid LK by the functional liquid supply unit 35 and the recovery operation by the liquid recovery unit 41 for the replacement space KS including the second space K2 for a predetermined time. Replaced with functional fluid LK. As described above, the control device CONT switches between the supply of the liquid LQ by the liquid supply unit 31 via the second supply port 32 of the second nozzle member 72 and the supply of the functional liquid LK by the functional liquid supply unit 35. By controlling the driving of the third and fifth valves 33B and 37B that function as the function liquid LK, the functional liquid LK is supplied to the replacement space KS including the second space K2, and the replacement space KS is replaced with the functional liquid LK. it can.

  In other words, after the functional liquid LK supply operation by the functional liquid supply unit 35 and the recovery operation by the liquid recovery unit 41 are continued for a predetermined time and the replacement space KS including the second space K2 is replaced with the functional liquid LK, in other words, After the liquid (pure water) LQ almost disappears in the replacement space KS, the control device CONT controls the third and fifth valves 33B and 37B as shown in FIG. The flow path of the supply pipes 33 and 37 is closed, the fourth valve 43B is controlled, the flow path of the second recovery pipe 43 is also closed, and the recovery operation by the second liquid recovery mechanism 40 is stopped. Thereby, the control apparatus CONT can maintain the state where the replacement space KS including the second space K2 is filled with the functional liquid LK.

  As described above, the functional liquid LK is a hydrogen peroxide solution and has a function of suppressing the generation of viable bacteria. When the liquid LQ made of pure water remains (stays) in the replacement space KS, for example, when the operation of the exposure apparatus EX is stopped for a predetermined period for maintenance, live bacteria such as bacteria may be generated in the replacement space KS. There is sex. When viable bacteria are generated in the replacement space KS, the upper surface T2 of the first optical element LS1, the lower surface T3 of the second optical element LS2, or the inner wall surface of the second nozzle member 72 may be contaminated. Contamination of the first and second optical elements LS1 and LS2 causes inconveniences such as a decrease in light transmittance and distribution in the light transmittance, leading to deterioration in exposure accuracy and measurement accuracy via the projection optical system PL. . When the operation of the exposure apparatus EX is resumed and the liquid LQ is supplied to the replacement space KS, the upper surface T2 of the first optical element LS1, the lower surface T3 of the second optical element LS2, or the inner wall surface of the second nozzle member 72 When contaminated, despite the supply of the clean liquid LQ, the contaminated upper surface T2 of the first optical element LS1, the lower surface T3 of the second optical element LS2, or the inner wall surface of the second nozzle member 72, The supplied liquid LQ is also contaminated, resulting in a decrease in the light transmittance of the liquid LQ. Thus, when the liquid LQ cannot be maintained in a clean state and viable bacteria are generated due to the liquid LQ, the state of the projection optical system PL deteriorates, and it becomes difficult to maintain exposure accuracy and measurement accuracy. . Although the supply operation and the recovery operation of the liquid LQ by the second immersion mechanism 2 are continued, that is, the liquid LQ is continuously supplied to the replacement space KS, the generation of viable bacteria may be suppressed. When the operation of the exposure apparatus EX is stopped for a predetermined period of time, it is difficult to continue the supply operation and the recovery operation of the liquid LQ by the second immersion mechanism 2. Further, since the replacement space KS is a closed space surrounded by the first optical element LS1, the second optical element LS2, and the second nozzle member 72, the upper surface T2 of the first optical element LS1 and the second optical element. When the lower surface T3 of the LS2 or the inner wall surface of the second nozzle member 72 is contaminated, the projection optical system PL (lens barrel) is used to clean the contaminated first and second optical elements LS1 and LS2 and the second nozzle member 72. PK) must be disassembled, and so much labor is required.

  Therefore, when the irradiation of the exposure light EL is stopped, the replacement space KS including the second space K2 is replaced with the functional liquid LK, so that the generation of viable bacteria in the replacement space KS can be prevented. Contamination of each object (the first and second optical elements LS1, LS2, the second nozzle member 72, etc.) forming the space KS can be prevented. Even when viable bacteria are generated in the replacement space KS, the viable bacteria can be removed (destroyed) by replacing the replacement space KS with the functional liquid LK.

As described above, the functional liquid LK is an aqueous solution (diluted liquid) obtained by mixing (dissolving) a predetermined amount of hydrogen peroxide water in pure water. Hydrogen peroxide solution can sufficiently suppress the generation of viable bacteria and is easy to handle. In the present embodiment, the concentration of the hydrogen peroxide solution in the aqueous solution is suppressed to 10 ⁻⁶ % or less (10 ppb or less). In order to suppress the generation of viable bacteria, it is sufficient that the concentration of the hydrogen peroxide solution is about 10 ⁻⁶ %. By suppressing the concentration of the hydrogen peroxide solution to 10 ⁻⁶ % or less, handling becomes easy, and members (first and second optical elements LS 1 and LS 2, second nozzle member 72, Generation | occurrence | production of a living microbe can fully be suppressed, suppressing the influence which acts on the supply pipe | tubes 33 and 37, the collection pipe | tube 43, etc.). Of course, the concentration of the hydrogen peroxide solution in the aqueous solution may be set to 10 ⁻⁶ % or more according to the characteristics of the member in contact with the functional liquid LK. Alternatively, undiluted hydrogen peroxide solution may be used as the functional liquid LK.

  When replacing the replacement space KS with the functional liquid LK, the second immersion mechanism 2 may fill almost all of the replacement space KS with the functional liquid LK, or the objects (first and second) forming the replacement space KS. The functional liquid LK may be arranged in a part of the replacement space KS so that the functional liquid LK contacts a region in contact with the liquid LQ on the surface of the optical elements LS1, LS2, and the second nozzle member 72). Good. In addition, generation | occurrence | production of a living microbe can be suppressed more reliably by satisfy | filling substantially all of substitution space KS with functional liquid LK.

  As described above, when the irradiation of the exposure light EL is stopped, specifically, when the operation of the exposure apparatus EX is stopped and the supply operation and the recovery operation of the liquid LQ to the replacement space KS are stopped, By substituting the replacement space KS with the functional liquid LK having the function of suppressing the occurrence, the influence of the projection optical system PL from the liquid LQ can be reduced, and the exposure accuracy and the measurement accuracy can be maintained.

  Note that the functional liquid LK is not limited to a liquid containing hydrogen peroxide solution, and a diluting liquid (aqueous solution) containing hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, or a diluting liquid (aqueous solution) containing an alkaline substance is used. it can. Alternatively, as the functional liquid LK, alcohols, ethers, absole, organic solvents such as HFE, or a mixture thereof can be used. The generation of viable bacteria can also be suppressed by using these functional fluids. Antibacterial agents and preservatives may be added to such various functional liquids LK. Alternatively, a functional liquid LK may be obtained by adding an antibacterial agent or a preservative to liquid LQ (pure water).

<Second Embodiment>
Next, a maintenance method according to the second embodiment will be described with reference to FIG. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. A characteristic part of the present embodiment is that after replacing the replacement space KS with the functional liquid LK, the gas G is supplied to the replacement space KS in order to remove the functional liquid LK from the replacement space KS.

  In FIG. 4A, the second liquid immersion mechanism 2 is connected to the liquid supply unit 31 at one end and the other end is connected to the second supply port 32 of the second nozzle member 72 as in the above-described embodiment. A second supply pipe 33 to be connected and a third supply pipe 37 having one end connected to the functional liquid supply unit 35 and the other end connected to the second supply pipe 33 are provided.

  In the present embodiment, the functional liquid supply unit 35 supplies a liquid that is more volatile than the liquid LQ as the functional liquid LK. The functional liquid LK preferably has solubility (affinity) with respect to the liquid LQ. In the present embodiment, pure water is used as the liquid LQ, and methanol that is more volatile than pure water and is soluble (affinity) in pure water is used as the functional liquid LK. The functional liquid LK may be any liquid that is more volatile (higher volatility) than the liquid (pure water) LQ and is soluble (affinity) in the liquid LQ. Alcohols such as isopropyl alcohol (IPA), ethers such as dimethyl ether and diethyl ether, or a mixture thereof can be used. These functional liquids have a function of suppressing the generation of viable bacteria.

  Further, the exposure apparatus EX includes a gas supply system 50 that can supply the gas G to the replacement space KS. The gas supply system 50 includes a gas supply unit 51 that supplies a predetermined gas G, one end connected to the gas supply unit 51, and the other end in the middle of the second supply pipe 33 of the second immersion mechanism 2. And a fourth supply pipe 53 connected thereto. A sixth valve 53B for opening and closing the flow path is provided in the middle of the fourth supply pipe 53. The gas supply unit 51 includes a filter unit or the like that removes foreign matters in the supplied gas and cleans the gas. In the present embodiment, the gas supply unit 51 supplies dry air (dry air). The gas supply unit 51 may supply a gas other than dry air, such as dry nitrogen. The supply operation of the gas supply unit 51 and the opening / closing operation of the sixth valve 53B are controlled by the control device CONT.

  In the present embodiment, the connection part (merging part) C1 of the third supply pipe 37 to the second supply pipe 33 and the connection part (merging part) C2 of the fourth supply pipe 53 to the second supply pipe 33 are substantially the same. Set to position. After the gas G delivered from the gas supply unit 51 flows through the fourth supply pipe 53, the second supply pipe 33 is connected between the connection part C <b> 2 with the fourth supply pipe 53 and the second supply port 32. It flows through the region A and is supplied to the replacement space KS via the second supply port 32. That is, the gas G delivered from the gas supply unit 51 flows through a partial region A of the second supply pipe 33 that forms the liquid supply path of the second immersion mechanism 2 and then is supplied to the replacement space KS. In the region A of the second supply pipe 33, the liquid supply path of the second immersion mechanism 2 and the gas supply path of the gas supply system 50 are combined.

  Further, in the second supply pipe 33, the region A between the connection parts C <b> 1 and C <b> 2 with the third and fourth supply pipes 37 and 53 and the second supply port 32 is supplied from the liquid supply part 31. Each of the liquid LQ, the functional liquid LK supplied from the functional liquid supply unit 35, and the gas G supplied from the gas supply unit 51 flows. That is, in the region A of the second supply pipe 33, a liquid supply path through which the liquid LQ and the functional liquid LK supplied from the liquid supply unit 31 and the functional liquid supply unit 35 of the second liquid mechanism 2 flow, respectively. A gas supply path through which the gas G supplied from the gas supply unit 51 of the gas supply system 50 flows is also used.

  When irradiating the exposure light EL, as shown in FIG. 4A, the control device CONT controls the third, fourth, and fifth valves 33B, 43B, and 37B, as in the above-described embodiment, and the liquid supply unit. The flow path of the second recovery pipe 43 connected to the liquid recovery section 41 is closed while opening the flow path of the second supply pipe 33 connected to 31 and closing the flow path of the third supply pipe 37 connected to the functional liquid supply section 35. Open. At this time, the control device CONT controls the sixth valve 53B and closes the flow path of the fourth supply pipe 53 connected to the gas supply unit 51. The control device CONT fills the second space K2 (replacement space KS) between the first and second optical elements LS1 and LS2 with the liquid (pure water) LQ when the substrate P is irradiated with the exposure light EL. . Thereafter, in order to prevent vibration due to the flow of the liquid LQ, all the valves may be closed and the exposure light EL may be irradiated.

  When the operation of the exposure apparatus EX is stopped for a predetermined period, such as during maintenance of the exposure apparatus EX, the irradiation of the exposure light EL is stopped. When the irradiation of the exposure light EL is stopped, as shown in FIG. 4B, the control device CONT controls the third and fifth valves 33 </ b> B and 37 </ b> B and connects to the liquid supply unit 31. The flow path of the third supply pipe 37 connected to the functional liquid supply unit 35 is opened. At this time, the flow path of the recovery pipe 43 connected to the liquid recovery part 41 is open. The flow path of the fourth supply pipe 53 connected to the gas supply unit 51 is closed. Then, the replacement operation KS including the second space K2 is performed by performing the supply operation of the functional liquid LK from the functional liquid supply unit 35 to the replacement space KS including the second space K2 and the recovery operation by the liquid recovery unit 41 for a predetermined time. Is replaced with a functional liquid (methanol) LK.

  The supply operation of the functional liquid LK by the functional liquid supply unit 35 and the recovery operation by the liquid recovery unit 41 are continued for a predetermined time, and the replacement space KS including the second space K2 is replaced with the functional liquid LK (into the replacement space KS). After the liquid LQ almost disappears, the control device CONT controls the third and fifth valves 33B and 37B to flow through the second and third supply pipes 33 and 37 as shown in FIG. While closing the path, the sixth valve 53B is controlled to open the flow path of the fourth supply pipe 53. At this time, the flow path of the second recovery pipe 43 is open, and the recovery operation by the liquid recovery unit 41 (second liquid recovery mechanism 40) is continued. Then, in order to remove the functional liquid LK from the replacement space KS, the control device CONT drives the gas supply unit 51 of the gas supply system 50 and supplies the gas G to the replacement space KS. The control device CONT performs the gas supply operation by the gas supply system 50 and the recovery operation (suction operation) by the second liquid recovery mechanism 40 in parallel. The control device CONT supplies the gas G to the replacement space KS using the gas supply system 50, and moves the functional liquid LK in the replacement space KS toward the second recovery port 42 by the flow of the gas. And the removal of the functional liquid LK can be promoted.

  Moreover, since the functional liquid LK has high volatility, by supplying the gas G, drying (volatilization) of the functional liquid LK is promoted, and the functional liquid LK can be removed within a short time. it can. Moreover, since the functional liquid LK is soluble (affinity) with respect to the liquid LQ, the liquid LQ remaining in the replacement space KS can be removed well together with the functional liquid LK.

  Further, the gas supply system 50 supplies the gas G to the surface of the object forming the replacement space KS, that is, the upper surface T2 of the first optical element LS1, the lower surface T3 of the second optical element LS2, or the second nozzle member 72. It can be supplied by spraying it on the wall surface. By doing so, the functional liquid LK adhering (remaining) on the surface of the object forming the replacement space KS can be smoothly moved toward the second recovery port 42 or can be quickly dried. The functional liquid LK can be removed in a short time. As described above, since the functional liquid LK of the present embodiment has high volatility, the upper surface T2 and the lower surface T3 of the first and second optical elements LS1 and LS2 and the second nozzle member 72 The functional liquid LK can be removed from the replacement space KS in a short time by supplying the gas G to the inner wall surface or the like.

  When the gas G is blown onto the surface of the object forming the replacement space KS, for example, a guide member (rectifying member) that controls the flow of the gas G may be disposed in the vicinity of the second supply port 32 or the like. The gas G supplied to the replacement space KS via the second supply port 32 is blown onto the surface of the object forming the replacement space KS by the guide member. Alternatively, a gas outlet that can supply gas to the replacement space KS is provided at a position different from the second supply port 32, and the gas G is supplied to the replacement space KS via the gas outlet. Also good. Or you may make it blow the gas G on the surface of the object which forms the substitution space KS through the gas blower outlet.

  In addition, the gas supply system 50 does not need to spray gas on the surface of the object which forms the substitution space KS. Since the functional liquid LK has high volatility, by supplying gas to the replacement space KS, drying (volatilization) of the functional liquid LK is promoted, and the functional liquid LK is quickly removed from the replacement space KS. Can do.

  As described above, after replacing the replacement space KS including the second space K2 with the functional liquid LK, the gas G is supplied to the replacement space KS using the gas supply system 50, and the surface of the object forming the replacement space KS Is sufficiently dried (by removing the liquid component), the generation of viable bacteria can be suppressed.

  In the present embodiment, since the liquid supply path of the second immersion mechanism 2 and the gas supply path of the gas supply system 50 are combined, the liquid LQ remaining in the region A of the second supply pipe 33 is used. And the functional liquid LK can be removed by the flow of the gas G. Note that the liquid supply path of the second immersion mechanism 2 and the gas supply path of the gas supply system 50 may be provided independently without being combined.

<Third Embodiment>
Next, a third embodiment will be described. In the second embodiment described above, when the irradiation of the exposure light EL is stopped, the replacement space KS is replaced with one type of functional liquid (methanol) LK, and then the gas G is supplied to remove the functional liquid LK. However, a characteristic part of this embodiment is that the replacement space KS is sequentially replaced with a plurality of types of functional liquids when the irradiation of the exposure light EL is stopped.

  Hereinafter, a case where the replacement space KS is sequentially replaced with two types of functional liquids LK1 and LK2 will be described. Here, the first functional liquid LK1 is soluble in the liquid LQ, and the second functional liquid LK2 has a characteristic that it is more volatile than the first functional liquid LK1.

  After the replacement space KS is filled with the liquid LQ and the substrate P is exposed, the control device CONT replaces the replacement space KS with the first functional liquid LK1 that is soluble in the liquid LQ. In the present embodiment, since the liquid LQ is pure water, methanol having solubility (affinity) with respect to pure water can be used as the first functional liquid LK1. Thereafter, the control device CONT replaces the replacement space KS with the second functional liquid LK2 that is more volatile than the first functional liquid LK1. As the second functional liquid LK2, diethyl ether (or dimethyl ether) that is more volatile than methanol can be used. After the replacement space KS is replaced with methanol, the methanol is removed, whereby the pure water remaining in the replacement space KS can be removed well together with the methanol. Then, after replacing the substitution space KS with highly volatile diethyl ether or the like, by supplying the gas G to the substitution space KS, liquid components including the second functional liquid LK2 are quickly removed from the substitution space KS. can do.

  Since diethyl ether or the like is very volatile, it can be quickly removed (dried) by supplying the gas G, but its solubility (affinity) in pure water is lower than that of methanol. Therefore, when the substitution space KS is filled with pure water and the substrate P is exposed, and the substitution space KS is substituted with diethyl ether, when the gas G is supplied, the pure water is removed even though the diethyl ether is removed. The possibility that water remains in the replacement space KS increases. Thus, after the substitution space KS is filled with pure water and the substrate P is exposed, the substitution space KS is replaced with methanol having high affinity with pure water, and then substituted with diethyl ether, whereby pure water remains. And the liquid component can be quickly removed (dried) from the replacement space KS.

  To sequentially replace the replacement space KS with two types of functional liquids LK1 and LK2, for example, the functional liquid supply unit 35 is provided with a first tank and a second tank that separately store the functional liquid LK1 and the functional liquid LK2, A switching valve for switching between the connecting pipe and the connecting portion connected from the tank to the third supply pipe 37 may be provided. The number of tanks can be increased according to the type of functional liquid used.

  Further, a fluorine-based inert liquid may be used as the second functional liquid LK2. Examples of the fluorinated inert liquid include hydrofluorocarbon ether (HFE) and hydrofluorocarbon (HFC), and it is particularly preferable to use hydrofluorocarbon. Examples of the hydrofluorocarbon include “Bertrel XF” manufactured by Mitsui DuPont Fluorochemical Co., Ltd. “Bertrel XF” has high volatility (quick drying) and also has a cleaning function. Further, “Bertrel XF” has a feature of having a relatively small heat of vaporization (latent heat of vaporization) although it has high volatility (rapid drying). Therefore, after the replacement space KS is filled with pure water and the substrate P is exposed, the replacement space KS is replaced with methanol having high affinity with pure water, and then replaced with “Bertrel XF” or the like. An object (first and second optical elements LS1, LS2, second nozzle member 72, etc.) that can prevent water from remaining and can quickly remove (dry) the liquid component from the replacement space KS and form the replacement space KS. ) Contamination can be prevented. Moreover, the temperature change resulting from the heat of vaporization of objects such as the first and second optical elements LS1 and LS2 and the second nozzle member 72 can be made relatively small.

  In the present embodiment, the replacement space KS is replaced with the second functional liquid LK2 such as diethyl ether or hydrofluorocarbon (Bertrel XF) and then the gas G is supplied. However, the supply of the gas G is omitted. May be. Since the second functional liquid LK2 is highly volatile, the second functional liquid LK2 can be quickly removed (dried) from the replacement space KS even if the supply of the gas G is omitted.

  In the present embodiment, the example in which the replacement space KS is sequentially replaced with two types of functional liquids LK1 and LK2 has been described. However, the replacement space KS may be sequentially replaced with three or more types of functional liquids.

  For example, after replacing the substitution space KS filled with pure water with methanol, the substitution space KS may be substituted with diethyl ether, and then the substitution space KS may be substituted with hydrofluorocarbon (Bertrel XF). .

  In the present embodiment, the replacement space KS is first replaced with the first functional liquid KL1 that is soluble in the liquid LQ (pure water), and then highly volatile diethyl ether or hydrofluorocarbon (Bertrel XF). After that, the gas G is supplied, but if the liquid LQ is sufficiently (completely) removed from the replacement space KS, the replacement space KS is replaced with a second function such as diethyl ether or hydrofluorocarbon. The state filled with the liquid LK2 may be maintained. Since diethyl ether, hydrofluorocarbon, and the like have a function of suppressing the generation of bacteria and the like, by maintaining a state where the replacement space KS is filled with the second functional liquid LK2, an object (first, Contamination of the second optical elements LS1, LS2, the second nozzle member 72, etc.) can be prevented.

  As described above, fluorine-based inert liquids such as hydrofluorocarbon ether (HFE) and hydrofluorocarbon (HFC) are mentioned as an example of the second functional liquid LK2. However, the first embodiment and the second embodiment are described. A fluorine-based inert liquid may be used as the functional liquid LK.

<Fourth Embodiment>
Next, a fourth embodiment will be described. As in the second and third embodiments described above, when the gas G is supplied to the replacement space KS in order to remove the functional liquid LK from the replacement space KS, the replacement space KS is changed by the heat of vaporization of the functional liquid LK. There is a possibility that the object to be formed undergoes a temperature change (temperature decrease). Therefore, in this embodiment, the gas G is supplied to the replacement space KS while adjusting the temperature of the object forming the replacement space KS.

  5A, the exposure apparatus EX has one end connected to the liquid supply unit 31 and the other end connected to the second supply port 32 of the second nozzle member 72, as in the second and third embodiments. One end is connected to the second supply pipe 33 to be connected, the functional liquid supply section 35, and the other end is connected to the middle of the second supply pipe 33, and one end is connected to the gas supply section 51. And a fourth supply pipe 53 that connects the other end partway along the second supply pipe 33. Further, the exposure apparatus EX includes a first temperature adjustment device 61 that adjusts the temperature of the first optical element LS1, which is an object that forms the replacement space KS, and a second temperature adjustment device 62 that adjusts the temperature of the second optical element LS2. The first temperature detector 81 for detecting the temperature of the first optical element LS1 and the second temperature detector 82 for detecting the temperature of the second optical element LS2 are provided. The first temperature adjustment device 61 and the first temperature detector 81 do not disturb the irradiation of the exposure light EL in the first optical element LS1, and do not affect the state of the first and second liquid immersion regions LR1 and LR2. In the position. Similarly, the second temperature adjustment device 62 and the second temperature detector 82 do not interfere with the irradiation of the exposure light EL and do not affect the state of the second immersion region LR2 in the second optical element LS2. Is provided.

  The first and second temperature control devices 61 and 62 are connected to the control device CONT, and each operation is controlled by the control device CONT. The first and second temperature detectors 81 and 82 are connected to the control device CONT, and the detection results of the respective detectors are output to the control device CONT. The control device CONT controls the first temperature adjustment device 61 based on the detection result of the first temperature detector 81, and suppresses the temperature change amount with respect to the target temperature of the first optical element LS1 within an allowable range. Similarly, the control device CONT controls the second temperature adjustment device 62 based on the detection result of the second temperature detector 82, and suppresses the temperature change amount with respect to the target temperature of the second optical element LS2 within an allowable range.

  When irradiating the exposure light EL, as shown in FIG. 5A, the second space K2 (replacement space KS) between the first and second optical elements LS1 and LS2 is liquid (like the above-described embodiment). Filled with pure water) LQ.

  When the exposure of the exposure light EL is stopped, such as during maintenance of the exposure apparatus EX, as shown in FIG. 5B, the replacement space KS including the second space K2 is replaced with the functional liquid (methanol) LK.

  After the replacement space KS including the second space K2 is replaced with the functional liquid LK, the control device CONT controls the third and fifth valves 33B and 37B as shown in FIG. The flow path of the third supply pipes 33 and 37 is closed, and the sixth valve 53B is controlled to open the flow path of the fourth supply pipe 53. At this time, the flow path of the second recovery pipe 43 is open, and the recovery operation by the liquid recovery unit 41 (second liquid recovery mechanism 40) is continued. Then, in order to remove the functional liquid LK from the replacement space KS, the control device CONT drives the gas supply unit 51 of the gas supply system 50 and supplies the gas G to the replacement space KS. The removal of the functional liquid LK can be promoted by the gas G supplied to the replacement space KS. Moreover, since the functional liquid LK has high volatility, drying (volatilization) of the functional liquid LK is promoted by supplying the gas G. At this time, there is a possibility that the first and second optical elements LS1 and LS2 forming the replacement space KS may change in temperature (decrease in temperature) due to the heat of vaporization of the functional liquid LK. When supplying the gas G to the replacement space KS, the control device CONT uses the first and second temperature control devices 61 and 62 based on the detection results of the first and second temperature detectors 81 and 82. Thus, the temperature of the first and second optical elements LS1 and LS2 is adjusted, and the amount of temperature change with respect to the target temperature of the first and second optical elements LS1 and LS2 is suppressed within an allowable range.

  As described above, the temperature change of the first and second optical elements LS1 and LS2 caused by the heat of vaporization by supplying the gas G while adjusting the temperature of the first and second optical elements LS1 and LS2, As a result, thermal deformation of the first and second optical elements LS1 and LS2 due to the temperature change can be suppressed. Therefore, fluctuations in the optical characteristics of the projection optical system PL caused by thermal deformation of the first and second optical elements LS1 and LS2 can be suppressed, and exposure accuracy and measurement accuracy can be maintained.

  Further, the control device CONT may control the operation of the gas supply system 50 based on the detection results of the first and second temperature detectors 81 and 82. For example, when it is determined based on the detection results of the first and second temperature detectors 81 and 82 that the temperature change amount for at least one target temperature of the first and second optical elements LS1 and LS2 is greater than or equal to the allowable range. The control device CONT stops the gas G supply operation by the gas supply system 50. By doing so, temperature changes of the first and second optical elements LS1 and LS2 due to heat of vaporization can be suppressed. Then, after waiting for the temperature change amount with respect to the target temperature of the first and second optical elements LS1 and LS2 to fall within the allowable range, the control device CONT restarts the gas G supply operation by the gas supply system 50. The functional liquid LK can be removed satisfactorily. Alternatively, a temperature adjusting mechanism capable of adjusting the temperature of the gas G is provided in the gas supply system 50, and the gas G to be supplied (sprayed) is suppressed in order to suppress the temperature change of the first and second optical elements LS1 and LS2. The temperature may be adjusted. For example, when the temperature of the first and second optical elements LS1 and LS2 decreases due to the heat of vaporization, the temperature of the gas G supplied from the gas supply system 50 is increased to increase the first and second optical elements LS1, The temperature change of LS2 can be prevented. In this case, the temperature-adjusted gas G is supplied to the replacement space KS to adjust the temperatures of the objects forming the space, that is, the first and second optical elements LS1 and LS2.

  Further, the control device CONT, based on the detection results of the first and second temperature detectors 81 and 82, performs the temperature adjustment operation by the first and second temperature control devices 61 and 62, and the supply operation of the gas supply system 50. Both can be controlled.

  In FIG. 5, the temperature control device and the temperature detector are provided in the first and second optical elements LS1 and LS2, but the second nozzle member 72 is provided with the temperature control device and the temperature detector, and the second nozzle You may make it suppress the temperature change resulting from the vaporization heat of the member 72. FIG. That is, it can be provided as necessary on a member that is easily affected by temperature changes due to heat of vaporization. In addition, a temperature detector is not always necessary, and a temperature change of an object (such as the optical elements LS1 and LS2) may be obtained in advance by experiments or simulations, and the temperature adjustment device may be operated based on the result. .

  In the second to fourth embodiments described above, the substitution space KS is substituted with methanol, diethyl ether, or the like. Since methanol and diethyl ether also have a function of removing organic substances adhering to the surface of the object forming the substitution space KS, for example, even if organic substances enter the substitution space KS due to abnormal operation of the liquid supply unit 31 or the like, By replacing the substitution space KS with methanol or the like, organic substances can be removed.

  In the second to fourth embodiments described above, the generation of viable bacteria in the replacement space KS is prevented by sufficiently removing the liquid (pure water) LQ in the replacement space KS. Therefore, the functional liquid LK (LK1, LK2) preferably has solubility (affinity) with respect to the liquid LQ so that the liquid LQ can be removed smoothly, and the function of removing (defeating) viable bacteria. Is not necessary. On the other hand, if the functional liquid LK has a function of removing (defeating) viable bacteria, even if viable bacteria are generated in the replacement space KS, the viable bacteria are removed by filling the functional liquid LK in the replacement space KS. This is preferable because it is possible.

<Fifth Embodiment>
A fifth embodiment will be described with reference to FIG. As in the above-described embodiment, at the time of irradiation with the exposure light EL, the replacement space KS is filled with the liquid LQ as shown in FIG. Then, when the irradiation of the exposure light EL is stopped, such as during maintenance, as shown in FIG. 6 (B), without using the functional liquid LK in parallel with the recovery operation by the second liquid recovery mechanism 40, The gas supply operation to the replacement space KS by the gas supply system 50 is performed. Gas supply conditions by the gas supply system 50 (flow velocity, direction, temperature, etc. of the gas to be supplied) and liquid recovery conditions by the second liquid recovery mechanism 40 (shape, position and number of the second recovery ports 42, the liquid recovery unit 41 Depending on the suction force or the like, the liquid LQ in the replacement space KS can be satisfactorily removed (dried) by the gas supply operation by the gas supply system 50 without once replacing the replacement space KS with the functional liquid LK. Therefore, the generation of viable bacteria due to the remaining liquid LQ can be prevented. Also in the present embodiment, the first and second optical elements LS1 and LS2 and the second nozzle member 72 are provided with temperature control devices and temperature detectors, and the first and second optical elements LS1 and LS2 and the second nozzle member 72 are provided. You may make it suppress the temperature change resulting from the heat of vaporization.

  In the second to fifth embodiments described above, when the exposure apparatus EX is stopped, the replacement space KS is filled with dry air (or dry nitrogen) (replaced state). Any gas can be substituted as long as it has a small influence on the object forming KS.

  In the above-described second to fifth embodiments, the replacement space KS between the first optical element LS1 and the second optical element LS2 is replaced with the functional liquid LK. Of the projection optical system PL, In order to suppress the generation of viable bacteria in a space other than the space between the first optical element LS1 and the second optical element LS2 (for example, the space between the third and fourth optical elements), the functional liquid LK is placed in that space. You may make it satisfy | fill.

  In the first to fourth embodiments described above, the second liquid immersion mechanism 2 uses the second supply port 32 and the second recovery port 42 in common for the liquid LQ and the functional liquid LK. The supply port and the recovery port for the liquid LQ may be provided separately from the supply port and the recovery port for the functional liquid LK.

  In the above-described second to fifth embodiments, the second liquid immersion mechanism 2 has both the supply port for the liquid LQ and the supply port for the gas G, but can also be provided separately. .

  In the above embodiment, at least a part of the liquid LQ recovered by the first or second liquid recovery mechanism 21, 41 may be returned to the first or second liquid supply mechanism 11, 31. Alternatively, all of the first liquid LQ recovered by the first or second liquid recovery mechanism 21, 41 is discarded, and a new clean liquid LQ is supplied from the first or second liquid supply mechanism 11, 31. Also good. If the functional liquid LK is purified by ultrafiltration or a functional filter, it can be circulated for reuse. The structure of the liquid immersion mechanism 1 such as the nozzle member 70 is not limited to the above-described structure. For example, European Patent Publication No. 1420298, International Publication No. 2004/055803, International Publication No. 2004/057589, Those described in International Publication No. 2004/057590 and International Publication No. 2005/0295559 can also be used.

<Sixth Embodiment>
A sixth embodiment will be described with reference to FIG. In the above-described first to fifth embodiments, the replacement space KS between the first optical element LS1 and the second optical element LS2 is processed to suppress the generation of viable bacteria in the replacement space KS. However, a process for suppressing the generation of viable bacteria in the space below the first optical element LS1, that is, the first space K1 (the lower surface T1, the lower surface of the first nozzle member 71 and the space including them). You may give it. In the present embodiment, as shown in FIG. 7, the lower surface T1 side of the first optical element LS1 is immersed in the functional liquid LK. By doing so, it is possible to prevent viable bacteria from occurring in the lower surface T1 of the first optical element LS1, the lower surface of the first nozzle member 71, and the space including them (the space on the image plane side of the projection optical system PL). In FIG. 7, the functional liquid LK is stored in the container 100, and the first optical element LS <b> 1 is immersed in the functional liquid LK stored in the container 100 together with the first nozzle member 71. Here, foreign matter generated from the substrate P may adhere to the first optical element LS1 or the first nozzle member 71. Examples of the foreign matter generated from the substrate P include organic substances that form a photosensitive material (resist). Therefore, as the functional liquid LK for immersing the lower surface T1 side of the first optical element LS1, it is preferable to use methanol, diethyl ether, or the like that can remove organic substances. Such immersion with the functional liquid LK can be performed when the exposure apparatus EX is not performing an exposure operation, for example, during maintenance, movement, or conveyance of the exposure apparatus. The container 100 is installed below the projection optical system PL by an operator manually or by mechanical equipment. The container 100 may be movable on the base member BP.

  In addition, after the lower surface T1 side of the first optical element LS1 is immersed in the functional liquid LK, the functional liquid LK is collected, and gas is supplied (sprayed) to the first optical element LS1 to remove the functional liquid LK. It may be promoted. In addition, a temperature control device capable of adjusting the temperature of the first optical element LS1 and a temperature detector capable of detecting the temperature of the first optical element LS1 are provided, and gas is supplied while adjusting the temperature of the first optical element LS1. You may make it do. When supplying the gas, for example, a pipe from the gas supply unit 51 or a separation pipe from the fourth supply pipe may be connected to the first supply pipe connected to the first nozzle member 71. By doing so, the space (KS1) on the image plane side of the projection optical system PL can also obtain the effects of gas supply and / or temperature control, as in the second to fourth embodiments.

  The processing with the functional liquid in the space (KS1) on the image plane side of the projection optical system PL in the sixth embodiment is performed simultaneously with the processing of the replacement space KS described in the first to fifth embodiments or before and after the processing of the replacement space KS. You may go to

  The projection optical system PL may be a catadioptric system including a refractive element and a reflective element, or may be a reflective system not including a refractive element. In this case, a predetermined space between the light passage element (for example, a refraction element) and the reflection element of the projection optical system PL or between the reflection element and the reflection element may be filled with the liquid.

  In the first to sixth embodiments described above, the operation of the exposure apparatus EX is stopped for a predetermined period as an example of maintenance of the exposure apparatus EX. However, the device using the exposure apparatus EX is described. During manufacturing, there is a possibility that a situation where the supply and recovery operations of the liquid LQ by the second immersion mechanism 2 with respect to the replacement space KS must be stopped depending on the process conditions may occur. Even in such a case, the processing described in the first to sixth embodiments can be executed. Alternatively, for example, the above-described processing can be executed at night when the operation of the exposure apparatus EX stops or during a long-term stop such as a long vacation. Alternatively, the above-described processing can be executed even during the manufacture of the exposure apparatus EX including the projection optical system PL. Alternatively, the above-described processing can also be executed when the exposure apparatus EX (projection optical system PL) is transported from an exposure apparatus manufacturer to a device manufacturer that uses the exposure apparatus.

  As described above, the liquid LQ in this embodiment is pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be about 1.44, and when ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  In the present embodiment, the optical element LS1 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration, etc.) can be adjusted by this lens. The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  When the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid LQ and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. However, for example, the liquid LQ is filled with a cover glass made of a plane parallel plate attached to the surface of the substrate P. May be.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In this case, a lyophilic treatment is performed by forming a thin film with a substance having a small molecular structure including fluorine, for example, in a portion in contact with the liquid LQ. In addition, as the liquid LQ, the liquid LQ is transparent to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used. Also in this case, the surface treatment is performed according to the polarity of the liquid LQ to be used.

  In the above-described embodiment, the light transmissive mask (reticle) in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. Instead of this reticle, for example, the US As disclosed in Japanese Patent No. 6,778,257, an electronic mask that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed may be used. Further, as disclosed in International Publication No. 2001/035168, an exposure apparatus (lithography system) that forms a line and space pattern on a wafer W by forming interference fringes on the wafer W. The present invention can also be applied.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  Further, as disclosed in Japanese Patent Application Laid-Open No. 11-135400, an exposure apparatus including a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and a measurement stage on which various photoelectric sensors are mounted. The present invention can be applied.

  Further, in the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in JP-A-6-124873 and JP-A-10. The present invention can also be applied to an immersion exposure apparatus that performs exposure in a state where the entire surface of a substrate to be exposed is immersed in a liquid as disclosed in Japanese Patent Laid-Open No. -303114.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) ) Or an exposure apparatus for manufacturing reticles or masks.

  When using a linear motor (see USP5,623,853 or USP5,528,118) for the substrate stage PST and mask stage MST, use either the air levitation type using air bearings or the magnetic levitation type using Lorentz force or reactance force. Also good. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

  As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).

  As described in JP-A-8-330224 (USP 5,874,820), the reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground).

  As described above, the exposure apparatus EX according to the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 8, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, substrate processing step 204 including an exposure process for exposing a mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, and packaging process) 205, inspection It is manufactured through step 206 and the like. The substrate processing step 204 may include the maintenance operation described in the first to sixth embodiments, which is incorporated in the exposure process or separate from the exposure process.

1 is a schematic block diagram that shows a first embodiment of an exposure apparatus according to the present invention. It is a principal part enlarged view of FIG. It is a figure for demonstrating the maintenance method which concerns on 1st Embodiment. It is a figure for demonstrating the maintenance method which concerns on 2nd, 3rd embodiment. It is a figure for demonstrating the maintenance method which concerns on 4th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 5th Embodiment. It is a figure for demonstrating the maintenance method which concerns on 6th Embodiment. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 1st liquid immersion mechanism, 2 ... 2nd liquid immersion mechanism, 10 ... 1st liquid supply mechanism, 12 ... 1st supply port, 20 ... 2nd liquid recovery mechanism, 22 ... 1st recovery port, 30 ... 2nd Liquid supply mechanism 31... Liquid supply unit 32. Second supply port 35. Functional liquid supply unit 33 B and 37 B Valve 40. , 61, 62 ... temperature control device, 71 ... first nozzle member, 72 ... second nozzle member, 81, 82 ... temperature detector, EL ... exposure light, EX ... exposure device, G ... gas, K1 ... first space , K2 ... second space, KS ... replacement space, LK ... functional liquid, LQ ... liquid, LS1 to LS7 ... optical element, LS1 ... first optical element, LS2 ... second optical element, P ... substrate, PL ... projection optics system

Claims (41)

In a maintenance method for an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate via a projection optical system,
The exposure of the substrate is performed by irradiating the exposure light in a state where a predetermined space between specific optical elements among a plurality of optical elements constituting the projection optical system is filled with a first liquid,
A maintenance method of replacing the predetermined space with a second liquid different from the first liquid when exposure light is not irradiated.   The predetermined space is a space between the first optical element closest to the image plane of the projection optical system and the second optical element closest to the image plane after the first optical element. The maintenance method according to claim 1.   The maintenance method according to claim 1, wherein the first liquid is pure water.   The maintenance method according to any one of claims 1 to 3, wherein the second liquid has a function of suppressing generation of viable bacteria.   The maintenance method according to claim 1, wherein the second liquid contains hydrogen peroxide water. The maintenance method according to claim 5, wherein the second liquid is a hydrogen peroxide solution, and the concentration of the hydrogen peroxide solution is 10 ⁻⁶ % or less.   The maintenance method according to claim 1, wherein after the predetermined space is replaced with the second liquid, gas is supplied to the predetermined space in order to remove the second liquid from the predetermined space.   The maintenance method according to claim 7, wherein the gas is blown onto a surface of an object that forms the predetermined space.   The maintenance method according to claim 7 or 8, wherein the second liquid is a liquid that is more volatile than the first liquid.   The second liquid includes a third liquid that is soluble in the first liquid and a fourth liquid that is more volatile than the third liquid, and the third liquid and the fourth liquid in the predetermined space. The maintenance method according to any one of claims 7 to 9, wherein the gas is supplied after the replacement in the order.   The maintenance method according to claim 10, wherein the third liquid is methanol and the fourth liquid is dimethyl ether or diethyl ether.   The maintenance method according to claim 10, wherein the third liquid is methanol and the fourth liquid is hydrofluorocarbon.   The maintenance method according to any one of claims 7 to 12, wherein the gas is supplied while adjusting a temperature of an object forming the predetermined space. In an exposure apparatus maintenance method for exposing the substrate by irradiating exposure light onto the substrate,
The exposure of the substrate is performed by irradiating exposure light in a state where a predetermined space of a part of the optical path space of the exposure light is filled with a liquid,
A maintenance method for supplying gas to the predetermined space while adjusting the temperature of an object forming the predetermined space in order to remove the liquid from the predetermined space when the exposure light is not irradiated.   The maintenance method according to claim 14, wherein the gas is blown onto a surface of an object that forms the predetermined space. The exposure apparatus has a projection optical system including a plurality of optical elements,
The maintenance method according to claim 14 or 15, wherein the predetermined space is a space between specific optical elements among the plurality of optical elements.   The predetermined space is a space between the first optical element closest to the image plane of the projection optical system and the second optical element closest to the image plane after the first optical element. The maintenance method according to claim 16.   The maintenance method according to claim 14, further comprising a projection optical system, wherein the predetermined space is a space on the image plane side of the projection optical system. An exposure method of exposing a substrate by irradiating the substrate with exposure light via a projection optical system including a plurality of optical elements,
Irradiating the substrate with exposure light in a state where a predetermined space between the specific optical elements among the plurality of optical elements is filled with the first liquid;
An exposure method including replacing a predetermined space with a second liquid different from the first liquid when the exposure light is not irradiated.   The exposure method according to claim 19, comprising filling a predetermined space between the substrate and the projection optical system with the first liquid when the substrate is irradiated with the exposure light.   21. The exposure method according to claim 20, further comprising replacing the predetermined space with a liquid different from the second liquid after replacing the predetermined space with the second liquid.   The exposure method according to claim 21, wherein the second liquid is methanol, and the another liquid is a kind of liquid selected from the group consisting of diethyl ether, dimethyl ether and hydrofluorocarbon.   The device manufacturing method using the exposure method as described in any one of Claims 19-22. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate via a projection optical system,
When irradiating the substrate with exposure light, among the plurality of optical elements constituting the projection optical system, a predetermined space between specific optical elements is filled with the first liquid, and when the exposure light is not irradiated, the predetermined light is emitted. An exposure apparatus comprising an immersion mechanism for replacing a space with a second liquid different from the first liquid.   The predetermined space is a space between the first optical element closest to the image plane of the projection optical system and the second optical element closest to the image plane after the first optical element. The exposure apparatus according to claim 24.   The exposure apparatus according to claim 25, wherein the first liquid is pure water.   27. The exposure apparatus according to claim 25 or 26, wherein the second liquid has a function of suppressing generation of viable bacteria. The liquid immersion mechanism includes a supply port connected to the predetermined space;
A first liquid supply unit capable of supplying the first liquid;
A second liquid supply unit capable of supplying the second liquid;
28. The switching device according to claim 24, further comprising: a switching device that switches between supply of the first liquid by the first liquid supply unit and supply of the second liquid by the second liquid supply unit via the supply port. The exposure apparatus according to item. The liquid immersion mechanism includes a liquid recovery mechanism that recovers liquid from the predetermined space,
29. The gas supply system according to any one of claims 24 to 28, further comprising a gas supply system that supplies gas to the predetermined space in order to remove the second liquid from the predetermined space after the predetermined space is replaced with the second liquid. The exposure apparatus according to one item.   30. The exposure apparatus according to claim 29, wherein the gas supply system blows the gas onto a surface of an object forming the predetermined space.   31. The exposure apparatus according to claim 29, further comprising a temperature adjustment device that adjusts a temperature of an object that forms the predetermined space when gas is supplied from the gas supply system. A temperature detector for detecting the temperature of the object;
32. The exposure apparatus according to claim 31, wherein the temperature adjustment device adjusts the temperature of the object based on a detection result of the temperature detector. A temperature detector for detecting the temperature of the object;
31. The exposure apparatus according to claim 29, further comprising a control device that controls an operation of the gas supply system based on a detection result of the temperature detector. In an exposure apparatus that exposes the substrate by irradiating exposure light onto the substrate,
An immersion mechanism that fills a predetermined space in the optical path space of the exposure light with a liquid when irradiating the substrate with exposure light; and
A gas supply system for supplying a gas to the predetermined space in order to remove the liquid from the predetermined space when irradiation of the exposure light is stopped;
An exposure apparatus comprising: a temperature adjustment device that adjusts the temperature of an object that forms the predetermined space when supplying the gas.   35. The exposure apparatus according to claim 34, wherein at least a part of the liquid supply path of the immersion mechanism and the gas supply path of the gas supply system are also used.   36. The exposure apparatus according to claim 34 or 35, wherein the gas supply system blows the gas onto a surface of an object forming the predetermined space. A projection optical system including a plurality of optical elements;
37. The exposure apparatus according to any one of claims 34 to 36, wherein the predetermined space is a space between specific optical elements among the plurality of optical elements.   The predetermined space is a space between the first optical element closest to the image plane of the projection optical system and the second optical element closest to the image plane after the first optical element. The exposure apparatus according to claim 37.   35. The exposure apparatus according to claim 34, further comprising a projection optical system, wherein the predetermined space is a space on the image plane side of the projection optical system. An exposure apparatus that irradiates a substrate with exposure light to expose the substrate,
A projection optical system having a plurality of optical elements;
An immersion mechanism for filling a predetermined space between specific optical elements of the plurality of optical elements with a liquid;
An exposure apparatus comprising: a gas supply system that supplies a gas to the predetermined space when the exposure light is not irradiated. 41. A device manufacturing method using the exposure apparatus according to any one of claims 24 to 40.

Images