JP2007021579A5 - - Google Patents
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- JP2007021579A5 JP2007021579A5 JP2006059282A JP2006059282A JP2007021579A5 JP 2007021579 A5 JP2007021579 A5 JP 2007021579A5 JP 2006059282 A JP2006059282 A JP 2006059282A JP 2006059282 A JP2006059282 A JP 2006059282A JP 2007021579 A5 JP2007021579 A5 JP 2007021579A5
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- laser beam
- processing
- laser
- moving
- moving speed
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- 230000001678 irradiating Effects 0.000 claims 6
- 238000001514 detection method Methods 0.000 claims 4
- 230000001133 acceleration Effects 0.000 claims 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims 1
Claims (9)
前記被加工材に対して相対的な前記レーザ加工ノズルの移動方向のみまたは移動方向と速さ(移動速度)を検出する移動速度検出手段を具備し,前記移動方向のみまたは前記移動速度に応じて,前記加工線と所定の角度で前記レーザビームを振動させることを特徴とする倣いレーザビーム振動装置。 A laser beam vibration device for irradiating while oscillating a laser beam when a laser processing nozzle is relatively moved along a processing line on a workpiece surface,
A moving speed detecting means for detecting only the moving direction of the laser processing nozzle relative to the workpiece or the moving direction and speed (moving speed) is provided, and only the moving direction or according to the moving speed is provided. A scanning laser beam vibration device that vibrates the laser beam at a predetermined angle with respect to the processing line.
前記レーザ加工ノズルが前記加工線に沿って移動する際に,前記レーザ加工ノズルの移動方向のみまたは移動方向と速さ(移動速度)を検出する移動速度検出手段と,
前記移動方向または前記移動速度の検出値に基づいて,前記加工線に対して所定の角度,所定の周波数,及び所定の振幅でレーザビームを振動させるミラー駆動制御手段を具備する請求項1に記載の倣いレーザビーム振動装置。 A laser processing head comprising a mirror for condensing and irradiating a workpiece with a laser beam and vibrating the laser beam;
A moving speed detecting means for detecting only the moving direction or the moving direction and speed (moving speed) of the laser processing nozzle when the laser processing nozzle moves along the processing line;
The mirror drive control means for oscillating a laser beam at a predetermined angle, a predetermined frequency, and a predetermined amplitude with respect to the processing line based on the detected value of the moving direction or the moving speed. Scanning laser beam vibration device.
前記移動速度検出手段は,前記加工線上の前記レーザ加工ノズルの移動量を検出する移動量検出部,及び前記移動量を基に前記レーザ加工ノズルの移動方向と速さを得る移動速度演算部で構成され,
前記ミラー駆動制御手段は,前記移動方向と速さの検出値に基づいて,前記加工線に対して所定の角度,所定の周波数,及び所定の振幅でレーザビームを振動させる振動信号を生成する振動信号生成部と,該振動信号に基づいて前記可動ミラーを振動させてレーザビームを振動照射するミラー駆動制御部とで構成される,請求項2に記載の倣いレーザビーム振動装置。 The laser processing head includes a mirror driving unit having a movable mirror that vibrates a laser beam on the workpiece surface, and a laser processing nozzle.
The moving speed detecting means includes a moving amount detecting unit that detects a moving amount of the laser processing nozzle on the processing line, and a moving speed calculating unit that obtains the moving direction and speed of the laser processing nozzle based on the moving amount. Composed,
The mirror drive control means generates a vibration signal for oscillating a laser beam at a predetermined angle, a predetermined frequency, and a predetermined amplitude with respect to the processing line based on the detected values of the moving direction and speed. 3. The scanning laser beam vibration device according to claim 2, comprising a signal generation unit and a mirror drive control unit that vibrates and irradiates a laser beam by vibrating the movable mirror based on the vibration signal.
請求項1〜請求項7のうちの一項に記載の倣いレーザビーム振動装置に加えて,レーザビームを被加工材上に集光照射するレーザ加工ヘッドが,予め設定した加工線に沿って倣いながらレーザ加工するレーザビーム倣い手段を具備することを特徴とするビーム振動レーザビーム加工装置。 A laser beam processing apparatus for irradiating while oscillating a laser beam along a processing line on a workpiece surface,
In addition to the scanning laser beam vibration device according to one of claims 1 to 7, a laser processing head for condensing and irradiating a laser beam onto a workpiece is scanned along a preset processing line. A beam vibration laser beam processing apparatus comprising laser beam copying means for performing laser processing.
A laser beam processing apparatus for irradiating a workpiece surface while vibrating a laser beam, in addition to the scanning laser beam vibration apparatus according to one of claims 1 to 7, A beam vibration laser beam processing apparatus comprising: a laser processing head for condensing and irradiating a workpiece along a processing line on the workpiece, which is manually or in real-time directed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006059282A JP4786372B2 (en) | 2005-06-17 | 2006-03-06 | Scanning laser beam vibration device and beam vibration laser processing device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177863 | 2005-06-17 | ||
JP2005177863 | 2005-06-17 | ||
JP2006059282A JP4786372B2 (en) | 2005-06-17 | 2006-03-06 | Scanning laser beam vibration device and beam vibration laser processing device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007021579A JP2007021579A (en) | 2007-02-01 |
JP2007021579A5 true JP2007021579A5 (en) | 2009-09-10 |
JP4786372B2 JP4786372B2 (en) | 2011-10-05 |
Family
ID=37783003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006059282A Active JP4786372B2 (en) | 2005-06-17 | 2006-03-06 | Scanning laser beam vibration device and beam vibration laser processing device |
Country Status (1)
Country | Link |
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JP (1) | JP4786372B2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009217205A (en) * | 2008-03-13 | 2009-09-24 | Panasonic Corp | Method for disassembling display and disassembling device |
JP5245844B2 (en) * | 2009-01-14 | 2013-07-24 | 新日鐵住金株式会社 | Laser cutting method and apparatus |
JP5201098B2 (en) * | 2009-07-23 | 2013-06-05 | 新日鐵住金株式会社 | Laser cutting apparatus and laser cutting method |
JP2015174096A (en) * | 2014-03-13 | 2015-10-05 | 新日鐵住金株式会社 | Laser cutting method and laser cutting system |
WO2015155801A1 (en) * | 2014-04-09 | 2015-10-15 | 三菱電機株式会社 | Laser beam machine |
JP6588498B2 (en) | 2017-06-12 | 2019-10-09 | ファナック株式会社 | Laser processing equipment |
WO2019176631A1 (en) * | 2018-03-12 | 2019-09-19 | 株式会社アマダホールディングス | Cutting machine and cutting method |
JP6638011B2 (en) * | 2018-03-12 | 2020-01-29 | 株式会社アマダホールディングス | Laser processing machine and laser processing method |
JP6592564B1 (en) | 2018-07-06 | 2019-10-16 | 株式会社アマダホールディングス | Laser processing machine and laser processing method |
JP6592563B1 (en) * | 2018-07-06 | 2019-10-16 | 株式会社アマダホールディングス | Laser processing machine and laser processing method |
DE102018212281A1 (en) * | 2018-07-24 | 2020-01-30 | Amada Holdings Co., Ltd. | Laser processing machine and laser processing method |
JP7182392B2 (en) * | 2018-07-27 | 2022-12-02 | 株式会社アマダ | Handy laser welder and laser welding method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61103692A (en) * | 1984-10-29 | 1986-05-22 | Mitsubishi Electric Corp | Laser beam machine |
JP2726658B2 (en) * | 1987-02-20 | 1998-03-11 | 三菱電機株式会社 | Processing line teaching method |
JPH02142693A (en) * | 1988-11-21 | 1990-05-31 | Mitsubishi Electric Corp | Beam scanning device |
JPH10314971A (en) * | 1997-05-21 | 1998-12-02 | Olympus Optical Co Ltd | Laser beam probe |
JPH11147192A (en) * | 1997-11-12 | 1999-06-02 | Koike Sanso Kogyo Co Ltd | Laser beam cutting device |
JP2001287065A (en) * | 2000-04-10 | 2001-10-16 | Ishikawajima Harima Heavy Ind Co Ltd | Automatic welding equipment |
JP2004216418A (en) * | 2003-01-14 | 2004-08-05 | Komatsu Ltd | Laser beam machine |
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2006
- 2006-03-06 JP JP2006059282A patent/JP4786372B2/en active Active
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